Substrate, preparation method thereof and display panel
By designing the connection parts of the first hole ring and the second hole ring with unequal areas, the breaking position is staggered, and the line breaking problem caused by the concentration of the substrate is solved, thereby achieving high-efficiency stress dispersion and extended service life of the substrate.
Patent Information
- Application Number
- CN202411875434.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-03-28
AI Technical Summary
The existing substrates are stressed at the breaking position, which can easily lead to line breakage and functional failure.
A substrate is designed, including a substrate, a first conductive layer, a second conductive layer, a through hole and a connecting portion. The connecting part consists of a first hole ring and a second hole ring of unequal areas. The connection structure is connected, and the breaking positions of the first hole ring and the second hole ring are staggered to disperse stress.
It effectively avoids stress concentration, reduces the risk of substrate fracture, and extends the service life of substrate.
Smart Images
Figure CN119730002A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a substrate and a preparation method thereof, and a display panel. Background Art
[0002] Current substrates, such as flexible circuit boards, use a hole plating process to form two hole rings at both ends of the hole. The two hole rings have a certain thickness, and the gap between the two hole rings is at the same position. Stress is concentrated at this position to form a stress point. Once subjected to external forces such as bending, it is easy for the substrate to break at the gap position, which in turn causes the circuit to break and the function to fail. Summary of the invention
[0003] In view of this, the embodiments of the present application provide a substrate and a method for preparing the same, and a display panel, which solve the problem of circuit breakage caused by stress concentration at the step position of the substrate in the prior art.
[0004] In a first aspect, the present application provides a substrate, the substrate comprising:
[0005] substrate;
[0006] A first conductive layer is located on one surface of the substrate;
[0007] a second conductive layer, located on a surface of the substrate opposite to the first conductive layer;
[0008] A through hole, along the thickness direction of the substrate, the through hole penetrates the first conductive layer, the substrate and the second conductive layer;
[0009] A connecting portion, the connecting portion comprising a first hole ring, a second hole ring and a connecting structure, the first hole ring is located on a surface of the first conductive layer away from the substrate, the second hole ring is located on a surface of the second conductive layer away from the substrate, the first hole ring and the second hole ring respectively surround the through hole, and the connecting structure is located in the through hole and connects the first hole ring and the second hole ring;
[0010] The orthographic projection areas of the first aperture ring and the second aperture ring on the substrate are not equal.
[0011] In one embodiment, the area of the orthographic projection of the first aperture ring on the substrate is 10% to 50% larger than the area of the orthographic projection of the second aperture ring on the substrate, preferably 20% to 40%.
[0012] In one embodiment, the shape of the orthographic projection of the first aperture ring on the substrate includes at least one of a circle, a square, an ellipse and a polygon;
[0013] The shape of the orthographic projection of the second hole ring on the substrate includes at least one of a circle, a square, an ellipse and a polygon.
[0014] In one embodiment, the center of the first annular ring, the center of the through hole and the center of the second annular ring are in a straight line;
[0015] Preferably, the connection structure is located on surfaces of the substrate, the first conductive layer and the second conductive layer close to the through hole.
[0016] In one embodiment, the orthographic projection of the first conductive layer on the substrate covers the orthographic projection of the first annular ring on the substrate;
[0017] Preferably, the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the second annular ring on the substrate.
[0018] In one embodiment, the substrate comprises a flexible circuit board;
[0019] Preferably, the material of the connecting portion includes copper;
[0020] Preferably, the material of the first conductive layer includes copper, and the material of the second conductive layer includes copper.
[0021] A second aspect of the present application provides a method for preparing a substrate, the method comprising:
[0022] A first conductive layer and a second conductive layer are respectively formed on two opposite surfaces of the substrate;
[0023] Opening a through hole that penetrates the first conductive layer, the substrate, and the second conductive layer;
[0024] Prepare a connecting portion, the connecting portion comprising a first hole ring, a second hole ring and a connecting structure, the first hole ring is located on a surface of the first conductive layer away from the substrate, the second hole ring is located on a surface of the second conductive layer away from the substrate, the first hole ring and the second hole ring surround the through hole respectively, and the connecting structure is located in the through hole and connects the first hole ring and the second hole ring;
[0025] The orthographic projection areas of the first aperture ring and the second aperture ring on the substrate are not equal.
[0026] In one embodiment, preparing the connecting portion comprises:
[0027] The connection part is prepared by electroplating.
[0028] In one embodiment, preparing the connecting portion comprises:
[0029] A first mask is covered on a surface of the first conductive layer away from the substrate, and a second mask is covered on a surface of the second conductive layer away from the substrate;
[0030] The orthographic projection of the first mask on the substrate is connected to the orthographic projection of the first aperture ring on the substrate, and the orthographic projection of the second mask on the substrate is connected to the orthographic projection of the second aperture ring on the substrate;
[0031] Copper is plated in the areas defined by the first mask plate and the second mask surface to obtain a connecting portion.
[0032] A third aspect of the present application provides a display panel, which includes the above-mentioned substrate.
[0033] In the embodiment of the present application, the areas of the direct projections of the first hole ring and the second hole ring on the substrate are not equal. In the thickness direction of the substrate, the edge of the first hole ring and the edge of the second hole ring are not on a straight line, so that the break positions of the first hole ring and the second hole ring are staggered, which can effectively disperse the stress at the break position of the first hole ring and the second hole ring to avoid stress concentration, effectively avoid equal break positions in the thickness direction of the substrate, reduce the risk of substrate breakage, and extend the service life of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] Figure 1 It is a structural schematic diagram of a substrate in the related art.
[0035] Figure 2 This is a schematic diagram of the structure of a substrate in one embodiment of the present application.
[0036] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure of the substrate along the AA' direction.
[0037] Figure 4 This is a schematic structural diagram of a substrate in another embodiment of the present application.
[0038] Figure 5 This is a schematic structural diagram of a substrate in another embodiment of the present application.
[0039] Figure 6 This is a schematic structural diagram of a substrate in another embodiment of the present application.
[0040] Figure 7 This is a schematic diagram of the cross-sectional structure of a substrate in another embodiment of the present application.
[0041] Figure 8 This is a schematic diagram of the cross-sectional structure of a substrate in another embodiment of the present application.
[0042] Fig. 9 This is a schematic diagram of the cross-sectional structure of a substrate in another embodiment of the present application.
[0043] Fig.10 This is a schematic diagram of the cross-sectional structure of a substrate in another embodiment of the present application.
[0044] Fig.11 This is a schematic structural diagram of a substrate in another embodiment of the present application.
[0045] Fig.12The figure is a schematic flow chart of a method for preparing a substrate in one embodiment of the present application.
[0046] Fig.13 This is a schematic diagram of the process for preparing a connecting portion in one embodiment of the present application. DETAILED DESCRIPTION
[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0048] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.
[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0050] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.
[0051] Conventional substrates, such as flexible circuit boards, use copper plating throughout the board. Figure 1 The structural schematic diagram of the flexible circuit board shown in the figure shows that when the thickness requirement or bending requirement of the flexible circuit board is relatively strict, a hole plating process will be adopted, and only the through hole 10 in the flexible circuit board will be copper-plated to form an upper hole ring 20 and a lower hole ring 30, and the area of the orthographic projection of the upper hole ring 20 on the substrate 100 and the orthographic projection of the lower hole ring 30 on the substrate 100 are equal; this process will cause a certain height difference between the copper thickness of the area where the upper hole ring 20 and the lower hole ring 30 are located after copper plating and the copper thickness of the circuit 50 in other areas, and along the thickness direction of the flexible circuit board, the break of the upper hole ring 20 and the lower hole ring 30 are on the same straight line, and a stress point is formed at the break position. Once subjected to an external force similar to bending, the flexible circuit board is easily broken at the break position, causing the circuit to break and the flexible circuit board to fail in function.
[0052] In view of this, the first aspect of the present application provides a substrate, referring to Figure 2 and Figure 3The structural schematic diagram of the substrate shown in the figure comprises: a substrate 100; a first conductive layer 200, which is located on one surface of the substrate 100; a second conductive layer 300, which is located on the surface of the substrate 100 opposite to the first conductive layer 200; a through hole 400, which penetrates the first conductive layer 200, the substrate 100 and the second conductive layer 300 along the thickness direction of the substrate; a connecting portion 500, which comprises a first hole ring 510, a second hole ring 520 and a connecting structure 530, wherein the first hole ring 510 is located on the surface of the first conductive layer 200 away from the substrate 100, and the second hole ring 520 is located on the surface of the second conductive layer 300 away from the substrate 100, the first hole ring 510 and the second hole ring 520 respectively surround the through hole 400, and the connecting structure 530 is located in the through hole 400 and connects the first hole ring 510 and the second hole ring 520; the areas of the orthographic projections of the first hole ring 510 and the second hole ring 520 on the substrate 100 are not equal.
[0053] It should be noted that the thickness direction of the substrate refers to the direction from the first conductive layer 200 to the second conductive layer 300 or the direction from the second conductive layer 300 to the first conductive layer 200 .
[0054] In the embodiment of the present application, the areas of the direct projections of the first hole ring 510 and the second hole ring 520 on the substrate 100 are not equal. In the thickness direction of the substrate, the edge of the first hole ring 510 and the edge of the second hole ring 520 are not on a straight line, so that the fault positions of the first hole ring 510 and the second hole ring 520 are staggered, which can effectively disperse the stress at the fault position of the first hole ring 510 and the second hole ring 520 to avoid stress concentration, effectively avoid equal faults in the thickness direction of the substrate, reduce the risk of substrate breakage, and extend the service life of the substrate.
[0055] In one embodiment, the area of the orthographic projection of the first annular ring 510 on the substrate 100 is 10% to 50% larger than the area of the orthographic projection of the second annular ring 520 on the substrate 100, for example, it can be 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45% or 50%, etc. Thus, the connection portion 500 has a better effect of connecting the first conductive layer 200 and the second conductive layer 300, and has a better effect of dispersing the stress at the break position of the first annular ring 510 and the break position of the second annular ring 520, thereby effectively reducing the risk of substrate fracture.
[0056] It is understandable that the first hole ring 510 and the second hole ring 520 in the embodiment of the present application are only used to explain the present application and cannot be understood as limiting the present application. In actual situations, the area of the orthographic projection of the first hole ring 510 on the substrate 100 may be larger than the area of the orthographic projection of the second hole ring 520 on the substrate 100, or the area of the orthographic projection of the second hole ring 520 on the substrate 100 may be larger than the area of the orthographic projection of the first hole ring 510 on the substrate 100. Exemplarily, the area of the orthographic projection of the second hole ring 520 on the substrate 100 is 10% to 50% larger than the area of the orthographic projection of the first hole ring 510 on the substrate 100.
[0057] In a preferred embodiment, the area of the orthographic projection of the first aperture ring 510 on the substrate 100 is 20% to 40% larger than the area of the orthographic projection of the second aperture ring 520 on the substrate 100 .
[0058] In one embodiment, referring to Figures 2 to 6 As shown in the structural schematic diagram of the substrate, the shape of the orthographic projection of the first hole ring 510 on the substrate 100 includes at least one of a circle, a square, an ellipse and a polygon.
[0059] In one embodiment, the shape of the orthographic projection of the second annular ring 520 on the substrate 100 includes at least one of a circle, a square, an ellipse, and a polygon.
[0060] It is understandable that the shapes of the orthographic projections of the first hole ring 510 and the second hole ring 520 on the substrate 100 may be the same or different. As long as the requirements can be met, those skilled in the art may flexibly select according to actual conditions.
[0061] In one embodiment, the center of the first annular ring 510 , the center of the through hole 400 , and the center of the second annular ring 520 are in a straight line.
[0062] It should be noted that the center of the first hole ring 510 refers to: the orthographic projection of the first hole ring 510 on the substrate 100 is a ring, the inside of the ring is a hole, and the centroid of the hole is the center of the first hole ring 510; the center of the second hole ring 520 refers to: the orthographic projection of the second hole ring 520 on the substrate 100 is a ring, the inside of the ring is a hole, and the centroid of the hole is the center of the second hole ring 520; the center of the through hole 400 refers to: the centroid of the orthographic projection of the through hole 400 on the substrate 100 is the center of the through hole 400.
[0063] In the embodiment of the present application, the center of the first hole ring 510, the center of the through hole 400 and the center of the second hole ring 520 are in a straight line, so that the connecting part 500 is relatively stable, and the effect of connecting the first conductive layer 200 and the second conductive layer 300 is excellent. When the substrate is subjected to external force, it can also ensure an excellent electrical connection effect between the first conductive layer 200 and the second conductive layer 300.
[0064] In one embodiment, referring to Figure 3 As shown in the structural diagram of the substrate, the connection structure 530 is located on the surface of the substrate 100, the first conductive layer 200 and the second conductive layer 300 close to the through hole 400. Therefore, the connection structure 530 can be stably placed in the through hole 400, and the effect of connecting the first conductive layer 200 and the second conductive layer 300 is excellent.
[0065] It can be understood that the first conductive layer 200 may cover the entire surface of the substrate 100, or may be located on a portion of the surface of the substrate 100. For example, in one embodiment, referring to Figure 7 In the structural schematic diagram of the substrate shown, on one side L1 of the through hole 400, the first conductive layer 200 covers the surface of the substrate 100, and on the other side L2 of the through hole 400, the first conductive layer 200 is located on a portion of the surface of the substrate 100, and the orthographic projection of the first conductive layer 200 on the substrate 100 covers the orthographic projection of the first hole ring 510 on the substrate 100. Therefore, when the first conductive layer 200 is located on a portion of the surface of the substrate 100, there is a step difference between the first conductive layer 200 and the substrate 100, and stress is generated at the position of the step difference. At this time, the orthographic projection of the first conductive layer 200 on the substrate 100 covers the orthographic projection of the first hole ring 510 on the substrate 100. In the thickness direction of the substrate, the edge of the first conductive layer 200 and the edge of the first hole ring 510 may not be on the same straight line, which can effectively stagger the step difference between the first conductive layer 200 and the first hole ring 510, effectively disperse the stress, avoid stress concentration, and further reduce the risk of substrate fracture.
[0066] It is understood that the second conductive layer 300 may cover the entire surface of the substrate 100, or may be located on a portion of the surface of the substrate 100. For example, in one embodiment, referring to Figure 7 In the structural schematic diagram of the substrate shown in the figure, on both sides of the through hole 400, the second conductive layer 300 is located on a partial surface of the substrate 100, and the orthographic projection of the second conductive layer 300 on the substrate 100 covers the orthographic projection of the second hole ring 520 on the substrate 100. As a result, there is a step difference between the second conductive layer 300 and the substrate 100, and stress is generated at the position of the step difference. At this time, the orthographic projection of the second conductive layer 300 on the substrate 100 covers the orthographic projection of the second hole ring 520 on the substrate 100. In the thickness direction of the substrate, the edge of the second conductive layer 300 and the edge of the second hole ring 520 may not be on the same straight line, which can effectively stagger the step difference between the second conductive layer 300 and the second hole ring 520, effectively disperse the stress, avoid stress concentration, and further reduce the risk of substrate fracture.
[0067] In a specific embodiment, the orthographic projection of the first conductive layer 200 on the substrate 100 covers the orthographic projection of the first hole ring 510 on the substrate 100, including: the orthographic projection of the first conductive layer 200 on the substrate 100 coincides with the edge of the orthographic projection of the first hole ring 510 on the substrate 100, or the orthographic projection of the first hole ring 510 on the substrate 100 is completely inside the orthographic projection of the first conductive layer 200 on the substrate 100.
[0068] In a specific embodiment, the orthographic projection of the second conductive layer 300 on the substrate 100 covers the orthographic projection of the second hole ring 520 on the substrate 100, including: the orthographic projection of the second conductive layer 300 on the substrate 100 coincides with the edge of the orthographic projection of the second hole ring 520 on the substrate 100, or the orthographic projection of the second hole ring 520 on the substrate 100 is completely inside the orthographic projection of the second conductive layer 300 on the substrate 100.
[0069] In a specific embodiment, on one side L1 of the through hole 400, the first conductive layer 200 covers the surface of the substrate 100, on the other side L2 of the through hole 400, the first conductive layer 200 is located on a portion of the surface of the substrate 100, and on both sides of the through hole 400, the second conductive layer 300 is located on a portion of the surface of the substrate 100, and the area of the orthographic projection of the first hole ring 510 on the substrate 100 is greater than the area of the orthographic projection of the second hole ring 520 on the substrate 100; refer to Figure 8 The structural diagram of the substrate shown in FIG. 1 shows that the orthographic projection of the second hole ring 520 on the substrate 100 is completely inside the orthographic projection of the first hole ring 510 on the substrate 100. Alternatively, referring to Fig.10 In the schematic structural diagram of the substrate shown in FIG. 1 , the orthographic projection of the second hole ring 520 on the substrate 100 overlaps with a portion of the edge of the orthographic projection of the first hole ring 510 on the substrate 100. The structures of the first hole ring 510 and the second hole ring 520 can both ensure an excellent staggered difference effect. In a preferred embodiment, the orthographic projection of the second hole ring 520 on the substrate 100 is completely inside the orthographic projection of the first hole ring 510 on the substrate 100.
[0070] In a specific embodiment, on one side L1 of the through hole 400, the first conductive layer 200 covers the surface of the substrate 100, on the other side L2 of the through hole 400, the first conductive layer 200 is located on a portion of the surface of the substrate 100, on both sides of the through hole 400, the second conductive layer 300 is located on a portion of the surface of the substrate 100, and the area of the orthographic projection of the first hole ring 510 on the substrate 100 is smaller than the area of the orthographic projection of the second hole ring 520 on the substrate 100. Fig. 9 The structural diagram of the substrate shown in FIG. 1 shows that the orthographic projection of the first hole ring 510 on the substrate 100 is completely inside the orthographic projection of the second hole ring 520 on the substrate 100. Alternatively, referring to Figure 7In the schematic structural diagram of the substrate shown in FIG. 1 , the orthographic projection of the second hole ring 520 on the substrate 100 overlaps with a portion of the edge of the orthographic projection of the first hole ring 510 on the substrate 100. The structures of the first hole ring 510 and the second hole ring 520 can both ensure an excellent staggered difference effect. In a preferred embodiment, the orthographic projection of the first hole ring 510 on the substrate 100 is completely inside the orthographic projection of the second hole ring 520 on the substrate 100.
[0071] In one embodiment, the substrate comprises a flexible circuit board; preferably, the material of the connecting portion comprises copper; preferably, the material of the first conductive layer comprises copper, and the material of the second conductive layer comprises copper.
[0072] It is understandable that the material of the substrate includes but is not limited to polyimide (PI), and those skilled in the art can flexibly select it according to actual conditions as long as it can meet the requirements.
[0073] In the embodiments of the present application, the thicknesses of the first conductive layer, the second conductive layer, the first hole ring and the second hole ring are not limited. As long as the requirements can be met, technicians in this field can flexibly select them according to actual conditions.
[0074] In a specific embodiment, referring to Fig.11 The structural schematic diagram of the substrate shown is a flexible circuit board, the first conductive layer 200 is used to connect the circuit, and the area of the orthographic projection of the first hole ring 510 electrically connected to the first conductive layer 200 on the substrate 100 is larger than the area of the orthographic projection of the second hole ring 520 on the substrate 100.
[0075] In one embodiment, the substrate is a flexible circuit board, which includes a bendable area, a through hole is provided in the bendable area, and the above-mentioned connecting part is provided in the through hole. When the flexible circuit board is bent, stress is not easy to concentrate at one point, and breakage is not easy to occur, thereby ensuring the service life of the flexible circuit board.
[0076] It is understandable that, in addition to the aforementioned connecting parts, through holes, first conductive layer and second conductive layer, the substrate may also include structures that a conventional flexible circuit board should have, such as positioning marks and gold fingers, etc., which will not be elaborated here.
[0077] The second aspect of the present application provides a method for preparing a substrate, referring to Fig.12 The preparation method shown is a schematic flow chart, and the preparation method comprises the following steps.
[0078] S100: preparing a first conductive layer and a second conductive layer on two opposite surfaces of the substrate respectively.
[0079] It can be understood that the substrate, the first conductive layer and the second conductive layer are consistent with the above description and will not be described in detail here.
[0080] Exemplarily, the preparation methods of the first conductive layer and the second conductive layer include but are not limited to attaching rolled copper to two opposite surfaces of the substrate, or coating the conductive material on two opposite surfaces of the substrate by coating. As long as the requirements can be met, technicians in this field can make flexible choices based on actual conditions.
[0081] S200: opening a through hole penetrating the first conductive layer, the substrate, and the second conductive layer.
[0082] It can be understood that the through hole is consistent with the previous description and will not be described in detail here.
[0083] Exemplarily, the methods of opening the through holes include, but are not limited to, mechanical drilling, chemical etching, etc. As long as the requirements can be met, technicians in this field can flexibly choose according to the actual situation.
[0084] It is understandable that the size of the through hole can be flexibly selected according to actual conditions, and will not be elaborated here.
[0085] S300: preparing a connection portion.
[0086] It should be noted that the connecting part is consistent with the previous description, and the connecting part includes a first hole ring, a second hole ring and a connecting structure. The first hole ring is located on the surface of the first conductive layer away from the substrate, and the second hole ring is located on the surface of the second conductive layer away from the substrate. The first hole ring and the second hole ring respectively surround the through hole, and the connecting structure is located in the through hole and connects the first hole ring and the second hole ring; the areas of the direct projections of the first hole ring and the second hole ring on the substrate are not equal.
[0087] It is understandable that the method of preparing the connection part may include but is not limited to deposition, electroplating, screen printing, etc. In a preferred embodiment, preparing the connection part includes: preparing the connection part by electroplating. In the connection part prepared by electroplating, the first hole ring and the second hole ring can be closely attached to the surface of the first conductive layer and the second conductive layer, and the connection structure can also be closely attached to the surface of the first conductive layer, the second conductive layer and the substrate near the through hole, and the reliability and integrity of the connection part are high; and the thickness of the connection part formed by electroplating is relatively uniform, and the yield is high.
[0088] It is understandable that the use of electroplating to prepare the connection portion can simultaneously form a first hole ring, a connection structure, and a second hole ring that are connected in sequence.
[0089] It is understandable that when the connection portion is prepared by electroplating, the connection structure formed by electroplating is relatively thin and adheres to the first conductive layer, the second conductive layer and the surface of the substrate close to the through hole, so the connection structure does not fill the through hole.
[0090] In one embodiment, referring to Fig.13 The schematic diagram of the preparation process of the connecting part is shown, and the preparation of the connecting part includes the following steps.
[0091] S310: Covering a surface of the first conductive layer away from the substrate with a first mask, and covering a surface of the second conductive layer away from the substrate with a second mask.
[0092] It should be noted that the orthographic projection of the first mask on the substrate is connected to the orthographic projection of the first aperture ring on the substrate, and the orthographic projection of the second mask on the substrate is connected to the orthographic projection of the second aperture ring on the substrate.
[0093] Exemplarily, the method for preparing the first mask includes the following steps: preparing a dry film on the surface of the first conductive layer away from the substrate; attaching a film to the surface of the dry film away from the substrate, and patterning the dry film with the film (for example, exposing the film and the dry film to ultraviolet light, and then etching the dry film to form a pattern in the dry film) to obtain the first mask; and finally removing the film.
[0094] Illustratively, the method for preparing the second mask may refer to the method for preparing the first mask, and will not be described in detail herein.
[0095] It can be understood that the first mask exposes a portion of the surface of the first conductive layer away from the substrate, and prepares a first hole ring on the exposed portion of the surface; the second mask exposes a portion of the surface of the second conductive layer away from the substrate, and prepares a second hole ring on the exposed portion of the surface.
[0096] S320: Copper is plated in the areas defined by the first mask and the second mask surface to obtain a connecting portion.
[0097] It can be understood that during the copper plating process, a connecting structure is formed on the first conductive layer, the second conductive layer and the surface of the substrate near the through hole, a first hole ring is formed on the surface of the first conductive layer exposed by the first mask, and a second hole ring is formed on the surface of the second conductive layer exposed by the second mask. The first hole ring, the second hole ring and the connecting structure are formed through a one-time process, and the connecting structure does not fill the through hole.
[0098] A third aspect of the present application provides a display panel, which includes the above-mentioned substrate.
[0099] The display panel of the embodiment of the present application may include, in addition to the substrate described above, structures that a conventional display panel should have, such as a light-emitting device, a packaging layer, etc., which will not be elaborated herein.
[0100] Exemplarily, the display panel may be a flexible display panel, and the display panel may also have a narrow frame. Exemplarily, the display panel may be used for color display, and may also be used for black and white display. Exemplarily, the display panel may be used for displaying dynamic images, and may also be used for displaying static images.
[0101] There is no particular limitation on the type of display panel in the embodiments of the present application, and may include but is not limited to mobile phones, tablets, televisions, wearable devices, etc.
[0102] The present application is further described below in conjunction with specific embodiments. It should be noted that the following embodiments are only used to explain the present application and cannot be understood as limiting the present application.
[0103] Example 1
[0104] The structure of the substrate includes:
[0105] substrate;
[0106] A first conductive layer and a second conductive layer located on two opposite surfaces of the substrate;
[0107] A through hole, penetrating the substrate, the first conductive layer, and the second conductive layer;
[0108] A first hole ring is located on a surface of the first conductive layer away from the substrate and surrounds the through hole, and the first hole ring is a circular ring;
[0109] A second hole ring is located on a surface of the second conductive layer away from the substrate and surrounds the through hole, and the second hole ring is a circular ring;
[0110] A connection structure is located on the surfaces of the first conductive layer, the substrate and the second conductive layer close to the through hole and is electrically connected to the first hole ring and the second hole ring;
[0111] An orthographic projection area of the first aperture ring on the substrate is greater than an orthographic projection area of the second aperture ring on the substrate.
[0112] Take 5 substrates of this embodiment, numbered 1, 2, 3, 4, and 5 respectively, and repeatedly bend the substrates 90 degrees in the thickness direction of the substrates. Use a multimeter to measure the resistance of the substrates until the circuit breaks, and record the number of bends.
[0113] The number of times the substrate is bent until the circuit is broken and the resistance value of the substrate corresponding to each bending are shown in Table 1 below:
[0114] Table 1
[0115]
[0116]
[0117] Comparative Example 1
[0118] The structure of the substrate includes:
[0119] substrate;
[0120] A first conductive layer and a second conductive layer located on two opposite surfaces of the substrate;
[0121] A through hole, penetrating the substrate, the first conductive layer, and the second conductive layer;
[0122] A first hole ring is located on a surface of the first conductive layer away from the substrate and surrounds the through hole, and the first hole ring is a circular ring;
[0123] A second hole ring is located on a surface of the second conductive layer away from the substrate and surrounds the through hole, and the second hole ring is a circular ring;
[0124] A connection structure is located on the surfaces of the first conductive layer, the substrate and the second conductive layer close to the through hole and is electrically connected to the first hole ring and the second hole ring;
[0125] The orthographic projection area of the first aperture ring on the substrate is equal to the orthographic projection area of the second aperture ring on the substrate.
[0126] Take 3 substrates of this comparative example, number them 1, 2, and 3 respectively, and repeatedly bend the substrates 90 degrees in the thickness direction of the substrates. Use a multimeter to measure the resistance of the substrates until the circuit breaks, and record the number of bends.
[0127] The number of times the substrate of this comparative example is bent until the circuit breaks, and the resistance value of the substrate corresponding to each bending are shown in Table 2 below:
[0128] Table 2
[0129]
[0130] It can be seen from the data in Table 1 and Table 2 that the substrate in the embodiment of the present application has better bending performance and can increase the number of bending times.
[0131] Generally, a substrate that can be bent 9 times has a higher yield rate. The substrate in comparative example 1 has at least a 50% probability of being defective and latently defective, while the substrate in the embodiment of the present application can increase the yield rate to 100%, thereby improving product reliability and having very excellent product competitiveness.
[0132] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.
[0133] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A substrate, characterized in that: include: substrate; A first conductive layer, located on one surface of the substrate; a second conductive layer, located on a surface of the substrate opposite to the first conductive layer; a through hole, wherein along the thickness direction of the substrate, the through hole penetrates the first conductive layer, the substrate and the second conductive layer; A connecting portion, the connecting portion comprising a first hole ring, a second hole ring and a connecting structure, the first hole ring is located on a surface of the first conductive layer away from the substrate, the second hole ring is located on a surface of the second conductive layer away from the substrate, the first hole ring and the second hole ring respectively surround the through hole, and the connecting structure is located in the through hole and connects the first hole ring and the second hole ring; The orthographic projection areas of the first aperture ring and the second aperture ring on the substrate are not equal.
2. The substrate according to claim 1, characterized in that The area of the orthographic projection of the first hole ring on the substrate is 10% to 50%, preferably 20% to 40%, larger than the area of the orthographic projection of the second hole ring on the substrate.
3. The substrate according to claim 1, characterized in that The shape of the orthographic projection of the first aperture ring on the substrate includes at least one of a circle, a square, an ellipse and a polygon; The shape of the orthographic projection of the second hole ring on the substrate includes at least one of a circle, a square, an ellipse and a polygon.
4. The substrate according to claim 1, characterized in that The center of the first hole ring, the center of the through hole and the center of the second hole ring are in a straight line; Preferably, the connection structure is located on surfaces of the substrate, the first conductive layer and the second conductive layer close to the through hole.
5. The substrate according to claim 1, characterized in that The orthographic projection of the first conductive layer on the substrate covers the orthographic projection of the first hole ring on the substrate; Preferably, the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the second hole ring on the substrate.
6. The substrate according to claim 1, characterized in that The substrate comprises a flexible circuit board; Preferably, the material of the connecting portion includes copper; Preferably, the material of the first conductive layer includes copper, and the material of the second conductive layer includes copper.
7. A method for preparing a substrate, characterized in that: include: A first conductive layer and a second conductive layer are respectively formed on two opposite surfaces of the substrate; Opening a through hole that penetrates the first conductive layer, the substrate, and the second conductive layer; Prepare a connecting portion, the connecting portion comprising a first hole ring, a second hole ring and a connecting structure, the first hole ring is located on a surface of the first conductive layer away from the substrate, the second hole ring is located on a surface of the second conductive layer away from the substrate, the first hole ring and the second hole ring surround the through hole respectively, and the connecting structure is located in the through hole and connects the first hole ring and the second hole ring; The orthographic projection areas of the first aperture ring and the second aperture ring on the substrate are not equal.
8. The preparation method according to claim 7, characterized in that: The preparation of the connecting portion comprises: The connecting portion is prepared by electroplating.
9. The preparation method according to claim 7, characterized in that: The preparation of the connecting portion comprises: A first mask is covered on a surface of the first conductive layer away from the substrate, and a second mask is covered on a surface of the second conductive layer away from the substrate; The orthographic projection of the first mask on the substrate is connected to the orthographic projection of the first aperture ring on the substrate, and the orthographic projection of the second mask on the substrate is connected to the orthographic projection of the second aperture ring on the substrate; The connecting portion is obtained by copper plating in the areas defined by the surfaces of the first mask and the second mask.
10. A display panel, characterized in that: A substrate comprising the substrate according to any one of claims 1 to 6.