Crystal oscillator, production equipment and production process thereof

Abstract

The present invention discloses a crystal oscillator, a production device and a production process thereof, including a crystal oscillator with pins provided thereon, a chassis, a pressurizing unit and a corner bending unit are provided on the chassis. The pressurizing unit includes a cylinder body, a bearing table and a lifting member. The crystal oscillator is loaded on the bearing table, and the lifting member can drive the bearing table to move up and down. The bearing table moves up into the cylinder body, and the air pressure in the cylinder body increases. A detector is also provided on the bearing table, which contacts the pins to detect the resistance value of the crystal oscillator. The corner bending unit includes a bending block, and the bending block moves forward to abut against the pins. The present invention provides a crystal oscillator, a production device and a production process thereof, which can bend the pins when pressurizing and detecting the crystal oscillator, and then detect whether the crystal oscillator after bending is qualified. At the same time, after detecting a leaky crystal oscillator, the pins of the crystal oscillator are automatically cut off, and then the leaky crystal oscillator is marked and scrapped.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal oscillator production, in particular to crystal oscillators, production equipment for crystal oscillators, and production processes therefor. Background Art

[0002] A crystal oscillator, abbreviated as a crystal, is an electronic component that utilizes the piezoelectric effect of a quartz crystal to generate a highly accurate oscillation frequency. A crystal mainly consists of components such as a quartz wafer, a base, a housing, and pins. The base and the housing cooperate to hermetically encapsulate the quartz wafer, and airtightness detection is often required after encapsulation.

[0003] In the existing airtightness detection, after encapsulation is completed, the crystal is placed in a sealed container such as the sealed container disclosed in the patent document CN218524316U, the sealed container is pressurized, and the airtightness is judged by detecting the voltage change at the pins of the crystal. After the airtightness detection is completed, the pin bending of the crystal is carried out according to requirements.

[0004] The above process has the following problems: The airtightness of the crystal encapsulation may be damaged when bending the pins. Summary of the Invention

[0005] After the crystal is encapsulated, airtightness detection is carried out, and then the pins are bent. During the bending process, it is easy to damage the airtightness of the encapsulation, resulting in poor airtightness of the crystals leaving the factory.

[0006] The present invention provides a crystal oscillator, production equipment for a crystal oscillator, and a production process therefor in view of the deficiencies in the prior art.

[0007] To solve the above technical problems, the present invention is solved by the following technical solutions: A crystal oscillator, production equipment for a crystal oscillator, and a production process therefor. The crystal oscillator includes an encapsulation body for hermetically encapsulating a crystal vibration element. Pins are provided on the crystal vibration element, and the pins extend out of the encapsulation body and are bent.

[0008] The production equipment for a crystal oscillator includes a chassis. A pressurizing unit and a corner bending unit are provided on the chassis. The pressurizing unit includes a cylinder body, a bearing platform, and a lifting member. The crystal oscillator is loaded on the bearing platform. The lifting member can drive the bearing platform to move up and down. The bearing platform moves up into the cylinder body, and the air pressure in the cylinder body increases. A detector is also provided on the bearing platform. The detector contacts the pins to detect the resistance value of the crystal oscillator. The corner bending unit includes a bending block. The bending block moves forward and touches against the pins, and cooperates with a limit block on the lifting member to bend the pins.

[0009] The beneficial effect thereof is that the pins are bent when the airtightness of the crystal oscillator is detected under pressure, and then it is detected whether the crystal oscillator after bending is qualified.

[0010] In the above solution, preferably, an opening groove for loading the crystal oscillator is formed on the bearing platform, and a blocking block for blocking the opening groove is arranged on the lifting member.

[0011] In the above solution, preferably, a cutting block is elastically guided and slidably arranged on the bending block, and a locking member is arranged on the cutting block. The locking member can lock the cutting block and the bending block with each other or lock the cutting block and the blocking block with each other.

[0012] In the above solution, preferably, the locking member is a bidirectional telescopic rod, and locking holes are formed on both the upper end surface of the bending block and the lower end surface of the blocking block. The locking member expands and contracts up and down to lock the cutting block with the bending block or the blocking block respectively.

[0013] The beneficial effect is that after detecting a leaky crystal oscillator, the pins of the crystal oscillator are automatically cut off, and then the leaky crystal oscillator is marked and scrapped.

[0014] In the above solution, preferably, the detector can detect the resistance of the crystal oscillator, and the central controller controls the upward or downward extension of the locking member through the change of the resistance value.

[0015] In the above solution, preferably, the gap between the upper end surface of the bending block and the lower end surface of the limiting block is greater than the thickness of the pin.

[0016] In the above solution, preferably, the upper end surface of the cutting block is flush with the lower end surface of the limiting block, and the cutting block moves together with the bending block to cooperate with the limiting block to cut off the pin.

[0017] The production process of using a crystal oscillator production device

[0018] S1: The crystal oscillator is loaded on the bearing platform by a manipulator or manually, and the detector starts to monitor the crystal oscillator resistance R1.

[0019] S2: The lifting member pushes the bearing platform into the cylinder to increase the air pressure in the cylinder, and the lifting member stops moving after the air pressure rises to - standard atmospheric pressure. The detector measures the crystal oscillator resistance R2.

[0020] S3: The bending block extends to cooperate with the limiting block to bend the pin, and the detector measures the crystal oscillator resistance R3.

[0021] In the above solution, preferably, in S2, if R2 > R1 and it is determined that the crystal oscillator leaks air, the locking member is controlled to lock the cutting block and the bending block, and the pin is cut off through S3.

[0022] On the contrary, the locking member is controlled to lock the cutting block and the bearing platform, and S3 is normally carried out.

[0023] In the above solution, preferably, in the step S3, when R3 > R1 and it is determined that the crystal oscillator leaks air, the locking member is controlled to release the lock between the cutting block and the blocking block, and the cutting block cuts the pin under the action of the rear elastic member.

[0024] The beneficial effects of the present invention are as follows: The present invention provides a crystal oscillator, a production device and a production process thereof, which can bend the pins when pressurizing and detecting the crystal oscillator, and then detect whether the crystal oscillator after bending is qualified. At the same time, when a leaking crystal oscillator is detected, the pins of the crystal oscillator are automatically cut off, and then the leaking crystal oscillator is marked and scrapped. Description of the Drawings

[0025] Figure 1 Schematic diagram of the present invention.

[0026] Figure 2 Cross-sectional view of the present invention in the pressurized bending state.

[0027] Figure 3 Schematic diagram of the carrier and the lifting member of the present invention.

[0028] Figure 4 Schematic diagram of the bending angle unit of the present invention.

[0029] Figure 5 Schematic diagram of the carrier and the crystal oscillator after bending of the present invention.

[0030] Figure 6 Partial enlarged view of the bending angle unit in the pressurized bending state of the present invention.

[0031] Figure 7 Partial enlarged view of the release of the cutting block in the pressurized bending state of the present invention.

[0032] Figure 8 Schematic diagram of the cooperation of the locking member of the present invention. Detailed Description of the Invention

[0033] In this application, it is determined whether there is air leakage by the resistance change of the crystal oscillator under normal pressure and pressurized state, then the pins are bent, and at the same time, the resistance is detected, and it is determined whether the crystal oscillator after bending is qualified by comparing the resistance value change.

[0034] The following further describes the present invention in detail in conjunction with the drawings and the specific embodiments: Refer to Figures 1-8 ,

[0035] A crystal oscillator has a pin 11 provided thereon, and the pin 11 is in a bent state. The production equipment of the crystal oscillator includes a chassis, a detector, a pressurizing unit 2, and a corner bending unit 3. A platform plate is provided at the middle position of the chassis. The pressurizing unit 2 includes a cylinder body 21, a carrier table 22, and a lifting member 23. The cylinder body 21 is fixedly provided on the chassis 1 and is located above the platform plate. A guide rod is provided at the lower end of the carrier table 22, and the carrier table 22 is slidably provided on the platform plate through the guide rod in an up-and-down guiding manner, and the carrier table 22 is located directly below the cylinder body 21. The peripheral wall of the carrier table 22 fits with the inner peripheral wall of the inner cavity of the cylinder body 21, and the carrier table 22 moves inside the cylinder body 21 to perform a piston movement.

[0036] A support table is provided on the platform plate. In the initial state, the left and right sides of the carrier table 22 are pressed against the support table, so that there is a certain space between the bottom surface of the carrier table 22 and the platform plate. An opening groove 221 and a pin hole 222 are provided on the carrier table 22. The pin hole 222 is located at the rear end of the opening groove 221. The width of the opening groove 221 is greater than the width of the pin 11. The size of the pin hole 222 is the same as that of the pin 11. When the crystal oscillator is loaded on the carrier table 22, the package body of the crystal oscillator is pressed against the upper end surface of the carrier table 22, and the pin 11 is located in the pin hole 222. The opening groove 221 is used for the pin 11 of the crystal oscillator to be able to horizontally translate in and out. Especially after the pin 11 is bent, it can horizontally translate out of the carrier table in cooperation with the space left between the bottom surface of the carrier table 22 and the platform plate.

[0037] The lifting member 23 is a hydraulic cylinder, and its bottom end is provided at the bottom of the chassis. Its telescopic rod is slidably provided on the platform plate in a guiding manner. A blocking block 231 is provided at the top end of the telescopic rod. During the process of the telescopic rod extending upward, the blocking block 231 is inserted into the opening groove 221. At this time, the pin hole 222 is blocked by the pin 11 of the crystal oscillator, and the opening groove 221 is blocked by the blocking block 231, so that the plane of the carrier table 22 is in a complete state. A probe of the detector is provided on the side wall of the pin hole 222. At this time, the probe of the detector contacts the side wall of the pin 11, and then the resistance R1 is measured.

[0038] At this time, the telescopic rod continues to extend upward, driving the carrier table 22 to move upward together and enter the cylinder body 21. The carrier table 22 and the blocking block 231 together form a piston ring. During the upward movement in the cylinder body 21, the air above the carrier table 22 is compressed, so that the air pressure acting on the package body of the crystal oscillator 1 increases. When the air pressure in the cylinder body 1 rises to the required air pressure, preferably 3 - 4 standard atmospheric pressures, the control system of the equipment controls the lifting member 23 to stop rising, and the detector measures the resistance R2.

[0039] Since the crystal oscillator is encapsulated in a vacuum state, the interior of the encapsulated crystal oscillator 1 is in a vacuum state. If the encapsulation body of the crystal oscillator 1 is in a leaky state, under a pressurized state, compressed air will enter the encapsulation body, increasing the internal air pressure, and thus the measured resistance value R2 by the detector will be greater than R1.

[0040] The bent angle unit 3 includes a bending block 31, a cutting block 32, a locking member 33, and a pulling member 34. The pulling member 34 is an electric hydraulic cylinder, which is controlled by the central controller of the device to extend and retract back and forth. The pulling member 34 is fixedly arranged at the upper end of the telescopic rod of the lifting member 23. A linkage plate 341 is arranged at the front end of the telescopic rod of the pulling member 34. The bending block 31 is fixedly arranged on the linkage plate 341. When the pulling member 34 contracts, it drives the bending block 31 to move towards the pin hole 222. A guide post 342 is arranged on the linkage plate 341. The cutting block 32 is slidably arranged on the guide post 342 in a guiding manner, and a first elastic member 343 is sleeved on the guide post 342. The two ends of the first elastic member 343 respectively abut against the rear end of the cutting block 32 and the front end of the linkage plate 341, so that the cutting block 32 elastically abuts against the bending block 31. The locking member 33 is fixedly arranged in the cutting block 32. The locking member 32 is a two-way telescopic rod. When the lower end extends out of the cutting block 32, the upper end retracts into the cutting block 32. On the contrary, when the upper end extends out of the cutting block 32, the lower end retracts into the cutting block 32. And the locking head at the lower end of the locking member 32 is an elastic locking head, which can elastically abut against an obstacle when extending downward and encountering an obstacle, so that the locking head at the upper end of the locking member 32 can normally retract.

[0041] A limiting block 223 is further arranged on the bottom surface of the bearing platform 22. The limiting block 223 is located on one side of the pin 11, while the bending block 31 is located on the other side of the pin 11. The moving direction of the linkage plate 341 is towards the limiting block 223. There is a height difference between the upper end surface of the bending block 31 and the lower end surface of the limiting block 223. This height difference is greater than the thickness of the pin 11. Therefore, when the bending block 31 moves towards the limiting block 223, it can drive the pin 11 to bend.

[0042] The cutting edge of the cutting block 32 is flush with the lower end surface of the limiting block 223. Therefore, when the cutting block 32 moves towards the limiting block 223 and cooperates with the limiting block 223, the pin 11 can be cut.

[0043] When the bending block 31 moves towards the limiting block 223 under the action of the pulling member 34, it abuts against the pin 11. The upper end position of the pin 11 abuts against the limiting block 223 and thus does not deform, while the lower end deforms under the action of the bending block 31, thereby completing the bending process of the pin 11.

[0044] Locking holes are provided on the upper end surface of the bending block 31 and the bottom surface of the plugging block 231. The locking member 33 rises upward, and the upper locking head of the locking member 33 is inserted into the locking hole of the plugging block 231, so that the cutting block 32 is locked on the plugging block 231. When the bending block 31 moves forward, the cutting block 32 does not move, and the first elastic member 343 is compressed.

[0045] The locking member 33 extends downward, and the locking head at the lower end of the locking member 33 is inserted into the locking hole of the bending block 31, locking the cutting block 32 and the bending block 31 to each other. When the bending block 31 moves forward, the cutting block 32 also moves forward with the bending block 31. Then, during the forward movement, the cutting edge of the cutting block 32 cuts on the lead 11 to cut off the lead 11.

[0046] In the initial state, the locking member 33 rises upward. When the detector measures that the resistance R2 > R1, it is determined at this time that the package of the crystal oscillator 1 is air-leaking. Then, the central controller of the device controls the locking member 33 to extend downward, so that the cutting block 32 moves forward with the bending block, and automatically cuts off the lead 11 during the bending process, thereby marking the air-leaking crystal oscillator and performing scrap treatment.

[0047] After the normal bending process, the detector measures the resistance R3. Since the inside of the packaged crystal oscillator 1 is in a vacuum state, during the bending of the lead 11, the package leaks air, and the air pressure in the external environment is greater than the internal air pressure. Therefore, the external air will enter the package, causing the internal air pressure to rise, and thus the measured R3 will also be greater than R1. Through reverse reasoning, when R3 is greater than R1, it is determined that the crystal oscillator 1 leaks air when the lead 11 is bent.

[0048] The locking head at the lower end of the locking member 33 is an elastic locking head. When R3 is greater than R1, the central processor of the device controls the locking member 33 to expand and contract downward. At this time, the lower locking head is not aligned with the locking hole, so the lower locking head elastically touches the bending block 31, and the upper locking head retracts into the cutting block 32. The cutting block 32 is unlocked from the carrier 22. At this time, the elastic force of the first elastic member 343 is released, pushing the cutting block 32 to move toward the lead 11, thereby cutting off the lead 11, and also marking the air-leaking crystal oscillator 1 and performing scrap treatment.

[0049] Its working principle or usage method is as follows:

[0050] First, the crystal oscillator 1 is loaded on the carrier 22 by a manipulator or manually. The lead 11 is located in the lead hole 222. The lifting member 23 extends upward, so that the plugging block 231 is inserted into the opening groove 221, and the plane of the carrier 22 is in a complete state. At this time, the detector measures the crystal oscillator resistance as R1.

[0051] The lifting member 23 continues to rise, and the carrier 22 and the cylinder 21 cooperate to form a piston device, increasing the air pressure in the package of the crystal oscillator 1 located on the upper end face of the carrier 22. After reaching the set air pressure, the resistance R2 is measured.

[0052] When R2 > R1, it is determined that the package of the crystal oscillator 1 is air-leaking. The central controller of the device controls the locking member 33 to extend downward, and the cutting block 32 is locked with the bending block 31. The cutting block 32 moves together with the bending block 31 and automatically cuts off the lead 11 during the bending process, thereby identifying and scrapping the air-leaking crystal oscillator.

[0053] Conversely, the locking member 33 rises upward, the cutting block 32 is locked on the carrier 22, and the bending block 31 moves toward the limiting block 223 under the action of the pulling member 34. The cutting block 32 does not move. The bending block 31 touches the lead 11, and the upper end position of the lead 11 touches the limiting block 223 and thus does not deform. The lower end deforms under the action of the bending block 31, thereby completing the bending process of the lead 11. After the bending process is completed, the detector measures the crystal oscillator resistance as R3.

[0054] When R3 > R1, it is determined that the crystal oscillator 1 is air-leaking during the bending of the lead 11. The central processor of the device controls the locking member 33 to extend and retract downward, so that the cutting block 32 is unlocked from the carrier 22, and the elastic force of the first elastic member 343 is released, pushing the cutting block 32 to move toward the lead 11, thereby cutting off the lead 11, and also identifying and scrapping the air-leaking crystal oscillator 1.

[0055] Conversely, after the bending work is completed, first the pulling member 34 is reset, and then the lifting member 23 is reset, so that the left and right sides of the carrier 22 are pressed against the support table. The lifting member 23 continues to reset downward, and the blocking block 231 moves downward away from the opening groove 221, so that the bent crystal oscillator 1 can be taken out outward from the opening groove 221.

[0056] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. The production process of a crystal oscillator, characterized in that: The crystal oscillator includes a package body (12) for hermetically encapsulating a crystal vibration element. Pins (11) are provided on the crystal vibration element, and the pins extend out of the package body (12) and are bent. It includes production equipment. The production equipment includes a chassis, on which a pressing unit (2) and a corner bending unit (3) are provided. The pressing unit (2) includes a cylinder body (21), a carrier table (22), and a lifting member (23). The crystal oscillator (1) is loaded on the carrier table (22), and the lifting member (23) can drive the carrier table (22) to move up and down. The carrier table (22) moves up into the cylinder body (21), and the air pressure in the cylinder body (21) increases. A detector is also provided on the carrier table (22). The detector contacts the pins (11) to detect the resistance value of the crystal oscillator (1). The corner bending unit (3) includes a bending block (31). The bending block (31) is slidably arranged at the upper end of the telescopic rod of the lifting member (23). The bending block (31) slides forward and abuts against the pins (11), and can cooperate with a limit block (223) on the bottom surface of the carrier table (22) to bend the pins (11). Production process S1: The crystal oscillator (1) is loaded on the carrier table (22) by a manipulator or manually, and the detector starts to monitor the crystal oscillator resistance R1. S2: The lifting member (23) pushes the carrier table (22) into the cylinder body (21) to increase the air pressure in the cylinder body (21). The lifting member (23) stops moving after the air pressure rises to 2 - 5 standard atmospheric pressures, and the detector measures the crystal oscillator resistance R2. S3: The bending block (31) extends out and cooperates with the limit block (223) to bend the pins (11), and the detector measures the crystal oscillator resistance R3. In S2, if R2 > R1, it is determined that the crystal oscillator (1) leaks air, then the locking member (33) is controlled to lock the cutting block (32) and the bending block (31), and the pins (11) are cut off through S3. Otherwise, the locking member (33) is controlled to lock the cutting block (32) and the carrier table (22), and S3 is carried out normally. In S3, if R3 > R1, it is determined that the crystal oscillator (1) leaks air during the bending process, then the locking member (33) is controlled to release the lock between the cutting block (32) and the plugging block (231), and the cutting block (32) cuts off the pins (11) under the action of the rear elastic member.

2. The production process of the crystal oscillator according to claim 1, characterized in that: An opening groove (221) for loading the crystal oscillator (1) is provided on the carrier table (22), and a plugging block (231) for plugging the opening groove (221) is provided on the lifting member (23).

3. The production process of the crystal oscillator according to claim 2, characterized in that: A cutting block (32) is elastically and slidably arranged on the bending block (31). A locking member (33) is provided on the cutting block (32). The locking member (33) can lock the cutting block (32) and the bending block (31) to each other or lock the cutting block (32) and the plugging block (231) to each other.

4. The production process of the crystal oscillator according to claim 3, characterized in that: The locking member (33) is a bidirectional telescopic rod. Locking holes are provided on the upper end surface of the bending block (31) and the lower end surface of the plugging block (231). The locking member (33) expands and contracts up and down to lock the cutting block (32) to the bending block (31) or the plugging block (231) respectively.

5. The production process of the crystal oscillator according to claim 4, characterized in that: The detector can detect the resistance of the crystal oscillator (1), and the central controller controls the upward or downward extension of the locking member (33) according to the change in resistance value.

6. The production process of the crystal oscillator according to claim 4, characterized in that: The gap between the upper end face of the bending block (31) and the lower end face of the limiting block (223) is greater than the thickness of the pin (11).

7. The production process of the crystal oscillator according to claim 4, characterized in that: The upper end face of the cutting block (32) is flush with the lower end face of the limiting block (223). The cutting block (32) moves together with the bending block (31) and cooperates with the limiting block (223) to cut off the pin (11).

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