Siphon heat dissipation device and electronic equipment

Abstract

The invention provides a siphon heat dissipation device and electronic equipment, and the siphon heat dissipation device comprises a main evaporation plate which defines a main evaporation chamber in which a liquid-phase refrigerant is converted into a gas-phase refrigerant; a main condensation chamber is limited by the main condensation plate, and a gas-phase refrigerant is converted into a liquid-phase refrigerant in the main condensation chamber; one end of the liquid-phase pipeline is communicated with the main condensation chamber through a liquid-phase pipeline inlet, and the other end of the liquid-phase pipeline is communicated with the main evaporation chamber through a liquid-phase pipeline outlet; one end of the gas-phase pipeline is communicated with the main evaporation chamber through a gas-phase pipeline inlet, the other end of the gas-phase pipeline is communicated with the main condensation chamber through a gas-phase pipeline outlet, and the liquid-phase pipeline and the gas-phase pipeline are mutually independent; the gas-phase pipeline outlet further extends into the main condensation chamber compared with the liquid-phase pipeline inlet, and the liquid-phase pipeline outlet further extends into the main evaporation chamber compared with the gas-phase pipeline inlet.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic equipment, and in particular, to a siphon heat dissipation device for dissipating heat of an electronic device such as a processor, and an electronic device comprising such a siphon heat dissipation device. Background Art

[0002] The increase in the integration of electronic device chips is accompanied by an increase in their heat generation. Effective heat dissipation is very important for the normal operation and life of the chip. When conventional air cooling cannot meet the needs, water cooling (including single-phase and two-phase water cooling) or immersion cooling can be used. For this purpose, water cooling plates or heat pipes, especially heat pipes in the form of gravity pipes, can be used.

[0003] Regarding the chip water cooling plate, the applicant is aware of the following technical solution, namely, it includes a base plate and an upper cover plate that are sealed and connected to each other, and the base plate is used to be attached to the chip. A receiving chamber for accommodating a heat sink group is stamped on the base plate, and a coolant circulates between adjacent heat sinks. The improvement of the heat dissipation efficiency of this type of water cooling plate requires space consumption and is not suitable for installation on chips with a high degree of integration.

[0004] The applicant is also aware of the following gravity tube for heat dissipation, in which an evaporation chamber for containing a coolant is provided in the base, and a plurality of longitudinal tubes extend outward from the evaporation chamber. The liquid coolant is converted into a gaseous coolant due to the heat transferred through the base, and then converted into a liquid coolant again in the longitudinal tube with the help of an external heat dissipation device and flows back into the evaporation chamber. In this type of gravity tube, the gaseous coolant and the liquid coolant flow in opposite directions in the same space, so when the rising force of the gaseous coolant exceeds its gravity, it will reach its limit, that is, the maximum heat dissipation potential of this gravity tube will be limited, which is obviously disadvantageous.

[0005] It should be noted that the content introduced here only provides background information related to the present disclosure and does not necessarily belong to the prior art. Summary of the invention

[0006] Based on this, an object of the present invention is to further improve the heat dissipation efficiency of electronic equipment or chips, which is achieved by providing an improved siphon heat dissipation device.

[0007] In addition, the present invention is also intended to solve or alleviate other technical problems existing in the prior art.

[0008] The present invention solves the above-mentioned problem by providing the following type of siphon heat dissipation device, specifically, it comprises: a main evaporation plate, the main evaporation plate defines a main evaporation chamber, and the liquid phase refrigerant is converted into a gas phase refrigerant in the main evaporation chamber; a main condensation plate, the main condensation plate defines a main condensation chamber, and the gas phase refrigerant is converted into a liquid phase refrigerant in the main condensation chamber; a liquid phase pipeline, the liquid phase pipeline is connected to the main condensation chamber at a liquid phase pipeline inlet at one end and is connected to the main evaporation chamber at a liquid phase pipeline outlet at the other end; and a gas phase pipeline, wherein the gas phase pipeline is connected to the main evaporation chamber at a gas phase pipeline inlet at one end and is connected to the main condensation chamber at a gas phase pipeline outlet at the other end, The liquid phase pipeline and the gas phase pipeline are independent of each other, the gas phase pipeline outlet extends further into the main condensation chamber than the liquid phase pipeline inlet, and the liquid phase pipeline outlet extends further into the main evaporation chamber than the gas phase pipeline inlet.

[0009] In the siphon heat dissipation device proposed according to the first aspect of the present invention, a gas phase stopper is provided at the gas phase pipeline outlet and further extends toward the interior of the main condensation chamber, or a liquid phase stopper is provided at the liquid phase pipeline outlet and further extends toward the interior of the main evaporation chamber.

[0010] In the siphon heat dissipation device proposed according to the first aspect of the present invention, the gas phase stopper or the liquid phase stopper is an extended portion extending parallel to the central axis of the respective pipeline, or expands outward relative to the central axis of the respective pipeline.

[0011] In the siphon heat dissipation device proposed according to the first aspect of the present invention, the liquid phase pipeline outlet is connected to a level below the liquid level of the liquid phase refrigerant in the main evaporation chamber.

[0012] In the siphon heat dissipation device proposed according to the first aspect of the present invention, it also includes an additional condensation plate, which defines an additional condensation chamber, wherein the additional condensation chamber has an additional condensation inlet connected to the main condensation chamber and an additional condensation outlet connected to the main evaporation chamber, wherein a one-way flow pipeline is provided between the additional condensation inlet and the additional condensation outlet.

[0013] In the siphon heat dissipation device proposed according to the first aspect of the present invention, the one-way flow pipeline is U-shaped.

[0014] In the siphon heat dissipation device proposed according to the first aspect of the present invention, it also includes a heat dissipation fin group, which is fixed between the main evaporation plate and the main condensation plate in a manner of externally surrounding the gas phase pipeline and the liquid phase pipeline, or the heat dissipation fin group is fixed to the outside of the additional condensation plate.

[0015] In the siphon heat dissipation device proposed according to the first aspect of the present invention, the liquid phase pipeline, the gas phase pipeline or the one-way flow pipeline is an aluminum pipeline.

[0016] In the siphon heat dissipation device proposed according to the first aspect of the present invention, the refrigerant is R515B, or R1234ze, or R1234yf, or R134a, or a mixture containing at least one of these refrigerants.

[0017] According to a second aspect of the present invention, there is also provided an electronic device, which comprises a chip and the above-mentioned siphon heat dissipation device, wherein the siphon heat dissipation device is attached to the chip and is used to dissipate heat from the chip.

[0018] By modifying the flow paths of the gas-phase refrigerant and the liquid-phase refrigerant, the siphon heat dissipation device according to the present invention can increase its heat dissipation potential and achieve a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other features of the present invention will become apparent with reference to the accompanying drawings, in which: Figure 1 A perspective view of a siphon heat dissipation device according to an embodiment is shown; Figure 2 Shown according to Figure 1 A partial cross-sectional view of a siphon heat dissipation device; Figure 3 Shown according to Figure 1 Another partial cross-sectional view of the siphon heat dissipation device; Figure 4a A bar graph showing the thermal resistance achieved by each refrigerant in the siphon heat dissipation device; Figure 4b The pressure curves of various refrigerants with respect to temperature in such a siphon heat dissipation device are shown; Figure 5 The thermal resistance curve of this siphon heat dissipation device with respect to air volume is shown in a comparative manner; Figure 6 The thermal resistance curve of this siphon heat dissipation device with respect to TTV power at low air volume is shown in a comparative manner; Figure 7 The thermal resistance curve of this siphon heat sink with respect to TTV power at high air volume is shown in a comparative manner. DETAILED DESCRIPTION

[0020] It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the present invention, and should not be regarded as the whole of the present invention or as a limitation or restriction to the technical solution of the present invention.

[0021] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. They are relative concepts and may change accordingly according to their different positions and different usage states. Therefore, these or other directional terms should not be interpreted as restrictive terms. In addition, the terms "first", "second", "third", etc. or similar expressions are only used for description and distinction purposes, and cannot be understood as indicating or implying the relative importance of the corresponding components.

[0022] refer to Figure 1 , which shows a stereoscopic view of an embodiment of a siphon heat dissipation device according to the present invention. In general, it includes a main heat dissipation component 100 ( Figure 2 shows its corresponding cross-sectional view) and the additional heat dissipation assembly 200 ( Figure 3 The siphon heat dissipation device is used to be attached to the chip of the processor to dissipate heat to the chip in a timely manner.

[0023] The main heat dissipation assembly 100 includes a main condensation plate 110 located at the top, a main evaporation plate 120 located at the bottom, and a gas phase pipeline 130 and a liquid phase pipeline 140 that are independent of each other. The main evaporation plate 120 defines a main evaporation chamber 121, in which a liquid phase refrigerant is filled. The liquid phase refrigerant is converted into a gas phase refrigerant under the action of the heat transferred through the main evaporation plate 120, and then transmitted to the main condensation chamber 111 of the main condensation plate 110 through the gas phase pipeline 130. Under the action of the heat dissipation fin group 150 (which may also be referred to as the main heat dissipation fin group), the gas phase refrigerant is converted into a liquid phase refrigerant again in the main condensation chamber 111 and flows back to the main evaporation chamber 121 through a dedicated liquid phase pipeline 140.

[0024] It should be noted here that the main condensation plate, the main evaporation plate and the additional condensation plate to be described in detail later are generally plate-shaped parts and have a chamber for the refrigerant inside them, which should not be understood as having limitations on thickness, surface shape, contour shape or manufacturing process.

[0025] Specifically, in terms of structure, the liquid phase pipeline 140 is connected to the main evaporation chamber 121 below at the liquid phase pipeline outlet at its lower end, and is connected to the main condensation chamber 111 above at the liquid phase pipeline inlet at its upper end. The gas phase pipeline 130 is connected to the main evaporation chamber 121 below at the gas phase pipeline inlet at its lower end, and is connected to the main condensation chamber 111 at the gas phase pipeline outlet at its upper end. Here, the gas phase pipeline 130 and the liquid phase pipeline 140 are arranged in such a way that firstly, the two are independent of each other, that is, the gas phase pipeline 130 is only used or exclusively used for the flow of gas phase refrigerant, and the liquid phase pipeline 140 is only used or exclusively used for the flow of liquid phase refrigerant. Secondly, the gas phase pipeline outlet extends further into the main condensation chamber 111 at the top than the liquid phase pipeline inlet (this can be represented in the accompanying drawings as the end of the gas phase pipeline outlet is higher than the liquid phase pipeline inlet), and the liquid phase pipeline outlet extends further into the main evaporation chamber 121 at the bottom than the gas phase pipeline inlet (this can be represented in the accompanying drawings as the end of the liquid phase pipeline outlet is lower than the gas phase pipeline inlet).

[0026] In the attached Figure 2 In the figure, the flow path of the gas phase refrigerant is represented by a dotted line with an arrow, and the flow path of the liquid phase refrigerant is represented by a solid line with an arrow. It should also be noted that the concepts of "outlet" and "inlet" used herein are defined in the sense of the flow direction of the refrigerant. Taking the outlet of the liquid phase pipeline as an example, it is configured to allow the liquid phase refrigerant to flow out of the liquid phase pipeline, specifically into the main evaporation chamber. It should also be noted that the number of gas phase pipelines and liquid phase pipelines and the arrangement scheme relative to each other are not limited to the examples proposed herein, and can also be modified as needed.

[0027] In this way, the flow paths of the gas-phase refrigerant and the liquid-phase refrigerant can be completely separated and the mixing and collision of the gas-phase refrigerant and the liquid-phase refrigerant can be avoided, thereby increasing the heat dissipation potential of the siphon heat dissipation device and achieving a better heat dissipation effect.

[0028] In this regard, the following optional implementation is provided, wherein a gas phase stopper 131 is provided at the gas phase pipeline outlet above the gas phase pipeline 130, and the gas phase stopper 131 further extends upward toward the inside of the main condensing chamber 111, that is, the gas phase refrigerant is closer to the top of the main condensing chamber 111, so as to prevent it from mixing with the liquid phase refrigerant. In addition, a liquid phase stopper 141 is also provided at the liquid phase pipeline outlet below the liquid phase pipeline 140, and the liquid phase stopper 141 further extends downward toward the inside of the main evaporation chamber 121. Here, in order to prevent the liquid phase refrigerant from mixing and colliding with the gas phase refrigerant, it is preferred that the gas phase stopper and the liquid phase stopper are provided at the same time.

[0029] The gas phase stopper 131 and the liquid phase stopper 141 can each be implemented as an extension portion extending parallel to the central axis of the pipeline, or they can also be implemented as a stop plate that is expanded or folded outwardly about the central axis of the respective pipeline.

[0030] For example, in the attached Figure 2 In the embodiment shown in , the gas phase pipeline 130 is arranged in one of the liquid phase pipelines 140 (for example, located at the center), so gas phase stoppers are respectively provided at the upper and lower ends of the gas phase pipeline 130, and a liquid phase stopper is provided at the lower end of the liquid phase pipeline 140.

[0031] Alternatively, the liquid phase pipeline outlet below the liquid phase pipeline 140 can extend below the liquid level of the liquid phase refrigerant, that is, the liquid phase refrigerant flowing back into the main evaporation chamber 121 directly flows into the existing liquid phase refrigerant, thereby completely avoiding the mixing and collision of the gas phase refrigerant and the liquid phase refrigerant in the main evaporation chamber 121. Here, the "liquid level" used as a reference for determining the liquid phase pipeline outlet structure can be predetermined, for example, based on the heating power of the processor chip involved. In addition, in the upper main condensation chamber 111, the gas phase pipeline outlet of the gas phase pipeline 130 can be extended upward as much as possible while meeting the gas phase refrigerant flow space requirements.

[0032] Optionally, in order to further improve the heat dissipation efficiency of the siphon heat dissipation device, an additional heat dissipation component 200 is provided to supplement the main heat dissipation component 100 and is in a T-shape with the main heat dissipation component 100 as a whole. Figure 1 As shown in the figure, it includes an additional condensation plate 210, a first connecting pipe 220, a second connecting pipe 230, and an additional heat dissipation fin group 240 (which and the main heat dissipation fin group 150 of the main heat dissipation assembly 100 can be collectively referred to as a heat dissipation fin group), wherein the additional condensation plate 210 defines an additional condensation chamber 221 and the additional condensation chamber has an additional condensation inlet 222 and an additional condensation outlet 223. The additional condensation inlet 222 is connected to the main condensation chamber 111 through the first connecting pipe 220, and the additional condensation outlet 223 is connected to the main evaporation chamber 121 through the second connecting pipe 230, wherein the additional condensation inlet 222 is used to supply the gas phase refrigerant flow and can also be referred to as an additional gas phase refrigerant inlet, and accordingly, the additional condensation inlet 223 is used to supply the liquid phase refrigerant reflux and can therefore also be referred to as a liquid phase refrigerant outlet. In addition, a one-way flow pipeline is provided or formed between the additional condensation inlet 222 and the additional condensation outlet 223. In this one-way flow pipeline, the gas phase refrigerant and the liquid phase refrigerant flow in the same direction, thereby isolating the gas phase refrigerant and the liquid phase refrigerant. Figure 3Similarly, the flow path of the gas-phase refrigerant is represented by a dotted line with an arrow, and the flow path of the liquid-phase refrigerant is represented by a solid line with an arrow.

[0033] Optionally, the one-way flow pipe can be U-shaped or can be combined to form a racetrack shape, for the latter, see Figure 3 Each U-shaped one-way flow pipeline has a first section (e.g., above) and a second section (e.g., below) that are arranged substantially parallel to each other, and an arc section extending between the two sections. Specifically, the gas-phase refrigerant flowing in through the additional condensation inlet 222 flows along the first section; under the action of the additional heat dissipation fin group 240, it is then converted into a liquid-phase refrigerant and then flows in the second section below; finally, the liquid-phase refrigerant flows back to the main evaporation chamber 121 through the additional condensation outlet 223.

[0034] By means of the overall T-shaped structure and the installation of an additional condensation plate with a one-way flow pipeline, it is possible to increase the heat dissipation efficiency while achieving a better spatial arrangement.

[0035] Optionally, the liquid phase pipeline 140 and the gas phase pipeline 130 in the main heat dissipation component 100 and the additional condensation plate 210 or its one-way flow pipeline in the additional heat dissipation component 200 are aluminum pipelines, thereby improving the heat dissipation performance and reducing the production cost.

[0036] Now, the main heat dissipation fin group 150 and the additional heat dissipation fin group 240 are described in detail, which can be achieved by arranging and fixing heat dissipation fins made of heat conductive material to each other, wherein the intervals between adjacent heat dissipation fins can be, for example, rectangular. The main heat dissipation fin group 150 and the additional heat dissipation fin group 240 can be equipped with a fan together to provide air circulation for cooling. The main heat dissipation fin group 150 can surround the liquid phase pipeline 140 and the gas phase pipeline 130 on the outside. The additional heat dissipation fin group 240 can exist on the upper side and the lower side of the additional condensation plate 210, or can also exist in the middle area of ​​the U-shaped additional condensation plate, for example, the additional heat dissipation fin group can be directly welded to the outside of the additional condensation plate.

[0037] Optionally, in such a siphon heat dissipation device, the refrigerant can be R515B, R1234ze, R1234yf, R134a or a mixture containing at least any one of the above refrigerants. Figure 4a The figure shows the heat dissipation performance (represented by the thermal resistance Rca on the vertical axis) achieved by each refrigerant under the same operating conditions in a CPU thermal performance experimental device (TTV, Thermal Test Vehicle), wherein the bar graph is only used to schematically represent the differences between the refrigerants, that is, it should be understood from a comparative perspective. Figure 4bThe pressure curves achieved by each refrigerant at different temperatures in the above TTV are shown (the horizontal axis is the temperature of TTV, and the vertical axis is the refrigerant pressure), wherein it can be concluded from the figure that when the temperature of TTV is 60°C, the pressure corresponding to the refrigerant R515B is about 0.4MPa lower than the pressure corresponding to the refrigerant R1234yf. It should be pointed out that the refrigerant R515B has a lower GWP (Global Warming Potential), is non-flammable, has a lower pressure at the same temperature (about 25% lower than the refrigerant R134a), and can achieve a smaller thermal resistance, so it has a better overall performance in this siphon heat dissipation device.

[0038] In addition, the heat dissipation performance of this siphon cooling device is summarized by combining the CPU thermal performance experimental device and the wind duct test. Figures 5 to 7 , wherein the dotted line represents a common heat dissipation device, and the solid line represents a siphon heat dissipation device according to the present invention, and these drawings are also only for schematic comparison. Figure 5 (where the horizontal axis is the air volume and the vertical axis is the thermal resistance Rca) it can be concluded that under the same air volume, the siphon heat dissipation device according to the present invention can achieve significantly reduced thermal resistance, thereby achieving relatively good heat dissipation performance. Figure 6 and Figure 7 ,in, Figure 6 The relationship between TTV power and thermal resistance achieved at a lower air volume (e.g., 46 CFM) is shown. By analogy, Figure 7 The relationship between TTV power and thermal resistance achieved under high air volume (correspondingly, for example, 90 CFM) is shown. It can be concluded that, compared with conventional heat sinks, the thermal resistance of the siphon heat sink according to the present invention does not change significantly with the increase of TTV power under low air volume, and decreases with the increase of TTV power under high air volume. That is, from Figure 6 and Figure 7 It can be concluded that this siphon cooling device can achieve a relatively stable cooling effect and can maintain outstanding cooling performance especially when the chip heat density is high.

[0039] Finally, the present invention also relates to an electronic device, which can be implemented as a processor and includes a chip and the siphon heat dissipation device according to various embodiments, wherein the siphon heat dissipation device is attached to the chip and is used to dissipate heat from the chip. For the siphon heat dissipation device in the electronic device, reference can be made to the above description of the siphon heat dissipation device.

[0040] It should be understood that all the above preferred embodiments are illustrative rather than restrictive, and various modifications or variations made by those skilled in the art to the specific embodiments described above under the concept of the present invention should be within the legal protection scope of the present invention.

Claims

1. A siphon heat dissipation device, characterized in that: include: a main evaporation plate, the main evaporation plate defining a main evaporation chamber in which a liquid phase refrigerant is converted into a gas phase refrigerant; a main condensing plate, the main condensing plate defining a main condensing chamber in which a gas phase refrigerant is converted into a liquid phase refrigerant; a liquid phase pipeline, the liquid phase pipeline being connected to the main condensing chamber at a liquid phase pipeline inlet at one end and being connected to the main evaporating chamber at a liquid phase pipeline outlet at the other end; and a gas phase pipeline, wherein the gas phase pipeline is connected to the main evaporation chamber at a gas phase pipeline inlet at one end and is connected to the main condensation chamber at a gas phase pipeline outlet at the other end, The liquid phase pipeline and the gas phase pipeline are independent of each other, the gas phase pipeline outlet extends further into the main condensation chamber than the liquid phase pipeline inlet, and the liquid phase pipeline outlet extends further into the main evaporation chamber than the gas phase pipeline inlet.

2. The siphon heat dissipation device according to claim 1, characterized in that: A gas phase stopper further extending toward the interior of the main condensation chamber is provided at the outlet of the gas phase pipeline, or a liquid phase stopper further extending toward the interior of the main evaporation chamber is provided at the outlet of the liquid phase pipeline.

3. The siphon heat dissipation device according to claim 2, characterized in that: The gas phase stopper or the liquid phase stopper is an extended portion extending parallel to the central axis of the respective pipeline, or is expanded outward relative to the central axis of the respective pipeline.

4. The siphon heat dissipation device according to claim 1, characterized in that: The liquid phase pipeline outlet is connected to below the liquid level of the liquid phase refrigerant in the main evaporation chamber.

5. The siphon heat dissipation device according to claim 1, characterized in that: It also includes an additional condensation plate, which defines an additional condensation chamber, wherein the additional condensation chamber has an additional condensation inlet connected to the main condensation chamber and an additional condensation outlet connected to the main evaporation chamber, wherein a one-way flow pipeline is provided between the additional condensation inlet and the additional condensation outlet.

6. The siphon heat dissipation device according to claim 5, characterized in that: The one-way flow pipeline is U-shaped.

7. The siphon heat dissipation device according to claim 5, characterized in that: It also includes a heat dissipation fin group, which is fixed between the main evaporation plate and the main condensation plate in a manner of externally surrounding the gas phase pipeline and the liquid phase pipeline, or the heat dissipation fin group is fixed outside the additional condensation plate.

8. The siphon heat dissipation device according to claim 5, characterized in that: The liquid phase pipeline, the gas phase pipeline or the one-way flow pipeline is an aluminum pipeline.

9. The siphon heat dissipation device according to claim 1, characterized in that: The refrigerant is R515B, or R1234ze, or R1234yf, or R134a, or a mixture containing at least one of the refrigerants.

10. An electronic device, characterized in that: It comprises a chip and the siphon heat dissipation device according to any one of claims 1 to 9, wherein the siphon heat dissipation device is attached to the chip and is used for dissipating heat from the chip.

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