LED module directly pasted with heat sink and manufacturing method

Abstract

The invention discloses an LED module directly pasted with a heat sink and a manufacturing method. The LED module comprises a heat sink device, a PCB and an LED light source. The PCB and the LED light source are arranged on the heat sink device, the PCB is provided with a half-hole groove part, the LED light source is located in the half-hole groove part, a PCB side face bonding pad is arranged on the groove wall face of the half-hole groove part of the PCB, the LED light source is provided with an LED side face bonding pad, a solder paste welding layer is arranged between the PCB side face bonding pad and the LED side face bonding pad, and an anti-conduction insulating layer is arranged between the LED light source and the half-hole groove part. According to the structure, the reliability of connection between the PCB and the LED light source is improved, the LED light source is directly attached to the heat sink device, the heat source heat conduction path of the LED light source is shortened, and heat accumulation of the LED light source is greatly reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of LED packaging, and in particular relates to an LED module directly attached to a heat sink and a manufacturing method thereof. Background Art

[0002] Existing high-power LED modules usually use PCB boards as heat dissipation and circuit conduction carriers. There are generally two electrical connection methods for existing high-power LED modules: the first one is shown in Figure 1 The LED lamp beads, which serve as heat sources, are soldered to the PCB board with solder paste. The bottom pad of the LED is connected to the PCB electrical pad with solder paste to achieve conduction. However, the PCB is generally made of boards with poor heat dissipation performance such as FR-4. The heat generated by the LED is difficult to be conducted away through the PCB in the form of heat transfer. During long-term use, this layer is very likely to crack or even break. At the same time, heat accumulates at the LED, causing the LED to heat up and light decay or even die.

[0003] The second reference Figure 2 , by wire bonding, wires are connected from the LED wire bonding pads to the PCB pads. This method requires high-precision bonding equipment and high-reliability wire arcs, which greatly limits the mass production and use of LED modules. Summary of the invention

[0004] In order to overcome the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an LED module directly attached to a heat sink.

[0005] In order to achieve the purpose, the technical solution adopted by the present invention is as follows:

[0006] A LED module directly attached to a heat sink, comprising a heat sink device, a PCB board and an LED light source;

[0007] The PCB board and the LED light source are arranged on the heat sink device, the PCB board has a half-hole groove portion, the LED light source is in the half-hole groove portion, the groove wall surface of the half-hole groove portion of the PCB board is provided with a PCB side soldering pad, the LED light source is provided with an LED side soldering pad, a solder paste welding layer is provided between the PCB side soldering pad and the LED side soldering pad, and an anti-conduction insulating layer is provided between the LED light source and the half-hole groove portion.

[0008] Preferably, the heat sink device comprises a PCB placement groove for placing the PCB board, an LED placement groove for placing the LED light source, and an insulating layer filling groove for placing the anti-conduction insulating layer, and the insulating layer filling groove is arranged between the PCB placement groove and the LED placement groove;

[0009] The area size of the PCB placement groove is larger than the area size of the PCB board;

[0010] The area size of the LED placement groove is larger than the area size of the LED light source;

[0011] The insulating layer filling groove is arranged around the LED placement groove, the top of the anti-conduction insulating layer does not exceed the bottom surface of the PCB placement groove, and the bottom surface of the PCB placement groove is flush with the lower boundary of the PCB side pad.

[0012] Preferably, the heat sink device further comprises a heat sink mounting hole, a heat dissipation fin, a limiting boss and an LED positioning hole;

[0013] The heat sink mounting hole is arranged through the middle of the heat sink device, the PCB placement groove, the LED placement groove and the insulation layer filling groove are arranged on one end surface of the heat sink device, the heat dissipation fins are arranged on the other end surface of the heat sink device and are located on both sides of the heat sink mounting hole, the limiting bosses are arranged on one end surface of the heat sink device and are located on both sides of the heat sink mounting hole, and the LED positioning holes are arranged on both sides of the LED light source.

[0014] Preferably, the limiting boss comprises a first limiting boss and a second limiting boss, which are arranged on the left and right sides of the heat sink mounting hole in the length direction of the heat sink device;

[0015] The LED positioning holes include a first LED positioning hole and a second LED positioning hole, the shapes of the first LED positioning hole and the second LED positioning hole are circular or elliptical, and the first LED positioning hole and the second LED positioning hole are relatively arranged on the left and right sides of the LED light source in the width direction of the heat sink device.

[0016] Preferably, the PCB board is provided with a PCB mounting hole and a PCB limiting hole;

[0017] The PCB mounting hole is coaxially arranged with the heat sink mounting hole;

[0018] The PCB limiting hole includes a first PCB limiting hole and a second PCB limiting hole, and the first PCB limiting hole and the second PCB limiting hole are matched with the first limiting convex column and the second limiting convex column respectively;

[0019] The PCB side pads are symmetrically arranged on both sides of the LED light source in the width direction of the heat sink device.

[0020] Preferably, the LED light source comprises an LED substrate, an LED bottom pad, an LED light emitting layer, an LED light conversion layer, an LED front pad and an LED light blocking layer;

[0021] The LED front solder pad is arranged on the top of the LED substrate, the LED light-emitting layer is arranged on the LED front solder pad, the LED light conversion layer is arranged on the top of the LED light-emitting layer and completely covers the LED light-emitting layer, the LED light blocking layer is arranged around the LED light-emitting layer and the LED light conversion layer, the LED bottom solder pad is arranged on the bottom of the LED substrate, and the center line of the LED light conversion layer is consistent with the straight line formed by the centers of the first LED positioning hole and the second LED positioning hole;

[0022] The LED bottom solder pad is fixed to the LED placement groove by gluing;

[0023] The LED side solder pads are arranged on both sides of the LED substrate, and the LED side solder pads are connected to the LED front solder pads;

[0024] The depth of the LED placement groove is less than the thickness of the LED substrate of the LED light source.

[0025] The present invention also includes a method for manufacturing an LED module directly attached to a heat sink, which is used to manufacture the above-mentioned LED module directly attached to a heat sink, and the steps are as follows:

[0026] S1. Fix the LED light source to the LED placement groove of the heat sink device by SMT die bonding and thermal conductive adhesive to achieve direct path connection between the LED light source and the heat sink device;

[0027] S2, filling the insulating layer filling groove with insulating glue to form the anti-conduction insulating layer;

[0028] S3, placing the PCB board into the PCB placement groove and fixing it, and at the same time, fitting the PCB side pads of the PCB board with the LED side pads of the LED light source;

[0029] S4, filling the middle pore formed by the contact between the PCB side solder pad and the LED side solder pad to form the solder paste welding layer, and then realizing the electrical connection between the LED light source and the PCB board through reflow soldering / vacuum reflow soldering.

[0030] Preferably, in step S1, the heat sink device is first manufactured, and the PCB placement groove, LED placement groove, insulation layer filling groove, and limiting bosses are formed on one end face of the heat sink device by stamping / casting, and the heat sink fins are fixed to the other end face of the heat sink device by riveting or welding, and the heat sink mounting holes and LED positioning holes are formed on the heat sink device by drilling.

[0031] Preferably, in step S1, the LED light source is manufactured, and the LED light source includes an LED substrate, an LED side pad, an LED bottom pad, an LED light-emitting layer, an LED light conversion layer, an LED front pad and an LED light blocking layer, the LED light-emitting layer includes an LED chip but is not limited to a blue light chip, the LED light conversion layer includes but is not limited to a fluorescent sheet or a fluorescent film, the LED light blocking layer includes but is not limited to a mixture of TiO2 powder and silica gel or a silica gel resin, the LED side pad is a structure in which a groove is carved or milled on the ceramic LED substrate of the LED light source, or powder injection molding or dry pressing molding or molded into a groove, the LED side pad extends toward the LED front pad and is connected to the LED front pad to form an integrated circuit connection structure, and at the same time, copper is electroplated on the surface of the LED side pad and then nickel-gold or nickel-palladium-gold is plated.

[0032] Preferably, in step S4, the solder paste between the PCB board and the LED light source is consistent with the solder paste used for the PCB front circuit of the PCB board, and medium-temperature solder paste is used to achieve mounting by tinning patch method, and then soldering is performed by a reflow soldering method.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] In the structure of the LED module directly attached to the heat sink of this embodiment, the PCB side pad of the PCB board and the LED side pad of the LED light source are connected through a solder paste welding layer, and the LED light source is directly attached to the heat sink device to achieve independent heat transfer of the heat source of the LED light source, which can avoid the wire bonding between the PCB board and the pad of the LED light source, and improve the risk of bonding failure such as collapsed / broken wires from the source. In addition, the structure of the side pad provides a larger welding area, which increases the mechanical strength of the welding point, thereby improving the reliability of the connection between the PCB board and the LED light source. The LED light source is directly attached to the heat sink device, shortening the heat source heat conduction path of the LED light source, greatly reducing the heat accumulation of the LED light source. The anti-conduction insulation layer can avoid the problem of short circuit caused by solder paste flowing into the heat sink when welding between the PCB board and the LED light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0036] Figure 1 A view of a first electrical connection method in the prior art;

[0037] Figure 2 A view of a second electrical connection method in the prior art;

[0038] Figure 3 A top view of the present invention;

[0039] Figure 4 for Figure 3 AA cross-section diagram;

[0040] Figure 5 for Figure 3 A magnified schematic diagram of the local structure where no solder paste soldering layer is provided at the middle LED light source;

[0041] Figure 6 for Figure 3 A magnified schematic diagram of the local structure at the middle LED light source;

[0042] Figure 7 It is a partial schematic diagram of step S1 of the manufacturing method of the present invention;

[0043] Figure 8 It is a partial schematic diagram of step S2 of the manufacturing method of the present invention;

[0044] Fig. 9 It is a top view schematic diagram of step S3 of the manufacturing method of the present invention;

[0045] Fig.10 It is a schematic top view of step S4 of the manufacturing method of the present invention.

[0046] Description of reference numerals:

[0047] 1. Heat sink device, 201. First LED positioning hole, 202-Second LED positioning hole, 3. Heat sink mounting hole, 4. Heat dissipation fin, 5. PCB placement groove, 6. First limiting boss, 7. Second limiting boss, 8. PCB first limiting hole, 9. PCB mounting hole, 10. PCB second limiting hole, 11. PCB board, 12. LED light source, 13. LED adhesion layer, 14. Anti-conduction insulation layer, 15. LED side pad, 16. LED light blocking layer, 17. LED bottom pad, 18. LED placement groove, 19. Insulation layer filling groove, 20. Solder paste welding layer, 21. PCB side pad, 22. LED light emitting layer, 23. LED substrate, 24. LED light conversion layer, 25. LED front pad. DETAILED DESCRIPTION

[0048] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0050] Embodiment 1:

[0051] like Figures 2 to 10 , a LED module directly attached to a heat sink, comprising a heat sink device 1, a PCB board 11 and an LED light source 12;

[0052] The PCB board 11 and the LED light source 12 are arranged on the heat sink device 1, the PCB board 11 has a half-hole groove, the LED light source is in the half-hole groove, the groove wall surface of the half-hole groove of the PCB board 11 is provided with a PCB side pad 21, the LED light source 12 is provided with an LED side pad 15, a solder paste welding layer 20 is provided between the PCB side pad 21 and the LED side pad 15, and an anti-conduction insulating layer 14 is provided between the LED light source 12 and the half-hole groove;

[0053] In the structure of the LED module directly attached to the heat sink of this embodiment, the PCB side pad 21 of the PCB board 11 and the LED side pad 15 of the LED light source 12 are connected through the solder paste welding layer 20, and the LED light source 12 is directly attached to the heat sink device 1 to achieve independent heat transfer of the heat source of the LED light source 12, which can avoid the wire bonding of the pads of the PCB board 11 and the LED light source 12, and improve the risk of bonding failure such as collapsed / broken wires from the source. In addition, the structure of the side pads provides a larger welding area, which increases the mechanical strength of the welding point, thereby improving the reliability of the connection between the PCB board 11 and the LED light source 12. The LED light source 12 is directly attached to the heat sink device 1, shortening the heat source heat conduction path of the LED light source 12, and greatly reducing the heat accumulation of the LED light source 12. The anti-conduction insulating layer 14 can avoid the problem of short circuit caused by solder paste flowing into the heat sink when welding between the PCB board 11 and the LED light source 12.

[0054] In this embodiment, the specific structure of the relative positions of the PCB board 11, the LED light source 12 and the heat sink device 1 is as follows:

[0055] A PCB placement groove 5, an LED placement groove 18 and an insulating layer filling groove 19 are provided on the heat sink device 1. At the same time, the LED placement groove 18 corresponds to the position of the half-hole groove portion of the PCB board 11, and the insulating layer filling groove 19 is provided between the PCB placement groove 5 and the LED placement groove 19. The PCB board 11 is provided in the PCB placement groove 5, the LED light source 12 is provided in the LED placement groove 18, and the anti-conduction insulating layer 14 is provided in the insulating layer filling groove 19.

[0056] The heat sink device 1 of this embodiment is also provided with a heat sink mounting hole 3, a heat dissipation fin 4, a limiting boss and an LED positioning hole;

[0057] The heat sink mounting hole 3 is arranged through the middle of the heat sink device 1, the PCB placement groove 5, the LED placement groove 18 and the insulation layer filling groove 19 are arranged on one end surface of the heat sink device 1, the heat dissipation fins 4 are arranged on the other end surface of the heat sink device 1 and are located on both sides of the heat sink mounting hole 3, the limiting bosses are arranged on one end surface of the heat sink device 1 and are located on both sides of the heat sink mounting hole 3, and the LED positioning holes are arranged on both sides of the LED light source 12.

[0058] Specifically, the limiting bosses include a first limiting boss 6 and a second limiting boss 7, which are relatively arranged on the left and right sides of the heat sink mounting hole 3 in the length direction of the heat sink device 1;

[0059] The LED positioning holes include a first LED positioning hole 201 and a second LED positioning hole 202. In this embodiment, the first LED positioning hole 201 is circular, and the second LED positioning hole 202 is elliptical. The first LED positioning hole 201 and the second LED positioning hole 202 are relatively arranged on the left and right sides of the LED light source 12 in the width direction of the heat sink device 1.

[0060] The area size of the PCB placement groove 5 is larger than the area size of the PCB board 11;

[0061] The area size of the LED placement groove 18 is larger than the area size of the LED light source 12;

[0062] The insulating layer filling groove 19 is arranged around the LED placement groove 18, wherein the top of the anti-conduction insulating layer 14 does not exceed the bottom surface of the PCB placement groove 5, and the bottom surface of the PCB placement groove 5 is flush with the lower boundary of the PCB side pad 21.

[0063] Specifically, the PCB board 11 is provided with a PCB mounting hole 9 and a PCB limiting hole;

[0064] The PCB mounting hole 9 is coaxially arranged with the heat sink mounting hole 3;

[0065] The PCB limiting holes include a first PCB limiting hole 8 and a second PCB limiting hole 10, which respectively cooperate with the first limiting boss 6 and the second limiting boss 7; the PCB board 11 can be accurately fixed in the PCB placement groove 5 of the heat sink device 1 through the structure in which the PCB limiting holes cooperate with the first limiting boss 6 and the second limiting boss 7 respectively.

[0066] The PCB side pads 21 are symmetrically arranged on both sides of the LED light source 12 in the width direction of the heat sink device 1 .

[0067] Specifically, the LED light source 12 includes an LED bottom surface solder pad 17, an LED light emitting layer 22, an LED light blocking layer 16, an LED light emitting layer 22, an LED substrate 23, an LED light conversion layer 24 and an LED front surface solder pad 25;

[0068] The LED front solder pad 25 is arranged on the top of the LED substrate 23, the LED light emitting layer 22 is arranged on the LED front solder pad 25, the LED light conversion layer 24 is arranged on the top of the LED light emitting layer 22 and completely covers the LED light emitting layer 22, the LED light blocking layer 16 is arranged around the LED light conversion layer 24 and the LED light emitting layer 22, the center line of the LED light conversion layer 24 is consistent with the straight line formed by the center of the first LED positioning hole 201 and the second LED positioning hole 202, and the LED bottom solder pad 17 is arranged at the bottom of the LED substrate 23;

[0069] The LED bottom solder pad 17 is fixed to the LED placement groove 18 by gluing to form the LED adhesive layer 13, and the LED side solder pads are arranged on both sides of the LED substrate 23;

[0070] The LED side pad 15 is in contact with the PCB side pad 21, and the solder paste welding layer 20 is provided at the contact point between the LED side pad and the PCB side pad 21, and the LED side pad 15 and the PCB side pad 21 form a side pad. The LED side pad 15 and the PCB side pad 21 are welded and fastened with solder paste, and then the reflow process is used to realize the electrical connection between the two, thereby avoiding wire bonding and achieving the effect of thermal and electrical separation of the heat source.

[0071] The present invention also includes a method for manufacturing an LED module directly attached to a heat sink, which is used to manufacture the above-mentioned LED module directly attached to a heat sink, and the steps are as follows:

[0072] S1. See Figure 7 , fix the LED light source 12 in the LED placement groove 18 of the heat sink device 1 through SMT die bonding and thermal conductive adhesive, so as to achieve a path connection between the LED light source 12 and the heat sink device 1;

[0073] S2, see Figure 8, filling the insulating layer filling groove 19 with insulating glue to form an anti-conduction insulating layer 14;

[0074] S3, see Fig. 9 , place the PCB board 11 into the PCB placement groove 5 and fix it. Specifically, the PCB board 11 can be placed by sucking it with a nozzle or mechanically grabbing it, and at the same time, the PCB side pad 21 of the PCB board 11 is fitted with the LED side pad 15 of the LED light source 12;

[0075] S4. See Fig.10 The intermediate gap formed by the contact between the PCB side pad 21 and the LED side pad 15 is filled with solder paste to form a solder paste welding layer 20, and then the electrical connection between the LED light source 12 and the PCB board 11 is achieved through reflow soldering / vacuum reflow soldering.

[0076] Specifically, in step S1, a heat sink device 1 is first manufactured. The heat sink device 1 is a heat sink component. A PCB placement groove 5, an LED placement groove 18, an insulation layer filling groove 19, and a limiting boss are formed on the heat sink device 1 by stamping / casting. The heat dissipation fin 4 is fixed to the other end surface of the heat sink device 1 by riveting or welding. A heat sink mounting hole 3 and an LED positioning hole are formed on the heat sink device 1 by a drilling process. At the same time, according to the above structure, in step S3, the PCB board 11 is fastened to the limiting boss of the heat sink device 1 by pressing down with a pressure head / riveting.

[0077] Specifically, in step S1, an LED light source 12 is manufactured, and the LED light source 12 includes an LED substrate 23, an LED side solder pad 15, an LED bottom solder pad 17, an LED light-emitting layer 22, an LED light conversion layer 24, an LED front solder pad 25 and an LED light blocking layer 16. The LED light-emitting layer 22 includes an LED chip but is not limited to a blue light chip. The LED light conversion layer 24 includes but is not limited to a fluorescent sheet or a fluorescent film. The LED light blocking layer 16 includes but is not limited to a mixture of TiO2 powder and silica gel or a silica gel resin. The LED side solder pad 15 is a structure in which a groove is carved out on the ceramic LED substrate 23 of the LED light source 12 or a groove is formed by powder injection molding, dry pressing or molding. The LED side solder pad extends toward the LED front solder pad 25 and is connected to the LED front solder pad 25 to form an integrated circuit connection structure. At the same time, copper is electroplated on the surface of the LED side solder pad 15 and then nickel-gold or nickel-palladium-gold is plated.

[0078] Specifically, in step S4, the solder paste between the PCB board 11 and the LED light source is consistent with the solder paste used for the PCB front circuit of the PCB board 11, and medium-temperature solder paste is used to achieve mounting through tinning patch method, and then soldering is performed through a reflow soldering method.

[0079] Specifically, in step S1, the thermal conductivity of the thermal conductive adhesive is 6.5 W / mk.

[0080] Specifically, in step S3, during the production of the PCB board, one end of the PCB board 11 is a half-hole structure for placing the LED light source 12. According to the above structure, a copper through hole is first made at one end of the PCB board 11 and then cut in half to form a half-hole groove. During the half-cutting process, the PCB board 11 cuts off the material of the area of ​​the LED light source 12 to form a shape surrounding the LED light source 12. The PCB board 11 also includes a FR-4 flat plate, a PCB circuit layer, and a PCB solder mask layer. The PCB circuit layer is located on the front side of the PCB board 11. The PCB circuit layer and the FR-4 flat plate are combined into one by lamination. The thickness of the PCB circuit layer is 1oz. The PCB circuit layer is covered with a PCB solder mask layer, and the material of the PCB solder mask layer is white oil.

[0081] At the same time, the above-mentioned method for manufacturing the LED module directly attached to the heat sink simplifies the electrical connection between the PCB and the LED, and welding is achieved through a conventional patch method, which is conducive to mass production.

[0082] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. An LED module directly attached to a heat sink, characterized in that: It includes a heat sink device, a PCB board and an LED light source; The PCB board and the LED light source are arranged on the heat sink device, the PCB board has a half-hole groove portion, the LED light source is in the half-hole groove portion, the groove wall surface of the half-hole groove portion of the PCB board is provided with a PCB side soldering pad, the LED light source is provided with an LED side soldering pad, a solder paste welding layer is provided between the PCB side soldering pad and the LED side soldering pad, and an anti-conduction insulating layer is provided between the LED light source and the half-hole groove portion.

2. The LED module directly attached to the heat sink according to claim 1, characterized in that: The heat sink device comprises a PCB placement groove for placing the PCB board, an LED placement groove for placing the LED light source, and an insulation layer filling groove for placing the anti-conduction insulation layer, wherein the insulation layer filling groove is arranged between the PCB placement groove and the LED placement groove; The area size of the PCB placement groove is larger than the area size of the PCB board; The area size of the LED placement groove is larger than the area size of the LED light source; The insulating layer filling groove is arranged around the LED placement groove, the top of the anti-conduction insulating layer does not exceed the bottom surface of the PCB placement groove, and the bottom surface of the PCB placement groove is flush with the lower boundary of the PCB side pad.

3. The LED module directly attached to the heat sink according to claim 2, characterized in that: The heat sink device also includes a heat sink mounting hole, a heat dissipation fin, a limiting boss and an LED positioning hole; The heat sink mounting hole is arranged through the middle of the heat sink device, the PCB placement groove, the LED placement groove and the insulation layer filling groove are arranged on one end surface of the heat sink device, the heat dissipation fins are arranged on the other end surface of the heat sink device and are located on both sides of the heat sink mounting hole, the limiting bosses are arranged on one end surface of the heat sink device and are located on both sides of the heat sink mounting hole, and the LED positioning holes are arranged on both sides of the LED light source.

4. The LED module directly attached to the heat sink according to claim 3, characterized in that: The limiting bosses include a first limiting boss and a second limiting boss, which are arranged on the left and right sides of the heat sink mounting hole in the length direction of the heat sink device; The LED positioning holes include a first LED positioning hole and a second LED positioning hole, the shapes of the first LED positioning hole and the second LED positioning hole are circular or elliptical, and the first LED positioning hole and the second LED positioning hole are relatively arranged on the left and right sides of the LED light source in the width direction of the heat sink device.

5. The LED module directly attached to the heat sink according to claim 4, characterized in that: The PCB board is provided with a PCB mounting hole and a PCB limiting hole; The PCB mounting hole is coaxially arranged with the heat sink mounting hole; The PCB limiting hole includes a first PCB limiting hole and a second PCB limiting hole, and the first PCB limiting hole and the second PCB limiting hole are matched with the first limiting convex column and the second limiting convex column respectively; The PCB side pads are symmetrically arranged on both sides of the LED light source in the width direction of the heat sink device.

6. The LED module directly attached to the heat sink according to claim 5, characterized in that: The LED light source comprises an LED substrate, an LED bottom solder pad, an LED light emitting layer, an LED light conversion layer, an LED front solder pad and an LED light blocking layer; The LED front solder pad is arranged on the top of the LED substrate, the LED light-emitting layer is arranged on the LED front solder pad, the LED light conversion layer is arranged on the top of the LED light-emitting layer and completely covers the LED light-emitting layer, the LED light blocking layer is arranged around the LED light-emitting layer and the LED light conversion layer, the LED bottom solder pad is arranged on the bottom of the LED substrate, and the center line of the LED light conversion layer is consistent with the straight line formed by the centers of the first LED positioning hole and the second LED positioning hole; The LED bottom solder pad is fixed to the LED placement groove by gluing; The LED side solder pads are arranged on both sides of the LED substrate, and the LED side solder pads are connected to the LED front solder pads; The depth of the LED placement groove is less than the thickness of the LED substrate of the LED light source.

7. A method for manufacturing an LED module directly attached to a heat sink, characterized in that: The steps for manufacturing the LED module directly attached to the heat sink as described in any one of claims 1 to 6 are as follows: S1. Fix the LED light source to the LED placement groove of the heat sink device by SMT die bonding and thermal conductive adhesive to achieve direct path connection between the LED light source and the heat sink device; S2, filling the insulating layer filling groove with insulating glue to form the anti-conduction insulating layer; S3, placing the PCB board into the PCB placement groove and fixing it, and at the same time, fitting the PCB side pads of the PCB board with the LED side pads of the LED light source; S4, filling the middle pore formed by the contact between the PCB side solder pad and the LED side solder pad to form the solder paste welding layer, and then realizing the electrical connection between the LED light source and the PCB board through reflow soldering / vacuum reflow soldering.

8. The method for manufacturing an LED module directly attached to a heat sink according to claim 7, characterized in that: In step S1, the heat sink device is first manufactured, and the PCB placement groove, LED placement groove, insulation layer filling groove, and limiting boss are formed on one end surface of the heat sink device by stamping / casting. The heat dissipation fins are fixed to the other end surface of the heat sink device by riveting or welding, and the heat sink mounting holes and LED positioning holes are formed on the heat sink device by drilling.

9. The method for manufacturing an LED module directly attached to a heat sink according to claim 7, characterized in that: In step S1, the LED light source is manufactured, and the LED light source includes an LED substrate, an LED side pad, an LED bottom pad, an LED light-emitting layer, an LED light conversion layer, an LED front pad and an LED light blocking layer. The LED light-emitting layer includes an LED chip but is not limited to a blue light chip. The LED light conversion layer includes but is not limited to a fluorescent sheet or a fluorescent film. The LED light blocking layer includes but is not limited to a mixture of TiO2 powder and silica gel or a silica gel resin. The LED side pad is a structure in which a groove is carved or milled on the ceramic LED substrate of the LED light source, or powder injection molding or dry pressing molding or molded into a groove. The LED side pad extends toward the LED front pad and is connected to the LED front pad to form an integrated circuit connection structure. At the same time, copper is electroplated on the surface of the LED side pad and then nickel-gold or nickel-palladium-gold is plated.

10. The method for manufacturing an LED module directly attached to a heat sink according to claim 9, characterized in that: In step S4, the solder paste between the PCB board and the LED light source is consistent with the solder paste used for the PCB front circuit of the PCB board, and medium-temperature solder paste is used to achieve mounting through tinning patch method, and then soldering is performed through a reflow soldering method.

Images