Micro LED micro-display chip and preparation method thereof

By forming a cavity structure on the LED units of the Micro LED microdisplay chip, the life problem caused by heating of traditional microdisplay devices is solved, and the process is simplified, manufacturing costs are reduced, yields are improved, and it is suitable for large-scale mass production.

CN119730528AActive Publication Date: 2025-03-28RAYSOLVE OPTOELECTRONICS (SUZHOU) CO LTD
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Patent Information

Application Number
CN202510230716.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-28
Publication Date
2025-03-28
Estimated Expiration
2045-02-28

AI Technical Summary

Technical Problem

Traditional full-color microdisplay devices are directly transmitted to the light conversion structure due to the heating of the LED unit, which causes the light conversion structure to aging and failure, limiting the life of the microdisplay device. The preparation process of the prior art is complicated, which increases manufacturing cost and reduces yield.

Method used

By forming a cavity structure on the LED unit, the heat transmission of the LED unit is reduced to the light conversion structure, and a light emitting structure is formed on the driving substrate by a simple process, including a plurality of LED units, a first fence structure and an optical layer, and the LED tabletop and optical layer form a cavity region at the corresponding first grid hole.

Benefits of technology

It effectively improves the service life of Micro LED microdisplay chips, reduces manufacturing costs, improves product yield, and is suitable for large-scale mass production.

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Abstract

The invention relates to the technical field of display chips, and provides a Micro LED micro display chip and a preparation method thereof, the micro display chip comprises a driving substrate and a light emitting structure arranged on the driving substrate; the light-emitting structure comprises a plurality of LED units arranged on the driving substrate at intervals, each LED unit can be independently driven by the driving substrate, and the LED units are provided with a plurality of LED table tops in one-to-one correspondence; the first fence structure is provided with a plurality of first grid holes, the plurality of first grid holes respectively surround the plurality of LED table boards, and the first fence structure is higher than the plurality of LED units; and the optical layer is arranged on the first fence structure, and the LED table board and the optical layer form a cavity area at the corresponding first grid holes. The cavity area is formed through a simple process, heat of the LED unit is reduced to be transmitted to the light conversion structure above, the service life of the micro-display chip is prolonged, and the manufacturing cost is reduced.
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