Guard, wafer grinding module, thinning apparatus and method, processing apparatus

Abstract

The application provides a protection device, a wafer grinding module, a thinning device and method, a data processing device and a storage medium. The protection device is used for a wafer grinding module of a wafer thinning device, and comprises: a partition flow guide strip, which divides a rotary workbench into a plurality of fan-shaped areas and has a flow guide groove; and a movable protection piece, which is arranged above the partition flow guide strip of the rotary workbench when a wafer is located at any work station, and can be moved to a first position to prevent waste liquid splashing when wafer grinding is performed, and can be moved to a second position to allow the rotary workbench to rotate when the rotary workbench is rotated. The application can effectively reduce the risk of impurities such as grinding waste contacting or falling on the surface of the wafer when the wafer work station is rotated and switched, thereby effectively reducing the risk of grinding waste damaging the upper surface of the wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer ultra-precision grinding, and in particular to a protection device, a wafer grinding module, a thinning device and method, a data processing device and a storage medium. BACKGROUND

[0002] A wafer is a circular thin sheet made of silicon or other semiconductor materials, which is used to manufacture integrated circuits. Wafer grinding is an important link in the semiconductor manufacturing process, which is mainly used to adjust the thickness of the wafer, usually grinding from the non-active surface of the wafer to make the wafer reach the required specifications, and to improve the flatness and smoothness of the wafer.

[0003] In the wafer thinning grinding process, in order to thin the back of the wafer to the required thickness, it is usually operated in a grinding area surrounded by a cavity, and in this process, grinding waste will splash to the inner wall of the cavity or from the gap below the cavity wall to contaminate other areas. At present, a fixed waterproof curtain of soft material is usually arranged below the cavity wall, however, the fixed waterproof curtain has certain limitations and is easy to contaminate or scratch the wafer. SUMMARY

[0004] Therefore, the present application provides a protection device, a wafer grinding module, a thinning device and method, a data processing device and a storage medium, so as to solve or at least alleviate one or more of the above problems and other aspects in the prior art.

[0005] To achieve the foregoing object, a first aspect of the present application provides a protection device for a wafer grinding module of a wafer thinning device, the wafer grinding module having a rotary table capable of rotating a wafer between a plurality of stations, wherein the protection device comprises:

[0006] a partitioning flow guide strip protruding from a surface of the rotary table and extending radially to divide the rotary table into a plurality of fan-shaped areas, a top surface of the partitioning flow guide strip being provided with a flow guide groove having a radially outer end opening; and

[0007] a movable protection member having a radial dimension matching a radius of the rotary table, the movable protection member being arranged above the partitioning flow guide strip, the movable protection member being capable of moving to a first position for preventing waste liquid splashing when wafer grinding is performed, and the movable protection member being capable of moving to a second position for allowing the rotary table to rotate when the rotary table is rotated.

[0008] In the protective device as described above, optionally, the workstations include a loading and unloading workstation and a plurality of grinding workstations, the protective device includes a housing surrounding the grinding workstations, the housing has a vertical mounting surface for mounting the movable protective member, the mounting surface is located between the loading and unloading workstation and the grinding workstations and / or between adjacent grinding workstations.

[0009] In the protective device as described above, optionally, the bottom of the housing is open, allowing the waste liquid to flow into a water collecting tray below the rotary table.

[0010] In the protective device as described above, optionally, a lifting cylinder and a linear guide rail are provided at the mounting surface, the movable protective member can be lifted along the linear guide rail under the control of the lifting cylinder.

[0011] In the protective device as described above, optionally, two linear guide rails and one lifting cylinder are provided at the mounting surface, the linear guide rails are symmetrically arranged on both sides of the lifting cylinder.

[0012] In the protective device as described above, optionally, the lifting cylinder is connected with a controller, the controller is responsible for receiving instructions and driving the lifting cylinder to perform corresponding actions through electrical signals.

[0013] In the protective device as described above, optionally, the movable protective member includes a protective plate, the lower end of the protective plate is lowered into the flow guide groove during wafer grinding, and the lower end of the protective plate is raised above the partition flow guide strip when the rotary table is rotated.

[0014] In the protective device as described above, optionally, the protective plate is made of a corrosion-resistant material.

[0015] In the protective device as described above, optionally, the inner bottom surface of the flow guide groove gradually slopes downward radially outward, and the bottom end of the protective plate is inclined at the same angle as the inner bottom surface of the flow guide groove.

[0016] In the protective device as described above, optionally, the movable protective member further includes a lifting plate, the lifting plate is fixed to the top end of the protective plate, the protective plate and the lifting plate are driven, and the lifting plate is controlled by a lifting cylinder and can be lifted along a linear guide rail.

[0017] In the protective device as described above, optionally, the protective device further includes a fixed protective member fixed to the housing, the fixed protective member is arranged on the outer side of the rotary table, and is used to prevent the waste liquid from splashing out.

[0018] In the protective device as described above, optionally, the fixed guard comprises an outer rigid rim and an inner soft rim, the outer periphery of the inner soft rim is spliced with the inner periphery of the outer rigid rim, the outer rigid rim and the inner soft rim are used to prevent the circumferential splashing of waste liquid, and a gap is left between the inner soft rim and the side of the rotary table.

[0019] In the protective device as described above, optionally, the outer rigid rim is integrally formed with the mounting surface of the housing, and the outer rigid rim comprises a top section laterally aligned with the mounting surface, a side section located at the radially outer periphery of the movable guard and the rotary table, and a bottom section extending radially inward below the rotary table, and the top section, the side section and the bottom section are integrally formed.

[0020] In the protective device as described above, optionally, the fixed guard and the movable guard are spliced into a splash-proof surface, and the fixed guard is located outside the movable guard.

[0021] In the protective device as described above, optionally, the outer rigid rim is made of rigid metal, and the inner soft rim is made of corrosion-resistant rubber or silicone.

[0022] To achieve the foregoing object, a second aspect of the present application provides a wafer grinding module for a wafer thinning device, wherein the wafer grinding module has a rotary table capable of rotating a wafer between multiple stations, and the wafer grinding module has the protective device as described in any one of the foregoing first aspects.

[0023] In the wafer grinding module as described above, optionally, the radially outer end opening has a downward guide located at the radially outer periphery of the rotary table, preventing waste liquid from contaminating the rotary table.

[0024] To achieve the foregoing object, a third aspect of the present application provides a wafer thinning device, wherein the wafer thinning device has the wafer grinding module as described in any one of the foregoing second aspects.

[0025] To achieve the foregoing object, a fourth aspect of the present application provides a method for processing a wafer using the wafer thinning device as described in the foregoing third aspect, wherein the method comprises the following steps:

[0026] loading the wafer to the rotary table at a loading and unloading station;

[0027] moving the movable guard to the second position, rotating the rotary table to transfer the wafer to a grinding station;

[0028] moving the movable guard to the first position for wafer grinding;

[0029] moving the movable guard to the second position for rotating the rotary table to switch the wafer station.

[0030] In the method as described above, optionally, the grinding station comprises a rough grinding station and a fine grinding station, and when transferring the wafer from the loading and unloading station to the grinding station, the rotary table rotates clockwise so that the wafer sequentially enters the rough grinding station for rough grinding and enters the fine grinding station for fine grinding, and when returning the wafer from the grinding station to the loading and unloading station, the rotary table rotates counterclockwise so that the wafer directly returns to the loading and unloading station from the fine grinding station.

[0031] To achieve the foregoing object, a fifth aspect of the present application provides a data processing device, wherein the data processing device comprises:

[0032] a memory for storing computer executable instructions or computer programs;

[0033] a processor for controlling the wafer thinning device as described in the third aspect above to implement the method as described in any one of the fourth aspects above when executing the computer executable instructions or computer programs stored in the memory.

[0034] To achieve the foregoing object, a sixth aspect of the present application provides a computer readable storage medium, wherein the computer readable storage medium stores computer executable instructions or computer programs, and the computer executable instructions or computer programs control the wafer thinning device as described in the third aspect above to implement the method as described in any one of the fourth aspects above when executed by a processor.

[0035] The present application provides a guard device, a wafer grinding module, a thinning device and method, a data processing device and a storage medium, which can effectively reduce the contact or falling of grinding waste on the wafer surface when the wafer station is rotated and switched, thereby effectively reducing the pollution of the waste on the wafer surface. BRIEF DESCRIPTION OF DRAWINGS

[0036] The disclosure of the present application will become more apparent from the following description in conjunction with the accompanying drawings. It should be understood that the drawings are only for the purpose of illustration and are not intended to limit the scope of protection of the present application. In the drawings:

[0037] Figure 1 a schematic view of one embodiment of a wafer grinding module according to the present application;

[0038] Figure 2 a top view schematic view of another embodiment of a wafer grinding module according to the present application;

[0039] Figure 3 For Figure 2 A perspective view of the wafer grinding module, wherein the protective device of the rotary table is also shown;

[0040] Figure 4 For Figure 2 A sectional view of the wafer grinding module along A-A, wherein the movable protective member falls into the flow guide groove;

[0041] Figure 5 For Figure 2 A sectional view of the wafer grinding module along A-A, wherein the movable protective member exits the flow guide groove;

[0042] Figure 6 A schematic view of a wafer thinning apparatus;

[0043] Figure 7 A flowchart of an embodiment of a method for processing a wafer using the wafer thinning apparatus according to the present application; and

[0044] Figure 8 A schematic view of the working process of the rotary table of the wafer thinning apparatus according to an embodiment of the present application.

[0045] Reference signs : 1 - protective device; 2 - wafer grinding module; 3 - rotary table; 4 - separation flow guide strip; 5 - flow guide groove; 6 - fixed protective member; 7 - movable protective member; 8 - lifting plate; 9 - lifting cylinder; 10 - linear guide rail; 11 - loading and unloading station; 12 - rough grinding station; 13 - fine grinding station; 14 - cover; 15 - mounting surface; 16 - outer rigid stopper; 17 - inner soft stopper; 18 - top section; 19 - side section; 20 - bottom section; 21 - wafer mounting chuck; 22 - downward guide; 23 - protective plate; 100 - wafer thinning apparatus; 101 - rough grinding station; 102 - first waterproof curtain; 103 - loading and unloading station; 104 - fine grinding station; 105 - second waterproof curtain; 106 - rotary table; I - first position of the protective device; II - second position of the protective device; III - third position of the protective device; a - first wafer; b - second wafer; c - third wafer; d - fourth wafer; e - fifth wafer. DETAILED DESCRIPTION

[0046] With reference to the drawings and specific embodiments, the structure, composition, features and advantages of the protective device, wafer grinding module, thinning apparatus and method, data processing apparatus and storage medium of the present application will be described below in an exemplary manner, however, all the descriptions shall not be used to form any limitation on the present application.

[0047] For any individual technical feature described or implied in the embodiments mentioned herein, or any individual technical feature shown or implied in the drawings, the present application still allows any combination or deletion to be made between these technical features (or their equivalents) without any technical obstacles, so that more embodiments according to the present application should be considered to be within the scope of the description herein.

[0048] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features.

[0049] Figure 1 Schematic diagram of an embodiment of a wafer grinding module according to the present application.

[0050] According to the illustration, the wafer grinding module includes a rotary table 106, a loading and unloading station 103, a rough grinding station 101, and a fine grinding station 104. The first water curtain 102 and the second water curtain 105 between the stations are also shown in the figure. The first water curtain 102 and the second water curtain 105 can be water curtains made of soft material. In order to prevent waste and waste liquid from flowing out of the gap, the water curtain can be lowered so that its bottom is tightly attached to the water collecting pan; when the wafer carrier table takes the wafer out of the grinding area, the soft water curtain can be raised so that the inner wall of the water curtain effectively reduces the risk of contact with the upper surface of the wafer, reducing the risk of impurities such as waste on the water curtain falling onto the wafer surface. Therefore, after a long time of grinding, the contaminants on the inner wall of the water curtain do not have the risk of damaging the wafer surface when the station is switched.

[0051] Figure 2 Schematic top view of another embodiment of a wafer grinding module according to the present application.

[0052] As can be seen from Figure 2 The wafer grinding module 2 of this embodiment can at least include the following parts, i.e. a rotary table 3, a protective device 1, and a cover 14 that isolates the grinding station from the outside to prevent waste liquid and waste from splashing into the external environment.

[0053] The rotary table 3 can rotate to rotate the wafer between multiple stations. When grinding work is performed, the rotary table 3 rotates so that the wafer to be ground is transferred between the loading and unloading station 11 and each grinding station through the protective device 1. The left grinding station in the illustrated example can be a rough grinding station 12, and the right grinding station can be a fine grinding station 13.

[0054] According to the illustrated example, during the wafer grinding operation, each rotation cycle of the rotary table 3 can make the wafer rotate in the order of: the loading and unloading station 11 - the rough grinding station 12 - the fine grinding station 13 in clockwise direction, and then make the wafer rotate in the order of: the loading and unloading station 11 - the rough grinding station 12 - the fine grinding station 13 in counterclockwise direction. The whole rotation process is designed compactly, which is beneficial to improve the efficiency of wafer grinding, and can be automatically controlled to reduce manual operation intervention and reduce the risk of quality fluctuation caused by human factors, thereby ensuring the consistency and reliability of wafer processing.

[0055] In Figure 2 In the illustrated embodiment, the rotary table 3 is circular as a whole. The radial partitioning flow guide strips 4 on the rotary table 3 uniformly divide the rotary table 3 into three fan-shaped areas, each of which can be at a different process position, i.e., one loading and unloading station 11 and two grinding stations, which can be a rough grinding station 12 and a fine grinding station 13, respectively. The partitioning flow guide strips 4 are protruded from the surface of the rotary table 3 and extend radially. It should be understood that, in alternative embodiments, the rotary table 3 can also be divided into other number of uniform fan-shaped areas by other number of radial partitioning flow guide strips, such as but not limited to four, five, etc.

[0056] As shown in the figure, the center lines of the one loading and unloading station 11 and the two grinding stations and the center of the rotary table 3 form an angle of 120° with each other, thereby ensuring the balanced distribution and seamless connection between the stations. A wafer mounting chuck 21 can be mounted on each station for keeping the wafer stable and rotating together, which can prevent the wafer from displacement or damage due to vibration or high-speed rotation. For example, the wafer mounting chuck 21 can be a porous ceramic chuck that uses vacuum to adsorb the wafer.

[0057] In the illustrated example, a protective device 1 can be mounted on both sides of the loading and unloading station 11 and each of the grinding stations. When the rotary table 3 makes the wafer at each station, the protective device 1 aligns with the flow guide groove 5 on the partitioning flow guide strip 4, which can guide the waste liquid, waste chips, etc. to the flow guide groove 5 and then flow into the water collecting tray (not shown) under the rotary table. In Figure 2 The protective devices between the two grinding stations and the loading and unloading station 11 are clearly shown in the figure. In addition, a protective device can also be provided between the two grinding stations, which is not shown in the figure because it is covered in the cover 14.

[0058] In addition, from Figure 2It can also be seen that, in this embodiment, the protective device 1 may include a fixed protective member 6 and a movable protective member 7, which can be spliced ​​together to form a splash-proof surface. A lifting cylinder 9 is used to drive the movable protective member 7 to rise and fall, and a linear guide rail 10 guides the rise and fall of the movable protective member 7. In this example, the fixed protective member 6 can be fixed to the housing 14 and located on the outer side of the rotary table 3 to prevent waste liquid from splashing from the grinding station into the external environment; the movable protective member 7 can have a radial dimension matching the radius of the rotary table 3, thereby providing protection over the entire radius range of the rotary table 3 and allowing the rotary table 3 to rotate.

[0059] During wafer grinding, the movable protective member 7 can be positioned aligned with the guide groove 5 on the partition guide bar 4. The movable protective member 7 can be configured such that, when the wafer is at any station, the movable protective member 7 can be positioned above the partition guide bar 4 and is adapted to guide the waste liquid contaminated with the movable protective member 7 to the guide groove 5. At the same time, the guide groove 5 is adapted to guide the waste liquid radially outward along the rotary table 3 into the collection tray.

[0060] Additionally, this illustrated example also shows that setting... Figure 2 The grinding station on the left is the rough grinding station 12, and the grinding station on the right is the fine grinding station 13. Therefore, during the wafer grinding process, the grinding rotary table 3 needs to rotate three times to switch between different stations for each wafer. Even if the wafer starts at the loading / unloading station 11, rotates clockwise sequentially to the rough grinding station 12 and then the fine grinding station 13, and finally returns counterclockwise to the loading / unloading station 11 to replace the new wafer to be processed. During this rotary grinding process, although a large amount of grinding debris is generated and splashes onto the inner walls of the cavity formed by the housing 14, the protective device 1 prevents the debris and coolant from splashing or spreading to adjacent stations at each processing position, and guides the waste liquid radially outward to collect in the water collection tray, effectively reducing contamination or scratching of the ground wafer.

[0061] Furthermore, in Figure 2 In the example shown, a single set of protective devices or two independent sets of protective devices may be included on both sides of the fan-shaped area where the loading and unloading station 11 is located, so that the lifting and lowering of the movable protective component 7 can be controlled individually or designed to be controlled uniformly.

[0062] For example, in Figure 2 In the diagram, the lifting plates 8 and movable protective parts 7 on the left and right sides of the protective device can be operated synchronously as a whole. The two lifting cylinders 9 in the diagram operate the lifting plates 8 and movable protective parts 7 on both sides of the whole at the same time. The four linear guide rails 10 on the left and right sides guide the lifting of the lifting plates 8 and movable protective parts 7, so as to realize the synchronous left and right movement of the protective device through mechanical means.

[0063] For example, inFigure 3 In the embodiment, the left and right lifting plates 8 and the movable guard 7 of the guard device can be independently operated. In the embodiment, two lifting cylinders 9 are provided to synchronously operate the two independently operated lifting plates 8 and the movable guard 7. The left and right guard devices are synchronously operated by control.

[0064] Figure 2 For Figure 4 In the embodiment, the left and right lifting plates 8 and the movable guard 7 of the guard device can be independently operated. In the embodiment, two lifting cylinders 9 are provided to synchronously operate the two independently operated lifting plates 8 and the movable guard 7. The left and right guard devices are synchronously operated by control.

[0065] As shown in the figure, the wafer grinding module further comprises a cover 14. In the embodiment, the guard device 1 can comprise the cover 14 surrounding the grinding stations. The cover 14 provides a working space for the grinding and thinning of the wafer, effectively reducing the splashing of waste liquid and waste chips. In addition, the bottom of the cover 14 is open, allowing the waste liquid to be collected into the water collecting tray below the rotary table 3, facilitating centralized treatment and recycling. It can be understood that the stations of the wafer grinding module also include loading and unloading stations 11 and a plurality of grinding stations.

[0066] As shown in the figure, the wafer grinding module 2 comprises a circular rotary table 3. The surface of the rotary table 3 can be divided into a plurality of uniform sectors by raised radial partitioning flow guide strips 4. The top surface of the partitioning flow guide strips 4 can be provided with flow guide grooves 5 having radially outer end openings. The rotary table 3 can drive the wafer to rotate between the stations, and the cover 14 and the guard device 1 do not rotate with the rotary table 3.

[0067] In the embodiment, the movable guard 7 can comprise a guard plate 23, which can be made of a corrosion-resistant material. When the wafer is being ground, the lower end of the guard plate 23 can be lowered into the flow guide grooves 5 of the partitioning flow guide strips 4, so that the guard plate 23 forms a barrier together with the partitioning flow guide strips 4. When the rotary table 3 is rotating, the lower end of the guard plate 23 can be raised above the partitioning flow guide strips 4, so as to allow the rotary table 3 to rotate without being hindered by the guard plate 23 in the flow guide grooves 5. The bottom surface of the guard plate 23 can have a slope gradually decreasing radially outward, so that the splashed waste liquid can flow outward along the bottom surface and fall into the water collecting tray, without accidentally falling into the radius area of the rotary table 3 to contaminate the wafer.

[0068] As shown in the figure, the cover 14 has a vertical mounting surface 15 for mounting the guard plate 23. The mounting surface 15 can be located between the loading and unloading stations 11 and the grinding stations and / or between adjacent grinding stations. The mounting surface 15 is provided with a lifting cylinder 9 and a linear guide rail 10, and the guard plate 23 can be controlled by the lifting cylinder 9 to rise and fall along the linear guide rail 10, in and out of the flow guide grooves 5 on the partitioning flow guide strips 4.

[0069] As shown in the figure, in the illustrated example, two linear guides 10 are provided at the mounting surface 15, and a lifting cylinder 9 is provided between the two linear guides 10. The linear guides 10 are vertically arranged at the mounting surface 15. In this way, the mounting surface 15 is more stable when it is lifted and lowered under the guidance of the two linear guides 10, and tilting failure caused by unbalanced torque can be avoided. In alternative embodiments, other numbers of linear guides can be used as needed.

[0070] The fixed guard 6 is also shown in the figure. As shown in the figure, the fixed guard 6 can be a plate, which includes an outer rigid baffle 16 and an inner soft baffle 17. The outer periphery of the inner soft baffle 17 can be spliced with the inner periphery of the outer rigid baffle 16, and the outer rigid baffle 16 and the inner soft baffle 17 are used to prevent circumferential splashing of the waste liquid. The outer rigid baffle 16 and the inner soft baffle 17 are optionally located in the same plane. A gap can be left between the inner soft baffle 17 and the side of the rotary table 3 to avoid contamination of the rotary table 3 and scratching that affects the grinding process. In order to provide a wider operating space at the loading and unloading station 11, the fixed guard 6 is arranged at an angle to the movable guard 7 in the radial direction, and is overall turned back towards the grinding station. Specifically, in this example, the extension direction of the fixed guard 6 is perpendicular to the radius of the rotary table 3 passing through the loading and unloading station 11, which expands the operable space of the loading and unloading station 11 and its periphery.

[0071] In the illustrated example, in order to further improve the splashing prevention effect, the outer rigid baffle 16 is also optionally formed integrally with the mounting surface 15 of the cover 14, avoiding the formation of a gap therebetween and gradual detachment due to vibration, and reducing the risk of failure.

[0072] As can be seen from the figure, the outer rigid baffle 16 can include a top section 18 laterally aligned with the mounting surface 15, a side section 19 located radially outward of the movable guard 7 and the rotary table 3, and a bottom section 20 extending radially inward below the rotary table 3, which are respectively used to form protection above, laterally and below the rotary table 3. In alternative embodiments, the top section 18, the side section 19 and the bottom section 20 can be integrally formed. In this example, the top section 18, the side section 19 and the bottom section 20 are in the same plane, which is convenient for processing and aesthetically pleasing.

[0073] As shown in the figure, according to this embodiment, corresponding to the movable guard 7 of the guard device 1, the lifting cylinder 9 is located at the top of the entire device, can be fixed at the edge of the top surface of the cover 14, and can push the up-and-down movement of the lifting plate 8 to adjust the height of the following guard plate 23. The lifting plate 8 can be fixed to the top end of the guard plate 23, and the guard plate 23 follows the lifting plate 8. The lifting plate 8 is controlled by the lifting cylinder 9 and can be lifted along the linear guide rail 10

[0074] In this example, two linear guide rails 10 are shown, which are fixed at the mounting surface 15 of the cover 14. The two linear guide rails 10 can be symmetrically located on the left and right sides of the lifting cylinder 9, respectively. The linear guide rail 10 can be composed of a linear rail-sliding block assembly, which is composed of a linear rail and a sliding block. The sliding block can slide on the linear rail, and the linear rail is fixed on the mounting surface 15 of the cover 14, while the sliding block is connected to the push rod of the lifting cylinder 9 on one side and to the lifting plate 8 on the other side, realizing the driving of the lifting plate 8 by the lifting cylinder 9. In this example, two sets of linear rail-sliding block assemblies are used, which work together to ensure the smooth movement of the lifting plate during the lifting and lowering process.

[0075] Figure 2 For Figure 5 A cross-sectional view of the wafer grinding module along A-A, in which the movable guard falls into the flow guide groove.

[0076] Figure 2 For Figure 4 A cross-sectional view of the wafer grinding module along A-A, in which the movable guard exits the flow guide groove. These two figures clearly illustrate how the guard device dynamically adjusts during the grinding process to ensure the cleanliness, safety, and grinding efficiency of the wafer at the same time.

[0077] When the wafer is being ground at the grinding station, such as the rough grinding station 12 or the fine grinding station 13, the guard device 1 moves as shown in the figure Figure 5 The lifting plate 8 and the guard plate 23 move to the first position shown in the figure, where the movable guard 7 can prevent the splashing of waste liquid. Specifically, in this first position, the lifting cylinder 9 is activated and drives the lifting plate 8 to descend, which in turn drives the following movable guard 7 to move downward synchronously, and the movable guard 7 finally descends to a position inside the flow guide groove 5 of the radial separation flow guide strip 4 on the surface of the rotary table 3, cooperating with the flow guide groove 5 arranged on the radial separation flow guide strip 4. This design enables the movable guard 7 to cooperate with the separation flow guide strip 4 to form a stable and continuous barrier in the radial direction between different stations, preventing the waste chips and liquid generated during grinding from splashing out of the grinding station area, thereby protecting the cleanliness of the wafer and the working environment.

[0078] However, when the wafer needs to switch workstations, the rotary table 3 needs to rotate to position itself for the next process. At this time, to allow sufficient space for the rotation of the rotary table 3, the movable protective component 7 needs to be adjusted accordingly. At this time, the protective device 1... Figure 4 As shown, the lifting plate 8 and the protective plate 23 are in the second position, where the movable protective member 7 allows the rotary table 3 to rotate. Specifically, the lifting cylinder 9 is activated and drives the lifting plate 8 to rise. The lifting plate 8 drives the movable protective member 7 to move upward synchronously. The movable protective member 7 is eventually lifted to a higher position, exits from the guide channel 5, and creates a gap between the movable protective member 7 and the separating guide bar 4, allowing the rotary table 3 to rotate. In this way, by lifting the movable protective member 7 to the second position shown in the figure, a certain safe distance is maintained between the upper surface of the wafer and the movable protective member when the rotary table 3 rotates through. This not only ensures that no waste liquid or debris falls onto the wafer surface during station changes, but also avoids any potential damage to the wafer surface that may be caused by improper positioning of the movable protective member.

[0079] Through this dynamic adjustment mechanism, the movable protective component 7 can change its position in real time according to actual needs during the grinding process. This provides effective protection during grinding and ensures sufficient space when switching workstations, effectively reducing any damage to the wafer. This design not only improves the safety and reliability of the wafer grinding process but also optimizes the overall process flow, making the transfer of wafers between various workstations more efficient and orderly.

[0080] Figure 5 and Figure 4 The various structural components of the wafer grinding module are also shown more clearly in the image. Figure 5 and Figure 2 In the middle, refer to Figure 4 The AA sectioning location shown in the image can be understood; the left side of the image represents the wafer grinding station, and the right side represents the wafer protection device. Figure 5 and Figure 5 The cover 14, lifting cylinder 9, linear guide rail 10, lifting plate 8, protective plate 23, dividing guide strip 4, and the outer rigid baffle 16 and inner soft baffle 17 of the fixed protective component 6 can be seen more clearly.

[0081] During wafer grinding, the lower end of the protective plate 23 of the movable protective component 7 can be lowered into the guide groove 5. When the rotary table 3 is rotated, the lower end of the protective plate 23 can exit from the guide groove 5 and rise above the partition guide bar 4. Figure 4In the middle, the flow guide groove 5 is shown more clearly as the shield plate 23 exits the flow guide groove 5. As can be seen from the figure, the inner bottom surface of the flow guide groove 5 is gradually inclined radially outward, and the bottom end of the shield plate 23 is also inclined at the same angle as the inner bottom surface of the flow guide groove 5, so that the waste liquid can be discharged along the inner bottom surface of the flow guide groove 5 and the bottom end of the shield plate 23 to the outer periphery of the rotary table 3. As Figure 4 As shown in the middle, since the inner bottom surface of the flow guide groove 5 and the bottom end of the shield plate 23 are inclined at the same angle, when the shield plate 23 enters the flow guide groove 5, they can effectively cooperate in shape to prevent the waste liquid from splashing between the two workstations. Figure 5 And Figure 4 As also shown in the middle, the radial outer end of the flow guide groove 5 is also provided with a downward guide portion 22 located at the radial outer periphery of the rotary table 3, which is used to guide the waste liquid in the flow guide groove 5 into the water collecting tray, preventing the waste liquid from contaminating the rotary table 3.

[0082] Figure 5 And Figure 6 As also shown clearly in the middle, the fixed shield 6 is provided.

[0083] As can be seen from the figure, the inner soft side 17 is located on the inner side and fits the outer periphery of the rotary table 3 with a small gap, and can be made of soft and durable materials such as rubber or silicone. The function of the inner soft side 17 includes filling the gap between the outer rigid side 16 and the rotary table 3, preventing the cooling liquid and waste from leaking out of the gap, and the inner soft side 17 can also effectively reduce the re-splashing of the waste liquid splashed on it to the grinding area, thereby ensuring the cleanliness of the grinding area and preventing the grinding waste from damaging the surface of the wafer.

[0084] Correspondingly, the outer rigid side 16 is located at the outermost periphery of the entire shield device 1 and can be made of rigid metal materials. The function of the outer rigid side 16 includes providing rigid support for the inner soft side 17, and ensuring the stability and reliability of the entire shield device 1. The outer rigid side 16 and the inner soft side 17 together form a complete and effective closed structure. Because of the rigidity and stability of the outer rigid side 16, the rigidity and closure of the entire shield device 1 are enhanced, which can effectively prevent the splashing of waste and waste liquid even during high-speed rotation of the rotating parts at the grinding station and during the grinding process. It can be understood that this double-layer protection design combines the advantages of softness and rigidity, which is flexible and firm, and is an important guarantee for ensuring the efficient operation of the grinding process.

[0085] Figure 6 A schematic view of a wafer thinning device.

[0086] As Figure 1As shown in the figure, the wafer thinning apparatus 100 can include an equipment front end module (EFEM module), a chemical mechanical polishing and cleaning module (CMP and cleaning module), and a grinding module.

[0087] Specifically, in the illustrated example, the equipment front end module can be arranged at the front end of the wafer thinning apparatus, for conveying wafers from the outside to the inside of the apparatus machine, achieving "dry-in dry-out" of the wafers; the grinding module can be arranged at the end of the wafer thinning apparatus, including a loading and unloading station, a rough grinding station, and a fine grinding station (see Figure 2 and Figure 6 ), for grinding the wafers. The chemical mechanical polishing and cleaning module can be arranged between the equipment front end module and the grinding module, for chemical mechanical polishing of the ground wafers; this module also has the function of transporting wafers between the equipment front end module, the grinding module, and the chemical mechanical polishing and cleaning module.

[0088] In Figures 2 to 5 , the positions for installing the protective devices are also schematically shown, for example, including a first position I of the protective device, a second position II of the protective device, and a third position III of the protective device. In this example, the first position I and the third position III are protective devices between the loading and unloading station and the grinding station, and the second position II is a protective device between the two grinding stations. The specific composition and structure of these protective devices can be found in the description in conjunction with Figure 6 The surface of the rotary table of the grinding module of the wafer thinning apparatus can be divided into multiple uniform sector regions by raised radial partitioning flow guide strips, and the top surface of the partitioning flow guide strips can be provided with flow guide grooves with radially outer end openings. When the wafer is in the grinding station, the movable protective member of each protective device is aligned with the flow guide grooves of the partitioning flow guide strips and can be lowered into the flow guide grooves to shield the splashing of waste liquid between the sectors; when the rotary table rotates, the movable protective member of each protective device exits from the flow guide grooves, allowing the rotary table to rotate, so that the wafer switches stations.

[0089] It should be noted that the Figure 7 shown is only one embodiment of the wafer thinning apparatus 100; in alternative embodiments, the wafer thinning apparatus 100 can have an equipment front end module, a chemical mechanical polishing and cleaning module, and a grinding module arranged in other forms, without being limited to the illustrated embodiments.

[0090] Figure 2 A flowchart of one embodiment of a method for processing wafers using the wafer thinning apparatus according to the present application is shown. As can be seen from the figure, the method can include the following steps.

[0091] In order to process the wafer, the wafer first needs to be loaded onto the rotary table at the loading and unloading station. As Figure 2In the embodiment shown in FIG. 1, the loading and unloading station 11 is used for loading and unloading the wafers to be processed. It can be understood that the loading and unloading can occur during the grinding at the grinding station, at which time the rotary table stops rotating, the movable guard blocks the splashing of the waste liquid at the grinding station, and the wafer is adapted to be loaded onto the rotary table and unloaded from the rotary table.

[0092] After the wafer is loaded onto the rotary table, the movable guard can be moved to a second position, as shown in FIG. 2, which can be the raised position of the movable guard 7, at which time the rotary table can be rotated to transfer the wafer to the grinding station. Figure 4 Figure 4 In the embodiment shown in FIG. 1, the loading and unloading station 11 is used for loading and unloading the wafers to be processed. It can be understood that the loading and unloading can occur during the grinding at the grinding station, at which time the rotary table stops rotating, the movable guard blocks the splashing of the waste liquid at the grinding station, and the wafer is adapted to be loaded onto the rotary table and unloaded from the rotary table. Figure 2 After the wafer is loaded onto the rotary table, the movable guard can be moved to a second position, as shown in FIG. 2, which can be the raised position of the movable guard 7, at which time the rotary table can be rotated to transfer the wafer to the grinding station.

[0093] Figure 5 In the embodiment shown in FIG. 1, the loading and unloading station 11 is used for loading and unloading the wafers to be processed. It can be understood that the loading and unloading can occur during the grinding at the grinding station, at which time the rotary table stops rotating, the movable guard blocks the splashing of the waste liquid at the grinding station, and the wafer is adapted to be loaded onto the rotary table and unloaded from the rotary table. Figure 4 After the wafer is loaded onto the rotary table, the movable guard can be moved to a second position, as shown in FIG. 2, which can be the raised position of the movable guard 7, at which time the rotary table can be rotated to transfer the wafer to the grinding station.

[0094] Figure 2 In the embodiment shown in FIG. 1, the loading and unloading station 11 is used for loading and unloading the wafers to be processed. It can be understood that the loading and unloading can occur during the grinding at the grinding station, at which time the rotary table stops rotating, the movable guard blocks the splashing of the waste liquid at the grinding station, and the wafer is adapted to be loaded onto the rotary table and unloaded from the rotary table.

[0095] As shown in FIG. 1, the grinding station can include a rough grinding station 12 and a fine grinding station 13. When the wafer is transferred from the loading and unloading station 11 to the grinding station, the rotary table 3 can be rotated clockwise so that the wafer is sequentially subjected to rough grinding at the rough grinding station 12 and fine grinding at the fine grinding station 13. When returning from the grinding station to the loading and unloading station 11, the rotary table 3 can be rotated counterclockwise so that the wafer directly returns to the loading and unloading station 11 from the fine grinding station 13. Figure 8

[0096] Figure 8 ​​​​Fig. 1 is a schematic diagram of the working process of the rotary table of the wafer thinning apparatus according to an embodiment of the present application. In the figure, it is shown in detail how the rotary table rotates to switch the wafer transfer station for processing the wafers and loading / unloading the wafers.

[0097] Specifically, first, as shown in (i) of Fig. 2, a first wafer a is loaded to the rotary table at the loading / unloading station of the wafer grinding module. Second, as shown in (ii) of Fig. 2, the rotary table is rotated clockwise to transfer the first wafer a to the rough grinding station, and a second wafer b is loaded to the loading / unloading station. Third, as shown in (iii) of Fig. 2, the rotary table is rotated clockwise to transfer the first wafer a to the fine grinding station, and a third wafer c is loaded to the loading / unloading station. Fourth, as shown in (iv) of Fig. 2, the rotary table is rotated counterclockwise to transfer the first wafer a to the loading / unloading station, and a fourth wafer d is loaded to the loading / unloading station. Finally, as shown in (v) of Fig. 2, the rotary table is rotated clockwise to transfer the second wafer b to the loading / unloading station, and a fifth wafer e is loaded to the loading / unloading station. Figure 8 Figure 8 Figure 8 Figure 8 ​

[0098] The method flow realizes continuous and efficient processing of the wafers by alternating use of the loading / unloading station, the rough grinding station and the fine grinding station. In this way, the smooth flow of the wafers between the stations is ensured, and the efficiency of the grinding apparatus is fully utilized.

[0099] In still another aspect, the present application provides a data processing apparatus. The data processing apparatus can include a memory for storing computer executable instructions or computer programs, and a processor for controlling the wafer thinning apparatus as in the foregoing embodiments to implement the method as in the foregoing embodiments when executing the computer executable instructions or computer programs stored in the memory. The data processing apparatus can be, for example, a central processing unit, which can perform various appropriate actions and processes according to programs stored in a read-only memory (ROM) or loaded from a storage device into a random access memory (RAM). Various programs and data required for operation of the data processing apparatus can also be stored in the RAM. The data processing apparatus, the ROM and the RAM can be connected to each other through a bus. An input / output (I / O) interface is also connected to the bus.​​​​​

[0100] Yet another aspect of the present application also provides a computer readable storage medium. The computer readable storage medium can store computer executable instructions or computer programs, which, when executed by a processor, control a wafer thinning apparatus as in the foregoing embodiments to implement a method as in the foregoing embodiments.

[0101] In particular, according to embodiments of the present application, the method process can be implemented as a computer software program. For example, embodiments of the present application can include a computer program product comprising a computer program carried on a non-transitory computer readable storage medium, the computer program comprising program code for executing the method of the present application. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device, or installed from a ROM. When the computer program is executed by a processing device, the above-mentioned functions defined in the method of the embodiments of the present application are performed.

[0102] It should be noted that the computer readable storage medium of the present application described above can be, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination of the above. More specific examples of the computer readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, the computer readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or apparatus.

[0103] The computer readable storage medium described above can be contained in the data processing device described above; or can exist separately and not be assembled into the data processing device.

[0104] The technical scope of the present application is not limited to the above description, and those skilled in the art can make various modifications and improvements to the above embodiments without departing from the technical idea of the present application, and these modifications and improvements should all be within the scope of the present application.

Claims

1. A protective device (1) for a wafer grinding module (2) of a wafer thinning equipment (100), the wafer grinding module (2) having a rotary table (3) capable of rotating the wafer between multiple workstations, characterized in that, The protective device (1) includes: A dividing guide bar (4) protrudes from the surface of the rotary table (3) and extends radially to divide the rotary table (3) into multiple fan-shaped areas. The top surface of the dividing guide bar (4) has a guide groove (5) with a radially outward opening. A movable protective member (7) has a radial dimension matching the radius of the rotary table (3). The movable protective member (7) is positioned above the partition guide bar (4). During wafer grinding, the movable protective member (7) can move to a first position to prevent waste liquid from splashing. When the rotary table (3) is rotated, the movable protective member (7) can move to a second position to allow the rotary table (3) to rotate. The movable protective member (7) includes a protective plate (23). During wafer grinding, the lower end of the protective plate (23) is lowered into the guide groove (5). When the rotary table (3) is rotated, the lower end of the protective plate (23) is raised above the partition guide bar (4).

2. The protective device (1) as described in claim 1, characterized in that, The workstation includes a loading / unloading workstation (11) and a plurality of grinding workstations. The protective device (1) includes a cover (14) surrounding the grinding workstation. The cover (14) has a vertical mounting surface (15) for mounting the movable protective member (7). The mounting surface (15) is located between the loading / unloading workstation (11) and the grinding workstations and / or between adjacent grinding workstations.

3. The protective device (1) as described in claim 2, characterized in that, The bottom of the cover (14) is open, allowing waste liquid to flow into the collection tray below the rotary table (3).

4. The protective device (1) as described in claim 2, characterized in that, A lifting cylinder (9) and a linear guide rail (10) are provided at the mounting surface (15), and the movable protective component (7) can be raised and lowered along the linear guide rail (10) under the control of the lifting cylinder (9).

5. The protective device (1) as described in claim 4, characterized in that, Two linear guides (10) and one lifting cylinder (9) are provided at the mounting surface (15), and the linear guides (10) are symmetrically arranged on both sides of the lifting cylinder (9).

6. The protective device (1) as described in claim 4, characterized in that, The lifting cylinder (9) is connected to a controller, which is responsible for receiving instructions and driving the lifting cylinder (9) to perform corresponding actions through electrical signals.

7. The protective device (1) as described in claim 1, characterized in that, The protective plate (23) is made of corrosion-resistant material.

8. The protective device (1) as described in claim 1, characterized in that, The bottom surface of the guide channel (5) gradually slopes downwards radially outwards, and the bottom end of the protective plate (23) is inclined at the same angle as the bottom surface of the guide channel (5).

9. The protective device (1) as described in claim 1, characterized in that, The movable protective component (7) further includes a lifting plate (8), which is fixed to the top of the protective plate (23). The protective plate (23) and the lifting plate (8) move together. The lifting plate (8) is controlled by a lifting cylinder (9) and can move up and down along the linear guide rail (10).

10. The protective device (1) as described in claim 2, characterized in that, The protective device (1) further includes a fixed protective member (6) fixed to the cover (14), the fixed protective member (6) being disposed on the outer side of the rotary table (3) to prevent waste liquid from splashing out.

11. The protective device (1) as described in claim 10, characterized in that, The fixed protective component (6) includes an outer rigid baffle (16) and an inner soft baffle (17). The outer periphery of the inner soft baffle (17) is spliced ​​with the inner periphery of the outer rigid baffle (16). The outer rigid baffle (16) and the inner soft baffle (17) are used to prevent circumferential splashing of waste liquid. A gap is left between the inner soft baffle (17) and the side of the rotary table (3).

12. The protective device (1) as described in claim 11, characterized in that, The outer rigid guard (16) is integrally formed with the mounting surface (15) of the cover (14), and the outer rigid guard (16) includes a top section (18) laterally aligned with the mounting surface (15), a side section (19) located on the radial outer periphery of the movable guard (7) and the rotary table (3), and a bottom section (20) extending radially inward below the rotary table (3), the top section (18), the side section (19) and the bottom section (20) being integrally formed.

13. The protective device (1) as described in claim 11, characterized in that, The fixed protective component (6) and the movable protective component (7) are spliced ​​together to form a splash-proof surface, and the fixed protective component (6) is located outside the movable protective component (7).

14. The protective device (1) as described in claim 11, characterized in that, The outer rigid guard (16) is made of rigid metal, and the inner soft guard (17) is made of corrosion-resistant rubber or silicone.

15. A wafer grinding module (2) for a wafer thinning apparatus (100), characterized in that, The wafer grinding module (2) has a rotary table (3) that enables the wafer to rotate between multiple workstations, and the wafer grinding module (2) has a protective device (1) as described in any one of claims 1 to 14.

16. The wafer grinding module (2) as described in claim 15, characterized in that, The radial outer end opening has a downward guide portion (22), which is located on the radial outer periphery of the rotary table (3) to prevent waste liquid from contaminating the rotary table (3).

17. A wafer thinning apparatus (100), characterized in that, The wafer thinning apparatus (100) has a wafer grinding module (2) as described in claim 15 or 16.

18. A method for processing a wafer using the wafer thinning apparatus (100) as described in claim 17, characterized in that, The method includes the following steps: The wafer is loaded onto the rotary table (3) at the loading and unloading station (11). Move the movable protective member (7) to the second position and rotate the rotary table (3) to transfer the wafer to the grinding station; Move the movable protective component (7) to the first position and perform wafer grinding; Move the movable protective component (7) to the second position and rotate the rotary table (3) to perform a workstation change on the wafer.

19. The method as described in claim 18, characterized in that, The grinding station includes a rough grinding station and a fine grinding station. When transferring the wafer from the loading / unloading station to the grinding station, the rotary table rotates clockwise so that the wafer sequentially enters the rough grinding station for rough grinding and then enters the fine grinding station for fine grinding. When returning the wafer from the grinding station to the loading / unloading station, the rotary table rotates counterclockwise so that the wafer directly returns from the fine grinding station to the loading / unloading station.

20. A data processing device, characterized in that, The data processing device includes: The memory is used to store computer-executable instructions or computer programs; A processor, when executing computer-executable instructions or computer programs stored in the memory, controls the wafer thinning apparatus (100) as described in claim 17 to implement the method as described in claim 18 or 19.

21. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions or computer programs that, when executed by a processor, control the wafer thinning apparatus (100) as described in claim 17 to implement the method as described in claim 18 or 19.

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