Miniature loudspeaker and circuit system

Abstract

The invention relates to a miniature loudspeaker, which comprises a sensing chip, a diaphragm, a diaphragm, a loudspeaker body and a loudspeaker body, and is characterized in that the sensing chip is manufactured through a semiconductor manufacturing process; the control chip is manufactured through a semiconductor manufacturing process and is electrically connected with the sensing chip; a gap for the sensing chip to bear the vibration diaphragm to move is formed between the magnetic element and the sensing chip; wherein the control chip is used for receiving an electrical signal, the polarity of the electrical signal is changed and input to the sensing chip so as to form a variable magnetic field on the sensing chip, a force for driving the vibrating diaphragm to move is formed between the magnetic element and the sensing chip, and the moving vibrating diaphragm generates sound waves output by the miniature loudspeaker. An induction chip formed by a micro coil element is manufactured through a semiconductor manufacturing process, and the purpose of microminiaturization of the loudspeaker is achieved.

Description

Technical Field

[0001] The invention relates to a micro speaker, in particular to a micro speaker and circuit system formed by a packaged control chip and a sensing chip formed by metal micro segments. Background Art

[0002] Speakers are important sound-generating components in electronic devices. The working principle of speakers is to convert electrical signals into sound wave signals. With the demand for miniaturization of electronic devices, speakers also need to be miniaturized.

[0003] The current speaker structure generally includes a magnet, a conductive coil and a diaphragm connected to the conductive coil. When the conductive coil is energized, a magnetic field is generated, thereby changing the force exerted on the conductive coil in the magnetic field of the magnet. When the current flowing through the conductive coil changes, the force exerted on the conductive coil will also change, causing vibration. At the same time, the diaphragm connected to the conductive coil also vibrates, thereby making a sound and completing the conversion of electrical signals into acoustic signals.

[0004] In the current speaker structure, the magnet and the conductive coil constitute its magnetic structure, which occupies a large space, making the speaker structure larger, so that its use in handheld electronic devices and ultra-thin electronic devices is subject to certain restrictions. Therefore, how to provide a miniaturized speaker structure to meet the ultra-thin or miniaturized requirements of the electronic devices in which it is used has become an urgent problem to be solved. Summary of the invention

[0005] The present invention provides a micro-speaker and a circuit system, wherein the components in the micro-speaker are manufactured by semiconductor process to achieve the purpose of miniaturization.

[0006] A micro speaker, comprising: The sensor chip is manufactured through a semiconductor process and connected to the diaphragm; A control chip, formed by a semiconductor process and electrically connected to the sensor chip; and A magnetic element has a gap with the sensing chip to allow the sensing chip to carry the movement of the diaphragm; The control chip is used to receive electrical signals, change the polarity of the electrical signals and input them to the sensing chip to form a changing magnetic field in the sensing chip, thereby forming a force between the sensing chip and the magnetic element to drive the diaphragm to move. The moving diaphragm generates sound waves output by the micro speaker.

[0007] Furthermore, it also includes a substrate, on which a sensing circuit layer having a sensing chip is formed by a semiconductor process, and there is the gap between the magnetic attraction element and the sensing circuit layer; the control chip is formed on a control circuit layer by a semiconductor process.

[0008] Furthermore, the sensing circuit layer and the control circuit layer are formed on the substrate in the same layer by a semiconductor process.

[0009] Furthermore, a connection layer is formed on the sensing circuit layer, the control circuit layer is formed on the connection layer in a stacked manner using a semiconductor process, and one or more control chips in the micro speaker are formed in the control circuit layer; the control chip is electrically connected to the sensing chip through the connection layer.

[0010] Furthermore, the sensing circuit layer is exposed to one or more precursors by chemical vapor deposition process to form the connection layer by chemical reaction deposition.

[0011] Furthermore, the connection layer is a structure formed of insulating material on the sensing circuit layer, and a guide hole is formed in the insulating material using silicon through-hole technology; then the control circuit layer is formed on the insulating material, and the guide hole is used to electrically connect the sensing circuit layer and the control circuit layer.

[0012] Furthermore, the magnetic element is a magnet, a magnetic material or is manufactured by a semiconductor process.

[0013] Furthermore, a carrier board is provided in the micro speaker, and a control circuit layer having one or more control chips is formed on the carrier board by a semiconductor process.

[0014] Furthermore, the micro speaker has a shell, and the control chip is one or more and is arranged inside or on the outer surface of the shell.

[0015] Furthermore, the sensing chip is formed by one or more micro-coil elements, each micro-coil element comprising: a wiring layer, comprising a plurality of metal wire segments starting from a starting point and surrounding the starting point to form a plurality of turns of continuous wiring, each metal wire segment having a first electrode end and a second electrode end at both ends, wherein the starting point is the first electrode of the micro-coil element, and the ends of the plurality of metal wire segments of continuous wiring are the second electrodes of the micro-coil element; and The electrode layer is provided with at least one first electrode region and at least one second electrode region. The at least one first electrode region is used to collect the first electrode ends of each metal line segment, and the at least one second electrode region is used to collect the second electrode ends of each metal line segment.

[0016] Furthermore, the one or more control chips implement the communication circuit, digital signal processor, amplifier and / or voltage and current stabilization circuit of the micro speaker.

[0017] Furthermore, the one or more control chips are used to receive the electrical signal from the signal source, perform analog-to-digital conversion or digital-to-analog conversion, amplify the signal and / or equalize the signal.

[0018] Furthermore, the micro speaker is electrically connected to the signal source via one or more electrical contacts, a flexible printed circuit board or wire bonding disposed on the substrate.

[0019] The present invention also provides a circuit system of a micro speaker, comprising: A sensing circuit layer connected to the diaphragm, wherein the sensing circuit layer is formed with a sensing chip by a semiconductor process; A control circuit layer, electrically connected to the sensing circuit layer, including one or more control chips made by semiconductor process to realize the communication circuit, digital signal processor, amplifier and / or voltage and current stabilization circuit of the micro speaker; and A magnetic element having a gap with the sensing circuit layer to allow the sensing circuit layer to carry the movement of the diaphragm; The control chip receives an electrical signal from a signal source, changes the polarity of the electrical signal and transmits it to the sensing chip to form a changing magnetic field in the sensing circuit layer, thereby forming a force between the magnetic element and the diaphragm to drive the diaphragm to move. The moving diaphragm generates sound waves output by the micro speaker.

[0020] In this way, the purpose of miniaturizing the speaker is achieved by using the sensing chip and the control chip formed by the semiconductor process. The speaker using the traditional coil uses the copper coil to be wound vertically, so when the coil moves up and down, it will cause interference, the overall space is limited and there is not much extra free space to set the control chip. Different from this, the miniature speaker proposed by the present invention uses semiconductors to form the sensing chip, and uses the stackable characteristics of the chip to make the overall chip thinner, so there can be extra space available to set the additional control chip without causing interference.

[0021] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the packaging structure of the micro-speaker according to Embodiment 1 of the present invention; Figure 2 It is a side view schematic diagram of the packaging structure of the micro-speaker according to the first embodiment of the present invention; Figure 3 Schematic diagram of the packaging structure of a micro-speaker according to Embodiment 2 of the present invention; Figure 4 It is a top view of the packaging structure of the micro-speaker according to Embodiment 2 of the present invention; Figure 5 is a block diagram of a circuit system of a micro-speaker according to embodiment 3 of the present invention; Figure 6 A side view of the semiconductor structure of a micro-speaker according to a fourth embodiment of the present invention; Figure 7 A side view of the semiconductor structure of a micro-speaker according to Embodiment 5 of the present invention; Figure 8 is a schematic diagram of Embodiment 6 of the present invention, showing a micro-speaker made in a stacked form; Fig. 9 is a schematic diagram of a micro speaker according to a seventh embodiment of the present invention, showing a schematic diagram of forming a plurality of control chips on a carrier board during packaging; Fig.10 A schematic diagram of a wiring layer of a micro-coil element of a micro-speaker magnetic element in Embodiment 8 of the present invention; Fig.11 Schematic diagram of a contact unit of a micro-coil element according to Embodiment 8 of the present invention; Fig.12 Schematic diagram of the negative electrode collection layer of the micro-coil element of Example 8 of the present invention; Fig.13 Schematic diagram of the positive electrode collection layer of the micro-coil element of Example 8 of the present invention.

[0023] Description of labels: Example 1 10: micro speaker; 101: housing; 103: first magnetic element; 105: second magnetic element; 107: induction chip; 109: control chip in the structure; 110: diaphragm; 111: first control chip; 112: second control chip; 115: first power connection structure; 116: second power connection structure; Example 2 20: micro speaker; 201: housing; 203: magnetic element; 205: sensor chip; 207: diaphragm; 212: control chip; Example 3 30: control chip; 301: signal source; 303: digital signal processor; 305: amplifier circuit; 307: speaker unit; Example 4 411: power connection structure; 401: sensing circuit layer; 403: connection layer; 405: control circuit layer; Example 5 511: electrical connection structure; 501: substrate; 513: first connection layer; 503: sensing circuit layer; 515: second connection layer; 505: control circuit layer; Example 6 601: control circuit layer; 603: sensing circuit layer; 605: magnetic element; Example 7 71: diaphragm; 73: carrier board; 701: control chip; Example 8 80: micro coil element; 81: first electrode; 82: second electrode; 801: metal wire segment; 83: contact unit; 81': first electrode contact; 82': second electrode contact; 85: contact; 87: negative electrode collection layer; 811: first electrode area; 813: first metal wire; 89: positive electrode collection layer; 812: second electrode area; 815: second metal wire. DETAILED DESCRIPTION

[0024] The following is an explanation of the embodiments of the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0025] It should be understood that, although the terms "first", "second", "third", etc. may be used in this article to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0026] The present invention provides a miniature speaker and a related circuit system. The induction chip formed by a micro coil element is manufactured by a semiconductor process, and can be matched with a magnetic element manufactured by a semiconductor process and a related control circuit to achieve the purpose of a miniaturized speaker.

[0027] Example 1 Figure 1 A schematic diagram showing a first embodiment of a packaging structure of a micro speaker.

[0028] The figure shows a micro speaker 10, which includes a diaphragm 110, a housing 101, and a plurality of components encapsulated in the housing 101; The plurality of elements include a first magnetic element 103 , a second magnetic element 105 , a sensing chip 107 and an in-structure control chip 109 .

[0029] The first magnetic element 103 can be made of a magnetic conductive material, and can be used to concentrate and strengthen the application of magnetism.

[0030] The second magnetic element 105 can be made of a magnet or a magnetic material. The second magnetic element 105 can also be a magnetic element formed on a substrate by a semiconductor process.

[0031] The sensing chip 107 is formed on the second magnetic element 105. The sensing chip 107 may be a sensing chip 107 made by a semiconductor process, and may be composed of one or more micro-coil elements, and coupled to the second magnetic element 105 by a special connection structure. The special connection structure refers to setting a flexible circuit board or a wire on the sensing chip 107 to form an integral connection with the second magnetic element 105, and the arc-shaped piece in the figure is only a schematic diagram and is not limited thereto.

[0032] After being introduced into the sensor chip 107 , the processed electrical signal can form a magnetic field that interacts with the second magnetic element 105 .

[0033] The control chip 109 in the structure is formed on the sensor chip 107. The figure shows that the control chip 109 in the structure is manufactured on the sensor chip 107 in a stacked manner through a semiconductor process. The control chip 109 in the structure can be used as a controller in the micro speaker 10. It is consistent with the design of the sensor chip 107 and can fit each other to achieve the purpose of miniaturization. The control chip 109 in the structure is used to receive external electrical signals, process them, and then input them to the sensor chip 107.

[0034] Furthermore, the sensor chip 107 or the control chip 109 in the structure stacked therewith can be connected to the diaphragm 110 of the micro speaker 10 .

[0035] Furthermore, according to the implementation of the micro speaker 10 , in addition to the control chip 109 in the above structure, miniaturization results in redundant internal space for accommodating additional control chips, or forming a first control chip 111 and a second control chip 112 outside the housing 101 of the micro speaker 10 .

[0036] In this embodiment, each control chip (such as the internal control chip 109, the first control chip 111 and the second control chip 112) is electrically connected to the sensor chip 107. The first control chip 111 and the second control chip 112 can be disposed at vacant positions inside or outside the housing 101 of the micro speaker 10, such as inside or on the outer surface of the housing 101, and the internal control chip 109 can be formed on the sensor chip 107.

[0037] Each control chip can be used to process the received electrical signal and convert it into an electrical signal, such as current, which is input to the sensor chip 107, so that the current passing through the sensor chip 107 generates a magnetic field. It can also realize voltage / current control or the role of CPU, operational amplifier, etc.

[0038] Then you can refer to Figure 2 This figure shows a side view of the packaging structure of the micro speaker 10. This figure shows a schematic side view of the micro speaker 10, including a diaphragm 110 coupled to the sensor chip 107, and a first control chip 111 disposed outside the housing. The micro speaker has one or more electrical contacts electrically connected to an external signal source (such as a power source or an external device), and the electrical contacts can be a first electrical connection structure 115 and a second electrical connection structure 116 as shown in the figure, and the first electrical connection structure 115 and the second electrical connection structure 116 are electrically connected to the sensor chip 107. Of course, the micro speaker 10 can also be connected to the external signal source through a flexible printed circuit (FPC), wire bonding, or other various methods that can receive signals.

[0039] Example 2 Figure 3 A schematic diagram showing a second embodiment of a packaging structure of a micro speaker.

[0040] The figure shows that the micro speaker 20 has a housing 201, a magnetic element 203 and a ring-shaped sensor chip 205 made by a semiconductor process. A diaphragm 207 can be coupled to the sensor chip 205, and a control chip 212 electrically connected to the sensor chip 205 is set in an empty space in the housing 201.

[0041] The control chip 212 receives an electrical signal, such as a voltage or current signal, from a specific signal source, performs analog-to-digital conversion, and then processes it to form an electrical signal supplied to the sensor chip 205, forming a magnetic field on the sensor chip 205, so that it interacts with the magnetic element 203 covered by the magnetic field. When the electrical signal input to the sensor chip 205 is changed, the magnetic field can be changed, and a force that drives the diaphragm 207 to move is formed. The diaphragm 207 vibrates with the magnitude of the force to generate sound waves.

[0042] like Figure 4 As shown in FIG. 1 , this figure shows a circular micro speaker 20, in which a diaphragm 207 connected by a sensor chip 205 and a magnetic element 203 coupled to each other are presented. A control chip 212 is also provided at a specific position of the micro speaker 20. In this example, the control chip 212 is attached to the inner surface of the housing of the micro speaker 20, and it can also be provided on the outer surface of the speaker.

[0043] Example 3 Figure 5 Next, a block diagram of the circuit system for driving the micro-speaker is shown.

[0044] The circuit system for driving the micro speaker to operate includes a signal source 301 , a control chip 30 and a speaker unit 307 which are electrically connected in sequence.

[0045] The control chip 30 is connected to and receives the electrical signal from the signal source 301 . The control chip 30 includes circuit elements such as a digital signal processor 303 and an amplifier circuit 305 . The actual implementation is not limited to the illustrated example.

[0046] The speaker unit 307 electrically connected to the control chip 30 mainly includes the sensor chip, magnetic element, diaphragm and other components as described in the first and second embodiments.

[0047] In this embodiment, the control chip 30 and the sensor chip in the speaker unit 307 can be formed on the substrate by semiconductor process to form a semiconductor structure. Specifically, the semiconductor structure can be formed with a sensor circuit layer having a sensor chip and connected to a diaphragm. In addition, a control circuit layer having a control chip can be formed on the sensor circuit layer in the same layer or in a stacked manner. Specifically, a logic layer is made on the control circuit layer by semiconductor process, and one or more control chips are formed after design. The number of control chips is determined according to actual needs, and is used to realize the communication circuit, digital signal processor, amplifier and / or voltage and current stabilization circuit of the micro speaker.

[0048] There is a gap between the magnetic element and the sensing circuit layer for the sensing circuit layer to carry the movement of the diaphragm, wherein the control chip 30 receives an electrical signal from a signal source, changes the polarity of the electrical signal and inputs it to the sensing chip to form a changing magnetic field in the sensing circuit layer, thereby forming a force between the magnetic element and the diaphragm to drive the movement. The moving diaphragm generates sound waves output by the micro speaker.

[0049] Example 4 Figure 6 A side view of the semiconductor structure of the microspeaker of the above embodiment is shown.

[0050] The semiconductor structure of the micro speaker shown in this embodiment mainly includes a sensing circuit layer 401, a connection layer 403 and a control circuit layer 405, and a power connection structure 411 connected to an external signal source may be formed at one end.

[0051] In particular, the sensing circuit layer 401 can be a sensing chip formed by metal segments made by semiconductor processes, which can generate an induced magnetic field after an electrical signal is introduced, so that it interacts with the magnetic elements in the micro speaker. Then, a connection layer 403 made of insulating material is formed on the sensing circuit layer 401, and then a control circuit layer 405 is formed in a stacked manner on the connection layer 403. The control circuit layer 405 is a logic layer that provides circuit design and can realize the circuit function in the micro speaker.

[0052] Example 5 Figure 7 Another side view of the semiconductor structure of the micro-speaker of the above embodiment is shown.

[0053] This embodiment shows that in a semiconductor process, a substrate 501 is first provided, and then a first connection layer 513 is first formed on the surface of the substrate 501. The sensing circuit layer 503 can be formed on the first connection layer 513 by using a semiconductor process. For example, a copper layer is first formed on the first connection layer 513, and then metal segments can be formed on the copper layer by etching, or the metal segments can be formed by a printing process. Figures 10 to 13 As shown, a sensing chip that can generate a magnetic field by introducing current is finally formed. Next, a second connection layer 515 connected to the control circuit layer 505 is formed on the sensing circuit layer 503, and the control circuit layer 505 is formed thereon in a stacked manner using a semiconductor process.

[0054] The method of forming the first connection layer 513 and the second connection layer 515 includes chemical vapor deposition (CVD) or through silicon via (TSV). The chemical vapor deposition (CVD) process is to expose the substrate 501 to one or more different precursors, and chemically react to deposit the connection structure on the surface of the substrate 501, so as to form the first connection layer 513 on the substrate 501, or to form the second connection layer 515 on the surface of the sensing circuit layer 503. Therefore, the chemical vapor deposition process can be used to expose the sensing circuit layer 503 to the one or more precursors to chemically react and deposit to form the second connection layer 515, and then form the second connection layer 515 on the control circuit layer 505.

[0055] Another way is that the first connection layer 513 and the second connection layer 515 are a structure formed of two layers of insulating materials, and then the through silicon via (TSV) technology is applied to drill holes in the insulating material, and then the holes are filled with conductive materials to conduct the sensing circuit layer 503 and the control circuit layer 505. Specifically, a structure formed of insulating materials can be first formed on the sensing circuit layer 503, and then the through silicon via technology is applied to drill holes in the insulating material, and then the conductive materials are filled in the holes to form guide holes, and then the control circuit layer 505 is formed on the insulating material, that is, the sensing circuit layer 503 and the control circuit layer 505 are conducted through the guide holes formed by the through silicon via technology.

[0056] Speakers using traditional coils use copper coils that are wound vertically, so interference will occur when the coils move up and down. The overall space is limited and there is not much extra free space to set up control chips. Different from this, the micro speaker proposed in the present invention uses the stackable chip feature to make the overall chip thinner, so there can be extra space available to set up additional control chips without causing interference.

[0057] Example 6 Combined with the above-mentioned embodiments 4 and 5, Figure 8 As shown, this embodiment provides a partial cross section of a micro-speaker with a three-dimensional structure.

[0058] It is shown that the control circuit layer 601 is formed in a stacked form on the sensing circuit layer 603. Other detailed structures are not described here. It can be seen that there is a gap between the magnetic element 605 and the sensing circuit layer 603, which is surrounded by the sensing circuit layer 603 and the control circuit layer 601, and the sensing circuit layer 603, which provides the sensing circuit layer 603 with a gap to carry the diaphragm (not shown in this figure) to move. That is, when the sensing chip formed by the magnetic element 605 on the sensing circuit layer 603 is energized, it will interact with each other and produce relative movement. For example, the sensing chip formed by the sensing circuit layer 603 is connected to the diaphragm, and the sensing chip is coupled to the magnetic element 605. They are separated by a certain distance. After the current is introduced, a magnetic field is formed on the sensing chip. The polarity of the magnetic field is changed by changing the current and direction, and the diaphragm is driven to move by reversing the magnetic field, thereby pushing the air to produce sound. The actual movement amplitude can be 0.01~5mm, depending on the vibration and frequency of the audio.

[0059] According to the description of the above embodiment, it can be known that after the sensing circuit layer 603 receives the electrical signal input by the control circuit layer 601, the polarity of the electrical signal is changed by the control chip formed on the control circuit layer 601 to form a changing magnetic field in the sensing circuit layer 603, and a force that drives the diaphragm to move is formed between the adjacent magnetic element 605, and the moving diaphragm generates sound waves output by the micro speaker.

[0060] Example 7 like Fig. 9 As shown, this embodiment is a schematic diagram of forming multiple control chips on a carrier during packaging.

[0061] This example shows that the micro speaker can be provided with multiple control chips 701, and the control chip 701 does not have to be formed on the substrate described in the above embodiment, but can be on a carrier 73, which is a structural layer on the sensor chip (not shown in this figure), and the sensor chip is connected to the diaphragm 71 in the figure. In this way, the multiple control chips 701 can respectively realize various circuit functions in the micro speaker, such as communication circuit (such as Bluetooth communication circuit), digital signal processor, amplifier and / or voltage and current stabilization circuit, etc., and can be used to perform audio processing procedures such as analog-to-digital or digital-to-analog conversion, signal amplification, signal equalization and / or digital-to-analog conversion.

[0062] In this way, when the sensing chip receives the electrical signal input by the control chip 701, one of the control chips can change the polarity of the electrical signal according to the signal sent by the signal source to form a changing magnetic field on the sensing chip, so as to form a force to drive the diaphragm 71 to move between the magnetic element (not shown in this figure), and the moving diaphragm 71 generates sound waves output by the micro speaker.

[0063] Example 8 According to the requirements of miniaturization, one or both of the inductive chip and the magnetic element in the micro speaker are composed of one or more micro-coil elements, especially the inductive chip is formed by one or more micro-coil elements on the inductive circuit layer, specifically, Figures 10 to 13 shown.

[0064] For the purpose of miniaturization, the micro-speaker proposed in the present invention uses a micro-coil element formed by a metal micro-segment to realize the induction chip, and can also use a micro-coil element formed by a metal micro-segment to realize the magnetic element.

[0065] The micro-coil element can be a component (such as a chip) made by plating, metallization or etching, and electrically connected to its control circuit by wire bonding or flip chip. The magnetic element of each of the above embodiments can adopt such a micro-coil element, or an array micro-coil element formed by multiple micro-coil elements, or one of them can be adopted, and the other can be a specific magnetic object (such as a magnet).

[0066] Fig.10The wiring layer of the micro-coil element 80 is shown. The wiring layer of the micro-coil element 80 is composed of continuous or discontinuous metal wire segments. The figure shows that the metal wire forms multiple breakpoints according to the needs. The wiring layer is provided with multiple metal wire segments 801 starting from a starting point and surrounding the starting point to form multiple turns of continuous wiring. The starting point can be set at any position of the micro-coil element, preferably a position close to the central area of ​​the micro-coil element, but it is not limited to this. The starting point position can be determined according to actual needs. The starting point forms a first electrode 81, for example, the negative electrode of the micro-coil element, and the end of the metal wire segment, that is, the end of the metal wire segment of the multiple continuous wiring is the second electrode 82 of the micro-coil element, which can be the positive electrode of the micro-coil element.

[0067] As shown in the figure, each metal wire segment in the multiple metal wire segments has two endpoints, one of which is the first electrode end, such as one end of the first electrode 81 formed closer to the starting point; the other end is the second electrode end, which is the endpoint closer to the end of the metal wire segment, that is, the second electrode 82.

[0068] For example Fig.11 The contact unit 83 shown in FIG. Fig.10 The contact unit 83 shown in this figure includes a plurality of contacts 85 corresponding to the two ends of a plurality of metal wire segments on the wiring layer of the micro-coil element, and the other side electrodes corresponding to the first electrode 81 and the second electrode 82, namely the first electrode contact 81' and the second electrode contact 82'.

[0069] In addition to the wiring layer described in the above embodiment, the micro coil element 80 may also be provided with an electrode layer, such as Fig.12 and Fig.13 shown.

[0070] Fig.12 The negative electrode collection layer 87 shown as the first electrode end (such as the negative electrode) of each metal wire segment on the wiring layer includes a first electrode area 811 that collects the first electrode ends of each metal wire segment. The implementation example is a pad. The pad needs to have enough area to connect multiple first metal wires 813 (corresponding to the metal wire segments in the wiring layer mentioned above). The first metal wire 813 is used in this negative electrode collection layer 87 to guide the connection of the negative electrode in each metal wire segment in the wiring layer.

[0071] Fig.13 The positive electrode collection layer 89 shown as the second electrode end (such as the positive electrode) of each metal wire segment in the wiring layer includes a second electrode area 812 for collecting the second electrode end of each metal wire segment. Similarly, it should be an electrical pad with sufficient area to connect multiple second metal wires 815. The second metal wire 815 shown in this positive electrode collection layer 89 is used to guide the connection of the positive electrodes in each metal wire segment in the wiring layer.

[0072] The above-mentioned method of gathering the electrode ends of the metal wire segments on the electrode layer is to guide them to the first electrode region 811 and the second electrode region 812 on the electrode layer through vias or wires on the substrate.

[0073] In summary, according to the micro-speaker described in the above embodiment, a micro-coil element is used to realize the induction chip in the micro-speaker, and a micro-coil element can also be used to realize a magnetic chip, and then the induction chip and the control chip are combined in a stacked manner to achieve the purpose of miniaturization. In this way, the induction chip is connected to the diaphragm of the micro-speaker. Through the operation of the circuit system, the induction chip forms a magnetic field after being energized, and an interaction is generated between the induction chip and the magnetic element to drive the diaphragm to move, thereby generating sound. It is worth mentioning that, unlike the speakers made of traditional coils, the characteristics of the induction chip can reduce the area of ​​the magnetic element (such as a magnet), so that there is extra space to place the control chip, so that the micro-speaker will have the effect of saving space and reducing signal delay due to the short communication path.

[0074] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the scope of the present invention.

Claims

1. A micro speaker, characterized in that: include: The sensor chip is manufactured through a semiconductor process and connected to the diaphragm; A control chip, formed by a semiconductor process and electrically connected to the sensor chip; as well as A magnetic element has a gap with the sensing chip to allow the sensing chip to carry the movement of the diaphragm; The control chip is used to receive electrical signals, change the polarity of the electrical signals and input them to the sensing chip to form a changing magnetic field in the sensing chip, thereby forming a force between the sensing chip and the magnetic element to drive the diaphragm to move. The moving diaphragm generates sound waves output by the micro speaker.

2. The micro-speaker according to claim 1, characterized in that: It also includes a substrate, on which a sensing circuit layer with a sensing chip is formed by a semiconductor process, and there is a gap between the magnetic attraction element and the sensing circuit layer; the control chip is formed on a control circuit layer by a semiconductor process.

3. The micro-speaker according to claim 2, characterized in that: The sensing circuit layer and the control circuit layer are formed on the substrate in the same layer by semiconductor process.

4. The micro-speaker according to claim 2, characterized in that: A connection layer is formed on the sensing circuit layer, the control circuit layer is formed on the connection layer in a stacked manner using a semiconductor process, and one or more control chips in the micro speaker are formed in the control circuit layer; The control chip is electrically connected to the sensing chip through a connection layer.

5. The micro-speaker according to claim 4, characterized in that: The connection layer is formed by a chemical vapor deposition process or by using a through silicon via technique on an insulating material.

6. The micro-speaker according to claim 1, characterized in that: The magnetic element is a magnet, a magnetic material or is manufactured by a semiconductor process.

7. The micro-speaker according to claim 1, characterized in that: A carrier board is arranged in the micro speaker, and a control circuit layer having one or more control chips is formed on the carrier board by semiconductor process.

8. The micro-speaker according to claim 1, characterized in that: The micro speaker has a shell, and the control chip is one or more and is arranged inside or on the outer surface of the shell.

9. The micro-speaker according to claim 1, characterized in that: The sensing chip is formed by one or more micro-coil elements, each micro-coil element comprising: a wiring layer, comprising a plurality of metal wire segments starting from a starting point and surrounding the starting point to form a plurality of turns of continuous wiring, each metal wire segment having a first electrode end and a second electrode end at both ends, wherein the starting point is the first electrode of the micro-coil element, and the ends of the plurality of metal wire segments of continuous wiring are the second electrodes of the micro-coil element; and The electrode layer is provided with at least one first electrode region and at least one second electrode region. The at least one first electrode region is used to collect the first electrode ends of each metal line segment, and the at least one second electrode region is used to collect the second electrode ends of each metal line segment.

10. The micro-speaker according to any one of claims 4 to 9, characterized in that: The one or more control chips realize the communication circuit, digital signal processor, amplifier and / or voltage and current stabilization circuit of the micro speaker.

11. The micro-speaker according to any one of claims 4 to 9, characterized in that: The one or more control chips are used to receive the electrical signal from the signal source, perform analog-to-digital conversion or digital-to-analog conversion, amplify the signal and / or equalize the signal.

12. The micro-speaker according to claim 11, characterized in that: The micro speaker is electrically connected to the signal source through one or more electrical contacts, a flexible circuit board or wire bonding on the substrate.

13. A circuit system of a micro speaker, characterized in that: include: A sensing circuit layer connected to the diaphragm, wherein the sensing circuit layer is formed with a sensing chip by a semiconductor process; A control circuit layer, electrically connected to the sensing circuit layer, including one or more control chips made by semiconductor process to realize the communication circuit, digital signal processor, amplifier and / or voltage and current stabilization circuit of the micro speaker; and A magnetic element having a gap with the sensing circuit layer to allow the sensing circuit layer to carry the movement of the diaphragm; The control chip receives an electrical signal from a signal source, changes the polarity of the electrical signal and transmits it to the sensing chip to form a changing magnetic field in the sensing circuit layer, thereby forming a force between the magnetic element and the diaphragm to drive the diaphragm to move. The moving diaphragm generates sound waves output by the micro speaker.

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