Chip packaging structure

Abstract

The invention provides a chip packaging structure. The chip packaging structure comprises a base, at least one chip, a heat-conducting sheet and at least one metal heat-conducting bulge, the chip is arranged on the base. The metal heat conduction projection is arranged on the heat conduction sheet and is arranged between the chip and the heat conduction sheet. And the metal heat-conducting bulge is in thermal contact with the chip and the heat-conducting sheet.

Description

Technical Field

[0001] The invention relates to a chip packaging structure. Background Art

[0002] The telecommunications industry requires higher data transmission rates and electronic devices want to cover a wider frequency range. For electronic products that require broadband, such as mobile phones, tablets, Wi-Fi base stations, Bluetooth, and satellite communications, the high-frequency chipset is composed of a variety of small components with different functions. These small components include, for example, high-power amplifiers (Power amplifiers), control ICs, passive components (such as resistors, capacitors), etc., and because the assembly methods of each small component are different, high-density integrated assembly is technically difficult. Taking high-power amplifiers as an example, multifunctional single-crystal microwave integrated circuits (Monolithic Microwave Integrated Circuits, MMIC) packaging design is often used, which includes a die for generating communication signals, a base for carrying the die, and metal wiring for transmitting communication signals or providing power to the die.

[0003] As electronic products gradually develop in the direction of miniaturization and multifunctionality, the heat dissipation of chips in high-power amplifiers is one of the problems that the industry urgently needs to solve. The existing chip and chip set packaging structure uses thermal conductive plates made entirely of ceramic materials or entirely of metal materials, and the chip and the thermal conductive plate are not in direct contact, so the thermal conductivity that relies solely on air conduction is very poor. The internal space of some chip packaging structures will be additionally filled with thermal conductive media, but the manufacturing process is not easy to control, alignment is difficult, and it is easy to cause chip short circuits; in addition, as the power density of the power amplifier module increases, the chip temperature increases, so there is an urgent need for a novel chip packaging structure. Summary of the invention

[0004] The chip packaging structure disclosed in one embodiment of the present invention comprises a base, at least one chip, a heat conductive sheet and at least one metal heat conductive protrusion. The chip is disposed on the base. The metal heat conductive protrusion is disposed on the heat conductive sheet and is between the at least one chip and the heat conductive sheet. The metal heat conductive protrusion is in thermal contact with the chip and the heat conductive sheet.

[0005] According to the chip packaging structure disclosed in the present invention, the metal heat-conducting protrusions help to improve the heat exchange between the heat-generating chip and the packaging structure, and help to guide the heat energy to the heat-conducting sheet and even further to the heat sink, so that the temperature of the heat-generating chip can be quickly cooled and the temperature can be controlled within a safe range, thereby reducing or even eliminating the need for the use of heat-conducting media. In addition, in one embodiment, the heat-conducting sheet and the base form a protective space for accommodating the chip. Since the metal heat-conducting protrusions improve the heat exchange efficiency, the inside of the protective space relies on the metal heat-conducting protrusions to achieve more effective heat dissipation, so that the temperature of the chip and / or chipset is reduced, thereby achieving stable performance control.

[0006] The above description of the content of the present invention and the following description of the implementation modes are used to demonstrate and explain the principles of the present invention and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 A schematic diagram of a chip packaging structure according to an embodiment of the present invention;

[0008] Figures 2 to 4 For manufacturing Figure 1 A schematic diagram of a chip packaging structure;

[0009] Figure 5 A schematic diagram of a chip packaging structure according to another embodiment of the present invention;

[0010] Figure 6 A schematic diagram of a chip packaging structure according to yet another embodiment of the present invention;

[0011] Figure 7 A schematic diagram of a chip packaging structure according to yet another embodiment of the present invention;

[0012] Figure 8 A schematic diagram of a chip packaging structure according to yet another embodiment of the present invention;

[0013] Fig. 9 is a schematic diagram of a chip packaging structure of Comparative Example 1;

[0014] Fig.10 FIG. 4 is a schematic diagram of a chip packaging structure of a second comparative example.

[0015] Explanation of symbols

[0016] 1. 1A, 1B, 1C, 1D: Chip packaging structure

[0017] 10, 10D: Base

[0018] 110: Circuit board wiring

[0019] 111, 112: Solder pad

[0020] 113: Circuit layer

[0021] 100: First Circuit Board

[0022] 101: Second circuit board

[0023] 20: Chip

[0024] 30, 30A: Thermal conductive sheet

[0025] 310: Metal wall

[0026] 320: Upper cover

[0027] 330: Adhesive layer

[0028] 40: Metal heat-conducting protrusion

[0029] 50: Auxiliary heat conduction parts

[0030] 60, 70: Radiator

[0031] 80: Packaging cover

[0032] S, S”: Protected Space

[0033] P1, P2: measuring points

[0034] ER: Effective Heat Transfer Path

[0035] NR: Non-effective heat transfer path DETAILED DESCRIPTION

[0036] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the contents are sufficient for any person familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the contents disclosed in this specification, claims and drawings, any person familiar with the relevant art can easily understand the relevant purposes and advantages of the present invention. The following examples are to further illustrate the viewpoints of the present invention in detail, but are not intended to limit the scope of the present invention in any viewpoint.

[0037] The present invention provides a chip packaging structure, which helps to solve the problems of poor heat dissipation and heat-conducting filling materials with difficult-to-control manufacturing processes.

[0038] Please refer to Figure 1 , is a schematic diagram of a chip packaging structure according to an embodiment of the present invention. In this embodiment, the chip packaging structure 1 includes a base 10, a chip 20, a heat conducting sheet 30 and a metal heat conducting protrusion 40.

[0039] The base 10 is, for example but not limited to, a ceramic circuit board. The base 10 includes a circuit board wiring 110, which may include pads 111 and 112 exposed on the surface of the base 10 and a circuit layer 113 buried inside the base 10. In some embodiments, the base may be a low temperature co-fired ceramic (LTCC) circuit board. In some embodiments, the base may be a FR-4 printed circuit board or an aluminum substrate.

[0040] The chip 20 is disposed on the base 10. Specifically, the chip 20 can be bonded to the pad 111 of the base 10. In the present embodiment, the chip package structure 1 includes a chipset consisting of a plurality of chips 20, wherein each chip 20 can be a power amplifier or a silicon-based integrated circuit, but the number of chips is not intended to limit the present invention. In addition, the chip 20 can be a bare die.

[0041] The heat conducting sheet 30 is disposed on the base 10, and the heat conducting sheet 30 and the base 10 together form a protective space S for accommodating the chip 20. Further, the heat conducting sheet 30 includes a metal peripheral wall 310 and an upper cover 320. The metal peripheral wall 310 is disposed on the base 10 and surrounds the chip 20. The upper cover 320 is disposed on the metal peripheral wall 310 and is located above the chip 20. Further, one side of the metal peripheral wall 310 is bonded to the pad 112 of the base 10, and the upper cover 320 is bonded to the other side of the metal peripheral wall 310. The material of the metal peripheral wall 310 of the heat conducting sheet 30 may be copper, aluminum, gold, silver, nickel, chromium or an alloy thereof. The upper cover 320 of the heat conducting sheet 30 may include a ceramic material, such as but not limited to aluminum oxide, aluminum nitride, silicon nitride, silicified carbon, diamond, diamond like carbon (DLC) or the above composite materials.

[0042] In this embodiment, the heat conductive sheet 30 may further include an adhesive layer 330, and the upper cover 320 is attached to the metal peripheral wall 310 via the adhesive layer 330. The material of the adhesive layer 330 includes, for example but not limited to, titanium, chromium, nickel, phosphorus, alloys thereof, or mixtures thereof.

[0043] The metal heat-conducting protrusion 40 is disposed on the heat-conducting sheet 30 and is located in the protective space S formed by the heat-conducting sheet 30 and the base 10. Further, the chip package structure 1 includes a plurality of metal heat-conducting protrusions 40 corresponding to the number of the chip 20, but the number of the metal heat-conducting protrusions is not intended to limit the present invention. The metal heat-conducting protrusion 40 is disposed on the side of the upper cover 320 facing the base 10, and the metal heat-conducting protrusion 40 is in thermal contact with the chip 20. The material of the metal heat-conducting protrusion 40 can be copper, aluminum, gold, silver, nickel, chromium, indium, tin or their alloys. Figure 1 It is exemplarily shown that a plurality of metal heat conductive protrusions 40 are in thermal contact with a plurality of chips 20 respectively.

[0044] In some other embodiments, the heat conducting sheet 30 and the metal heat conducting protrusion 40 can be integrally formed. For example, the upper cover of the heat conducting sheet can be processed by 3D laser printing and sintering graphics to form the metal heat conducting protrusion. In this case, the metal peripheral wall, the outer cover and the metal heat conducting protrusion are integrally formed and can be made of the same material, which is conducive to simplifying the manufacturing process and saving the use of bonding materials.

[0045] In this embodiment, the chip packaging structure 1 may further include an auxiliary heat conductive member 50, and the auxiliary heat conductive member 50 is disposed between the chip 20 and the metal heat conductive protrusion 40. Further, the chip packaging structure 1 may include a plurality of auxiliary heat conductive members 50 corresponding to the number of the chip 20, but the number of the auxiliary heat conductive members 50 is not intended to limit the present invention. The auxiliary heat conductive member 50 is, for example but not limited to, a heat conductive glue or a heat conductive pad, and the metal heat conductive protrusion 40 is in thermal contact with the chip 20 through the auxiliary heat conductive member 50. Figure 1 Each auxiliary heat conducting member 50 is exemplarily shown between a corresponding chip 20 and a corresponding metal heat conducting protrusion 40. In some other embodiments, if the metal heat conducting protrusion is made of a material with very high thermal conductivity, the chip can directly thermally contact the metal heat conducting protrusion without the need for additional auxiliary heat conducting members.

[0046] In this embodiment, the metal heat-conducting protrusion 40 helps to improve the heat exchange between the chip 20 and the heat-conducting sheet 30. As a result, the protective space S formed by the heat-conducting sheet and the base does not need to be additionally filled with heat-conducting media such as thermal paste, heat transfer fluid and heat-conducting resin, which is conducive to quickly reducing the temperature of the heat-generating chip. In addition, the metal heat-conducting protrusion 40 can be in direct thermal contact with the chip 20, or selectively in thermal contact with the chip 20 through the auxiliary heat-conducting member 50. The auxiliary heat-conducting member 50 helps to promote heat transfer between the chip 20 and the metal heat-conducting protrusion 40, thereby further improving the heat exchange efficiency between the chip 20 and the heat-conducting sheet 30.

[0047] In this embodiment, since the protective space S does not need to be filled with an additional heat-conducting medium, the protective space S can be in a vacuum state or filled with an inert gas. Here, the inert gas refers to a gas that does not significantly affect the heat exchange efficiency and the operation of the chip 20, that is, a medium with poor heat transfer capacity, such as but not limited to dry air, nitrogen and argon. Figure 1As shown, the auxiliary heat conducting member 50 and the metal heat conducting protrusion 40 can define multiple effective heat transfer paths ER between the chip 20 and the heat conducting plate 30. Two adjacent effective heat transfer paths ER are spaced apart, and the area outside the effective heat transfer path ER can be understood as a non-effective heat transfer path NR. The non-effective heat transfer path NR is filled with dry air, nitrogen or argon, for example, and its heat transfer capacity is significantly lower than that of the effective heat transfer path ER. In some other embodiments where the auxiliary heat conducting member is not provided, the metal heat conducting protrusion can be used to define multiple effective heat transfer paths between the chip and the heat conducting plate alone.

[0048] In this embodiment, the heat conducting sheet 30 includes a metal peripheral wall 310 formed of a metal material and an upper cover 320 formed of a ceramic material. The metal peripheral wall 310 helps to improve the thermal conductivity of the heat conducting sheet 30, and the upper cover 320 helps to prevent electromagnetic interference from affecting the operation of the chip 20. Therefore, compared with the existing heat conducting sheet made entirely of ceramic material or entirely of metal material, the heat conducting sheet 30 including the metal peripheral wall 310 and the upper cover 320 of different materials can meet the requirements of good thermal conductivity and no electromagnetic interference.

[0049] In this embodiment, the upper cover 320 of the heat conductive sheet 30 is attached to the metal peripheral wall 310 via the adhesive layer 330. The adhesive layer 330 can form a chemical bond between the metal peripheral wall 310 and the upper cover 320, which helps to reduce the interface thermal resistance between the metal peripheral wall 310 and the upper cover 320.

[0050] Figures 2 to 4 For manufacturing Figure 1 Schematic diagram of the chip packaging structure. Figure 2 As shown, a base 10 is provided with a chip 20. The chip 20 can be bonded to a pad 111 of the base 10 by, for example, surface mounting technology (SMT). Figure 3 As shown, a metal peripheral wall 310 of the heat conducting sheet 30 is formed on the base 10. The metal peripheral wall 310 can be bonded to the pad 112 of the base 10 by, for example, surface mounting technology. Figure 4 As shown, an upper cover 320 of a heat conductive sheet 30 provided with a metal heat conductive protrusion 40 is provided. The metal heat conductive protrusion 40 can be formed on the upper cover 320 by, for example, a transfer technology. An auxiliary heat conductive member 50 is provided on the chip 20 or the metal heat conductive protrusion 40, and an adhesive layer 330 is provided on the metal peripheral wall 310 or the upper cover 320. The metal heat conductive protrusion 40 is attached to the chip 20, and the upper cover 320 is bonded to the metal peripheral wall 310, thereby completing the manufacture of the chip package structure 1.

[0051] exist Figure 1 In the embodiment, the heat conducting sheet 30 and the base 10 form a protective space S, but the present invention is not limited thereto. Figure 5, is a schematic diagram of a chip packaging structure according to another embodiment of the present invention. The chip packaging structure 1A comprises a base 10, a chip 20, a heat conducting sheet 30A, a metal heat conducting protrusion 40 and a packaging cover 80. The specific description of the base 10, the chip 20 and the metal heat conducting protrusion 40 can be referred to the above related Figure 1 The contents of the chip packaging structure 1 are not repeated here.

[0052] The heat conducting sheet 30A is a single metal sheet, which is located above the chip 20 and is connected to the heat conducting sheet 30A disposed on the chip 20 through the metal heat conducting protrusion 40. The metal heat conducting protrusion 40 is between the chip 20 and the heat conducting sheet 30A, and the metal heat conducting protrusion 40 is in thermal contact with the chip 20 and the heat conducting sheet 30A.

[0053] The packaging cover 80 is disposed on the base 10 to form a protection space S” for accommodating the chip 20 , the heat conductive sheet 30A and the metal heat conductive protrusion 40 . The protection space S” can be in a vacuum state or filled with an inert gas.

[0054] The chip packaging structure of the present invention can be equipped with a heat sink to achieve faster heat dissipation. Figure 6 FIG. 1 is a schematic diagram of a chip packaging structure according to another embodiment of the present invention. In this embodiment, the chip packaging structure 1B includes a base 10, a chip 20, a heat conductive sheet 30, a metal heat conductive protrusion 40, and a heat sink 60. The specific description of the base 10, the chip 20, the heat conductive sheet 30, and the metal heat conductive protrusion 40 can be referred to the above related Figure 1 The contents of the chip packaging structure 1 are not repeated here.

[0055] The heat sink 60 is, for example but not limited to, a copper sheet, which is disposed on the upper cover portion 320 of the heat conductive sheet 30 . The heat generated by the chip 20 can be transferred to the heat sink 60 through the metal heat conductive protrusions 40 and the upper cover portion 320 .

[0056] Figure 7 FIG. 1 is a schematic diagram of a chip packaging structure according to another embodiment of the present invention. In this embodiment, the chip packaging structure 1C includes a base 10, a chip 20, a heat conductive sheet 30, a metal heat conductive protrusion 40, and heat sinks 60 and 70. The specific description of the base 10, the chip 20, the heat conductive sheet 30, and the metal heat conductive protrusion 40 can be referred to the above related Figure 1 The contents of the chip packaging structure 1 are not repeated here.

[0057] The heat sinks 60 and 70 are, for example but not limited to, copper sheets, wherein the heat sink 60 is disposed on the upper cover portion 320 of the heat conductive sheet 30, and the heat sink 70 is disposed on the base 10. The heat generated by the chip 20 can be transferred to the heat sink 60 through the metal heat conductive protrusions 40 and the upper cover portion 320, or transferred to the heat sink 70 through the metal heat conductive protrusions 40, the upper cover portion 320, the metal peripheral wall 310, the solder pad 112 and the circuit layer 113.

[0058] The chip packaging structure of the present invention may include multiple circuit boards to achieve wider applications. Figure 8 FIG. 1 is a schematic diagram of a chip packaging structure according to another embodiment of the present invention. In this embodiment, the chip packaging structure 1D includes a base 10D, a chip 20, a heat conducting sheet 30, a metal heat conducting protrusion 40, and a heat sink 60. The specific description of the chip 20, the heat conducting sheet 30, and the metal heat conducting protrusion 40 can be referred to the above related Figure 1 The content of the chip packaging structure 1, and the specific description of the heat sink 60 can refer to the above-mentioned Figure 6 The contents of the chip packaging structure 1B are not repeated here.

[0059] The base 10D includes a first circuit board 100 and a second circuit board 101. The chip 20 and the heat conductive sheet 30 are disposed on one side of the first circuit board 100, and the second circuit board 101 is disposed on the other side opposite to the first circuit board 100. The first circuit board 100 and the second circuit board 101 can each be a low temperature co-fired ceramic circuit board, a FR-4 printed circuit board or an aluminum substrate.

[0060] The following provides experimental data to support that the metal heat-conducting protrusions disclosed in the present invention are helpful in improving heat exchange efficiency.

[0061] [Example]

[0062] like Figure 1 The chip packaging structure 1 is shown.

[0063] [Comparative Example 1]

[0064] like Fig. 9 The chip packaging structure shown is Figure 1 The main difference between the chip package structure 1 and the comparative example 1 is that the chip package structure of the comparative example 1 does not have the metal heat-conducting protrusions and the auxiliary heat-conducting member, and the top surface of the chip 20 is spaced apart from the heat-conducting sheet 30 .

[0065] [Comparative Example 2]

[0066] like Fig.10 The chip packaging structure shown is Figure 1 The main difference between the chip package structure 1 and the comparative example 2 is that the chip package structure of the comparative example 2 does not have the metal heat-conducting protrusions, and the chip 20 is in thermal contact with the heat-conducting sheet 30 through the auxiliary heat-conducting member 50 (ie, the heat-conducting pad).

[0067] The two measuring points P1 and P2 of the embodiment, comparative example 1 and comparative example 2 are measured by any known means, and the heat dissipation performance of the chip 20 is judged according to the temperature difference between the measuring points P1 and P2. The measuring point P1 is located at the junction of the chip 20 and the auxiliary heat conductive member 50 or the top surface of the chip 20. The measuring point P2 is located at the junction of the metal heat conductive protrusion 40 and the upper cover 320, the junction of the auxiliary heat conductive member 50 and the upper cover 320, or the bottom surface of the heat conductive sheet 30. The measurement results are shown in Tables 1 and 2 below.

[0068]

[0069]

[0070] According to Table 1 and Table 2, it can be seen that the first embodiment has a lower thermal resistance value and a smaller temperature difference, which means that the metal heat-conducting protrusions help to quickly transfer the heat generated by the chip to the upper cover of the heat-conducting sheet.

[0071] In summary, according to the chip packaging structure disclosed in the present invention, the metal thermal conductive protrusion helps to enhance the heat exchange between the heat-generating chip and the packaging structure, and helps to direct the heat energy to the thermal conductive sheet and even further to the heat sink, so that the temperature of the heat-generating chip can be quickly cooled down and the temperature can be controlled within a safe range, thereby reducing or even eliminating the need for the use of thermal conductive media.

[0072] In some embodiments, the heat conducting sheet and the base form a protective space for accommodating the chip. Since the metal heat conducting protrusions improve the heat exchange efficiency, the metal heat conducting protrusions can achieve more effective heat dissipation inside the protective space, so that the temperature of the chip and / or chipset is reduced, thereby achieving stable performance control.

[0073] In some embodiments, the heat conducting sheet includes a metal peripheral wall formed of a metal material and an upper cover formed of a ceramic material. The metal peripheral wall helps to improve the thermal conductivity of the heat conducting sheet, and the upper cover helps to prevent electromagnetic interference from affecting the operation of the chip. Therefore, compared with existing heat conducting sheets that are all made of ceramic materials or all made of metal materials, the heat conducting sheet can meet the requirements of good thermal conductivity and no electromagnetic interference.

[0074] In some embodiments, the upper cover of the heat conductive sheet is attached to the metal peripheral wall via an adhesive layer. The adhesive layer can form a chemical bond between the metal peripheral wall and the upper cover, which helps to reduce the interface thermal resistance between the metal peripheral wall and the upper cover.

Claims

1. A chip packaging structure, comprising: Base; At least one chip is disposed on the base; Thermally conductive sheet; and At least one metal heat-conducting protrusion is disposed on the heat-conducting sheet. The at least one metal heat-conducting protrusion is between the at least one chip and the heat-conducting sheet, and the at least one metal heat-conducting protrusion is in thermal contact with the at least one chip and the heat-conducting sheet. 2 . The chip package structure as claimed in claim 1 , wherein the base comprises a ceramic circuit board. 3 . The chip package structure as claimed in claim 1 , wherein the at least one chip comprises a power amplifier. 4 . The chip package structure as claimed in claim 1 , further comprising at least one auxiliary thermal conductive member, wherein the at least one auxiliary thermal conductive member is disposed between the at least one chip and the at least one metal thermal conductive protrusion. 5 . The chip packaging structure as claimed in claim 1 , wherein the heat conductive sheet is disposed on the base, and the heat conductive sheet and the base together form a protection space for accommodating the at least one chip.

6. The chip packaging structure as described in claim 5, wherein the heat conductive sheet comprises a metal peripheral wall and an upper cover portion, the metal peripheral wall is arranged on the base, the upper cover portion is arranged on the metal peripheral wall, the upper cover portion and the base are respectively located on opposite sides of the metal peripheral wall, and the at least one metal heat conductive protrusion is arranged on the upper cover portion. 7 . The chip packaging structure as claimed in claim 6 , wherein the base comprises a circuit board wiring, and the at least one chip and the metal peripheral wall of the heat conducting sheet are bonded to the circuit board wiring. 8 . The chip package structure as claimed in claim 6 , wherein the upper cover portion of the heat conducting sheet comprises a ceramic material. 9 . The chip package structure as claimed in claim 6 , wherein the heat conducting sheet further comprises an adhesive layer, and the upper cover is attached to the metal peripheral wall through the adhesive layer. 10 . The chip packaging structure as claimed in claim 6 , further comprising a heat sink, wherein the heat sink is disposed on the upper cover portion of the heat conducting sheet. 11 . The chip package structure as claimed in claim 1 , further comprising a heat sink, wherein the heat sink is disposed on the base.

12. The chip packaging structure as claimed in claim 1, wherein the base comprises a first circuit board and a second circuit board, the at least one chip and the heat conductive sheet are disposed on one side of the first circuit board, and the second circuit board is disposed on the other side opposite to the first circuit board.

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