Power supply shell, power supply conversion device and electronic equipment

Abstract

The invention provides a power source shell, a power source conversion device and electronic equipment, the power source shell comprises a shell and a fixing plate, the shell is provided with an accommodating cavity, and a first flow channel is arranged in the shell; the fixing plate is located in the containing cavity, at least part of the surface, facing the shell, of the fixing plate is fixedly connected with at least part of the inner surface of the shell, the fixing plate is used for fixing the power conversion function assembly, and heat dissipation is conducted on a heating device in the power conversion function assembly through cooling flow in the first flow channel. The surface of the fixing plate in the power supply shell and the surface of the shell are connected in a face-to-face mode, the connection area is large, the connection stability is higher, and the fixing stability of the power supply conversion function assembly and the shell is improved.

Description

[0001] This application is a divisional application. The application number of the original application is 202111204608.2, and the original application date is October 15, 2021. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The present application relates to the technical field of power supply, and in particular to a power supply housing, a power supply conversion device and an electronic device. Background Art

[0003] A switching power supply, also known as an exchange power supply or a switching converter, is a high-frequency electric energy conversion device and a type of power supply. Its function is to convert a voltage into the voltage or current required by the user through different forms of architecture. As the density of the power module of the switching power supply increases, conventional air cooling and natural heat dissipation can no longer meet the heat dissipation requirements, and more and more high-power modules use liquid cooling. For example, when the power module is a car charger, the MOS tube and magnetic devices of the car charger are the main heat-generating devices. In order to quickly take away the heat of the heat-generating devices, there are many solutions for the heat dissipation of the car charger. Generally, a water channel is provided in the power supply casing, and the MOS tube is attached to the wall of the water channel to dissipate the heat, and the cooling water in the water channel directly takes away the heat. The power supply casing can be formed by a drawing process or a die-casting process to form a flow channel, but when the casing is formed by the drawing process, it cannot be stretched to form an integrated fixing column. Each fixing column needs to be fixed in the shell individually and then the fixing column is fixed to the device. The process time is long and the connection stability between the fixing column and the stretched shell is poor. When the casing is formed by the die-casting process, although the fixing column can be formed during die-casting, the cost of the die-casting mold and the process complexity will increase. Summary of the invention

[0004] The present application provides a power supply housing capable of stably fixing components.

[0005] In a first aspect, the present application provides a power supply housing, comprising an outer shell and a fixing plate, wherein the outer shell has a receiving cavity, and a first flow channel is arranged in the outer shell; the fixing plate is located in the receiving cavity, and the fixing plate is fixedly connected to at least a portion of the inner surface of the outer shell facing at least a portion of the surface of the outer shell, and the fixing plate is used to fix a power conversion functional component, and the heat generating device in the power conversion functional component is dissipated by the cooling fluid in the first flow channel.

[0006] In one embodiment, the housing is formed by a deep drawing process, the housing is made of aluminum, and the aluminum plate is formed into a housing with a receiving cavity by a deep drawing process. The first flow channel in the housing is used to cool the heat generating device in the power conversion functional component, wherein the cooling fluid of the first flow channel can be water, a cooling medium or a phase change medium.

[0007] In some embodiments, the housing is formed by a die-casting process and forms a first flow channel.

[0008] In the present application, the power housing is applied to a power conversion device, which includes a power housing and a power conversion functional component located in the power housing. The power housing also includes a cover plate, one side of the housing has an opening, and the cover plate covers the opening of the housing.

[0009] The power conversion functional component includes a circuit board, a magnetic device, etc., wherein the heating device of the power conversion functional component includes an insulated gate bipolar transistor, a triode, a MOS tube, etc. located on the circuit board, and the heating device also includes an inductor device or a voltage device in the magnetic device. One of the functions of the circuit board is to connect the insulated gate bipolar transistor, the triode, the MOS tube, and the magnetic device. Since there are multiple devices in the power conversion functional component, these devices need to be fixed in the receiving cavity of the shell. The outer shell formed by the die-casting process can be directly die-cast on the inner wall of the outer shell to form fixed columns, which are used to fix the device. However, there are generally more fixed columns, which will increase the cost of the die-casting mold and the complexity of the process. When the outer shell is formed by the deep drawing process, the fixed columns for fixing the device cannot be integrally formed on the inner surface of the outer shell, and the fixed columns need to be welded on the inner surface of the outer shell. Generally, the fixed columns are first fixed to the inner surface of the outer shell by welding or adhesive, and then the power conversion functional component is fixed to the fixed columns to fix the power conversion functional component in the outer shell. This method requires the fixed columns to be fixed one by one on the inner surface of the outer shell. Generally, the end face size of the fixed columns is small, and the fixation to the inner surface of the outer shell is unstable. On the other hand, if the fixed columns are welded to the outer shell one by one or bonded to the outer shell one by one by adhesive, the welding process takes a long time and is relatively complicated. On the other hand, when the material of the outer shell formed by the deep drawing process or the die-casting process is aluminum, the stability of direct welding on the aluminum outer shell is poor, the welding yield is low, and the stability of direct bonding on the aluminum outer shell by adhesive is also poor.

[0010] In the present application, at least a portion of the surface of the fixing plate facing the shell is fixedly connected to at least a portion of the inner surface of the shell, and the fixed connection method includes welding or bonding with an adhesive. The fixed connection between the surface of the fixing plate and the surface of the shell can improve the stability of the connection. Compared with the connection method between the small-sized end face of the stud and the inner surface of the shell, the surface of the fixing plate and the surface of the shell are connected face to face, and the connection area is large and the connection stability is higher. The fixing plate is then fixedly connected to the power conversion functional component to fix the power conversion functional component in the receiving cavity inside the shell. Compared with the method of forming a fixed column by a die-casting process, the process of using a fixing plate is simpler and the process cost is low.

[0011] In one embodiment, the entire surface of the fixing plate facing the shell is fixedly connected to the inner surface of the shell to improve the connection stability between the fixing plate and the shell. In one embodiment, a partial surface of the fixing plate facing the shell can be fixedly connected to the inner surface of the shell.

[0012] In a possible implementation, the fixing plate is provided with a fixing hole penetrating two opposite surfaces of the fixing plate, a fixing sub-component is provided in the fixing hole, and the fixing hole cooperates with the fixing sub-component to fix the power conversion functional component.

[0013] In one embodiment, the area of ​​the surface of the fixing plate facing the housing is greater than 1 / 4 times the area of ​​the inner surface of the housing, so that the fixing plate has a sufficient area to install a sufficient number of fixing components.

[0014] In a possible implementation, the shell includes the base plate and a peripheral side plate located on one side of the base plate and surrounding the base plate, the base plate and the peripheral side plate are arranged to form the accommodating cavity, and the fixed plate includes a first fixed sub-plate stacked with the base plate, at least a portion of the surface of the first fixed sub-plate facing the base plate is fixedly connected to at least a portion of the inner surface of the base plate, and an area of ​​the surface of the first fixed sub-plate facing the base plate is greater than or equal to 0.5 times the area of ​​the surface of the base plate facing the first fixed sub-plate, and is less than or equal to the area of ​​the surface of the base plate facing the first fixed sub-plate.

[0015] In one embodiment, the peripheral side plate is perpendicular to the bottom plate, and when the shell is formed by a deep drawing process, the peripheral side plate can be arranged perpendicular to the bottom plate. In this embodiment, when the shell is formed by a deep drawing process, the connection between the peripheral side plate and the bottom plate is a rounded corner. In one embodiment, the peripheral side plate deviates from the direction perpendicular to the bottom plate by a certain angle, and when the shell is formed by a die casting process, the peripheral side plate has a draft angle, so that the peripheral side plate deviates from the direction perpendicular to the bottom plate by a certain angle.

[0016] Among them, setting the area of ​​the first fixed sub-board to be larger than half the area of ​​the bottom plate is conducive to fixing the power conversion functional component. Since the functional devices of the power conversion functional component are relatively large and scattered, including but not limited to circuit boards, inductors, transformers, etc., when these functional devices are distributed on the left, right, front, back or middle of the accommodating cavity, the area of ​​the first fixed sub-board cannot be too small, and the area of ​​the surface of the first fixed sub-board facing the bottom plate is greater than or equal to . times the area of ​​the surface of the bottom plate facing the first fixed sub-board, so that the first fixed sub-board has enough area to install a sufficient number of fixed sub-components for fixing each functional device in the power conversion functional component.

[0017] In some embodiments, when the area of ​​the first fixed sub-plate is small, the first fixed sub-plate can be patterned so that the first fixed sub-plate can fix the functional devices in the power conversion functional component that are arranged toward the base plate. The specific pattern can be designed according to the setting position and quantity of each device in the power conversion functional component.

[0018] In a possible implementation, the fixed plate further includes a second fixed sub-plate, the second fixed sub-plate is located on the inner side of the peripheral side plate and intersects with the first fixed sub-plate, and at least a portion of the surface of the second fixed sub-plate facing the peripheral side plate is fixedly connected to at least a portion of the inner surface of the peripheral side plate. The second fixed sub-plate can fix the power conversion functional component from the side, for example, it can fix the surface of the magnetic device facing the peripheral side plate, thereby improving the stability of the fixed connection. The second fixed sub-plate intersects with the first fixed sub-plate, including the second fixed sub-plate intersecting with the first fixed sub-plate perpendicularly, or the second fixed sub-plate deviates from a certain angle compared to the direction perpendicular to the first fixed sub-plate. For example, in one embodiment, the angle between the second fixed sub-plate and the first fixed sub-plate is greater than or equal to 80° and less than 90°. The second fixed sub-plate can be used to fix part of the power conversion functional component that is a certain distance away from the peripheral side plate.

[0019] In one embodiment, the second fixed sub-plate and the first fixed sub-plate are an integrated structure. That is, the fixed plate is an integrated structure. The material of the fixed plate is aluminum. In one embodiment, the shape of the fixed plate is adapted to the outer shell, and the fixed plate is attached to the inner wall of the outer shell, wherein the fixed plate can be formed by a deep drawing process, and the fixed plate can also be formed by a bending process.

[0020] In one embodiment, the second fixed sub-plate includes a first portion and a second portion that are arranged opposite to each other along a first direction, and the peripheral side plate includes a first side plate and a second side plate that are arranged opposite to each other along the first direction, the first portion is located on the surface of the first side plate facing the receiving cavity, and the second portion is located on the surface of the second side plate facing the receiving cavity. The first portion, the first fixed sub-plate, and the second portion are an integrated structure. The second fixed sub-plate is fixed to the peripheral side plate by fixing the first portion and the second portion to the first side plate and the second side plate, respectively. The second fixed sub-plate only includes the first portion and the second portion, which can save costs while ensuring connection reliability.

[0021] In some embodiments, the second fixed sub-plate further includes a third portion disposed on one side of the first fixed sub-plate along the second direction, the third portion being used to fix the surface of the power conversion functional component along one side of the second direction, wherein the second direction intersects with the first square, and in a specific embodiment, the first direction is the width direction of the power housing, the second direction is the length direction of the power housing, and the second direction intersects with the first square perpendicularly. In some embodiments, the first direction is the length direction of the power housing, and the second direction is the width direction of the power housing.

[0022] In one embodiment, the fixing plate is connected and fixed to both the bottom plate and the peripheral side plate of the housing, thereby increasing the fixing connection area and improving the stability of the fixing connection.

[0023] In one embodiment, the second fixed sub-board has a fixing piece at one end away from the first fixed sub-board, and the fixing piece extends from the second fixed sub-board to the middle of the receiving cavity. The fixing piece is used to fix the functional components in the power conversion functional assembly that are arranged away from the bottom plate.

[0024] In one embodiment, the power conversion functional component includes two circuit boards arranged opposite to each other along a third direction, the third direction intersects the first direction and the second direction perpendicularly, and the third direction is the height direction of the power housing, one of the circuit boards is fixedly connected to the first fixed sub-board, and the other circuit board is located on a side of the fixing plate away from the bottom plate and is fixedly connected to the fixing plate. Specifically, a hole can be opened on the fixing plate, and the circuit board can be fixed to the fixing plate by studs or rivets.

[0025] In one possible implementation, the portion of the shell other than the first flow channel is an integrated structure. The bottom plate and the surrounding side plates in the shell of the integrated structure are continuous, and no welding parts or fixings are required, which can save costs, and the sealing of the first flow channel is better. In some embodiments, a die-casting process is used to form a groove, and then a sealing plate is used to cover the groove to form a flow channel. The sealing position of the sealing plate and the groove needs to be welded by stir friction welding or bonded with an adhesive, which makes the sealing of the flow channel poor, and after long-term use, the welding or bonding of the adhesive is poor. In addition, the cooling water is more sensitive to defects on the groove formed by die-casting, such as pores, shrinkage, cracks, etc., and the risk of water leakage is high. The portion of the shell other than the first flow channel is an integrated structure, that is, the edge of the first flow channel is integrated, the sealing is better, and the risk of water leakage is avoided.

[0026] In a possible implementation, the outer shell includes a first sub-shell and a second sub-shell, the first sub-shell is nested in the second sub-shell, and the cavity of the first sub-shell is a receiving cavity, the first sub-shell is fixedly connected to the fixing plate, the first flow channel is located between the first sub-shell and the second sub-shell, and the first sub-shell and the second sub-shell are hot-rolled and fused into an integrated structure except for the first flow channel.

[0027] In one embodiment, the first subshell includes a first bottom wall and a first side wall located at one side of the first bottom wall and arranged around the first bottom wall, the second subshell includes a second bottom wall and a second side wall located at one side of the second bottom wall and arranged around the second bottom wall, the first bottom wall and the second bottom wall are stacked together to form a bottom plate, the first side wall and the second side wall are stacked together to form a peripheral side plate, part of the first flow channel is located between the first bottom wall and the second bottom wall, and part of the first flow channel is located between the first side wall and the second side wall. In some embodiments, the first flow channel may be located only between the first side wall and the second side wall, and arranged around the entire first side wall. In some embodiments, the first flow channel may be located only between the first bottom wall and the second bottom wall, and the pattern of the first flow channel may be set according to actual needs.

[0028] The first subshell and the second subshell are made of aluminum, which is cheap and has good thermal conductivity, while copper is expensive and stainless steel has poor thermal conductivity.

[0029] In a possible implementation, the first subshell includes a first protrusion protruding in a direction away from the second subshell, and the second subshell and the first protrusion constitute a first flow channel. In one embodiment, the thickness of the first protrusion is less than the thickness of other parts of the second subshell, and the thickness refers to the dimension perpendicular to the first protrusion or the second subshell. In one embodiment, the thickness of the second subshell is 1.5 mm, and the thickness of the first protrusion is 1 mm. In one embodiment, when the first protrusion is formed by a deep drawing process, the connection between the first protrusion and the part of the first subshell other than the first protrusion is rounded.

[0030] In a possible implementation, the second subshell includes a second convex portion that convexes in a direction away from the first subshell, and the first subshell and the second convex portion form a first flow channel. In one embodiment, when the second convex portion is formed by a deep drawing process, the connection between the second convex portion and the portion of the second subshell other than the second convex portion is a rounded corner.

[0031] In a possible implementation, the first subshell includes a first convex portion protruding in a direction away from the second subshell, the second subshell includes a second convex portion protruding in a direction away from the first subshell, the first convex portion and the second convex portion are arranged opposite to each other and connected to each other, and together constitute a first flow channel.

[0032] In a possible implementation, the housing includes a first subshell and a second subshell, the first subshell is nested in the second subshell, the cavity of the first subshell is the receiving cavity, the first subshell is fixedly connected to the fixing plate, the first flow channel is located between the first subshell and the second subshell, and the edge of the opening of the first subshell is sealed with the edge of the opening of the second subshell. The first subshell is a groove-shaped structure composed of a first bottom wall and a first side wall, and the opening of the groove-shaped structure is the opening of the first subshell. The second subshell is a groove-shaped structure composed of a second bottom wall and a second side wall, and the opening of the groove-shaped structure is the opening of the second subshell.

[0033] In a possible implementation, the fixed plate is provided with a avoidance hole penetrating two opposite surfaces thereof, the projection of the avoidance hole on the first subshell along the thickness direction of the first subshell at least partially overlaps with the projection of the first flow channel on the first subshell along the thickness direction of the first subshell, and the avoidance hole is used to accommodate at least part of the heating device. The thickness direction of the first subshell refers to a direction perpendicular to the part of the first subshell where the first flow channel is located. When the avoidance hole is located on the first fixed sub-plate, the thickness direction of the first subshell is a direction perpendicular to the first bottom wall. When the avoidance hole is located on the second fixed sub-plate, the thickness direction of the first subshell is a direction perpendicular to the first side wall.

[0034] In one possible implementation, the first flow channel includes a first sub-channel located inside the bottom plate, the fixed plate includes a first fixed sub-plate arranged relative to the bottom plate along a third direction, at least part of the avoidance holes are located in the first fixed sub-plate, and at least part of the first sub-channel is arranged relative to the avoidance holes located in the first fixed sub-plate along the third direction. In one embodiment, the third direction is the height direction of the power supply housing, and the first sub-channel is used to cool the heat-generating device above the bottom plate. In the power conversion device, the circuit board is generally arranged above the bottom plate of the housing, and the circuit board and the fixed plate are fixed face to face, and the first sub-channel cools the heat-generating devices such as insulated gate bipolar transistors, triodes, MOS tubes, etc. on the circuit board through the avoidance holes.

[0035] In a possible implementation, the first flow channel also includes a second sub-channel located inside the peripheral side plate, the first sub-channel and the second sub-channel are interconnected, the fixed plate includes a second fixed sub-plate, the second fixed sub-plate is fixedly connected to the surface of the peripheral side plate and connected to the first fixed sub-plate, part of the avoidance holes are located in the second fixed sub-plate, and at least part of the second sub-channel is arranged relative to the avoidance holes located in the second fixed sub-plate along a third direction. The second sub-channel is used to cool the heat-generating devices on the side of the peripheral side plate, such as inductors and capacitors in magnetic devices, and the magnetic devices can be arranged adjacent to the peripheral side plate, so that the second sub-channel in the peripheral side plate can cool and dissipate heat for the magnetic devices.

[0036] The fixing plate may be provided with a plurality of avoidance holes, a portion of the plurality of avoidance holes are located in the first fixing sub-plate, and the remaining portion of the avoidance holes are located in the second fixing sub-plate.

[0037] In a possible implementation, the first subshell includes a first protrusion protruding in a direction away from the second subshell, the second subshell and the first protrusion constitute a first flow channel, the first protrusion is located in the avoidance hole, and the first protrusion abuts against at least a portion of the inner surface of the power conversion functional component facing the first subshell. The first protrusion is arranged in the avoidance hole and filled in the avoidance hole, so that the power conversion functional component can be placed flat on the fixing plate, improve the flatness, and avoid the circuit board portion located at the avoidance hole from being crushed when impacted.

[0038] In a possible implementation, the power supply housing further includes a liquid inlet nozzle and a liquid outlet nozzle, and the liquid inlet nozzle and the liquid outlet nozzle are located on both sides of the housing and are connected to the first flow channel. A hole can be opened on the outer wall of the housing, and the liquid inlet nozzle and the liquid outlet nozzle are welded to the opening portion by a brazing process for connecting to the first flow channel. In one embodiment, part of the first flow channel is located in the bottom plate, and part of the first flow channel is located in the surrounding side plate, and the liquid inlet nozzle and the liquid outlet nozzle are located on the outside of the surrounding side plate and are connected to the first flow channel in the surrounding side plate. In some embodiments, the liquid inlet nozzle and the liquid outlet nozzle are located on the same side of the surrounding side plate.

[0039] In a possible implementation, the power supply housing further includes a third sub-shell, the first sub-shell and the second sub-shell are nested in the third sub-shell, and a second flow channel is provided between the third sub-shell and the second sub-shell. The first sub-shell is nested in the second sub-shell, and the second sub-shell is nested in the third sub-shell. The provision of the first flow channel and the second flow channel can achieve a better heat dissipation effect. The first flow channel is provided closer to the heating device in the power conversion functional component than the second flow channel. The first flow channel cools the heating device and absorbs heat. After absorbing heat, the first flow channel is absorbed by the second flow channel to transfer the heat away. In some embodiments, the temperatures of the cooling liquids in the first flow channel and the second flow channel can be set differently. The cooling liquid with a temperature difference can improve the heat exchange efficiency between the first flow channel and the second flow channel, thereby improving the heat dissipation efficiency of the heating device.

[0040] In a possible implementation, the second subshell includes a third protrusion protruding in a direction away from the third subshell, and the third subshell and the third protrusion constitute a second flow channel. In one embodiment, the thickness of the third protrusion is less than the thickness of the third subshell, and the thickness refers to the dimension perpendicular to the third protrusion or the third subshell. In one embodiment, the thickness of the third subshell is 1.5 mm, and the thickness of the third protrusion is 1 mm.

[0041] In a possible implementation manner, the third sub-shell includes a fourth convex portion protruding in a direction away from the second sub-shell, and the second sub-shell and the fourth convex portion form a second flow channel.

[0042] In a possible implementation, the second subshell includes a third protrusion protruding in a direction away from the third subshell, the third subshell includes a fourth protrusion protruding in a direction away from the second subshell, and the third protrusion is arranged opposite to the fourth protrusion and is connected to each other to jointly constitute a second flow channel.

[0043] In one embodiment, the area size of the inner surface of the third subshell is comparable to the area size of the outer surface of the second subshell. The third subshell is an integrated structure formed by a deep drawing process, and the third subshell includes a third bottom wall and a third side wall, the third bottom wall is located on a side of the second bottom wall away from the first bottom wall, the third side wall is located on a side of the second side wall away from the first side wall, and the second flow channel is located between the third bottom wall and the second bottom wall. The third bottom wall, the second bottom wall and the first bottom wall are stacked along the third direction to form a bottom plate together, and the second flow channel is located in the bottom plate.

[0044] In one embodiment, the second flow channel is located between the third side wall and the second side wall. The third side wall, the second side wall and the first side wall together constitute a peripheral side plate, and the second flow channel is located in the peripheral side plate.

[0045] In one embodiment, part of the second flow channel is located between the third bottom wall and the second bottom wall, and part of the second flow channel may be located between the third side wall and the second side wall. The second flow channel is distributed in the bottom plate and the peripheral side plate.

[0046] In a possible implementation, the projection of the second flow channel on the second sub-shell along the thickness direction of the second sub-shell at least partially overlaps with the projection of the first flow channel on the second sub-shell along the thickness direction of the second sub-shell. The thickness direction of the second sub-shell refers to a direction perpendicular to the second sub-shell having the second flow channel or having the first flow channel. For example, when the second flow channel and the first flow channel are located in the bottom plate of the outer shell, the thickness direction is the direction perpendicular to the bottom plate. When the second flow channel and the first flow channel are located in the second side plate of the peripheral side plate, the thickness direction is the direction perpendicular to the second side plate.

[0047] The above design allows continuous heat transfer between the second flow channel and the first flow channel. The first flow channel can extend to the location of the heat generating device that needs to dissipate heat, making the design of the second flow channel and the first flow channel more flexible to adapt to a variety of power conversion functional components with different structural settings.

[0048] In a possible implementation, the second flow channel is not connected to the first flow channel, a first medium is provided in the first flow channel, a second medium is provided in the second flow channel, and the thermal conductivity of the second medium is greater than the thermal conductivity of the first medium. The thermal conductivity of the second medium is greater than the thermal conductivity of the first medium, indicating that the second medium has better heat dissipation efficiency and can quickly absorb the heat of the heating device. In one embodiment, the second medium is a phase change material and the first medium is water.

[0049] In some embodiments, the second flow channel is connected to the first flow channel, and the two layers of flow channels can increase the flow path of the coolant in the housing and improve the heat dissipation effect.

[0050] In some embodiments, the housing may further include more sub-shells stacked to form a plurality of flow channels, which may be specifically arranged according to needs to improve the heat dissipation effect.

[0051] In the second aspect, the present application also provides a power conversion device, the power conversion device includes a power conversion functional component and a power housing as described in any of the above items, the power conversion functional component is located in the receiving cavity in the housing, and is fixedly connected to the fixing plate. The power conversion device realizes the power conversion function through the power conversion functional component, wherein the power conversion includes AC conversion to high-voltage DC, for example, converting 220V civil AC or 380V industrial AC into high-voltage DC for charging the target device. When the target device is a car, the high-voltage DC can be 450V; the target device can also be other devices that need power supply; power conversion also includes high-voltage DC conversion to low-voltage DC, for example, high-voltage DC in a car is converted into low-voltage DC for powering low-voltage devices such as lights, audio, and radios.

[0052] The power conversion functional component includes a circuit board, a magnetic device, etc. The heating device of the power conversion functional component includes an insulated gate bipolar transistor, a triode, a MOS tube, etc. located on the circuit board, and the heating device also includes an inductor device or a voltage device in the magnetic device. One of the functions of the circuit board is to connect the insulated gate bipolar transistor, the triode, the MOS tube, the magnetic device, etc.

[0053] In a possible implementation, the power supply housing further includes a cover plate, one side of the housing has an opening, and the cover plate covers the opening of the housing.

[0054] In a third aspect, the present application further provides an electronic device, the electronic device comprising a load and a power conversion device as described above, the power conversion device being electrically connected to the load for supplying power to the load. The power conversion device supplies the converted power to the load for supplying power to the load.

[0055] In a possible implementation, the electronic device is a vehicle, a charging pile, a charging power station, a communication device or a data center. The data center includes a cabinet or a data room. The electronic device may also be other devices that require power conversion.

[0056] In some embodiments, when the electronic device is a data center, the load is a server in the data center, and the power conversion device converts 380V industrial electricity into direct current power for the server. The voltage after the power conversion device converts can be set according to the load. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0058] Figure 1 It is a schematic diagram of the three-dimensional structure of a power supply housing provided in one embodiment of the present application;

[0059] Figure 2a is a schematic diagram of the three-dimensional structure of a power conversion device provided in one embodiment of the present application;

[0060] Figure 2b is a schematic diagram of a cross-sectional structure of a power conversion device provided in one embodiment of the present application;

[0061] Figure 3 It is a schematic diagram of the three-dimensional structure of a power supply housing provided in one embodiment of the present application;

[0062] Figure 4 It is a schematic diagram of a cross-section structure of a power supply housing provided in one embodiment of the present application;

[0063] Figure 5a This application Figure 4 A partial enlarged view of part A;

[0064] Figure 5b This application Figure 4 A partial enlarged view of part B;

[0065] Figure 6 It is a schematic diagram of the three-dimensional structure of a power supply housing provided in one embodiment of the present application;

[0066] Figure 7 It is a structural schematic diagram of a bottom plate, a fixing plate and a power conversion functional component in a power housing provided in an embodiment of the present application;

[0067] Figure 8 It is a schematic diagram of the structure of a fixing plate in a power supply housing provided in one embodiment of the present application;

[0068] Fig. 9 This is a schematic structural diagram of a base plate, a support frame and a power conversion functional component provided by an implementation method;

[0069] Fig.10 It is a schematic diagram of the structure of a fixing plate in a power supply housing provided in one embodiment of the present application;

[0070] Fig.11 It is a schematic diagram of the structure of the flow channel formed by the die casting process;

[0071] Fig.12 It is a schematic diagram of the step of printing a graphite rolling resistance agent in the method for preparing a power supply housing provided in one embodiment of the present application;

[0072] Fig.13 It is a schematic diagram of a hot rolling step in a method for preparing a power supply housing provided in one embodiment of the present application;

[0073] Fig.14It is a schematic diagram of a drawing step in a method for preparing a power supply housing provided in one embodiment of the present application;

[0074] Fig.15 It is a schematic diagram of the inflation step in the method for preparing a power supply housing provided in one embodiment of the present application;

[0075] Fig.16 It is a schematic diagram of the structure of the outer shell in the power supply housing provided in one embodiment of the present application;

[0076] Fig.17 It is a schematic diagram of the structure of the outer shell in the power supply housing provided in one embodiment of the present application;

[0077] Fig.18 It is a schematic diagram of the structure of the shell in the power supply housing provided in one embodiment of the present application;

[0078] Fig.19 It is a schematic diagram of the structure of the outer shell in the power supply housing provided in one embodiment of the present application;

[0079] Fig. 20 is a three-dimensional exploded view of a power supply housing provided in one embodiment of the present application;

[0080] Fig.21 It is a schematic diagram of the positions of a power supply housing and a circuit board provided in one embodiment of the present application;

[0081] Fig. 22 It is a schematic diagram of the positions of a power supply housing and a power conversion functional component provided in one embodiment of the present application;

[0082] Fig.23 It is a schematic diagram of the positions of a power supply housing and a circuit board provided in one embodiment of the present application;

[0083] Fig.24 It is a schematic diagram of the structure of the shell in the power supply housing provided in one embodiment of the present application;

[0084] Fig.25 It is a schematic diagram of the structure of the outer shell in the power supply housing provided in one embodiment of the present application;

[0085] Fig.26 It is a schematic diagram of the structure of the shell in the power supply housing provided in one embodiment of the present application;

[0086] Fig. 27 It is a schematic diagram of the positions of the first flow channel, the second flow channel and the heating device in the power supply housing provided in one embodiment of the present application;

[0087] Fig.28 It is a schematic diagram of the structure of the housing formed by the die casting process;

[0088] Fig.29It is a schematic diagram of the structure of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0089] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0090] In this document, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0091] In addition, in this article, directional terms such as "upper" and "lower" are defined relative to the orientation of the structure schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the change of the orientation of the structure.

[0092] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application are explained and described below.

[0093] Drawing process: also known as drawing, stretching, calendering, etc., refers to a mechanical processing process that uses a die to punch a certain shape of flat blank obtained after punching into various open hollow parts or to reduce the diameter of the open hollow blank and increase the height. The drawing process can be used to manufacture thin-walled parts in cylindrical, stepped, conical, spherical, box-shaped and other irregular shapes.

[0094] MOS tube: It is the abbreviation of MOSFET, Metal-Oxide-Semiconductor Field-EffectTransistor, metal-oxide semiconductor field effect transistor.

[0095] Die casting: Die casting is a precision casting method that uses high pressure to force molten metal into a complex-shaped metal mold. Its characteristic is that high pressure is applied to the molten metal in the mold cavity. The mold is usually made of a higher-strength alloy.

[0096] Draft angle: The draft angle is also the demolding angle, which is the slope designed on both sides of the mold cavity to facilitate demolding.

[0097] Welding flange: It is a part that connects pipes to each other and is connected to the pipe ends.

[0098] Friction stir welding: It refers to the use of the heat generated by the friction between the high-speed rotating welding tool and the workpiece to partially melt the material to be welded. When the welding tool moves forward along the welding interface, the plasticized material flows from the front to the back of the welding tool under the action of the rotating friction force of the welding tool, and forms a dense solid phase weld under the extrusion of the welding tool.

[0099] See also Figure 1 In one embodiment of the present application, a power supply housing 10 is provided, comprising a housing 100 and a fixing plate 200. The housing 100 has a receiving cavity 101, and a first flow channel 300 is provided in the housing 100. The fixing plate 200 is located in the receiving cavity 101, and at least a portion of the surface of the fixing plate 200 facing the housing 100 is fixedly connected to at least a portion of the inner surface of the housing 100. The fixing plate 200 is used to fix a power conversion functional component 400 (such as Figure 2a As shown), the heat generating device 401 in the power conversion functional component 400 is cooled by the cooling fluid in the first flow channel 300.

[0100] The housing 100 is formed by a deep drawing process, and the material of the housing 100 is aluminum. The aluminum plate is subjected to a deep drawing process to form the housing 100 having the receiving cavity 101. The first flow channel 300 in the housing 100 is used to cool the heating device 401 in the power conversion functional component 400, and the cooling fluid of the first flow channel 300 can be water, a cooling medium, or a phase change medium. In some embodiments, the housing 100 is formed by a die-casting process, and the first flow channel 300 is formed.

[0101] In the present application, the power supply housing 10 is applied to a power conversion device 20 (such as Figure 2a ), the power conversion device 20 includes a power housing 10 and a power conversion functional component 400 located in the power housing 10, the power housing 10 also includes a cover 600, one side of the housing 100 has an opening 106, and the cover 600 covers the opening 106 of the housing 100. The power conversion functional component 400 is a combination of components for realizing the power conversion function, wherein the power conversion includes the conversion of AC into high-voltage DC, for example, converting 220V civil AC or 380V industrial AC into high-voltage DC for charging the target device. When the target device is a car, the high-voltage DC can be 450V; the target device can also be other devices that need power supply; the power conversion also includes the conversion of high-voltage DC into low-voltage DC, for example, the high-voltage DC in the car is converted into low-voltage DC for powering low-voltage devices such as car lights, audio, and radios. The housing 100 can be provided with a connection hole 107 (such as Figure 3 As shown), the power conversion device 20 also includes a connecting member 21 (as shown Figure 2a As shown), the connector 21 connects the power conversion functional component 400 and the external load or external power supply through the connecting hole 107.

[0102] See also Figure 2b The power conversion functional component 400 includes a circuit board 410, a magnetic device 420, etc., wherein the heating device 401 of the power conversion functional component 400 includes an insulated gate bipolar transistor 411, a triode 412, a MOS tube, etc. located on the circuit board 410, and the heating device 401 also includes an inductor device or a transformer, etc. in the magnetic device 420. One of the functions of the circuit board 410 is to connect the insulated gate bipolar transistor 411, the triode 412, the MOS tube, and the magnetic device 420, etc. Since the power conversion functional component 400 has multiple devices, these devices need to be fixed in the receiving cavity 101 of the housing 100. The housing formed by the die-casting process can directly die-cast fixed columns on the inner wall of the housing. The fixed columns are used to fix the device. However, there are generally more fixed columns, which will increase the cost of the die-casting mold and the complexity of the process. When the housing 100 is formed by the deep drawing process, it is impossible to integrally form the fixed columns for fixing the device on the inner surface of the housing 100. It is necessary to weld the fixed columns on the inner surface of the housing 100. Generally, the fixed columns are first fixed to the inner surface of the housing 100 by welding or adhesive, and then the power conversion functional component 400 is fixed to the fixed columns to fix the power conversion functional component 40 in the housing 100. This method requires fixing the fixing columns one by one on the inner surface of the shell 100. Generally, the end face size of the fixing columns is small, and the fixation with the inner surface of the shell 100 is unstable. On the other hand, if the fixing columns are welded to the shell 100 one by one or bonded to the shell one by one by adhesive, the welding process takes a long time and is relatively complicated. On the other hand, when the material of the shell 100 formed by the deep drawing process or the die-casting process is aluminum, the stability of direct welding on the aluminum shell 100 is poor, the welding yield is low, and the stability of direct bonding on the aluminum shell 100 by adhesive is also poor.

[0103] In the present application, at least a portion of the surface of the fixing plate 200 facing the outer shell 100 is fixedly connected to at least a portion of the inner surface of the outer shell 100, and the fixed connection method includes welding or bonding with an adhesive. The fixed connection between the surface of the fixing plate 200 and the surface of the outer shell 100 can improve the stability of the connection. Compared with the connection method between the small-sized end face of the stud and the inner surface of the outer shell 100, the surface of the fixing plate 200 and the surface of the outer shell 100 are connected face to face, and the connection area is large and the connection stability is higher. The fixing plate 200 is then fixedly connected to the power conversion functional component 400 to fix the power conversion functional component 400 in the accommodating cavity 101 inside the outer shell 100. Compared with the method of forming a fixed column by a die-casting process, the process of using the fixing plate 200 is simpler and has a low process cost.

[0104] In one embodiment, the entire surface of the fixing plate 200 facing the housing 100 is fixedly connected to the inner surface of the housing 100 to improve the connection stability between the fixing plate 200 and the housing 100. In one embodiment, a partial surface of the fixing plate 200 facing the housing 100 can be fixedly connected to the inner surface of the housing 100.

[0105] See also Figure 4 and Figure 5b In a possible implementation, the fixing plate 200 is provided with fixing holes 210 (such as Figure 5b As shown), a fixing sub-component 220 is disposed in the fixing hole 210, and the fixing hole 210 cooperates with the fixing sub-component 220 to fix the power conversion functional component 400.

[0106] The size and quantity of the fixing hole 210 and the fixing sub-component 220 can be set according to the size and quantity of the functional components in the power conversion functional component 400, so that each component in the power conversion functional component 400 can be stably fixed in the housing 100. Figure 4 As shown, the fixing plate 200 has a plurality of fixing sub-components 220, wherein the fixing sub-components 220 can be studs or rivets, and the fixing sub-components 220 and the fixing holes 210 can be fixed by threaded connection or riveting. When the fixing method is threaded connection, the fixing sub-components 220 are studs, and the inner wall of the fixing hole 210 is provided with internal threads matching the studs. When the fixing method is riveting, the fixing sub-components 220 are rivets 221 (such as Figure 5b As shown in FIG. 1 , one end of the fixing hole 210 facing the housing 100 has a groove 211 sunken into the hole wall of the fixing hole 210, and the side of the rivet 221 close to the housing 100 has a convex portion 222 convexly arranged in the circumferential direction of the rivet 221, and the convex portion 222 is located in the groove 211 to fix the rivet 221 in the fixing hole 210. When there are multiple fixing sub-components 220, the height of each fixing sub-component 220 can be set as needed, and the height of some of the multiple fixing sub-components 220 can be set higher, such as Fig.10 The fixing sub-components 220 in the embodiment may be configured to have a lower height than the fixing sub-components. Fig.10 The fixing sub-component 230 in the embodiment of the present invention.

[0107] In one embodiment, the area of ​​the surface of the fixing plate 200 facing the housing 100 is greater than 1 / 4 times the area of ​​the inner surface of the housing 100 , so that the fixing plate 200 has enough area to install a sufficient number of fixing sub-components 220 .

[0108] See also Figure 1 and Figure 6In a possible implementation, the housing 100 includes a bottom plate 110 and a peripheral side plate 120 located on one side of the bottom plate 110 and surrounding the bottom plate 110. The bottom plate 110 and the peripheral side plate 120 are arranged to form a receiving cavity 101. The fixing plate 200 includes a first fixing sub-plate 260 (such as Figure 1 As shown in the figure, at least a portion of the surface of the first fixed sub-plate 260 facing the bottom plate 110 is fixedly connected to at least a portion of the inner surface of the bottom plate 110, and the area of ​​the surface of the first fixed sub-plate 260 facing the bottom plate 110 is greater than or equal to 0.5 times the area of ​​the surface of the bottom plate 110 facing the first fixed sub-plate 260, and is less than or equal to the area of ​​the surface of the bottom plate 110 facing the first fixed sub-plate 260.

[0109] In this embodiment, the side plate 120 is perpendicular to the bottom plate 110. When the housing 100 is formed by a deep drawing process, the side plate 120 can be arranged perpendicular to the bottom plate 110. In this embodiment, when the housing 100 is formed by a deep drawing process, the connection between the side plate 120 and the bottom plate 110 is a rounded corner 103 (such as Figure 4 In one embodiment, the side plate 120 deviates from the direction perpendicular to the bottom plate 110 by a certain angle. When the housing 100 is formed by a die-casting process, the side plate 120 has a draft angle so that the side plate 120 deviates from the direction perpendicular to the bottom plate 110 by a certain angle.

[0110] The area of ​​the first fixed sub-board 260 is set to be larger than half the area of ​​the bottom plate 110, which is conducive to fixing the power conversion functional component 400. Since the functional components of the power conversion functional component 400 are relatively numerous and scattered, including but not limited to the circuit board 410, the inductor, the transformer, etc., when these functional components are distributed on the left, right, front, back or middle of the receiving cavity 101, the area of ​​the first fixed sub-board 260 cannot be too small, and the area of ​​the surface of the first fixed sub-board 260 facing the bottom plate 110 is greater than or equal to 0.5 times the area of ​​the surface of the bottom plate 110 facing the first fixed sub-board 260, so that the first fixed sub-board 260 has enough area to install a sufficient number of fixed sub-components 220 for fixing each functional component in the power conversion functional component 400. Please refer to Figure 7 , Figure 71 is a schematic diagram of the structure of the bottom plate 110 and the power conversion functional component 400. In one embodiment, the area of ​​the surface of the first fixed sub-plate 260 facing the bottom plate 110 is equal to 0.8 times the area of ​​the surface of the bottom plate 110 facing the first fixed sub-plate 260. The power conversion functional component 400 includes two magnetic devices 420 and a circuit board 410. The two magnetic devices 420 are respectively recorded as 420a and 420b. The circuit board 410 is located between the two magnetic devices 420. Since the first fixed sub-plate 260 occupies most of the area of ​​the bottom plate 110, the two magnetic devices 420 and the circuit board 410 can be fixed to the fixed plate 200 through the fixed sub-plate 220. In some embodiments, when the area of ​​the first fixed sub-plate 260 is small, the first fixed sub-plate 260 can be patterned (such as Figure 8 As shown), the first fixed sub-board 260 can fix the functional components of the power conversion functional component 400 that are arranged toward the bottom plate 110. The specific pattern can be designed according to the setting position and quantity of each component in the power conversion functional component 400.

[0111] In some embodiments, see Fig. 9 , Fig. 9 It is a structural schematic diagram of the base plate 110 and the power conversion functional component 400. Two long strip support frames 201 are used to support and fix the power conversion functional device 400. The two support members 201 are distributed on both sides of the base plate 110. The support members 201 can only fix and support the magnetic devices 420a and 420b on both sides of the accommodating cavity 101, and cannot fix the circuit board 410 in the middle of the accommodating cavity 101. Only one side of the circuit board 410 and the magnetic device 420a can be fixed by welding or a fixing member 202, and the other side of the circuit board 410 and the magnetic device 420b can be fixed by welding or a fixing member 202. This will increase the cost, and the stability of the side fixation between the circuit board 410 and the magnetic device 420 is not as good as the stability of the bottom fixation between the circuit board 410 and the fixing plate 200. Therefore, for the power conversion functional component 400, its devices are relatively large and scattered. Using a larger area of ​​the fixing plate 200 for fixing and supporting can improve the stability of the fixed connection.

[0112] Please continue reading Figure 1In a possible implementation, the fixing plate 200 further includes a second fixing sub-plate 270, which is located on the inner side of the peripheral side plate 120 and intersects with the first fixing sub-plate 260, and at least a portion of the surface of the second fixing sub-plate 270 facing the peripheral side plate 120 is fixedly connected to at least a portion of the inner surface of the peripheral side plate 120. The second fixing sub-plate 270 can fix the power conversion functional component 400 from the side, for example, can fix the surface of the magnetic device 420 facing the peripheral side plate 120, thereby improving the stability of the fixed connection. The second fixed sub-plate 270 intersects with the first fixed sub-plate 260, including the second fixed sub-plate 270 intersecting with the first fixed sub-plate 260 at a vertical angle, or the second fixed sub-plate 270 deviates from a direction perpendicular to the first fixed sub-plate 260 at a certain angle. For example, in one embodiment, the angle between the second fixed sub-plate 270 and the first fixed sub-plate 260 is greater than or equal to 80° and less than 90°. The second fixed sub-plate 270 can be used to fix a portion of the power conversion functional component 400 that is at a certain distance from the peripheral side plate 120.

[0113] In one embodiment, the second fixed sub-plate 270 and the first fixed sub-plate 260 are an integrated structure. That is, the fixed plate 200 is an integrated structure. The material of the fixed plate 200 is aluminum. In one embodiment, the shape of the fixed plate 200 is adapted to the housing 100, and the fixed plate 200 is attached to the inner wall of the housing 100, wherein the fixed plate 200 can be formed by a deep drawing process, and the fixed plate 200 can also be formed by a bending process.

[0114] In one embodiment, the second fixed sub-plate 270 includes a first portion 271 and a second portion 272 (eg, Fig.10 The peripheral side plate 120 includes a first side plate 121 and a second side plate 122 (as shown in FIG. Figure 1 As shown), the first part 271 is located on the surface of the first side plate 121 facing the receiving cavity 101, and the second part 272 is located on the surface of the second side plate 122 facing the receiving cavity 101. The first part 271, the first fixed sub-plate 260 and the second part 272 are an integrated structure. In this embodiment, the second fixed sub-plate 270 is fixed to the peripheral side plate 120 by fixing the first part 271 and the second part 272 to the first side plate 121 and the second side plate 122 respectively. The second fixed sub-plate 270 only includes the first part 271 and the second part 272, which can save costs while ensuring the reliability of the connection. In some embodiments, the second fixed sub-plate 270 also includes a third part 273 (as shown in FIG. 2 ) disposed on one side of the first fixed sub-plate 260 along the second direction Y. Fig.10The third portion 273 is used to fix the surface of the power conversion functional component 400 along the second direction Y, wherein the second direction Y intersects with the first square X. In a specific embodiment, the first direction X is the width direction of the power housing 10, the second direction Y is the length direction of the power housing 10, and the second direction Y intersects with the first square X perpendicularly. In some embodiments, the first direction X is the length direction of the power housing 10, and the second direction Y is the width direction of the power housing 10.

[0115] exist Figure 1 In the illustrated embodiment, the fixing plate 200 is connected and fixed to both the bottom plate 110 and the peripheral side plate 120 of the housing 100 , thereby increasing the fixed connection area and improving the stability of the fixed connection.

[0116] Please continue reading Figure 1 In one embodiment, the second fixed sub-plate 270 has a fixed sheet 240 at one end away from the first fixed sub-plate 260, and the fixed sheet 240 extends from the second fixed sub-plate 270 to the middle of the receiving cavity 101. The fixed sheet 240 is used to fix the functional components of the power conversion functional component 400 that are arranged away from the bottom plate 110. In one embodiment, the power conversion functional component 400 includes two circuit boards 410 (such as Figure 2b As shown), the third direction Z intersects the first direction X and the second direction Y perpendicularly, the third direction Z is the height direction of the power supply housing 10, the two circuit boards are respectively denoted as 410a and 410b, the circuit board 410a is fixedly connected to the first fixed sub-plate 260, the circuit board 410b is located on the side of the fixing plate 240 away from the bottom plate 110 and is fixedly connected to the fixing plate 240. Specifically, a hole can be opened on the fixing plate 240, and the circuit board 410b can be fixed to the fixing plate 240 by studs or rivets.

[0117] Please continue reading Figure 4 In a possible implementation, the housing 100 except the first flow channel 300 is an integrated structure. The bottom plate 110 and the peripheral side plate 120 in the housing 100 of the integrated structure are continuous, and no welding parts or fixing parts are required, which can save costs, and the sealing performance of the first flow channel 300 is better. Fig.11In some embodiments, the channel 303 is formed by die casting, and then the sealing plate 304 is used to cover the channel 303 to form the flow channel. The sealing position 305 of the sealing plate 304 and the channel 303 needs to be welded by stir friction welding or bonded with adhesive, which makes the sealing of the flow channel poor, and after long-term use, the stability of welding or bonding with adhesive is poor; in addition, the cooling water is more sensitive to defects such as pores, shrinkage, cracks, etc. on the channel 303 formed by die casting, and the risk of water leakage is high. In this embodiment, the part of the housing 100 that constitutes the first flow channel 300 is an integrated structure, that is, the edge of the first flow channel 300 is integrated, the sealing is better, and the risk of water leakage is avoided.

[0118] Please continue reading Figure 4 In a possible implementation, the housing 100 includes a first sub-shell 140 and a second sub-shell 150, the first sub-shell 140 is nested in the second sub-shell 150, and the cavity of the first sub-shell 140 is a receiving cavity 101, the first sub-shell 140 is fixedly connected to the fixing plate 200, the first flow channel 300 is located between the first sub-shell 140 and the second sub-shell 150, and the first sub-shell 140 and the second sub-shell 150 are hot-rolled and fused into an integrated structure except for the first flow channel 300.

[0119] The first flow channel 300 may be formed by a blowing process. Specifically, a graphite rolling resistance agent (such as Fig.12 As shown): Print the graphite rolling resistance agent 306 at the position where the first flow channel 300 is to be formed between the first plate 301 and the second plate 302, and print it in the interlayer of the first plate 301 and the second plate 302 in different patterns according to the heat dissipation requirements; hot rolling (as shown Fig.13 As shown in FIG. 1 ): the portion without the printed graphite rolling resistance agent 306 will be fused together after hot rolling to form the shell prefabricated plate 105, and the portion of the first plate 301 and the second plate 302 with the graphite rolling resistance agent 306 will still be in a separated state after hot rolling; deep drawing (as shown in FIG. 1 ) Fig.14 As shown in FIG. 1 ): the shell prefabricated plate 105 after hot rolling is formed into the shell 100 by a deep drawing process, wherein the first plate 301 and the second plate 302 are respectively formed into the first subshell 140 and the second subshell 150 by a deep drawing process, and the first subshell 140 and the second subshell 150 are hot-rolled and fused into an integrated structure except for the first flow channel 300; inflation (as shown in FIG. 1 ); Fig.15 As shown): Through the inflation process, inflation will produce local deformation at the location where the graphite anti-rolling agent 306 is printed, and the second sub-shell 150 will bulge outward to form a second convex portion 153 bulging away from the first sub-shell 140, and the second convex portion 153 and the first sub-shell 140 together form a closed first flow channel 300.

[0120] Please continue reading Figure 4 and Figure 5aThe first sub-shell 140 includes a first bottom wall 141 and a first side wall 142 located at one side of the first bottom wall 141 and arranged around the first bottom wall 141. The second sub-shell 150 includes a second bottom wall 151 and a second side wall 152 located at one side of the second bottom wall 151 and arranged around the second bottom wall 151. The first bottom wall 141 and the second bottom wall 151 are stacked together to form the bottom plate 110. The first side wall 142 and the second side wall 152 are stacked together to form the peripheral side plate 120. Part of the first flow channel 300 is located between the first bottom wall 141 and the second bottom wall 151, and part of the first flow channel 300 is located between the first side wall 142 and the second side wall 152. In some embodiments, the first flow channel 300 may be located only between the first side wall 142 and the second side wall 152 (e.g., Fig.16 ), and is disposed around the entire first side wall 142. In some embodiments, the first flow channel 300 may be located only between the first bottom wall 141 and the second bottom wall 151 (as shown in FIG. Fig.17 As shown), the pattern of the first flow channel 300 can be set according to actual needs.

[0121] The first sub-shell 140 and the second sub-shell 150 are made of aluminum, which is cheap and has good thermal conductivity, while copper is expensive and stainless steel has poor thermal conductivity.

[0122] See also Fig.18 In a possible implementation, the first subshell 140 includes a first protrusion 143 that protrudes in a direction away from the second subshell 150, and the second subshell 150 and the first protrusion 143 constitute a first flow channel 300. In this embodiment, the thickness of the first protrusion 143 is less than the thickness of other parts of the second subshell 150, and the thickness refers to the dimension perpendicular to the first protrusion 143 or the second subshell 150. In one embodiment, the thickness of the second subshell 150 is 1.5 mm, and the thickness of the first protrusion 143 is 1 mm. In one embodiment, when the first protrusion 143 is formed by a deep drawing process, the connection between the first protrusion 143 and the part of the first subshell 140 other than the first protrusion 143 is a fillet 108 (such as Fig.18 shown).

[0123] Please refer again Fig.15 In a possible implementation, the second sub-shell 150 includes a second convex portion 153 protruding in a direction away from the first sub-shell 140, and the first sub-shell 140 and the second convex portion 153 constitute the first flow channel 300. In one embodiment, when the second convex portion 153 is formed by a deep drawing process, the connection between the second convex portion 153 and the portion of the second sub-shell 150 other than the second convex portion 153 is a rounded corner 104 (such as Fig.15 shown).

[0124] See also Fig.19In a possible implementation, the first sub-shell 140 includes a first protrusion 143 protruding in a direction away from the second sub-shell 150, and the second sub-shell 150 includes a second protrusion 153 protruding in a direction away from the first sub-shell 140. The first protrusion 143 and the second protrusion 153 are arranged opposite to each other and are connected to each other, and together constitute a first flow channel 300.

[0125] See also Fig. 20 In a possible implementation, the housing 100 includes a first sub-shell 140 and a second sub-shell 150, the first sub-shell 140 is nested in the second sub-shell 150, the cavity of the first sub-shell 140 is the receiving cavity 101, the first sub-shell 140 is fixedly connected to the fixing plate 200, the first flow channel 300 is located between the first sub-shell 140 and the second sub-shell 150, and the edge of the opening 144 of the first sub-shell 140 is sealed with the edge of the opening 154 of the second sub-shell 150. The first sub-shell 140 is a groove-shaped structure composed of a first bottom wall 141 and a first side wall 142, and the opening of the groove-shaped structure is the opening 144 of the first sub-shell 140. The second sub-shell is a groove-shaped structure composed of a second bottom wall 151 and a second side wall 152, and the opening of the groove-shaped structure is the opening 154 of the second sub-shell 150.

[0126] The first subshell 140 and the second subshell 150 are integrated structures formed by a deep drawing process, and the first flow channel 300 is formed by a deep drawing process. Specifically, the first plate 301 is formed into the first subshell 140 by a deep drawing process, and the second plate 302 is formed into the second subshell 150 by a deep drawing process, and the second convex portion 153 is formed by a deep drawing process, wherein the size and shape of the first subshell 140 and the second subshell 150 match, and then the first subshell 140 is nested in the second subshell 150, and the second convex portion 153 and the first subshell 140 constitute the first flow channel 300, and finally the opening edge 144 of the first subshell 140 and the opening edge 144 of the second subshell 150 are welded by a welding flange or sealed with a sealant, wherein the opening edge 144 of the first subshell 140 is the edge of the first side wall 142 away from the first bottom wall 141, and the opening edge 154 of the second subshell 150 is the edge of the second side wall 152 away from the second bottom wall 151. In this embodiment, only the edges of the first sub-shell 140 and the second sub-shell 150 need to be sealed and connected, and other parts can be locally welded for structural reinforcement. The local welding position can not destroy the integrated structure of the first sub-shell 140 and the second sub-shell 150, the sealing is good, and the deep drawing production efficiency is high.

[0127] It should be noted that the first flow channel 300 formed by the drawing process may be composed of the second sub-shell 150 and the first convex portion 143 , the first sub-shell 140 and the second convex portion 153 , or the first convex portion 143 and the second convex portion 153 .

[0128] Please continue reading Fig.10 In a possible implementation, the fixing plate 200 is provided with a avoidance hole 250 penetrating two opposite surfaces thereof, and the projection of the avoidance hole 250 on the first sub-shell 140 along the thickness direction of the first sub-shell 140 at least partially overlaps with the projection of the first flow channel 300 on the first sub-shell 140 along the thickness direction of the first sub-shell 140, and the avoidance hole 250 is used to accommodate at least part of the heating device 401. The thickness direction of the first sub-shell 140 refers to a direction perpendicular to the part of the first sub-shell 140 where the first flow channel 300 is located. When the avoidance hole 250 is located on the first fixing sub-plate 260, the thickness direction of the first sub-shell 140 is a direction perpendicular to the first bottom wall 141 (such as Fig. 20 ), which is Fig. 20 When the avoidance hole 250 is located on the second fixed sub-plate 270 , the thickness direction of the first sub-shell 140 is perpendicular to the first side wall 142 .

[0129] Among them, the heating device 401 on the circuit board 410, such as the insulated gate bipolar transistor 411, the triode 412, and the MOS tube, is protruding from the surface of the circuit board 410. When the circuit board 410 is placed on the fixing plate 200, the heating device 401 will make the surface of the circuit board 410 and the surface of the fixing plate 200 not fit tightly. Fig.21 As shown), on the one hand, the surface of the circuit board 410 can be closely attached to the surface of the fixing plate 200, and on the other hand, the first flow channel 300 below the avoidance hole 250 can directly cool the heating device 401 located in the avoidance hole 250, thereby improving the cooling effect. In some embodiments, the heating device 401 can also be an inductor or a transformer in the magnetic device 420, and the magnetic device 420 can also be placed in the avoidance hole 250. The circuit board 410 is fixedly connected face to face with the fixing plate 200, and at least one of an insulated gate bipolar transistor, a triode, and a MOS tube can be arranged in the avoidance hole 250, wherein the number and size of the avoidance holes 250 can be set according to the number and size of the heating device 401.

[0130] See also Fig. 22In a possible implementation, the first flow channel 300 includes a first sub-channel 310 located inside the bottom plate 110, the fixed plate 200 includes a first fixed sub-plate 260 arranged opposite to the bottom plate 110 along the third direction Z, at least part of the avoidance holes 250 are located in the first fixed sub-plate 260, and at least part of the first sub-channel 310 is arranged opposite to the avoidance holes 250 located in the first fixed sub-plate 260 along the third direction Z. In this embodiment, the third direction Z is the height direction of the power supply housing 10, and the first sub-channel 310 is used to cool the heating device 401 above the bottom plate 110. In the power conversion device 20, the circuit board 410 is generally arranged above the bottom plate 110 of the housing 100, and the circuit board 410 is fixed to the fixed plate 200 face to face, and the first sub-channel 310 cools the heating devices 401 such as the insulated gate bipolar transistor 411, the triode 412, and the MOS tube on the circuit board 410 through the avoidance holes 250.

[0131] Please continue reading Fig. 22 In a possible implementation, the first flow channel 300 further includes a second sub-channel 320 located inside the peripheral side plate 120, the first sub-channel 310 and the second sub-channel 320 are interconnected, the fixed plate 200 includes a second fixed sub-plate 270, the second fixed sub-plate 270 is fixedly connected to the surface of the peripheral side plate 120, and is connected to the first fixed sub-plate 260, part of the avoidance holes 250 is located in the second fixed sub-plate 270, at least part of the second sub-channel 250 and the avoidance holes 250 located in the second fixed sub-plate 270 are arranged opposite to each other along the third direction Z. In this embodiment, the second sub-channel 320 is used to cool the heat generating device 401 on the side of the peripheral side plate 120, such as an inductor, a capacitor, etc. in the magnetic device 420, and the magnetic device 420 can be arranged adjacent to the peripheral side plate 120, so that the second sub-channel 320 in the peripheral side plate 120 can cool and dissipate the heat of the magnetic device 420.

[0132] The fixed plate 200 may be provided with a plurality of avoidance holes 250, a portion of the avoidance holes 250 of the plurality of avoidance holes 250 are located in the first fixed sub-plate 260, and the remaining portion of the avoidance holes 250 are located in the second fixed sub-plate 270. For example, the fixed plate 200 has 10 avoidance holes 250, 6 avoidance holes 250 are located in the first fixed sub-plate 260, and 4 avoidance holes 250 are located in the second fixed sub-plate 270.

[0133] See also Fig.23In a possible implementation, the first sub-shell 140 includes a first protrusion 143 protruding in a direction away from the second sub-shell 150, the second sub-shell 150 and the first protrusion 143 form a first flow channel 300, the first protrusion 143 is located in the avoidance hole 250, and the first protrusion 143 abuts against at least part of the inner surface of the power conversion functional component 400 facing the first sub-shell 140. Among them, the first protrusion 143 is arranged in the avoidance hole 250, and the avoidance hole 250 is filled, so that the power conversion functional component 400 can be placed flatly on the fixing plate 200, improve the flatness, and avoid the part of the circuit board 410 located at the avoidance hole 250 from being crushed when impacted.

[0134] For example, when the power conversion functional component 400 is a circuit board 410, when the circuit board 410 is placed on the first fixed sub-board 260, the circuit board 410 includes a partial circuit board 410a without an insulated gate bipolar transistor 411, a triode 412, a MOS tube, etc. and a partial circuit board 410b with a heating device 401, and the first fixed sub-board 260 includes an avoidance hole 250a and an avoidance hole 250b, wherein a portion of the first flow channel 300 protrudes into the avoidance hole 250a, and a portion of the first flow channel 300 at the avoidance hole 250b is located below the first fixed sub-board 260, and the portion 410b with the heating device 401 is placed on the first fixed sub-board 260. Located above the avoidance hole 250b, the heating device 401 is located in the avoidance hole 250b, and a portion of the circuit board 410a without heating devices 401 such as the insulated gate bipolar transistor 411, the triode 412, and the MOS tube is located above the avoidance hole 250a. Although the portion of the circuit board 410a is not directly provided with the heating device 401, the heat generated by the heating of the portion of the circuit board 410b will be transferred to the portion of the circuit board 410a, and the portion of the first flow channel 300 protruding from the avoidance hole 250a can cool the portion of the circuit board 410a, and the portion of the first flow channel 300 can also provide support for the portion of the circuit board 410a.

[0135] Please continue reading Figure 6 In a possible implementation, the power supply housing 10 further includes a liquid inlet nozzle 700 and a liquid outlet nozzle 800, which are located on both sides of the housing 100 and communicate with the first flow channel 300. A hole may be opened on the outer wall of the housing 100, and the liquid inlet nozzle 700 and the liquid outlet nozzle 800 are welded to the opening portion by a brazing process for communicating with the first flow channel 300. In this embodiment, part of the first flow channel 300 is located in the bottom plate 110, and part of the first flow channel 300 is located in the surrounding side plate 120. The liquid inlet nozzle 700 and the liquid outlet nozzle 800 are located on the outside of the surrounding side plate 120 and communicate with the first flow channel 300 in the surrounding side plate 120. In some embodiments, the liquid inlet nozzle 700 and the liquid outlet nozzle 800 are located on the same side of the surrounding side plate 120.

[0136] See also Fig.24 In a possible implementation, the power supply housing 10 further includes a third sub-shell 160, the first sub-shell 140 and the second sub-shell 150 are nested in the third sub-shell 160, and a second flow channel 500 is provided between the third sub-shell 160 and the second sub-shell 150. In this embodiment, the first sub-shell 140 is nested in the second sub-shell 150, and the second sub-shell 150 is nested in the third sub-shell 160. The first flow channel 300 and the second flow channel 500 are provided to achieve a better heat dissipation effect. The first flow channel 300 is provided closer to the heating device 401 in the power conversion functional component 400 than the second flow channel 500. The first flow channel 300 cools the heating device 401 and absorbs heat. After absorbing heat, the first flow channel 300 is absorbed by the second flow channel 500 to transfer the heat out. In some embodiments, the temperatures of the cooling liquid in the first flow channel 300 and the second flow channel 500 can be set differently. For example, the temperature of the cooling liquid in the first flow channel 300 is between 10°C and 15°C, and the temperature of the cooling liquid in the second flow channel 500 is between 5°C and 10°C. The cooling liquid with a temperature difference can improve the heat exchange efficiency between the first flow channel 300 and the second flow channel 500, thereby improving the heat dissipation efficiency of the heating device 401.

[0137] Please continue reading Fig.24 In a possible implementation, the second sub-shell 150 includes a third protrusion 154 protruding in a direction away from the third sub-shell 160, and the third sub-shell 160 and the third protrusion 154 constitute a second flow channel 500. In this embodiment, the thickness of the third protrusion 154 is less than the thickness of the third sub-shell 160, and the thickness refers to the dimension perpendicular to the third protrusion 154 or the third sub-shell 160. In one embodiment, the thickness of the third sub-shell 160 is 1.5 mm, and the thickness of the third protrusion 154 is 1 mm.

[0138] See also Fig.25 In a possible implementation, the third sub-shell 160 includes a fourth protrusion 163 protruding in a direction away from the second sub-shell 150 , and the second sub-shell 150 and the fourth protrusion 163 constitute the second flow channel 500 .

[0139] See also Fig.26 In a possible implementation, the second sub-shell 150 includes a third protrusion 154 protruding in a direction away from the third sub-shell 160, and the third sub-shell 160 includes a fourth protrusion 163 protruding in a direction away from the second sub-shell 150. The third protrusion 154 and the fourth protrusion 163 are arranged opposite to each other and are connected to each other, and together constitute the second flow channel 500.

[0140] Please continue reading Fig.26In one embodiment, the area size of the inner surface of the third sub-shell 160 is equivalent to the area size of the outer surface of the second sub-shell 150. The third sub-shell 160 is an integrated structure formed by a deep drawing process. The third sub-shell 160 includes a third bottom wall 161 and a third side wall 162. The third bottom wall 161 is located on the side of the second bottom wall 151 away from the first bottom wall 141. The third side wall 162 is located on the side of the second side wall 152 away from the first side wall 142. The second flow channel 500 is located between the third bottom wall 161 and the second bottom wall 151. In this embodiment, the third bottom wall 161, the second bottom wall 151 and the first bottom wall 141 are stacked along the third direction Z to form the bottom plate 110 together. The second flow channel 500 is located in the bottom plate 110.

[0141] In one embodiment, the second flow channel 500 is located between the third side wall 162 and the second side wall 152. The third side wall 162, the second side wall 152 and the first side wall 142 together constitute the peripheral side plate 120, and the second flow channel 500 is located in the peripheral side plate 120.

[0142] In one embodiment, part of the second flow channel 500 is located between the third bottom wall 161 and the second bottom wall 151 , and part of the second flow channel 500 may be located between the third side wall 162 and the second side wall 152 . The second flow channel 500 is distributed in the bottom plate 110 and the peripheral side plate 120 .

[0143] Please continue reading Fig.25 In a possible implementation, the projection of the second flow channel 500 on the second sub-shell 150 along the thickness direction of the second sub-shell 150 at least partially overlaps with the projection of the first flow channel 300 on the second sub-shell 150 along the thickness direction of the second sub-shell 150. The thickness direction of the second sub-shell 150 refers to a direction perpendicular to the portion of the second sub-shell 150 where the second flow channel 500 or the first flow channel 300 is located. For example, when the second flow channel 500 and the first flow channel 300 are located in the bottom plate 110 of the housing 100, the thickness direction is the direction perpendicular to the bottom plate 110, that is, Fig.25 When the second flow channel 500 and the first flow channel 300 are located in the second side plate 122 of the peripheral side plate 120 (such as Figure 1 As shown), the thickness direction is the direction perpendicular to the second side plate 122.

[0144] Through the above design, the heat transfer between the second flow channel 500 and the first flow channel 300 is continuous. The first flow channel 300 can extend to the position of the heat generating device 401 that needs to dissipate heat, making the design of the second flow channel 500 and the first flow channel 300 more flexible to adapt to a variety of power conversion functional components 400 with different structural settings. Fig. 27As shown, the power conversion functional component 400 includes a heating device 401a with a large heat generation. The first end 307 of the first channel 300 and the heating device 401a can be stacked, and the other end 308 of the first channel 300 and the second channel 500 can be stacked. A cooling medium with a lower temperature or a phase change medium with a larger heat absorption rate can be set in the first channel 300. The first end 307 of the first channel 300 absorbs the heat of the heating device 401a, and the heat is transferred to the second channel 500 through the other end 308 of the first channel 300 for heat dissipation. The pattern shape of the first channel 300 can be designed according to the position of the heating device 401.

[0145] Please continue reading Fig.25 In a possible implementation, the second flow channel 500 is not connected to the first flow channel 300, the first flow channel 300 is provided with a first medium 301, the second flow channel 500 is provided with a second medium 501, and the thermal conductivity of the second medium 501 is greater than the thermal conductivity of the first medium 301. The thermal conductivity of the second medium 501 is greater than the thermal conductivity of the first medium 301, which means that the heat dissipation efficiency of the second medium 501 is better and the heat of the heating device 401 can be quickly absorbed. In one embodiment, the second medium 501 is a phase change material, and the first medium 301 is water.

[0146] In some embodiments, the second flow channel 500 is connected to the first flow channel 300, and the two layers of flow channels can increase the flow path of the coolant in the housing 100 and improve the heat dissipation effect.

[0147] In some embodiments, the housing 100 may further include more sub-shells stacked to form a plurality of flow channels, which may be specifically arranged according to needs to improve the heat dissipation effect.

[0148] It should be noted that the housing 100 of the present application is an integrated housing 100 formed by a deep drawing process. Fig.28 The method of fixing the housing 100a of the integrated structure formed by the die-casting process and the power conversion functional component 400 is to form a fixing column 102 by integrated die-casting in the housing 100a, and then fix the power conversion functional component 400 by the fixing column 102. The housing 100 of the integrated structure formed by the drawing process cannot form the fixing column 102 inside the housing 100 by the drawing process, and the process of welding the fixing columns 102 to the housing 100 one by one is complicated and the welding yield is low. The present application realizes the fixed connection between the housing 100 and the power conversion functional component 400 through the fixing plate 200, as described above.

[0149] The housing 100 of the integrated structure formed by the deep drawing process in the present application is different from the housing 100a of the integrated structure formed by the die casting process in at least one of the following aspects:

[0150] (1) The shell 100 formed by the deep drawing process has a uniform thickness, a uniform color and gloss on the surface of the material, and no pores inside the shell 100 material, while the shell 10a formed by the die casting process may have an uneven wall thickness, uneven surface color and gloss, flow marks, and defects such as pores and shrinkage inside the shell 100a material;

[0151] (2) The wall thickness of the inner layer (first subshell 140) of the housing 100 formed by the deep drawing process is generally 1.5 mm, and the wall thickness of the outer layer (second subshell 150) is generally 1.0 mm, while the wall thickness of the housing 100a formed by the die casting process may be uneven. Due to the limitation of the die casting process, the wall thickness of a single layer is greater than 2 mm, and as the size increases, the wall thickness also needs to be thickened;

[0152] (3) The portion where the side wall (the peripheral side plate 120) and the bottom wall (the bottom plate 110) of the housing 100 formed by the deep drawing process are connected is a rounded corner 103 (such as Figure 4 As shown), the outer fillet radius is greater than 5 mm, and the portion where the side wall 120a of the housing 100a formed by the die-casting process connects to the bottom wall 110a has no fillet (as shown Fig.28 shown);

[0153] (4) The side wall (the peripheral side plate 120) of the housing 100 formed by the deep drawing process is perpendicular to the bottom wall (the bottom plate 110), while the housing 100a formed by the die casting process is usually provided with a draft angle on the side wall 120a in order to facilitate demolding, that is, the side wall 120a is arranged to deviate from the direction perpendicular to the bottom wall 110a, and the draft angle θ is at least 1°;

[0154] (5) The outer shell 100 formed by the deep drawing process has convex features on the outside and concave features on the inside, such as Fig.15 The second protrusion 153 in the second sub-shell 150, the protrusion outside the second sub-shell 150 and the depression inside the second sub-shell 150 appear simultaneously, and the protrusion feature 153a (such as the protrusion 153a on the outside of the housing 100a formed by the die-casting process Fig.28 As shown) can exist alone, and there may be no depression inside the housing 100a;

[0155] (6) The raised features (e.g., the first flow channel 300) in the housing 100 formed by the deep drawing process all have rounded corners, such as Fig.15 There is a rounded corner 104 between the second protrusion 153 and the other parts of the second sub-shell 150, and the rounded corner 104 is greater than or equal to 1 times the thickness of the second sub-shell 150, while the protruding feature 153a of the housing 100a formed by the die-casting process has no rounded corner restriction (such as Fig.28 shown), but with draft angle;

[0156] (7) The outer wall of the shell 100a formed by the die-casting process must have the mold parting line, slag bag mouth, and feed port of the die, and these parts must have grinding marks, while the shell 100 formed by the deep drawing process does not have them.

[0157] Please continue reading Figure 2a and Figure 2b , one embodiment of the present application also provides a power conversion device 20, the power conversion device 20 includes a power conversion functional component 400 and a power housing 10 as described in any of the above items, the power conversion functional component 400 is located in the receiving cavity 101 in the housing 100, and is fixedly connected to the fixing plate 200. The power conversion device 20 realizes the power conversion function through the power conversion functional component 400, wherein the power conversion includes AC conversion to high-voltage DC, for example, converting 220V civil AC or 380V industrial AC into high-voltage DC for charging the target device, when the target device is a car, the high-voltage DC can be 450V; the target device can also be other devices that need power supply; the power conversion also includes high-voltage DC conversion to low-voltage DC, for example, the high-voltage DC in the car is converted into low-voltage DC for powering low-voltage devices such as car lights, audio, and radio.

[0158] The power conversion functional component 400 includes a circuit board 410, a magnetic device 420, etc., wherein the heating device 401 of the power conversion functional component 400 includes an insulated gate bipolar transistor, a triode, a MOS tube, etc. located on the circuit board 410, and the heating device 401 also includes an inductor device or a transformer, etc. in the magnetic device 420. One of the functions of the circuit board 410 is to connect the insulated gate bipolar transistor, the triode, the MOS tube and the magnetic device 420, etc.

[0159] In a possible implementation, the power supply housing 10 further includes a cover plate 600 . One side of the housing 100 has an opening 106 . The cover plate 600 covers the opening 106 of the housing 100 .

[0160] See also Fig.29 In one embodiment of the present application, an electronic device 30 is provided. The electronic device 30 includes a load 31 and the power conversion device 20 as described above. The power conversion device 20 is electrically connected to the load 31 and is used to supply power to the load 31. The power conversion device 20 provides the converted electricity to the load 31 to supply power to the load 31.

[0161] In a possible implementation, the electronic device 30 is a vehicle, a charging pile, a charging power station, a communication device or a data center. The data center includes a cabinet or a data room. The electronic device 30 may also be other devices that require power conversion.

[0162] When the electronic device 30 is a vehicle, the power conversion device 20 is a vehicle charger, and the power conversion device 20 is fixed inside the vehicle 30 by a fixing bracket 26 (such as Figure 2a The outer side of the housing 100 is also provided with a first connection port 21, a second connection port 22 and a third connection port 23, and the housing 100 is provided with three connection holes 107, 107a, 107b (as shown in FIG. Figure 3 As shown in the figure, the first connection port 21, the second connection port 22 and the third connection port 23 pass through the connection holes 107, 107a, 107b respectively and are electrically connected to the power conversion functional component 400, wherein the first connection port 21, the second connection port 22 and the third connection port 23 can be fixed to the outside of the housing 100 by screwing or riveting. The first connection port 21 is used to connect an external power source 32, for example, a 220V civil AC voltage, the second connection port 22 is used to connect an external controller 34, the controller 34 is used to control the operation of the power conversion device 20, and the third connection port 23 is used to connect a load 31. In a vehicle, the third connection port 23 is used to connect a battery pack 33, which is a lithium-ion battery pack for powering the vehicle. When the vehicle needs to be charged, the first connection port 21 is connected to an external power source, and the 220V civil AC voltage is converted into a 450V high-voltage DC through the power conversion device 20, and the battery pack 33 is charged through the third connection port 23, so as to realize the power conversion from AC to high-voltage DC.

[0163] A fourth connection port 24 is also provided on the outside of the housing 100. The fourth connection port 24 is used to connect to low-voltage devices 35 in the vehicle. The low-voltage devices 35 include car lights, audio, radios, etc. When the low-voltage devices 35 in the vehicle need to be powered, the battery pack 33 is the power supply device. The high-voltage direct current of the battery pack 33 is input to the power conversion device 20 through the third connection port 23. The power conversion device 20 converts the 450V high-voltage direct current into a 12V low-voltage direct current, and charges the low-voltage devices through the fourth connection port 24, thereby realizing the power conversion from high-voltage direct current to low-voltage direct current.

[0164] In this embodiment, the electronic device 30 further includes an external cooling circulation system 36, which is connected to the liquid inlet nozzle 700 and the liquid outlet nozzle 800 in the power supply housing 10. The cooling fluid after absorbing heat in the first flow channel 300 in the housing 100 flows back from the liquid outlet nozzle 800 to the external cooling circulation system 36, and is cooled by the external cooling circulation system 36. The cooled cooling fluid is then input from the liquid inlet nozzle 700 to the first flow channel 300 to cool the power conversion functional component 400. The external cooling circulation system 36 is not limited to Fig.29 The structure shown can also be other structures.

[0165] In some embodiments, when the electronic device 30 is a data center, the load 31 is a server in the data center, and the power conversion device 20 converts 380V industrial electricity into direct current for powering the server. The voltage after the power conversion device 20 converts can be set according to the load 31.

[0166] The power supply housing, power conversion device and electronic device provided in the embodiments of the present application are introduced in detail. Specific examples are used in this article to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific embodiments and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A vehicle charger, characterized in that: The vehicle charger comprises a cover plate, a bottom plate, a peripheral side plate and a first fixed sub-plate, wherein: The bottom plate and the side plates are arranged to form a receiving cavity, one side of the receiving cavity has an opening, the cover plate covers the opening of the receiving cavity, the receiving cavity is used to accommodate the power conversion functional component of the vehicle charger and the first fixed sub-plate, the bottom plate is provided with the first sub-channel inside, the side plates are provided with a liquid inlet and a liquid outlet, the first sub-channel is connected with the liquid inlet and the liquid outlet, and the first sub-channel is used to cool the power conversion functional component; The first fixed sub-board is stacked with the base plate, the first fixed sub-board is fixedly connected to the base plate, the power conversion functional component includes a circuit board, the circuit board is stacked with the first fixed base plate, the first fixed sub-board has a plurality of fixed sub-components, at least one of the fixed sub-components is used to fix the circuit board.

2. The vehicle charger according to claim 1, characterized in that: At least a portion of the surface of the first fixed sub-plate facing the bottom plate is fixedly connected to at least a portion of the inner surface of the bottom plate.

3. The vehicle charger according to claim 1 or 2, characterized in that: An area of ​​a surface of the first fixed sub-plate facing the bottom plate is greater than or equal to 0.5 times an area of ​​a surface of the bottom plate facing the first fixed sub-plate, and less than or equal to an area of ​​a surface of the bottom plate facing the first fixed sub-plate.

4. The vehicle charger according to claim 3, characterized in that: The first fixed sub-plate is provided with a fixing hole, the fixing sub-component is arranged in the fixing hole, and the fixing hole cooperates with the fixing sub-component to fix the power conversion functional component.

5. The vehicle charger according to claim 3 or 4, characterized in that: The height of some of the plurality of fixing sub-components is greater than the height of another part of the plurality of fixing sub-components.

6. The vehicle charger according to claim 4, characterized in that: The on-board charger further includes a second fixed sub-board, the second fixed sub-board is used to fix part of the power conversion functional component, the second fixed sub-board is located on the inner side of the peripheral side plate, and the plane where the second fixed sub-board is located intersects with the plane where the first fixed sub-board is located; The peripheral side plates are perpendicular to the bottom plate.

7. The vehicle charger according to claim 6, characterized in that: The on-board charger further includes another circuit board, which is fixedly connected to the second fixed sub-board and stacked with the one circuit board.

8. The vehicle charger according to claim 6 or 7, characterized in that: The second fixed sub-plate includes a first portion and a second portion, the first portion and the second portion are arranged opposite to each other along the length direction of the power supply housing, and the first portion and / or the second portion are used to fix at least one circuit board.

9. The vehicle charger according to claim 5, characterized in that: The first fixed sub-board is provided with a patterned design, the patterned design has at least one recessed portion, the thickness of the at least one recessed portion is less than the thickness of an area of ​​the first fixed sub-board without the patterned design, and the at least one recessed portion is used to fix a functional device in the power conversion functional component that is arranged toward the base plate on the first fixed sub-board.

10. The vehicle charger according to claim 9, characterized in that: The first fixed sub-plate is provided with a position avoiding hole, and at least a part of the power conversion functional component is arranged in the position avoiding hole.

11. The vehicle charger according to claim 10, characterized in that: The opening area of ​​the avoidance hole is larger than the opening area of ​​the fixing hole.

12. The vehicle charger according to claim 10 or 11, characterized in that: At least a portion of the first sub-channel is arranged opposite to the avoidance hole in the first fixed sub-plate along the thickness direction of the bottom plate.

13. The vehicle charger according to claim 10 or 11, characterized in that: The power conversion functional component includes at least one magnetic device, the circuit board is located on one side of the at least one magnetic device, and the at least one magnetic device is fixed on the first fixed sub-board through the fixing sub-component.

14. A vehicle, characterized in that: The vehicle comprises a battery pack and an on-board charger as described in any one of claims 1 to 13, wherein the on-board charger is electrically connected to the battery pack and is used to charge the battery pack.

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