Printed circuit board assembly, manufacturing method of printed circuit board assembly and electronic equipment

Abstract

The invention provides a printed circuit board assembly, a manufacturing method of the printed circuit board assembly and electronic equipment, the printed circuit board assembly comprises a mainboard and a daughter board, a chip is arranged on one side of the mainboard, the daughter board is arranged on one side, away from the chip, of the mainboard, and a power conversion module and a power supply module which are in signal connection are arranged on the daughter board. The mainboard is in signal connection with the daughter board, and the power supply module is used for supplying power to the chip. The power conversion module and the power supply module are arranged on the daughter board, so that the space of the main board is saved, the problem that the wiring space of the main board is limited is solved, the power supply module can be arranged at the position close to the chip, voltage drop is reduced, and electric energy loss is reduced. The printed circuit board assembly has the advantages of small voltage drop, small electric energy loss and abundant wiring space.

Description

Technical Field

[0001] The present invention relates to the field of printed circuit board design and power supply, and in particular to a printed circuit board assembly, a method for manufacturing the printed circuit board assembly and electronic equipment. Background Art

[0002] The operation of each chip on the printed circuit board is inseparable from the power supply of the power module. At present, the industry basically uses the front layout of the power supply, and then supplies the chip through the low-resistance power layer. The power supply module needs to pass through the plane and vias of the printed circuit board to transmit the power to the chip, which causes a relatively large voltage drop in the transmission link, resulting in power loss. As the competition in the electronic product market becomes more and more fierce, the cost control requirements for printed circuit boards are also gradually increasing, and the number of layers of printed circuit boards is compressed, which has the effect of making the wiring space more tight. Especially for chips working with high current, the number of phases of the power module increases accordingly, making the layout and wiring of the power supply more severe.

[0003] In view of this, it is necessary to provide a new printed circuit board assembly, a method for manufacturing a printed circuit board assembly and an electronic device to solve or at least alleviate the above technical defects. Summary of the invention

[0004] The main purpose of the present invention is to provide a printed circuit board assembly, a method for manufacturing a printed circuit board assembly and an electronic device, aiming to solve the technical problems of large power loss in the power supply module and tight wiring space in the prior art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present invention, the present invention provides a printed circuit board assembly, including a main board and a daughter board, a chip is arranged on one side of the main board, the daughter board is arranged on the side of the main board away from the chip, a signal-connected power conversion module and a power supply module are arranged on the daughter board, the main board and the daughter board are signal-connected, and the power supply module is used to supply power to the chip.

[0006] According to another embodiment of the present invention, the present invention further provides a method for manufacturing a printed circuit board assembly, the method for manufacturing the printed circuit board assembly comprising the following steps:

[0007] A main board and a sub-board are provided; wherein the sub-board is provided with a sub-power supply layer;

[0008] A chip and a main power via are arranged on the main board, a power conversion module, a power supply module and a sub-power via are arranged on the sub-board, and the power supply module is respectively connected to the power conversion module and the sub-power layer signal;

[0009] A connection column for signal connection between the main power via hole and the sub-power via hole is formed by sintering copper paste.

[0010] According to another embodiment of the present invention, the present invention further provides an electronic device, the electronic device comprising the above-mentioned printed circuit board assembly; and / or,

[0011] The printed circuit board assembly is manufactured by the above-mentioned manufacturing method of the printed circuit board assembly.

[0012] In the above invention, the printed circuit board assembly includes a main board and a sub-board, a chip is arranged on one side of the main board, a sub-board is arranged on the side of the main board away from the chip, a signal-connected power conversion module and a power supply module are arranged on the sub-board, the main board and the sub-board are signal-connected, and the power supply module is used to supply power to the chip. By adding a sub-board outside the main board, a signal-connected power conversion module and a power supply module are arranged on the sub-board, the power conversion module and the power supply module arranged on the main board in the related technology are moved to the sub-board, and the main board and the sub-board are signal-connected, and the chip can also be powered by the power supply module. By moving the power conversion module and the power supply module to the sub-board, the space of the main board is saved, and the problem of tight wiring space of the main board is solved. Moreover, in the related art, due to the influence of the heat sink and high-speed signal optical module or cable connector assembly on the mainboard, the power supply module can only be set at a position far away from the chip. At the same time, since the solder balls and signal vias will destroy the integrity of the power plane, the resistance is further increased, and the voltage drop of the power supply module is relatively large. By setting the power supply module on the sub-board, the power supply module can be set close to the chip, reducing the voltage drop, thereby reducing the power loss. The invention has the advantages of small voltage drop, small power loss and ample wiring space. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0014] Figure 1 A top view of a printed circuit board assembly in the related art;

[0015] Figure 2 It is a schematic diagram of a side cross-sectional structure of a printed circuit board assembly in the related art;

[0016] Figure 3 An exploded view of a printed circuit board assembly according to an embodiment of the present invention;

[0017] Figure 4A top view of a mainboard of a printed circuit board assembly according to an embodiment of the present invention;

[0018] Figure 5 It is a schematic diagram of the structure of each layer of the mainboard of the printed circuit board assembly according to an embodiment of the present invention;

[0019] Figure 6 A bottom view of a mainboard of a printed circuit board assembly according to an embodiment of the present invention;

[0020] Figure 7 A top view of a mainboard of a printed circuit board assembly according to an embodiment of the present invention;

[0021] Figure 8 A schematic diagram of the structure of each layer of a mainboard of a printed circuit board assembly according to an embodiment of the present invention;

[0022] Fig. 9 A bottom view of a mainboard of a printed circuit board assembly according to an embodiment of the present invention;

[0023] Fig.10 A schematic diagram of the structure of a printed circuit board assembly according to an embodiment of the present invention;

[0024] Fig.11 A comparison table of the measurement results of the printed circuit board assembly of the embodiment of the present invention and the traditional board simulation case;

[0025] Fig.12 The present invention is a flowchart of a method for manufacturing a printed circuit board assembly according to an embodiment of the present invention.

[0026] Description of labels:

[0027] 001, power conversion module; 101, power supply module; 201, chip; 301, power pin; 401, heat sink; 501, connector assembly; 601, main board; 701, daughter board; 801, signal layer; 901, signal reference ground plane; 1001, signal via; 1101, main power via; 1201, sub-power via; 1301, power plane layer; 1401, ground layer; 1501, connecting column; 1601, sub-power layer; 1702, sub-ground layer.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, in the present invention, the descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0032] Furthermore, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] like Figure 1 and Figure 2 As shown, Figure 1 and Figure 2 The schematic diagram of the structure of the printed circuit board assembly in the related art is that the power supply module 101 and the chip 201 are on the same single board, and the power supply module 101 may occupy Figure 1All positions marked with 101 may only occupy some of them. Among them, 301 is the power pin of the chip, 401 is the heat sink, 501 is the connector component of the high-speed signal optical module or cable, 001 is the power conversion module, 801 is the signal layer, 901 is the ground plane for signal reference, 1301 is the power plane layer, 1401 is the ground layer, and the power plane layer 1301 and the signal layer 801 share a single board. Under this power supply structure, firstly, affected by the heat sink 401, the optical module and the connector assembly 501, the power supply module 101 is placed far away from the chip 201, and the voltage drop of the power supply network is relatively large; at the same time, a large number of signal via pads inside the package array will destroy the integrity of the power plane layer 1301, further increase the DC resistance, and increase the voltage drop; in addition, due to the influence of the above two factors, it is necessary to increase the number of layers of the power plane layer 1301 to compensate for the loss of voltage drop, resulting in an increase in the total number of PCB layers, thereby increasing costs and reducing product competitiveness; finally, there will be noise coupling between the power plane layer 1301 and the signal layer 801, which will reduce the signal transmission quality.

[0034] Reference Figure 3 According to one aspect of the present invention, the present invention provides a printed circuit board assembly, including a main board 601 and a sub-board 701, a chip 201 is arranged on one side of the main board 601, a sub-board 701 is arranged on the side of the main board 601 away from the chip 201, a signal-connected power conversion module 001 and a power supply module 101 are arranged on the sub-board 701, the main board 601 and the sub-board 701 are signal-connected, and the power supply module 101 is used to supply power to the chip 201.

[0035] In the above embodiment of the present invention, a sub-board 701 is added outside the main board 601, and a power conversion module 001 and a power supply module 101 with signal connection are arranged on the sub-board 701. The power conversion module 001 and the power supply module 101 arranged on the main board 601 in the related art are moved to the sub-board 701, and the main board 601 and the sub-board 701 are signal connected, and the chip 201 can also be powered by the power supply module 101. By moving the power conversion module 001 and the power supply module 101 to the sub-board 701, the space of the main board 601 is saved, and the problem of tight wiring space of the main board 601 is solved. Moreover, in the related art, due to the influence of the heat sink 401 on the mainboard 601 and the connector assembly 501 of the high-speed signal optical module or cable, the power supply module 101 can only be set at a position far away from the chip 201. At the same time, since the solder balls and the signal vias 1001 will destroy the integrity of the power plane, the resistance is further increased, and the voltage drop of the power supply module 101 is relatively large. This embodiment can set the power supply module 101 on the sub-board 701, so that the power supply module 101 can be set close to the chip 201, reducing the voltage drop, and thus reducing the power loss. This embodiment has the advantages of small voltage drop, small power loss and ample wiring space.

[0036] In addition, this embodiment moves the power supply module 101 out of the mainboard 601, which can reduce the number of power plane layers 1301, thereby reducing the total number of layers and reducing the cost of printed circuit boards. The mainboard 601 has a high-speed network signal layer 801, which requires a more expensive printed circuit board, while the sub-board 701 can use a lower-cost low-speed board material. Fig.11 , Fig.11 This is a comparison table of the voltage drop, plate type and number of layers of the traditional board and the printed circuit board assembly of this application. It can be seen from the data in the chart that the voltage drop of the traditional board is 75mV, and all the plates used are high-speed plates M8, with 30 layers; the voltage drop of the printed circuit board assembly of this application is 53mV, and the voltage drop can be reduced by 29.3%. The plate is reduced from all high-speed plates M8 to high-speed plates M8 for the main board + low-speed and low-cost plates FR-4 for the sub-board, which reduces the cost of the plate. At the same time, the number of layers is 12 layers of M8 + 14 layers of FR-4, and the total number of layers is 26, and the total number of layers is reduced by 4 layers, which brings obvious beneficial effects.

[0037] Reference Figure 6 , Figure 7 and Fig.10In some embodiments, a main power via 1101 and a signal via 1001 are provided on the main board 601, a main pad is provided at the position of the main power via 1101, a sub-power via 1201 is provided on the sub-board 701, and a sub-pad is provided at the position of the sub-power via 1201. The printed circuit board assembly also includes a connecting column 1501, and the connecting column 1501 connects the main pad and the sub-pad to achieve signal connection and physical connection between the main board 601 and the sub-board 701. The connecting column 1501 here can be a metal column, such as a copper column. The connecting column 1501 connects the main power via 1101 and the sub-power via 1201 through the main pad and the sub-pad, which not only plays a role in signal connection, realizing the signal connection between the main board 601 and the sub-board 701, but also plays a role in physical support, connecting the main board 601 and the sub-board 701 through the physical strength of the connecting column 1501, and plays a role in physical connection. Through the connection of the connecting column 1501, it is no longer necessary to set up additional screw parts to connect the main board 601 and the sub-board 701. The same component realizes the two functions of signal connection and physical connection, which is convenient to manufacture and simplifies the process steps.

[0038] Reference Fig. 9 In some embodiments, the number of the power supply module 101 is at least one, and at least one power supply module 101 is disposed on the periphery of the main power via 1101. The number of the power supply module 101 may be one, two, three, four or other numbers. Fig. 9 There are four as shown in FIG. The specific position and distribution of the power supply module 101 are not specifically limited, but can be arranged near the periphery of the main power via 1101. This design can make the power supply module 101 as close to the chip 201 as possible to reduce the voltage drop. Figure 8 In some embodiments, a sub-power layer 1601 is provided in the sub-board 701, and the sub-power layer 1601 is connected to the power supply module 101 and the sub-power via 1201 respectively, and realizes physical connection and signal connection with the main board 601 through the connecting column 1501. In other embodiments, a sub-ground layer 1702 is also provided in the sub-board 701, and the sub-power layer 1601 and the sub-ground layer 1702 are alternately stacked, and the signal layer 801 is arranged on the main board 601. The specific number of layers of the sub-power layer 1601 and the sub-ground layer 1702 can be determined according to actual needs. Since there is only a power network on the sub-board 701, the requirements for the board material of the sub-board 701 are not high, and a low-cost board material can be used. The present invention lays the sub-power layer 1601 and the signal layer 801 separately, reduces the noise coupling between the power supply and the signal, ensures the integrity of the sub-power plane, and improves the power supply efficiency of the power supply module 101.

[0039] Reference Figure 3 and Figure 4In some embodiments, the chip 201 includes a power pin 301, and the power supply module 101 is disposed close to the power pin 301. The power supply module 101 is disposed close to the power pin 301 of the chip 201, so as to make the power supply module 101 closer to the chip 201, thereby reducing the voltage drop of the power supply link.

[0040] In some embodiments, the power conversion module 001 and the power supply module 101 are both arranged on the side of the sub-board 701 away from the main board 601. The power conversion module 001 and the power supply module 101 are arranged at the bottom of the sub-board 701 to avoid being too close to the components of the main board 601 to cause signal interference. The power conversion module 001 mainly converts a large voltage into a small voltage, and can be composed of a variety of power conversion modules 001, such as 0.7V, 0.8V and 1.0V.

[0041] Reference Figure 3 and Figure 4 In some embodiments, a heat sink 401 and a connector assembly 501 are also provided on the mainboard 601. The heat sink 401 is provided on the side of the chip 201 away from the mainboard 601 and is in contact with the chip 201. The connector assembly 501 is provided on the side of the mainboard 601 facing away from the ion plate 701. The heat sink 401 is used to accelerate the heat dissipation of the chip 201, and is therefore generally provided close to the chip 201 or around the periphery of the chip 201.

[0042] Reference Fig.12 , Fig.12 The flowchart of the method for manufacturing a printed circuit board assembly according to an embodiment of the present invention is as follows. The method for manufacturing a printed circuit board assembly comprises the following steps:

[0043] S100, providing a main board 601 and a sub-board 701; wherein the sub-board 701 is provided with a sub-power supply layer 1601;

[0044] The main board 601 is used to set the chip 201 , the heat sink 401 and components such as the connector assembly, and the sub-board 701 is formed with a power layer for realizing signal connection with the main board 601 .

[0045] S200, a chip 201 and a main power via 1101 are arranged on the main board 601, a power conversion module 001, a power supply module 101 and a sub-power via 1201 are arranged on the sub-board 701, and the power supply module 101 is signal-connected to the power conversion module 001 and the sub-power layer 1601 respectively;

[0046] The power supply module 101 and the power conversion module 001 are both arranged on the sub-board 701 , which can reduce the space occupied by the main board 601 , and in order to reduce the voltage drop, the power supply module 101 can be arranged at a position close to the sub-power via 1201 .

[0047] S300 , forming a connection column 1501 for signal connection between the main power via 1101 and the sub-power via 1201 by sintering copper paste.

[0048] By pouring high-temperature copper plating paste on the main pad of the main board 601 and the sub-pad column of the sub-board 701, the copper paste is cooled to form a copper connecting column 1501. Since the copper paste is conductive and has a certain strength and can conduct electricity, the connecting column 1501 formed after the copper paste is cooled can serve as both a signal connection and a physical support.

[0049] In the above embodiment of the present invention, a sub-board 701 is added outside the main board 601, and a power conversion module 001 and a power supply module 101 with signal connection are arranged on the sub-board 701. The power conversion module 001 and the power supply module 101 arranged on the main board 601 in the related art are moved to the sub-board 701, and the main board 601 and the sub-board 701 are signal connected, and the chip 201 can also be powered by the power supply module 101. By moving the power conversion module 001 and the power supply module 101 to the sub-board 701, the space of the main board 601 is saved, and the problem of tight wiring space of the main board 601 is solved. Moreover, in the related art, due to the influence of the heat sink 401 and the high-speed signal optical module or cable connector assembly 501 on the mainboard 601, the power supply module 101 can only be set at a position far away from the chip 201. At the same time, since the solder balls and signal vias 1001 will destroy the integrity of the power plane, the resistance is further increased, and the voltage drop of the power supply module 101 is relatively large. This embodiment can set the power supply module 101 close to the chip 201 by setting the power supply module 101 on the sub-board 701, thereby reducing the voltage drop and thus reducing the power loss. This embodiment has the advantages of small voltage drop, small power loss and ample wiring space. In addition, this embodiment moves the power supply module 101 out of the mainboard 601, which can reduce the number of power plane layers 1301, so the total number of layers is reduced, which can reduce the cost of the printed circuit board.

[0050] According to another embodiment of the present invention, the present invention further provides an electronic device, the electronic device includes the above-mentioned printed circuit board assembly; and / or the printed circuit board assembly is made by the above-mentioned printed circuit board assembly manufacturing method. Since the electronic device includes all the technical solutions of all the above-mentioned embodiments, at least all the beneficial effects brought by all the above-mentioned technical files are not described one by one here.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and do not limit the patent scope of the present invention; although the present application is described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that under the technical concept of the present invention, the technical solutions recorded in the aforementioned embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; or directly / indirectly applied to other related technical fields, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A printed circuit board assembly, characterized in that: It includes a main board and a sub-board, a chip is arranged on one side of the main board, the sub-board is arranged on the side of the main board away from the chip, a signal-connected power conversion module and a power supply module are arranged on the sub-board, the main board and the sub-board are signal-connected, and the power supply module is used to supply power to the chip.

2. The printed circuit board assembly according to claim 1, characterized in that: The main board is provided with a main power via, a main pad is provided at the position of the main power via, the sub-board is provided with a sub-power via, a sub-pad is provided at the position of the sub-power via, and the printed circuit board assembly also includes a connecting column, which connects the main pad and the sub-pad to achieve signal connection and physical connection between the main board and the sub-board.

3. The printed circuit board assembly according to claim 2, characterized in that: The number of the power supply module is at least one, and at least one of the power supply modules is arranged on the periphery of the main power via.

4. The printed circuit board assembly according to claim 2, characterized in that: A sub-power layer is arranged in the sub-board, and the sub-power layer is respectively connected to the power supply module and the sub-power via, and is physically connected and signal-connected to the main board through the connection column.

5. The printed circuit board assembly according to claim 4, characterized in that: A sub-ground layer is also arranged in the sub-board, and the sub-power layer and the sub-ground layer are alternately stacked.

6. The printed circuit board assembly according to any one of claims 1 to 5, characterized in that: The chip comprises a power pin, and the power supply module is arranged close to the power pin.

7. The printed circuit board assembly according to any one of claims 1 to 5, characterized in that: The power conversion module and the power supply module are both arranged on a side of the sub-board away from the main board.

8. The printed circuit board assembly according to claim 1, characterized in that: The mainboard is also provided with a heat sink and a connector assembly. The heat sink is arranged on a side of the chip away from the mainboard and is in contact with the chip. The connector assembly is arranged on a side of the mainboard away from the daughterboard.

9. A method for manufacturing a printed circuit board assembly, characterized in that: The method for manufacturing the printed circuit board assembly comprises the following steps: A main board and a sub-board are provided; wherein the sub-board is provided with a sub-power supply layer; A chip and a main power via are arranged on the main board, a power conversion module, a power supply module and a sub-power via are arranged on the sub-board, and the power supply module is respectively connected to the power conversion module and the sub-power layer signal; A connection column for signal connection between the main power via hole and the sub-power via hole is formed by sintering copper paste.

10. An electronic device, characterized in that: The electronic device comprises the printed circuit board assembly according to any one of claims 1 to 8; and / or, The printed circuit board assembly is manufactured by the method for manufacturing a printed circuit board assembly according to claim 9.

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