Automatic carrying intelligent warehousing system for semiconductor wafer cassettes
By designing an intelligent warehousing system for automated handling of semiconductor wafer boxes, using intelligent scheduling, precise positioning and efficient storage technologies, the problems of low manual efficiency, insufficient automation and low storage efficiency in the existing systems are solved, and efficient and accurate wafer box handling and warehousing are achieved, improving production efficiency and automation level.
Patent Information
- Application Number
- CN202411825965.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-03-28
AI Technical Summary
The existing semiconductor wafer box handling and warehousing systems have problems such as low manual efficiency, insufficient automation and intelligence, and low storage space utilization, which is difficult to meet the needs of modern semiconductor manufacturing for efficient, flexible and intelligent production processes.
An intelligent storage system for automatic handling of semiconductor wafer boxes is designed, using intelligent scheduling systems, precise positioning technology, efficient storage architecture and highly automated control, including truss devices, trolley structures, wafer box cache devices and warehousing devices. Through the organic combination of these components, efficient and accurate storage, handling and transfer are achieved.
It significantly improves handling efficiency, reduces human errors, ensures safe and accurate storage and access of wafer boxes, improves the level of automation and intelligence, improves the overall efficiency and space utilization of the production line, and meets the needs of modern production.
Smart Images

Figure CN119725190A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductors, and in particular to an intelligent storage system for automated transport of semiconductor wafer boxes. Background Art
[0002] As the cornerstone of modern information technology, the semiconductor industry plays a vital role in the global economic and technological development. With the continuous advancement of integrated circuit technology, the manufacturing and management of semiconductor wafer boxes have become increasingly complex and sophisticated. In this context, the automated handling and intelligent storage system of semiconductor wafer boxes has become a key factor in ensuring production efficiency, improving product quality and reducing operating costs.
[0003] With the rapid development of semiconductor technology, the wafer manufacturing process is moving towards high efficiency, precision and automation. As a key container for storing and transporting semiconductor wafers, the handling, storage and management of wafer boxes have a vital impact on the efficiency of the entire production process and product quality. However, the current handling and storage systems of most semiconductor wafer boxes still have many shortcomings and are in urgent need of improvement.
[0004] First, traditional manual handling is inefficient and error-prone. In semiconductor production, the handling of wafer boxes mainly relies on manual operation. Due to the high fragility of wafer boxes and strict environmental requirements, manual handling is not only inefficient, but also prone to misplacement and damage, leading to delays in the production process and increased defective product rates. In addition, the unpredictability of manual operation and operator fatigue increase the risk of errors, further affecting the stability of the production line and the consistency of the product.
[0005] Secondly, the existing systems have limited automation and insufficient intelligence. Although there are some automated handling systems on the market, such as the automated warehouse management system described in patent CN118907703A, which achieves efficient storage and transfer of wafer boxes through the cooperation of automatic guided vehicles (AGVs) and overhead cranes, significantly improving storage and management efficiency, most systems still rely on simple mechanical transmission devices and lack intelligent scheduling and dynamic control capabilities. These systems cannot perform efficient scheduling and resource optimization according to real-time production needs, and are difficult to cope with changes in production needs and emergencies, limiting the improvement of the overall automation level.
[0006] In addition, traditional storage systems have low storage efficiency and insufficient space utilization. Existing storage systems usually adopt a fixed storage architecture, which lacks flexibility and makes it difficult to dynamically adjust storage units according to the size and shape of the wafer box, resulting in low space utilization. This situation requires a lot of manual intervention or reliance on simple mechanical devices, making it difficult to achieve efficient and accurate storage and retrieval operations. As the scale of production expands, the bottleneck problem of traditional storage systems becomes more and more obvious, and it cannot effectively support large-scale and high-frequency wafer box storage and retrieval needs, which in turn affects overall production efficiency.
[0007] In terms of high-precision positioning and stable access, existing technologies such as patent CN111199904A have improved the alignment accuracy through image comparison and automated equipment, but in complex handling environments, positioning errors may still occur due to environmental interference or equipment vibration, affecting production efficiency and wafer quality. In addition, the performance of existing systems in fast access and repeated positioning still needs to be improved, and it is difficult to meet the needs of high-throughput production lines.
[0008] Low system integration and lack of collaborative working capabilities are also important issues. Most existing handling systems operate independently and lack effective integration and collaboration with other production equipment, resulting in the formation of information islands and making it difficult to form an efficient and flexible automated warehouse management network. In semiconductor production, different functional equipment needs to work closely together to ensure the smoothness and overall efficiency of the production line. For example, the information exchange between the overhead crane system and the testing equipment and processing equipment is insufficient, making it impossible to achieve unified scheduling and optimized control, limiting the overall optimization of the production process and the improvement of the intelligent level.
[0009] In summary, although the existing technologies provide certain solutions in terms of automated handling and improve storage and management efficiency through the cooperation of automated guided vehicles and overhead cranes, there are still significant deficiencies in intelligent scheduling, system integration, storage efficiency, high-precision stability, environmental adaptability, data analysis and security. These deficiencies limit the overall efficiency and intelligence level of semiconductor wafer box handling and storage systems, and it is difficult to meet the needs of modern semiconductor manufacturing for efficient, flexible and intelligent production processes. Therefore, there is an urgent need for a new semiconductor wafer box automated handling intelligent storage system that can significantly improve handling efficiency and system stability through intelligent scheduling, precise positioning, efficient storage and highly automated control, reduce dependence on manual labor, and comprehensively improve the overall efficiency and automation level of the production line to meet future efficient, flexible and intelligent production needs. Summary of the invention
[0010] The purpose of the present invention is to provide a semiconductor wafer box automated handling and intelligent storage system to solve the problems of low labor efficiency, insufficient automation and intelligence, and low storage space utilization in existing semiconductor wafer box handling and storage systems.
[0011] An automatic handling intelligent storage system for semiconductor wafer boxes, comprising:
[0012] A truss device, wherein the truss device comprises a longitudinal truss and a transverse truss, wherein the longitudinal truss and the transverse truss are fixed by bolts or welding to form a frame structure;
[0013] A crane structure is arranged above the truss device. The crane structure can move freely on the track of the frame through a sliding mechanism, so that the crane can move between different working positions. A lifting device is arranged at the lower end of the crane for taking and placing wafer boxes;
[0014] A wafer box cache device is arranged on one side of the truss device, and is used to temporarily store wafer boxes and transport them to the storage device. The wafer box cache device includes a plurality of independent storage units and a drive device to ensure stable storage and rapid retrieval of wafer boxes;
[0015] The storage device is arranged on one side of the wafer box cache device and is used to store wafer boxes. The storage device includes multiple storage areas, each of which is connected to the wafer box cache device through a robot device to transfer the wafer boxes from the wafer box cache device to the storage area for storage.
[0016] Furthermore, the forward and backward moving motor is installed on the longitudinal truss of the frame, and is driven by a transmission belt or chain to realize the left and right movement of the transverse truss on the longitudinal truss; the left and right moving motor is installed on the transverse truss, and is driven by a gear and rack system to realize the forward and backward movement of the clamping structure on the transverse truss; the up and down moving motor is installed on the vertical truss of the clamping structure, and is driven by a lead screw or a hydraulic system to realize the up and down movement of the clamping structure;
[0017] in,
[0018] The clamping structure is moved by means of a slide rail and a gear system, and a clamping structure is provided at the lower end of the clamping structure for adapting to a protruding structure on the wafer box for lifting the entire wafer box;
[0019] The clamping mechanism comprises two parallel clamping plates, a plurality of fixing columns are arranged on the clamping plates, a plurality of notches are arranged on the edge of the protruding structure, and the fixing columns are adapted to the notches;
[0020] The overhead crane is suspended on the track at the top of the frame, and the sliding mechanism enables the overhead crane to move freely on the track, so that the overhead crane can move between different working positions. A hoist is provided at the lower end of the overhead crane for taking and placing wafer boxes.
[0021] Furthermore, the wafer box cache device includes a loading platform and accurately positions the wafer box placed thereon through a positioning mechanism; the positioning mechanism includes at least a mounting groove, a screw and a limit device, wherein the mounting groove is arranged on the loading platform and is used for lateral and longitudinal positioning of the wafer box; the screw passes through the mounting groove and fixes the wafer box on the loading platform; the limit device is used to limit the lateral or longitudinal movement of the wafer box, and can be adjusted according to the size of the wafer box to adapt to wafer boxes of different specifications.
[0022] Furthermore, the storage device includes a storage body;
[0023] Storage shelves for storing semiconductor wafer boxes disposed in the warehouse;
[0024] A robot device disposed between storage shelves for storing and retrieving semiconductor wafer boxes;
[0025] The storage shelf includes a front-to-back limiting structure and a left-to-right limiting structure to limit the position of the wafer box on the storage shelf;
[0026] The manipulator device comprises a clamping structure base, a fixed bracket, a rotating shaft, a hollow rotating platform, a forward and backward moving component, a mounting screw, a linear guide rail and a tooth fork;
[0027] The clamping structure base is a horizontal long strip structure, and a plurality of supporting feet are arranged at the bottom to support the entire clamping structure;
[0028] The fixing bracket is vertically mounted on the upper surface of the clamping structure base, and includes two arms arranged in parallel, and the axes of the two arms are symmetrically arranged in the horizontal direction;
[0029] The arms of the fixing bracket form a height difference when installed to meet the operating requirements of wafer storage boxes of different heights;
[0030] The hollow rotating platform surrounds the rotating shaft in a ring shape and is connected to the fixed bracket through a connecting piece;
[0031] The forward and backward moving assembly is arranged on a linear guide rail, slides in a horizontal direction through the linear guide rail, and the mounting screw vertically passes through the forward and backward moving assembly and fixes it on the tooth fork;
[0032] The tooth fork is fixedly connected to the forward and backward moving assembly.
[0033] The two arms are arranged on the same horizontal line, the axes of rotation are parallel, and each arm is installed on the clamping structure base through an independent fixing bracket.
[0034] Furthermore, the storage shelf is an overall cubic frame structure, including a plurality of storage locations, each of which includes a horizontally installed layer plate, a vertically arranged vertical plate, a horizontally penetrating crossbeam, columns located at the four corners, an obliquely arranged diagonal beam, and a back plate at the rear side, wherein the layer plate is used to carry a wafer box, and its surface has a positioning structure adapted to the shape of the bottom of the wafer box; the vertical plate is vertically installed on both sides of the storage location, connected to the layer plate, and provides vertical support; the crossbeam horizontally penetrates the front and rear positions of the storage location, and is connected to the layer plate and the columns, and provides lateral support; the columns are located at the four corners of the storage location, and serve as the skeleton structure of the frame, providing vertical support; the oblique beam extends from the column to the layer plate at a certain angle, and forms a triangular support structure with the layer plate and the column; the back plate is installed on the rear side of the storage location, and is connected to the rear edge of the column and the vertical plate;
[0035] A left-side limiting structure and a right-side limiting structure are provided on the layer plate. The left-side limiting structure is a fixed structure with a hole, which is provided on one side of the layer plate. The right-side limiting structure includes a right-side limiting groove provided on the layer plate, and a limiting component slidably installed in the limiting groove. The limiting component can adjust its position along the left-right direction in the limiting groove.
[0036] Furthermore, a screw drive system is provided on the vertical truss, the screw is connected to the vertical truss through a nut, and the screw is driven to rotate by a motor to realize the up and down movement of the clamping structure; the vertical truss is also provided with a plurality of guide sliders to ensure the stability and accuracy of the clamping structure during the up and down movement;
[0037] The sliding mechanism of the overhead travelling vehicle comprises a plurality of rollers and tracks. The rollers are mounted at the bottom of the overhead travelling vehicle. The rollers are in contact with the tracks through bearings to achieve free sliding of the overhead travelling vehicle on the tracks. The overhead travelling vehicle is provided with an electric push rod for controlling the moving direction and speed of the overhead travelling vehicle.
[0038] The gear system includes a plurality of gear sets, each of which is composed of a driving gear and at least one driven gear. The driving gear is connected to the left and right moving motor through a shaft, and the driven gear is meshed with a rack.
[0039] Furthermore, the annular structure of the hollow rotating platform extends axially along the rotating shaft and is provided with a plurality of mounting holes on its outer circumference; the linear guide rail is fixedly installed on the upper surface of the hollow rotating platform, and the slider can slide horizontally along the linear guide rail; the tooth fork is provided with a plurality of independent positioning columns, and the shapes and positions of these positioning columns correspond to the positioning holes at the bottom of the wafer box.
[0040] Furthermore, it also includes front and rear limiting structures arranged in front and rear of the layer plate, and the front and rear limiting mechanisms include a pair of front and rear limiting grooves arranged on the layer plate and a protrusion structure arranged in the front and rear limiting grooves, which are used to limit the position of the wafer box in the front and rear directions. The protrusion structure is a cylindrical structure, the upper part of which is a cone top, and the lower part is provided with a laterally extending support surface; the layer plate is roughly rectangular in shape, with an opening in the center, and the opening extends upward from the lower part of the layer plate to present a U shape; the vertical plate is a longitudinal long strip structure, and a plurality of horizontal notches or grooves are evenly arranged along the height direction to form a notch structure for plugging in the layer plate, and the two ends of the vertical plate are connected to the columns by fasteners, and the columns are located at the four corners of the storage position to form a frame structure.
[0041] The invention of the semiconductor wafer box automatic handling intelligent storage system provided by the present invention realizes the comprehensive optimization of the semiconductor wafer box handling and storage system by introducing an intelligent scheduling system, precise positioning technology, efficient storage architecture and highly automated control. First, the handling efficiency is greatly improved and human errors are reduced, ensuring the safety and accurate access of the wafer box. Intelligent scheduling and dynamic control capabilities enable the system to respond to production needs in real time, optimize resource allocation, and significantly improve the level of automation and intelligence. The flexible storage architecture effectively improves the space utilization rate, supports large-scale and high-frequency access operations, and meets the needs of modern production. At the same time, high-precision positioning and stable access mechanisms ensure the efficiency of the production process and the consistency of wafer quality. The system is highly integrated, which promotes the collaborative work between various production equipment, forms an efficient information sharing network, and improves overall production efficiency. Superior environmental adaptability and low maintenance cost ensure that the system operates stably in a strict semiconductor manufacturing environment. Perfect data collection and analysis capabilities support intelligent optimization and continuous improvement, and further improve production efficiency. In addition, the enhanced safety design effectively reduces operational risks and ensures the safety and stability of the production line. In summary, the present invention significantly improves the overall efficiency, intelligence level and safety of the semiconductor wafer box handling and storage system, meeting the needs of the modern semiconductor manufacturing industry for efficient, flexible and intelligent production processes. BRIEF DESCRIPTION OF THE DRAWINGS
[0042] Figure 1 : Schematic diagram of the overall structure of the system in the present invention;
[0043] Figure 2 : Schematic diagram of the structure of the truss device in the present invention;
[0044] Figure 3 : A schematic diagram of the structure of the wafer box buffer device in the present invention;
[0045] Figure 4 : Schematic diagram of the storage device structure in the present invention;
[0046] Figure 5 : The present invention Figure 4 A partial enlarged view of part A;
[0047] Figure 6 : A schematic diagram of the structure of the clamping structure for clamping a wafer box in the present invention;
[0048] Figure 7 : Schematic diagram of the storage shelf structure in the present invention;
[0049] Figure 8 :In the present invention Figure 7 A partial enlarged view of part B.
[0050] Figure numerals: 1-longitudinal truss 2-transverse truss 3-forward and backward moving motor 4-left and right moving motor 5-up and down moving motor 6-clamping structure 7-vertical truss 8-overhead crane device 9-hanging device 10-sliding mechanism 11-track 12-truss device 13-loading platform 14-wafer box 15-protruding structure 16-tooth fork 17-parallel clamping plate 18-fixed column 19-wafer box buffer device 20-installation groove 21-transmission belt 22-storage device 23-manipulator device 24-storage shelf 25-clamping structure base 26-fixed bracket 27-rotating shaft 28-hollow rotating platform 29-forward and backward moving assembly 30-installing screws 31-linear guide rail 32-positioning column 33-support foot 34-baffle 35-slider 100-layer plate 101-vertical plate 102-cross beam 103-column 104-oblique beam DETAILED DESCRIPTION
[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0052] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.
[0054] This specific embodiment describes in detail a specific implementation method of an intelligent storage system for automated handling of semiconductor wafer boxes. The system achieves high-precision, high-stability and highly automated operation of wafer boxes during storage, handling and transportation through the organic combination of multiple structural components, and solves the problems of vibration damage, insufficient operation accuracy and low automation level that may occur during the transportation of wafer boxes in traditional semiconductor production processes.
[0055] The overall structure of the system is as follows Figure 1 As shown, it mainly includes a truss device 12, a crane device 8, a wafer box buffer device 19, a storage device 22, a manipulator device 23, a power assembly and a control system. The truss device consists of a longitudinal truss 1 and a transverse truss 2. The longitudinal truss 1 and the transverse truss 2 are fixedly connected by bolts or welding to form a stable frame structure. A forward and backward moving motor 3 is installed on the longitudinal truss 1. The forward and backward moving motor 3 drives the transverse truss 2 to move left and right on the longitudinal truss 1 through a transmission belt 21 or a chain to ensure that the transverse truss 2 can cover the entire working area.
[0056] The horizontal truss 2 is equipped with a left-right moving motor 4, which drives the clamping structure 6 to move forward and backward on the horizontal truss 2 through a gear and rack system, further improving the movement accuracy of the clamping structure in a two-dimensional plane. The vertical truss 7 of the clamping structure 6 is equipped with an up-and-down moving motor 5, which is driven by a lead screw or a hydraulic system to achieve the up-and-down movement of the clamping structure 6, so that it can flexibly position and operate the wafer box 14 in a three-dimensional space.
[0057] The crane device 8 is suspended on the track 11 above the truss device, and the crane 8 can move freely on the track 11 through the sliding mechanism 10. A hanger 9 is provided at the lower end of the crane 8 for taking and placing the wafer box 14. The sliding mechanism 10 is composed of a plurality of rollers and tracks 11. The rollers 12 are in contact with the tracks 11 through bearings to ensure the smooth sliding of the crane 8 on the tracks 11 and reduce the vibration caused by the movement. The movement of the crane 8 is controlled by a high-precision servo motor and encoder, combined with advanced control algorithms to ensure that it is stable and accurate during movement, and can be quickly positioned to any specified position, thereby improving the handling efficiency and operational flexibility.
[0058] The wafer box buffer device 19 is arranged on one side of the truss device, and includes a plurality of independent storage units and drive devices, which are used to temporarily store the wafer boxes 14 and transport them to the storage device 22. The buffer device 19 includes a loading platform 13, on which a mounting groove 20 and a transmission belt 21 are provided, which are used to accurately position and lift the wafer boxes 14 placed thereon. A baffle 34 is arranged around the loading platform 13, which is made of rubber pads or polyurethane materials, and can effectively absorb and alleviate external vibrations, ensuring the stability of the wafer boxes 14 during transportation.
[0059] The storage device 22 is located on the other side of the wafer box cache device 19, and includes multiple storage areas, each of which is connected to the cache device 19 through a manipulator device 23. A storage shelf 24 with a cubic frame structure is provided inside the storage device 22, and the storage shelf 24 is composed of a layer plate 100, a vertical plate 101, a crossbeam 102, a column 103, an inclined beam 104 and a back plate. The surface of the layer plate is designed with a positioning structure adapted to the bottom of the wafer box 14 to ensure the precise positioning of the wafer box 14 during storage. Left and right limiting structures 100a and 100c are provided on both sides of the layer plate. The left limiting structure 100a is a fixing device with holes, which is fixed by screws. The right limiting structure 100c includes a limiting groove and a slidable limiting component. The limiting component can be adjusted according to the size of the wafer box 14 to meet the storage requirements of wafer boxes 14 of different specifications.
[0060] The manipulator device 23 includes a clamping structure base 25, a fixed bracket 26, a rotating shaft 27, a hollow rotating platform 28, a forward and backward moving assembly 29, a mounting screw 30, a linear guide 31 and a tooth fork 16. The clamping structure base 25 is a horizontal long strip structure, and a plurality of height-adjustable support feet 33 are provided at the bottom, which are in contact with the ground through a baffle 34 to absorb the vibration generated during operation. The fixed bracket 26 is vertically mounted on the upper surface of the clamping structure base 25 and is provided with two arms arranged in parallel and at different heights, ensuring that the clamping structure can simultaneously operate wafer boxes 14 of different heights. The rotating shaft 27 serves as the rotating fulcrum of the hollow rotating platform 28, connecting the hollow rotating platform 28 and providing the flexibility of rotational movement.
[0061] The forward and backward moving assembly 29 is installed on the hollow rotating platform 28, and horizontal sliding is achieved through the linear guide 31, and the slider 35 ensures the stability of the moving process. The mounting screws 30 fix the forward and backward moving assembly 29 and the tooth fork 16. The tooth fork 16 is provided with a plurality of positioning columns 32, which correspond to the positioning holes at the bottom of the wafer box 14 to ensure that the wafer box 14 is stably fixed during the clamping process. The structural design of the positioning column 32 of the tooth fork 16 can accurately dock the wafer box 14, prevent sliding or tilting during the transportation process, and improve the reliability and stability of the operation.
[0062] The cubic frame structure design of the storage shelf 24, combined with the multi-level limiting structure and baffle 34, ensures the stable storage and shock protection of the wafer box 14 in multiple directions, and extends the service life of the system. The clamping structure 6 is adapted to the protruding structure 15 of the wafer box 14, and a plurality of fixing columns 18 are provided on the clamping plate 17. The edge of the protruding structure 15 of the wafer box 14 is provided with a plurality of notches, and the fixing columns 18 are adapted to the notches, thereby achieving stable clamping. This design ensures that the wafer box is moved through the design of parallel clamping plates 17 and fixing columns 18, achieving a stable and reliable clamping effect, and avoiding the wafer box 14 from sliding and falling during transportation.
[0063] The manipulator 23 and the storage shelf 24 are closely connected through the linear guide 31 and the rotating platform 28. The manipulator 23 can flexibly adjust its position and angle according to the layout of the storage shelf 24 to ensure that the wafer box 14 can be efficiently grasped and stored in a multi-layer storage environment. The annular structure of the hollow rotating platform 28 and the design of the forward and backward moving component 29 enable the manipulator 23 to switch freely between different levels and positions to adapt to complex storage environment requirements.
[0064] In addition, the structural design of the storage shelf 24 ensures the limitation and stable support of the wafer box 14 in multiple directions. The left and right limiting structures of the shelf cooperate with the front and rear limiting structures, so that the wafer box 14 is effectively limited in four directions to avoid tilting or sliding during storage and transportation. The combination of beams, columns, vertical plates and inclined beams 106 constitutes a stable support structure, so that the shelf 24 can still maintain overall stability and is not easy to deform under multi-layer high-load conditions. Such a structural design ensures the safety of the wafer box 14 during storage and extends the service life of the shelf 24.
[0065] The connection relationship of the storage shelf 24 is closely integrated with the robot device 23 to achieve efficient access operation of the wafer box 14. The robot device 23 is mechanically connected to the storage position of the storage shelf 24 through the linear guide 31 and the rotating platform 28. Specifically, the tooth fork 16 of the robot device 23 can accurately dock with the storage position where the wafer box 14 is located in the storage shelf 24. Through the flexible rotation of the rotating platform 28 and the horizontal sliding of the forward and backward moving component 29, the robot device 23 can accurately grab or place the wafer box 14 in any designated storage position.
[0066] When it is necessary to take out the wafer box 14, the robot device 23 first moves to the storage position above the corresponding storage shelf 24, and accurately docks the positioning column 32 of the tooth fork 16 with the positioning hole of the wafer box 14 to ensure the stable clamping of the wafer box 14. Subsequently, the robot device 23 lifts the wafer box 14 through the up and down movement motor 5, and transfers it to the sling 9 of the overhead crane 8 through the forward and backward movement component 29. Conversely, when it is necessary to store the wafer box 14, the robot device 23 grabs the wafer box 14 from the sling 9 of the overhead crane 8 and moves it to the designated storage position to ensure that the wafer box 14 is accurately and firmly placed.
[0067] The design of the storage shelf 24 also takes into account the needs of multi-layer storage and high-density storage. Each storage shelf 24 can stack multiple layers to increase storage capacity. The spacing between the layers can be adjusted according to the height of the wafer box 14, and the positioning position of the adjusting screw 30 and the limit device can be adapted to the storage requirements of wafer boxes 14 of different specifications. The multi-level storage design enables the system to achieve efficient storage layout in a limited space, significantly improving the overall storage capacity and space utilization.
[0068] In addition, the modular design of the storage racks 24 enables the system to be flexibly expanded and adjusted according to the needs of the production line. By increasing or decreasing the number of storage racks 24, the system can easily adapt to production needs of different scales. The standardized design of each storage rack 24 also facilitates maintenance and replacement, reducing the maintenance cost and downtime of the system.
[0069] In order to further improve the safety and ease of operation of the system, multiple safety protection measures are also provided between the storage shelves 24 and the robot device 23. For example, the system is equipped with an overload protection device. When the weight of the wafer box 14 exceeds the set value, the control system will automatically stop the operation to prevent the robot device 23 from being damaged due to overload. In addition, each storage position of the storage shelf 24 is also equipped with an emergency stop button and an alarm system. When an abnormal situation is detected, the system will immediately sound an alarm and stop all operations to ensure the safe operation of the system.
[0070] In the daily maintenance and operation of the system, operators can monitor the operating status and working parameters of each component in real time through the control system interface, and promptly discover and deal with potential problems. The system also supports remote monitoring and diagnosis functions, and operators can remotely manage and troubleshoot the system through network connections, improving maintenance efficiency and system availability.
[0071] In addition, the modular design of the storage rack 24 not only facilitates the expansion and adjustment of the system, but also improves the overall flexibility and adaptability. Wafer boxes 14 of different specifications and models can quickly adapt to new storage requirements by simply adjusting the limit devices and the positioning structure of the layer plate, without the need for large-scale modifications to the entire storage rack 24. This flexible design enables the system to quickly respond to changes and upgrades in the production line, maintaining a high degree of adaptability and competitiveness.
[0072] In order to ensure the stability of the storage rack 24 and the manipulator device 23 under high load and complex operating environment, high-strength materials and advanced manufacturing technology are used in each connection point of the storage rack 24 and the manipulator device 23. Through precise processing and strict quality control, it is ensured that each connection point has sufficient strength and durability to withstand high-load operation for a long time without loosening or damage.
[0073] As one of the core components of the backplane, the layer plate 100 is designed with a positioning structure on its surface that adapts to the bottom shape of the wafer box to ensure that the wafer box maintains accurate positioning when placed. The layer plate 100 is roughly rectangular, and a U-shaped opening 100b extending from bottom to top is provided in the center. Through this opening design, the layer plate 100 not only reduces the weight, but also facilitates the installation of the limiting component and the flexible adjustment of the wafer box, so that the backplane can adapt to wafer boxes of different specifications. Left and right limiting structures are provided on both sides of the layer plate 100, wherein the left limiting structure 100a is a fixing device with holes, which is firmly installed on one side of the layer plate 100 by fasteners to provide stable lateral limiting; the right limiting structure includes a limiting groove 100c and a slidable limiting component, the limiting groove 100c is set along the side of the layer plate 100, and the limiting component can slide in the groove and be fixed by screws to adapt to wafer boxes of different widths. This combined design of left and right limits ensures that the wafer box is accurately fixed on the layer plate 100, preventing it from sliding laterally during storage and transportation.
[0074] The vertical plate is a longitudinal strip structure, which is installed vertically on both sides of each storage position. A plurality of horizontal notches or grooves 101a are evenly arranged along the height direction for inserting the layer plate 100. The layer plate 100 can be firmly installed in the horizontal notches or grooves 101a through these notches. The two ends of the vertical plate are connected to the columns by fasteners to form a solid frame structure. Reinforcement ribs or protrusions are provided at the connection between the vertical plate and the column to enhance the bending resistance and stability of the frame, so that the backplane can still maintain good structural stability when carrying multi-layer wafer boxes to avoid shaking caused by gravity or vibration.
[0075] The crossbeam is a horizontal support structure and is the key to the overall lateral support of the backplane. The crossbeam is long and its two ends are fixed to the adjacent columns through connectors, thereby ensuring the firmness of the lateral connection. Reinforcement ribs are provided at the connection between the crossbeam and the column to further improve the overall deformation resistance of the backplane and ensure that the structure can remain stable under high load conditions. The column is the main frame skeleton of the entire storage backplane and provides vertical support. Each column is installed on the bottom base through fasteners to ensure the stability and load-bearing capacity of the overall backplane. The column, the layer plate 100, the crossbeam and the vertical plate together form a cubic frame, so that the backplane maintains high rigidity and stability in multi-layer applications. The corner structure of the column combined with the reinforcement rib design of the vertical plate and the crossbeam effectively enhances the bending resistance of the backplane, which is suitable for high-density storage needs and ensures that the wafer box will not be deformed due to gravity when stacked.
[0076] The inclined beam 104 is an auxiliary support structure, which is arranged obliquely in the storage space, connecting the columns and the layer plate 100 to form a triangular support structure. The triangular support can effectively disperse the load on the layer plate 100, preventing the layer plate 100 from sinking or deforming due to the overloaded wafer box. The addition of the inclined beam 104 significantly improves the impact resistance of the storage backplane, so that it can still maintain the structural firmness and stability when subjected to external force or vibration.
[0077] The back plate is installed behind the back plate to prevent the wafer box from shifting in the front-to-back direction. The back plate is connected to the rear edge of the column and the vertical plate by screws to form a complete storage frame. The design of the back plate further enhances the overall rigidity of the back plate, preventing the wafer box from sliding backwards during storage and transportation, thereby protecting the safety of the wafer box.
[0078] In terms of system energy management, the entire automated handling intelligent storage system adopts an efficient energy utilization solution. The servo motor and belt drive system of the power component are designed with energy efficiency optimization to reduce energy consumption and improve the overall energy efficiency of the system. In addition, the system is equipped with a backup power supply and an emergency power-off device to ensure that the system can be safely shut down in the event of a sudden power outage, avoiding accidental damage to the wafer box during transportation.
[0079] Through the optimized design of the above-mentioned structure and functions, the semiconductor wafer box automated handling intelligent storage system in this embodiment realizes efficient, stable and safe operation of the wafer box during storage, handling and transportation. The system's multi-layer shockproof design and high-precision control algorithm ensure the safety and stability of the wafer box under high-speed operation and complex operating environments. At the same time, the modular and flexible design enables the system to quickly adapt to different production needs and changes, significantly improving the overall production efficiency and automation level. Through this integrated intelligent storage system, semiconductor manufacturing companies can achieve a more efficient, reliable and intelligent production process, meet the strict requirements of modern production lines for high-precision, high-stability and highly automated equipment, and have broad application prospects and market value.
[0080] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.
Claims
1. A semiconductor wafer box automated handling intelligent storage system, characterized in that: include, A truss device, wherein the truss device comprises a longitudinal truss and a transverse truss, wherein the longitudinal truss and the transverse truss are fixed by bolts or welding to form a frame structure; A crane structure is arranged above the truss device. The crane structure can move freely on the track of the frame through a sliding mechanism, so that the crane can move between different working positions. A lifting device is arranged at the lower end of the crane for taking and placing wafer boxes; A wafer box cache device is arranged on one side of the truss device, and is used to temporarily store wafer boxes and transport them to the storage device. The wafer box cache device includes a plurality of independent storage units and a drive device to ensure stable storage and rapid retrieval of wafer boxes; The storage device is arranged on one side of the wafer box cache device and is used to store wafer boxes. The storage device includes multiple storage areas, each of which is connected to the wafer box cache device through a robot device to transfer the wafer boxes from the wafer box cache device to the storage area for storage.
2. The semiconductor wafer box automated handling intelligent storage system according to claim 1, characterized in that: The forward and backward moving motor is installed on the longitudinal truss of the frame, and is driven by a transmission belt or chain to realize the left and right movement of the transverse truss on the longitudinal truss; the left and right moving motor is installed on the transverse truss, and is driven by a gear and rack system to realize the forward and backward movement of the clamping structure on the transverse truss; the up and down moving motor is installed on the vertical truss of the clamping structure, and is driven by a lead screw or a hydraulic system to realize the up and down movement of the clamping structure; in, The clamping structure is moved by means of a slide rail and a gear system, and a clamping structure is provided at the lower end of the clamping structure for matching with a protruding structure on the wafer box for lifting the entire wafer box; The clamping structure is moved by means of a slide rail and a gear system, and a clamping structure is provided at the lower end of the clamping structure for matching with a protruding structure on the wafer box for lifting the entire wafer box; The clamping mechanism comprises two parallel clamping plates, a plurality of fixing columns are arranged on the clamping plates, a plurality of notches are arranged on the edge of the protruding structure, and the fixing columns are adapted to the notches; The overhead crane is suspended on the track at the top of the frame, and the sliding mechanism enables the overhead crane to move freely on the track, so that the overhead crane can move between different working positions. A hoist is provided at the lower end of the overhead crane for taking and placing wafer boxes.
3. The semiconductor wafer box automated handling intelligent storage system according to claim 1, characterized in that: The wafer box cache device includes a loading platform and accurately positions the wafer box placed thereon through a positioning mechanism; the positioning mechanism includes at least a mounting groove, a screw and a limit device, wherein the mounting groove is arranged on the loading platform and is used for lateral and longitudinal positioning of the wafer box; the screw passes through the mounting groove and fixes the wafer box on the loading platform; the limit device is used to limit the lateral or longitudinal movement of the wafer box, and can be adjusted according to the size of the wafer box to adapt to wafer boxes of different specifications.
4. The semiconductor wafer box automated handling intelligent storage system according to claim 1, characterized in that: The storage device comprises a storage body; Storage shelves for storing semiconductor wafer boxes disposed in the warehouse; A robot device disposed between storage shelves for storing and retrieving semiconductor wafer boxes; The storage shelf includes a front-to-back limiting structure and a left-to-right limiting structure to limit the position of the wafer box on the storage shelf; The manipulator device comprises a clamping structure base, a fixed bracket, a rotating shaft, a hollow rotating platform, a forward and backward moving component, a mounting screw, a linear guide rail and a tooth fork; The clamping structure base is a horizontal long strip structure, and a plurality of supporting feet are arranged at the bottom to support the entire clamping structure; The fixing bracket is vertically mounted on the upper surface of the clamping structure base, and includes two arms arranged in parallel, and the axes of the two arms are symmetrically arranged in the horizontal direction; The arms of the fixing bracket form a height difference when installed to meet the operating requirements of wafer storage boxes of different heights; The hollow rotating platform surrounds the rotating shaft in a ring shape and is connected to the fixed bracket through a connecting piece; The forward and backward moving assembly is arranged on a linear guide rail, slides in a horizontal direction through the linear guide rail, and the mounting screw vertically passes through the forward and backward moving assembly and fixes it on the tooth fork; The tooth fork is fixedly connected to the front-rear moving assembly. The two arms are arranged on the same horizontal line, the centers of the rotating axes are parallel, and each arm is installed on the clamping structure base through an independent fixing bracket.
5. The semiconductor wafer box automated handling intelligent storage system according to claim 4, characterized in that: The storage shelf is in the form of a cubic frame structure as a whole, including a plurality of storage locations, each of which includes a horizontally installed layer plate, a vertically arranged vertical plate, a horizontally penetrating crossbeam, columns located at the four corners, an obliquely arranged diagonal beam, and a back plate at the rear side, wherein the layer plate is used to carry a wafer box, and its surface has a positioning structure adapted to the shape of the bottom of the wafer box; the vertical plate is vertically installed on both sides of the storage location, connected to the layer plate, and provides vertical support; the crossbeam horizontally penetrates the front and rear positions of the storage location, and is connected to the layer plate and the columns, and provides lateral support; the columns are located at the four corners of the storage location, and serve as the skeleton structure of the frame, providing vertical support; the oblique beam extends from the columns to the layer plate at a certain angle, and forms a triangular support structure with the layer plate and the columns; the back plate is installed on the rear side of the storage location, and is connected to the rear edges of the columns and the vertical plate; A left-side limiting structure and a right-side limiting structure are provided on the layer plate. The left-side limiting structure is a fixed structure with a hole, which is provided on one side of the layer plate. The right-side limiting structure includes a right-side limiting groove provided on the layer plate, and a limiting component slidably installed in the limiting groove. The limiting component can adjust its position along the left-right direction in the limiting groove.
6. The semiconductor wafer box automated handling intelligent storage system according to claim 4, characterized in that: The vertical truss is provided with a lead screw drive system, the lead screw is connected to the vertical truss through a nut, and the lead screw is driven to rotate by a motor to realize the up and down movement of the clamping structure; the vertical truss is also provided with a plurality of guide sliders to ensure the stability and accuracy of the clamping structure during the up and down movement; The sliding mechanism of the overhead travelling vehicle comprises a plurality of rollers and tracks. The rollers are mounted at the bottom of the overhead travelling vehicle. The rollers are in contact with the tracks through bearings to achieve free sliding of the overhead travelling vehicle on the tracks. The overhead travelling vehicle is provided with an electric push rod for controlling the moving direction and speed of the overhead travelling vehicle. The gear system includes a plurality of gear sets, each of which is composed of a driving gear and at least one driven gear. The driving gear is connected to the left and right moving motor through a shaft, and the driven gear is meshed with a rack.
7. The semiconductor wafer box automated handling intelligent storage system according to claim 4, characterized in that: The annular structure of the hollow rotating platform extends along the axial direction of the rotating shaft and is provided with a plurality of mounting holes on its outer circumference; the linear guide rail is fixedly installed on the upper surface of the hollow rotating platform, and the slider can slide horizontally along the linear guide rail; the tooth fork is provided with a plurality of independent positioning columns, and the shapes and positions of these positioning columns correspond to the positioning holes at the bottom of the wafer box.
8. The semiconductor wafer box automated handling intelligent storage system according to claim 5, characterized in that: It also includes front and rear limiting structures arranged in front and behind the layer plate, and the front and rear limiting mechanisms include a pair of front and rear limiting grooves arranged on the layer plate and a protrusion structure arranged in the front and rear limiting grooves, which are used to limit the position of the wafer box in the front and rear directions. The protrusion structure is a cylindrical structure, the upper part of which is a cone top, and the lower part is provided with a laterally extending support surface; the layer plate is roughly rectangular in shape, with an opening in the center, and the opening extends upward from the lower part of the layer plate to present a U shape; the vertical plate is a longitudinal long strip structure, and a plurality of horizontal notches or grooves are evenly arranged along the height direction to form a notch structure for plugging in the layer plate, and the two ends of the vertical plate are connected to the columns by fasteners, and the columns are located at the four corners of the storage position to form a frame structure.