Chip pickup device and method

Abstract

The invention discloses a chip pickup device and method. The pickup device comprises a gas inlet nozzle used for introducing gas; the ejector pin selection assembly comprises a selection disc and a telescopic disc, first hole sites are distributed on the selection disc, second hole sites are distributed on the telescopic disc and used for allowing ejector pins to extend out, and the hole site sequence of the extending target ejector pins is adjusted according to the position relation between the selection disc and the telescopic disc. The hole site distance and the extension length of the target ejector pin are adjusted according to the position relation between the telescopic disc and the ejector pin; the gas outlet disc is located below the ejector pin selection assembly and comprises a gas outlet for outputting gas to adsorb the chip, and the gas outlet disc comprises a third hole site, so that the target ejector pin extends out of the outer side of the chip through the first hole site, the second hole site and the third hole site to limit the chip in the circumferential direction from the outer side of the chip. The chip adsorption device can be suitable for adsorbing different chips, does not make contact with other chips nearby when adsorbing the chips, prevents the other chips from being polluted, and meanwhile can improve the stability of the chips in the conveying process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a chip picking device, a chip picking method, and a computer-readable storage medium. Background Art

[0002] In the chip-to-wafer bonding process of the semiconductor process, the chip needs to be picked up first. In the traditional vacuum adsorption method of the chip, the nozzle will come into contact with the chip, which will inevitably cause contamination and defects of the chip. Among the non-contact adsorption methods, the Bernoulli suction cup is a more commonly used method.

[0003] However, in the traditional Bernoulli suction cup design, the pin used for positioning is in a fixed position, so one suction nozzle can only suck chips of one size. In the process of picking up chips, since the extension length of the ejector pin is fixed and cannot be extended, for some thinner chips, the extension length of the ejector pin is too long, and it is easy to touch other nearby chips when sucking the chip to be picked up, causing other chips to be contaminated. For some thicker chips, the extension length of the ejector pin is too short, which is easy to cause instability during the process of transporting and placing the chip, and it is impossible to ensure that the chip is always within the suspension range of the suction nozzle interface.

[0004] In order to solve the above problems existing in the prior art, the art urgently needs a chip picking technology that can be used to adsorb chips of different sizes and thicknesses, and when adsorbing the chip to be picked up, it does not contact other nearby chips to avoid contamination of other chips, and can also improve the stability of the chip during the transmission process. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a chip picking device, a chip picking method, and a computer-readable storage medium, which can be used to adsorb chips of different sizes and thicknesses, and when adsorbing the chip to be picked up, it does not contact other chips nearby to avoid contamination of other chips, and can also improve the stability of the chip during the transmission process.

[0007] Specifically, the chip picking device provided in accordance with the first aspect of the present invention comprises: an air inlet nozzle for introducing gas; a pin selection assembly comprising a selection disk and a telescopic disk, wherein the selection disk is provided with a first hole position, and the telescopic disk is provided with a second hole position, both of which are used for the pins to extend, wherein the hole position sequence of the extended target pins is adjusted according to the positional relationship between the selection disk and the telescopic disk, and the hole position distance and the extension length of the target pins are adjusted according to the positional relationship between the telescopic disk and the pins; and a gas outlet disk, located below the pin selection assembly, comprising a gas outlet to output the gas to adsorb the chip, wherein the gas outlet disk comprises a third hole position, so that the target pins extend from the outside of the chip via the first hole position, the second hole position and the third hole position, thereby circumferentially limiting the chip.

[0008] Furthermore, in some embodiments of the present invention, according to the hole position sequence of the target ejector pin determined by the size of the chip, the rotation angle between the selection disk and the telescopic disk is adjusted to obtain the hole position sequence consisting of the first hole position and the second hole position that overlap with each other.

[0009] Furthermore, in some embodiments of the present invention, a positioning handle is provided on the edge of the selection disk, and the edge of the telescopic disk includes multiple groups of positioning grooves for placing the positioning handle, and the hole position combination between the first hole position and the second hole position is adjusted by changing the positioning groove group in which the positioning handle is placed.

[0010] Furthermore, in some embodiments of the present invention, each of the hole sequences includes hole arrangements of multiple distances, so that the target ejector pin can extend through the first hole and the second hole located at the same position of at least two of the distances.

[0011] Furthermore, in some embodiments of the present invention, the angle between the positioning groove groups ranges from 15° to 30°.

[0012] Furthermore, in some embodiments of the present invention, the hole position distance of the target ejector pin is determined according to the size of the chip, and the rotation angle of the telescopic disk is adjusted according to the posture of the chip to obtain the hole position distance formed by the first hole position and the second hole position corresponding to the current posture of the chip.

[0013] Furthermore, in some embodiments of the present invention, the lifting height of the telescopic plate is adjusted according to the target ejector pin extension length determined by the thickness of the chip to obtain the target ejector pin extension length that exposes the third hole position.

[0014] Furthermore, in some embodiments of the present invention, the chip picking device also includes: a lifting and rotating mechanism, connected to the telescopic disk, used to drive the telescopic disk to rise so as to drive the target ejector pin to separate from the air outlet disk, and then drive the telescopic disk to rotate, and after rotating to the hole position distance of the target ejector pin, drive the telescopic disk to descend so that the target ejector pin that passes through the first hole position and the second hole position extends out of the third hole position corresponding to at least two groups of hole position distances by a preset length.

[0015] Furthermore, in some embodiments of the present invention, the at least two groups of holes are evenly distributed on the edge of the chip, and the distance between each group of holes is slightly larger than the chip, so that the chip is circumferentially limited by the target ejector pins extending from the at least two groups of holes when being adsorbed.

[0016] Furthermore, in some embodiments of the present invention, the extension length of the target ejector pin ranges from 0 to 2 mm.

[0017] Furthermore, in some embodiments of the present invention, the gas outlet is a circular air channel located at the center of the gas outlet plate and connected to the gas inlet nozzle to output the gas from the gas outlet in the form of positive pressure airflow and generate negative pressure in the combined flow channel between the gas outlet plate and the chip to adsorb the chip.

[0018] In addition, the chip picking method provided in accordance with the second aspect of the present invention comprises the following steps: obtaining a chip to be picked up and determining the size and thickness of the chip; determining, according to the size of the chip, a hole sequence and a hole distance of a target ejector pin extending from a selection disk and a telescopic disk in an ejector pin selection assembly of the chip picking device provided in the first aspect of the present invention; determining, according to the thickness of the chip, an extension length of the target ejector pin; adjusting a positional relationship between the selection disk and the telescopic disk to obtain a hole sequence of the target ejector pin, and adjusting a positional relationship between the telescopic disk and the ejector pin to obtain a hole distance and an extension length of the target ejector pin; and introducing gas from an air inlet nozzle so that the output gas adsorbs the chip, wherein the target ejector pin extends from the outside of the chip via a first hole on the selection disk, a second hole on the telescopic disk, and a third hole on the gas outlet disk to circumferentially limit the chip.

[0019] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above-mentioned chip picking method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0021] Figure 1 A schematic structural diagram of a chip pickup device provided according to some embodiments of the present invention is shown;

[0022] Figure 2 It shows a schematic structural diagram of a gas outlet disk provided according to some embodiments of the present invention;

[0023] Figure 3A It is a schematic diagram of the nozzle structure of a traditional Bernoulli suction cup;

[0024] Figure 3B A schematic diagram of a nozzle structure of a chip picking device provided in some embodiments of the present invention is shown;

[0025] Figure 4 A schematic diagram of the structure of a selection disk provided according to some embodiments of the present invention is shown;

[0026] Figure 5 It shows a schematic structural diagram of a telescopic disk provided according to some embodiments of the present invention;

[0027] Figure 6 A schematic diagram of the structure of a combination of an ejector pin selection assembly and an air outlet plate provided in some embodiments of the present invention is shown;

[0028] Figure 7 A schematic diagram showing the positional relationship between a target ejector pin and a chip provided according to some embodiments of the present invention is shown;

[0029] Figure 8 It shows a schematic structural diagram of a chip pickup device provided in some embodiments of the present invention when absorbing a chip to be picked up; and

[0030] Fig. 9 A flow chart of a chip picking process method provided according to some embodiments of the present invention is shown.

[0031] Reference numerals:

[0032] 100 Chip Pickup Device;

[0033] 110 air intake nozzle;

[0034] 111 Intake plate;

[0035] 120 ejector pin selection assembly;

[0036] 121 Select disk;

[0037] 122 telescopic disc;

[0038] 130 air outlet plate;

[0039] 131 air outlet;

[0040] 140 thimble;

[0041] 150 lifting and rotating mechanism;

[0042] 210 third hole position;

[0043] 420 first hole position;

[0044] 520 second hole position;

[0045] 310, 320 nozzles;

[0046] 311 annular air outlet;

[0047] 312 center disk;

[0048] 213 Chips to be picked up;

[0049] 214 other chips;

[0050] 410 Adjustment handle;

[0051] 510 positioning slot group;

[0052] 530 telescopic plate connection hole;

[0053] 610 Target ejector pin; and

[0054] Steps S910~S950. DETAILED DESCRIPTION

[0055] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0056] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0058] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0059] As mentioned above, in the traditional Bernoulli suction cup design, the pin used for positioning is in a fixed position, so one suction nozzle can only absorb chips of one size. In the process of picking up the chip, since the extension length of the ejector pin is fixed and cannot be extended, for some thinner chips, the extension length of the ejector pin is too long, and it is easy to touch other nearby chips when absorbing the chip to be picked up, thereby causing other chips to be contaminated. For some thicker chips, the extension length of the ejector pin is too short, which is easy to cause instability during the process of transporting and placing the chip, and it is impossible to ensure that the chip is always within the suspension range of the suction nozzle interface.

[0060] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a chip picking device, a chip picking method, and a computer-readable storage medium, which can be suitable for adsorbing chips of different sizes and thicknesses, and when adsorbing the chip to be picked up, it does not contact other chips nearby, so as to avoid contamination of other chips, and can also improve the stability of the chip during the transmission process.

[0061] In some non-limiting embodiments, the chip pickup device provided by the first aspect of the present invention may be used to implement the chip pickup method provided by the second aspect of the present invention.

[0062] Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a processor, can be used to implement the chip picking method provided in the second aspect of the present invention.

[0063] The working principle of the above-mentioned chip pickup device will be described below in conjunction with some embodiments of the chip pickup method. Those skilled in the art will understand that these embodiments of the chip pickup device are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the chip pickup device. Similarly, the chip pickup device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these chip pickup methods.

[0064] Please see Figure 1 , Figure 1 A schematic structural diagram of a chip pickup device provided according to some embodiments of the present invention is shown.

[0065] like Figure 1 As shown, in some embodiments of the present invention, the chip pickup device 100 may mainly include an air inlet nozzle 110 and an air outlet plate 130, and a pin selection assembly 120 located therebetween. The combination of the air inlet nozzle 110 and the air outlet plate 130 may constitute a suction nozzle of the chip pickup device 100.

[0066] Specifically, in some embodiments of the present invention, the air inlet nozzle 110 can be used to introduce gas. The air inlet nozzle 110 can be connected to the air inlet disk 111 through a thread, and the air inlet disk 111 can be threadedly connected to the air outlet disk 130. The air outlet 131 is located below the ejector selection assembly 120 and can be used to output gas to adsorb the chip to be picked up through the Bernoulli effect.

[0067] Please see Figure 2 , Figure 2 FIG. 2 shows a schematic diagram of the structure of the gas outlet disk provided in some embodiments of the present invention. Figure 2 As shown, a plurality of third holes 210 may be provided in the gas outlet disk 130 for a specific portion of the target ejector pins 140 to extend out. The third hole positions 210 may be designed and distributed according to the angle and distance required by the process. The target ejector pins extending from the third hole positions 210 may be located outside the chip to be picked up, and are used to limit the chip to be picked up in the circumferential direction. A gas outlet 131 of a circular structure is provided at the center of the gas outlet disk 130, so as to shrink the vacuum area generating negative pressure, so that smaller chips can be adsorbed.

[0068] Specifically, please see Figure 3A , Figure 3A Figure 1 is a schematic diagram of the nozzle structure of a traditional Bernoulli suction cup. Figure 3A As shown, in the conventional Bernoulli suction cup, the suction nozzle 310 is an annular air outlet 311. Since the central disk 312 in the annular air outlet 311 occupies a large area, for some smaller chips, especially the chips 213 to be picked up whose size is smaller than the annular air outlet 311, it is easy for the air outlet of the annular air outlet 311 to be larger than the chip 213 to be picked up, thereby making it impossible to adsorb these smaller chips. In other words, the air outlet size of the suction nozzle 310 of the Bernoulli suction cup in the prior art is too large, and it is impossible to adsorb the small-sized chip 213 to be picked up well.

[0069] For this, see Figure 3B , Figure 3B A schematic diagram of the nozzle structure of a chip picking device provided according to some embodiments of the present invention is shown.

[0070] like Figure 1 and Figure 3B As shown, in some embodiments, in the suction nozzle 320 of the chip picking device 100 composed of the air inlet nozzle 110 and the air outlet disk 130, the air outlet 131 is a circular structure, that is, a circular air outlet 131. The air outlet 131 is located at the center of the air outlet disk 130 and is connected to the air inlet nozzle 110, so that the gas can be output from the circular air outlet 131 in the form of a positive pressure airflow, and a negative pressure is generated in the combined flow channel between the air outlet disk 130 and the chip 213 to be picked up, thereby adsorbing the chip 213 to be picked up. In this embodiment, the air outlet 131 with a circular structure is smaller in size, and the vacuum area generating the negative pressure can be shrunk, so that smaller chips can be adsorbed. Furthermore, through experiments and simulations, it is verified that the suction force generated by the circular air outlet 131 can also be greater than the weight of the chip, so that it can be stably suspended below the suction nozzle 320 ( Figure 3B The upward arrow in the figure indicates that the chip 213 to be picked up is in a suspended state).

[0071] Furthermore, in the chip field, since it is necessary to ensure the cleanliness level in each process as much as possible, in some preferred embodiments, clean high-purity nitrogen (Purity Nitrogen, PN2) can be introduced into the air inlet nozzle 110 and discharged to generate negative pressure for adsorption through the Bernoulli effect.

[0072] Next, please continue to return to Figure 1The ejector pin selection assembly 120 between the air inlet nozzle 110 and the air outlet disk 130 may include a selection disk 121 and a telescopic disk 122, wherein the selection disk 121 may be provided with a first hole position 420, and the telescopic disk 122 may be provided with a second hole position 520, both of which are used to allow a specific portion of the ejector pins 140 to extend. Further, the hole position sequence of the target ejector pins may be adjusted according to the positional relationship between the selection disk 121 and the telescopic disk 122, and the hole position distance and extension length of the target ejector pins may be adjusted according to the positional relationship between the telescopic disk 122 and the ejector pins 140.

[0073] Specifically, in some embodiments of the present invention, the hole position sequence of the extended target ejector pins can be determined according to the shape and size of the chip 213 to be picked up, and then the rotation angle between the selection disk 121 and the telescopic disk 122 is adjusted to obtain the hole position sequence of the target ejector pins composed of the first hole position 420 and the second hole position 520 that overlap each other.

[0074] Specifically, please refer to Figure 4 and Figure 5 , Figure 4 shows a schematic structural diagram of a selection disk provided according to some embodiments of the present invention, Figure 5 A schematic structural diagram of a telescopic disk provided according to some embodiments of the present invention is shown.

[0075] like Figure 4 As shown, optionally, the surface of the selection plate 121 may be distributed with a plurality of first holes 420 at different distances to allow a specific portion of the ejector pins 140 to extend, and an adjustment handle 410 may be provided at the edge of the selection plate 121. Figure 5 As shown, the disk surface of the telescopic disk 122 may also be distributed with multiple second holes 520 at different distances to allow a specific portion of the ejector pins 140 to extend out, and the edge thereof may include multiple groups of positioning grooves 510 to place the adjustment handle 410 of the selection disk 121.

[0076] Combination Figure 4 and Figure 5As shown, when the adjustment handle 410 of the selection disk 121 cooperates with a group of positioning slots 510 in the telescopic disk 122, the first hole positions 420 and the second hole positions 520 that overlap each other can form a sequence of hole position arrangements, that is, the ejector pins 140 at the positions of the hole position sequence can pass through the first hole positions 420 and the second hole positions 520 to extend out. Different sequences of hole position arrangements can be replaced by the cooperation between the adjustment handle 410 and different groups of positioning slots 510. In other words, by changing the positioning slot group 510 into which the adjustment handle 410 is placed, the rotation angle between the selection disk 121 and the telescopic disk 122 can be adjusted, thereby adjusting the hole position combination between the first hole position 420 and the second hole position 520, and then adjusting the hole position sequence of the target ejector pin.

[0077] Optionally, the angle between adjacent positioning groove groups 510 may be in the range of 15° to 30°. In addition, the rotation position of the selection disk 121 may be adjusted manually, or the rotation position may be controlled and adjusted by an external motor.

[0078] For further information, see Figure 6 , Figure 6 A schematic structural diagram of a combination of an ejector pin selection assembly and an air outlet disk provided according to some embodiments of the present invention is shown.

[0079] like Figure 6 As shown, in the present invention, the position of the selection disk 121 and the telescopic disk 122 in the ejector selection assembly 120 is adjusted by rotating the angle, so that there can be a variety of angle combinations and hole position designs. Figure 6 In the embodiment shown in , there are 16 hole position sequences for the ejector selection assembly 120. First, the adjustment handle 410 in the selection disk 121 can be placed in one of the three groups of positioning grooves 510 in the telescopic disk 122, and the positioning grooves 510 at different positions can correspond to the sequence hole positions of the ejector outlets in different sequences. Figure 6 When the adjustment handle 410 shown in the figure is placed in the leftmost group of positioning slots 510, the current sequence of holes corresponding to the position relationship between the selection plate 121 and the telescopic plate 122 may include 6 groups of hole positions with different distances, that is, there are 6 groups of ejector hole positions with different distances in the hole position sequence expressed, which may include hole position distances of 10.5×10.5mm, 12×16mm, 16×24mm, etc. When the adjustment handle 410 is placed in the middle group of positioning slots 510, there will be hole position sequences of different sizes. It can be understood that the hole position distances listed here are only for illustration, and the hole position sequence includes the specific number of ejector hole positions and the hole position distances of each group can be designed based on actual conditions.

[0080] Please see Figure 7 , Figure 7A schematic diagram showing the positional relationship between a target ejector pin and a chip provided according to some embodiments of the present invention is shown.

[0081] like Figure 7 As shown, in some embodiments of the present invention, since each hole sequence may include hole arrangements of multiple groups of distances, a target ejector pin 610 may be provided to extend from the first hole 420 and the second hole 520 located at the same position of at least two groups of distances. The extended target ejector pin 610 is located at the outer side of the chip 213 to be picked up, so as to be close to the edge of the chip 213 to be picked up, and circumferentially limit the adsorbed chip 213 to be picked up.

[0082] like Figure 7 As shown, during the process of the chip pickup device 100 adsorbing the chip 213 to be picked up, four target pins 610 may be exposed. These four target pins 610 are arranged in pairs, and are respectively attached to the chip 213 to be picked up in the horizontal and vertical directions, so as to limit the chip 213 to be picked up in the circumferential direction during adsorption. If the two groups of target pins 610 are connected in pairs, the connection line formed by the two groups of target pins 610 is vertical, that is, the multiple groups of target pins 610 are evenly distributed on the edge of the chip. The specific hole distance between the two groups of target pins 610 is related to the size (i.e., length and width) of the chip 213 to be picked up.

[0083] Those skilled in the art will appreciate that the above Figure 7 The solution of two groups of target ejector pins 610 shown in the figure is only a non-limiting implementation provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is convenient for the public to implement, rather than to limit the protection scope of the present invention. Optionally, in other embodiments, those skilled in the art can also extend the target ejector pins 610 in holes of multiple groups of distances, such as three groups, based on the concept of the present invention, to achieve the same chip circumferential limiting effect.

[0084] Further, please continue to combine Figure 1 and Figure 6 , usually, the ejector pins 140 can be pre-placed in each first hole position 420 of the selection disk 121. In the ejector pin selection assembly 120 formed by the combination of the selection disk 121 and the telescopic disk 122, after the hole position sequence is selected by the selection disk 121, the hole position distance of the target ejector pin 610 can be determined according to the size of the chip, and then the rotation angle of the telescopic disk 122 is adjusted according to the posture of the chip to obtain the hole position distance consisting of the first hole position 420 and the second hole position 520 corresponding to the current posture of the chip. In other words, different ejector pin distance groups can be selected by rotating the telescopic disk 122 to exactly correspond to the current posture of the chip.

[0085] like Figure 7As shown, the selection of the hole distance of the target ejector pins 610 can be determined according to the size (i.e., length and width) of the chip to be picked up 213. The target ejector pins 610 can be evenly distributed in the holes at the edge of the chip to be picked up 213 from at least two groups of holes, and the distance between each group of holes can be slightly larger than the chip to be picked up 213, so that the chip is circumferentially limited by the target ejector pins 610 extending from at least two groups of holes when being adsorbed.

[0086] For example, if Figure 7 As shown, assuming that the size of the chip 213 to be picked up is 10.12×10.12mm, the distance between the two sets of holes required for this chip, that is, the distance between the two sets of ejector pins, can be 10.5×10.5mm. The edge distance of the two sets of extended target ejector pins 610 needs to be slightly longer than the chip 213 to be picked up, so that the chip can be basically fitted and circumferentially limited. When the chip is adsorbed, it is only subjected to an upward force, and theoretically it can be completely adsorbed. However, in reality, there is airflow disturbance, that is, although the airflow channel between the adsorbed chip in a suspended state and the air outlet disk 130 is completely axially symmetrical, the airflow route is completely different and may change at any time, so the side target ejector pins 610 are required to limit it circumferentially, otherwise the chip is prone to positional displacement between the air outlet disk 130 during the adsorption and transmission process, causing the chip slide to fall off or fly away.

[0087] Furthermore, the rotation angle of the telescopic plate 122 can be determined according to the current posture of the chip 213 to be picked up. Figure 7 The posture of the chip 213 to be picked up is shown as being placed on a plane at a positive angle of 90°. If a hole sequence corresponding to the chip 213 to be picked up in the current telescopic disk 122 is offset to the right by 15° compared to the posture of the chip 213 to be picked up, the telescopic disk 122 can be rotated to the left by 15° to rotate the hole sequence to a positive angle of 90°, which completely corresponds to the current posture of the chip 213 to be picked up, so that the two groups of target ejector pins 610 that are subsequently extended can just cling to the horizontal and vertical sides of the chip 213 to be picked up.

[0088] In some embodiments of the present invention, the extension length of the target ejector pin 610 may be determined according to the thickness of the chip, and then the lifting height of the telescopic plate 122 may be adjusted to obtain a preset extension length of the target ejector pin 610 that exposes the third hole 210 .

[0089] like Figure 6As shown, since there is a corresponding ejector pin 140 in each first pinhole 420 in the selection disk 121, the length of the ejector pin 140, after passing through the first hole position 420 in the selection disk 121, the second hole position 520 in the telescopic disk 122, and the third hole position 210 in the air outlet disk 130, can be adjusted by adjusting the telescopic disk 122 to adjust the extended length of the ejector pin 140 exposed in the third hole position 210.

[0090] Specifically, please return to Figure 1 ,exist Figure 1 In the optional embodiment shown, the chip picking device 100 may further include a lifting and rotating mechanism 150, and the extension and retraction of the ejector pin 140 is controlled by the movement of the lifting and rotating mechanism 150. Figure 1 and 5 As shown, the lifting and rotating mechanism 150 can be threadedly connected to the telescopic disk 122 through the telescopic disk connection hole 530, and there is no fixed relationship between the two. Since the air outlet disk 130 located at the bottom is connected to the air path and is in a relatively fixed state, and the telescopic disk 122 is sleeved on the air outlet disk 130 and is not fixedly connected to it. After determining the hole position distance of the target ejector pin 610, the lifting and rotating mechanism 150 can drive the telescopic disk 122 to rise, so as to drive the target ejector pin 610 to separate from the air outlet disk 130 at the bottom, that is, the target ejector pin 610 is not in the air outlet disk 130. Then, the lifting and rotating mechanism 150 drives the telescopic disk 122 to rotate again, so that the target ejector pin 610 reaches the position of the determined hole position distance. After the telescopic disk 122 rotates to the hole distance of the target ejector pin 610, the lifting and rotating mechanism 150 drives the telescopic disk 122 to descend, so that the target ejector pin 610 that penetrates the first hole position 420 and the second hole position 520 extends out of the third hole position 210 corresponding to at least two sets of hole position distances by a preset length. When the first hole position 420, the second hole position 520 and the third hole position 210 are all in the same position, the target ejector pin 610 can extend out of the air outlet disk 130, and the remaining ejector pins 140 cannot extend out. The exposed length of the target ejector pin 610 can be adjusted by the rise or fall of the telescopic disk 122. Optionally, the extended length of the target ejector pin 510 can range from 0 to 2 mm.

[0091] For example, combining Figure 1 and Figure 6As shown, after adjusting the hole sequence, the ejector pins 140 can be kept retracted in the first hole 420 of the selection plate 121. Based on the size of the chip, the telescopic plate 122 can be raised and rotated to select a suitable hole distance. For example, the rotation angle of the telescopic plate 122 can be 15°. At this time, the first hole 420 in the selection plate 121, the second hole 520 in the telescopic plate 122, and the third hole 210 in the air outlet plate 130 will overlap at the position of 12×16mm. The telescopic plate 122 is lowered to extend the ejector pins 140 at the hole of 12×16mm, which is the target ejector pin 610.

[0092] When the chip picking device 100 picks up a chip of another size, the telescopic plate 122 can be raised to retract the previous target ejector pin 610 from the gas outlet plate 130. The rotation angle of the telescopic plate 122 is adjusted according to the posture of the other chip, and then the target ejector pin 610 is extended at a new hole distance according to the size of the other chip, thereby completing the conversion of the target ejector pin 610 at different hole distances. In the embodiment of the present invention, by adding ejector pin holes at different distances, and the target ejector pin 610 can select the hole position according to the size and shape of the chip 213 to be picked up, the convenience and applicability are increased. In other words, chips of different sizes can adapt to adsorption by replacing different positioning pins.

[0093] Since various circuits can be added to the chip, the thickness of each chip is not uniform. The retractable ejector pin structure composed of the retractable disk 122 and the ejector pin 140 in the chip pickup device 100 of the present invention can adjust the extension length appropriately according to the thickness of different chips.

[0094] Further, see Figure 8 , Figure 8 A schematic structural diagram of a chip pickup device provided according to some embodiments of the present invention when absorbing a chip to be picked up is shown.

[0095] like Figure 8 As shown, during the adsorption process, multiple chips are usually placed on the wafer stage, so there will be other chips 214 around the chip 213 to be picked up. Since the chip pickup device 100 needs distance when performing chip adsorption, and the spacing between each group of target ejector pins 610 is slightly larger than the size of the chip 213 to be picked up, during the adsorption process, suction will only be generated when the distance between the gas outlet plate 130 and the chip 213 to be picked up reaches a certain distance, and this distance is the minimum adsorption distance H. For example, assuming that in this process, when the spacing between the gas outlet plate 130 and the chip to be picked up is 1mm, the suction force is greater than the adhesive force. Here, 1mm is the minimum adsorption distance H, and at this time, the length of the target ejector pin 610 beyond the gas outlet plate 130 cannot exceed the thickness of one chip 213 to be picked up.

[0096] Due to the retractable ejector pin structure formed by the retractable disk 122 and the ejector pin 140 in the present invention, Figure 8 As shown, when adsorbing the chip 213 to be picked up, a length of the target ejector pin 610 can be retracted first, so that the length of the target ejector pin 610 exposed from the air outlet plate 130 can be less than the minimum adsorption distance H, thereby preventing the extended target ejector pin 610 from being too long and touching other nearby chips 214, thereby preventing other chips 214 from being contaminated.

[0097] At the same time, the suction force generated by the Bernoulli effect will increase first and then decrease as the distance between the chip and the bottom surface of the air outlet plate 130 decreases, which causes the chip to be in a micro-motion state during adsorption. During the chip transfer process, if an upward acceleration is added, the downward gravitational force will become larger. Due to the increase in gravitational force, a too short ejector pin will cause the chip to escape from the range where the ejector pin is fixed. Therefore, the retractable ejector pin structure can adjust the extension length of the target ejector pin 610 exposed from the air outlet plate 130, so that the chip 213 to be picked up can be more stable during transportation and placement, avoiding the chip escaping from the range where the ejector pin is fixed due to the ejector pin extending too short.

[0098] Furthermore, due to the different thicknesses of different chips, generally speaking, the thickness of the chip can range from 0.03 to 0.3 mm. The retractable ejector pin structure can change its extension length according to the thickness of the chip, thereby ensuring that chips of different thicknesses can be suspended within the suction nozzle surface of the air outlet plate.

[0099] It can be concluded from the above embodiments that the telescopic disk 122 in the present invention can have two functions. One is to obtain a telescopic ejector pin structure by cooperating with the ejector pin and adjust the extension length of the target ejector pin 610, so that the chip picking device 100 can be compatible with chips of different thicknesses. The other is to rotate with the ejector pin during the telescopic process, so as to select the corresponding hole position suitable for sucking the current chip according to the posture of the chip.

[0100] Next, see Fig. 9 , Fig. 9 A flow chart of a chip picking process method provided according to some embodiments of the present invention is shown.

[0101] like Fig. 9 As shown, in some embodiments of the present invention, the chip picking process method may include the following steps: First, step S910 may be performed: obtaining a chip to be picked up, and determining the size and thickness of the chip.

[0102] Specifically, optionally, multiple chips are placed on the picking table. After the chip to be picked up is determined, the shape of the chip 213 to be picked up can be obtained through devices such as visual components, which may include the size, thickness and posture of the chip 213 to be picked up.

[0103] Then, step S920 may be performed: determining the hole position sequence and hole position distance of the target ejector pins extending from the selection plate and the retractable plate in the ejector pin selection assembly of the chip pickup device according to the size of the chip.

[0104] Specifically, in some embodiments, the hole position sequence of the target ejector pins extended by the positional coordination of the selection disk 121 and the telescopic disk 122 can be determined according to the size of the chip 213 to be picked up. In addition, after the hole position sequence is selected and determined, the hole position distance of the extended target ejector pins 610 can also be determined according to the size of the chip 213 to be picked up.

[0105] Then, step S930 may be performed: determining the extension length of the target ejector pin according to the thickness of the chip.

[0106] Specifically, if Figure 8 As shown, since the circuits arranged on different chips are different, the thickness of different chips may also be different. According to the thickness of the chip 213 to be picked up, the extension length of the extended target ejector pin 610 can be determined to limit the circumferential position of the chip 213 to be picked up during the chip transmission process, so as to prevent the chip from slightly shifting during the transmission process and thus falling off.

[0107] Then, step S940 may be performed: adjusting the positional relationship between the selection disk and the telescopic disk to obtain the hole sequence of the target ejector pin, and adjusting the positional relationship between the telescopic disk and the ejector pin to obtain the hole distance and extension length of the target ejector pin.

[0108] Specifically, in some optional embodiments, the rotation angle between the selection disk 121 and the telescopic disk 122 can be adjusted to obtain a hole sequence consisting of the first hole positions 420 and the second hole positions 520 that overlap each other and conform to the chip shape. The hole sequence of the ejector selection assembly 120 can be adjusted by adjusting the position of the adjustment handle 410 in the selection disk 121 in the positioning groove group 510 in the telescopic disk 122.

[0109] Further, preferably, after the selection disk 121 completes the adjustment of the hole sequence, the telescopic disk 122 is adjusted to rotate through the lifting and rotating mechanism 150 according to the posture of the chip 213 to be picked up acquired by the visual component, so that a hole sequence corresponding to the chip 213 to be picked up in the telescopic disk 122 completely corresponds to the current posture of the chip 213 to be picked up. Then, based on the size of the chip 213 to be picked up, the hole distance of the target ejector pin 610 is determined.

[0110] For example, Figure 7 The posture of the chip 213 to be picked up is shown as being placed on a plane at a positive angle of 90°. If a hole sequence corresponding to the chip 213 to be picked up in the current telescopic disk 122 is offset to the right by 15° compared to the posture of the chip 213 to be picked up, the telescopic disk 122 can be rotated to the left by 15° to rotate the hole sequence to a positive angle of 90°, which completely corresponds to the current posture of the chip 213 to be picked up. Afterwards, according to the size of the chip 213 to be picked up, the two groups of extended target ejector pins 610 can be just close to the horizontal and vertical sides of the chip 213 to be picked up. For example, assuming that the size of the chip 213 to be picked up is 10.12×10.12mm, then the distance between the two groups of holes required for this chip, that is, the distance between the two groups of ejector pins, can be 10.5×10.5mm, and the edge distance of the two groups of extended target ejector pins 610 needs to be slightly longer than that of the chip 213 to be picked up, so that the chip can be basically attached to the chip and the circumferential position can be limited.

[0111] Afterwards, the telescopic plate 122 can be raised and lowered to adjust the extension and retraction of the target ejector pin 610. When the chip 213 to be picked up is adsorbed from the pick-up table, the target ejector pin 610 can be retracted first to prevent the extended target ejector pin 610 from being too long and touching other chips 214 around it, thereby contaminating other chips. At the same time, during the chip transmission process when the chip pickup device 100 is adsorbed to the chip 213 to be picked up, the target ejector pin 610 can be extended by a preset length from the first hole position 420 and the second hole position 529 of the part with the determined hole position sequence and hole position distance, thereby improving the stability of chip transportation and preventing the extended target ejector pin 610 from being too short and causing the chip to escape from the fixed range of the ejector pin.

[0112] Finally, step S950 may be performed: introducing gas from the gas inlet nozzle so that the output gas adsorbs the chip.

[0113] Specifically, if Figure 1 As shown, optionally, clean high-purity nitrogen gas is introduced from the air inlet nozzle 110, and the high-purity nitrogen gas can be output from the circular air outlet 131 in the center of the air outlet disk 130 on the bottom surface in the form of positive pressure airflow, and negative pressure is generated in the combined flow channel between the air outlet disk 130 and the chip to be picked up 213, thereby adsorbing the chip to be picked up 213. In this embodiment, the size of the air outlet 131 of the circular structure is smaller than that of the annular air outlet, and the vacuum area that generates negative pressure can be contracted, so that smaller chips can be adsorbed. At this time, the target ejector pin 610 can extend from the outside of the chip to be picked up 213 through the first hole position 420 on the selection disk 121, the second hole position 520 on the telescopic disk 122, and the third hole position 210 on the air outlet disk 130, which is used to limit the chip circumferentially.

[0114] In the present invention, ejector pin holes at different distances are added, so that the hole positions suitable for different chips can be determined according to the shape, size, thickness and posture of the chip. Then, through the rotation and rise of the three-layer ejector pin hole structure, the selection of ejector pin holes at different distances can be adjusted, thereby achieving the effect of adapting to different chips.

[0115] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0116] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0117] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0118] In summary, the present invention provides a chip picking device, a chip picking method, and a computer-readable storage medium, which can be used to adsorb chips of different sizes and thicknesses, and when adsorbing the chip to be picked up, it does not contact other chips nearby, thereby avoiding contamination of other chips, and can also improve the stability of the chip during the transmission process.

[0119] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip picking device, characterized in that: include: An air inlet nozzle, used for introducing gas; An ejector pin selection assembly comprises a selection disk and a telescopic disk, wherein the selection disk is provided with first holes, and the telescopic disk is provided with second holes, both of which are used for ejectors to extend, wherein the hole position sequence of the extended target ejector pin is adjusted according to the positional relationship between the selection disk and the telescopic disk, and the hole position distance and the extension length of the target ejector pin are adjusted according to the positional relationship between the telescopic disk and the ejector pin; and The gas outlet plate is located below the ejector pin selection component and includes a gas outlet to output the gas to adsorb the chip, wherein the gas outlet plate includes a third hole position so that the target ejector pin extends from the outside of the chip through the first hole position, the second hole position and the third hole position to circumferentially limit the chip.

2. The chip pickup device according to claim 1, characterized in that: According to the hole position sequence of the target ejector pin determined by the size of the chip, the rotation angle between the selection disk and the telescopic disk is adjusted to obtain the hole position sequence consisting of the first hole position and the second hole position that overlap with each other.

3. The chip pickup device according to claim 2, characterized in that: The edge of the selection disk is provided with an adjustment handle, and the edge of the telescopic disk includes multiple groups of positioning grooves for placing the adjustment handle. The hole position combination between the first hole position and the second hole position can be adjusted by changing the positioning groove group in which the adjustment handle is placed.

4. The chip pickup device according to claim 3, characterized in that: Each of the hole sequences includes a plurality of hole arrangement groups of distances, so that the target ejector pin can penetrate and extend from the first hole and the second hole located at the same position in at least two of the plurality of hole arrangement groups of distances.

5. The chip pickup device according to claim 3, characterized in that: The angle between the positioning groove groups ranges from 15° to 30°.

6. The chip pickup device according to claim 1, characterized in that: The hole distance of the target ejector pin is determined according to the size of the chip, and the rotation angle of the telescopic plate is adjusted according to the posture of the chip to obtain the hole distance formed by the first hole position and the second hole position corresponding to the current posture of the chip.

7. The chip pickup device according to claim 6, characterized in that: According to the extended length of the target ejector pin determined by the thickness of the chip, the lifting height of the telescopic plate is adjusted to obtain the extended length of the target ejector pin that exposes the third hole position.

8. The chip pickup device according to claim 7, characterized in that: Also includes: A lifting and rotating mechanism is connected to the telescopic disk, and is used to drive the telescopic disk to rise so as to drive the target ejector pin to separate from the air outlet disk, and then drive the telescopic disk to rotate, and after rotating to the hole position distance of the target ejector pin, drive the telescopic disk to descend, so that the target ejector pin passing through the first hole position and the second hole position extends out of the third hole position corresponding to at least two groups of hole position distances by a preset length.

9. The chip pickup device according to claim 8, characterized in that: The at least two groups of holes are evenly distributed on the edge of the chip, and the distance between the holes in each group is slightly larger than the chip, so that the chip is circumferentially limited by the target ejector pins extending from the at least two groups of holes when being adsorbed.

10. The chip pickup device according to claim 9, characterized in that: The extension length of the target ejector pin is in the range of 0 to 2 mm.

11. The chip pickup device according to claim 1, characterized in that: The gas outlet is a circular air channel located at the center of the gas outlet plate and connected to the gas inlet nozzle to output the gas from the gas outlet in the form of positive pressure airflow and generate negative pressure in the combined flow channel between the gas outlet plate and the chip to adsorb the chip.

12. A chip picking method, characterized in that: The following steps are involved: Obtaining a chip to be picked up, and determining the size and thickness of the chip; Determine, according to the size of the chip, the hole sequence and hole distance of the target ejector pins extending from the selection disk and the telescopic disk in the ejector pin selection assembly of the chip pickup device according to any one of claims 1 to 11; Determining the extension length of the target ejector pin according to the thickness of the chip; Adjusting the positional relationship between the selection disk and the telescopic disk to obtain the hole position sequence of the target ejector pin, and adjusting the positional relationship between the telescopic disk and the ejector pin to obtain the hole position distance and extension length of the target ejector pin; as well as Gas is introduced from the air inlet nozzle so that the output gas adsorbs the chip, wherein the target ejector pin extends from the outside of the chip through the first hole position on the selection disk, the second hole position on the telescopic disk and the third hole position on the air outlet disk to circumferentially limit the chip.

13. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the chip picking method as claimed in claim 12 is implemented.

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