An ESD device with pin protection and application method

Abstract

The present invention relates to an ESD device with pin protection and an application method, comprising an ESD device body, wherein a plurality of pins are arranged on both sides of the left and right sides of the ESD device body; a protective plate is detachably connected to the bottom surface of the ESD device body, and accommodating grooves for accommodating the pins are arranged on the left and right sides of the protective plate; the protective plate has a first installation state and a second installation state on the bottom surface of the ESD device body, and the protective plate in the first installation state is perpendicular to the protective plate in the second installation state; in the first installation state, a plurality of pins are accommodated in the accommodating grooves in a one-to-one correspondence; in the second installation state, the accommodating groove is used to dissipate heat for the ESD device body, and the protective plate provides support for the ESD device body; it can provide protection for the pins in all directions and angles, and is convenient for transportation and storage; it can also provide support force for the ESD device body, and can also greatly increase the surface area of ​​the ESD device body, and significantly improve the heat dissipation performance.

Description

Technical Field

[0001] The present invention relates to the technical field of ESD devices, and more specifically, to an ESD device with pin protection and an application method thereof. Background Art

[0002] ESD devices are used to prevent electronic components or devices from being damaged under the action of an electrostatic field, and are usually mounted on the surface of a circuit board. ESD devices generally include a substrate layer and a ceramic layer deposited on the substrate. The ceramic layer is composed of a ceramic electrostatic discharge material. Currently used ESD devices usually do not have the ability to protect pins by themselves, and an additional protective shell needs to be configured to protect their pins. Pin protection grooves are provided on the protective shell. Although the protective shell can be recycled after use, there is still a problem of waste of resources. At the same time, the improvement of the heat dissipation performance of ESD devices usually needs to rely on improving the thermal conductivity of the materials that make up themselves, which has great limitations. At the same time, the cost of high-thermal-conductivity insulating materials is also relatively high, and the improvement of the heat dissipation performance is also very limited. There is a need for an ESD device with pin protection and an application method that can take into account both pin protection and heat dissipation performance. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an ESD device with pin protection and an application method of an ESD device with pin protection in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0005] Construct an ESD device with pin protection, which includes an ESD device body, and a plurality of pins are provided on both the left and right sides of the ESD device body; a protective plate is detachably connected to the bottom surface of the ESD device body, and receiving grooves for receiving the pins in one-to-one correspondence are provided on both the left and right sides of the protective plate; the protective plate has a first installation state and a second installation state on the bottom surface of the ESD device body, and the protective plate in the first installation state is perpendicular to the protective plate in the second installation state; in the first installation state, a plurality of pins are received in the receiving grooves in one-to-one correspondence; in the second installation state, the receiving grooves are used for dissipating heat from the ESD device body, and at the same time the protective plate provides support for the ESD device body.

[0006] In the ESD device with pin protection of the present invention, the protective plate is composed of a heat-conducting layer and an elastic layer arranged up and down.

[0007] In the ESD device with pin protection of the present invention, the receiving grooves penetrate through the heat-conducting layer and the elastic layer.

[0008] The ESD device with pin protection according to the present invention, wherein a plurality of through holes are horizontally arranged on the heat-conducting layer, springs are arranged in the through holes, the middle parts of the springs are fixed in the through holes, and movable rods are respectively connected to both ends of the springs; insulating clamping claws corresponding to the pins one by one are arranged at the ends of the movable rods;

[0009] In the first installation state, the insulating clamping claws clamp and fix the pins one by one, and the springs are in an undeformed state.

[0010] The ESD device with pin protection according to the present invention, wherein in the second installation state, the two insulating clamping claws connected to the same spring clamp the ESD device body, and the springs are in a deformed state.

[0011] The ESD device with pin protection according to the present invention, wherein a heat-absorbing layer is arranged on the upper surface of the heat-conducting layer, and the surface of the heat-absorbing layer is communicated with a plurality of the receiving grooves.

[0012] The ESD device with pin protection according to the present invention, wherein the heat-absorbing layer is made of heat-conducting silica gel.

[0013] A method for applying an ESD device with pin protection, which applies the ESD device with pin protection as described above, wherein the method includes the following steps:

[0014] In the state where the chip is not assembled, the protection plate is in the first installation state on the bottom surface of the ESD device body, and a plurality of pins are respectively received in the receiving grooves;

[0015] When the chip is assembled, the protection plate is adjusted to the second installation state, the pins are exposed for welding, the receiving grooves dissipate heat from the ESD device body, and at the same time, the protection plate provides support for the ESD device body.

[0016] The beneficial effects of the present invention are as follows: In the state where the chip is not assembled, the protection plate is in the first installation state on the bottom surface of the ESD device body, and a plurality of pins are respectively received in the receiving grooves, which can provide protection for the pins in all directions and at multiple angles, facilitating transportation and storage; when the chip is assembled, the protection plate is adjusted to the second installation state, the pins are exposed for welding, the receiving grooves dissipate heat from the ESD device body, and at the same time, the protection plate provides support for the ESD device body, without interfering with the welding, and not only can provide a supporting force for the ESD device body, but also can greatly increase the surface area of the ESD device body, significantly improving the heat dissipation performance; the overall structure is simple, the processing is convenient, and the cost is relatively low. Description of the Drawings

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will further explain the present invention in conjunction with the accompanying drawings and embodiments. The accompanying drawings in the following description are only partial embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings:

[0018] Figure 1 is a structural cross-sectional view of the ESD device with pin protection in the first installation state of a preferred embodiment of the present invention;

[0019] Figure 2 is a top view of the ESD device with pin protection in the first installation state of a preferred embodiment of the present invention;

[0020] Figure 3 is a top view of the ESD device with pin protection in the second installation state of a preferred embodiment of the present invention. Detailed implementation manners

[0021] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are partial embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

[0022] The ESD device with pin protection in a preferred embodiment of the present invention, as Figure 1 shown, and referring to Figure 2 and Figure 3 , includes an ESD device body 1, and a plurality of pins 10 are provided on both the left and right sides of the ESD device body 1; a protective plate 2 is detachably connected to the bottom surface of the ESD device body 1, and accommodation grooves 20 for accommodating the pins 10 in a one-to-one correspondence are provided on both the left and right sides of the protective plate 2; the protective plate 2 has a first installation state and a second installation state on the bottom surface of the ESD device body 1, and the protective plate 2 in the first installation state is perpendicular to the protective plate 2 in the second installation state; in the first installation state, a plurality of pins 10 are accommodated in the accommodation grooves 20 in a one-to-one correspondence; in the second installation state, the accommodation grooves 20 are used for dissipating heat from the ESD device body 1, and at the same time, the protective plate 2 provides support for the ESD device body 1;

[0023] In the state where the chip is not assembled, the protective plate 2 is in the first installation state on the bottom surface of the ESD device body 1, and a plurality of pins 10 are accommodated in the accommodation grooves 20 in a one-to-one correspondence, which can provide protection for the pins 10 in all directions and at multiple angles, facilitating transportation and storage;

[0024] When the chip is assembled, the protective plate 2 is adjusted to the second installation state, and the pins 10 are exposed for welding. The receiving groove 20 dissipates heat from the ESD device body 1, and at the same time, the protective plate 2 provides support for the ESD device body 1, which will not interfere with the welding. It can not only provide a supporting force for the ESD device body 1, but also greatly increase the surface area of the ESD device body 1, significantly improving the heat dissipation performance;

[0025] The overall structure is simple, easy to process, and the cost is relatively low at the same time.

[0026] Preferably, the protective plate 2 is composed of a heat-conducting layer 200 and an elastic layer 201 arranged vertically, and the receiving groove 20 penetrates through the heat-conducting layer 200 and the elastic layer 201.

[0027] Preferably, a plurality of through holes 21 are horizontally arranged on the heat-conducting layer 200, springs 22 are arranged in the through holes 21, the middle of the spring 22 is fixed in the through hole 21, and two ends of the spring 22 are respectively connected with a movable rod 23; an insulating claw 24 corresponding to the pin 10 one by one is arranged at the end of the movable rod 23;

[0028] In the first installation state, the insulating claws 24 clamp and fix the pins 10 one by one, and the spring 22 is in an undeformed state;

[0029] In the second installation state, two insulating claws connected to the same spring clamp the ESD device body, and the spring is in a deformed state;

[0030] In the first installation state, the pins 10 are clamped by the insulating claws 24 to complete the connection between the ESD device body 1 and the protective plate 2. In the second installation state, the spring is stretched, and the ESD device body is clamped by the insulating claws. In this way, there is no need to change the structure of the ESD device body, and at the same time, it has good applicability to ESD devices of different sizes, which is convenient for popularization;

[0031] The insulating claw 24 can adopt the existing elastic claw style, and there is no limitation on it.

[0032] Preferably, a heat-absorbing layer 202 is arranged on the upper surface of the heat-conducting layer 200, and the surface of the heat-absorbing layer 202 is communicated with a plurality of receiving grooves 20, which is convenient for ensuring the heat absorption and heat dissipation effect.

[0033] Preferably, the heat-absorbing layer 202 is made of heat-conducting silica gel, and materials such as graphene can also be used, and there is no limitation on this.

[0034] A method for applying an ESD device with pin protection, applying the ESD device with pin protection as described above, wherein the method includes the following steps:

[0035] In the unassembled state of the chip, the protective plate is in the first installation state at the bottom surface of the ESD device body, and multiple pins are respectively received in the receiving grooves;

[0036] When the chip is assembled, the protective plate is adjusted to the second installation state, and the pins are exposed for welding. The receiving grooves dissipate heat from the ESD device body, and at the same time, the protective plate provides support for the ESD device body;

[0037] The pins have good protection performance, and can not only provide a supporting force for the ESD device body, but also greatly increase the surface area of the ESD device body, significantly improving the heat dissipation performance; The overall structure is simple, the processing is convenient, and the cost is relatively low.

[0038] It should be understood that those of ordinary skill in the art can make improvements or changes according to the above description, and all such improvements and changes should fall within the protection scope of the appended claims of the present invention.

Claims

1. An ESD device with pin protection, comprising an ESD device body, wherein a plurality of pins are arranged on both the left and right sides of the ESD device body; a protective plate is detachably connected to the bottom surface of the ESD device body, and a receiving groove for receiving the pins is arranged on the left and right sides of the protective plate; characterized in that: The protection plate has a first installation state and a second installation state on the bottom surface of the ESD device body, and the protection plate in the first installation state is perpendicular to the protection plate in the second installation state; in the first installation state, a plurality of pins are accommodated in the accommodation groove in a one-to-one correspondence; In the second installation state, the receiving groove is used to dissipate heat for the ESD device body, and the protection plate provides support for the ESD device body.

2. The ESD device with pin protection according to claim 1, characterized in that: The protective plate is composed of an upper heat-conducting layer and a lower elastic layer.

3. The ESD device with pin protection according to claim 2, characterized in that: The receiving groove penetrates the heat conducting layer and the elastic layer.

4. The ESD device with pin protection according to claim 3, characterized in that: A plurality of through holes are transversely arranged in the heat conducting layer, a spring is arranged in the through hole, the middle part of the spring is fixed in the through hole, and both ends of the spring are respectively connected to a movable rod; the ends of the movable rod are provided with insulating claws corresponding to the pins one by one; In the first installation state, the insulating claws clamp and fix the pins one by one, and the spring is in an undeformed state.

5. The ESD device with pin protection according to claim 4, characterized in that: In the second installation state, the two insulating claws connected to the same spring clamp the ESD device body, and the spring is in a deformed state.

6. The ESD device with pin protection according to claim 2, characterized in that: A heat absorbing layer is disposed on the upper surface of the heat conducting layer, and the surface of the heat absorbing layer is communicated with the plurality of containing grooves.

7. The ESD device with pin protection according to claim 6, characterized in that: The heat absorption layer is made of heat-conductive silica gel.

8. An application method of an ESD device with pin protection, using the ESD device with pin protection as claimed in any one of claims 1 to 7, characterized in that: The method comprises the following steps: When the chip is not assembled, the protection plate is in a first installation state on the bottom surface of the ESD device body, and the plurality of pins are accommodated in the accommodation grooves in a one-to-one correspondence; When assembling the chip, the protection plate is adjusted to the second installation state, the pins are exposed for welding, the receiving groove dissipates heat for the ESD device body, and the protection plate provides support for the ESD device body.

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