Circuit board and manufacturing method thereof

Abstract

The invention discloses a circuit board and a manufacturing method thereof, and relates to the technical field of electronic circuit additive manufacturing. The manufacturing method comprises the following steps: preparing a first insulating layer; printing to form a first printed circuit pattern, and electroplating to form a first plated circuit pattern; the surface, where the first plating circuit pattern is located, of the first insulating layer is attached to the second insulating layer; forming a first blind hole and a second blind hole; printing to form a second printed circuit pattern, a third printed circuit pattern, a first conductive column and a second conductive column; a second plating line pattern is formed on the second printed line pattern by electroplating, and a third plating line pattern is formed on the third printed line pattern by electroplating. According to the invention, the circuit board is manufactured by a printing and electroplating addition process, so that the problems of low production efficiency, serious environmental pollution and relatively high waste material cost and pollution treatment cost of a traditional circuit board process can be effectively reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic circuit additive manufacturing, and in particular relates to a circuit board and a manufacturing method thereof. Background Art

[0002] Double-sided or multi-layer circuit boards on the market are mostly produced and processed using chemical etching technology. Although the technology is mature and can meet the production and processing of higher-precision circuit patterns, it has low production efficiency, high waste costs and pollution treatment costs. In addition, as the country's demand for environmental improvement and carbon emission control continues to increase, its cost will continue to increase in the future. Summary of the invention

[0003] In view of this, an object of the present invention is to provide a circuit board and a method for manufacturing the same, so as to solve the problems of low production efficiency, high environmental pollution, high waste cost and high pollution treatment cost of traditional circuit board processes.

[0004] In some illustrative embodiments, the method for manufacturing the circuit board includes: preparing a first insulating layer; forming a first printed circuit pattern on a first surface of the first insulating layer using a conductive paste, and forming a first plated circuit pattern by electroplating on the first printed circuit pattern; preparing a second insulating layer; bonding the surface of the first plated circuit pattern on the first insulating layer to the second insulating layer; opening a first blind hole that penetrates the first insulating layer and the first printed circuit pattern and reaches the first plated circuit pattern, and a second blind hole that penetrates the second insulating layer and reaches the first plated circuit pattern; forming a second printed circuit pattern on the second surface of the first insulating layer using a conductive paste, and filling the first blind hole to realize a first conductive column that is conductively interconnected between the second printed circuit pattern and the first plated circuit pattern; forming a third printed circuit pattern on a surface of the second insulating layer away from the first plated circuit pattern using a conductive paste, and filling the second blind hole to realize a second conductive column that is conductively interconnected between the third printed circuit pattern and the first plated circuit pattern; electroplating to form a second plated circuit pattern on the second printed circuit pattern, and electroplating to form a third plated circuit pattern on the third printed circuit pattern.

[0005] In some optional embodiments, before applying the conductive paste, it also includes: forming a primer layer on the printing surface of the conductive paste, and the conductive paste is applied on the primer layer; wherein the primer layer is used to improve the adhesion of the conductive paste on the supporting surface.

[0006] In some optional embodiments, the primer layer includes: a first primer layer between the first insulating layer and the first printed circuit pattern, a second primer layer between the first insulating layer and the second printed circuit pattern, and a third primer layer between the second insulating layer and the third printed circuit pattern.

[0007] In some optional embodiments, after the second printed circuit pattern is electroplated to form a second plated circuit pattern, and after the third printed circuit pattern is electroplated to form a third plated circuit pattern, it also includes: forming a covering layer on the second plated circuit pattern and / or the third plated circuit pattern; the covering layer shields part or all of the second plated circuit pattern and / or the third plated circuit pattern.

[0008] In some optional embodiments, after the second printed circuit pattern is electroplated to form a second plated circuit pattern, and after the third printed circuit pattern is electroplated to form a third plated circuit pattern, the method further includes: repeating the following steps once or multiple times: preparing a third insulating layer; bonding the surface of the second plated circuit pattern on the first insulating layer or the surface of the third plated circuit pattern on the second insulating layer to the third insulating layer; opening a third blind hole that penetrates the corresponding insulating layer and reaches the corresponding plated circuit pattern; forming a fourth printed circuit pattern on the surface of the third insulating layer away from the plated circuit pattern using a conductive paste, and filling the third blind hole to realize a third conductive column that is conductively interconnected between the fourth printed circuit pattern and the relative plated circuit pattern; and forming a fourth plated circuit pattern by electroplating on the fourth printed circuit pattern.

[0009] Another object of the present invention is to provide a circuit board to solve the problems in the prior art.

[0010] In some illustrative embodiments, the circuit board is obtained by any of the manufacturing methods described above.

[0011] In some illustrative embodiments, the circuit board is characterized in that it includes: a third plated circuit pattern, a third printed circuit pattern, a second insulating layer, a first plated circuit pattern, a first printed circuit pattern, a first insulating layer, a second printed circuit pattern and a second plated circuit pattern stacked in sequence; wherein the first plated circuit pattern is formed on the first printed circuit pattern, the second plated circuit pattern is formed on the second printed circuit pattern, and the third plated circuit pattern is formed on the third printed circuit pattern; the second printed circuit pattern is interconnected with the first plated circuit pattern through a first conductive column, and the third printed circuit pattern is interconnected with the first plated circuit pattern through a second conductive column.

[0012] In some selected embodiments, the circuit board is characterized in that it also includes: a first primer layer between the first insulating layer and the first printed circuit pattern, a second primer layer between the first insulating layer and the second printed circuit pattern, and a third primer layer between the second insulating layer and the third printed circuit pattern.

[0013] In some optional embodiments, the circuit board is characterized in that it further includes: a covering layer formed on the second plated circuit pattern and / or the third plated circuit pattern; the covering layer shields part or all of the second plated circuit pattern and / or the third plated circuit pattern.

[0014] Compared with the prior art, this application has the following advantages:

[0015] The present invention manufactures the circuit board by an additive process of printing and electroplating, which can effectively reduce the problems of low production efficiency, large environmental pollution, high waste cost and pollution treatment cost of the traditional circuit board process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an example of a process of a method for manufacturing a circuit board in an embodiment of the present invention;

[0017] Figure 2 This is a process example of a method for manufacturing a circuit board in an embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0020] The present invention discloses a method for manufacturing a circuit board. Specifically, Figure 1-2 As shown, Figure 1 This is an example of a process of a method for manufacturing a circuit board in an embodiment of the present invention; Figure 2 This is a process example of a method for manufacturing a circuit board in an embodiment of the present invention. The method for manufacturing a circuit board includes:

[0021] Step S11, preparing a first insulating layer 110;

[0022] The first insulating layer may be made of a hard board or a soft board. The hard board includes but is not limited to: FR-4, CEM-1, 22F, CEM-3, wood, glass, plastic, PMMA (Acrylic), etc.; the soft board includes but is not limited to PET, PVC, PU, ​​PC, PP, PA, PI, CPI (transparent PI), TPE, TPU, TPV, etc.;

[0023] Step S12, forming a first printed circuit pattern 310 on the first surface of the first insulating layer 110 by using a conductive paste, and forming a first plated circuit pattern 410 by electroplating on the first printed circuit pattern 310;

[0024] The conductive paste in the embodiment of the present invention refers to a composite conductive paste mainly composed of a conductive filler, a resin binder and a solvent. After the paste is fully cured, the solvent will fully evaporate, thereby converting the paste into a conductive film in which the conductive filler is bound by the resin film-forming material.

[0025] The conductive filler is not limited to one or at least two of metal particles, graphene, conductive carbon black, carbon nanotubes, and conductive particles such as core-shell structures; the metal particles are not limited to one or at least two of gold, silver, copper, iron, nickel, zinc, and silver-coated copper powder; the resin binder can be any resin on the market, including but not limited to one or at least two of epoxy resin, acrylic resin, naphthalene-containing epoxy resin, polyaromatic epoxy resin, multifunctional epoxy resin, bismaleimide resin, and polyimide resin. The present application does not limit the selection of solvents.

[0026] The curing method of the low-temperature conductive paste in the embodiment of the present invention is not limited to thermosetting, photocuring, electromagnetic radiation or other curing methods.

[0027] Among them, the function of the plated circuit pattern (the first plated circuit pattern, and the second plated circuit pattern, the third plated circuit pattern, and the fourth plated circuit pattern referred to below) is mainly to improve one or more of the conductivity, stability, solderability, oxidation resistance, surface properties, etc. of the printed circuit pattern.

[0028] Step S13, preparing a second insulating layer 12;

[0029] The first insulating layer may be made of a hard board or a soft board. The hard board includes but is not limited to: FR-4, CEM-1, 22F, CEM-3, wood, glass, plastic, PMMA (Acrylic), etc.; the soft board includes but is not limited to PET, PVC, PU, ​​PC, PP, PA, PI, CPI (transparent PI), TPE, TPU, TPV, etc.;

[0030] Step S14, laminating the surface of the first insulating layer 110 where the first plated circuit pattern 410 is located with the second insulating layer 120;

[0031] The two can be bonded to each other through the adhesive layer 810.

[0032] Step S15, opening a first blind hole 610 penetrating through the first insulating layer 110 and the first printed circuit pattern 310 and directly reaching the first plated circuit pattern 410, and a second blind hole 620 penetrating through the second insulating layer 1120 and directly reaching the first plated circuit pattern 410;

[0033] The first blind hole 610 and / or the second blind hole 620 are not limited to being realized by mechanical drilling or laser drilling.

[0034] Optionally, after the first blind hole 610 and / or the second blind hole 620 are processed, the process may further include: using a plasma generator to clean the blind hole, thereby removing the remaining first insulating layer 110 and / or second insulating layer 120, and exposing the complete metal surface at the bottom of the blind hole as much as possible, so as to improve the reliability of subsequent conductive interconnection and reduce contact resistance.

[0035] Preferably, the temperature of the first insulating layer and / or the second insulating layer can be controlled to reach the glass transition temperature of the material, and then surface treatment can be performed by plasma, which can effectively improve the removal effect of residual impurities.

[0036] Step S16, forming a second printed circuit pattern 320 on the second surface of the first insulating layer 110 by using a conductive paste, and filling the first blind hole 610 to realize the first conductive pillar 510 for conductive interconnection between the second printed circuit pattern 320 and the first plated circuit pattern 410;

[0037] Step S17, using a conductive paste to form a third printed circuit pattern 330 on a surface of the second insulating layer 120 away from the first plated circuit pattern 410, and to fill the second blind hole 620 to realize the second conductive pillar 520 for conductive interconnection between the third printed circuit pattern 330 and the first plated circuit pattern 410;

[0038] Step S18 , electroplating the second printed circuit pattern 320 to form a second plated circuit pattern 420 , and electroplating the third printed circuit pattern 330 to form a third plated circuit pattern 430 .

[0039] The present invention manufactures the circuit board by an additive process of printing and electroplating, which can effectively reduce the problems of low production efficiency, large environmental pollution, high waste cost and pollution treatment cost of the traditional circuit board process.

[0040] In some embodiments, before applying the conductive paste, it also includes: forming a primer layer on the printing surface of the conductive paste, and the conductive paste is applied on the primer layer; wherein the primer layer is used to improve the adhesion of the conductive paste on the supporting surface.

[0041] In some embodiments, the primer layer includes: a first primer layer 710 between the first insulating layer 110 and the first printed circuit pattern 310, a second primer layer 720 between the first insulating layer 110 and the second printed circuit pattern 320, and a third primer layer 730 between the second insulating layer 120 and the third printed circuit pattern 330.

[0042] In some embodiments, after the second printed circuit pattern is electroplated to form a second plated circuit pattern, and the third printed circuit pattern is electroplated to form a third plated circuit pattern, the method further includes:

[0043] A covering layer is formed on the second plated circuit pattern and / or the third plated circuit pattern; the covering layer shields a part or the whole of the second plated circuit pattern and / or the third plated circuit pattern.

[0044] In some embodiments, after the second printed circuit pattern is electroplated to form a second plated circuit pattern, and the third printed circuit pattern is electroplated to form a third plated circuit pattern, the method further includes:

[0045] Repeat the following steps one or more times:

[0046] Prepare the third insulation layer;

[0047] The surface where the second plated circuit pattern on the first insulating layer is located or the surface where the third plated circuit pattern on the second insulating layer is located is bonded to the third insulating layer;

[0048] A third blind hole is provided which penetrates the corresponding insulating layer and directly reaches the corresponding plated circuit pattern;

[0049] Using conductive paste to form a fourth printed circuit pattern on a side of the third insulating layer away from the plated circuit pattern, and fill the third blind hole to achieve a third conductive column conductively interconnecting the fourth printed circuit pattern and the opposite plated circuit pattern;

[0050] A fourth plated circuit pattern is formed on the fourth printed circuit pattern by electroplating.

[0051] An embodiment of the present invention discloses a circuit board, which can be obtained by any of the above-mentioned manufacturing methods.

[0052] An embodiment of the present invention discloses a circuit board, comprising: a third plated circuit pattern 430, a third printed circuit pattern 330, a second insulating layer 120, a first plated circuit pattern 410, a first printed circuit pattern 310, a first insulating layer 110, a second printed circuit pattern 320, and a second plated circuit pattern 420 stacked in sequence; wherein the first plated circuit pattern 410 is formed on the first printed circuit pattern 310, the second plated circuit pattern 420 is formed on the second printed circuit pattern 320, and the third plated circuit pattern 430 is formed on the third printed circuit pattern 330; the second printed circuit pattern 320 is interconnected with the first plated circuit pattern 410 through a first conductive column 510, and the third printed circuit pattern 330 is interconnected with the first plated circuit pattern 410 through a second conductive column 520.

[0053] In some embodiments, it also includes: a first primer layer between the first insulating layer and the first printed circuit pattern, a second primer layer between the first insulating layer and the second printed circuit pattern, and a third primer layer between the second insulating layer and the third printed circuit pattern.

[0054] In some embodiments, the method further includes: forming a covering layer on the second plated circuit pattern and / or the third plated circuit pattern; the covering layer shielding a part or all of the second plated circuit pattern and / or the third plated circuit pattern.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a circuit board, characterized in that: include: preparing a first insulating layer; forming a first printed circuit pattern on the first surface of the first insulating layer using a conductive paste, and forming a first plated circuit pattern by electroplating on the first printed circuit pattern; Preparing a second insulating layer; The surface where the first plated circuit pattern is located on the first insulating layer is bonded to the second insulating layer; A first blind hole is formed which penetrates the first insulating layer and the first printed circuit pattern and directly reaches the first plated circuit pattern, and a second blind hole is formed which penetrates the second insulating layer and directly reaches the first plated circuit pattern; Using conductive paste to form a second printed circuit pattern on the second surface of the first insulating layer, and fill the first blind hole to realize a first conductive column for conductive interconnection between the second printed circuit pattern and the first plated circuit pattern; Using conductive paste to form a third printed circuit pattern on a side of the second insulating layer away from the first plated circuit pattern, and fill the second blind hole to realize a second conductive column for conductive interconnection between the third printed circuit pattern and the first plated circuit pattern; A second plated circuit pattern is formed by electroplating on the second printed circuit pattern, and a third plated circuit pattern is formed by electroplating on the third printed circuit pattern.

2. The method according to claim 1, characterized in that: Before applying the conductive paste, it also includes: forming a primer layer on the printing surface of the conductive paste, and the conductive paste is applied on the primer layer; wherein the primer layer is used to improve the adhesion of the conductive paste on the supporting surface.

3. The method according to claim 2, characterized in that: The primer layer includes a first primer layer between the first insulating layer and the first printed wiring pattern, a second primer layer between the first insulating layer and the second printed wiring pattern, and a third primer layer between the second insulating layer and the third printed wiring pattern.

4. The method according to claim 1, characterized in that: After the second printed circuit pattern is electroplated to form a second plated circuit pattern, and after the third printed circuit pattern is electroplated to form a third plated circuit pattern, the method further comprises: A covering layer is formed on the second plated circuit pattern and / or the third plated circuit pattern; the covering layer shields a part or the whole of the second plated circuit pattern and / or the third plated circuit pattern.

5. The method according to claim 1, characterized in that: After the second printed circuit pattern is electroplated to form a second plated circuit pattern, and after the third printed circuit pattern is electroplated to form a third plated circuit pattern, the method further comprises: Repeat the following steps one or more times: Prepare the third insulation layer; The surface where the second plated circuit pattern on the first insulating layer is located or the surface where the third plated circuit pattern on the second insulating layer is located is bonded to the third insulating layer; A third blind hole is provided which penetrates the corresponding insulating layer and directly reaches the corresponding plated circuit pattern; Using conductive paste to form a fourth printed circuit pattern on a side of the third insulating layer away from the plated circuit pattern, and fill the third blind hole to achieve a third conductive column conductively interconnecting the fourth printed circuit pattern and the opposite plated circuit pattern; A fourth plated circuit pattern is formed on the fourth printed circuit pattern by electroplating.

6. A circuit board, characterized in that: The method is obtained by the production method described in claims 1-5.

7. A circuit board, characterized in that: include: A third plated circuit pattern, a third printed circuit pattern, a second insulating layer, a first plated circuit pattern, a first printed circuit pattern, a first insulating layer, a second printed circuit pattern, and a second plated circuit pattern stacked in sequence; wherein the first plated circuit pattern is formed on the first printed circuit pattern, the second plated circuit pattern is formed on the second printed circuit pattern, and the third plated circuit pattern is formed on the third printed circuit pattern; The second printed wiring pattern is interconnected with the first plated wiring pattern through a first conductive column, and the third printed wiring pattern is interconnected with the first plated wiring pattern through a second conductive column.

8. The circuit board according to claim 7, characterized in that: Also includes: A first primer layer is disposed between the first insulating layer and the first printed wiring pattern, a second primer layer is disposed between the first insulating layer and the second printed wiring pattern, and a third primer layer is disposed between the second insulating layer and the third printed wiring pattern.

9. The circuit board according to claim 7, characterized in that: Also includes: A covering layer is formed on the second plated circuit pattern and / or the third plated circuit pattern; the covering layer shields a part or the whole of the second plated circuit pattern and / or the third plated circuit pattern.

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