Liquid ejecting head and liquid ejecting apparatus

Abstract

The invention provides a liquid ejecting head and a liquid ejecting apparatus capable of suppressing reduction of printing quality. The liquid ejecting head includes: four or more head chips arranged in a staggered shape along a first direction; and a support member that supports the plurality of head chips, the plurality of head chips being disposed so as to have an overlapping region in which a portion of the nozzle formation region of one of the adjacent head chips overlaps a portion of the nozzle formation region of the other head chip when viewed in a second direction orthogonal to the first direction, and the overlapping region being a region in which a portion of the nozzle formation region of the other head chip overlaps a portion of the nozzle formation region of the other head chip when viewed in the second direction orthogonal to the first direction. The plurality of overlapping regions include a first overlapping region and a second overlapping region, the second overlapping region being farther than the first overlapping region with respect to a center position in the first direction of all nozzle forming regions constituted by all the nozzle forming regions of the plurality of head chips, and the second overlapping region being located between the first overlapping region and the second overlapping region in the first direction. The first overlap region is larger than the second overlap region.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejecting head and a liquid ejecting device. Background Art

[0002] Conventionally, there has been proposed a liquid ejecting apparatus including a liquid ejecting head for ejecting liquid such as ink onto a medium such as printing paper.

[0003] The liquid jet head described in Patent Document 1 includes a plurality of head chips arranged in a zigzag pattern, a fixing plate, and a housing member. The plurality of head chips are accommodated and supported in a space formed by the fixing plate and the housing member.

[0004] In the liquid jet head described in Patent Document 1, adjacent head chips among a plurality of head chips have overlapping regions that overlap each other. In the document, a plurality of head chips are arranged in a staggered manner, and a plurality of overlapping regions exist. In a liquid jet head having a plurality of overlapping regions, the size of each overlapping region has not been fully studied in the past.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-489 Summary of the invention

[0006] A liquid jet head involved in one embodiment of the present invention comprises: a plurality of head chips, which are four or more and are arranged in a staggered manner along a first direction; a supporting member, which supports the plurality of head chips, the plurality of head chips being arranged to have an overlapping area in which a portion of a nozzle forming area of ​​one of the adjacent head chips overlaps a portion of a nozzle forming area of ​​the other head chip when viewed in a second direction orthogonal to the first direction, the plurality of overlapping areas including a first overlapping area and a second overlapping area, the second overlapping area being farther away from the first overlapping area relative to the center position in the first direction of all nozzle forming areas constituted by all nozzle forming areas of the plurality of head chips than the first overlapping area, and the first overlapping area is larger than the second overlapping area in the first direction.

[0007] A liquid ejecting device according to one aspect of the present disclosure includes: a liquid ejecting head that ejects liquid onto a medium; and a transport unit that transports the medium.

[0008] A liquid injection device involved in one embodiment of the present disclosure comprises: a liquid injection head, wherein the plurality of overlapping areas include a third overlapping area that is smaller in size than the first overlapping area in the first direction, the second overlapping area is arranged between the first overlapping area and the third overlapping area in the first direction, the supporting part has a cutout between the second overlapping area and the third overlapping area, and the liquid injection head sprays liquid onto a medium; and a suppression portion that suppresses the floating of the medium, and the suppression portion is arranged at the cutout. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram showing a configuration example of the liquid ejecting device according to the first embodiment.

[0010] Figure 2 for Figure 1 A perspective exploded view of a liquid ejecting head is shown.

[0011] Figure 3 for Figure 2 Cross-sectional view along line aa in FIG.

[0012] Figure 4 It is a top view of the liquid ejecting head according to the first embodiment.

[0013] Figure 5 for Figure 4 AA line section view in.

[0014] Figure 6 This is a schematic diagram of the bottom surface of the liquid ejecting head according to the first embodiment.

[0015] Figure 7 It is a bottom view of the liquid ejecting head according to the first embodiment.

[0016] Figure 8 This is a diagram illustrating the flow of airflow in a plurality of head chips.

[0017] Fig. 9 It is a bottom view of the liquid ejecting head of the comparative example.

[0018] Fig.10 This is a diagram for explaining the landing of ink droplets in the second overlapping area.

[0019] Fig.11 This is a diagram for explaining the landing of ink droplets in the first overlapping area.

[0020] Fig.12 for Figure 5 A perspective view of a portion of a support member is shown.

[0021] Fig.13 To be removed Fig.12 Figure 2 shows a diagram of a fixing plate of a support member.

[0022] Fig.14 for Fig.13 A bottom view of the support member is shown.

[0023] Fig.15 A bottom view of a frame portion of another example.

[0024] Fig.16 This is a diagram showing the number of overlaps of nozzles that eject ink droplets in the second overlap region.

[0025] Fig.17 This is a diagram showing the number of overlaps of nozzles that eject ink droplets in the first overlap region.

[0026] Fig.18 It is a bottom view of the liquid ejecting head of the first modified example.

[0027] Fig.19 It is a bottom view of the liquid ejecting head of the second modified example.

[0028] Fig. 20 It is a bottom view of the liquid ejecting head of the third modified example.

[0029] Fig.21 This is a diagram for explaining the landing of ink droplets when there is no influence of airflow.

[0030] Fig. 22 This is a diagram for explaining the landing of ink droplets when affected by airflow. DETAILED DESCRIPTION

[0031] Hereinafter, preferred embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, in the accompanying drawings, the dimensions and scales of each part are appropriately different from the actual ones, and there are also parts that are shown in a schematic manner for easy understanding. In addition, as long as there is no record of the subject matter of the present disclosure that specifically limits the present disclosure in the following description, the scope of the present disclosure is not limited to these methods.

[0032] In addition, in the following description, the X-axis, Y-axis and Z-axis that intersect each other are appropriately used for implementation. In addition, a direction along the X-axis is referred to as the X1 direction, and the direction opposite to the X1 direction is referred to as the X2 direction. Similarly, directions opposite to each other along the Y-axis are referred to as the Y1 direction and the Y2 direction. In addition, directions opposite to each other along the Z-axis are referred to as the Z1 direction and the Z2 direction. The Y1 direction or the Y2 direction is an example of a "first direction". The X1 direction or the X2 direction is an example of a "second direction". In the following, the situation of observing from the Z1 direction or the Z2 direction is referred to as "planar observation".

[0033] Typically, the Z axis is a vertical axis, and the Z1 direction is equivalent to the downward direction in the vertical direction. However, the Z axis may not be a vertical axis. In addition, although the X axis, the Y axis, and the Z axis are typically orthogonal to each other, they are not limited to this, and for example, they can intersect at an angle within a range of 80° or more and 100° or less.

[0034] 1. First Implementation

[0035] 1-1. Schematic Structure of Liquid Ejection Device 100

[0036] Figure 1 1 is a schematic diagram showing a configuration example of a liquid ejecting device 100 according to the first embodiment. The liquid ejecting device 100 is an inkjet printing device that ejects ink, which is an example of a liquid, onto a medium M in the form of droplets. The medium M is typically printing paper. In addition, the medium M is not limited to printing paper, and may be a printing object of any material such as a resin film or cloth.

[0037] like Figure 1 As shown, the liquid ejecting device 100 includes a liquid container 10 , a control unit 20 , a transport unit 50 , a liquid ejecting head 30 , a plurality of suppressing units 60 , and a plurality of suppressing units 61 .

[0038] The liquid container 10 is a container for storing ink. Specific forms of the liquid container 10 include, for example, a cartridge that can be attached to and detached from the liquid ejecting device 100, a bag-shaped ink bag formed of a flexible film, and an ink tank that can replenish ink. The type of ink stored in the liquid container 10 is not particularly limited and is arbitrary.

[0039] The control unit 20 controls the operation of each element of the liquid ejection device 100. The control unit 20 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operation of each element of the liquid ejection device 100.

[0040] The conveying unit 50 conveys the medium M in the direction DM under the control of the control unit 20. The direction DM in this embodiment is the X1 direction. Figure 1 In the example shown, the conveying unit 50 includes a conveying roller that is elongated along the Y axis and a motor that rotates the conveying roller. In addition, the conveying unit 50 is not limited to a structure using a conveying roller, and for example, a structure using a roller or an endless belt that conveys the medium M while being adsorbed to the outer peripheral surface by electrostatic force or the like may also be used.

[0041] The suppression parts 60 and 61 are provided on a head support member (not shown) that supports the liquid ejecting head 30. The suppression parts 60 and 61 suppress the floating of the medium M relative to the liquid ejecting head 30. The suppression parts 60 and 61 include, for example, a sawtooth roller that contacts and rotates driven by the medium M being transported. The sawtooth roller can rotate around a rotation axis along the Y axis, and a plurality of protrusions are provided on the outer periphery of the rotation axis.

[0042] The liquid ejection head 30 ejects the ink supplied from the liquid container 10 from each of the plurality of nozzles N onto the medium M in the Z2 direction under the control of the control unit 20. The liquid ejection head 30 is a line head that is elongated in the direction of extension of the Y axis. The liquid ejection head 30 has a plurality of head chips 3 that are arranged so that the plurality of nozzles N are distributed over the entire range of the medium M in the direction along the Y axis. The ejection of the ink from the liquid ejection head 30 is performed in parallel with the conveyance of the medium M by the conveyance unit 50, thereby forming an image composed of the ink on the surface of the medium M.

[0043] The number and arrangement of the head chips 3 of the liquid jet head 30 are not limited to Figure 1 The examples shown are arbitrary. In addition, when the liquid ejecting head 30 is configured to circulate ink, the liquid ejecting head 30 may be connected to the liquid container 10 via a circulation mechanism for circulating the ink in the liquid ejecting head 30 .

[0044] As described above, the above liquid ejection device 100 includes the liquid ejection head 30 that ejects ink onto the medium M, and the transport unit 50 that transports the medium M. Although described later, in the liquid ejection head 30, the difference in the landing deviation between the plurality of head chips 3 is reduced. Therefore, according to the liquid ejection device 100 including the liquid ejection head 30, it is possible to suppress the reduction in printing quality.

[0045] In addition, the liquid ejection device 100 includes a liquid ejection head 30 and a suppressing unit 60 for suppressing the floating of the medium M. Although the details will be described later, the suppressing unit 60 can effectively suppress the floating of the medium M while achieving miniaturization in the direction along the Y axis of the liquid ejection head 30. Therefore, according to the liquid ejection device 100 including the liquid ejection head 30, it is possible to suppress the reduction of printing quality while achieving miniaturization.

[0046] 1-2. Overall structure of the head chip 3

[0047] Figure 2 for, Figure 1 The head chip 3 is shown in a perspective exploded view. Figure 3 for, Figure 2 Cross-sectional view along line aa in FIG. Figure 3 The cross section shown in FIG. 1 is a cross section parallel to the XZ plane. The Z axis is an axis along the ejection direction of the ink of the liquid ejection head 30 .

[0048] As Figure 2 As illustrated, the head chip 3 has a plurality of nozzles N arranged along the Y axis. The plurality of nozzles N are divided into a nozzle column La and a nozzle column Lb which are spaced apart from each other and arranged side by side along the X axis. The nozzle column La and the nozzle column Lb are respectively a collection of a plurality of nozzles N arranged in a straight line along the Y axis. The liquid ejection head 30 is a structure in which the elements associated with each nozzle N of the nozzle column La and the elements associated with each nozzle N of the nozzle column Lb are arranged in a roughly plane-symmetrical manner. In the following description, the elements corresponding to the nozzle column La are described in detail, and the description of the elements corresponding to the nozzle column Lb is appropriately omitted. In addition, in the following description, when the nozzle column La and the nozzle column Lb are not distinguished, they are marked as the nozzle column L.

[0049] As Figure 2 as well as Figure 3 As illustrated, the head chip 3 includes a communication plate 31 , a pressure chamber substrate 32 , a vibration plate 33 , a nozzle plate 37 , a vibration absorber 38 , a plurality of driving elements 34 , a sealing substrate 35 , a housing 36 , and a wiring substrate 40 .

[0050] The connecting plate 31, the pressure chamber substrate 32, the vibration plate 33, the nozzle plate 37 and the vibration absorber 38 are respectively long plate-shaped members along the Y axis. The pressure chamber substrate 32 and the housing 36 are provided on the surface of the connecting plate 31 in the Z2 direction. The nozzle plate 37 and the vibration absorber 38 are provided on the surface of the connecting plate 31 in the Z1 direction. For example, the components are fixed to each other by an adhesive.

[0051] The nozzle plate 37 is a plate-shaped member formed with a plurality of nozzles N. Each of the plurality of nozzles N is a circular through hole for ejecting ink. For example, the nozzle plate 37 is manufactured by processing a single crystal substrate of silicon (Si) using semiconductor manufacturing techniques such as photolithography and etching.

[0052] In the connecting plate 31, a plurality of narrowed portions 312, a plurality of connecting flow channels 314, a connecting space Ra and a common flow channel Rb are formed. The narrowed portion 312 and the connecting flow channel 314 are respectively through holes extending in the Z1 direction and formed for each nozzle N. The connecting flow channel 314 overlaps with the nozzle N when viewed in a plan view. The connecting space Ra is an opening formed in a long strip along the Y axis. The connecting space Ra extends along the Y axis. The common flow channel Rb is connected to the connecting space Ra and overlaps with the connecting space Ra when viewed in a plan view. The common flow channel Rb extends along the Y axis. The common flow channel Rb is connected to the plurality of narrowed portions 312. In addition, the connecting space Ra connects the common flow channel Rb and the external flow channel of the head chip 3 via the space Rc and the supply port 361 described later.

[0053] A plurality of pressure chambers C1 are formed in the pressure chamber substrate 32. The pressure chamber C1 is a space located between the connecting plate 31 and the vibration plate 33 and formed by the wall surface 320 of the pressure chamber substrate 32. The pressure chamber C1 is formed for each nozzle N. The pressure chamber C1 is a long strip-shaped space extending in the X1 direction. A plurality of pressure chambers C1 are arranged along the Y axis. At one end of the pressure chamber C1 in the X1 direction, the nozzle N is connected via the connecting flow channel 314. At the other end of the pressure chamber C1 in the X1 direction, the narrowing portion 312 is connected. The narrowing portion 312 has a smaller cross-sectional area than the pressure chamber C1. In addition, an independent flow channel for each nozzle N is formed by the pressure chamber C1, the nozzle N, the connecting flow channel 314, and the narrowing portion 312.

[0054] The communication plate 31 and the pressure chamber substrate 32 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate, for example.

[0055] On the upper part of the pressure chamber C1, there is arranged a vibration plate 33 that can be elastically deformed. The vibration plate 33 is stacked on the pressure chamber substrate 32 and is in contact with the surface of the pressure chamber substrate 32 opposite to the connecting plate 31. The vibration plate 33 is a plate-like component that is formed into a long rectangular shape along the Y axis when viewed in a plan view. The thickness direction of the vibration plate 33 is parallel to the Z1 direction. The pressure chamber C1 is connected to the connecting flow channel 314 and the narrowing portion 312. Therefore, the pressure chamber C1 is connected to the nozzle N via the connecting flow channel 314, and is connected to the connecting space Ra via the narrowing portion 312. In addition, although in Figure 2 In the figure, the pressure chamber substrate 32 and the vibration plate 33 are shown as different substrates for the convenience of explanation, but they are actually plates stacked on one silicon substrate.

[0056] A driving element 34 is formed for each pressure chamber C1 on the surface of the vibration plate 33 on the opposite side to the pressure chamber C1. The driving element 34 is a piezoelectric element that is long and along the X-axis when viewed in a plan view. The driving element 34 includes, for example, a pair of electrodes and a piezoelectric body sandwiched by the pair of electrodes. In addition, the driving element 34 may also be an electrothermal conversion element that generates heat energy.

[0057] The housing 36 is a shell for storing ink supplied to the plurality of pressure chambers C1, and is formed, for example, by injection molding of a resin material. In the housing 36, a space Rc and a supply port 361 are formed. The supply port 361 is a pipe for supplying ink from the liquid container 10, and is connected to the space Rc. The space Rc of the housing 36 is connected to the connecting space Ra of the connecting plate 31. The connecting space Ra, the common flow channel Rb, and the space Rc constitute a common space R shared by the plurality of nozzles N. The common space R functions as a liquid storage chamber for storing ink supplied to the plurality of pressure chambers C1. The ink stored in the common space R is branched into each of the narrowed portions 312, and is supplied and filled in parallel to the plurality of pressure chambers C1.

[0058] The vibration absorbing body 38 is a flexible film constituting the wall surface of the communicating space Ra, and absorbs the pressure fluctuation of the ink in the common space R. The vibration absorbing body 38 is, for example, a laminate of a resin film resistant to ink, a SUS (stainless steel) member having spring properties to hold the resin film, and a fixing plate to protect the resin film and the SUS member. By providing the vibration absorbing body 38, the natural vibration frequency of the flow path from the nozzle N through the pressure chamber C1 to the narrowing portion 312 is stabilized regardless of the driven nozzle N.

[0059] The frame 56 is bonded to the surface of the vibration absorbing body 38 facing the Z1 direction by adhesive or the like. The frame 56 is a frame-shaped member along the outer periphery of the vibration absorbing body 38. The frame 56 is made of, for example, a metal material. As shown by the double-dashed line in the figure, a fixing plate 532 described later is bonded to the surface of the frame 56 facing the Z1 direction by adhesive or the like.

[0060] The sealing substrate 35 is a structure that protects the plurality of driving elements 34 and reinforces the mechanical strength of the pressure chamber substrate 32 and the vibration plate 33, and is fixed to the surface of the vibration plate 33 by, for example, an adhesive. The plurality of driving elements 34 are accommodated inside the recess formed on the opposite surface of the sealing substrate 35 that faces the vibration plate 33. In addition, the wiring substrate 40 is inserted into the through hole 362 of the housing 36 and the through hole 353 of the sealing substrate 35. The wiring substrate 40 is bonded to the surface of the vibration plate 33. The wiring substrate 40 is a package component formed with a plurality of wirings for electrically connecting the control unit 20 and the head chip 3. The wiring substrate 40 includes a driver IC. The driver IC is a circuit including a switch element that selects whether to supply the driving signal Com to the driving element 34. As the wiring substrate 40, for example, TCP (Tape Carrier Package) or FPC (Flexible Printed Circuit) can be used. A drive signal and a reference voltage for driving the drive element 34 are supplied from the wiring substrate 40 to each drive element 34 .

[0061] In the head chip 3 involved, when the driving element 34 contracts due to power-on, the vibration plate 33 is bent and flexed in the direction in which the volume of the pressure chamber C1 decreases, so that the pressure in the pressure chamber C1 rises and ink droplets are ejected from the nozzle N. At this time, the pressure also propagates from the pressure chamber C1 toward the narrowing portion 312, so that the ink also flows to the common flow channel Rb through the narrowing portion 312. After the ink is ejected, the driving element 34 returns to its original position. At this time, the ink from the nozzle N to the common flow channel Rb also vibrates. Then, while the meniscus of the nozzle N is restored, ink is supplied from the narrowing portion 312. Through the above series of actions, ink is ejected from the nozzle N.

[0062] 1-3. Liquid ejecting head 30

[0063] Figure 4 2 is a plan view of the liquid jet head 30 according to the first embodiment. Figure 5 for, Figure 4 AA line section view in. Figure 6 FIG. 2 is a schematic diagram of the bottom surface of the liquid jet head 30 according to the first embodiment. Figure 4 , Figure 5 as well as Figure 6 , a liquid ejecting head 30 having head chips 3 - 1 to 3 - 7 is schematically shown. The head chips 3 - 1 to 3 - 7 are respectively the aforementioned head chips 3 . Hereinafter, there are cases where the head chips 3 - 1 to 3 - 7 are respectively referred to as head chips 3 .

[0064] The liquid ejecting head 30 includes head chips 3 - 1 to 3 - 7 , a flow channel structure 52 , and a supporting member 53 .

[0065] The head chips 3-1 to 3-7 are arranged in a staggered manner along the Y2 direction when viewed in the direction of the Z axis. The head chips 3-1, 3-3, 3-5, and 3-7 are arranged in a row in the Y2 direction in this order. The head chips 3-1, 3-3, 3-5, and 3-7 are arranged so that their positions are aligned with each other in the direction along the X axis. In addition, the head chips 3-2, 3-4, and 3-6 are arranged in a row in the Y2 direction in this order. The head chips 3-2, 3-4, and 3-6 are arranged so that their positions are aligned with each other in the direction along the X axis at positions closer to the X2 direction than the head chips 3-1, 3-3, 3-5, and 3-7.

[0066] The flow channel structure 52 is a structure having a flow channel Pa for supplying ink from the liquid container 10 to the plurality of head chips 3. The flow channel structure 52 is made of, for example, a resin material or a metal material. A plurality of tubes 52d are provided in the flow channel structure 52. The plurality of tubes 52d protrude from the flow channel structure 52 toward the Z1 direction.

[0067] The flow channel Pa has a common flow channel Pa1, a plurality of branched flow channels Pa2, and a plurality of openings HL. The common flow channel Pa1 and the plurality of branched flow channels Pa2 are formed in the flow channel structure 52. The plurality of openings HL are formed in a one-to-one manner in the plurality of tube portions 52d.

[0068] The common flow channel Pa1 is a flow channel commonly provided in a plurality of head chips 3. Specifically, the common flow channel Pa1 is composed of flow channels commonly provided in chips 3-1, 3-3, 3-5, and 3-7, and flow channels commonly provided in head chips 3-2, 3-4, and 3-6. These flow channels extend in the direction along the Y axis, and both ends of each flow channel are connected to the opening HL facing the Z2 direction. Ink from the liquid container 10 is introduced into the opening HL.

[0069] The plurality of branched flow paths Pa2 are provided for each supply port 361 of the head chips 3 - 1 to 3 - 7 . The plurality of branched flow paths Pa2 are communicated with the corresponding supply ports 361 , respectively.

[0070] The support member 53 is a member that directly and collectively supports the plurality of head chips 3. The support member 53 is disposed on the surface of the flow channel structure 52 that faces the Z1 direction and is connected to the flow channel structure 52. The support member 53 includes a frame portion 531 and a fixing plate 532.

[0071] The frame 531 has a plurality of recesses 53a for accommodating a plurality of head chips 3. The plurality of recesses 53a are depressions provided on the surface of the frame 531 facing the Z1 direction. In addition, the plurality of recesses 53a may be provided for each head chip 3 or for each group of two or more head chips 3. For example, the plurality of recesses 53a are formed by dividing one recess into a plurality of recesses.

[0072] The fixing plate 532 is disposed on the surface of the frame 531 facing the Z1 direction and connected to the frame 531. The fixing plate 532 is a plate-shaped member for fixing the plurality of head chips 3. The head chips 3 are stored in the storage space defined by the fixing plate 532 and the recessed portion 53a of the frame 531.

[0073] A plurality of exposure openings 53b are provided on the fixing plate 532 for exposing the nozzle plates 37 of each head chip 3 to the outside of the liquid ejecting head 30. Each exposure opening 53b is a hole formed on the fixing plate 532. The plurality of exposure openings 53b are independently provided for each head chip 3. Each exposure opening 53b exposes a plurality of nozzles of the nozzle plates 37 of each head chip 3. The surface of the fixing plate 532 of the liquid ejecting head 30 facing the Z1 direction and the nozzle plates 37 exposed from the exposure openings 53b together constitute an ejection surface FN. Figure 3 As shown in FIG. 1 , in the present embodiment, the exposure opening 53b is formed so as to overlap with the plurality of nozzles N of the nozzle plate 37. When a portion of the fixing plate 532 is viewed in the Z1 direction, it overlaps with the outer peripheral portion of the nozzle plate 37. In addition, the exposure opening 53b may overlap with the entire area of ​​the nozzle plate 37 when viewed in a plan view. That is, the entire nozzle plate 37 may be exposed from the exposure opening 53b.

[0074] The supporting member 53 is made of, for example, a metal material such as stainless steel, titanium, or a magnesium alloy, or a resin material. In addition, although the fixing plate 532 and the frame 531 are made of different components, they may be integrally formed. In addition, a part of the supporting member 53 may be integrally formed with the flow channel structure 52. For example, the frame 531 may be integrally formed with the flow channel structure 52.

[0075] 1-4. Overlapping area of ​​head chip 3

[0076] Figure 7 2 is a bottom view of the liquid jet head 30 according to the first embodiment.

[0077] like Figure 7 As shown in FIG. 1 , the ejection surface FN of the liquid ejection head 30 includes all nozzle forming areas S30 formed by all nozzle forming areas S3 of the plurality of head chips 3. The nozzle forming area S3 is an area from the nozzle N arranged at one end of the plurality of nozzles N formed on one head chip 3 in the Y1 direction to the nozzle N arranged at the other end. Figure 7 In the figure, the nozzle N is omitted, and the nozzle forming area S3 is shown. In addition, the entire nozzle forming area S30 is an area from the end of the nozzle forming area S3 of the head chip 3-1 in the Y1 direction to the end of the nozzle forming area S3 of the head chip 3-7 in the Y2 direction. In addition, in the present embodiment, the size of each nozzle forming area S3 of the plurality of head chips 3, that is, the length along the Y axis is substantially the same as each other. In addition, the so-called substantially the same means that the difference between the two is less than 1% when the size of the nozzle forming area S3 of one head chip 3 is 100%.

[0078] As described above, the plurality of head chips 3 are arranged in a staggered manner along the Y1 direction, and four or more head chips 3 are provided. In the illustrated example, seven head chips 3 are provided. Furthermore, the plurality of head chips 3 are arranged so that a portion of the nozzle forming area S3 of one of the adjacent head chips 3 and a portion of the nozzle forming area S3 of the other head chip 3 have an overlapping overlap area A when viewed in the X1 direction. Therefore, there is an overlapping area A between adjacent head chips 3. Therefore, the plurality of head chips 3 include a plurality of overlapping areas A. In addition, the Y1 direction and the X1 direction are directions parallel to the nozzle forming area S3, and directions perpendicular to the Z1 direction which is the ejection direction of the ink.

[0079] The plurality of overlapping regions A include a first overlapping region A1 , a second overlapping region A2 , a third overlapping region A3 , a fourth overlapping region A4 , a fifth overlapping region A5 , and a sixth overlapping region A6 .

[0080] The first overlapping region A1 is an overlapping region A where a portion of the nozzle forming region S3 of the head chip 3-4 overlaps a portion of the nozzle forming region S3 of the head chip 3-5 when viewed in the X1 direction. The first overlapping region A1 is closest to the center position O1 among the plurality of overlapping regions A. The center position O1 is the center position of all the nozzle forming regions S30 in the Y1 direction.

[0081] The second overlapping area A2 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-5 overlaps a part of the nozzle forming area S3 of the head chip 3-6 when viewed in the X1 direction. The second overlapping area A2 is farther away from the first overlapping area A1 relative to the center position O1. In the present embodiment, the second overlapping area A2 is arranged in the Y2 direction relative to the first overlapping area A1. In addition, the second overlapping area A2 is arranged between the first overlapping area A1 and the third overlapping area A3 described later in the Y1 direction. In addition, the size of the second overlapping area A2, that is, the length in the direction along the Y axis, is smaller than the size of the first overlapping area A1, that is, the length in the direction along the Y axis.

[0082] The third overlapping area A3 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-6 overlaps a part of the nozzle forming area S3 of the head chip 3-7 when viewed in the X1 direction. The third overlapping area A3 is farther away from the first overlapping area A1 and the second overlapping area A2 relative to the center position O1. The third overlapping area A3 is configured in the Y1 direction so as to sandwich the second overlapping area A2 between the first overlapping area A1. In the present embodiment, the third overlapping area A3 is located closest to the Y2 direction among the plurality of overlapping areas A. The size of the third overlapping area A3, that is, the length in the direction along the Y axis, is smaller than the size of the first overlapping area A1 in the Y1 direction. In addition, in the present embodiment, the size of the third overlapping area A3 is substantially the same as the length of the second overlapping area A2 in the direction along the Y axis. In addition, the so-called substantially the same means that the difference between the two is less than 1% when the size of the nozzle forming area S3 of one head chip 3 is set to 100%.

[0083] The fourth overlapping area A4 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-4 overlaps a part of the nozzle forming area S3 of the head chip 3-3 when viewed in the X1 direction. The fourth overlapping area A4 is arranged with the center position O1 sandwiched between the first overlapping area A1. In this embodiment, the distance between the fourth overlapping area A4 and the center position O1 is substantially the same as the distance between the first overlapping area A1 and the center position O1. Therefore, similarly to the first overlapping area A1, the fourth overlapping area A4 is closest to the center position O1 among the plurality of overlapping areas A. In addition, the size of the fourth overlapping area A4, that is, the length in the direction along the Y axis, is substantially the same as the size of the first overlapping area A1.

[0084] The fifth overlapping area A5 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-3 overlaps a part of the nozzle forming area S3 of the head chip 3-2 when viewed in the X1 direction. The fifth overlapping area A5 is farther away from the first overlapping area A1 and the fourth overlapping area A4 relative to the center position O1. In the present embodiment, the fifth overlapping area A5 is set in the Y1 direction relative to the fourth overlapping area A4. In addition, the fifth overlapping area A5 is arranged between the fourth overlapping area A4 and the sixth overlapping area A6 described later in the Y1 direction. In addition, the size of the fifth overlapping area A5, that is, the length in the direction along the Y axis, is smaller than the size of the fourth overlapping area A4.

[0085] The sixth overlapping area A6 is an overlapping area A where a portion of the nozzle forming area S3 of the head chip 3-2 overlaps a portion of the nozzle forming area S3 of the head chip 3-1 when viewed in the X1 direction. The sixth overlapping area A6 is farther away from the fourth overlapping area A4 and the fifth overlapping area A5 relative to the center position O1. The sixth overlapping area A6 is configured in the Y1 direction so as to sandwich the fifth overlapping area A5 between the fourth overlapping area A4. In the present embodiment, the sixth overlapping area A6 is located closest to the Y1 direction among the plurality of overlapping areas A. The size of the sixth overlapping area A6, that is, the length in the direction along the Y axis, is smaller than the size of the fourth overlapping area A4 in the Y1 direction. In addition, in the present embodiment, the size of the sixth overlapping area A6 is substantially the same as the length of the fifth overlapping area A5 in the direction along the Y axis.

[0086] In addition, the fourth overlap region A4, the fifth overlap region A5 and the sixth overlap region A6 may be understood as the first overlap region A1, the second overlap region A2 and the third overlap region A3. In addition, the number of the head chips 3 may be 4 or more, and may be 5, 6 or 8 or more.

[0087] Furthermore, in each overlapping region A, several nozzles N belonging to the nozzle forming region S3 of one of two adjacent head chips 3 and several nozzles N belonging to the nozzle forming region S3 of the other head chip 3 overlap for each nozzle column L when viewed in the X1 direction.

[0088] In addition, each head chip 3 includes a non-overlapping area B in the nozzle forming area S3 that does not overlap with the nozzle forming area S3 of other adjacent head chips 3 when viewed in the X1 direction. The non-overlapping area B is an area different from the overlapping area A. The non-overlapping area B includes a plurality of non-overlapping areas B1, B2, B3, B4, B5, B6, and B7.

[0089] The non-overlapping region B1 is a region different from the first overlapping region A1 and the fourth overlapping region A4 in the nozzle forming region S3 of the head chip 3-4. The non-overlapping region B1 is a region remaining after removing the first overlapping region A1 and the fourth overlapping region A4 from the nozzle forming region S3 of the head chip 3-4. In the present embodiment, the size of the non-overlapping region B1, that is, the length in the direction along the Y axis is more than half the size of the nozzle forming region S3 of the head chip 3-4. The size of the non-overlapping region B1 is larger than the sizes of the first overlapping region A1 and the fourth overlapping region A4.

[0090] The non-overlapping area B2 is an area different from the first overlapping area A1 and the second overlapping area A2 in the nozzle forming area S3 of the head chip 3-5. The non-overlapping area B2 is an area remaining after removing the first overlapping area A1 and the second overlapping area A2 from the nozzle forming area S3 of the head chip 3-5. In the present embodiment, the size of the non-overlapping area B2, that is, the length in the direction along the Y axis is more than half the size of the nozzle forming area S3 of the head chip 3-5. The size of the non-overlapping area B2 is larger than the sizes of the first overlapping area A1 and the second overlapping area A2.

[0091] The non-overlapping area B3 is an area different from the second overlapping area A2 and the third overlapping area A3 in the nozzle forming area S3 of the head chip 3-6. The non-overlapping area B3 is an area remaining after removing the second overlapping area A2 and the third overlapping area A3 from the nozzle forming area S3 of the head chip 3-6. In the present embodiment, the size of the non-overlapping area B3, that is, the length along the Y-axis direction, is more than half the size of the nozzle forming area S3 of the head chip 3-6. The size of the non-overlapping area B3 is larger than the sizes of the second overlapping area A2 and the third overlapping area A3.

[0092] The non-overlapping area B4 is an area different from the third overlapping area A3 in the nozzle forming area S3 of the head chip 3-7. The non-overlapping area B4 is an area remaining after removing the third overlapping area A3 from the nozzle forming area S3 of the head chip 3-7. In this embodiment, the size of the non-overlapping area B4, that is, the length along the Y-axis direction is more than half the size of the nozzle forming area S3 of the head chip 3-7. The size of the non-overlapping area B4 is larger than the size of the third overlapping area A3.

[0093] The non-overlapping area B5 is an area different from the fourth overlapping area A4 and the fifth overlapping area A5 in the nozzle forming area S3 of the head chip 3-3. The non-overlapping area B5 is an area remaining after removing the fourth overlapping area A4 and the fifth overlapping area A5 from the nozzle forming area S3 of the head chip 3-3. In the present embodiment, the size of the non-overlapping area B5, that is, the length along the Y-axis direction, is more than half the size of the nozzle forming area S3 of the head chip 3-3. The size of the non-overlapping area B5 is larger than the sizes of the fourth overlapping area A4 and the fifth overlapping area A5.

[0094] The non-overlapping area B6 is an area different from the fifth overlapping area A5 and the sixth overlapping area A6 in the nozzle forming area S3 of the head chip 3-2. The non-overlapping area B6 is an area remaining after removing the fifth overlapping area A5 and the sixth overlapping area A6 from the nozzle forming area S3 of the head chip 3-2. In the present embodiment, the size of the non-overlapping area B6, that is, the length in the direction along the Y axis, is more than half the size of the nozzle forming area S3 of the head chip 3-2. The size of the non-overlapping area B6 is larger than the sizes of the fifth overlapping area A5 and the sixth overlapping area A6.

[0095] The non-overlapping region B7 is a region different from the sixth overlapping region A6 in the nozzle forming region S3 of the head chip 3-1. The non-overlapping region B7 is a region remaining after removing the sixth overlapping region A6 from the nozzle forming region S3 of the head chip 3-1. In the present embodiment, the size of the non-overlapping region B7, that is, the length along the Y-axis direction is more than half the size of the nozzle forming region S3 of the head chip 3-1. The size of the non-overlapping region B7 is larger than the size of the sixth overlapping region A6.

[0096] Figure 8 2 is a diagram illustrating the flow of airflow generated around the plurality of head chips 3. In the liquid ejecting head 30, ink droplets may not land on the target position of the medium M due to the airflow.

[0097] like Figure 8 As shown in FIG. 1 , there are multiple gaps between the multiple head chips 3. Therefore, airflow passes through the multiple gaps. Figure 8 As indicated by the solid arrow mark a0, the airflow passes through the gaps between the plurality of head chips 3. Since the airflow passes through, there is a possibility that the dropout deviation occurs between the plurality of head chips 3. The airflow is generated by, for example, conveying the medium M.

[0098] For example, when all nozzles N are used for non-special format input, ink droplets ejected from the seven head chips 3 match the shape of the nozzle array L arranged in the Y1 direction and form a curtain shape, thereby hindering the flow of airflow. For example, the liquid ejection head 30 of this embodiment is a line head. In this case, the flow of airflow generated in the X1 direction due to the transportation of the medium M is hindered by the ink droplets.

[0099] However, for the head chips 3-1 and 3-7 located at the two sides of the entire nozzle formation area S30 in the Y1 direction, the airflow passes through the position where there is no adjacent chip. Figure 8 As shown by the dashed arrow mark a9, the airflow passes through. Therefore, the vicinity of the head chips 3-1 and 3-7 is less affected by the landing deviation than the head chip 3-4 closest to the center position O1.

[0100] In addition, for the airflow, the airflow speed is faster the closer to the center of the area S30 where all nozzles are formed in the Y1 direction, and slower the closer to the two end sides. Therefore, the closer to the center, the more easily it is affected by the airflow, and the larger the drop deviation becomes, and the closer to the two end sides, the less easily it is affected by the airflow, and the smaller the drop deviation becomes. In this way, due to the influence of the multiple gaps between the multiple head chips 3, there will be differences in the drop deviation in the Y1 direction. In order to reduce this difference, in this embodiment, it is considered that the drop deviation near the center position O1 is greater than the drop deviation at the two end portions, so that the overlap amount of the overlapping area A near the center position O1 is greater than the overlap amount at the two end sides.

[0101] Specifically, as described above, in the Y1 direction, the first overlap region A1 is larger than the second overlap region A2. Therefore, compared with a case where the sizes of the plurality of overlap regions A are the same, it is possible to suppress degradation of printing quality due to differences in landing deviations among the plurality of head chips 3.

[0102] In addition, the same problem also exists when the liquid ejection head 30 is not a line head but a serial head. For example, when the liquid ejection head 30 is a serial head, the ink droplets hinder the following airflow, that is, the airflow generated by the movement of the carriage that supports and reciprocates the liquid ejection head 30 in a direction orthogonal to the extension direction of all nozzle forming areas S30, that is, the direction in which the plurality of head chips 3 are arranged in a staggered manner. Even in such a case, since the size of the first overlapping area A1 is larger than the second overlapping area A2, the reduction in printing quality caused by the difference in the drop deviation between the plurality of head chips 3 can be suppressed compared to the case where the sizes of the plurality of overlapping areas A are the same.

[0103] Fig. 9 FIG. 3 is a bottom view of a liquid ejecting head 30x of a comparative example. Fig. 9 As shown, in the conventional liquid ejecting head 30x, the sizes of the plurality of overlapping regions A are substantially the same. In the liquid ejecting head 30x, there is a difference in the landing deviation in the Y1 direction in all the nozzle forming regions S30. As a result, the printing quality may be degraded.

[0104] Fig.21 3 is a diagram for explaining the spraying that occurs when the spray is not affected by the airflow. Fig. 22 , which is a diagram for explaining the falling of ink droplet M0 under the influence of airflow. Fig.21 as well as Fig. 22 , the nozzle array La included in each head chip 3 is representatively shown.

[0105] like Fig.21 As shown, when not affected by the air flow, ideally, the ink droplet M0 is ejected directly below the nozzle N. Since the adjacent head chips 3 have overlapping areas A, white streaks are not generated on the medium M between the adjacent head chips 3 .

[0106] In contrast, Fig. 22 As shown, under the influence of the airflow, the ink droplets M0 are not ejected directly below the nozzles N, but move to the center of the nozzle array La. As a result, an area A0 where no ink droplets are ejected is generated on the medium M. The area A0 appears on the medium M as a white stripe.

[0107] Fig.10 2 is a diagram for explaining the landing of the ink droplet M0 in the second overlapping area A2. Fig.11 , which is a diagram for explaining the landing of the ink droplet M0 in the first overlapping area A1. Fig.10 as well as Fig.11 , the nozzle array La included in each head chip 3 is representatively shown.

[0108] like Fig.10 as well as Fig.11 As shown, due to the influence of the aforementioned airflow, ink droplets M0 ejected from several nozzles N located near the end of one nozzle row La may move to the center side of the nozzle row La.

[0109] Compared with the space between the head chip 3-4 and the head chip 3-5, the space between the head chip 3-5 and the head chip 3-6 is arranged on the end side of the liquid jet head 30. Therefore, compared with the space between the head chip 3-4 and the head chip 3-5, the space between the head chip 3-5 and the head chip 3-6 is less susceptible to the influence of the airflow. Therefore, even if the size of the second overlapping area A2 is smaller than the size of the first overlapping area A1, white streaks are not easily generated. On the other hand, the airflow easily passes between the head chip 3-4 and the head chip 3-5. Therefore, the size of the first overlapping area A1 is made larger than the size of the second overlapping area A2. Thus, even if a large drop deviation of the ink droplet M0 is generated due to the influence of the airflow between the head chip 3-4 and the head chip 3-5, the possibility of generating white streaks on the medium M can be suppressed.

[0110] In addition, similarly to the nozzle row La, the nozzle row Lb included in the adjacent head chip 3 also has a portion that overlaps when viewed in the X1 direction.

[0111] In addition, if Figure 7 As shown, the first overlapping area A1 is the overlapping area A closest to the center position O1 in the Y1 direction among the multiple overlapping areas A. In this case, by making the first overlapping area A1 larger than the second overlapping area A2, it is possible to effectively suppress the reduction in printing quality caused by the difference in the landing deviation between the multiple head chips 3.

[0112] In addition, it is preferred that, in the Y1 direction, the size of the first overlapping region A1 is at least twice the average size of the plurality of overlapping regions A. If the size of the first overlapping region A1 is at least twice the average size of the plurality of overlapping regions A, even if the ink droplets are affected by a relatively large airflow on the first overlapping region A1, white streaks are less likely to be generated, compared with a case where the size of the first overlapping region A1 is less than twice the average size of the plurality of overlapping regions A.

[0113] From another point of view, it is preferable that the number of nozzles belonging to the first overlapping area A1 is more than twice the average number of nozzles belonging to the plurality of overlapping areas A. For example, consider the case where the number of nozzles in the first overlapping area A1 and the fourth overlapping area A4 is 64, and the number of nozzles in the second overlapping area A2, the third overlapping area A3, the fifth overlapping area A5, and the sixth overlapping area A6 is 9. In this case, the average number of nozzles belonging to the plurality of overlapping areas A is about 27. Therefore, twice the average is about 54. If the number of nozzles belonging to the first overlapping area A1 is more than twice the average number of nozzles belonging to the plurality of overlapping areas A, the effect of the first overlapping area A1 being larger than the second overlapping area A2 can be significantly exerted compared to the case where the number of nozzles belonging to the first overlapping area A1 is less than twice.

[0114] In addition, the size of the first overlapping region A1 may be smaller than twice the average size of the plurality of overlapping regions A. In addition, the number of nozzles belonging to the first overlapping region A1 may be smaller than twice the average number of nozzles belonging to the plurality of overlapping regions A.

[0115] In addition, preferably, in the Y1 direction, the size of the second overlapping area A2 is less than half the average size of the plurality of overlapping areas A. If the size of the second overlapping area A2 exceeds half the average size of the plurality of overlapping areas A, the effect of the first overlapping area A1 being larger than the second overlapping area A2 is weakened compared to the case where the size is less than half.

[0116] From another point of view, it is preferable that the number of nozzles belonging to the second overlapping area A2 is more than half the average number of nozzles belonging to the plurality of overlapping areas A. For example, consider the case where the number of nozzles in the first overlapping area A1 and the fourth overlapping area A4 is 64, and the number of nozzles in the second overlapping area A2, the third overlapping area A3, the fifth overlapping area A5, and the sixth overlapping area A6 is 9. In this case, the average number of nozzles belonging to the plurality of overlapping areas A is about 27. Therefore, half of the average is about 14. If the number of nozzles belonging to the second overlapping area A2 is less than half the average number of nozzles belonging to the plurality of overlapping areas A, the effect of the first overlapping area A1 being larger than the second overlapping area A2 can be significantly exerted compared to the case where the number of nozzles belonging to the second overlapping area A2 exceeds half.

[0117] In particular, it is preferred that, in the Y1 direction, the size of the first overlapping region A1 is more than twice the average size of the plurality of overlapping regions A, and that, in the Y1 direction, the size of the second overlapping region A2 is less than half the average size of the plurality of overlapping regions A. By satisfying these relationships, it is possible to more effectively suppress a reduction in printing quality caused by a difference in landing deviations among the plurality of head chips 3, compared to a case where these relationships are not satisfied.

[0118] In addition, the size of the second overlapping region A2 may exceed half the average size of the plurality of overlapping regions A. In addition, the number of nozzles belonging to the second overlapping region A2 may exceed half the average number of nozzles belonging to the plurality of overlapping regions A.

[0119] Preferably, the size of the first overlapping region A1 in the Y1 direction is 5 times or more the size of the second overlapping region A2. Also, preferably, the size of the first overlapping region A1 in the Y1 direction is 7 times or more the size of the second overlapping region A2.

[0120] In the Y1 direction, the total size of the plurality of overlapping regions A is smaller than the size of the nozzle forming region S3 of one head chip 3. By making the total size smaller than the size of the nozzle forming region S3, it is avoided that the number of nozzles included in the overlapping region A is excessive, and the liquid jet head 30 can be appropriately used as a line head. In addition, the total size may also be larger than the size of one nozzle forming region S3.

[0121] 1-5. Support member 53

[0122] Fig.12 for, Figure 5 A perspective view of a portion of a support member 53 is shown. Fig.13 For, removed Fig.12 A diagram of the fixing plate 532 of the support member 53 is shown. Fig.14 for, Fig.13 The bottom view of the support member 53 is shown. Fig.14 , the state where the fixing plate 532 is removed is shown.

[0123] like Fig.12 As shown, the support member 53 includes a frame portion 531 and a fixing plate 532. As described above, the fixing plate 532 is provided with a plurality of exposure openings 53b.

[0124] like Fig.13 as well as Fig.14 As shown, the frame 531 includes a base 5311 and a frame body 5312. The base 5311 is a portion connected to the flow channel structure 52. The frame body 5312 is provided on the surface of the base 5311 facing the Z1 direction. The frame body 5312 is provided with a through hole. The inner wall surface of the through hole and the surface of the base 5311 in the Z1 direction constitute the multiple recesses 53a described above. In the example shown in the figure, a portion of the multiple recesses 53a is connected to form a recess. In addition, a plurality of cutouts 55, 57 are provided on the frame body 5312.

[0125] Fig.15 FIG. 5 is a bottom view of a support member 53 of a modified example. Fig.15 The frame 531y of the support member 53y shown in FIG. 5 is not provided with a plurality of cutouts 55 and 57. Fig.14 The frame 5312 of the present embodiment shown in the figure is provided with a plurality of cutouts 55 and 57. Each cutout 55 and 57 is formed by Fig.15 The frame 5312y shown is formed by cutting away a portion thereof.

[0126] As described above, in the present embodiment, in the Y1 direction, the first overlapping area A1 is larger than the second overlapping area A2. Therefore, in the Y1 direction, the gap between the adjacent head chips 3 closer to the end than the center position O1 can be increased. Therefore, the cutout 55 can be provided closer to the end than the center position O1. In addition, any component can be arranged at the cutout 55. For example, a temperature sensor or a heater can be provided at the cutout 55. Therefore, the liquid jet head 30 can be miniaturized.

[0127] like Fig.14 As shown, in the present embodiment, one cutout 55 is provided between the second overlapping area A2 and the third overlapping area A3 in the Y1 direction. Another cutout 55 is provided between the fifth overlapping area A5 and the sixth overlapping area A6 in the Y1 direction. Therefore, the support member 53 has cutouts 55 between the second overlapping area A2 and the third overlapping area A3, and between the fifth overlapping area A5 and the sixth overlapping area A6, respectively. By providing the cutout 55 on the frame 5312, it is possible to configure a suppression portion 60 for suppressing the floating of the medium M at the cutout 55. Therefore, the suppression portion 60 can be provided on the liquid injection head 30. Therefore, there is no need to separately provide a component other than the liquid injection head 30 for configuring the suppression portion 60. Therefore, the liquid injection device 100 can be miniaturized. In addition, the suppression portion 61 can be configured by providing the cutout 57.

[0128] For example, as indicated by the double arrow mark a5, the suppression unit 60 can move in the X1 direction and the X2 direction. Similarly, as indicated by the double arrow mark a6, the suppression unit 61 can move in the X1 direction and the X2 direction. Therefore, when using the liquid ejecting device 100, by arranging the suppression units 60 and 61 in Fig.14 The suppressing parts 60 and 61 are placed at the positions shown in the figure, so that the floating of the medium M can be suppressed by the suppressing parts 60 and 61. In addition, when cleaning the ejection surface FN of the liquid ejecting head 30, the suppressing parts 60 and 61 are moved from Fig.14 The position shown moves in the X1 direction. This allows the ejection surface FN to be cleaned efficiently.

[0129] In addition, if Fig.14 As shown, the frame 5312 of the support member 53 has no cutout between the first overlapping area A1 and the second overlapping area A2. By not forming a cutout at the relevant position, the rigidity of the support member 53 can be improved compared to the case where a cutout is formed.

[0130] In addition, as described above, the fourth overlapping area A4 is arranged with the center position O1 sandwiched between the first overlapping area A1. In the Y1 direction, the size of the first overlapping area A1 is substantially the same as that of the fourth overlapping area A4. In addition, the so-called substantially the same size means that the difference between the two is less than 1% when the size of the nozzle forming area of ​​a head chip in the first direction is set to 100%. For the so-called substantially the same size, for example, the so-called substantially the same size means that when the number of nozzles included in the nozzle forming area S3 of a head chip in the first direction is 400 nozzles, it is 1% thereof, that is, less than four nozzles.

[0131] By making the size of the first overlapping area A1 substantially the same as that of the fourth overlapping area A4, the entire nozzle forming area S30 has a structure in which the center portion is line-symmetrical with respect to the center position O1. In the case of this line-symmetrical structure, by disposing the suppressing portion 60 at the aforementioned cutout 55, it is easy to stably fix the medium M using the suppressing portion 60. In particular, when the medium M is placed so that the center line in the conveying direction of the medium M coincides with the center position O1, even if the width of the medium M is smaller than the entire nozzle forming area S30, the suppressing portion 60 can be used to support the medium M in a manner that does not cause both ends of the medium M in the direction along the Y axis to float.

[0132] In addition, if Fig.14 As shown in the figure, in this embodiment, two cutouts 57 are formed at the ends in the Y1 direction and the Y2 direction of the frame 5312. In addition, the restraining portion 61 is disposed at the cutout 57. Thus, the restraining portion 61 can support the medium M in a manner that prevents both ends of the medium M from floating in the direction along the Y axis.

[0133] Fig.16 2 is a diagram showing the number of overlaps of nozzles that eject ink droplets in the second overlap area A2. Fig.17 , which is a graph showing the number of overlaps of nozzles for ejecting ink droplets in the first overlap region A1. Fig.16 as well as Fig.17 , the nozzle array La included in each head chip 3 is representatively shown.

[0134] The number of nozzles is different between the first overlapping area A1 and the second overlapping area A2. However, the overlapping number of nozzles used for ejecting ink droplets may be set to be equal.

[0135] exist Fig.16In the example shown, seven nozzles in the nozzle array La of the head chip 3-6 belong to the second overlapping area A2, and seven nozzles in the nozzle array La of the head chip 3-5 belong to the second overlapping area A2. Three nozzles N9 and two nozzles N8 of the seven nozzles N are nozzles N used for ejecting ink droplets. In the second overlapping area A2, the three nozzles N9 of the head chip 3-6 and the three nozzles N9 of the head chip 3-5 overlap when viewed in the X1 direction.

[0136] Therefore, the number of nozzles belonging to the second overlapping area A2 is 7 in one nozzle row La. On the other hand, in the second overlapping area A2, the number of nozzles used for ejecting ink droplets is 3 in one nozzle row La.

[0137] exist Fig.17 In the example shown, 17 nozzles in the nozzle array La of the head chip 3-5 belong to the first overlapping area A1, and 17 nozzles in the nozzle array La of the head chip 3-4 belong to the first overlapping area A1. Three nozzles N9 and seven nozzles N8 of the 17 nozzles N are nozzles N used for ejecting ink droplets. In the first overlapping area A1, the three nozzles N9 of the head chip 3-5 and the three nozzles N9 of the head chip 3-4 overlap when viewed in the X1 direction.

[0138] Therefore, the number of nozzles belonging to the first overlapping area A1 in one nozzle row La is 17. On the other hand, in the first overlapping area A1, the overlapping number of nozzles used for ejecting ink droplets in one nozzle row La is three.

[0139] In the first overlapping area A1 and the second overlapping area A2, the overlapping numbers of the nozzles used for ejecting ink droplets are the same. By setting the overlapping numbers equal in each overlapping area A, even when the first overlapping area A1 is larger than the second overlapping area A2 in the Y1 direction in order to set the suppression unit 60 in the liquid ejection head 30, the difference in the overlapping state of the ink droplets ejected between the head chips 3 can be reduced. In addition, the overlapping amount can also be set according to the conveying speed of the medium M caused by the air flow speed or the moving speed of the carriage.

[0140] 2. Modifications

[0141] The above-described various embodiments can be modified in various ways. Specific modified embodiments that can be applied to the above-described various embodiments are illustrated below. Two or more embodiments arbitrarily selected from the following examples can be appropriately combined within the scope of non-contradiction.

[0142] 2-1. First Modification

[0143] Fig.18 30A is a bottom view of a liquid ejecting head according to a first modification. Fig.18 The liquid jet head 30A of the first modified example shown includes a head chip 3-4, and the head chip 3-4 includes a first overlapping area A1 and a non-overlapping area B1. The non-overlapping area B1 of the head chip 3-4 is a non-overlapping area B that does not overlap with the nozzle forming area S3 of another head chip 3-5 when viewed in the X1 direction and is less than half the size of the nozzle forming area S3. Even in the case where a head chip 3-4 having the non-overlapping area B1 is provided, by making the first overlapping area A1 larger than the second overlapping area A2, it is possible to effectively suppress the reduction in printing quality caused by the difference in the landing deviation between the plurality of head chips 3.

[0144] In the head chip 3-4 including the nozzle forming area S3 constituting the first overlapping area A1, the size of the non-overlapping area B different from the overlapping area A is smaller than the first overlapping area A1. By making the size of the non-overlapping area B1 smaller than the size of the first overlapping area A1, the liquid ejecting head 30 in the Y1 direction can be miniaturized compared with the case where the size exceeds the first overlapping area A1.

[0145] In addition, as in the above-described embodiment, by making the size of the non-overlapping area B1 larger than the size of the first overlapping area A1, it is possible to provide the liquid ejecting head 30 suitable for a line head.

[0146] 2-2. Second Modification

[0147] Fig.19 2 is a bottom view of a liquid ejecting head 30B according to a second modification. Fig.19 The liquid ejecting head 30B of the second modification shown in the figure has six head chips 3. The number of head chips 3 included in the liquid ejecting head 30B is an even number. Fig.19 In the example of , the center position O1 is located in the first overlapping area A1 in the Y1 direction. In addition, the fourth overlapping area A4 is configured in a manner to sandwich the center position O1 relative to the second overlapping area A2. In the Y1 direction, the size of the second overlapping area A2 is substantially the same as the size of the fourth overlapping area A4. Even if the number of head chips 3 is an even number, the reduction in printing quality can be effectively suppressed in the same manner as in the above-mentioned embodiment.

[0148] In addition, the so-called substantially the same size means that the difference between the two is less than 1% when the size of the nozzle formation area of ​​one head chip in the first direction is set to 100%. For the so-called substantially the same size, for example, the so-called substantially the same size means that when the number of nozzles included in the nozzle formation area S3 of one head chip in the first direction is 400 nozzles, it is 1% thereof, that is, less than four nozzles.

[0149] 2-3. Third Modification

[0150] Fig. 20 FIG. 4 is a bottom view of a liquid ejecting head 30C according to a third modified example. Fig. 20 In the liquid jet head 30C of the third variant shown, in the Y1 direction, the second overlapping area A2 is smaller than the first overlapping area A1 and larger than the third overlapping area A3. That is, the sizes of the third overlapping area A3, the second overlapping area A2 and the first overlapping area A1 increase in this order. Therefore, the size of the overlapping area A increases in stages toward the center position O1. If viewed from another point of view, the size of the overlapping area A is changed according to the velocity distribution of the airflow in the Y1 direction. According to the variant involved, compared with the aforementioned embodiment, the reduction in printing quality caused by the difference in the drop deviation between the multiple head chips 3 can be effectively suppressed. In addition, with respect to the fourth overlapping area A4, the fifth overlapping area A5 and the sixth overlapping area A6, similarly, in the Y1 direction, the fifth overlapping area A5 is smaller than the fourth overlapping area A4 and larger than the sixth overlapping area A6.

[0151] 2-4. Other Modifications

[0152] Although the head chip 3 is not configured to circulate ink, the head chip 3 may be a circulation type head having a so-called circulation flow path.

[0153] In addition to equipment dedicated to printing, "liquid ejection devices" can also be used in various devices such as fax machines and copiers. The use of liquid ejection devices is not limited to printing. For example, a liquid ejection device that ejects a solution of a color material can be used as a manufacturing device for forming a color filter of a display device such as a liquid crystal display panel. In addition, a liquid ejection device that ejects a solution of a conductive material can be used as a manufacturing device for forming wiring or electrodes of a wiring substrate. In addition, a liquid ejection device that ejects a solution of an organic substance related to a living body can be used as a manufacturing device for manufacturing a biochip, for example.

[0154] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the aforementioned embodiments. In addition, the configuration of each part of the present invention can be replaced with an arbitrary configuration that exhibits the same functions as the aforementioned embodiments, and an arbitrary configuration can be added.

[0155] Explanation of symbols

[0156] 3…head chip, 30…liquid ejection head, 34…driving element, 37…nozzle plate, 53…support part, 55…cutout, 56…frame, 60…suppression part, 100…liquid ejection device, A…overlapping area, A1…first overlapping area, A2…second overlapping area, A3…third overlapping area, A4…fourth overlapping area, A5…fifth overlapping area, B…non-overlapping area, B1…non-overlapping area, L…nozzle row, M…medium, N…nozzle, O1…center position, S3…nozzle forming area, S30…all nozzle forming areas.

Claims

1. A liquid ejecting head, characterized in that: have: A plurality of head chips, which are four or more and are arranged in a staggered manner along a first direction; a supporting member for supporting the plurality of head chips, The plurality of head chips are arranged to have an overlapping region in which a portion of a nozzle forming region of one of the adjacent head chips overlaps a portion of a nozzle forming region of another head chip when viewed in a second direction orthogonal to the first direction. The plurality of overlapping regions include a first overlapping region and a second overlapping region, the second overlapping region being further away from the center position in the first direction of all nozzle forming regions formed by all nozzle forming regions of the plurality of head chips than the first overlapping region, In the first direction, the first overlapping area is larger than the second overlapping area.

2. The liquid ejecting head according to claim 1, wherein: The first overlapping region is, in the first direction, an overlapping region that is closest to the center position among the plurality of overlapping regions.

3. The liquid ejecting head according to claim 1, wherein: In the first direction, the size of the first overlapping area is more than twice the average size of the plurality of overlapping areas.

4. The liquid ejecting head according to claim 1, wherein: In the first direction, the size of the second overlapping area is less than half of an average size of the plurality of overlapping areas.

5. The liquid ejecting head according to claim 1, wherein: In the first direction, the size of the first overlapping area is more than twice the average size of the plurality of overlapping areas. In the first direction, the size of the second overlapping area is less than half of an average size of the plurality of overlapping areas.

6. The liquid ejecting head according to claim 1, wherein: In the first direction, a size of the first overlapping area is more than five times a size of the second overlapping area.

7. The liquid ejecting head according to claim 1, wherein: The plurality of head chips include a head chip including the first overlapping region and a non-overlapping region that does not overlap with the nozzle forming regions of other head chips when viewed in the second direction and is less than half of the nozzle forming regions.

8. The liquid ejecting head according to claim 1, wherein: In the head chip including the nozzle forming region constituting the first overlapping region, a size of a non-overlapping region different from the overlapping region is equal to or smaller than a size of the first overlapping region.

9. The liquid ejecting head according to claim 1, wherein: The plurality of overlapping regions include a third overlapping region having a smaller size than the first overlapping region in the first direction, The second overlapping region is arranged between the first overlapping region and the third overlapping region in the first direction, The support component has a cutout between the second overlapping area and the third overlapping area.

10. The liquid ejecting head according to claim 9, wherein: The support member is not formed with a cutout between the first overlapping region and the second overlapping region.

11. The liquid ejecting head according to claim 1, wherein The plurality of overlapping regions include a fourth overlapping region disposed between the first overlapping region and sandwiching the center position. In the first direction, a size of the first overlapping area is substantially the same as a size of the fourth overlapping area.

12. The liquid ejecting head according to claim 1, wherein The center position is located within the first overlapping area in the first direction, The plurality of overlapping regions include a fourth overlapping region disposed between the second overlapping region and sandwiching the center position. In the first direction, a size of the second overlapping area is substantially the same as a size of the fourth overlapping area.

13. The liquid ejecting head according to claim 1, wherein: The plurality of overlapping regions include a third overlapping region arranged in the first direction so as to sandwich the second overlapping region between the first overlapping region, In the first direction, the size of the second overlapping area is smaller than the size of the first overlapping area, and larger than the size of the third overlapping area.

14. The liquid ejecting head according to claim 1, wherein In the first direction, a total size of the plurality of overlapping regions is smaller than a size of the nozzle forming region of the head chip.

15. A liquid ejection device, characterized in that: have: A liquid ejecting head according to any one of claims 1 to 14 for ejecting liquid onto a medium; A conveying unit conveys the medium.

16. A liquid ejection device, characterized in that: have: The liquid ejecting head according to claim 9 for ejecting liquid onto a medium; a suppressing portion that suppresses buoyancy of the medium, The suppressing portion is arranged at the incision.

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