An online laser dicing machine and a dicing method

Abstract

The application discloses an online laser plate dividing machine and a plate dividing method, and relates to the technical field of laser cutting.The application comprises a conveying platform, a recycling system and cutting assemblies.The two cutting assemblies are independently arranged and can simultaneously cut the same plate or different plates.The application can be directly applied to a production line to realize online processing of the plate without independent arrangement.The application adopts double cutting assemblies.When the plate size is large, the two cutting assemblies can simultaneously cut one plate or two plates.When the plate size is small, the two cutting assemblies cannot simultaneously cut the plate (or need to edit a corresponding synchronous cutting program), and two plates can be simultaneously conveyed to enable the two cutting assemblies to cut the two plates, so that the cutting efficiency is ensured, and the production and processing efficiency of the plate is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser cutting, more particularly, the present application relates to an online laser plate dividing machine and a plate dividing method. BACKGROUND

[0002] The laser cutting machine currently sold on the market is of gantry type structure, and the plate is manually stacked and then cut. Because the cutting machine is independent of the production line, the production and processing efficiency of the plate is relatively low. And the gantry cutting machine is usually a three-axis cutting system, that is, there is only one cutting assembly. Because the size of the plate is different, if multiple cutting assemblies are set, when cutting a small plate, the processing path of the two cutting assemblies needs to be re-planned to avoid collision, and it is also possible that only one cutting assembly is used and the other cutting assembly is idle. Therefore, how to integrate the laser cutting machine into the production line while improving the processing efficiency of the plate is a technical problem to be solved by the present application. SUMMARY

[0003] A series of simplified concepts are introduced in the summary section, which will be further described in detail in the detailed description section. The summary section of the present application does not mean to attempt to limit the key features and necessary technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0004] To at least partially solve the above problems, the present application provides an online laser plate dividing machine and a plate dividing method, comprising:

[0005] A transport platform is arranged on the rack, and the two ends of the transport platform are respectively connected with the production equipment of the previous process and the production equipment of the next process, for transporting the plate processed by the production equipment of the previous process to the processing position, and transporting the cut plate from the processing position to the production equipment of the next process;

[0006] A recovery system is arranged on the rack and located below the transport platform, the recovery system covers the processing position of the plate, and is used for recovering the waste after cutting;

[0007] The cutting assembly is two groups, which are arranged on the rack, and the two groups of cutting assemblies are independently arranged, and the two groups of cutting assemblies can cut the same plate at the same time or cut different plates respectively;

[0008] The control center is electrically connected with the transport platform and the cutting assembly, and is used for controlling the transport platform and the cutting assembly.

[0009] Preferably, the transport platform is composed of two parallelly arranged plate material carriers and a plurality of transmission wheels, the plate material carriers and the transmission wheels are arranged on the rack, one end of the plate material carrier is connected with the production equipment of the previous process, the other end is connected with the production equipment of the next process, the first driving device is connected with the transmission wheel and provides power for the transmission wheel, and the first driving device is electrically connected with the control center.

[0010] Preferably, the recycling system is composed of a hopper and a collection box, the hopper is arranged on the rack, and the opening cover of the hopper covers the processing position of the plate material, and the collection box is arranged at the bottom of the hopper.

[0011] Preferably, the cutting assembly is composed of an X-axis translation system arranged on the rack, a Y-axis translation system arranged on the X-axis translation system, a Z-axis translation system arranged on the Y-axis translation system, and a laser device arranged on the Z-axis translation system, and the X-axis translation system, the Y-axis translation system and the Z-axis translation system are electrically connected with the control center.

[0012] Preferably, the two cutting assemblies are respectively a first assembly and a second assembly, the X-axis translation system of the first assembly is arranged in parallel with the X-axis translation system of the second assembly, the Y-axis translation system of the first assembly is arranged in parallel with the Y-axis translation system of the second assembly, and the Z-axis translation system of the first assembly is arranged in parallel with the Z-axis translation system of the second assembly.

[0013] Preferably, the X-axis translation system is provided with a bump stop, the bump stop of the first assembly is arranged opposite to the bump stop of the second assembly, and when the bump stop of the first assembly abuts against the bump stop of the second assembly, a gap is left between the laser device of the first assembly and the laser device of the second assembly.

[0014] Preferably, the laser device is composed of a laser cutter and a visual positioning system, the laser cutter and the visual positioning system are arranged on the Z-axis translation system, a light source is arranged below the visual positioning system, and the laser cutter, the visual positioning system and the light source are electrically connected with the control center.

[0015] Preferably, it further comprises two sets of limiting systems arranged in sequence along the transport direction of the plate material, the limiting system is composed of an end limiting piece arranged on the rack, a vertical limiting piece and a side limiting piece, the end limiting piece is connected with the second driving device, the second driving device is used to provide power for the end limiting piece, the vertical limiting piece is connected with the third driving device, the third driving device is used to provide power for the vertical limiting piece, the side limiting piece is connected with the fourth driving device, the fourth driving device is used to provide power for the side limiting piece, the second driving device, the third driving device and the fourth driving device are electrically connected with the control center, and the limiting system is used to position the transported plate material to the processing position of the plate material.

[0016] Preferably, a shell is further included, the shell is arranged on the rack, a sliding door is arranged on the shell, an exhaust system is arranged on the top of the shell, and the control center is arranged on the shell, and the exhaust system is electrically connected with the control center.

[0017] A plate dividing method of an online laser plate dividing machine, steps are as follows:

[0018] S1: inputting the processing parameters of the plate in the control center;

[0019] S2: the plate is conveyed to the transportation platform by the production equipment of the previous process;

[0020] S3: the plate is transported to the processing position by the transportation platform;

[0021] S4: the plate is cut by the two groups of cutting assemblies:

[0022] When the processed plate is one piece, the two groups of cutting assemblies cut the plate simultaneously;

[0023] When the processed plate is two pieces, the two groups of cutting assemblies cut the two plates respectively;

[0024] The cutting waste falls into the recycling system;

[0025] S5: after cutting, the plate is conveyed from the processing position to the production equipment of the next process by the transportation platform for subsequent processing.

[0026] Compared with the prior art, the present application at least has the following beneficial effects:

[0027] Through the design of the above structure, the present application can be directly applied to the production line to realize online processing of the plate without independent setting. The present application adopts double cutting assemblies, when the plate size is large, the two groups of cutting assemblies can cut one plate simultaneously or two plates simultaneously; when the plate size is small, the two groups of cutting assemblies cannot cut the plate simultaneously (or need to edit the corresponding synchronous cutting program), two plates can be conveyed simultaneously to make the two groups of cutting assemblies cut the two plates respectively to ensure the cutting efficiency. Thus, the production and processing efficiency of the plate is greatly improved.

[0028] The online laser plate dividing machine and the plate dividing method of the present application, other advantages, objects and features of the present application will be embodied in part through the following description, and part will be understood by those skilled in the art through research and practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and are meant to explain the application without limiting the application to the embodiments. In the drawings:

[0030] Figure 1 A schematic diagram of the online laser board splitting machine.

[0031] Figure 2 A schematic diagram of the recovery system on the rack.

[0032] Figure 3 A schematic diagram of the transport platform on the rack.

[0033] Figure 4 A schematic diagram of the cutting assembly on the rack.

[0034] Figure 5 A schematic diagram of the limiting system on the rack.

[0035] Figure 6 A schematic diagram of the anti-collision block on the X-axis translation system.

[0036] Figure 7 A schematic diagram of the laser device.

[0037] Figure 8 A schematic diagram of the board to be cut (A) and the marking point and cutting path (B).

[0038] In the figure: 100 rack, 200 board to be cut, 201 marking point, 202 cutting path, 1 transport platform, 11 board carrier, 12 transmission wheel, 2 recovery system, 31 X-axis translation system, 32 Y-axis translation system, 33 Z-axis translation system, 4 control center, 5 laser device, 51 laser cutter, 52 visual positioning system, 53 light source, 6 anti-collision block, 71 end limiting piece, 72 vertical limiting piece, 73 side limiting piece, 8 exhaust system. DETAILED DESCRIPTION

[0039] The application will be further described in conjunction with the drawings and examples, so that those skilled in the art can implement the application according to the description.

[0040] It should be understood that the terms such as "have", "contain" and "include" used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0041] As Figures 1-8As shown, the present application provides an online laser board cutting machine, comprising: a transport platform 1, the transport platform 1 is arranged on the rack 100, the two ends of the transport platform 1 are respectively connected with the production equipment of the previous process and the production equipment of the next process, for transporting the plate processed by the production equipment of the previous process to the processing position, and transporting the cut plate from the processing position to the production equipment of the next process; the transport platform 1 is composed of two parallel arranged plate carriers 11 and a plurality of transmission wheels 12, the plate carrier 11 and the transmission wheel 12 are arranged on the rack 100, as shown in Figure 3 and Figure 5 As shown, the plate is placed on the top surface of the plate carrier 11 during transportation, the transmission wheel 12 can be arranged on the plate carrier 11, cutting the plate carrier 11 into multiple sections, as shown in Figure 5 As shown, the transmission wheel 12 can also be arranged between two plate carriers 11, the transmission wheel 12 contacts the bottom surface of the plate, and drives the plate to translate on the plate carrier 11, because the present application can be directly applied to the production line, in order to simply limit the position of the moving plate, a baffle is usually arranged on the outside of the plate carrier 11 in the vertical direction, so as to limit the plate during transportation. In order to directly install the present application on the production line, one end of the plate carrier 11 is connected with the production equipment of the previous process, the other end is connected with the production equipment of the next process, the first driving device is connected with the transmission wheel 12 and provides power for the transmission wheel 12, and the first driving device is electrically connected with the control center 4.

[0042] The recycling system 2 is arranged on the rack 100 and located below the transport platform 1, the recycling system 2 covers the processing position of the plate, for recycling the waste after cutting; the recycling system 2 is composed of a hopper and a collection box, the hopper is arranged on the rack 100, and the opening of the hopper covers the processing position of the plate, the collection box is arranged at the bottom of the hopper, the waste cut down can directly fall into the collection box through the hopper, which is convenient for centralized recycling and processing of the waste.

[0043] The cutting assembly, the cutting assembly is two groups, which are arranged on the rack 100, the two groups of cutting assemblies are independently arranged, in order to improve the cutting efficiency, when only cutting one plate, the two groups of cutting assemblies can cut from both sides of the plate at the same time; when cutting two plates at the same time, the two groups of cutting assemblies can cut different plates respectively, so as to ensure online cutting while improving the cutting efficiency.

[0044] Two sets of limiting systems are sequentially arranged along the conveying direction of the plates, because the application adopts the structural design of double cutting assemblies, when the size of the plate is small, if the two cutting assemblies simultaneously process the plate, the laser equipment 5 is prone to collision, and separate programming design will complicate the production process, therefore, when the size of the plate is insufficient for the two cutting assemblies to simultaneously cut, two plates are simultaneously conveyed, and each cutting assembly cuts different plates, thereby, two sets of limiting systems are required to position the two plates respectively, the limiting system is composed of an end limiting piece 71, a vertical limiting piece 72 and a side limiting piece 73 arranged on the rack 100, the end limiting piece 71 is connected with the second driving device, the second driving device is used to provide power for the end limiting piece 71, the vertical limiting piece 72 is connected with the third driving device, the third driving device is used to provide power for the vertical limiting piece 72, the side limiting piece 73 is connected with the fourth driving device, the fourth driving device is used to provide power for the side limiting piece 73, the second driving device, the third driving device and the fourth driving device are electrically connected with the control center 4, and the limiting system is used to position the conveyed plate to the processing position of the plate.

[0045] The shell is arranged on the rack 100, the shell is provided with a sliding door, the top of the shell is provided with an exhaust system 8, the harmful gas diffusion in the cutting process can be effectively avoided by arranging the shell and the exhaust system 8, the control center 4 is arranged on the shell, and the exhaust system 8 is electrically connected with the control center 4.

[0046] The control center 4, the conveying platform 1 and the cutting assembly are electrically connected with the control center 4, the control center 4 is used to control the conveying platform 1 and the cutting assembly, and the control center 4 is a commercially available product or prior art which can program and control the conveying platform 1, the cutting assembly, the limiting system and the exhaust system 8.

[0047] The working principle and beneficial effects of the above technical scheme are as follows: through the design of the above structure, the application can be directly applied to the production line to realize online processing of the plate without independent arrangement. The application adopts double cutting assemblies, when the size of the plate is large, the two cutting assemblies can simultaneously cut one plate or simultaneously cut two plates, when the size of the plate is small, the two cutting assemblies cannot simultaneously cut the plate (or need to edit the corresponding synchronous cutting program), two plates are simultaneously conveyed, and the two cutting assemblies cut the two plates respectively to ensure the cutting efficiency. The production and processing efficiency of the plate is greatly improved.

[0048] Further, the cutting assembly is composed of an X-axis translation system 31 arranged on the rack 100, a Y-axis translation system 32 arranged on the X-axis translation system 31, a Z-axis translation system 33 arranged on the Y-axis translation system 32, and a laser device 5 arranged on the Z-axis translation system 33, and the X-axis translation system 31, the Y-axis translation system 32 and the Z-axis translation system 33 are electrically connected with the control center 4. Among them, the three-axis translation systems are all commercially available products or prior art, and the two cutting assemblies are respectively a first assembly and a second assembly, the X-axis translation system 31 of the first assembly is arranged in parallel with the X-axis translation system 31 of the second assembly, the Y-axis translation system 32 of the first assembly is arranged in parallel with the Y-axis translation system 32 of the second assembly, and the Z-axis translation system 33 of the first assembly is arranged in parallel with the Z-axis translation system 33 of the second assembly.

[0049] Further, the X-axis translation system 31 is provided with a collision block 6, the collision block 6 of the first assembly is arranged opposite to the collision block 6 of the second assembly, when the collision block 6 of the first assembly abuts against the collision block 6 of the second assembly, a gap is left between the laser device 5 of the first assembly and the laser device 5 of the second assembly, when the first assembly and the second assembly collide, the collision of the laser devices 5 of the two assemblies can be effectively avoided, and the loss is reduced.

[0050] Further, the laser device 5 is composed of a laser cutter 51 and a visual positioning system 52, the laser cutter 51 and the visual positioning system 52 are arranged on the Z-axis translation system 33, a light source 53 is arranged below the visual positioning system 52, and the laser cutter 51, the visual positioning system 52 and the light source 53 are electrically connected with the control center 4.

[0051] A cutting method of an online laser board dividing machine, the steps are as follows:

[0052] S1: input the processing parameters of the plate in the control center 4;

[0053] S2: the plate is conveyed to the transportation platform 1 by the production equipment of the previous process;

[0054] S3: the transportation platform 1 transports the plate to the processing position;

[0055] S4: two cutting assemblies cut the plate:

[0056] When the processed plate is one piece, the two cutting assemblies cut the plate at the same time;

[0057] When the processed plate is two pieces, the two cutting assemblies cut the two plates respectively;

[0058] The cutting waste falls into the recycling system 2;

[0059] S5: After cutting, the plate is transported by the transport platform 1 from the machining position to the production equipment of the next process for subsequent processing.

[0060] Further, when two cutting assemblies cut the same plate, the steps are as follows:

[0061] S1: The machining parameters of the plate are input in the control center 4;

[0062] S2: The plate is conveyed by the production equipment of the previous process to the plate carrier 11, and the transmission wheel 12 drives the plate to move to the machining position;

[0063] S301: The end limiting piece 71 rises, the plate moves to the end limiting piece 71 under the drive of the transmission wheel 12, and abuts against the end limiting piece 71;

[0064] S302: The transmission wheel 12 stops running;

[0065] S303: The side limiting piece 73 is pushed by one side of the plate to move the plate until the other side of the plate abuts against the baffle of the plate carrier 11;

[0066] S304: The vertical limiting piece 72 moves down and presses on the top of the plate, completing the positioning of the plate in the machining position;

[0067] S401: The light source 53 and the visual positioning system 52 of the laser equipment 5 of the two cutting assemblies are started;

[0068] S402: The two cutting assemblies move the laser equipment 5 to the initial position set by the program according to the set program;

[0069] S403: The visual positioning system 52 finds the mark point 201 on the plate 200 to be cut and completes the positioning of the laser cutter 51;

[0070] S404: The laser cutter 51 is started and cuts the plate along the cutting path 202 (usually two cutting assemblies cut from opposite ends of the plate to the center), and the waste generated by cutting falls into the collection box through the hopper;

[0071] S501: After cutting, the two cutting assemblies are reset;

[0072] S502: The limiting system is reset to release the position limitation of the plate;

[0073] S503: The transmission wheel 12 is started and drives the plate from the machining position to the production equipment of the next process for subsequent processing.

[0074] Further, when two cutting assemblies cut two plates respectively, the steps are as follows:

[0075] S1: input the processing parameters of the board at the control center 4;

[0076] S2: the first board is conveyed by the production equipment of the previous process to the board carrier 11, and the transmission wheel 12 drives the board to move to the processing position;

[0077] S301: the end limiting piece 71 farthest from the production equipment of the previous process (hereinafter referred to as the first end limiting piece) rises, and the first board moves to the first end limiting piece under the drive of the transmission wheel 12 and abuts against the first end limiting piece;

[0078] S302: the second board is conveyed by the production equipment of the previous process to the board carrier 11, and the transmission wheel 12 drives the board to move to the processing position;

[0079] S303: the other end limiting piece 71 (hereinafter referred to as the second end limiting piece) rises, and the second board moves to the second end limiting piece under the drive of the transmission wheel 12 and abuts against the second end limiting piece;

[0080] S304: the transmission wheel 12 stops running;

[0081] S305: the side limiting piece 73 is pushed by one side of the board to move the board until the other side of the board abuts against the baffle of the board carrier 11;

[0082] S306: the vertical limiting piece 72 moves down and presses on the top of the board, completing the positioning of the board in the processing position;

[0083] S401: the light source 53 and the visual positioning system 52 of the laser equipment 5 of the two cutting assemblies are started;

[0084] S402: the two cutting assemblies move the laser equipment 5 to the initial position set by the program according to the set program;

[0085] S403: the visual positioning system 52 finds the mark point 201 on the board 200 to be cut and completes the positioning of the laser cutter 51;

[0086] S404: the laser cutter 51 is started and cuts the board along the cutting path 202, and the waste generated by the cutting falls into the collection box through the hopper;

[0087] S501: after the cutting is completed, the two cutting assemblies are reset;

[0088] S502: the limiting system is reset to release the position limitation of the board;

[0089] S503: The transmission wheel 12 starts and drives the two plates from the processing position to the production equipment of the next process for subsequent processing.

[0090] Further, the visual positioning system 52 comprises: a visual collection microscope lens unit, a visual image photoelectric conversion unit, a collection data transmission unit, a mark point visual recognition unit, a visual and cutting coordinate conversion unit; the visual collection microscope lens unit collects the plate surface reflected light of the surface reflected light source 53 of the plate to be cut, and after optical microscopic magnification, irradiates the visual image photoelectric conversion unit; the visual image photoelectric conversion unit forms a plate surface microscopic visual image by photoelectric conversion of the plate surface reflected light; the collection data transmission unit transmits the plate surface microscopic visual image to the mark point visual recognition unit; the mark point visual recognition unit recognizes the plate surface microscopic visual image, and according to the field of view contraction spiral search path, finds the mark point 201 in the plate surface microscopic visual image; the mark point 201 forms an enlarged mark circle after microscopic magnification; the field of view contraction spiral search path includes first contracting the radius from the edge of the mark point 201 enlarged mark circle to the center along the spiral trajectory; when the edge of the mark point 201 enlarged mark circle is found, the visual recognition center and the mark point 201 enlarged mark circle center are aligned; the visual recognition mark point 201 and the mark point microscopic magnification center are precisely aligned, and the visual recognition error is reduced; the visual and cutting coordinate conversion unit establishes the visual positioning coordinate system of the visual positioning system 52 and the laser cutting coordinate system of the laser cutter 51, and according to the three-dimensional space relative position relationship between the visual recognition center of the visual positioning coordinate system and the laser cutting center of the laser cutting coordinate system, sets the coordinate conversion relationship between the visual positioning coordinate system and the laser cutting coordinate system; according to the coordinate conversion relationship, when the visual positioning system 52 recognizes and searches the mark point 201, the visual and cutting coordinate conversion unit converts the visual positioning coordinate system and the laser cutting coordinate, so that the laser cutting center of the laser cutting coordinate system of the laser cutter 51 and the mark point 201 recognized in the visual positioning coordinate system are consistent; the positioning of the laser cutter 51 is completed; after the positioning of the laser cutter 51 is completed, the positioning information is transmitted to the control center 4 to refer to the mark point 201 positioning information, plan the cutting path, and control the laser cutting center of the laser cutter 51 to cut the plate according to the planned cutting path through laser start or stop.

[0091] In the description of the application, it is to be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application.

[0092] In the present application, unless otherwise clearly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or communicate with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0093] Although the embodiments of the present application have been disclosed as above, it is not limited to the application and implementation listed in the specification and embodiments, and it can be fully applied to various fields suitable for the present application, and additional modifications can be easily realized by those skilled in the art, and therefore the present application is not limited to specific details and the figures shown and described herein, without departing from the general concept defined by the claims and the equivalent scope.

Claims

1. An in-line laser dicing machine characterized by, The utility model relates to a cutting device and a cutting method for cutting plate material, and belongs to the field of cutting device. The cutting device comprises a transportation platform (1) arranged on a rack (100), two ends of the transportation platform (1) being connected with production equipment of a previous process and production equipment of a next process respectively, the transportation platform (1) being used for transporting plate material processed by the production equipment of the previous process to a processing position and transporting the cut plate material from the processing position to the production equipment of the next process; a recovery system (2) arranged on the rack (100) and located below the transportation platform (1), the recovery system (2) covering the processing position of the plate material and being used for recovering waste material after cutting; two cutting assemblies arranged on the rack (100), the two cutting assemblies being arranged independently of each other, and the two cutting assemblies being capable of cutting the same plate material simultaneously or cutting different plate materials respectively; a control center (4) electrically connected with the transportation platform (1) and the cutting assemblies, the control center (4) being used for controlling the transportation platform (1) and the cutting assemblies; the cutting assembly comprises an X-axis translation system (31) arranged on the rack (100), a Y-axis translation system (32) arranged on the X-axis translation system (31), a Z-axis translation system (33) arranged on the Y-axis translation system (32), and a laser device (5) arranged on the Z-axis translation system (33), the X-axis translation system (31), the Y-axis translation system (32), and the Z-axis translation system (33) being electrically connected with the control center (4); the laser device (5) comprises a laser cutter (51) and a visual positioning system (52), the laser cutter (51) and the visual positioning system (52) being arranged on the Z-axis translation system (33), a light source (53) being arranged below the visual positioning system (52), the laser cutter (51), the visual positioning system (52), and the light source (53) being electrically connected with the control center (4); the visual positioning system (52) comprises a visual acquisition microscope lens unit, a visual image photoelectric conversion unit, a data acquisition and transmission unit, a mark point visual recognition unit, and a visual and cutting coordinate conversion unit; the visual acquisition microscope lens unit acquires a visual image through the visual image photoelectric conversion unit; the data acquisition and transmission unit identifies the visual image through the mark point visual recognition unit and finds a mark point (201); the visual and cutting coordinate conversion unit establishes a coordinate conversion relationship between a visual positioning coordinate system and a laser cutting coordinate system; according to the coordinate conversion relationship, the laser cutter (51) is positioned; the two cutting assemblies are a first assembly and a second assembly, the X-axis translation system (31) of the first assembly is arranged in parallel with the X-axis translation system (31) of the second assembly, the Y-axis translation system (32) of the first assembly is arranged in parallel with the Y-axis translation system (32) of the second assembly, and the Z-axis translation system (33) of the first assembly is arranged in parallel with the Z-axis translation system (33) of the second assembly.

2. The in-line laser dicing saw of claim 1, wherein, The transport platform (1) is composed of two parallel plate carriers (11) and a plurality of transmission wheels (12), the plate carrier (11) and the transmission wheel (12) are arranged on the rack (100), one end of the plate carrier (11) is connected with the production equipment of the previous process, the other end is connected with the production equipment of the next process, the first driving device is connected with the transmission wheel (12) and provides power for the transmission wheel (12), and the first driving device is electrically connected with the control center (4).

3. The in-line laser dicing saw of claim 1, wherein, The recycling system (2) is composed of a hopper and a collection box, the hopper is arranged on the rack (100), and the opening cover of the hopper covers the processing position of the plate, and the collection box is arranged at the bottom of the hopper.

4. The in-line laser dicing saw of claim 1, wherein, The X-axis translation system (31) is provided with a bump stop (6), the bump stop (6) of the first assembly is arranged opposite to the bump stop (6) of the second assembly, when the bump stop (6) of the first assembly abuts against the bump stop (6) of the second assembly, a gap is left between the laser equipment (5) of the first assembly and the laser equipment (5) of the second assembly.

5. The in-line laser dicing saw of claim 2, wherein, Further comprising two groups of limiting systems arranged in sequence along the transport direction of the plate, the limiting system is composed of an end limiting piece (71), a vertical limiting piece (72) and a side limiting piece (73) arranged on the rack (100), the end limiting piece (71) is connected with the second driving device, the second driving device is used for providing power for the end limiting piece (71), the vertical limiting piece (72) is connected with the third driving device, the third driving device is used for providing power for the vertical limiting piece (72), the side limiting piece (73) is connected with the fourth driving device, the fourth driving device is used for providing power for the side limiting piece (73), the second driving device, the third driving device and the fourth driving device are electrically connected with the control center (4), and the limiting system is used for positioning the transported plate to the processing position of the plate.

6. The in-line laser dicing saw of claim 1, wherein, Further comprising a shell, the shell is arranged on the rack (100), a sliding door is arranged on the shell, an exhaust system (8) is arranged at the top of the shell, the control center (4) is arranged on the shell, and the exhaust system (8) is electrically connected with the control center (4).

7. A method for separating a board in an on-line laser board separator as claimed in claim 1, characterized in that, The steps are as follows: S1: input the processing parameters of the plate in the control center (4); S2: the plate is conveyed from the production equipment of the previous process to the transport platform (1); S3: the transport platform (1) transports the plate to the processing position; S4: two groups of cutting assemblies cut the plate: when the processed plate is one piece, two groups of cutting assemblies cut the plate at the same time; when the processed plate is two pieces, two groups of cutting assemblies cut two pieces of plate respectively; the cutting waste falls into the recycling system (2); S5: after cutting, the plate is conveyed from the processing position to the production equipment of the next process by the transport platform (1) for subsequent processing.

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