Circulating cooling and heat dissipation system of solid laser

Abstract

The invention belongs to the technical field of solid-state lasers, and discloses a solid-state laser circulating cooling heat dissipation system which comprises a shell, a heat conduction plate and a top plate, the heat conduction plate and the top plate are fixed in the shell, and a heat dissipation inner cavity is formed between the heat conduction plate and the top plate; a backflow cavity is formed in the heat conduction plate, a refrigeration plate and an internal circulation fan are fixed to the top of the heat conduction plate, and the refrigeration plate is used for installing a heating element of the solid laser. A water cooling groove and a plurality of air cooling holes are formed in the refrigeration plate; a water cooling groove is formed in the shell, the water cooling groove is in a snakelike extending shape, the side walls of the two ends of the water cooling groove in the length direction are open, a water cooling pipeline is embedded in the water cooling groove, and a water cooling module connected with the water cooling pipeline is fixed to the outer side of the shell; the multiple air cooling holes comprise air inlet holes and air outlet holes, the heat dissipation inner cavity, the air inlet holes, the air outlet holes and the backflow cavity are sequentially communicated, the air inlet holes are the air cooling holes which are not completely covered by the heating element, and the air outlet holes are the air cooling holes which are completely covered by the heating element.

Description

Technical Field

[0001] The invention belongs to the technical field of solid lasers, and in particular relates to a circulating cooling and heat dissipation system for solid lasers. Background Art

[0002] Solid-state lasers have the characteristics of large output energy and high peak power. They are widely used in industrial manufacturing, national defense, high-energy physics research and other fields. With the advancement of current laser technology, high-power laser technology has become an important development direction for solid-state lasers. However, since solid-state lasers generate a lot of heat during operation, it is easy to cause birefringence in the gain medium. Therefore, it is necessary to cool the heating elements inside the laser.

[0003] Existing solid-state lasers are usually cooled by water cooling. The water cooling pipes are in contact with the heating elements. Therefore, when the cooling water passes through the water cooling pipes, the heat is taken away through heat exchange and the flow of water. However, when the cooling water with lower temperature passes through the water cooling pipes, the temperature of the surface of the water cooling pipes drops rapidly. At this time, the moisture in the air near the water cooling pipes will condense on the surface of the water cooling pipes, which will cause the heating elements to become damp and damaged. Summary of the invention

[0004] In view of this, in order to solve the problems raised in the above background technology, the purpose of the present invention is to provide a solid laser circulating cooling and heat dissipation system.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A solid laser circulating cooling and heat dissipation system comprises a shell, a heat conducting plate and a top plate fixed inside the shell, and a heat dissipation cavity is formed between the heat conducting plate and the top plate;

[0007] A reflux cavity is provided inside the heat conducting plate, a refrigeration plate and an internal circulation fan are fixed on the top of the heat conducting plate, and the refrigeration plate is used to install the heating element of the solid laser;

[0008] The refrigeration plate is provided with a water cooling groove and a plurality of air cooling holes;

[0009] The water cooling groove is in a serpentine shape, and the side walls at both ends of the length direction of the water cooling groove are opened. A water cooling pipe is embedded in the water cooling groove, and a water cooling module connected to the water cooling pipe is fixed on the outside of the shell;

[0010] The multiple air cooling holes include air inlet holes and air outlet holes, and the heat dissipation cavity, the air inlet holes, the air outlet holes and the return cavity are connected in sequence. The air inlet holes are air cooling holes that are not completely covered by the heating element, and the air outlet holes are air cooling holes that are completely covered by the heating element.

[0011] Preferably, each of the air-cooling holes comprises an end hole and a center hole and a guide hole connected through the end hole, the center hole and the end hole are coaxially arranged, and the guide hole is located outside the center hole.

[0012] Preferably, a threaded hole is connected between the center hole and the reflux chamber, and a movable valve is provided in the threaded hole; an annular guide cavity is provided in the refrigeration plate and is coaxially matched with the outer side of the threaded hole, the annular guide cavity is connected with the corresponding guide hole, and through holes are also connected between the multiple annular guide cavities.

[0013] Preferably, the diameter of the threaded hole is larger than the diameter of the center hole, and a sealing step is formed at the connection between the threaded hole and the center hole; the movable valve includes a threaded valve body screwed into the threaded hole, and the threaded valve body is provided with a valve hole that can be sealed by the sealing step.

[0014] Preferably, a push rod capable of passing through the center hole is fixed at the center of the top of the threaded valve body, and the diameter of the push rod is smaller than the diameter of the center hole.

[0015] Preferably, the outer sliding sleeve of the push rod is provided with a sliding sleeve, the diameter of the sliding sleeve is smaller than the diameter of the center hole, and a spring is connected between the top of the push rod and the sliding sleeve.

[0016] Preferably, the solid laser circulating cooling and heat dissipation system also includes a base plate fixed inside the shell, a heat dissipation external cavity is formed between the heat conducting plate and the base plate, and an external circulation fan is fixed on the base plate.

[0017] Preferably, a heat sink is also fixed to the base plate, a heat sink is provided on the heat sink, the heat sink is in a serpentine shape, and side wall openings are provided at both ends of the length direction of the heat sink, a heat sink is embedded in the heat sink, and the heat sink is connected to the water cooling module.

[0018] Preferably, a plurality of heat dissipation fins are fixed between the heat dissipation plate and the heat conduction plate, and a heat dissipation channel connected to the external circulation fan is formed between adjacent heat dissipation fins.

[0019] Preferably, the water cooling module includes a first water pump, a cold water tank, a second water pump and a semiconductor refrigeration plate, the first water pump is used to connect one end of the water cooling pipe and the heat dissipation pipe, the second water pump and the cold water tank are respectively connected to the other end of the water cooling pipe and the heat dissipation pipe, and a guide pipe is connected between the second water pump and the cold water tank, and the cold end of the semiconductor refrigeration plate extends into the cold water tank.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] (1) The present invention utilizes a water-cooling pipe and a plurality of air-cooling holes for coordinated heat dissipation, thereby effectively improving the heat dissipation efficiency of the solid-state laser, and utilizes the air-cooling holes and the reflux cavity to realize the internal circulation flow of dry air in the heat dissipation cavity, thereby effectively preventing moisture outside the shell from entering the heat dissipation cavity, thereby avoiding the condensation phenomenon on the surface of the heating element during heat dissipation cooling.

[0022] (2) A movable valve is provided in the air cooling hole, and the flow path of the dry air in the air cooling hole is changed by using the movable valve and the installation of the heating element, thereby forming a state in which the air flows into the air cooling hole through the surface of the heating element and flows out of the air cooling hole through the bottom of the heating element, thereby being able to automatically adjust the air cooling path according to the installation position of the heating element.

[0023] (3) The movable valve includes a threaded valve body and a push rod, and a sliding sleeve that can be elastically raised and lowered is connected to the top of the push rod, thereby ensuring that the movable valve is in contact with the bottom of the heating element and preventing the push rod from interfering with the installation of the heating element.

[0024] (4) The present invention sets the two sides of the heat conduction plate as an inner heat dissipation cavity and an outer heat dissipation cavity respectively, and uses the external air flow in the outer heat dissipation cavity to realize external circulation heat dissipation, thereby further improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 An exploded view of the present invention;

[0026] Figure 2 It is a cross-sectional view of the assembly of the heat conducting plate and the refrigeration plate in the present invention;

[0027] Figure 3 for Figure 2 A in the enlarged view;

[0028] Figure 4 for Figure 2 The enlarged view of point B in the figure;

[0029] Figure 5 An exploded view of the movable valve in the present invention;

[0030] Figure 6 It is a cross-sectional view of the assembly of the heat conducting plate and the bottom plate in the present invention;

[0031] In the figure: shell 1; heat conduction plate 2; refrigeration plate 21; water cooling groove 211; air cooling hole 212; end hole 213; center hole 214; guide hole 215; threaded hole 216; threaded valve body 2161; valve hole 2162; push rod 2163; sleeve 2164; spring 2165; annular guide cavity 217; internal circulation fan 22; top plate 3; bottom plate 4; external circulation fan 41; heat sink 42; heat sink fin 43; first water pump 5; cold water tank 6; second water pump 7; semiconductor refrigeration plate 8. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] like Figure 1 As shown, a solid laser circulating cooling and heat dissipation system provided by the present invention specifically includes a housing 1 and a top plate 3, a heat conducting plate 2 and a bottom plate 4 fixed inside the housing 1 from top to bottom, a heat dissipation inner cavity is formed between the heat conducting plate 2 and the top plate 3, and a heat dissipation outer cavity is formed between the heat conducting plate 2 and the bottom plate 4. In addition, a water cooling module is also fixed outside the housing 1.

[0034] Water Cooling:

[0035] Continue to refer Figure 1 and Figure 2 As shown, a cooling plate 21 is fixed on the top of the heat conducting plate 2, and the cooling plate 21 is used to install the heating element of the solid laser, and a water cooling groove 211 is opened on the cooling plate 21; the water cooling groove 211 is in a serpentine extension shape, and the side walls of the two ends of the length direction of the water cooling groove 211 are opened, and a water cooling pipe is embedded in the water cooling groove 211;

[0036] Continue to refer Figure 1 and Figure 6 As shown, a heat sink 42 is fixed on the bottom plate 4, and a heat sink 42 is provided on the heat sink. The heat sink is in a serpentine shape, and the side walls at both ends of the length direction of the heat sink are opened, and a heat sink pipe is embedded in the heat sink;

[0037] Continue to refer Figure 1As shown, the water cooling module includes a first water pump 5, a cold water tank 6, a second water pump 7 and a semiconductor refrigeration plate 8. The first water pump 5 is used to connect one end of the water cooling pipe and the heat dissipation pipe, the second water pump 7 and the cold water tank 6 are respectively connected to the other end of the water cooling pipe and the heat dissipation pipe, and a guide pipe is connected between the second water pump 7 and the cold water tank 6, and the cold end of the semiconductor refrigeration plate 6 extends into the cold water tank 6.

[0038] As described above, the semiconductor refrigeration sheet 8 is used for cooling to reduce the water temperature in the cold water tank 6; the cooling water in the cold water tank 6 is transported to the water cooling pipe by the second water pump 7, thereby reducing the temperature of the entire refrigeration plate 21, and cooling and dissipating the heat of the heating element installed on the refrigeration plate 21; the first water pump 5 transports the water heated by heat exchange to the heat dissipation pipe, and the heat dissipation pipe performs preliminary heat dissipation in the heat dissipation outer cavity, and then flows back to the cold water tank 6 for cooling. The cooling water circulates along the above path, thereby realizing the water cooling of the heating element of the solid laser.

[0039] In addition, a plurality of heat dissipation fins 43 are fixed between the heat dissipation plate 42 and the heat conducting plate 2 , and a heat dissipation channel connected to the external circulation fan 41 is formed between adjacent heat dissipation fins 43 , thereby improving the heat dissipation efficiency of the heat dissipation pipeline.

[0040] Internal circulation air cooling:

[0041] Continue to refer Figure 1 and Figure 2 As shown, a reflux cavity is provided inside the heat conducting plate 2, and an internal circulation fan 22 is fixed on the top of the heat conducting plate 2 (symmetrically arranged on both sides of the refrigeration plate 21, one side is an air outlet fan, and the other side is an air inlet fan).

[0042] Continue to refer Figure 1 and Figure 2 As shown, the cooling plate 21 is used to install the heating element of the solid laser, and a plurality of air cooling holes 212 (distributed in a staggered manner with the water cooling grooves 211 ) are provided on the cooling plate 21 .

[0043] Continue to refer Figure 2 and Figure 3 As shown, each of the air cooling holes 212 includes an end hole 213 and a center hole 214 and a guide hole 215 connected through the end hole 213 . The center hole 214 and the end hole 213 are coaxially arranged. There are multiple guide holes 215 , and the multiple guide holes 215 are arrayed and distributed outside the center hole 214 .

[0044] Continue to refer Figure 2 and Figure 3As shown, a threaded hole 216 is connected between each of the center holes 214 and the reflux chamber, and a movable valve is provided in the threaded hole 216; an annular guide chamber 217 is provided in the refrigeration plate 21 and is coaxially matched with the outer side of the threaded hole 216, and the annular guide chamber 217 is connected with the corresponding guide hole 215, and through holes are also connected between the multiple annular guide chambers 217.

[0045] Continue to refer Figure 2 and Figure 3 As shown, the diameter of the threaded hole 216 is larger than the diameter of the center hole 214, and a sealing step is formed at the connection between the threaded hole 216 and the center hole 214; the movable valve includes a threaded valve body 2161 screwed into the threaded hole 216, and the threaded valve body 2161 is provided with a valve hole 2162 that can be sealed by the sealing step.

[0046] In summary and combined Figure 2 , Figure 3 and Figure 4 It can be seen that:

[0047] When the heating element of the solid laser is installed on the cooling plate 21 (it can be installed by welding), the movable valve in the installation area is unlocked according to the installation position, and the specific unlocking method is: rotate the threaded valve body 2161 so that the threaded valve body 2161 moves downward in the axial direction, that is, the top of the threaded valve body 2161 is away from the sealing step, so that the valve hole 2162 can be connected with the threaded hole 216, while the movable valve outside the installation area remains Figure 3 The locked state shown;

[0048] After the heating element is installed, Figure 2 , Figure 3 and Figure 4 It can be seen that a is an air cooling hole 212 that is not covered by the heating element, and c is an air cooling hole 212 that is partially covered by the heating element. The end holes 213 in the air cooling holes 212 in these two states are both open, so they both serve as air inlet holes. b is an air cooling hole 212 that is completely covered by the heating element. The end holes 213 in the air cooling holes 212 in this state are both closed, so they both serve as air outlet holes. After starting the internal circulation fan 22, the dry air in the heat dissipation cavity is cooled according to the temperature. Figure 3 C in the middle and Figure 4The dotted arrow at a shows the air entering the end hole 213 and the guide hole 215 of the air cooling hole 212 (air inlet hole) (the air flow flows through the surface of the heating element), and then flows to b through the annular guide cavity 217 and the through hole. The air flow flows back to the end hole 213 through the guide hole 215 at b (and contacts the bottom of the heating element), and then enters the valve hole 2162 through the center hole 214 and the threaded hole 216 at b, and finally passes through the valve hole 2162 and the threaded hole 216 and flows into the reflux cavity. After entering the reflux cavity, the air flow will be returned to the heat dissipation cavity by the circulating fan 22, thereby realizing the internal circulation air cooling in the heat dissipation cavity.

[0049] As mentioned above, the airflow of the internal circulation air cooling is dry air, so that no condensation will occur after the heating element is cooled by the airflow (and the above-mentioned water cooling), and the temperature of the dry air flow will increase after contacting the surface and bottom of the heating element, and the heated airflow mainly dissipates heat in the reflow cavity, that is, dissipates heat through the heat conducting plate 2. Preferably, a plurality of heat dissipating fins 43 are fixed between the heat dissipating plate 42 and the heat conducting plate 2, and a heat dissipating channel connected to the external circulation fan 41 is formed between adjacent heat dissipating fins 43, so as to improve the heat dissipation efficiency of the heat conducting plate 2.

[0050] In addition, refer to Figure 3 , Figure 4 and Figure 5 In order to facilitate the unlocking operation of the movable valve, a push rod 2163 capable of passing through the center hole 214 is fixed at the center of the top of the threaded valve body 2161, and in order to prevent the push rod 2163 from interfering with the installation of the heating element, a sliding sleeve 2164 is also provided on the outer sliding sleeve of the push rod 2163. The diameters of the sliding sleeve 2164 and the push rod 2163 are both smaller than the diameter of the center hole 214, and a spring 2165 is connected between the top of the push rod 2163 and the sliding sleeve 2164. Figure 3 and Figure 4 It can be seen that:

[0051] exist Figure 4 At a, the threaded valve body 2161 is in a locked state, and the spring 2165 is not compressed;

[0052] exist Figure 4 At b, the threaded valve body 2161 is in an unlocked state, and the spring 2165 is not compressed;

[0053] exist Figure 3 At point c, the threaded valve body 2161 is in an unlocked state and the spring 2165 is compressed.

[0054] External circulation air cooling:

[0055] Continue to refer Figure 6As shown, a heat sink 42 and an external circulation fan 41 (symmetrically arranged on both sides of the heat sink 42, one side is an air outlet fan, and the other side is an air inlet fan) are fixed on the bottom plate 4. Thus, by starting the external circulation fan 41, the external airflow can pass through the heat dissipation outer cavity, thereby realizing air cooling and heat dissipation of the heat dissipation outer cavity.

[0056] Furthermore, a plurality of heat dissipation fins 43 are fixed between the heat dissipation plate 42 and the heat conducting plate 2, and a heat dissipation channel connected to the external circulation fan 41 is formed between adjacent heat dissipation fins 43, so as to improve the air-cooling heat dissipation efficiency of the heat dissipation outer cavity.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A solid laser circulating cooling and heat dissipation system, characterized in that: It comprises a shell (1), and a heat conducting plate (2) and a top plate (3) fixed inside the shell (1), and a heat dissipation cavity is formed between the heat conducting plate (2) and the top plate (3); A reflux cavity is provided inside the heat conducting plate (2), a refrigeration plate (21) and an internal circulation fan (22) are fixed on the top of the heat conducting plate (2), and the refrigeration plate (21) is used to install a heating element of a solid-state laser; The refrigeration plate (21) is provided with a water cooling groove (211) and a plurality of air cooling holes (212); The water cooling groove (211) is in a serpentine extending shape, and the side walls of the water cooling groove (211) are opened at both ends in the length direction. A water cooling pipe is embedded in the water cooling groove (211), and a water cooling module connected to the water cooling pipe is fixed on the outside of the shell (1); The plurality of air cooling holes (212) include air inlet holes and air outlet holes, and the heat dissipation inner cavity, the air inlet holes, the air outlet holes and the return cavity are sequentially connected, the air inlet holes are air cooling holes (212) that are not completely covered by the heating element, and the air outlet holes are air cooling holes (212) that are completely covered by the heating element.

2. The solid-state laser circulating cooling and heat dissipation system according to claim 1, characterized in that: Each of the air cooling holes (212) comprises an end hole (213) and a center hole (214) and a guide hole (215) connected through the end hole (213); the center hole (214) and the end hole (213) are coaxially arranged, and the guide hole (215) is located outside the center hole (214).

3. The solid-state laser circulating cooling and heat dissipation system according to claim 2, characterized in that: A threaded hole (216) is connected between the central hole (214) and the reflux chamber, and a movable valve is provided in the threaded hole (216); an annular guide chamber (217) is provided in the refrigeration plate (21) and is coaxially matched with the outer side of the threaded hole (216); the annular guide chamber (217) is communicated with the corresponding guide hole (215), and through holes are also connected between the multiple annular guide chambers (217).

4. The solid-state laser circulating cooling and heat dissipation system according to claim 3 is characterized in that: The diameter of the threaded hole (216) is greater than the diameter of the center hole (214), and a sealing step is formed at the connection between the threaded hole (216) and the center hole (214); the movable valve includes a threaded valve body (2161) screwed into the threaded hole (216), and the threaded valve body (2161) is provided with a valve hole (2162) that can be sealed by the sealing step.

5. The solid-state laser circulating cooling and heat dissipation system according to claim 4, characterized in that: A push rod (2163) capable of passing through the center hole (214) is fixed at the center of the top of the threaded valve body (2161), and the diameter of the push rod (2163) is smaller than the diameter of the center hole (214).

6. The solid-state laser circulating cooling and heat dissipation system according to claim 5, characterized in that: The outer sliding sleeve of the push rod (2163) is provided with a sliding sleeve (2164), the diameter of the sliding sleeve (2164) is smaller than the diameter of the central hole (214), and a spring (2165) is connected between the top of the push rod (2163) and the sliding sleeve (2164).

7. The solid-state laser circulating cooling and heat dissipation system according to claim 1, characterized in that: It also includes a bottom plate (4) fixed inside the shell (1), an external heat dissipation cavity is formed between the heat conducting plate (2) and the bottom plate (4), and an external circulation fan (41) is fixed on the bottom plate (4).

8. The solid-state laser circulating cooling and heat dissipation system according to claim 7, characterized in that: A heat sink (42) is also fixed on the bottom plate (4), and a heat sink (42) is provided on the heat sink. The heat sink is in a serpentine shape, and sidewall openings are provided at both ends of the length direction of the heat sink. A heat sink pipe is embedded in the heat sink, and the heat sink pipe is connected to the water cooling module.

9. The solid-state laser circulating cooling and heat dissipation system according to claim 8, characterized in that: A plurality of heat dissipation fins (43) are fixed between the heat dissipation plate (42) and the heat conduction plate (2), and a heat dissipation channel connected to the external circulation fan (41) is formed between adjacent heat dissipation fins (43).

10. The solid-state laser circulating cooling and heat dissipation system according to claim 8, characterized in that: The water cooling module comprises a first water pump (5), a cold water tank (6), a second water pump (7) and a semiconductor refrigeration plate (8); the first water pump (5) is used to connect a water cooling pipe and one end of a heat dissipation pipe; the second water pump (7) and the cold water tank (6) are respectively connected to the other ends of the water cooling pipe and the heat dissipation pipe; a flow guide pipe is connected between the second water pump (7) and the cold water tank (6); and the cold end of the semiconductor refrigeration plate (6) extends into the cold water tank (6).

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