Supporting lead structure, thermoelectric separation LED module and manufacturing method

Abstract

The invention provides a supporting lead structure of a thermoelectric separation LED module, the thermoelectric separation LED module comprises an LED device and a PCB (printed circuit board) which are transversely separated and arranged, and the supporting lead structure comprises a groove and a supporting body used for supporting and connecting the LED device and a lead of the PCB; the groove is formed between the LED device and the PCB; the supporting body comprises a first supporting body and a second supporting body, the first supporting body is arranged in the groove, and the second supporting body is arranged on the first supporting body. The invention further provides a thermoelectric separation LED module and a manufacturing method thereof. Through the structure and the method, the lead protection of the thermoelectric separation LED module can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of thermoelectric power light-emitting module structures, and in particular to a supporting lead structure, a thermoelectric separation LED module and a manufacturing method thereof. Background Art

[0002] The existing thermoelectric separation LED module has leads that are obviously suspended in the air due to module separation, which makes it susceptible to lead collapse. There are currently two mainstream solutions: one is to apply glue after wire welding to form a protective colloid that covers the wires; the other is to set up a shielding structure above the leads for protection. Although the glue-applying and coating solution can completely wrap the leads to form protection, the gravity of the colloid itself will cause the leads to be crushed due to the additional risk of collapse during the glue-applying process or after the colloid is cured and coated; compared with the above solutions, the solution of setting up a shielding structure will not directly apply stress to the leads themselves, but this solution can only perform the manufacturing process of the shielding structure after wire welding, which has the risk of damage to the lead structure and the protection effect is average. Therefore, there is currently a lack of simple and effective protection solutions for the protection of the leads. Summary of the invention

[0003] In order to solve the problems existing in the prior art, the present invention aims to provide a support lead structure to effectively protect the lead;

[0004] The second object of the present invention is to provide a thermally and electrically separated LED module;

[0005] The third object of the present invention is to provide a method for manufacturing a thermally and electrically separated LED module.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A support lead structure of a thermoelectric separation LED module, the thermoelectric separation LED module comprising an LED device and a PCB board that are laterally separated and arranged, the support lead structure comprising a groove and a support body for supporting leads connecting the LED device and the PCB board; the groove is formed between the LED device and the PCB board; the support body comprises a first support body and a second support body, the first support body is arranged in the groove, and the second support body is arranged on the first support body.

[0008] Preferably, the depth of the groove is 2 mm, and / or the width of the groove is 0.7 mm, and / or the height of the second support body is 0.2-0.5 mm.

[0009] Preferably, the length of the groove is 1-1.5 times the length of the bottom side of the LED device.

[0010] Preferably, the support body is made of insulating material.

[0011] A thermoelectric separation LED module comprises a heat sink, a boss, an LED device, a PCB board, a lead and a support lead structure; the boss is arranged on the surface of the heat sink, the LED device is arranged on the boss, the PCB board and the LED device are arranged on the upper surface of the heat sink, and the support lead structure is arranged between the PCB board and the LED device; an anti-diffusion structure is arranged on the heat sink, and the anti-diffusion structure is located at the two side corners of the LED device; the lead connects the PCB board and the LED device, and there is a certain distance between the lead arc top of the lead and the support body.

[0012] Preferably, the boss thickness is 0.8 mm.

[0013] Preferably, the solder balls at both ends of the lead are respectively connected to the reserved solder pads of the PCB board and the LED device.

[0014] Preferably, the lead arc top is 0.8 mm away from the second support body.

[0015] A method for manufacturing a thermoelectric separation LED module comprises the following steps:

[0016] S1. Arrange a boss on the heat sink, and arrange an LED device on the boss; connect and arrange a PCB board on the heat sink; and form the groove between the LED device and the PCB board;

[0017] S2, filling the groove with insulating material and extending the groove upward to an additional height after filling the groove to a depth to form a support body; the insulating material is evenly filled in the groove;

[0018] S3, respectively setting anti-diffusion structures at the corners of both sides of the LED device;

[0019] S4. Connecting two ends of the lead wire to the reserved pads of the PCB board and the LED device respectively, and the support body is located below the lead wire.

[0020] Preferably, the groove is made by chemical treatment or mechanical processing; and / or the anti-diffusion structure is formed integrally on the surface of the heat sink; and / or the support body is prepared by dispensing or molding.

[0021] The beneficial effects of the present invention are:

[0022] The present invention reduces the risk of line collapse by arranging a support structure under the module lead. There is an insulating support colloid under the lead to provide stress support for the lead when it is pressed by external force, reducing the risk of electrical circuit breakage. The pre-glue dispensing process avoids the additional risk of line collapse introduced by glue dispensing after wire welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0024] Figure 1 This is a schematic diagram of the structure of the thermoelectric separation LED module of the present invention;

[0025] Figure 2 The top view of the structure of the thermoelectric separation LED module of the present invention is shown in FIG.

[0026] Among them: 1-heat sink; 2-boss; 3-LED device; 4-anti-diffusion structure; 5-lead; 6-support body 7-PCB board. DETAILED DESCRIPTION

[0027] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention are further described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1 As shown, the present invention discloses a support lead structure suitable for a thermoelectric separation LED module. First, the thermoelectric separation LED module includes LED devices and a PCB board that are laterally separated and arranged.

[0029] The support lead structure includes a groove and a support body for supporting the lead connecting the LED device and the PCB board. The groove is formed between the LED device and the PCB board; the support body includes a first support body and a second support body, the first support body is arranged in the groove, the second support body is arranged on the first support body, and the second support body is not located in the groove. Wherein, the support body is an insulating material, specifically a high reflectivity thermosetting material. As an embodiment, the first support body and the second support body of the support body can be integrally formed; as an embodiment, the formation method of the support body is the support body formation method in a method for manufacturing a thermoelectric separation LED module described below; as an embodiment, the first support body and the second support body of the support body are an inseparable whole. The length of the groove is 1-1.5 times the length of the bottom side of the LED device, and the specific length depends on the size of the LED device substrate selected. Because the center of the bottom of the support body is in the same line with the midpoint of the bottom of the LED, the total length of 1-1.5 times can make the support body sufficiently stable to maintain the shape after forming. Wherein, the direction of the length of the groove refers to the direction of arrangement of non-LED devices and PCB boards, specifically perpendicular to the direction of arrangement of LED devices and PCB boards. After filling the groove depth, the support body still extends upwards to an additional height, and the additional height is in the range of 0.2-0.5 mm, wherein the support body part in the groove is the first support body, and the additional raised support body part is the second support body.

[0030] As an embodiment, the depth of the groove is 2 mm, the width of the groove is about 0.7 mm, and the height of the second support body is 0.2-0.5 mm.

[0031] A thermoelectric separation LED module described in the present invention comprises a heat sink, a boss, an LED device, a PCB board, leads and the supporting lead structure described in the present invention.

[0032] A boss is arranged on the surface of the heat sink, and the LED device is arranged on the boss. The LED device is directly arranged on the heat sink; the PCB board and the LED device are arranged on the upper surface of the heat sink. The support lead structure is arranged between the PCB board and the LED device, and specifically, the groove is arranged between the PCB board and the LED device. An anti-diffusion structure is arranged on the heat sink, and the anti-diffusion structure is located at the two side corners of the LED device. There is a certain distance between the lead arc top of the lead wire used to connect the LED device and the PCB board and the support body.

[0033] The thickness of the boss is about 0.8mm. The boss thickness is set to 0.8mm in order to reduce the height difference between the LED pad and the PCB pad surface, facilitate the wire welding process and the stability of the wire arc shape; a groove with a total depth of about 2mm is formed with the gap between the boss and the boundary of the PCB board. The depth is calculated based on the pad surface as the reference plane, and the width of the groove is about 0.7mm. This setting allows the colloid forming the support body to be evenly diffused and filled in the groove while ensuring sufficient support for the wider colloid on the upper layer, wherein the colloid is a high reflectivity thermosetting material.

[0034] The solder balls at both ends of the lead are respectively connected to the reserved pads on the PCB board and the LED device; as an embodiment, the lead arc top is 0.8mm away from the second support body, wherein the lead arc top is 0.8mm away from the top of the support body in consideration of the risk of the wire body being damaged due to the excessive height of the support body peak, and the safety range of the support body to support the lead in time when it collapses, so as to avoid breaking the wire due to excessive collapse height.

[0035] The method for manufacturing a thermoelectric separation LED module of the present invention comprises the following steps:

[0036] S1. A boss is provided on the heat sink, and an LED device is provided on the boss; a PCB board is connected to the heat sink; a groove is formed between the LED device and the PCB board; the groove can be made by chemical treatment or mechanical processing, but is not limited to etching, grinding, etc.;

[0037] S2, filling the groove with a high-reflectivity thermosetting material and extending the groove upward to an additional height after filling the groove depth to form a support body; the high-reflectivity thermosetting material is evenly filled in the groove; the support body material can be formed of a high-reflectivity thermosetting material including silicone, and its preparation method is not limited to dispensing, molding, etc.;

[0038] S3. Anti-diffusion structures are respectively provided at the corners of both sides of the LED device; the anti-diffusion structure can be formed integrally on the surface of the heat sink, and its preparation method is not limited to casting, molding, etc.;

[0039] S4. Connect the two ends of the lead wire to the reserved pads of the PCB board and the LED device respectively. The lead wire is prepared by a wire bonding process, and its material is not limited to high-conductivity metals such as gold, silver, and aluminum; and the support body is located about 0.8 mm below the lead wire.

[0040] The present invention reduces the risk of line collapse by arranging a support body under the module lead. There is an insulating support colloid under the lead to provide stress support for the lead when it is pressed by external force, thereby reducing the risk of electrical circuit breakage. The pre-glue dispensing process avoids the additional risk of line collapse introduced by glue dispensing after wire welding.

[0041] In the description herein, the reference terms "an embodiment", "example", etc., mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0042] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0043] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A support lead structure of a thermoelectric separation LED module, wherein the thermoelectric separation LED module comprises LED devices and a PCB board that are laterally separated and arranged, characterized in that: The support lead structure includes a groove and a support body for supporting the leads connecting the LED device and the PCB board; the groove is formed between the LED device and the PCB board; the support body includes a first support body and a second support body, the first support body is arranged in the groove, and the second support body is arranged on the first support body.

2. The support lead structure according to claim 1, characterized in that: The depth of the groove is 2 mm, and / or the width of the groove is 0.7 mm, and / or the height of the second support body is 0.2-0.5 mm.

3. The support lead structure according to claim 1 or 2, characterized in that: The length of the groove is 1-1.5 times the length of the bottom side of the LED device.

4. The support lead structure according to claim 1, characterized in that: The support body is made of insulating material.

5. A thermoelectric separation LED module, characterized in that: The invention comprises a heat sink, a boss, an LED device, a PCB board, a lead and the support lead structure according to any one of claims 1 to 4; the boss is arranged on the surface of the heat sink, the LED device is arranged on the boss, the PCB board and the LED device are arranged on the upper surface of the heat sink, and the support lead structure is arranged between the PCB board and the LED device; an anti-diffusion structure is arranged on the heat sink, and the anti-diffusion structure is located at the two side corners of the LED device; the lead connects the PCB board and the LED device, and there is a certain distance between the lead arc top of the lead and the support body.

6. The thermoelectric separation LED module according to claim 5, characterized in that: The thickness of the boss is 0.8 mm.

7. The thermoelectric separation LED module according to claim 5, characterized in that: The solder balls at both ends of the lead are respectively connected to the reserved solder pads of the PCB board and the LED device.

8. The thermoelectric separation LED module according to claim 5, characterized in that: The lead arc top is 0.8 mm away from the second support body.

9. A method for manufacturing a thermoelectric separation LED module, characterized in that: The following steps are involved: S1. Arrange a boss on the heat sink, and arrange an LED device on the boss; connect and arrange a PCB board on the heat sink; and form a groove between the LED device and the PCB board; S2, filling the groove with insulating material and extending the groove upward to an additional height after filling the groove to a depth to form a support body; the insulating material is evenly filled in the groove; S3, respectively setting anti-diffusion structures at the corners of both sides of the LED device; S4. Connecting two ends of the lead wire to the reserved pads of the PCB board and the LED device respectively, and the support body is located below the lead wire.

10. The manufacturing method according to claim 9, characterized in that: The groove is made by chemical treatment or mechanical processing; And / or, the anti-diffusion structure is formed integrally on the surface of the heat sink; And / or, the support body is prepared by dispensing or molding.

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