Macro-channel submodule packaging clamp

Abstract

A macro-channel heat dissipation base limiting mechanism is arranged on a bottom plate of an inverted-door-shaped placing frame, positioning frame limiting mechanisms are arranged on two side plates of the placing frame, pressure rods are fixedly connected to the upper portions of the two side wall plates of the placing frame, a row of spring ejector pins are evenly arranged on the pressure rods, and the spring ejector pins are arranged on the two side wall plates of the placing frame. A pressing block is pressed below the spring ejector pins and located above a positioning frame, a macro-channel heat dissipation base and an insulating ceramic piece with the surface plated with a metal film are placed between the positioning frame and the placing frame bottom plate, the macro-channel heat dissipation base is located below the insulating ceramic piece, and the positioning frame comprises a left metal baffle and a right metal baffle. Positioning partition plates and metal blocks are distributed between the two metal baffles at intervals, sub-module containing cavities are formed between the metal blocks and the positioning partition plates, and the shape of the pressing blocks is the same as that of the sub-module containing cavities. The sub-modules are separated by the positioning partition plates, so that the sub-modules cannot extrude one another, errors cannot be accumulated, and metal film cutting lines on the chips and the insulating ceramic chips are prevented from deviating.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor lasers, and in particular relates to a macro channel submodule packaging fixture.

[0002] The present invention belongs to the new industry catalogue 1, the new generation of information technology industry, 1.3, the key direction of the electronic core industry, 1.3.3 new components and semiconductor laser devices. Background Art

[0003] The macro channel submodule is welded by two electrode sheets and a semiconductor laser array chip. The two electrode sheets are welded around the chip, and the two electrode sheets serve as the positive and negative electrodes of the chip respectively. Figure 1 As shown in the figure, the module size is only 10mm×2mm×1mm. To assemble a macro channel laser, it is generally necessary to weld multiple such sub modules in series to form a high-power macro channel laser. When welding, the sub modules need to be welded to an insulating ceramic sheet with a metal film on the surface. In order to ensure that the positive and negative electrodes of the sub modules do not short-circuit, the metal film is generally cut with a diamond blade, see Fig. 9 , the chip just corresponds to the cut-off point, and the positive and negative electrodes are welded to the metal film layer of the ceramic sheet. In this way, a cut-off line just corresponds to the position of a chip, so that each submodule is connected in series without short circuit. However, during the packaging process, the following problems will be encountered: 1. Since the chip is very thin, only 0.135mm, the cumulative error between sub-modules can easily cause the chip and the cut-off line to deviate, causing the positive and negative electrodes of the sub-module to be welded to the same metal film, causing a short circuit.

[0004] 2. When the submodules are welded, the submodules are closely arranged and inevitably squeeze each other, so some submodules are lifted. The lifted submodules cannot contact the solder during welding, resulting in welding failure. In this case, when the submodule is powered on, it cannot dissipate heat in time, causing the submodule to burn out. Summary of the invention

[0005] In view of the problems in the prior art that the accumulated errors between sub-modules easily cause the chip and the cutting line to deviate, causing the positive and negative electrodes of the sub-module to be welded to the same metal film to cause a short circuit, and the sub-modules to be squeezed against each other and lifted up, the present invention provides a macro channel sub-module packaging fixture.

[0006] The object of the present invention is achieved in the following manner: A macro channel submodule packaging fixture comprises a placing frame, a positioning frame, a pressing block, a pressure rod and a spring ejector pin. The placing frame is an inverted door type. A macro channel heat dissipation base limiting mechanism is arranged on the bottom plate of the placing frame. Positioning frame limiting mechanisms are arranged on the two side plates of the placing frame. The upper part of the two side wall plates of the placing frame is fixedly connected to the pressure rod. A row of spring ejectors are evenly arranged on the pressure rod. A pressing block is pressed tightly under each spring ejector pin. The number of pressing blocks is not less than the number of submodules. The pressing block is located above the positioning frame. A macro channel heat dissipation base and an insulating ceramic sheet with a metal film on the surface are placed between the positioning frame and the bottom plate of the placing frame. The channel heat dissipation base is below the insulating ceramic sheet, and the positioning frame includes two left and right metal baffles, a positioning partition and a metal block spaced apart between the two metal baffles, the metal block includes a first metal block and a second metal block, one end of the positioning partition is detachably connected to the first metal block, and the other end is detachably connected to the second metal block, a submodule accommodating cavity is formed between the first metal block, the second metal block and the positioning partition, the width of the first metal block and the second metal block is the same as the width of the submodule, the spacing between the first metal block and the second metal block is the same as the length of the submodule, and the shape of the pressing block is the same as the submodule accommodating cavity.

[0007] Connection holes are set at both ends of the positioning partition, and connection holes are also set at the ends of the first metal block and the second metal block that are away from each other. The positioning partition is connected to the first metal block by screws passing through the connection holes, and the positioning partition is connected to the second metal block by screws passing through the connection holes.

[0008] A positioning tip is disposed at one end adjacent to the first metal block and the second metal block.

[0009] The limiting mechanism of the macro channel heat dissipation base comprises a first screw hole arranged on the bottom plate of the placement frame, and a positioning screw passes through the first screw hole.

[0010] The positioning frame limiting mechanism comprises second screw holes arranged on two side plates of the placing frame, the screw holes on the two side plates are arranged at the same height, and positioning screws pass through the screw holes.

[0011] There are two parallel pressure rods.

[0012] Compared with the prior art, the present invention has the following advantages: 1. Each submodule is separated by a positioning partition so that they will not squeeze each other, thus avoiding or reducing welding failure caused by the submodule being lifted and unable to contact the solder. The position of each submodule is fixed and there will be no accumulated error, thus avoiding deviation of the metal film cutting line on the chip and the insulating ceramic sheet, which will cause a short circuit when the positive and negative electrodes of the submodule are welded to the same metal film.

[0013] 2. The thickness of metal blocks and positioning partitions can be changed as needed, with a wide range of applications and flexible use of the device.

[0014] 3. The pressing block will not tilt when it is stuck on the positioning frame. The pressing block provides the pressure required for sub-module packaging, so that the sub-module is evenly stressed. The spring ejector is used to prevent cold soldering due to insufficient pressure on the pressing block.

[0015] 4. Multiple sub-modules are clamped and sintered successfully in one time, which improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of the macro channel submodule.

[0017] Figure 2 It is a structural schematic diagram of the present invention.

[0018] Figure 3 It is a structural diagram of a display rack.

[0019] Figure 4 It is a structural diagram of the positioning frame.

[0020] Figure 5 It is a schematic diagram of the structure of a metal block.

[0021] Figure 6 It is a structural schematic diagram of a positioning partition.

[0022] Figure 7 It is a schematic diagram of the structure of the briquette.

[0023] Figure 8 It is a schematic diagram of the structure of the pressure rod.

[0024] Fig. 9 It is a schematic diagram of the structure of an insulating ceramic sheet with a metal film coated on the surface. DETAILED DESCRIPTION

[0025] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention. After reading the content of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the present invention.

[0026] like Figure 2-8As shown, a macro channel submodule packaging fixture includes a display rack 1, a positioning frame 4, a pressure block 5, a pressure rod 6 and a spring ejector 7. The display rack 1 is an inverted door type. A macro channel heat dissipation base limiting mechanism is arranged on the bottom plate of the display rack 1. Positioning frame limiting mechanisms are arranged on the two side plates of the display rack 1. The upper parts of the two side wall plates of the display rack 1 are fixedly connected to the two ends of the pressure rod 6 by screws passing through third screw holes 13. A row of spring ejector pins 7 are evenly arranged on the pressure rod 6. A pressure block 5 is pressed under each spring ejector pin 7. The number of pressure blocks is not less than the number of submodules. The pressure block 5 is located above the positioning frame 4. A macro channel heat dissipation base 2 and an insulating ceramic sheet 3 with a metal film coated on the surface are placed between the positioning frame 4 and the bottom plate of the display rack 1. The macro channel heat dissipation base Below the insulating ceramic sheet 3, the positioning frame 4 includes two left and right metal baffles 44, a positioning baffle 41 and a metal block 42 spaced apart between the two metal baffles 44, the metal block 42 includes a first metal block 421 and a second metal block 422, one end of the positioning baffle 41 is detachably connected to the first metal block 421, and the other end is detachably connected to the second metal block 422, a submodule accommodating cavity 43 is formed between the first metal block 421, the second metal block 422 and the positioning baffle 41, the width of the first metal block 421 and the second metal block 422 is the same as the width of the submodule, the spacing between the first metal block 421 and the second metal block 422 is the same as the length of the submodule, and the shape of the pressing block 5 is the same as the submodule accommodating cavity 43.

[0027] The thickness of the positioning spacer 41 is 0.05-0.1 mm, and the processing accuracy of each component is 0.01 mm.

[0028] The detachable connection means that: both ends of the positioning partition 41 are provided with connection holes, and the ends of the first metal block 421 and the second metal block 422 that are away from each other are also provided with connection holes, and screws are passed through the connection holes of the positioning partition 41 and the first metal block 421 to fix the two. Similarly, the other end of the positioning partition 41 is also fixed to the second metal block 422 by screws. If you need to replace the positioning partition 41 or metal block 42 of different thickness, unscrew the screws and disassemble it easily.

[0029] Furthermore, a positioning tip 420 is provided at one end adjacent to the first metal block 421 and the second metal block 422. The distance between the two positioning tips 420 is the length of the submodule. The shape of the pressing block 5 is the same as the submodule accommodating cavity 43. Figure 7 As shown, the design of such a special shape is to ensure that the pressing block 5 will not tilt when pressing the submodule, to ensure that the submodule is evenly stressed and no cold solder joints are generated.

[0030] Furthermore, the limiting mechanism of the macro channel heat dissipation base includes a first screw hole 11 provided on the bottom plate of the display frame 1, and a positioning screw passes through the first screw hole 11. In addition to the water inlet hole and the water outlet hole, the existing macro channel heat dissipation base also has multiple mounting holes. The positioning screw passes through the first screw hole 11 and the mounting hole of the macro channel heat dissipation base to fix the macro channel heat dissipation base.

[0031] The positioning frame limiting mechanism includes second screw holes 12 arranged on the two side panels of the display frame 1. The screw holes 12 on the two side panels are arranged at the same height, and positioning screws pass through the screw holes 12. The positioning screws pass through the second screw holes 12 on the two side panels of the display frame 1 to fix the positioning frame 4 from the left and right ends.

[0032] A submodule accommodating cavity 43 is formed between the first metal block 421, the second metal block 422 and the positioning partition 41. One submodule can be placed between every two positioning partitions 41. If there is a deviation in the cutting line of the metal film on the chip and the ceramic sheet, it can be adjusted by replacing the positioning partitions 41 with different thicknesses.

[0033] The submodule 8 needs a certain amount of pressure when it is packaged. The pressure is provided by the pressure block 5 to make the submodule evenly stressed. After using the pressure block 5, the spring ejector 7 is used to prevent the pressure block from being insufficient and causing a cold solder joint. The pressure provided by the spring ejector 7 can be adjusted by replacing the spring ejector with different pressures. The overall pressure of the submodule is 10-200 g / cm 2 .

[0034] Furthermore, there are two parallel pressure rods 6. The purpose of using two pressure rods 6 is to have a spring ejector 7 at each end of a pressure block 5 to press it, so as to ensure that the pressure block 5 is evenly stressed and the submodule is evenly stressed.

[0035] The method of using the macro channel submodule packaging fixture includes the following steps: S1. Fix the macro channel heat dissipation base 2 on the display rack 1 with screws; S2. Place a ceramic sheet 3 coated with a metal film on the macro channel base 2, and evenly distribute the cut-off lines 31 on the metal film, and place solder between the macro channel base 2 and the ceramic sheet 3 coated with a metal film. The upper surface of the ceramic sheet 3 has solder prefabricated by thermal evaporation; S3. Assemble the positioning frame 4, arrange the positioning partition 41 and the metal block 42 between the left and right metal baffles 44, fix the metal baffle 44, the metal block 42 and the positioning partition 41 with screws, and the metal baffle 44 acts as a positioning plate at the outermost side of the positioning frame. The thickness can be selected to a suitable size according to the width of the macro channel base. The first metal block 421, the second metal block 422 and the two positioning partitions 41 form a sub-module accommodating cavity 43.

[0036] S4. Place the positioning frame 4 on the ceramic sheet 3 coated with a metal film on the surface, place the submodule in the submodule accommodating cavity 43, and check whether the chip of the submodule deviates from the cutting line of the metal film. If there is no deviation, use screws to pass through the connecting holes on the two side walls of the display frame 1 to fix the left and right sides of the positioning frame 4, and press it with the pressing block 5. If deviation occurs, partially or completely disassemble the positioning frame 4, replace the positioning partition 41 or metal block 42 of appropriate thickness, reassemble the positioning frame 4, and then fix the reassembled positioning frame 4 on the display frame 1.

[0037] S5. Install the spring ejector pins 7 on the pressure rod 6 one by one, and then fix the two ends of the pressure rod 6 on the upper part of the two side walls of the display rack 1 by screws. The spring ejector pins 7 press the pressure block 5, and further packaging operations can be carried out.

[0038] The macro channel submodule packaging fixture disclosed in the present invention has the following advantages: 1. Each submodule is separated by a positioning partition so that they will not squeeze each other, thus avoiding or reducing welding failure caused by the submodule being lifted and unable to contact the solder. The position of each submodule is fixed and there will be no accumulated error, thus avoiding deviation of the metal film cutting line on the chip and the insulating ceramic sheet, which will cause a short circuit when the positive and negative electrodes of the submodule are welded to the same metal film.

[0039] 2. The thickness of metal blocks and positioning partitions can be changed as needed, with a wide range of applications and flexible use of the device.

[0040] 3. The pressing block will not tilt when it is stuck on the positioning frame. The pressing block provides the pressure required for sub-module packaging, so that the sub-module is evenly stressed. The spring ejector is used to prevent cold soldering due to insufficient pressure on the pressing block.

[0041] 4. Multiple sub-modules are clamped and sintered successfully in one time, which improves work efficiency.

[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that for those skilled in the art, several changes and improvements can be made without departing from the overall concept of the present invention, which should also be regarded as the scope of protection of the present invention.

Claims

1. A macro channel submodule packaging fixture, characterized in that: The device comprises a placing frame (1), a positioning frame (4), a pressing block (5), a pressure rod (6) and a spring ejector pin (7). The placing frame (1) is an inverted door type. A macro channel heat dissipation base limiting mechanism is arranged on the bottom plate of the placing frame (1). The positioning frame limiting mechanism is arranged on the two side plates of the placing frame (1). The upper part of the two side wall plates of the placing frame (1) is fixedly connected to the pressure rod (6). A row of spring ejectors (7) are evenly arranged on the pressure rod (6). A pressing block (5) is pressed tightly under each spring ejector pin (7). The number of pressing blocks is not less than the number of submodules. The pressing block (5) is located above the positioning frame (4). A macro channel heat dissipation base (2) and an insulating ceramic sheet (3) with a metal film on the surface are placed between the positioning frame (4) and the bottom plate of the placing frame (1). The macro channel heat dissipation base (2) is below the insulating ceramic sheet (3). The positioning frame The frame (4) comprises two left and right metal baffles (44), a positioning baffle (41) and a metal block (42) spaced apart between the two metal baffles (44), the metal block (42) comprising a first metal block (421) and a second metal block (422), one end of the positioning baffle (41) being detachably connected to the first metal block (421), and the other end being detachably connected to the second metal block (422), a submodule accommodating cavity (43) being formed between the first metal block (421), the second metal block (422) and the positioning baffle (41), the width of the first metal block (421) and the second metal block (422) being the same as the width of the submodule, the spacing between the first metal block (421) and the second metal block (422) being the same as the length of the submodule, and the shape of the pressing block (5) being the same as the submodule accommodating cavity (43).

2. A macro channel submodule packaging fixture according to claim 1, characterized in that: Both ends of the positioning baffle (41) are provided with connection holes, and the ends of the first metal block (421) and the second metal block (422) that are away from each other are also provided with connection holes. The positioning baffle (41) and the first metal block (421) are connected by screws passing through the connection holes, and the positioning baffle (41) and the second metal block (422) are connected by screws passing through the connection holes.

3. The macro channel submodule packaging fixture according to claim 1, characterized in that: A positioning tip (420) is provided at one end adjacent to the first metal block (421) and the second metal block (422).

4. The macro channel submodule packaging fixture according to claim 1, characterized in that: The macro channel heat dissipation base limiting mechanism comprises a first screw hole (11) arranged on the bottom plate of the placement frame (1), and a positioning screw passes through the first screw hole (11).

5. The macro channel submodule packaging fixture according to claim 1, characterized in that: The positioning frame limiting mechanism comprises second screw holes (12) arranged on two side plates of the display frame (1), the screw holes (12) on the two side plates are arranged at the same height, and positioning screws pass through the screw holes (12).

6. The macro channel submodule packaging fixture according to claim 1, characterized in that: The pressure rods (6) have two parallel ones.

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