Process control method and device for PCB spray etching process

Abstract

The embodiment of the invention provides a process control method and device for a PCB spraying and etching process. The process control method comprises the steps of obtaining microbubble parameters of etching liquid; obtaining an array position of a spray head, and obtaining a size distribution diagram of the PCB substrate; according to the array position of the spray header and the size distribution diagram of the PCB substrate, spray array flow distribution data is calculated; adjusting the spray array flow distribution data according to the microbubble parameters to obtain spray array flow; etching operation of the PCB substrate is carried out according to the spraying array flow, and the etched PCB substrate is obtained; a'pool effect 'generated in the etching process is controlled and avoided, and the wire surface faces downwards to pass through the etching line, so that the problem of the pool effect is solved fundamentally, and the special requirements of products with strict impedance and strict line width tolerance are met; by using new film pressing, exposure process, etching method and flow, the problem of pool effect during the production of the PCB in the spraying and etching process is fundamentally solved, and the line width uniformity is improved.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a process control method and a process control device for a PCB spray etching process, a computer device and a storage medium. Background Art

[0002] In the PCB manufacturing process, the pool effect refers to the phenomenon caused by the accumulation of etchant on the top of the PCB when the etchant is sprayed. This pool becomes an obstacle to etching uniformity, making the center of the board more difficult to etch than the sides. When spraying a single board, the moment the etchant touches the copper, it becomes less effective because it has already reacted. In the middle of the board, this accumulation will happen quickly because it is difficult for the etchant to flow from the center to the sides. Using an oscillating spray method also requires pushing the etchant in the center of the board to the sides. Therefore, if nothing is done to assist etching, the center of the board will get less etching than the edges. This situation becomes very significant if you try to process large-sized boards. Summary of the invention

[0003] In view of the above problems, embodiments of the present invention are proposed to provide a process control device, a computer device and a storage medium for a PCB spray etching process that overcome the above problems or at least partially solve the above problems.

[0004] In order to solve the above problems, an embodiment of the present invention discloses a process control method for a PCB spray etching process, comprising: Obtain the microbubble parameters of the etching solution; Obtain the array position of the shower head and the size distribution map of the PCB substrate; The flow distribution data of the spray array is calculated based on the array position of the spray head and the size distribution diagram of the PCB substrate; Adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; The etching operation of the PCB substrate is performed according to the flow rate of the spray array to obtain the etched PCB substrate.

[0005] Preferably, performing an etching operation on a PCB substrate according to the flow rate of the spray array to obtain an etched PCB substrate comprises: After performing the first lamination on the PCB substrate, a PCB substrate after the first lamination is obtained; Performing a first double-sided exposure operation on the PCB substrate after the first lamination to obtain a PCB substrate after the first double-sided exposure; Performing an etching operation with the etching surface facing downward after the first double-sided exposure according to the flow rate of the spray array to obtain a PCB substrate after the first etching; Performing secondary lamination on the PCB substrate after the first etching to obtain a PCB substrate after secondary lamination; Controlling the PCB substrate after the secondary lamination to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; According to the spray array flow rate, an etching operation is performed on the PCB substrate after the second double-sided exposure with the etching surface facing downward to obtain a PCB substrate after the second etching, Preferably, the calculation of the spray array flow distribution data according to the array position of the spray head and the size distribution diagram of the PCB substrate includes: Dividing the size distribution diagram of the PCB substrate into a plurality of levels of annular diagrams; Dividing the annular array positions of the plurality of sprinkler heads according to the annular diagrams of the plurality of levels; The relationship between the annular array positions of the multiple sprinkler heads and the sprinkler array flow data is established to obtain the sprinkler array flow distribution data.

[0006] Preferably, adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow includes: Calculate the flow adjustment coefficient according to the microbubble parameters, etching liquid density parameters, water density parameters and mixed density parameters; The pressure data of the annular array position in the spray array flow distribution data is adjusted according to the flow adjustment coefficient to obtain the spray array flow.

[0007] Preferably, the method comprises: Obtaining a high-speed camera image of the etching liquid in the transparent spray pipe; The number of microbubbles is identified from the etching solution image captured by the high-speed camera, and the microbubble parameters are calculated.

[0008] The embodiment of the present invention discloses a process control device for a PCB spray etching process, comprising: A first acquisition module is used to acquire microbubble parameters of the etching solution; The second acquisition module is used to acquire the array position of the shower head and the size distribution map of the PCB substrate; A calculation module, used for calculating the flow distribution data of the spray array according to the array position of the spray head and the size distribution diagram of the PCB substrate; An adjustment module, used for adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; The etching operation module is used to perform an etching operation on the PCB substrate according to the flow rate of the spray array to obtain the etched PCB substrate.

[0009] Preferably, the etching operation module comprises: A first lamination submodule, used for performing first lamination on the PCB substrate to obtain a PCB substrate after first lamination; A first double-sided exposure submodule is used to perform a first double-sided exposure operation on the PCB substrate after the first lamination to obtain a PCB substrate after the first double-sided exposure; A first etching submodule, used for performing an etching operation with the etching surface facing downward on the PCB substrate after the first double-sided exposure according to the flow rate of the spray array, to obtain the PCB substrate after the first etching; A secondary lamination submodule, used for performing secondary lamination on the PCB substrate after the first etching to obtain a PCB substrate after the secondary lamination; A second double-sided exposure submodule is used to control the PCB substrate after the second lamination to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; The second etching submodule is used to perform an etching operation with the etching surface of the PCB substrate facing downward after the second double-sided exposure according to the flow rate of the spray array, so as to obtain the PCB substrate after the second etching. Preferably, the calculation module includes: A division submodule, used for dividing the size distribution diagram of the PCB substrate into multiple levels of annular diagrams; An array position submodule, used for dividing the annular array positions of the plurality of sprinkler heads according to the annular diagrams of the plurality of levels; A submodule is established to establish a relationship with the spray array flow data through the annular array positions of multiple sprinkler heads, so as to obtain the spray array flow distribution data.

[0010] The embodiment of the present invention further discloses a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the process control steps of the above-mentioned PCB spray etching process when executing the computer program.

[0011] The embodiment of the present invention further discloses a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the process control steps of the above-mentioned PCB spray etching process are implemented.

[0012] The embodiments of the present invention include the following advantages: In an embodiment of the present invention, the process control method of the PCB spray etching process includes: obtaining microbubble parameters of the etching solution; obtaining the array position of the spray head, and obtaining the size distribution map of the PCB substrate; calculating the spray array flow distribution data according to the array position of the spray head and the size distribution map of the PCB substrate; adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; performing an etching operation on the PCB substrate according to the spray array flow to obtain the etched PCB substrate; controlling to avoid the "pool effect" generated during the etching process, adopting a special film pressing etching method, splitting a single etching into single-sided etching, and each time etching, the wired side faces down over the etching line, fundamentally solving the pool effect problem, and meeting the special requirements of products with strict impedance and strict line width tolerances; using new film pressing, exposure process, etching method and process, fundamentally solving the pool effect problem of PCB during the spray etching process production, and improving line width uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 It is a flowchart of a process control method for a PCB spray etching process according to an embodiment of the present invention; Figure 2 is a schematic diagram of a spray device in an embodiment of the present invention; Figure 3 is a schematic diagram of a PCB substrate spraying process in an embodiment of the present invention; Figure 4 is a schematic diagram of a size distribution diagram of a divided PCB substrate according to an embodiment of the present invention; Figure 5 is a schematic diagram of setting some specific parameters of an embodiment of the present invention; Figure 6 It is a structural block diagram of an embodiment of a process control device for a PCB spray etching process according to an embodiment of the present invention; Figure 7 The diagram is a diagram of the internal structure of a computer device according to an embodiment. DETAILED DESCRIPTION

[0015] In order to make the technical problems, technical solutions and beneficial effects solved by the embodiments of the present invention more clearly understood, the embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0016] In a core concept of an embodiment of the present invention, in the etching process of the PCB substrate, the flow rate of the annular array of the spray head is controlled to control the generation of the "pool effect" by using the flow control method. On the other hand, the spray array flow distribution data is adjusted by the microbubble content in the etching solution to obtain the actual spray array flow rate to further avoid the "pool effect" generated in the etching process; in addition, the first lamination, the first double-sided exposure, the etching operation with the first etching surface facing down, the second lamination, the second double-sided exposure, the etching operation with the second etching surface facing down, etc. of the PCB substrate can also be controlled to control and avoid the "pool effect" generated in the etching process. A special lamination method and etching method are adopted, and a single etching is divided into single-sided etching. During each etching, the wired side passes the etching line downward, which fundamentally solves the pool effect problem and meets the special requirements of products with strict impedance and strict line width tolerances; new lamination, exposure process, etching method and process are used to fundamentally solve the pool effect problem of PCB during the spray etching process and improve the line width uniformity.

[0017] The process control method of the PCB spray etching process provided by the embodiment of the present invention can be applied to an application environment including a terminal and a server. Among them, the terminal communicates with the server through a network. The terminal can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers and portable wearable devices. The operating system of the terminal may include Android, Harmony OS, IOS, Windows Phone, Windows, etc. The present invention does not impose too many restrictions on this. The server can be implemented with an independent server or a server cluster composed of multiple servers. The terminal is connected to a variety of semiconductor devices, and the embodiment of the present invention does not impose too many restrictions on this.

[0018] Reference Figure 1 , shows a flowchart of a process control method for a PCB spray etching process according to an embodiment of the present invention, which may specifically include the following steps: Step 101, obtaining microbubble parameters of the etching solution; In an embodiment of the present invention, the terminal may be a terminal connected to a variety of semiconductor devices, and the semiconductor devices may include a variety of semiconductor devices, such as material pre-baking equipment, inner layer imaging equipment, etching equipment, drilling equipment, electroplating equipment, browning equipment, etc. The embodiment of the present invention does not impose too many restrictions on the types of semiconductor devices; the terminal and the connected server can control the above-mentioned semiconductor devices to perform corresponding processing operations on various semiconductor materials.

[0019] The PCB substrate may also include other operations before or after the etching operation, such as lamination operation, pressing operation, electroplating operation, outer layer image etching operation, solder mask operation, gold deposition operation, thermosetting text operation, molding operation, electrical measurement operation, etc. The embodiment of the present invention does not impose too many restrictions on this.

[0020] Specifically applied to the embodiment of the present invention, the etching solution may include a plurality of different types of etching solutions. In terms of system classification, the etching solution may specifically include etching solutions corresponding to different types of combinations of ferric chloride system, acidic copper chloride system and alkaline copper chloride system, and the embodiment of the present invention does not impose too many restrictions on this. In terms of main components, the main components of the etching solution may include ammonium fluoride, oxalic acid, sodium sulfate, hydrofluoric acid, sulfuric acid, nitric acid, bromic acid and sodium chloride, etc., and the embodiments of the present invention do not impose too many restrictions on this.

[0021] like Figure 2 As shown, the spray device in the etching equipment in the embodiment of the present invention may include a plurality of spray heads, the spray heads may be spray heads in multiple rows, and the spray array may be arranged in a rectangular shape.

[0022] In a spraying process of an embodiment of the present invention, as Figure 3 As shown, the PCB substrate moves through the transmission device, the spray device is arranged below the transmission device, the etching liquid is sprayed to the PCB substrate on the transmission device through the spray device, and the spray head in the spray device can change the inclination angle during spraying.

[0023] In an embodiment of the present invention, firstly, a microbubble parameter of the etching solution can be obtained, and the microbubble parameter refers to the ratio of the microbubble area in the etching solution to the entire sampling image area; the microbubble parameter represents the content of microbubbles smaller than a preset diameter per unit area, for example, the microbubble parameter can be 0.02% or 0.035%.

[0024] In a specific implementation, the microbubble parameters can be obtained by high-speed camera of the transparent spray pipe to obtain an etching liquid image including microbubbles, thereby identifying the microbubble parameters of a certain etching liquid. It should be noted that the above-mentioned method of obtaining the microbubble parameters is only an example of an embodiment of the present invention, and the microbubble parameters can also be measured by other methods, such as by conductivity probe measurement, and the embodiment of the present invention does not impose too many restrictions on this.

[0025] Step 102, obtaining the array position of the shower head and the size distribution map of the PCB substrate; Further applied to the embodiments of the present invention, the array position of the spray head in the spray device can also be obtained. Specifically, the array position of the spray head can refer to the horizontal and vertical coordinate positions of the spray head. For example, the array position of a certain spray head can be expressed as (2, 3). Furthermore, the size distribution diagram of the PCB substrate can also be obtained. The size distribution diagram can refer to the dimensions of the PCB substrate in the length direction and the width direction.

[0026] Step 103, calculating the flow distribution data of the spray array according to the array position of the spray head and the size distribution diagram of the PCB substrate; In the embodiment of the present invention, after obtaining the array position of the shower head and the size distribution diagram of the PCB substrate, the shower array flow distribution data can be calculated based on the two; Specifically, the spray array flow distribution data may include the spray volume per unit time of each spray head in the spray array.

[0027] Specifically applied to the embodiment of the present invention, the calculation of the spray array flow distribution data based on the array position of the spray head and the size distribution diagram of the PCB substrate includes: dividing the size distribution diagram of the PCB substrate into multiple levels of annular diagrams; dividing the annular array positions of multiple spray heads according to the multiple levels of annular diagrams; and establishing a relationship with the spray array flow data through the annular array positions of multiple spray heads to obtain the spray array flow distribution data.

[0028] like Figure 4As shown, the size distribution diagram of the PCB substrate can be divided into four levels of annular diagrams, namely, a first-level annular diagram, a second-level annular diagram, a third-level annular diagram, and a fourth-level annular diagram; further, the annular array positions of multiple shower heads are divided according to the first-level annular diagram, the second-level annular diagram, the third-level annular diagram, and the fourth-level annular diagram. For example, the annular array positions of the shower heads can also be divided into four levels, such as the first shower head annular array position, the second shower head annular array position, the third shower head annular array position, and the fourth shower head annular array position. ; The first shower head annular array position corresponds to the first level annular diagram of the size distribution diagram of the PCB substrate, that is, the position of the first shower head annular array position spraying corresponds to the PCB substrate position of the first level annular diagram; the position of the second shower head annular array position spraying corresponds to the PCB substrate position of the second level annular diagram; the position of the third shower head annular array position spraying corresponds to the PCB substrate position of the third level annular diagram; the position of the fourth shower head annular array position spraying corresponds to the PCB substrate position of the fourth level annular diagram, and the specific annular array positions are as follows Figure 2 As shown; The spray flow rates at the annular array positions of the shower heads of each level are different and can be reduced step by step, such as the spray volume at the annular array position of the first shower head is greater than the spray volume at the annular array position of the second shower head; the spray volume at the annular array position of the second shower head is greater than the spray volume at the annular array position of the third shower head, and the spray volume at the annular array position of the third shower head is greater than the spray volume at the annular array position of the fourth shower head. The spray array flow distribution data can be obtained. The step-by-step flow control method of the spray array in the embodiment of the present invention can effectively control the pool effect generated in the etching process. The above-mentioned division method is only an example of the embodiment of the present invention. The size distribution diagram of the PCB substrate and the annular array positions of the shower heads can also be divided into more other levels to achieve more precise flow control. The embodiment of the present invention does not impose too many restrictions on this.

[0029] Step 104, adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; In the embodiment of the present invention, after obtaining the spray array flow distribution data, it is also necessary to adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; further reducing the influence of the microbubbles of the etching solution on the spray array flow, and at the same time, it can be beneficial to the flow control of the etching solution, improve the control efficiency, and improve the reaction rate of the etching solution. Specifically applied to the embodiment of the present invention, the spray array flow distribution data is adjusted according to the microbubble parameters to obtain the spray array flow, including: calculating the flow adjustment coefficient according to the microbubble parameters, the etching liquid density parameter, the water density parameter, and the mixed density parameter; adjusting the pressure data of the annular array position in the spray array flow distribution data according to the flow adjustment coefficient to obtain the spray array flow.

[0030] Specifically, the flow adjustment factor According to the etching liquid density parameter And water density parameters , mixed density parameters , and microbubble parameters Calculated, the flow adjustment coefficient The expression is as follows; The flow adjustment factor ; In an embodiment of the present invention, a flow adjustment coefficient is calculated based on the microbubble parameter, and then the pressure data of the annular array position in the spray array flow distribution data is fine-tuned based on the flow adjustment coefficient to obtain the spray array flow, and then the spray array flow is applied to the spray flow of the annular array position of each level of the spray head mentioned above, wherein the spray array flow is adjusted by increasing or decreasing the pressure, which is beneficial to the flow control of the etching liquid, improves the control efficiency, and improves the reaction rate of the etching liquid.

[0031] Further applied to the embodiment of the present invention, the method includes: acquiring an etching liquid image of the transparent spray pipe taken by high-speed photography; identifying the number of microbubbles from the etching liquid image taken by high-speed photography, and calculating the microbubble parameters.

[0032] Step 105 , performing an etching operation on the PCB substrate according to the flow rate of the spray array to obtain an etched PCB substrate.

[0033] In the embodiment of the present invention, the etching operation of the PCB substrate is performed by the flow rate of the spray array to obtain the etched PCB substrate. It should be noted that during the etching operation, the PCB substrate can also be subjected to multiple operations such as lamination and double-sided exposure, and the embodiment of the present invention does not impose too many restrictions on this. In a specific example of an embodiment of the present invention, the etching operation of the PCB substrate is performed according to the spray array flow rate to obtain the etched PCB substrate, including: performing a first lamination on the PCB substrate to obtain the PCB substrate after the first lamination; performing a first double-sided exposure operation on the PCB substrate after the first lamination to obtain the PCB substrate after the first double-sided exposure; performing an etching operation with the etched surface facing down on the PCB substrate after the first double-sided exposure according to the spray array flow rate to obtain the PCB substrate after the first etching; performing a second lamination on the PCB substrate after the first etching to obtain the PCB substrate after the second lamination; controlling the PCB substrate after the second lamination to perform a second double-sided exposure operation to obtain the PCB substrate after the second double-sided exposure; performing an etching operation with the etched surface facing down on the PCB substrate after the second double-sided exposure according to the spray array flow rate to obtain the PCB substrate after the second etching.

[0034] That is, in the embodiment of the present invention, the etching surface of the PCB substrate is oriented downward, while the shower head is oriented upward in the etching operation, so as to avoid the "pool effect" generated in the etching process. A special lamination etching method is adopted, and a single etching is divided into single-sided etching. During each etching, the wired surface faces downward over the etching line, which fundamentally solves the pool effect problem and meets the special requirements of products with strict impedance and strict line width tolerance. A new lamination, exposure process, etching method and process are used to fundamentally solve the pool effect problem of PCB during the spray etching process, improve the line width uniformity, and some specific parameter settings are as follows: Figure 5 As shown, specifically, during the first etching operation, only the top surface circuit and the NPTH (Non-PlatedThrough Hole) hole on the bottom surface are etched. During the second etching operation, the bottom surface circuit is etched, and the NPTH hole is completely covered with dry film and not etched. The entire surface of the top surface where the circuit has been etched is exposed and not etched, and no window is added. During etching, the side that needs to be etched is always placed facing downwards when passing through the etching equipment. After the first etching, a second lamination is performed.

[0035] In an embodiment of the present invention, the process control method of the PCB spray etching process includes: obtaining microbubble parameters of the etching solution; obtaining the array position of the spray head, and obtaining the size distribution map of the PCB substrate; calculating the spray array flow distribution data according to the array position of the spray head and the size distribution map of the PCB substrate; adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; performing an etching operation on the PCB substrate according to the spray array flow to obtain the etched PCB substrate; controlling to avoid the "pool effect" generated during the etching process, adopting a special film pressing etching method, splitting a single etching into single-sided etching, and each time etching, the wired side faces down over the etching line, fundamentally solving the pool effect problem, and meeting the special requirements of products with strict impedance and strict line width tolerances; using new film pressing, exposure process, etching method and process, fundamentally solving the pool effect problem of PCB during the spray etching process production, and improving line width uniformity.

[0036] It should be noted that, for the sake of simplicity, the method embodiments are described as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0037] Reference Figure 6 , shows a structural block diagram of a process control device for a PCB spray etching process according to an embodiment of the present invention, which may specifically include the following modules: The first acquisition module 301 is used to acquire microbubble parameters of the etching solution; The second acquisition module 302 is used to acquire the array position of the shower head and the size distribution map of the PCB substrate; A calculation module 303 is used to calculate the flow distribution data of the spray array according to the array position of the spray head and the size distribution diagram of the PCB substrate; An adjustment module 304, configured to adjust the spray array flow distribution data according to the microbubble parameters to obtain a spray array flow; The etching operation module 305 is used to perform an etching operation on the PCB substrate according to the flow rate of the spray array to obtain an etched PCB substrate.

[0038] Preferably, the etching operation module comprises: A first lamination submodule, used for performing first lamination on the PCB substrate to obtain a PCB substrate after first lamination; A first double-sided exposure submodule is used to perform a first double-sided exposure operation on the PCB substrate after the first lamination to obtain a PCB substrate after the first double-sided exposure; A first etching submodule, used for performing an etching operation with the etching surface facing downward on the PCB substrate after the first double-sided exposure according to the flow rate of the spray array, to obtain the PCB substrate after the first etching; A secondary lamination submodule, used for performing secondary lamination on the PCB substrate after the first etching to obtain a PCB substrate after the secondary lamination; A second double-sided exposure submodule is used to control the PCB substrate after the second lamination to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; The second etching submodule is used to perform an etching operation with the etching surface of the PCB substrate facing downward after the second double-sided exposure according to the flow rate of the spray array, so as to obtain the PCB substrate after the second etching. Preferably, the calculation module includes: A division submodule, used for dividing the size distribution diagram of the PCB substrate into multiple levels of annular diagrams; An array position submodule, used for dividing the annular array positions of the plurality of sprinkler heads according to the annular diagrams of the plurality of levels; A submodule is established to establish a relationship with the spray array flow data through the annular array positions of multiple sprinkler heads, so as to obtain the spray array flow distribution data.

[0039] Preferably, the adjustment module includes: A flow adjustment coefficient submodule is used to calculate the flow adjustment coefficient according to microbubble parameters, etching liquid density parameters, water density parameters and mixed density parameters; The regulating submodule is used to adjust the pressure data of the annular array position in the spray array flow distribution data according to the flow adjustment coefficient to obtain the spray array flow.

[0040] Preferably, the device comprises: A third acquisition module is used to acquire an etching liquid image of the transparent spray pipe by high-speed photography; The calculation submodule is used to identify the number of microbubbles from the etching liquid image captured by high-speed photography and calculate the microbubble parameters.

[0041] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0042] The specific definition of the process control device for the PCB spray etching process can be found in the definition of the process control method for the PCB spray etching process mentioned above, which will not be repeated here. Each module in the process control device for the PCB spray etching process can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0043] The process control device for the PCB spray etching process provided above can be used to execute the process control method for the PCB spray etching process provided in any of the above embodiments, and has corresponding functions and beneficial effects.

[0044] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 7 As shown. The computer device includes a processor, a memory, a network interface, a display screen and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for simulating daylighting is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device housing, or an external keyboard, touchpad or mouse, etc.

[0045] Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0046] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented: Obtain the microbubble parameters of the etching solution; Obtain the array position of the shower head and the size distribution map of the PCB substrate; The flow distribution data of the spray array is calculated based on the array position of the spray head and the size distribution diagram of the PCB substrate; Adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; The etching operation of the PCB substrate is performed according to the flow rate of the spray array to obtain the etched PCB substrate.

[0047] Preferably, performing an etching operation on a PCB substrate according to the flow rate of the spray array to obtain an etched PCB substrate comprises: After performing the first lamination on the PCB substrate, a PCB substrate after the first lamination is obtained; Performing a first double-sided exposure operation on the PCB substrate after the first lamination to obtain a PCB substrate after the first double-sided exposure; Performing an etching operation with the etching surface facing downward after the first double-sided exposure according to the flow rate of the spray array to obtain a PCB substrate after the first etching; Performing secondary lamination on the PCB substrate after the first etching to obtain a PCB substrate after secondary lamination; Controlling the PCB substrate after the secondary lamination to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; According to the spray array flow rate, an etching operation is performed on the PCB substrate after the second double-sided exposure with the etching surface facing downward to obtain a PCB substrate after the second etching, Preferably, the calculation of the spray array flow distribution data according to the array position of the spray head and the size distribution diagram of the PCB substrate includes: Dividing the size distribution diagram of the PCB substrate into a plurality of levels of annular diagrams; Dividing the annular array positions of the plurality of sprinkler heads according to the annular diagrams of the plurality of levels; The relationship between the annular array positions of the multiple sprinkler heads and the sprinkler array flow data is established to obtain the sprinkler array flow distribution data.

[0048] Preferably, adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow includes: Calculate the flow adjustment coefficient according to the microbubble parameters, etching liquid density parameters, water density parameters and mixed density parameters; The pressure data of the annular array position in the spray array flow distribution data is adjusted according to the flow adjustment coefficient to obtain the spray array flow.

[0049] Preferably, the method comprises: Obtaining a high-speed camera image of the etching liquid in the transparent spray pipe; The number of microbubbles is identified from the etching solution image captured by the high-speed camera, and the microbubble parameters are calculated.

[0050] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: Obtain the microbubble parameters of the etching solution; Obtain the array position of the shower head and the size distribution map of the PCB substrate; The flow distribution data of the spray array is calculated based on the array position of the spray head and the size distribution diagram of the PCB substrate; Adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; The etching operation of the PCB substrate is performed according to the flow rate of the spray array to obtain the etched PCB substrate.

[0051] Preferably, performing an etching operation on a PCB substrate according to the flow rate of the spray array to obtain an etched PCB substrate comprises: After performing the first lamination on the PCB substrate, a PCB substrate after the first lamination is obtained; Performing a first double-sided exposure operation on the PCB substrate after the first lamination to obtain a PCB substrate after the first double-sided exposure; Performing an etching operation with the etching surface facing downward after the first double-sided exposure according to the flow rate of the spray array to obtain a PCB substrate after the first etching; Performing secondary lamination on the PCB substrate after the first etching to obtain a PCB substrate after secondary lamination; Controlling the PCB substrate after the secondary lamination to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; According to the spray array flow rate, an etching operation is performed on the PCB substrate after the second double-sided exposure with the etching surface facing downward to obtain a PCB substrate after the second etching, Preferably, the calculation of the spray array flow distribution data according to the array position of the spray head and the size distribution diagram of the PCB substrate includes: Dividing the size distribution diagram of the PCB substrate into a plurality of levels of annular diagrams; Dividing the annular array positions of the plurality of sprinkler heads according to the annular diagrams of the plurality of levels; The relationship between the annular array positions of the multiple sprinkler heads and the sprinkler array flow data is established to obtain the sprinkler array flow distribution data.

[0052] Preferably, adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow includes: Calculate the flow adjustment coefficient according to the microbubble parameters, etching liquid density parameters, water density parameters and mixed density parameters; The pressure data of the annular array position in the spray array flow distribution data is adjusted according to the flow adjustment coefficient to obtain the spray array flow.

[0053] Preferably, the method comprises: Obtaining a high-speed camera image of the etching liquid in the transparent spray pipe; The number of microbubbles is identified from the etching solution image captured by the high-speed camera, and the microbubble parameters are calculated.

[0054] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0055] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0056] It will be appreciated by those skilled in the art that the embodiments of the present invention may be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0057] The embodiments of the present invention are described with reference to flowcharts and / or block diagrams of apparatuses, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0058] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction method, which is implemented in the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0059] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0060] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0061] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, device, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, device, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the existence of other identical elements in the process, device, article or terminal device including the elements.

[0062] The process control method for a PCB spray etching process, a process control device for a PCB spray etching process, a computer device and a storage medium provided by the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A process control method for a PCB spray etching process, characterized in that: include: Obtain the microbubble parameters of the etching solution; Obtain the array position of the shower head and the size distribution map of the PCB substrate; The flow distribution data of the spray array is calculated based on the array position of the spray head and the size distribution diagram of the PCB substrate; Adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; The etching operation of the PCB substrate is performed according to the flow rate of the spray array to obtain the etched PCB substrate.

2. The method according to claim 1, characterized in that The etching operation of the PCB substrate is performed according to the flow rate of the spray array to obtain the etched PCB substrate, comprising: After performing the first lamination on the PCB substrate, a PCB substrate after the first lamination is obtained; Performing a first double-sided exposure operation on the PCB substrate after the first lamination to obtain a PCB substrate after the first double-sided exposure; Performing an etching operation with the etching surface facing downward after the first double-sided exposure according to the flow rate of the spray array to obtain a PCB substrate after the first etching; Performing secondary lamination on the PCB substrate after the first etching to obtain a PCB substrate after secondary lamination; Controlling the PCB substrate after the secondary lamination to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; The etching operation of the PCB substrate after the second double-sided exposure with the etching surface facing downward is performed according to the flow rate of the spray array to obtain the PCB substrate after the second etching.

3. The method according to claim 1, characterized in that The calculation of the spray array flow distribution data according to the array position of the spray head and the size distribution diagram of the PCB substrate includes: Dividing the size distribution diagram of the PCB substrate into a plurality of levels of annular diagrams; Dividing the annular array positions of the plurality of sprinkler heads according to the annular diagrams of the plurality of levels; The relationship between the annular array positions of the multiple sprinkler heads and the sprinkler array flow data is established to obtain the sprinkler array flow distribution data.

4. The method according to claim 3, characterized in that The step of adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow includes: Calculate the flow adjustment coefficient according to the microbubble parameters, etching liquid density parameters, water density parameters and mixed density parameters; The pressure data of the annular array position in the spray array flow distribution data is adjusted according to the flow adjustment coefficient to obtain the spray array flow.

5. The method according to claim 3, characterized in that: The method comprises: Obtaining a high-speed camera image of the etching liquid in the transparent spray pipe; The number of microbubbles is identified from the etching solution image captured by the high-speed camera, and the microbubble parameters are calculated.

6. A process control device for a PCB spray etching process, characterized in that: include: A first acquisition module is used to acquire microbubble parameters of the etching solution; The second acquisition module is used to acquire the array position of the shower head and the size distribution map of the PCB substrate; A calculation module, used for calculating the flow distribution data of the spray array according to the array position of the spray head and the size distribution diagram of the PCB substrate; An adjustment module, used for adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; The etching operation module is used to perform an etching operation on the PCB substrate according to the flow rate of the spray array to obtain the etched PCB substrate.

7. The device according to claim 6, characterized in that The etching operation module comprises: A first lamination submodule, used for performing first lamination on the PCB substrate to obtain a PCB substrate after first lamination; A first double-sided exposure submodule is used to perform a first double-sided exposure operation on the PCB substrate after the first lamination to obtain a PCB substrate after the first double-sided exposure; A first etching submodule, used for performing an etching operation with the etching surface facing downward on the PCB substrate after the first double-sided exposure according to the flow rate of the spray array, to obtain the PCB substrate after the first etching; A secondary lamination submodule, used for performing secondary lamination on the PCB substrate after the first etching to obtain a PCB substrate after the secondary lamination; A second double-sided exposure submodule is used to control the PCB substrate after the second lamination to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; The second etching submodule is used to perform an etching operation with the etching surface facing downward after the second double-sided exposure of the PCB substrate according to the flow rate of the spray array, so as to obtain the PCB substrate after the second etching.

8. The device according to claim 6, characterized in that The calculation module comprises: A division submodule, used for dividing the size distribution diagram of the PCB substrate into multiple levels of annular diagrams; An array position submodule, used for dividing the annular array positions of the plurality of sprinkler heads according to the annular diagrams of the plurality of levels; A submodule is established to establish a relationship with the spray array flow data through the annular array positions of multiple sprinkler heads, so as to obtain the spray array flow distribution data.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the process control method for the PCB spray etching process according to any one of claims 1 to 5 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the process control method for a PCB spray etching process according to any one of claims 1 to 5 are implemented.

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