Etching method and etching apparatus

Abstract

The application discloses an etching method and an etching device, and has the following etching procedures: a first etching procedure, a two-fluid nozzle is used to spray a first etching liquid and compressed air on the surface of an etching object so as to etch the etching object; a second etching procedure, a two-fluid nozzle is used to spray compressed air and a second etching liquid on the etching object etched in the first etching procedure; the pressure of the compressed air of the two-fluid nozzle in the first etching procedure is less than the pressure of the compressed air of the two-fluid nozzle in the second etching procedure, and the etching rate of the second etching liquid is less than the etching rate of the first etching liquid. The application belongs to the technical field of etching, and aims to solve the problems of large compressed air demand and slow etching rate in the prior art. The technical effects are as follows: the best etching effect is ensured, the compressed air demand is reduced, and the etching rate is increased.

Description

Technical Field

[0001] This invention relates to the field of etching technology, specifically to etching methods, and also to etching apparatus. Background Technology

[0002] Etching is a fundamental process in circuit board manufacturing. It involves using an etching solution to etch away the copper on the circuit board that is not protected by the resist layer, ultimately forming conductive lines.

[0003] With the development of technology, the requirements for circuit precision are becoming increasingly stringent, and the industry has put forward higher requirements for the production of etched circuits on substrates. Existing technologies mainly use two etching techniques: one-fluid nozzle etching and two-fluid etching. However, one-fluid nozzle etching often results in the circuit clarity not meeting the process requirements. Although two-fluid etching technology can achieve the required circuit clarity, existing two-fluid etching technologies have problems such as large compressed air requirements, slow etching rate, and high energy consumption. Summary of the Invention

[0004] Therefore, the present invention provides an etching apparatus to solve the above-mentioned problems in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] According to a first aspect of the present invention, an etching method comprises the following etching steps:

[0007] The first etching process involves using a two-fluid nozzle to spray a first etching solution and compressed air onto the surface of the object to be etched, thereby etching the object.

[0008] In the second etching process, compressed air and second etching solution are simultaneously sprayed onto the etched object after the first etching process has been completed using a two-fluid nozzle.

[0009] The pressure of the compressed air in the two-fluid nozzle of the first etching process is less than the pressure of the compressed air in the two-fluid nozzle of the second etching process, and the etching rate of the second etching solution is less than the etching rate of the first etching solution.

[0010] Furthermore, both the first etching solution and the second etching solution are mixed solutions of HCl and NaClO3, with the HCl concentration of the first etching solution being greater than that of the second etching solution.

[0011] Furthermore, the HCl concentration of the first etching solution is 1.5 mol / L to 2.5 mol / L, and the HCl concentration of the second etching solution is 0.3 mol / L to 0.5 mol / L.

[0012] Furthermore, the pressure of the compressed air in the two-fluid nozzle of the first etching process is 2.0 bar, and the pressure of the compressed air in the two-fluid nozzle of the second etching process is 3.0 bar.

[0013] According to a first aspect of the present invention, an etching apparatus includes a first body, a second body, a first water pump, a second water pump, an air pump, a plurality of first two-fluid nozzles, and a plurality of second two-fluid nozzles. A first etching solution is disposed inside the first body, and a second etching solution is disposed inside the second body. The outlet of the first water pump is connected to the plurality of first two-fluid nozzles via a water pipe, and the outlet of the second water pump is connected to the plurality of second two-fluid nozzles via a water pipe. The inlet of the first water pump is connected to the first body and communicates with the first etching solution via a pipe, and the inlet of the second water pump is connected to the second body and communicates with the second etching solution via a pipe. The plurality of first two-fluid nozzles and the plurality of second two-fluid nozzles are all connected to the air pump via air pipes. The plurality of first two-fluid nozzles are all installed inside the first body, and the plurality of second two-fluid nozzles are all installed inside the second body.

[0014] Furthermore, it also includes a third water pump, a first suction head, a fourth water pump, and a second suction head. The inlet of the third water pump is connected to multiple first suction heads via a water pipe, and the outlet of the third water pump is connected to the first body via a water pipe and connected to the first etching solution. The inlet of the fourth water pump is connected to multiple second suction heads via a water pipe, and the outlet of the fourth water pump is connected to the second body via a water pipe and connected to the second etching solution.

[0015] Furthermore, it also includes a first Venturi tube and a second Venturi tube. One end of the first Venturi tube is connected to a third water pump via a water pipe, and the other end of the first Venturi tube is connected to the first body via a water pipe and connected to the first etching solution. The middle part of the first Venturi tube is connected to multiple first suction heads via a water pipe. One end of the second Venturi tube is connected to a fourth water pump via a water pipe, and the other end of the second Venturi tube is connected to the second body via a water pipe and connected to the second etching solution. The middle part of the second Venturi tube is connected to multiple second suction heads via a water pipe.

[0016] Furthermore, it also includes a first automatic regulating valve and a second automatic regulating valve. The first automatic regulating valve is installed on the water pipe between the first water pump and the plurality of first two-fluid nozzles, the water pipe between the third water pump and the first venturi tube, and the air pipe between the air pump and the plurality of first two-fluid nozzles. The second automatic regulating valve is installed on the water pipe between the second water pump and the plurality of second two-fluid nozzles, the water pipe between the fourth water pump and the second venturi tube, and the air pipe between the air pump and the plurality of second two-fluid nozzles.

[0017] Furthermore, it also includes a first pressure gauge and a second pressure gauge. The first pressure gauge is installed on the water pipe between the first water pump and the plurality of first two-fluid nozzles, on the water pipe between the third water pump and the first venturi tube, and on the air pipe between the air pump and the plurality of first two-fluid nozzles. The second pressure gauge is installed on the water pipe between the second water pump and the plurality of second two-fluid nozzles, on the water pipe between the fourth water pump and the second venturi tube, and on the air pipe between the air pump and the plurality of second two-fluid nozzles.

[0018] Furthermore, it also includes a conveying mechanism for conveying the etched object. Multiple first two-fluid nozzles are respectively disposed on the upper and lower sides of the conveying mechanism, and multiple second two-fluid nozzles are respectively disposed on the upper and lower sides of the conveying mechanism. Both the first body and the second body are connected to the conveying mechanism.

[0019] The present invention has the following advantages: by using a first etching solution in the first etching process and a second etching solution in the second etching process, the above etching method can reduce the amount of compressed air used by more than 30% compared with the traditional two-fluid etching; the etching rate is increased by more than 20% while ensuring the best etching effect. Attached Figure Description

[0020] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0021] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0022] Figure 1 This is a schematic diagram of the etching apparatus used in the first etching step of the etching method provided in some embodiments of the present invention.

[0023] Figure 2 This is a schematic diagram of the etching apparatus used in the second etching step of the etching method provided in some embodiments of the present invention.

[0024] Figure 3 This is a schematic diagram of the initial etching stage structure of an etching apparatus for etching objects, provided in some embodiments of the present invention.

[0025] Figure 4 This is a schematic diagram of the structure of an etching object after being etched by a first etching process, according to some embodiments of the present invention.

[0026] Figure 5 This is a schematic diagram of the structure of an etching device provided in some embodiments of the present invention, showing the etching of an object after a second etching process.

[0027] In the diagram: 101, First body; 102, First suction head; 103, First water pump; 104, First venturi tube; 105, First two-fluid nozzle; 106, Air pump; 107, First gas filter; 108, Third water pump; 109, First liquid filter; 110, First automatic regulating valve; 111, First pressure gauge; 112, First etching solution; 114, First collection tank; 201, Second body; 202, Second suction head; 2 03. Second water pump; 204. Second venturi tube; 205. Second two-fluid nozzle; 207. Second gas filter; 208. Fourth water pump; 209. Second liquid filter; 210. Second automatic regulating valve; 211. Second pressure gauge; 212. Second etching solution; 214. Second collection tank; 3. Etching object; 31. Substrate; 32. Conductive layer; 33. Anti-corrosion layer; 4. Conveying mechanism; 41. Lower roller; 42. Upper roller. Detailed Implementation

[0028] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] like Figures 1 to 5 As shown, an etching method according to a first aspect embodiment of the present invention includes the following etching steps:

[0030] The first etching process involves using a two-fluid nozzle to spray the first etching solution 112 and compressed air onto the surface of the object to be etched 3, thereby etching the object to be etched 3.

[0031] In the second etching process, compressed air and second etching solution 212 are simultaneously sprayed onto the etched object 3 after the first etching process is completed using a two-fluid nozzle.

[0032] The pressure of the compressed air in the two-fluid nozzle of the first etching process is less than the pressure of the compressed air in the two-fluid nozzle of the second etching process, and the etching rate of the second etching solution 212 is less than the etching rate of the first etching solution 112.

[0033] In the above embodiments, it should be noted that in both the first and second etching processes, the two-fluid nozzles spray compressed air directly onto the etched object 3. The first etching process is from the initial stage to the middle stage of etching. In this stage, the etching solution can easily penetrate into the middle of the circuit to etch the surface copper layer. Therefore, the equipment pressure is adjusted to use a smaller pressure to supply a small amount of compressed air to slightly reduce the size of the etching solution particles, thus achieving the desired etching effect. In this stage, the first etching solution, i.e., the solution with a faster etching rate, is used to achieve the purpose of quickly etching the surface copper layer. The second etching process is from the middle stage to the final etching stage. In this stage, the copper layer of the circuit is at the root of the circuit, and the solution has difficulty penetrating the root of the circuit for etching. In this stage, the equipment pressure needs to be adjusted to use a larger pressure to output a large amount of compressed air, making the etching solution particles very fine, achieving the ideal etching of the copper layer at the root of the circuit. At the same time, in order to further improve the etching accuracy, the second etching solution, i.e., the solution with a slower etching rate, is used to better protect the side of the circuit, reduce side etching, thereby increasing the etching factor and ultimately achieving the ideal etching effect.

[0034] The technical effects achieved by the above embodiments are as follows: compared with traditional two-fluid etching, the above etching method can reduce the amount of compressed air used by more than 30%; the etching rate is increased by more than 20% while ensuring the best etching effect.

[0035] Optional, such as Figures 1 to 5 As shown, in some embodiments, the first etching solution 112 and the second etching solution 212 are both mixed solutions of HCl and NaClO3, and the HCl concentration of the first etching solution 112 is greater than the HCl concentration of the second etching solution 212.

[0036] The first etching solution 112 has an HCl concentration of 1.5 mol / L to 2.5 mol / L, and the second etching solution 212 has an HCl concentration of 0.3 mol / L to 0.5 mol / L.

[0037] The compressed air pressure of the two-fluid nozzle in the first etching process is 2.0 bar, and the compressed air pressure of the two-fluid nozzle in the second etching process is 3.0 bar.

[0038] In the above optional embodiments, it should be noted that, since the chemical formula of the etched object is Cu2Cl2, adding a mixed solution of HCl and NaClO3 to the etched object yields the formula: Cu2Cl2 + 2HCl + NaClO3 → 2CuCl2 + NaCl + H2O. During the production process, both HCl and NaClO3 solutions need to be added. The HCl settings for the two tanks are different. The etching rate of the first etching solution is 60 to 90 seconds, etching a thickness of 35 μm, and the etching rate of the second etching solution is 180 to 200 seconds, etching a thickness of 35 μm. The parameters of the oxidant NaClO3 in the first etching solution and the second etching solution are the same, both being an oxidation-reduction potential of 500 mV-550 mV.

[0039] The two-fluid nozzles for both the first and second etching processes are model 6010 two-fluid nozzles.

[0040] The compressed air pressure ejected by the two-fluid nozzle in the first etching process is 2.0 bar, and the compressed air volume ejected by each two-fluid nozzle is 36 NL / min. The compressed air pressure ejected by the two-fluid nozzle in the second etching process is 3.0 bar, and the compressed air volume ejected by each two-fluid nozzle is 58 NL / min. In contrast, the compressed air pressure of the two-fluid nozzle in the traditional two-fluid etching scheme is 3.0 bar, and the compressed air volume ejected by each two-fluid nozzle is 58 NL / min. According to calculations, the total compressed air consumption of this scheme is 81% of that of the traditional scheme.

[0041] The compressed air ejected through the two-fluid nozzle in the first etching process slightly reduces the size of the first etching solution particles, resulting in an average particle diameter of 30μm, thus achieving the effect of rapidly etching the copper layer on the surface.

[0042] Compressed air ejected through the two-fluid nozzle in the second etching process reduces the average particle size of the second etching solution to 20 μm, allowing the solution to reach the root of the circuit.

[0043] Traditional two-fluid etching uses an HCl solution with an addition setting of 0.3 mol / L to 0.5 mol / L. The etching rate of this solution is half that of an HCl solution with an addition setting of 1.5 mol / L to 2.5 mol / L. Therefore, the etching rate of the two parts of the two-fluid etching in this application is 1.5 times that of traditional two-fluid etching.

[0044] The technical effect achieved by the above optional embodiments is that by using etching solutions with different etching rates, combined with compressed air at different pressures and in different amounts in different processes, the amount of compressed air used is reduced and the etching rate is increased while ensuring the etching effect, thereby indirectly reducing energy consumption.

[0045] The initial state of the etched object is as follows Figure 3 As shown, it includes a substrate 31, a conductive layer 32 and a resist layer 33. Continuous conductive layers 32 are provided on both sides of the substrate 31, and a resist layer 33 is provided on the side of each conductive layer 32 facing away from the substrate 31.

[0046] The structure of the etched object obtained in the first etching process is as follows: Figure 4 As shown, the conductive layers 32 on both sides of the substrate 31 are rapidly etched to form a frustum shape.

[0047] The structure of the etched object obtained in the second etching process is as follows: Figure 5 As shown, the final etched object was formed.

[0048] A second aspect of the present invention provides an etching apparatus, comprising a first body 101, a second body 201, a first water pump 103, a second water pump 203, an air pump 106, a plurality of first two-fluid nozzles 105, and a plurality of second two-fluid nozzles 205. A first etching solution 112 is disposed within the first body 101, and a second etching solution 212 is disposed within the second body 201. The outlet of the first water pump 103 is connected to the plurality of first two-fluid nozzles 105 via a water pipe, and the outlet of the second water pump 203 is connected to the plurality of second two-fluid nozzles 205 via a water pipe. The fluid nozzles 205 are connected. The inlet of the first water pump 103 is connected to the first body 101 through a pipe and connected to the first etching solution 112. The inlet of the second water pump 203 is connected to the second body 201 through a pipe and connected to the second etching solution 212. Multiple first two-fluid nozzles 105 and multiple second two-fluid nozzles 205 are all connected to the air pump 106 through air pipes. Multiple first two-fluid nozzles 105 are all installed inside the first body 101, and multiple second two-fluid nozzles 205 are all installed inside the second body 201.

[0049] In the above optional embodiments, it should be noted that the system also includes a first gas filter 107, a second gas filter 207, a first liquid filter 109 and a second liquid filter 209, a first liquid collection tank 114 and a second liquid collection tank 214. The bottom of the first body 101 is provided with the first liquid collection tank 114, and the bottom of the second body 201 is provided with the second liquid collection tank 214. The first gas filter 107 is connected to the air pipe connecting the air pump 106 to the plurality of first two-fluid nozzles 105, and the second gas filter 207 is connected to the air pipe connecting the air pump 106 to the plurality of second two-fluid nozzles 205. The first etching solution 11 is placed in the first liquid collection tank 114, and the second etching solution 21 is placed in the second liquid collection tank 214. During the first etching process, the plurality of first two-fluid nozzles 105 are respectively placed on both sides of the etched object 3. During the second etching process, the plurality of second two-fluid nozzles 205 are respectively placed on both sides of the etched object 3 after the first etching process.

[0050] The beneficial effects of the above optional embodiments are as follows: the configuration of the air pump 106 provides sufficient compressed air and sufficient pressure to the first two-fluid nozzle 105 in the first etching process, and the configuration of the first water pump 103 provides sufficient power for the first etching liquid 101 to enter the first two-fluid nozzle 105; at the same time, the configuration of the air pump 106 provides sufficient compressed air and sufficient pressure to the second two-fluid nozzle 205 in the second etching process, and the configuration of the second water pump 203 provides sufficient power for the second etching liquid 201 to enter the second two-fluid nozzle 205.

[0051] Optional, such as Figures 1 to 5 As shown, in some embodiments, a third water pump 108, a first suction head 102, a fourth water pump 208, and a second suction head 202 are also included. The inlet of the third water pump 108 is connected to multiple first suction heads 102 via a water pipe, and the outlet of the third water pump 108 is connected to the first body 101 via a water pipe and communicates with the first etching solution 11. The inlet of the fourth water pump 208 is connected to multiple second suction heads 202 via a water pipe, and the outlet of the fourth water pump 208 is connected to the second body 201 via a water pipe and communicates with the second etching solution 212.

[0052] The advantages of the above optional embodiments are as follows: by setting the third water pump 108 in conjunction with the first suction head 102, the first etching liquid 101 remaining on the surface of the etched object 3 after the first etching process can be absorbed into the first collection tank 114 for secondary use; by setting the fourth water pump 208 in conjunction with the second suction head 202, the second etching liquid 201 remaining on the surface of the etched object 3 after the second etching process can be absorbed into the second collection tank 224 for secondary use, thereby avoiding waste of etching liquid.

[0053] Optional, such as Figures 1 to 5As shown, in some embodiments, a first Venturi tube 104 and a second Venturi tube 204 are also included. One end of the first Venturi tube 104 is connected to a third water pump 108 via a water pipe, and the other end of the first Venturi tube 104 is connected to a first body 101 via a water pipe and communicates with a first etching solution 11. The middle part of the first Venturi tube 104 is connected to a plurality of first suction heads 102 via a water pipe. One end of the second Venturi tube 204 is connected to a fourth water pump 208 via a water pipe, and the other end of the second Venturi tube 204 is connected to a second body 201 via a water pipe and communicates with a second etching solution 21. The middle part of the second Venturi tube 204 is connected to a plurality of second suction heads 202 via a water pipe.

[0054] Optional, such as Figures 1 to 5 As shown, in some embodiments, a first automatic regulating valve 110 and a second automatic regulating valve 210 are also provided. The first automatic regulating valve 110 is provided on the water pipe between the first water pump 103 and the plurality of first two-fluid nozzles 105, the water pipe between the third water pump 108 and the first venturi tube 104, and the air pipe between the air pump 106 and the plurality of first two-fluid nozzles 105. The second automatic regulating valve 210 is provided on the water pipe between the second water pump 203 and the plurality of second two-fluid nozzles 205, the water pipe between the fourth water pump 208 and the second venturi tube 204, and the air pipe between the air pump 106 and the plurality of second two-fluid nozzles 205.

[0055] In the above optional embodiments, it should be noted that both the first automatic regulating valve 110 and the second automatic regulating valve 210 are throttle valves.

[0056] The advantages of the above optional embodiments are as follows: by setting multiple first automatic regulating valves 110, the supply of compressed air, the supply of first etching liquid 101, and the absorption pressure of the first etching liquid 101 remaining on the surface of the etched object 3 are adjusted, thereby ensuring the initial etching effect of the first etching process on the etched object 3. By setting multiple second automatic regulating valves 210, the supply of compressed air, the supply of second etching liquid 201, and the absorption pressure of the second etching liquid 201 remaining on the surface of the etched object 3 are adjusted, thereby ensuring the etching effect of the second etching process on the etched object 3 and ensuring the final etching effect of the etched object 3.

[0057] Optional, such as Figures 1 to 5As shown, in some embodiments, a first pressure gauge 111 and a second pressure gauge 211 are also included. The first pressure gauge 11 is installed on the water pipe between the first water pump 103 and the plurality of first two-fluid nozzles 105, the water pipe between the third water pump 108 and the first venturi tube 104, and the air pipe between the air pump 106 and the plurality of first two-fluid nozzles 105. The second pressure gauge 211 is installed on the water pipe between the second water pump 203 and the plurality of second two-fluid nozzles 205, the water pipe between the fourth water pump 208 and the second venturi tube 204, and the air pipe between the air pump 106 and the plurality of second two-fluid nozzles 205.

[0058] The advantages of the above optional embodiments are as follows: by setting the first pressure gauge 111, the compressed air supply pressure and the supply pressure of the first etching liquid 101 in the first etching process can be monitored in real time to ensure that the compressed air supply pressure and the supply pressure of the first etching liquid 101 in the first etching process are within the required pressure. By setting the second pressure gauge 211, the compressed air supply pressure and the supply pressure of the second etching liquid 201 in the second etching process can be monitored in real time to ensure that the compressed air supply pressure and the supply pressure of the second etching liquid 201 in the second etching process are within the required pressure.

[0059] Optional, such as Figures 1 to 5 As shown, in some embodiments, a conveying mechanism 4 is also included. The conveying mechanism 4 is used to convey the etching object 3. A plurality of first two-fluid nozzles 105 are respectively disposed on the upper and lower sides of the conveying mechanism 4, and a plurality of second two-fluid nozzles 205 are respectively disposed on the upper and lower sides of the conveying mechanism 4. The first body 101 and the second body 201 are both connected to the conveying mechanism 4.

[0060] In the above optional embodiments, it should be noted that the conveying mechanism 4 includes multiple lower rollers 41, multiple lower rollers 42, and a drive motor. The upper rollers 42 are placed above the lower rollers 41 one by one. The spur gears of the lower rollers 41 drive the spur gears of the upper rollers 42. When the etched object passes by, the upper rollers will be lifted up and pressed on the etched object to prevent the lower spray from splashing the product. The drive motor is used to drive the multiple upper rollers 41 and multiple lower rollers 42 to rotate.

[0061] The beneficial effect of the above optional embodiments is that the conveying mechanism 4 enables the conveying of the etched object 3.

[0062] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

[0063] The terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

Claims

1. An etching method, characterized in that, It has the following etching process: The first etching process involves using a two-fluid nozzle to spray a first etching solution (112) and compressed air onto the surface of the object to be etched (3), thereby etching the object (3). In the second etching process, compressed air and second etching solution (212) are simultaneously sprayed onto the etched object (3) after the first etching process is completed using a two-fluid nozzle. The pressure of the compressed air in the two-fluid nozzle of the first etching process is less than the pressure of the compressed air in the two-fluid nozzle of the second etching process. The etching rate of the second etching solution (212) is less than the etching rate of the first etching solution (112). Both the first etching solution (112) and the second etching solution (212) are mixed solutions of HCl and NaClO3. The HCl concentration of the first etching solution (112) is greater than the HCl concentration of the second etching solution (212).

2. The etching method according to claim 1, characterized in that, The first etching solution (112) has an HCl concentration of 1.5 mol / L to 2.5 mol / L, and the second etching solution (212) has an HCl concentration of 0.3 mol / L to 0.5 mol / L.

3. The etching method according to claim 1, characterized in that, The pressure of the compressed air in the two-fluid nozzle of the first etching process is 2.0 bar, and the pressure of the compressed air in the two-fluid nozzle of the second etching process is 3.0 bar.

4. An etching apparatus, characterized in that, The system includes a first body (101), a second body (201), a first water pump (103), a second water pump (203), an air pump (106), multiple first two-fluid nozzles (105), and multiple second two-fluid nozzles (205). The first body (101) contains a first etching solution (112), and the second body (201) contains a second etching solution (212). The outlet of the first water pump (103) is connected to the multiple first two-fluid nozzles (105) via a water pipe, and the outlet of the second water pump (203) is connected to the multiple second two-fluid nozzles (205) via a water pipe. The inlet of the water pump (103) is connected to the first body (101) and connected to the first etching solution (112) through a pipe. The inlet of the second water pump (203) is connected to the second body (201) and connected to the second etching solution (212) through a pipe. Multiple first two-fluid nozzles (105) and multiple second two-fluid nozzles (205) are connected to multiple air pumps (106) through air pipes. Multiple first two-fluid nozzles (105) are installed inside the first body (101), and multiple second two-fluid nozzles (205) are installed inside the second body (201).

5. The etching apparatus according to claim 4, characterized in that, It also includes a third water pump (108), a first suction head (102), a fourth water pump (208), and a second suction head (202). The inlet of the third water pump (108) is connected to multiple first suction heads (102) through a water pipe. The outlet of the third water pump (108) is connected to the first body (101) through a water pipe and communicates with the first etching solution (112). The inlet of the fourth water pump (208) is connected to multiple second suction heads (202) through a water pipe. The outlet of the fourth water pump (208) is connected to the second body (201) through a water pipe and communicates with the second etching solution (212).

6. An etching apparatus according to claim 5, characterized in that, It also includes a first Venturi tube (104) and a second Venturi tube (204). One end of the first Venturi tube (104) is connected to the third water pump (108) via a water pipe, and the other end of the first Venturi tube (104) is connected to the first body (101) via a water pipe and communicates with the first etching solution (112). The middle part of the first Venturi tube (104) is connected to a plurality of first suction heads (102) via a water pipe. One end of the second Venturi tube (204) is connected to the fourth water pump (208) via a water pipe, and the other end of the second Venturi tube (204) is connected to the second body (201) via a water pipe and communicates with the second etching solution (212). The middle part of the second Venturi tube (204) is connected to a plurality of second suction heads (202) via a water pipe.

7. An etching apparatus according to claim 6, characterized in that, It also includes a first automatic regulating valve (110) and a second automatic regulating valve (210). The first automatic regulating valve (110) is provided on the water pipe between the first water pump (103) and the plurality of first two-fluid nozzles (105), the water pipe between the third water pump (108) and the first venturi tube (104), and the air pipe between the air pump (106) and the plurality of first two-fluid nozzles (105). The second automatic regulating valve (210) is provided on the water pipe between the second water pump (203) and the plurality of second two-fluid nozzles (205), the water pipe between the fourth water pump (208) and the second venturi tube (204), and the air pipe between the air pump (106) and the plurality of second two-fluid nozzles (205).

8. An etching apparatus according to claim 7, characterized in that, It also includes a first pressure gauge (111) and a second pressure gauge (211). The first pressure gauge (111) is installed on the water pipe between the first water pump (103) and the plurality of first two-fluid nozzles (105), on the water pipe between the third water pump (108) and the first venturi tube (104), and on the air pipe between the air pump (106) and the plurality of first two-fluid nozzles (105). The second pressure gauge (211) is installed on the water pipe between the second water pump (203) and the plurality of second two-fluid nozzles (205), on the water pipe between the fourth water pump (208) and the second venturi tube (204), and on the air pipe between the air pump (106) and the plurality of second two-fluid nozzles (205).

9. An etching apparatus according to claim 4, characterized in that, It also includes a conveying mechanism (4) for conveying the etched object (3). A plurality of first two-fluid nozzles (105) are respectively disposed on the upper and lower sides of the conveying mechanism (4), and a plurality of second two-fluid nozzles (205) are respectively disposed on the upper and lower sides of the conveying mechanism (4). The first body (101) and the second body (201) are both connected to the conveying mechanism (4).

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