Combined type heat dissipation device

Abstract

The invention relates to a composite heat dissipation device, which comprises a heat dissipation frame module and a fan module, the module comprises a base unit and a water-cooling heat dissipation unit, wherein the base unit is in contact with a high-heat electron unit; the heat dissipation frame module comprises a heat dissipation frame unit and a heat pipe unit, wherein the heat dissipation frame unit is located above the water-cooling heat dissipation unit. The radiating frame unit is provided with a plurality of polygonal radiating fins. Each polygonal radiating fin is provided with a plurality of cutting edges. The design that the high-heat electronic unit is subjected to water-cooling heat dissipation through the water-cooling heat dissipation module is matched with the heat pipe unit to conduct heat energy of the base unit and the high-heat electronic unit to the polygonal cooling fins, and the application that airflow of the fan module blows over the polygonal cooling fins is achieved. And a composite heat dissipation mode of water-cooling heat dissipation and air-cooling heat dissipation is effectively achieved. Furthermore, the design that each polygonal radiating fin is provided with the cutting edge is utilized, so that the overall flow resistance of the radiating frame unit is reduced, and the benefit of air cooling radiating is effectively increased.

Description

Technical Field

[0001] The invention relates to a radiator, and in particular to a composite radiator. Background Art

[0002] As the heat dissipation demand of electronic devices such as computers and servers continues to increase, water-cooled radiators are often installed on electronic components that generate high temperatures during operation. Cold water flows into the water-cooled radiator from the cold water pipe and dissipates the heat of the high-temperature electronic components. After the cold water flows through the water-cooled radiator, it heats up to hot water and flows out of the water-cooled heat dissipation module to the heat sink to cool down to cold water. The cold water then flows back to the water-cooled radiator in a continuous circulation mode to perform water-cooled heat dissipation operations. However, in the existing water-cooled radiator, cold water simply flows through the water-cooled radiator for heat exchange and then flows the heated water out to the heat sink to cool down to cold water. The heat dissipation part completely relies on the heat sink to quickly dissipate the heat. If the temperature generated by the high-heat electronic components is very high, the water-cooled radiator may not be able to cool down effectively in time, which may cause the problem of internal heat accumulation. It is indeed worthy of careful study and discussion by practitioners for improvement. Summary of the invention

[0003] Therefore, an object of the present invention is to provide a composite heat dissipation device with good heat dissipation efficiency.

[0004] Therefore, the composite heat dissipation device of the present invention includes a water-cooling heat dissipation module, a cooling monitoring module connected to the water-cooling heat dissipation module, a heat dissipation frame module, and a fan module.

[0005] The water cooling and heat dissipation module includes a base unit in contact with a high-temperature electronic unit, and a water cooling and heat dissipation unit disposed on the base unit. The water cooling and heat dissipation unit is used to dissipate heat from the base unit and the high-temperature electronic unit. Cold water flows into the water cooling and heat dissipation unit and the water cooling and heat dissipation unit dissipates heat from the base unit and the high-temperature electronic unit, and the cold water is heated to become hot water after flowing through the water cooling and heat dissipation unit and flows out of the water cooling and heat dissipation unit.

[0006] The cooling monitoring module includes a heat sink unit. Hot water generated by the water-cooling heat sink flowing through the water-cooling heat sink module will flow into the heat sink unit of the cooling monitoring module to be cooled into cold water and then flow into the water-cooling heat sink unit.

[0007] The heat sink module includes a heat sink unit located above the water-cooling heat sink of the water-cooling heat sink module, and a heat pipe unit extending upward from the base unit and passing through the heat sink unit. The heat sink unit has a plurality of polygonal heat sinks spaced parallel to each other. The heat pipe unit passes through the polygonal heat sink. The polygonal heat sinks cooperate to define a plurality of heat dissipation channels parallel to the base unit. Each polygonal heat sink has a plurality of cut edges. The angle between any two adjacent cut edges of each polygonal heat sink is an obtuse angle.

[0008] The heat pipe unit of the heat dissipation frame module conducts the heat energy of the base unit and the high-heat electron unit to the heat dissipation frame unit. The airflow generated by the fan module blows through the polygonal heat dissipation fins of the heat dissipation frame unit and causes the heat dissipation frame unit to dissipate heat.

[0009] Compared with the prior art, the composite heat dissipation device of the present invention is designed to dissipate heat from the base unit and the high-thermal electronic unit by means of the water-cooling heat dissipation unit of the water-cooling heat dissipation module, and the heat energy generated by the high-thermal electronic unit can be heat exchanged by means of water-cooling heat dissipation, and the heat pipe unit of the heat dissipation frame module can be used to conduct the heat energy of the base unit and the high-thermal electronic unit to the heat dissipation frame unit synchronously, and the heat energy generated by the high-thermal electronic unit can be directly transferred to the polygonal heat sink of the heat dissipation frame unit through the heat pipe unit in a fast heat conduction manner, and the airflow generated by the fan module blows through the polygonal heat sink, and the heat dissipation action can be performed synchronously by means of air-cooling heat dissipation, effectively achieving a composite heat dissipation method of the composite heat dissipation device that combines water-cooling heat dissipation and air-cooling heat dissipation, thereby greatly increasing the heat dissipation efficiency. Furthermore, by using the ingenuity that each polygonal heat sink has the design of the cut edge and the angle between any two adjacent cut edges is an obtuse angle, the overall flow resistance of the heat dissipation frame unit is reduced, and the efficiency of air-cooling heat dissipation is effectively increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:

[0011] Figure 1 is a three-dimensional diagram illustrating an embodiment of the composite heat dissipation device of the present invention;

[0012] Figure 2 is a side view schematic diagram illustrating the connection relationship between a water cooling heat dissipation module and a heat dissipation frame module in this embodiment;

[0013] Figure 3 is a top view schematically illustrating the connection relationship between one of the polygonal heat sinks of a heat sink unit of the heat sink module and a heat pipe unit of the heat sink module in the embodiment; and

[0014] Figure 4is a schematic diagram illustrating that in this embodiment, a plurality of heat pipes of the heat pipe unit of the heat dissipation frame module are combined on a substrate of a base unit of the water-cooling heat dissipation module; and

[0015] Figure 5 It is a side cross-sectional view illustrating the connection relationship between a horizontal tube body and two vertical tube bodies of one of the heat pipes of the heat pipe unit in the embodiment. DETAILED DESCRIPTION

[0016] Before the present invention is described in detail, it should be noted that similar elements are denoted by the same reference numerals in the following description.

[0017] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The composite heat dissipation device of the present invention comprises a water-cooling heat dissipation module 1, a heat dissipation frame module 2, and a fan module 4. The water-cooling heat dissipation module 1 comprises a base unit 11 contacting a high-heat electronic unit (not shown), and a water-cooling heat dissipation unit 12 disposed on the base unit 11. The water-cooling heat dissipation unit 12 is used to dissipate heat from the base unit 11 and the high-heat electronic unit.

[0018] Cold water flows into the water cooling and heat dissipation unit 12 and causes the water cooling and heat dissipation unit 12 to dissipate heat from the base unit 11 and the high-temperature electronic unit. After the cold water flows through the water cooling and heat dissipation unit 12 , it is heated up to become hot water and flows out of the water cooling and heat dissipation unit 12 .

[0019] The heat sink module 2 includes a heat sink unit 21 located above the water-cooling heat sink unit 12 of the water-cooling heat sink module 1, and a heat pipe unit 22 extending upward from the base unit 11 and passing through the heat sink unit 21. The heat sink unit 21 has a plurality of polygonal heat sinks 211 spaced parallel to each other. The heat pipe unit 22 passes through the polygonal heat sink 211. The polygonal heat sink 211 cooperates to define a plurality of heat dissipation channels 214 parallel to the base unit 11. Each polygonal heat sink 211 has a plurality of cut edges 212. The angle between any two adjacent cut edges 212 of each polygonal heat sink 211 is an obtuse angle. In the present embodiment, each polygonal heat sink 211 is an octagonal plane heat sink, but it is not limited thereto. In the present embodiment, the number of sides of each polygon is at least five, so each polygonal heat sink 211 can also be a pentagon, hexagon, etc.

[0020] The heat pipe unit 22 of the heat dissipation frame module 2 conducts the heat energy of the base unit 11 and the high thermal electron unit to the heat dissipation frame unit 21. The airflow generated by the fan module 4 blows through the polygonal heat dissipation fins 211 of the heat dissipation frame unit 21 and causes the heat dissipation frame unit 21 to dissipate heat.

[0021] When in use, the base unit 11 of the water-cooled heat dissipation module 1 is designed to contact the high-temperature electron unit, so the heat energy generated by the high-temperature electron unit will be thermally conducted to the base unit 11, and the water-cooled heat dissipation unit 12 will be used for water-cooled heat dissipation. At the same time, the heat pipe unit 22 of the heat dissipation frame module 2 will also conduct the heat energy of the base unit 11 and the high-temperature electron unit to the polygonal heat sink 211 of the heat dissipation frame unit 21, so as to achieve the high-temperature heat energy generated by the operation of the high-temperature electron unit to be quickly conducted to the polygonal heat sink 211 by means of heat conduction, and the airflow generated by the fan module 4 blows through the polygonal heat sink 211 of the heat dissipation frame unit 21, the heat dissipation channel 214 and the heat pipe unit 22 to perform heat exchange, so that the flowing airflow takes away the heat energy, and the heat dissipation frame module 2 is effectively cooled as a whole, and a composite heat dissipation method with both water-cooled heat dissipation and air-cooled heat dissipation is effectively achieved to simultaneously dissipate heat for the high-temperature electron unit, thereby greatly increasing the heat dissipation efficiency. In particular, the heat dissipation channel 214 is defined by the cooperation of the polygonal heat sink 211 as follows: Figure 2 The planar channel pattern shown in FIG. 1 and each polygonal heat sink 211 has a Figure 3 The design of the cutting edge 212 shown and the ingenious idea that the angle between any two adjacent cutting edges 212 is an obtuse angle form an octagonal heat dissipation plane feature, which can reduce the overall flow resistance of the heat dissipation rack unit 21, thereby greatly increasing the gas flow through the heat dissipation rack unit 21, effectively increasing the efficiency of air cooling.

[0022] Here, it is particularly noted that, in this embodiment, the base unit 11 of the water-cooled heat dissipation module 1 includes a substrate 111 that contacts the high-thermal electron unit. The heat pipe unit 22 of the heat dissipation frame module 2 has a plurality of heat pipes 221 extending upward from the substrate 111 of the base unit 11 and penetrating the polygonal heat sink 211 of the heat dissipation frame unit 21. The heat pipes 221 of the heat pipe unit 22 conduct the heat energy of the substrate 111 and the high-thermal electron unit to the polygonal heat sink 211. In simple terms, the design of the plurality of heat pipes 221 can more quickly conduct the heat energy of the substrate 111 and the high-thermal electron unit to the polygonal heat sink 211 of the heat dissipation frame unit 21, so as to achieve the goal of using heat conduction to quickly conduct the high-temperature heat energy generated by the operation of the high-thermal electron unit to the polygonal heat sink 211 for heat dissipation. In this embodiment, the number of the heat pipes 221 is three, but it is not limited thereto. The embodiment can be designed to use only one heat pipe 221, two heat pipes 221, or more than four heat pipes 221 according to actual use requirements. Figure 2 The ground plane channel is shown and each polygonal heat sink 211 has a Figure 3 The design of the cutting edge 212 is shown, and the polygonal heat sink 211 and the heat pipe 221 are as follows. Figure 3 The combination shown can allow the gas passing through the cross section of the polygonal heat sink 211 to escape in all directions without passing through each complete polygonal heat sink 211, effectively improving the air cooling efficiency. In this embodiment, the high-heat electronic unit is an electronic chip (CPU) that generates high heat temperature, but is not limited to this.

[0023] In addition, it should be noted that, in the present embodiment, the substrate 111 of the base unit 11 has a first side 112 that contacts the high thermal electron unit. The base unit 11 also includes a plurality of mounting grooves (not shown) recessed on the first side 112 of the substrate 111. Each mounting groove can be used for each heat pipe 221 of the heat pipe unit 22 to be embedded and combined. Each heat pipe 221 has a horizontal tube body 222 that is laterally embedded in each mounting groove and contacts the high thermal electron unit, and two vertical tube bodies 223 that extend upward from two opposite ends of the horizontal tube body 222 and penetrate the polygonal heat sink 211 of the heat dissipation frame unit 21. In simple terms, the horizontal tube body 222 of the heat pipe 221 is as follows: Figure 4 As shown, it is embedded in the first side 112 of the substrate 111 and contacts the high-heat electron unit, but it is not limited to this. In this embodiment, the horizontal tube body 222 of each heat pipe 221 of the heat pipe unit 22 of the heat dissipation rack module 2 cooperates with the vertical tube body 223 to present a U shape, and each heat pipe 221 is a metal hollow heat conduction tube. Metal has advantages such as fast heat transfer speed, but it is not limited to this.

[0024] In particular, in this embodiment, the vertical tube body 223 of each heat pipe 221 of the heat pipe unit 22 penetrates the polygonal heat sink 211 of the heat sink unit 21 and the vertical tube body 223 of each heat pipe 221 corresponds to one of the cut edges 212 close to the polygonal heat sink 211, and each vertical tube body 223 is located in the middle position close to the corresponding cut edge 212 (see FIG. Figure 3 In particular, in this embodiment, the vertical tube bodies 223 of the heat pipes 221 are arranged to surround a polygonal area (not numbered in the figure) close to the cut edge 212 of the polygonal heat sink 211, and the cut edges 212 of the polygonal heat sink 211 corresponding to the vertical tube bodies 223 of each heat pipe 221 face each other, that is, the cut edges 212 corresponding to the vertical tube bodies 223 of each heat pipe 221 are as follows: Figure 3 In short, the vertical tube body 223 of each heat pipe 221 is arranged as follows: Figure 2 The polygonal heat sink 211 is provided through the polygonal heat sink 211 and is located at a position where the cutting edges 212 are opposite to each other (see Figure 3 ) distribution, that is, the vertical tube body 223 of the heat pipe 221 is as follows Figure 3 As shown, the distribution of each vertical tube body 223 near the periphery of the polygonal heat sink 211 and near the middle position of the corresponding cutting edge 212 can promote the vertical tube body 223 of the heat pipe 221 to achieve good heat dissipation distribution when heat is transferred to the polygonal heat sink 211, thereby optimizing the uniformly distributed heat dissipation efficiency, increasing the effective area of ​​the plane characteristic heat dissipation of the polygonal heat sink 211, and achieving an optimized air-cooled heat dissipation effect. In this embodiment, each polygonal heat sink 211 of the heat sink unit 21 also has a plurality of coupling holes 213 for the vertical tube body 223 of the heat pipe 221 to pass through, but the present invention is not limited thereto.

[0025] By using the water-cooling heat dissipation unit 12 of the water-cooling heat dissipation module 1 to dissipate heat from the base unit 11 and the high-thermal electronic unit, the heat energy generated by the high-thermal electronic unit can be heat exchanged through water-cooling heat dissipation, and the heat pipe unit 22 of the heat dissipation frame module 2 can be used to synchronously conduct the heat energy of the base unit 11 and the high-thermal electronic unit to the heat dissipation frame unit 21, so that the heat energy generated by the high-thermal electronic unit can be directly transferred to the polygonal heat sink 211 of the heat dissipation frame unit 21 through the heat pipe unit 22 in a rapid heat conduction manner, and the airflow generated by the fan module 4 is used to blow through the polygonal heat sink 211, so that the heat dissipation action can be synchronously performed through air-cooling heat dissipation, effectively achieving a composite heat dissipation method of the composite heat dissipation device that combines water-cooling heat dissipation and air-cooling heat dissipation, thereby greatly increasing the heat dissipation efficiency. Furthermore, by utilizing the ingenious design that each polygonal heat sink 211 has the cut edge 212 and the included angle between any two adjacent cut edges 212 is an obtuse angle, the overall flow resistance of the heat sink unit 21 is reduced, thereby effectively increasing the efficiency of air cooling and heat dissipation.

[0026] Furthermore, in this embodiment, a cooling monitoring module 3 connected to the water-cooling heat dissipation module 1 is also included, and the cooling monitoring module 3 includes a heat sink unit 31. The hot water generated by the water-cooling heat dissipation unit 12 flowing through the water-cooling heat dissipation module 1 will flow into the heat sink unit 31 of the cooling monitoring module 3 to be cooled into cold water and then flow into the water-cooling heat dissipation unit 12. In this embodiment, the cooling monitoring module 3 also includes a cold water pipe 32 connecting the heat sink unit 31 and the water-cooling heat dissipation unit 12, and a hot water pipe 33 connecting the heat sink unit 31 and the water-cooling heat dissipation unit 12. The hot water generated by flowing through the water-cooling heat dissipation unit 12 will flow from the hot water pipe 33 of the cooling monitoring module 3 into the heat sink unit 31 to be cooled into cold water, and the cold water will flow from the cold water pipe 32 of the cooling monitoring module 3 into the water-cooling heat dissipation unit 12. That is to say, since the substrate 111 of the water-cooled heat dissipation module 1 contacts the high-temperature electron unit, the cold water pipe 32 of the cooling monitoring module 3 flows into the water-cooled heat dissipation unit 12 of the water-cooled heat dissipation module 1 for water-cooled heat dissipation and absorbs the thermal energy of the substrate 111 and the high-temperature electron unit, so that the cold water will be heated up to become hot water after flowing through the water-cooled heat dissipation unit 12, and will flow out from the water-cooled heat dissipation unit 12 to the hot water pipe 33 of the cooling monitoring module 3 and flow into the heat sink unit 31 to be cooled down to become cold water, and then the cold water will flow back to the water-cooled heat dissipation unit 12 from the cold water pipe 32 of the cooling monitoring module 3.

[0027] In addition, in the present embodiment, the water-cooling heat dissipation unit 12 of the water-cooling heat dissipation module 1 has a water-cooling radiator 121 which is arranged on a side of the substrate 111 away from the high-temperature electronic unit and extends upward from the substrate 111, a water inlet pipe 122 connecting the water-cooling radiator 121 and the cold water pipe 32 of the cooling monitoring module 3, and a water outlet pipe 123 connecting the water-cooling radiator 121 and the hot water pipe 33 of the cooling monitoring module 3. The hot water generated by flowing into the water-cooling radiator 121 from the water inlet pipe 122 of the water-cooling heat dissipation unit 12 will flow out from the water outlet pipe 123 to the hot water pipe 33 of the cooling monitoring module 3, and flow into the heat sink unit 31 of the cooling monitoring module 3 to be cooled into cold water, so that the cold water flows back from the cold water pipe 32 of the cooling monitoring module 3 to the water inlet pipe 122 of the water-cooling heat dissipation unit 12, but the present invention is not limited thereto. The polygonal heat sink 211 of the heat sink unit 21 of the heat sink module 2 is located above the water-cooling radiator 121 , but the present invention is not limited thereto.

[0028] In summary, the composite heat dissipation device of the present invention is designed to dissipate heat from the base unit 11 and the high-thermal electronic unit by means of the water-cooling heat dissipation unit 12 of the water-cooling heat dissipation module 1, and the heat energy generated by the high-thermal electronic unit can be heat exchanged by means of water-cooling heat dissipation, and the heat pipe unit 22 of the heat dissipation frame module 2 can be used to conduct the heat energy of the base unit 11 and the high-thermal electronic unit to the heat dissipation frame unit 21 synchronously, and the heat energy generated by the high-thermal electronic unit can be directly transferred to the polygonal heat sink 211 of the heat dissipation frame unit 21 through the heat pipe unit 22 in a fast heat conduction manner, and the airflow generated by the fan module 4 blows through the polygonal heat sink 211, and the heat dissipation action can be performed synchronously by means of air-cooling heat dissipation, effectively achieving a composite heat dissipation method of the composite heat dissipation device that combines water-cooling heat dissipation and air-cooling heat dissipation, thereby greatly increasing the heat dissipation efficiency. This dual-phase heat dissipation method not only has better heat dissipation efficiency, but also has the effect of mutual backup, so that the system has higher fault tolerance and improves the reliability of the system. Furthermore, by utilizing the ingenious design that each polygonal heat sink 211 has the cut edge 212 and the included angle between any two adjacent cut edges 212 is an obtuse angle, the overall flow resistance of the heat sink unit 21 is reduced, thereby effectively increasing the efficiency of air cooling and heat dissipation.

[0029] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. In a composite heat dissipation device, characterized in that: Include: A water-cooling heat dissipation module, comprising a base unit contacting a high-temperature electronic unit, and a water-cooling heat dissipation unit disposed on the base unit, the water-cooling heat dissipation unit being used to dissipate heat from the base unit and the high-temperature electronic unit, wherein cold water flows into the water-cooling heat dissipation unit and dissipates heat from the base unit and the high-temperature electronic unit, and the cold water is heated to become hot water after flowing through the water-cooling heat dissipation unit and flows out of the water-cooling heat dissipation unit; A cooling monitoring module connected to the water-cooling heat dissipation module includes a heat sink unit. Hot water generated by the water-cooling heat dissipation unit flowing through the water-cooling heat dissipation module flows into the heat sink unit of the cooling monitoring module to be cooled into cold water and then flows into the water-cooling heat dissipation unit; A heat sink module, comprising a heat sink unit located above the water-cooling heat sink of the water-cooling heat sink module, and a heat pipe unit extending upward from the base unit and passing through the heat sink unit, the heat sink unit having a plurality of polygonal heat sinks spaced parallel to each other, the heat pipe unit passing through the polygonal heat sinks, the polygonal heat sinks cooperating to define a plurality of heat dissipation channels parallel to the base unit, each polygonal heat sink having a plurality of cut edges, and the angle between any two adjacent cut edges of each polygonal heat sink being an obtuse angle; and A fan module, the heat pipe unit of the heat dissipation frame module conducts the heat energy of the base unit and the high-heat electronic unit to the heat dissipation frame unit, and the airflow generated by the fan module blows through the polygonal heat dissipation fins of the heat dissipation frame unit to dissipate heat from the heat dissipation frame unit.

2. The composite heat dissipation device according to claim 1, characterized in that: The cooling monitoring module also includes a cold water pipe connecting the heat sink unit and the water-cooled heat sink unit, and a hot water pipe connecting the heat sink unit and the water-cooled heat sink unit. The hot water generated by flowing through the water-cooled heat sink unit will flow from the hot water pipe of the cooling monitoring module into the heat sink unit to be cooled into cold water, and the cold water will flow from the cold water pipe of the cooling monitoring module into the water-cooled heat sink unit.

3. The composite heat dissipation device according to claim 1, characterized in that: The base unit includes a substrate contacting the high thermal electron unit. The heat pipe unit of the heat dissipation frame module has a plurality of heat pipes extending upward from the substrate of the base unit and penetrating the polygonal heat sink of the heat dissipation frame unit. The heat pipes of the heat pipe unit conduct heat energy from the substrate and the high thermal electron unit to the polygonal heat sink.

4. The composite heat dissipation device according to claim 3, characterized in that: The substrate of the base unit has a first side that contacts the high-temperature electron unit. The base unit also includes a plurality of mounting grooves recessed on the first side of the substrate. Each mounting groove can be used for each heat pipe of the heat pipe unit to be embedded and combined. Each heat pipe has a horizontal tube body that is transversely embedded in each mounting groove and contacts the high-temperature electron unit, and two vertical tube bodies that extend upward from two opposite ends of the horizontal tube body and penetrate the polygonal heat sink of the heat dissipation frame unit.

5. The composite heat dissipation device according to claim 4, characterized in that: The water-cooling heat dissipation unit of the water-cooling heat dissipation module comprises a water-cooling radiator which is arranged on a side of the substrate away from the high-heat electronic unit and extends upward from the substrate, a water inlet pipe connecting the water-cooling radiator and the cold water pipe of the cooling monitoring module, and a water outlet pipe connecting the water-cooling radiator and the hot water pipe of the cooling monitoring module. The hot water generated by flowing into the water-cooling radiator from the water inlet pipe of the water-cooling heat dissipation unit will flow out from the water outlet pipe to the hot water pipe of the cooling monitoring module, and flow into the heat dissipation unit of the cooling monitoring module to be cooled into cold water, so that the cold water flows back from the cold water pipe of the cooling monitoring module to the water inlet pipe of the water-cooling heat dissipation unit. The polygonal heat sink of the heat dissipation rack unit of the heat dissipation rack module is located above the water-cooling radiator.

6. The composite heat dissipation device according to claim 4, characterized in that: The vertical tube body of each heat pipe of the heat pipe unit penetrates the polygonal heat sink of the heat sink unit and the vertical tube body of each heat pipe corresponds to a cut edge close to the polygonal heat sink, and each vertical tube body is located in the middle position close to the corresponding cut edge.

7. The composite heat dissipation device according to claim 6, characterized in that: The upright tube bodies of the heat pipes are arranged to surround a polygonal area close to the cut edges of the polygonal heat sink, and the cut edges corresponding to the upright tube bodies of each heat pipe face each other.

8. The composite heat dissipation device according to claim 6, characterized in that: Each polygonal heat sink of the heat dissipation frame unit also has a plurality of coupling holes for the upright tube body of the heat pipe to pass through.

9. The composite heat dissipation device according to claim 4, characterized in that: The horizontal tube body of each heat pipe of the heat pipe unit of the heat dissipation rack module cooperates with the vertical tube body to present a U shape, and each heat pipe is a metal hollow heat conducting tube.

10. The composite heat dissipation device according to claim 3, characterized in that: The polygonal heat sink of the heat sink unit of the heat sink module is an octagonal heat sink.

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