Surface mount type base surge protector and electronic equipment

By designing the chip-mounted surge protector and adopting a reflow soldering process, the tripping problem caused by the excessive temperature of the pin electrode during the welding process of the DIP packaged surge protector is solved, achieving higher production efficiency and product stability.

CN119726612APending Publication Date: 2025-03-28SHENZHEN HAIPENGXIN ELECTRONICS
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Patent Information

Application Number
CN202510122942.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-24
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

Excessive DIP package surge protectors have excessive pin electrode temperature during welding, which may cause the tripping solder joint to melt, affecting the electrical connection and mechanical stability of the product.

Method used

A chip base surge protector is designed, which is mounted using a reflow soldering process and is connected to the chip base through a plug-in module to prevent the trip solder joints in the plug-in module from being heated and melted.

Benefits of technology

It effectively avoids tripping during welding, improves production efficiency and mechanical stability of the product, and improves protection performance and product miniaturization capabilities.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a patch type base surge protector and electronic equipment, and the patch type base surge protector comprises a patch type base which is provided with a bottom wall, the patch type base is provided with a first contact elastic sheet and a second contact elastic sheet, one end, close to the bottom wall, of the first contact elastic sheet is provided with a first mounting plane parallel to the bottom wall, and the other end, close to the bottom wall, of the second contact elastic sheet is provided with a second mounting plane parallel to the bottom wall; one end, close to the bottom wall, of the second contact elastic sheet is provided with a second mounting plane parallel to the bottom wall; and the plugging module is provided with a first pin electrode and a second pin electrode, one end of the first pin electrode is in plugging connection with one end, far away from the bottom wall, of the first contact elastic sheet, and one end of the second pin electrode is in plugging connection with one end, far away from the bottom wall, of the second contact elastic sheet. According to the embodiment of the invention, the patch type base can be mounted on the circuit board by adopting a reflow soldering process, and the plugging module is inserted into the patch type base after the welding is completed, so that the tripping welding spot in the plugging module cannot be melted, the tripping phenomenon cannot be caused in the welding process, and the product miniaturization is facilitated.
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Description

Technical Field

[0001] The present application belongs to the field of electrical technology, and more specifically, relates to a patch-type base surge protector and an electronic device. Background Art

[0002] A surge protector (SPD) is a device used to protect electronic equipment from voltage surges or transient overvoltages. It is widely used in power systems, communications equipment, household appliances, and other fields. Traditional surge protectors typically use a DIP (Dual In-line Package) package, which offers the advantages of a simple structure and easy installation.

[0003] However, DIP-packaged surge protectors have some significant drawbacks in practical applications. Specifically, when connecting a DIP-packaged surge protector to a circuit, excessively high pin electrode temperatures during soldering can cause the tripping solder joints to melt, compromising the product's electrical connection and mechanical stability. This problem is particularly prominent on high-density circuit boards or in high-temperature environments, increasing the risk of product failure. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a surface mount base surge protector and an electronic device to solve the technical problem that the pin electrode temperature of the existing surge protector is too high during the welding process, which may cause the tripping solder joint to melt, thereby causing the risk of product failure.

[0005] To achieve the above objectives, the technical solution adopted in this application is: in the first aspect, a patch-type base surge protector is provided, comprising:

[0006] A patch-type base having a bottom wall, wherein a first contact spring and a second contact spring are provided on the patch-type base, wherein an end of the first contact spring close to the bottom wall has a first mounting plane parallel to the bottom wall, and an end of the second contact spring close to the bottom wall has a second mounting plane parallel to the bottom wall;

[0007] The plug-in module has a first pin electrode and a second pin electrode, one end of the first pin electrode is plug-in connected to the end of the first contact spring away from the bottom wall, and one end of the second pin electrode is plug-in connected to the end of the second contact spring away from the bottom wall.

[0008] In an optional embodiment of the first aspect, the plug-in module includes a housing and a mounting base, the mounting base is disposed in the housing, and the mounting base includes a partition perpendicular to the bottom wall and a first top plate and a bottom plate parallel to the bottom wall;

[0009] The partition, the first top plate and the bottom plate divide the space inside the housing into a first cavity and a second cavity facing away from each other, and a third cavity on a side of the first cavity and the second cavity away from the bottom wall;

[0010] A varistor is disposed in the first cavity; the other end of the first pin electrode and the other end of the second pin electrode are disposed in the second cavity; and a tripping electrode and a tripping mechanism are disposed in the third cavity.

[0011] In an optional implementation manner of the first aspect, the varistor has a first electrode and a second electrode, the first electrode extends into the third cavity, and the second electrode passes through the partition and is located in the second cavity;

[0012] The other end of the first pin electrode is connected to one end of the trip electrode via a wire;

[0013] The other end of the trip electrode is welded to the first electrode;

[0014] The other end of the second pin electrode is connected to the second electrode;

[0015] The tripping mechanism is used to change the varistor from a first state to a second state, wherein the first state is a state in which the other end of the tripping electrode contacts the first electrode, and the second state is a state in which the other end of the tripping electrode is separated from the first electrode.

[0016] In an optional implementation of the first aspect, the tripping mechanism includes a tension spring, a compression spring, and a slider;

[0017] The tripping electrode is rotatably connected to the first top plate, one end of the tension spring is fixed to the first top plate, and the other end of the tension spring is connected to the tripping electrode;

[0018] The first top plate is provided with a slide rail, and the slider is slidably provided on the slide rail;

[0019] A first protrusion and a first limit plate are provided on the slider, a second limit plate is provided on the first top plate, and the compression spring is located between the first limit plate and the second limit plate; when the piezoresistor is in the first state, the first protrusion abuts against the other section of the trip electrode, and when the piezoresistor is in the second state, the first protrusion is located between the trip electrode and the first electrode.

[0020] In an optional implementation of the first aspect, the first alarm electrode and the second alarm electrode are further included; the slider is further provided with a second protrusion extending into the second cavity;

[0021] One end of the first alarm electrode and one end of the second alarm electrode are located in the second cavity, and when the piezoresistor is in the first state, one end of the first alarm electrode and one end of the second alarm electrode are in contact with each other and abut against the second bump, and when the piezoresistor is in the second state, one end of the first alarm electrode and one end of the second alarm electrode are separated;

[0022] The patch-type base is further provided with a third contact spring and a fourth contact spring that are plug-in connected to the other end of the first alarm electrode and the other end of the second alarm electrode.

[0023] In an optional embodiment of the first aspect, the end of the third contact spring close to the bottom wall has a third mounting plane parallel to the bottom wall, and the end of the fourth contact spring close to the bottom wall has a fourth mounting plane parallel to the bottom wall.

[0024] In an optional embodiment of the first aspect, the housing has a second top plate arranged opposite to the first top plate; a window is provided on the second top plate, and when the varistor is in the first state, the window is opposite to the slider; when the varistor is in the second state, the window is opposite to the slide rail.

[0025] In an optional implementation of the first aspect, silica gel is disposed in the first cavity.

[0026] In an optional implementation of the first aspect, the housing is snap-connected to the mounting seat.

[0027] In an optional implementation of the first aspect, a first anti-slip structure is provided between the patch-type base and the plug-in module.

[0028] In an optional embodiment of the first aspect, the first anti-drop structure includes a first buckle provided on the plug-in module, and a first slot provided on the patch-type base and cooperating with the first buckle.

[0029] In an optional implementation of the first aspect, a second anti-slip structure is provided between the first contact spring piece, the second contact spring piece, and the patch-type base.

[0030] In an optional embodiment of the first aspect, a first mounting hole and a second mounting hole are provided on the patch-type base, and the second anti-detachment structure includes a first boss provided in the first mounting hole, a second boss provided in the second mounting hole, a third slot provided on the first contact spring sheet and cooperating with the first boss, and a fourth slot provided on the second contact spring sheet and cooperating with the second boss.

[0031] In a second aspect, an electronic device is provided, comprising the patch-type base surge protector as described in any one of the first aspects.

[0032] The beneficial effects of the embodiments of the present application are as follows: the embodiments of the present application can use a reflow soldering process to mount the patch base onto the circuit board, and then insert the plug-in module into the patch base after the soldering is completed, so that the tripping solder joints in the plug-in module will not melt, and thus will not cause tripping during the soldering process. The use of a reflow soldering process can greatly improve production efficiency, reduce labor costs, and facilitate installation. The patch base surge protector of the embodiment of the present application can also increase the area of ​​the first mounting plane and the second mounting plane without increasing the volume of the product, which is conducive to product miniaturization, and the larger area of ​​the first mounting plane and the second mounting plane also enables the patch base to withstand higher current shocks, thereby improving the overall protection performance. The plug-in connection design between the plug-in module and the patch base makes the replacement and maintenance of the plug-in module more convenient, and the stability of the electrical connection can also be effectively guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] Figure 1 A schematic diagram of the structure of a patch-type base surge protector provided in an embodiment of the present application;

[0035] Figure 2 A schematic diagram of the structure of the plug-in module provided in an embodiment of the present application;

[0036] Figure 3 An exploded view of the patch-type base provided in an embodiment of the present application;

[0037] Figure 4 A top view of the patch-type base provided in an embodiment of the present application;

[0038] Figure 5 for Figure 4 AA section view in;

[0039] Figure 6 Schematic diagram of the explosion structure of the patch-type base surge protector provided in the embodiment of the present application Figure 1 ;

[0040] Figure 7 Schematic diagram of the explosion structure of the patch-type base surge protector provided in the embodiment of the present application Figure 2 ;

[0041] Figure 8 A top view of a housing assembly provided in an embodiment of the present application;

[0042] Figure 9 for Figure 8 BB section in the figure;

[0043] Figure 10 Schematic diagram of the structure of the plug-in module with the shell removed provided in the embodiment of the present application Figure 1 ;

[0044] Figure 11 Schematic diagram of the structure of the plug-in module with the shell removed provided in the embodiment of the present application Figure 2 ;

[0045] Figure 12 A schematic diagram of the structure of a varistor provided in an embodiment of the present application;

[0046] Figure 13 Schematic diagram of the structure of the mounting base provided in the embodiment of the present application Figure 1 ;

[0047] Figure 14 Schematic diagram of the structure of the mounting base provided in the embodiment of the present application Figure 2 ;

[0048] Figure 15 A schematic diagram of the structure of the trip electrode provided in an embodiment of the present application;

[0049] Figure 16 A schematic structural diagram of a slider provided in an embodiment of the present application.

[0050] Among them, the reference numerals in the figures are:

[0051] 1- SMD base, 101- bottom wall, 102- top wall, 103- first card slot, 104- first mounting hole, 105- first boss, 106- second mounting hole, 107- second boss, 108- first positioning slot, 109- third mounting hole, 110- third boss, 111- fourth mounting hole, 112- fourth boss, 2- mounting seat, 201- partition, 202- first top plate, 203- second buckle, 204- first pillar, 20 5-rotating shaft, 206-slide rail, 207-second limiting plate, 208-first positioning column, 209-baffle, 210-second through hole, 211-notch, 212-second positioning column, 213-bottom plate, 214-first avoidance groove, 215-second avoidance groove, 216-third avoidance groove, 217-fourth avoidance groove, 218-gap, 3-housing, 301-first buckle, 302-second slot, 303-second top plate, 304-window, 3 05-support foot, 4-first pin electrode, 5-second pin electrode, 6-slider, 601-first bump, 602-second bump, 603-first limit plate, 7-copper braid, 8-piezoresistor, 801-first electrode, 802-second electrode, 803-first through hole, 804-second positioning groove, 9-tripping electrode, 901-axis hole, 902-hook, 10-compression spring, 11-tension spring, 12-first alarm electrode, 13- Second alarm electrode, 14-plug-in module, 15-first contact spring, 151-first mounting plane, 152-third card slot, 16-second contact spring, 161-second mounting plane, 162-fourth card slot, 17-third contact spring, 171-third mounting plane, 172-fifth card slot, 18-fourth contact spring, 181-fourth mounting plane, 182-sixth card slot, 19-first cavity, 20-second cavity, 21-third cavity. DETAILED DESCRIPTION

[0052] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0053] In the description of the embodiments of the present application, the term "plurality" refers to more than two (including two).

[0054] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0055] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0056] It should be understood that in the embodiments of the present application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as a form of connection between different components in a circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals.

[0057] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0059] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0060] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments in any suitable manner.

[0061] Currently, when connecting a traditional DIP (Dual In-line Package) surge protector to a circuit, excessively high pin electrode temperatures during welding may cause the tripping solder joints to melt, thereby affecting the electrical connection and mechanical stability of the product. To this end, the present application embodiment designs a SMD base surge protector. Please refer to Figure 1-Figure 3 The chip-type base surge protector includes: a chip-type base 1, having a bottom wall 101, on which a first contact spring 15 and a second contact spring 16 are provided, wherein an end of the first contact spring 15 close to the bottom wall 101 has a first mounting plane 151 parallel to the bottom wall 101, and an end of the second contact spring 16 close to the bottom wall 101 has a second mounting plane 161 parallel to the bottom wall 101; a plug-in module 14, having a first pin electrode 4 and a second pin electrode 5, wherein one end of the first pin electrode 4 is pluggably connected to an end of the first contact spring 15 away from the bottom wall 101, and one end of the second pin electrode 5 is pluggably connected to an end of the second contact spring 16 away from the bottom wall 101.

[0062] See also Figure 1 The bottom wall 101 of the patch base 1 is located in the plane where the ZO direction is located. When the patch base 1 is installed, the bottom wall 101 is the side facing the circuit board.

[0063] It should be noted that the chip base surge protector of the embodiment of the present application is soldered differently from the existing DIP surge protector. The existing DIP surge protector adopts wave soldering, while the chip base surge protector of the present application can adopt a reflow soldering process. Reflow soldering is to mount the chip base 1 on the circuit board, melt the solder by high-temperature gas to achieve welding, and then insert the plug-in module 14 into the chip base 1 after welding is completed. Since only the chip base 1 is exposed to the high-temperature gas during the welding process, and the tripping solder points in the plug-in module 14 are not heated, the tripping solder points in the plug-in module 14 will not melt, and will not cause tripping during the welding process. In addition, the use of the reflow soldering process can greatly improve production efficiency, reduce labor costs and facilitate installation.

[0064] The SMD base surge protector of the present embodiment can increase the area of ​​the first mounting plane 151 and the second mounting plane 161 without increasing the product's volume, facilitating product miniaturization. Furthermore, increasing the area of ​​the first mounting plane 151 and the second mounting plane 161 allows the SMD base 1 to be more firmly bonded to the circuit board during the reflow process, improving soldering reliability. The larger areas of the first mounting plane 151 and the second mounting plane 161 also enable the SMD base 1 to withstand higher current surges, enhancing overall protection performance.

[0065] The plug-in connection design between the plug-in module 14 and the patch base 1 makes the replacement and maintenance of the plug-in module 14 more convenient, and the stability of the electrical connection can also be effectively guaranteed.

[0066] As an optional implementation, a first anti-drop structure is provided between the patch base 1 and the plug-in module 14 .

[0067] For details, see Figure 2 、 Figure 3 The first anti-dropout structure includes a first latch 301 provided on the plug-in module 14 and a first slot 103 provided on the surface-mount base 1 and cooperating with the first latch 301. The first slot 103 is higher than the top wall 102 of the surface-mount base 1. When the first latch 301 is inserted into the first slot 103, it forms a secure locking state, preventing the plug-in module 14 from accidentally falling off.

[0068] Optionally, a support foot 305 is provided on one side of the plug-in module 14 close to the top wall 102 of the patch base 1, and a first positioning groove 108 corresponding to the support foot 305 is provided on the patch base 1. After the support foot 305 is inserted into the first positioning groove 108, the assembly firmness of the plug-in module 14 is further enhanced, and the first pin electrode 4 and the second pin electrode 5 can be prevented from shaking in the first contact spring 15 and the second contact spring 16.

[0069] As an optional embodiment, a second anti-slip structure is provided between the first contact spring 15 , the second contact spring 16 and the patch-type base 1 .

[0070] For details, see Figure 2-Figure 5The surface-mount base 1 is provided with a first mounting hole 104 and a second mounting hole 106. The second anti-slip structure includes a first boss 105 disposed within the first mounting hole 104, a second boss 107 disposed within the second mounting hole 106, a third retaining groove 152 disposed on the first contact spring 15 and cooperating with the first boss 105, and a fourth retaining groove 162 disposed on the second contact spring 16 and cooperating with the second boss 107. The assembly of the third retaining groove 152 with the first boss 105 and the fourth retaining groove 162 with the second boss 107 prevents the first and second contact springs 15 and 16 from becoming loose in the first and second mounting holes 104 and 106, thereby improving the stability and safety of the electrical connection.

[0071] As an optional implementation, see Figure 6-Figure 9 The plug-in module 14 includes a shell 3 and a mounting base 2. The mounting base 2 is arranged in the shell 3. The mounting base 2 includes a partition 201 perpendicular to the bottom wall 101 and a first top plate 202 and a bottom plate 213 parallel to the bottom wall 101; the partition 201, the first top plate 202 and the bottom plate 213 divide the space inside the shell 3 into a first cavity 19 and a second cavity 20 that are opposite to each other, and a third cavity 21 on the side of the first cavity 19 and the second cavity 20 away from the bottom wall 101; the varistor 8 is arranged in the first cavity 19; the other end of the first pin electrode 4 and the other end of the second pin electrode 5 are arranged in the second cavity 20; the tripping electrode 9 and the tripping mechanism are arranged in the third cavity 21.

[0072] See also Figure 6 The housing 3 is a box-shaped structure with one side open. The open side of the housing 3 is arranged opposite to the top wall 102 of the patch base 1. The housing 3 is provided with a second slot 302, and the mounting base 2 is provided with a second buckle 203 that cooperates with the second slot 302. The mounting base 2 is fixed in the housing 3 through the cooperation of the second buckle 203 and the second slot 302. The bottom plate 213, the partition plate 201, and the first top plate 202 of the mounting base 2 can be integrally formed.

[0073] In this embodiment, the varistor 8 is placed in the first cavity 19 and the first pin electrode 4 and the second pin electrode 5 are placed in the second cavity 20 , thereby effectively isolating electrical interference and improving protection performance.

[0074] As an optional implementation, see Figure 10 、 Figure 11The varistor 8 has a first electrode 801 and a second electrode 802. The first electrode 801 extends into the third cavity 21, and the second electrode 802 passes through the partition 201 and is located in the second cavity 20. The other end of the first pin electrode 4 is connected to one end of the tripping electrode 9 via a wire. The other end of the tripping electrode 9 is welded to the first electrode 801. The other end of the second pin electrode 5 is connected to the second electrode 802. The tripping mechanism is used to change the varistor 8 from a first state to a second state. The first state is a state in which the other end of the tripping electrode 9 is in contact with the first electrode 801, and the second state is a state in which the other end of the tripping electrode 9 is separated from the first electrode 801.

[0075] See also Figure 10 One end of the first lead electrode 4 and one end of the second lead electrode 5 pass through the bottom plate 213 of the mounting base 2 and are located outside the second cavity 20, for plugging and unplugging with the first contact spring 15 and the second contact spring 16. The other end of the first lead electrode 4 is located within the second cavity 20 and is electrically connected to one end of the trip electrode 9 via the copper braid 7.

[0076] See also Figure 11 The first top plate 202 is provided with a notch 211, the first electrode 801 of the varistor 8 extends through the notch 211 to the third cavity 21, and the first electrode 801 is provided with a first through hole 803 (see Figure 12 ), the other end of the tripping electrode 9 passes through the first through hole 803 and is soldered to the first electrode 801 with tin, and the soldering point is the tripping soldering point.

[0077] See also Figure 12 、 Figure 13 Optionally, a second positioning groove 804 is provided on the varistor 8, and a second positioning column 212 cooperating with the second positioning groove 804 is provided on the partition 201 to improve the stability and assembly accuracy of the varistor 8.

[0078] See also Figure 10 、 Figure 13 A second through hole 210 is provided on the partition 201 , and the second electrode 802 passes through the second through hole 210 and is soldered to the other end of the second pin electrode 5 with tin.

[0079] After the varistor 8 is installed, silica gel is poured into the first cavity 19 containing the varistor 8 to seal it, thereby completing the packaging of the varistor 8 .

[0080] The varistor 8 is a nonlinear element whose resistance changes significantly with voltage. It can effectively absorb transient overvoltages and protect the circuit from damage. Under normal operating voltage conditions, the varistor 8 maintains a high resistance state and is almost non-conductive. At this time, the varistor 8 is in a first state, i.e., the other end of the tripping electrode 9 is in contact with the first electrode 801. When the varistor 8 deteriorates or is subjected to overvoltage for a long time, the resistance of the varistor 8 decreases, and the current is quickly discharged to prevent voltage shocks. During this process, the varistor 8 heats up, and the welding point between the other end of the tripping electrode 9 and the first electrode 801 is heated and melted. The varistor 8 switches to the second state, i.e., the other end of the tripping electrode 9 is separated from the first electrode 801, thereby cutting off the circuit and preventing damage to the equipment in the circuit.

[0081] As an optional implementation, see Figure 10 、 Figure 11 The tripping mechanism includes a tension spring 11, a compression spring 10 and a slider 6; the tripping electrode 9 is rotatably connected to the first top plate 202, one end of the tension spring 11 is fixed on the first top plate 202, and the other end of the tension spring 11 is connected to the tripping electrode 9; a slide rail 206 is provided on the first top plate 202, and the slider 6 is slidably provided on the slide rail 206; a first protrusion 601 and a first limit plate 603 are provided on the slider 6, and a second limit plate 207 is provided on the first top plate 202, and the compression spring 10 is located between the first limit plate 603 and the second limit plate 207; in the first state of the varistor 8, the first protrusion 601 abuts against the other end of the tripping electrode 9, and in the second state of the varistor 8, the first protrusion 601 is located between the tripping electrode 9 and the first electrode 801.

[0082] See also Figure 14 、 Figure 15 A rotating shaft 205 is provided on the first top plate 202 , and an axial hole 901 matching with the rotating shaft 205 is provided on the tripping electrode 9 . The tripping electrode 9 is connected to the rotating shaft 205 through the axial hole 901 .

[0083] See also Figure 14 、 Figure 15 A first pillar 204 is also provided on the first top plate 202, one end of the tension spring 11 is sleeved on the first pillar 204, a hook 902 is provided on the tripping electrode 9, and the other end of the tension spring 11 is sleeved on the hook 902. When the varistor 8 is in the first state, the tension spring 11 remains in a stretched state.

[0084] See also Figure 14 、 Figure 16, a group of parallel slide rails 206 are provided on the first top plate 202, and the slider 6 can slide along the slide rails 206. There is a gap 218 in the middle of a group of parallel slide rails 206, and the compression spring 10 is located in the gap 218. The first limit plate 603 is located at one end of the gap 218 close to the first electrode 801, and the second limit plate 207 is located at the end of the gap 218 away from the first electrode 801. The compression spring 10 is located between the first limit plate 603 and the second limit plate 207. When the varistor 8 is in the first state, the compression spring 10 is in a compressed state, and the first protrusion 601 is tightly against the tripping electrode 9; when the varistor 8 is subjected to an overvoltage, the varistor 8 heats up, causing the solder joint between the other end of the tripping electrode 9 and the first electrode 801 to become detached, and the tripping electrode 9 rotates around the axis 205 under the tension of the tension spring 11. Figure 10 The first top plate 202 rotates clockwise, disengaging the other end of the trip electrode 9 from the first through-hole 803 of the first electrode 801. Under the elastic force of the compression spring 10, the first protrusion 601 of the slider 6 moves along the slide rail 206, thereby engaging between the first electrode 801 and the other end of the trip electrode 9. This cuts off the low-current arc, achieving a safety trip failure. Optionally, a baffle 209 is provided on the first top plate 202. Baffle 209 is located on the side of the first electrode 801 away from the slide rail 206 to prevent excessive movement of the slider 6.

[0085] As an optional implementation, see Figure 6 、 Figure 7 The SMD-type surge protector of the embodiment of the present application further includes a first alarm electrode 12 and a second alarm electrode 13; the slider 6 is further provided with a second bump 602 extending into the second cavity 20; one end of the first alarm electrode 12 and one end of the second alarm electrode 13 are located within the second cavity 20. When the varistor 8 is in the first state, one end of the first alarm electrode 12 and one end of the second alarm electrode 13 contact and abut against the second bump 602. When the varistor 8 is in the second state, one end of the first alarm electrode 12 and one end of the second alarm electrode 13 are separated. The SMD-type base 1 is also provided with a third contact spring 17 and a fourth contact spring 18 that are pluggable and connected to the other end of the first alarm electrode 12 and the other end of the second alarm electrode 13.

[0086] See also Figure 14 A plurality of positioning posts 208 may be provided on the partition 201 within the second cavity 20 for positioning the two warning electrodes within the second cavity 20. The bottom plate 213 of the mounting base 2 is further provided with a first avoidance groove 214 for one end of the first pin electrode 4 to pass through, a second avoidance groove 215 for one end of the second pin electrode 5 to pass through, a third avoidance groove 216 for the other end of the first warning electrode 12 to pass through, and a fourth avoidance groove 217 for the other end of the second warning electrode 13 to pass through.

[0087] See also Figure 10 When the varistor 8 is in the first state, one end of the first alarm electrode 12 contacts one end of the second alarm electrode 13 and abuts the second bump 602, achieving remote signal closure and normal operation of the alarm system. When the varistor 8 changes to the second state, the first alarm electrode 12 and the second alarm electrode 13 separate, breaking the closed circuit and achieving remote signal opening. The alarm system triggers an alarm signal, indicating equipment abnormality, ensuring timely processing and preventing safety accidents.

[0088] See also Figure 3 The patch base 1 is also provided with a third mounting hole 109 for mounting the third contact spring 17, and a fourth mounting hole 111 for mounting the fourth contact spring 18. Optionally, a third boss 110 is further provided on the side wall of the third mounting hole 109, and the third contact spring 17 is further provided with a fifth slot 172 that cooperates with the third boss 110. A fourth boss 112 is provided on the side wall of the fourth mounting hole 111, and the fourth contact spring 18 is provided with a sixth slot 182 that cooperates with the fourth boss 112. The assembly of the fifth slot 172 with the third boss 110, and the assembly of the sixth slot 182 with the fourth boss 112, prevents the third contact spring 17 and the fourth contact spring 18 from loosening in the third mounting hole 109 and the fourth mounting hole 111, thereby improving the stability and safety of the electrical connection.

[0089] As an optional implementation, see Figure 1 The end of the third contact spring 17 close to the bottom wall 101 has a third mounting plane 171 parallel to the bottom wall 101 , and the end of the fourth contact spring 18 close to the bottom wall 101 has a fourth mounting plane 181 parallel to the bottom wall 101 .

[0090] In this embodiment, a third mounting plane 171 and a fourth mounting plane 181 are provided on the third contact spring 17 and the fourth contact spring 18 to increase the contact area between the third contact spring 17 and the fourth contact spring 18 and the circuit board, and secure welding with the circuit board can be achieved through a reflow soldering process.

[0091] As an optional implementation, see Figure 8 、 Figure 9 The housing 3 has a second top plate 303 arranged opposite to the first top plate 202; a window 304 is provided on the second top plate 303, and when the varistor 8 is in the first state, the window 304 is opposite to the slider 6; when the varistor 8 is in the second state, the window 304 is opposite to the slide rail 206.

[0092] Optionally, the slider 6 is green and the rail 206 is red. When the varistor 8 is in the second state, it will be red as seen from the window 304, indicating that the varistor 8 needs to be replaced. In addition, the color difference design of the slider 6 and the rail 206 makes it easier for operators to quickly identify the device status, avoid misjudgment, and ensure maintenance efficiency.

[0093] This embodiment can achieve dual warnings through the provision of the alarm electrode and the window 304, triggering the alarm through electrical signals and intuitively displaying it through visual prompts, thereby further improving the reliability of equipment safety management.

[0094] An embodiment of the present application further provides an electronic device, which includes the above-mentioned patch-type base surge protector.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A patch-type base surge protector, characterized in that: include: A patch-type base, having a bottom wall, on which a first contact spring and a second contact spring are arranged, wherein an end of the first contact spring close to the bottom wall has a first mounting plane parallel to the bottom wall, and an end of the second contact spring close to the bottom wall has a second mounting plane parallel to the bottom wall; The plug-in module has a first pin electrode and a second pin electrode, wherein one end of the first pin electrode is plug-in connected to an end of the first contact spring away from the bottom wall, and one end of the second pin electrode is plug-in connected to an end of the second contact spring away from the bottom wall.

2. The SMD base surge protector according to claim 1, characterized in that: The plug-in module comprises a housing and a mounting seat, wherein the mounting seat is arranged in the housing, and the mounting seat comprises a partition plate perpendicular to the bottom wall and a first top plate and a bottom plate parallel to the bottom wall; The partition, the first top plate and the bottom plate divide the space inside the shell into a first cavity and a second cavity facing away from each other, and a third cavity on a side of the first cavity and the second cavity away from the bottom wall; A varistor is disposed in the first cavity; the other end of the first pin electrode and the other end of the second pin electrode are disposed in the second cavity; and a tripping electrode and a tripping mechanism are disposed in the third cavity.

3. The SMD base surge protector according to claim 2, characterized in that: The varistor comprises a first electrode and a second electrode, the first electrode extends into the third cavity, and the second electrode passes through the partition and is located in the second cavity; The other end of the first pin electrode is connected to one end of the trip electrode through a wire; The other end of the tripping electrode is welded to the first electrode; The other end of the second pin electrode is connected to the second electrode; The tripping mechanism is used to change the varistor from a first state to a second state, wherein the first state is a state in which the other end of the tripping electrode is in contact with the first electrode, and the second state is a state in which the other end of the tripping electrode is separated from the first electrode.

4. The SMD base surge protector according to claim 3, characterized in that: The tripping mechanism comprises a tension spring, a compression spring and a slider; The tripping electrode is rotatably connected to the first top plate, one end of the tension spring is fixed to the first top plate, and the other end of the tension spring is connected to the tripping electrode; The first top plate is provided with a slide rail, and the slider is slidably arranged on the slide rail; The slider is provided with a first protrusion and a first limit plate, the first top plate is provided with a second limit plate, and the compression spring is located between the first limit plate and the second limit plate; when the varistor is in the first state, the first protrusion abuts against the other section of the tripping electrode, and when the varistor is in the second state, the first protrusion is located between the tripping electrode and the first electrode.

5. The SMD base surge protector according to claim 4, characterized in that: It also includes a first warning electrode and a second warning electrode; the slider is also provided with a second protrusion extending into the second cavity; One end of the first warning electrode and one end of the second warning electrode are located in the second cavity, one end of the first warning electrode and one end of the second warning electrode are in contact with each other and abut against the second bump when the varistor is in the first state, and one end of the first warning electrode and one end of the second warning electrode are separated when the varistor is in the second state; The patch-type base is also provided with a third contact spring and a fourth contact spring which are plug-in-plug connected to the other end of the first warning electrode and the other end of the second warning electrode.

6. The SMD base surge protector according to claim 5, characterized in that: One end of the third contact spring sheet close to the bottom wall has a third mounting plane parallel to the bottom wall, and one end of the fourth contact spring sheet close to the bottom wall has a fourth mounting plane parallel to the bottom wall.

7. The SMD base surge protector according to claim 4, characterized in that: The housing has a second top plate arranged opposite to the first top plate; a window is arranged on the second top plate, and when the varistor is in the first state, the window is opposite to the slider; when the varistor is in the second state, the window is opposite to the slide rail.

8. The SMD base surge protector according to claim 2, characterized in that: Silica gel is arranged in the first cavity.

9. The SMD base surge protector according to claim 2, characterized in that: The shell is snap-connected to the mounting seat.

10. The SMD base surge protector according to any one of claims 1 to 9, characterized in that: A first anti-drop structure is provided between the patch-type base and the plug-in module.

11. The SMD base surge protector according to claim 10, characterized in that: The first anti-drop structure includes a first buckle arranged on the plug-in module, and a first slot arranged on the patch-type base and matched with the first buckle.

12. The SMD base surge protector according to any one of claims 1 to 9, characterized in that: A second anti-slip structure is provided between the first contact spring sheet, the second contact spring sheet and the patch-type base.

13. The SMD base surge protector according to claim 12, characterized in that: The patch-type base is provided with a first mounting hole and a second mounting hole, and the second anti-detachment structure includes a first boss arranged in the first mounting hole, a second boss in the second mounting hole, a third slot arranged on the first contact spring sheet and cooperating with the first boss, and a fourth slot arranged on the second contact spring sheet and cooperating with the second boss.

14. An electronic device, characterized in that: include: A chip base surge protector as claimed in any one of claims 1 to 13.