Substrate processing apparatus

Abstract

The invention provides a substrate processing device. The substrate processing device comprises a reaction chamber; the plurality of substrate supporting pieces are used for bearing substrates and are mounted in the reaction chamber; the transfer assembly comprises a motor, a conveying piece rotating under the driving action of the motor and a suspension rod located between the motor and the conveying piece, and the conveying piece is hung in the reaction chamber through the suspension rod; the motor drives the conveying piece to rotate so as to enable the conveying piece to be jointed with a substrate and transfer the jointed substrate among the plurality of substrate supporting pieces; and the sealing gas pipeline is configured to introduce sealing gas into a gap between the suspension rod and the reaction chamber so as to seal the gap, and the suspension rod is inserted into the reaction chamber. The gap is sealed by the sealing gas, so that particles are prevented from falling onto the substrate in the frequent expansion and contraction process of the corrugated pipe after the reaction gas in the reaction chamber enters the corrugated pipe from the gap to form a coating film.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors and relates to a substrate processing device. Background Art

[0002] During the entire substrate manufacturing process, the substrate needs to be deposited, etched, baked and cured inside the chamber. In the vacuum processing chamber of PECVD (plasma enhanced chemical vapor deposition), a layer stack structure of different materials is deposited on the substrate. The chamber needs to maintain a low vacuum state continuously, and the reaction gas is continuously introduced into the chamber to allow the gas to react inside the chamber and deposit a thin film on the substrate surface. However, in the PECVD process, there are the following problems:

[0003] While the reaction gas is introduced into the chamber, the unreacted gas in the chamber needs to be continuously discharged through the gas outlet, so that the gas inside the chamber is in a state of continuous flow, so that a thin film is quickly deposited on the surface of the substrate. However, there are still particles that are not taken away by the gas in time, which are easy to contaminate the surface of the substrate.

[0004] Therefore, it is necessary to provide a substrate processing device. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a substrate processing device for solving the problem of particles contaminating the surface of the substrate in the prior art.

[0006] To achieve the above-mentioned purpose and other related purposes, a substrate processing device includes: a reaction chamber; a plurality of substrate supports for carrying substrates and installed in the reaction chamber; a transfer assembly including a motor, a conveying member rotating under the driving action of the motor, and a hanging rod located between the motor and the conveying member, the conveying member being suspended in the reaction chamber by the hanging rod, the motor driving the conveying member to rotate so that the conveying member engages the substrate and transfers the engaged substrate between a plurality of substrate supports; a sealing gas pipeline configured to pass a sealing gas into a gap between the hanging rod and the reaction chamber to seal the gap, wherein the hanging rod is inserted into the reaction chamber.

[0007] Optionally, the transfer assembly further includes a magnetic fluid, the motor is coupled to the conveying member through the magnetic fluid and the suspension rod, one end of the suspension rod is fixedly connected to the conveying member, and the other end of the suspension rod is fixedly connected to the magnetic fluid.

[0008] Optionally, the magnetic fluid includes a shaft connected to the motor, and the other end of the shaft is fixedly connected to the suspension rod.

[0009] Optionally, the substrate processing device further comprises a bellows sleeved below the magnetic fluid, the sealing gas pipeline comprises an air inlet pipe connected to the bellows, and the sealing gas flows from the air inlet pipe through the bellows into the gap.

[0010] Optionally, the reaction chamber comprises a mounting hole, the hanging rod passes through the mounting hole and is fixedly connected to the conveying member, and the gap is formed between the hanging rod and an inner wall of the mounting hole.

[0011] Optionally, the reaction chamber further includes a recess, the mounting hole is formed at the bottom of the recess, the bellows includes an upper flange and a lower flange located at both ends thereof, the upper flange is fixed to the magnetic fluid, and the lower flange is fixed to the bottom of the recess and is arranged around the mounting hole.

[0012] Optionally, the lower flange is formed with an air inlet, and the air inlet is connected to the air inlet pipe.

[0013] Optionally, the conveyor includes a central portion and a plurality of arms extending outwardly from the central portion, and ends of the arms are used to engage the substrate.

[0014] Optionally, the suspension rod is aligned and connected to the central portion.

[0015] Optionally, the transfer assembly further includes a bearing portion and a lifting power source for driving the transfer assembly to perform lifting motion relative to the reaction chamber, and the lifting power source is installed between the bearing portion and the reaction chamber.

[0016] Optionally, the motor is fixedly connected to the bearing part, and when the bearing part performs a lifting movement, the conveying member coupled to the motor performs a lifting movement simultaneously.

[0017] Optionally, the sealing gas is nitrogen.

[0018] As described above, in the substrate processing device of the present invention, the conveyor is suspended in the reaction chamber, and the gap between the suspension rod for suspending the conveyor and the reaction chamber is sealed by sealing gas to prevent the reaction gas from entering the gap and preventing particles of the coating formed by the bellows from falling onto the substrate during the frequent expansion and contraction of the bellows. Therefore, the sealing gas can keep the inside of the bellows clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of a partial cross-sectional structure of a substrate processing device in an embodiment of the present invention.

[0020] Figure 2 Schematic diagram of the structure of the transfer component in an embodiment of the present invention.

[0021] Figure 3 It is a schematic diagram showing that the conveying member of the transfer assembly is in an avoidance position in an embodiment of the present invention.

[0022] Figure 4 2 is a working state diagram of the conveying member in an embodiment of the present invention.

[0023] Figure 5 Schematic diagram of a bellows in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0025] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic view is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional space dimensions of length, width and depth should be included.

[0026] For ease of description, spatial relational terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatial relational terms are intended to include other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there can be one or more intervening layers. As used herein, "between..." means including the end point values.

[0027] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0028] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0029] like Figure 1As shown, this embodiment provides a substrate processing device, including a reaction chamber 100 and a transfer assembly 200 for transferring a substrate W in the reaction chamber 100 .

[0030] The reaction chamber 100 includes a cavity 110 (combined with reference Figure 3 ), a cover 120 installed on the cavity 110 and forming a closed space 112 with the cavity 110. In this embodiment, the cover 120 and the cavity form a closed space 112, and there is no specific limitation on the shape and size of the cover 120, and any cover that can form a closed space with the cavity. Exemplarily, in one embodiment, the cover 120 is an upper half shell, and forms a closed space 112 with the cavity as the lower shell. In another embodiment, the cavity is a container that defines a space and has an opening, such as Figure 1 As shown, the cover 120 can seal the opening of the chamber 110 to form a closed space 112. Here, the reaction chamber 100 needs to be made into a separate structure in order to facilitate the installation and maintenance of the structure installed inside the reaction chamber (such as the conveying member 240, the substrate support member 140). In addition, the reaction process of the substrate W is completed in the closed space 112 formed by the cover 120 and the chamber 110. The cover 120 includes a mounting portion 121 that passes through its upper and lower surfaces, and the mounting portion 121 includes a recess 1211 and a mounting hole 1212 that are interconnected. Specifically, the recess 1212 is formed inwardly from the surface of the cover 120, and the mounting hole 1212 is formed at the bottom of the recess 1211 and passes through the cover 120. Refer to 3 and Figure 4 A plurality of substrate supporting members 140 for supporting the substrate W are also disposed inside the reaction chamber 100 .

[0031] Reference Figure 1 The transfer assembly 200 includes a motor 210, a conveying member 240 driven to rotate by the motor 210, and a magnetic fluid 220 and a suspension rod 230 connected between the motor 210 and the conveying member 240. The magnetic fluid 220 includes a flange 222 protruding outward from its outer surface and a shaft 221 that can rotate relative to the flange 222. The motor 210 is coupled to the conveying member 240 via the shaft 221 and the suspension rod 230. Specifically, the motor 210 is fixedly connected to the shaft 221 of the magnetic fluid 220, and one end of the suspension rod 230 is fixedly connected to the shaft 221 of the magnetic fluid 220, and the other end is fixedly connected to the conveying member 240. As a result, under the drive of the motor 210, the conveying member 240 can rotate. Referring to Figure 2 The transfer member 240 includes a central portion 241 aligned with the suspension rod 230 and a plurality of arms 242 extending outward from the central portion 241, and the ends of the arms 242 are formed with loops, hooks, forks or other designs for engaging the substrate W. In embodiments of the present technology, any number of arms 242 may be included, and the number of arms may be the same as the number of substrate support members 140 in the chamber 110. Figures 2 to 4In the illustrated embodiment, the conveyor 240 includes three arms 242 for three substrate supports 140. In embodiments of the present technology, the transfer assembly 200 can engage and / or transfer one, two, three, or any number of substrates W.

[0032] The transfer member 240 rotates to engage with the substrate W and transfer the substrate W between the plurality of substrate supports 140. The transfer member 240 may engage with the substrate from above or below, or engage with the outer edge of the substrate and rotate to transfer the substrate W between the plurality of substrate supports 140. Figure 3 As shown, the conveyor 240 is in the avoidance position, and the arm 242 of the conveyor 240 is positioned between the substrate supports 140, which can allow the substrate W to be transferred from outside the chamber to the chamber and placed on the substrate support 140 or allow the substrate W to be surface treated (for example, depositing a material on the substrate W). Exemplarily, the conveyor 240 is in the avoidance position, and the substrate W is transferred from outside the chamber to one of the substrate supports 140 in the chamber, and the substrate W is transferred to the other substrate supports 140 through the conveyor 240. Specifically, in one embodiment, refer to Figure 3 The substrate W is transferred from the opening 111 of the chamber to the first substrate support 140a in the chamber, and the transfer member 240 rotates along the axis from the avoidance position to engage the substrate W on the first substrate support 140a and transfer it to the second substrate support 140b (refer to Figure 4 As such, the transfer member 240 engages one, two, or any number of substrates W and transfers the substrates W between the substrate support members 140a-140c.

[0033] Reference Figure 1 and Figure 2 The transfer assembly 200 also includes a bearing portion 270 and a lifting power source 260 installed on the bearing portion 270, and the lifting power source 260 is used to drive the transfer assembly 200 to move up and down relative to the reaction chamber 100. Exemplarily, the lifting power source 260 drives the bearing portion 270 to move up and down relative to the reaction chamber 100, and the bearing portion 270 drives the conveying member 240 coupled to the bearing portion 270 to move up and down. Specifically, the motor 210 of the transfer assembly 200 is fixedly connected to the bearing portion 270, and the conveying member 240 is coupled to the motor 210. Therefore, when the bearing portion 270 moves up and down, the conveying member 240 can also move up and down. Figure 3 and Figure 4 In the illustrated embodiment, the transfer assembly 200 drives the substrate W to transfer between the plurality of substrate supports 140a-140c. Figure 3 , the conveying member 240 rotates from the avoidance position to below the substrate W on the first substrate supporting member 140a and engages with the substrate W; Figure 1 and Figure 2Then, the lifting power source 260 drives the carrying part 270 to move upward to drive the conveying member 240 and the substrate W on the first substrate supporting member 140a to rise together, so that the substrate W is separated from the first substrate supporting member 140a; Figure 4 , the rotating conveying member 240 is moved to the second substrate supporting member 140b, and the lifting power source 260 drives the bearing part 270 to perform a downward movement to drive the transmission member 240 and the substrate W to descend together, so that the substrate W is placed on the second substrate supporting member 140b. At this point, the substrate W is transferred from the first substrate supporting member 140a to the second substrate supporting member 140b. Here, when the substrate W is transferred between the substrate supporting members 140a-140c, it is necessary to rise so that the substrate W is separated from the substrate supporting members 140a-140c, so as to avoid the friction between the substrate W and the substrate supporting members 140a-140c during the transfer of the substrate W, causing damage to the substrate W. In the embodiment of the present technology, the lifting power source 260 can be selected as an electric cylinder, and three electric cylinders are evenly distributed between the bearing part 270 and the cover 120 of the reaction chamber 100, so that the bearing part 270 and the cover 120 of the reaction chamber 100 are evenly stressed.

[0034] The substrate processing device further includes a bellows 600 sleeved under the magnetic fluid 220. Figure 1 and 5 As shown, the upper flange 601 of the bellows 600 is fixedly connected to the flange 222 of the magnetic fluid 220, and the lower flange 602 of the magnetic fluid 600 is fixedly connected to the bottom of the recess 1211 of the mounting portion 121 and is arranged around the mounting hole 1212. The suspension rod 230 passes through the mounting hole 1212, and one end extends into the bellows 600 and is fixedly connected to the axis 221 of the magnetic fluid 220, and the other end is aligned and fixedly connected to the center portion 241 of the conveying member 240. When the transfer assembly 200 performs a lifting movement, the bellows 600 performs a corresponding telescopic movement. Figure 1 and Figure 5 The sealing gas pipeline introduces the sealing gas into the gap, and the sealing gas pipeline includes an air inlet pipe 500 connected to the bellows 600. Specifically, the lower flange 602 of the bellows 600 is formed with an air inlet 603 connected to the air inlet pipe 500. Figure 1, the sealing gas flows from the air inlet pipe 500 through the bellows 600 and into the gap 800 between the suspension rod 230 and the cover 120, and the sealing gas entering the air inlet pipe 500 may be nitrogen. The supply source C of the sealing gas pipeline is connected to the bellows 600 through the air inlet pipe 500, and the air inlet pipe 500 is also provided with a switch valve A and a flow valve B to adjust and control the flow of the sealing gas. The gap 800 is located at the position where the suspension rod 230 is inserted into the interior of the reaction chamber 100 (such as the cover 120 or the cavity 110). More specifically, the gap 800 is located between the suspension rod 230 and the inner wall of the mounting hole 1212. When the sealing gas enters the gap 800 between the suspension rod 230 and the inner wall of the mounting hole 1212, the gas fills the entire gap 800 to form a sealing effect on the cavity 110, so that the particles in the bellows 600 will not fall from the gap 800 to the substrate in the cavity 110.

[0035] During the reaction process in the cavity, a small amount of reaction gas is introduced into the cavity 110 and the cavity 110 is in a low vacuum state. At the same time, the unreacted gas in the cavity 110 is pumped out, so that the reaction gas in the cavity 110 is always in a flowing state. The exhaust port from which the gas in the cavity 110 is pumped out is arranged at a position aligned with the central portion 241 of the conveyor 240, so that one exhaust port acts on multiple substrates W at the same time, avoiding setting multiple exhaust ports to be respectively aligned with the substrates. Therefore, the conveyor 240 is configured to be suspended in the cavity 110.

[0036] In the present invention, during the reaction process in the reaction chamber 100, the conveying member 240 is suspended in the cavity 110, and the gap 800 between the suspension rod 230 for suspending the conveying member 240 and the reaction chamber 100 is sealed by sealing gas to prevent the reaction gas from entering the gap 800 and preventing particles of the coating formed by the bellows 600 from falling onto the substrate during the frequent expansion and contraction of the bellows 600. Therefore, the sealing gas can keep the inside of the bellows clean.

[0037] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A substrate processing device, characterized in that: include: a reaction chamber; A plurality of substrate supporting members, used for carrying substrates and installed in the reaction chamber; A transfer assembly, comprising a motor, a conveyor member rotating under the driving action of the motor, and a suspension rod located between the motor and the conveyor member, wherein the conveyor member is suspended in the reaction chamber by the suspension rod, and the motor drives the conveyor member to rotate so that the conveyor member engages with a substrate and transfers the engaged substrate between the plurality of substrate supporting members; The sealing gas pipeline is configured to pass the sealing gas into the gap between the suspension rod and the reaction chamber to seal the gap, wherein the suspension rod is inserted into the reaction chamber.

2. The substrate processing device according to claim 1, characterized in that: The transfer assembly further comprises a magnetic fluid, through which the motor is coupled to the transmission member through the suspension rod, one end of the suspension rod being fixedly connected to the transmission member, and the other end of the suspension rod being fixedly connected to the magnetic fluid.

3. The substrate processing device according to claim 2, characterized in that: The magnetic fluid comprises a shaft connected to the motor, and the other end of the shaft is fixedly connected to the suspension rod.

4. The substrate processing device according to claim 2, characterized in that: The substrate processing device further comprises a bellows sleeved under the magnetic fluid, the sealing gas pipeline comprises an air inlet pipe connected to the bellows, and the sealing gas flows from the air inlet pipe through the bellows into the gap.

5. The substrate processing device according to claim 4, characterized in that: The reaction chamber comprises a mounting hole, the hanging rod passes through the mounting hole and is fixedly connected to the conveying member, and the gap is formed between the hanging rod and the inner wall of the mounting hole.

6. The substrate processing device according to claim 5, characterized in that: The reaction chamber also includes a recess, the mounting hole is formed at the bottom of the recess, the bellows includes an upper flange and a lower flange located at both ends thereof, the upper flange is fixed to the magnetic fluid, and the lower flange is fixed to the bottom of the recess and is arranged around the mounting hole.

7. The substrate processing device according to claim 6, characterized in that: The lower flange is formed with an air inlet, and the air inlet is connected to the air inlet pipe.

8. The substrate processing apparatus according to claim 1, wherein: The conveyor comprises a central portion and a plurality of arms extending outwardly from the central portion, wherein the ends of the arms are used for engaging the substrate.

9. The substrate processing device according to claim 8, characterized in that: The suspension rod is aligned and connected with the central portion.

10. The substrate processing apparatus according to claim 1, wherein: The transfer assembly further includes a bearing portion and a lifting power source for driving the transfer assembly to perform lifting motion relative to the reaction chamber, and the lifting power source is installed between the bearing portion and the reaction chamber.

11. The substrate processing apparatus according to claim 10, wherein: The motor is fixedly connected to the bearing part, and when the bearing part performs a lifting movement, the transmission member coupled to the motor performs a lifting movement simultaneously.

12. The substrate processing apparatus according to claim 1, wherein: The sealing gas is nitrogen.

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