An exhaust pipeline semiconductor coating device with a clogging prevention function
By introducing auxiliary structures and monitoring structures into semiconductor coating equipment, the problem of pipeline crystal blockage is solved, efficient cleaning and real-time monitoring are achieved, and the operation stability and service life of the equipment are improved.
Patent Information
- Application Number
- CN202411882842.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2044-12-19
AI Technical Summary
The internal pipelines of semiconductor coating equipment are prone to crystallization and blockage, which affects the normal use and service life of the equipment.
The auxiliary structure is designed in combination with the monitoring structure. The auxiliary structure cleans the pipeline crystallization through the moving ring and the impact plate. The monitoring structure monitors the crystal layer thickness in real time through the infrared emitter and receiver and triggers an alarm to achieve rapid positioning and cleaning.
It improves the efficiency and speed of cleaning and crystallization, reduces energy consumption, extends the service life of the equipment, and ensures the smooth operation of the equipment.
Smart Images

Figure CN119736598B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor coating equipment, and specifically relates to a semiconductor coating equipment with an anti-blocking function for an exhaust pipeline. Background Art
[0002] In the patent application with the application publication number CN117512526A, it includes a coating cabinet, a clamping component arranged in the coating cabinet for fixing the semiconductor to be coated, a vacuum component arranged outside the coating cabinet for evacuating the coating cabinet, and an electron gun device arranged below the semiconductor to be coated; a cleaning component for cleaning the clamping component is arranged in the coating cabinet, and the cleaning component includes a linear guide rail arranged at the top of the coating cabinet, a cleaning straight rod arranged on an electric slider of the linear guide rail, and a cleaning strip arranged below the cleaning straight rod through a plurality of cleaning cylinders. The advantages are as follows: First, the clamping component fixes the semiconductor to be coated in the inner cavity of the coating cabinet, and then the vacuum component evacuates the inner cavity of the coating cabinet to a vacuum state. The electron gun device is powered on and starts to heat the inner cavity of the coating cabinet. The electron gun device heats and evaporates the coating material by converting the kinetic energy of electrons into heat energy. The coating material forms a beam and adsorbs on the surface of the semiconductor to be coated. Finally, the electric slider on the linear guide rail drives the cleaning strip to move through the cleaning straight rod and the cleaning cylinders, and the cleaning strip can clean the residual coating material on the surface of the fixture frame and the locking strip plate, improving the problem that it is difficult to clean the coating material on the surface of the fixture body.
[0003] In the prior art including the above patent, the blockage of the pipeline of the semiconductor coating equipment often comes from the uneven temperature inside the pipeline, resulting in crystal deposition. The blockage in the main exhaust pipeline will affect the vacuum pumping performance in the core cavity, directly affecting the process quality; even more seriously, when the gas in the cavity cannot be discharged after a more serious blockage, there is a risk of equipment damage. Summary of the Invention
[0004] The problem to be solved by the present invention is that the internal pipeline of the semiconductor coating equipment is prone to crystal blockage, affecting the normal use and service life of the equipment.
[0005] To solve the above technical problems, the technical solution of the present invention is: a semiconductor coating equipment with an anti-blocking function for an exhaust pipeline, including a semiconductor coating machine. A plurality of exhaust pipes are arranged inside the semiconductor coating machine, and the exhaust pipes are used for the gas inlet and outlet of the semiconductor coating machine. A connection shell and an adapter seat are respectively arranged on both sides of the exhaust pipe. A cavity is opened inside the connection shell, and an auxiliary structure is arranged on one side of the connection shell, and a monitoring structure is arranged on the auxiliary structure;
[0006] The auxiliary structure includes a limiting ring. The inner wall of the limiting ring is fixedly connected to the bottom of the cavity of the connecting shell. The number of the limiting rings is two and they are symmetrically arranged in a semi-circular shape. The surface of the limiting ring is provided with a number of rolling balls arranged in a circumferential array. Control wheels are rotatably provided at the top and bottom of the cavity. A belt is provided on the surfaces of the control wheels and the limiting ring. The two control wheels are drivingly connected by the belt.
[0007] The monitoring structure includes an infrared emitter. One side of the infrared emitter is slidably connected to the chute. A limiting screw is provided at the top of the infrared emitter, which can control the infrared emitter to move up and down along the chute. An alarm is provided at the top of the connecting seat. A movable ring is fixedly provided on one side of the connecting seat. A clamping groove is provided on one side of the movable ring, which is adapted to the threaded rod. An infrared receiver is provided on one side of the movable ring. The infrared receiver is used in cooperation with the infrared emitter, and the infrared receiver is electrically connected to the alarm.
[0008] Preferably, a fixing ring is fixedly provided on one side of the connecting shell. Four chutes are opened on one side of the fixing ring. A threaded rod is fixedly provided on one side of the control wheel. One side of the threaded rod sequentially passes through the connecting shell and the fixing ring and extends to the outside of the fixing ring.
[0009] Preferably, toothed plates are fixedly provided on the front and back of the fixing ring. A moving ring is in threaded cooperation with the threaded rod. Empty grooves are opened on the front and rear sides of one side of the moving ring, and the empty grooves are in a semi-circular arc shape.
[0010] Preferably, rotating shafts are rotatably connected to the front and back of the moving ring. A torsion spring is provided inside the rotating shafts. A touch plate is provided on the front of the rotating shafts. Impact plates are provided at the top and bottom of the front of the rotating shafts. Impact needles are fixedly provided on both sides of the front of the impact plates.
[0011] Preferably, a motor is provided at the top of the inner wall of the connecting shell. A driving wheel is fixedly provided on the output shaft of the motor. A driven wheel is fixedly provided on one side of one of the control wheels, and the driven wheel is meshed with the driving wheel.
[0012] Preferably, flange plates are provided on both sides of the exhaust pipe. Auxiliary pipes are fixedly communicated with both sides of the top of the exhaust pipe, and control valves are provided on both sides of the auxiliary pipes.
[0013] Compared with the prior art, the technical solution of the present invention has the following advantages:
[0014] (1) An auxiliary structure and a monitoring structure are provided inside the semiconductor coating machine. The two can cooperate with each other to monitor and process the crystallization of the equipment pipeline. The auxiliary structure is mainly used when the crystallization in the pipeline condenses thickly. After a section of the pipeline is disassembled and opened by the user, the crystallization condensed inside the pipeline can be quickly cleaned through the moving ring. The cleaning efficiency is high and the speed is fast, improving the maintenance efficiency. The movement of the moving ring is controlled by the cooperation of two threaded rods. The two threaded rods are rotated by a motor, reducing energy consumption and being more energy-saving and environmentally friendly. Impact plates are also provided on both sides of the moving ring. The impact plates are inclined. During the movement of the moving ring, they can be linked with the toothed plate, so that the impact plates will first rotate around the rotating shaft to squeeze the crystallization, and then when they move to the middle position of the toothed plate, the torsion spring inside the rotating shaft will control the impact plates to quickly rebound and generate a vibrating impact on the pipe wall, forming a dual-purpose function of squeezing and crushing the crystallization and reducing the vibration to avoid the adhesion and residue of fine crystallization on the pipeline, further improving the ability to remove crystallization and making the semiconductor coating equipment operate more smoothly and have a longer service life;
[0015] (2) The monitoring structure monitors the thickness change of the crystallization layer inside the pipeline in real time through an infrared emitter at one end and an infrared receiver at the other end. When there is no crystallization layer or the crystallization layer does not reach the thickness that affects the operation of the equipment, the linear infrared light emitted by the infrared emitter will be received by the infrared receiver. When the crystallization layer is squeezed to a certain thickness, the crystallization layer will block the linear infrared light. At this time, when the infrared receiver does not receive the infrared light for a period of time, the alarm will be triggered. The user can achieve early warning in the first time according to the sound of the alarm and quickly locate the clean pipeline, quickly locate the crystallization pipeline among several pipelines. The positions of the infrared emitter and the receiver can also be adjusted, and the thickness of the crystallization to be monitored can be adjusted according to actual needs. The movable ring at this end of the connecting seat is clamped with the threaded rod and the toothed plate, and can be directly manually disassembled, so that the user can directly drop the broken crystallization outside the equipment when cleaning the pipeline. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 Schematic diagram of the overall structure of the semiconductor coating machine of the present invention;
[0017] Figure 2 Schematic diagram of the internal structure of the semiconductor coating machine of the present invention;
[0018] Figure 3 Schematic diagram of the exhaust pipe structure of the present invention;
[0019] Figure 4 Schematic diagram of the auxiliary structure of the present invention;
[0020] Figure 5 Right view schematic diagram of the motor structure of the present invention;
[0021] Figure 6 Left view schematic diagram of the fixed ring structure of the present invention;
[0022] Figure 7 Schematic diagram of the infrared emitter structure of the present invention;
[0023] Figure 8 Explosion schematic diagram of the auxiliary structure of the present invention;
[0024] Figure 9 Explosion schematic diagram of the moving ring structure of the present invention;
[0025] Figure 10 Schematic diagram of the moving ring structure of the present invention;
[0026] Figure 11 Schematic diagram of the impact plate structure of the present invention;
[0027] Figure 12 Schematic diagram of the belt structure of the present invention;
[0028] Figure 13 Enlarged schematic diagram of the structure at location A of the present invention.
[0029] In the figure: 1. Semiconductor coating machine; 2. Exhaust pipe; 3. Control valve; 4. Auxiliary pipe; 5. Flange; 6. Connection shell; 7. Connection seat; 8. Monitoring structure; 801. Infrared receiver; 802. Movable ring; 803. Limit screw; 804. Infrared emitter; 9. Auxiliary structure; 901. Threaded rod; 902. Toothed plate; 903. Fixed ring; 904. Moving ring; 905. Limit ring; 906. Empty slot; 907. Driven wheel; 908. Belt; 909. Ball; 910. Control wheel; 911. Impact plate; 912. Rotating shaft; 913. Touching plate; 10. Motor; 11. Driving wheel; 12. Alarm. Specific embodiments
[0030] The following will clearly and completely describe the technical solutions of the embodiments of the present disclosure in conjunction with the accompanying drawings of the embodiments of the present disclosure, making the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.
[0031] Unless otherwise defined, technical terms or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The words such as "including" or "comprising" used in this disclosure mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words such as "connected" or "coupled" are not limited to physical or mechanical connections, and may also include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left", and "right" are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0032] As Figures 1 to 13 shown, a semiconductor coating device with an anti-blocking function exhaust pipeline provided by the present invention includes a semiconductor coating machine 1. A plurality of exhaust pipes 2 are arranged inside the semiconductor coating machine 1. The exhaust pipes 2 are used for the gas inlet and outlet of the semiconductor coating machine 1. A connection shell 6 and an adapter seat 7 are respectively arranged on both sides of the exhaust pipe 2. A cavity is formed inside the connection shell 6. An auxiliary structure 9 is arranged on one side of the connection shell 6, and a monitoring structure 8 is arranged on the auxiliary structure 9;
[0033] The auxiliary structure 9 includes a limiting ring 905. The inner wall of the limiting ring 905 is fixedly connected to the bottom of the cavity of the connection shell 6. The number of the limiting rings 905 is two and they are symmetrically arranged in a semi-circular shape. A plurality of balls 909 are arranged on the surface of the limiting ring 905 in a circumferential array. Control wheels 910 are rotatably arranged at the top and bottom of the cavity. A belt 908 is arranged on the surfaces of the control wheels 910 and the limiting ring 905. The two control wheels 910 are drivingly connected through the belt 908;
[0034] The monitoring structure 8 includes an infrared emitter 804. One side of the infrared emitter 804 is slidably connected to a chute. A limiting screw 803 is arranged at the top of the infrared emitter 804. The limiting screw 803 can control the up and down movement of the infrared emitter 804 along the chute. An alarm 12 is arranged at the top of the adapter seat 7. A movable ring 802 is fixedly arranged on one side of the adapter seat 7. A clamping groove is arranged on one side of the movable ring 802. The clamping groove is adapted to a threaded rod 901. An infrared receiver 801 is arranged on one side of the movable ring 802. The infrared receiver 801 is used in cooperation with the infrared emitter 804. The infrared receiver 801 is electrically connected to the alarm 12.
[0035] A fixing ring 903 is fixedly arranged on one side of the connection shell 6. Four chutes are formed on one side of the fixing ring 903. A threaded rod 901 is fixedly arranged on one side of the control wheel 910. One side of the threaded rod 901 sequentially penetrates through the connection shell 6 and the fixing ring 903 and extends to the outside of the fixing ring 903.
[0036] Tooth plates 902 are fixedly provided on both the front and back of the fixed ring 903. A moving ring 904 is in threaded fit with the threaded rod 901. Semicircular arc-shaped empty slots 906 are formed on both the front and back sides of one side of the moving ring 904. The empty slots 906 can facilitate the emission of infrared light from the infrared emitter 804 and avoid occlusion.
[0037] Rotating shafts 912 are rotatably connected to both the front and back of the moving ring 904. A torsion spring is provided inside the rotating shafts 912. A touch plate 913 is provided on the front of the rotating shafts 912. Impact plates 911 are provided on both the top and bottom of the front of the rotating shafts 912. Impact needles are fixedly provided on both sides of the front of the impact plates 911.
[0038] A motor 10 is provided at the top of the inner wall of the connection shell 6. A driving wheel 11 is fixedly provided on the output shaft of the motor 10. A driven wheel 907 is fixedly provided on one side of one of the control wheels 910. The driven wheel 907 is meshed with the driving wheel 11.
[0039] Flange plates 5 are provided on both sides of the exhaust pipe 2. Auxiliary pipes 4 are fixedly communicated with both sides of the top of the exhaust pipe 2. Control valves 3 are provided on both sides of the auxiliary pipes 4.
[0040] Working principle and usage process of the present invention: After the semiconductor coating machine 1 has been running for a long time, crystallization will occur inside the pipeline due to uneven temperature inside the pipeline. When the thickness of the crystallization layer is relatively thick, it will affect the normal use of the semiconductor coating machine 1. Moreover, there are many internal pipelines in the semiconductor coating machine 1 and the main body inside the equipment is pipelines. Therefore, the crystallization inside the pipeline will directly or indirectly affect the normal use and service life of the equipment. When the user installs the exhaust pipe 2 inside the semiconductor coating machine 1, when adjusting the different crystallization thickness monitoring according to the size and installation position of the exhaust pipe 2, the limit screw 803 can be rotated. The limit screw 803 drives the infrared emitter 804 to move along the chute. Similarly, the infrared receiver 801 on the other side can also be adjusted to the appropriate position in the same way. After adjustment, the infrared emitter 804 is turned on. The infrared emitter 804 will emit a straight-line infrared light that is received by the infrared receiver 801. After the debugging is completed, the entire device can be installed inside the exhaust pipe 2. First, place the connection shell 6 and the auxiliary structure 9 on one side of it inside the exhaust pipe 2. After placing it properly, install the connection seat 7 from the other end, so that the connection seat 7 is clamped with the threaded rod 901 and the toothed plate 902. Then the semiconductor coating machine 1 can be used normally. As the usage time increases, the crystallization gradually thickens. When the thickness of the crystallization grows to block the conduction of infrared rays, the infrared receiver 801 will trigger the alarm 12 to sound after not receiving the infrared signal for a period of time, so that the user can clean the crystallization. The user can quickly locate the position of the alarm pipeline according to the alarm sound. After confirmation, one end of the exhaust pipe 2 is disassembled. After disassembly, the motor 10 is started. The motor 10 controls the rotation of the driven wheel 907 through the driving wheel 11. The driven wheel 907 drives one of the control wheels 910 to rotate. The control wheel 910 controls the rotation of the other control wheel 910 through the belt 908. The rotation of the two control wheels 910 can drive the rotation of the two threaded rods 901. At this time, the moving ring 904 on the threaded rod 901 will move along the inner wall of the pipeline to push and clean the crystallization on the inner wall of the pipeline. While the moving ring 904 is moving, the touch plates 913, impact plates 911 and rotating shafts 912 on its front and back are all inclined. When the touch plate 913 passes through the teeth on the toothed plate 902, it will drive the rotation of the rotating shaft 912 through extrusion and compress the torsion spring, so that the impact plate 911 becomes parallel to the toothed plate 902. At this time, the impact needle at the front end of the impact plate 911 will squeeze the crystallization to break it. When passing through the teeth on the toothed plate 902 to reach the gap position, the torsion spring will control the rotating shaft 912 to quickly return to the initial position, and the resilience will control the rear end of the impact plate 911 to impact the inner wall of the pipeline, shaking off the fine crystallization debris until the moving ring 904 moves to the end of the pipeline, disassemble the connection seat 7, collect the crystallization inside the pipeline, and after collection, reverse the motor 10 to make the moving ring 904 return to the initial position, and then re-adjust the infrared emitter 804.
[0041] The above embodiments are only exemplary embodiments of the present invention and are not used to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions within the essence and protection scope of the present invention, and such modifications or equivalent substitutions should also be regarded as falling within the protection scope of the present invention.
Claims
1. An exhaust pipeline semiconductor coating device with an anti-blocking function, including a semiconductor coating machine, characterized in that: Inside the semiconductor coating machine (1), there are several exhaust pipes (2) which are used for the gas inlet and outlet of the semiconductor coating machine (1). On both sides of the exhaust pipe (2), there are a connecting shell (6) and an adapter seat (7) respectively. A cavity is formed inside the connecting shell (6). On one side of the connecting shell (6), there is an auxiliary structure (9), and a monitoring structure (8) is arranged on the auxiliary structure (9). The auxiliary structure (9) includes a limit ring (905). The inner wall of the limit ring (905) is fixedly connected to the bottom of the cavity of the connecting shell (6). The number of the limit rings (905) is two and they are symmetrically arranged in a semi-circular shape. A number of balls (909) are arranged on the surface of the limit ring (905) in a circumferential array. Control wheels (910) are rotatably arranged at the top and bottom of the cavity. A belt (908) is arranged on the surfaces of the control wheels (910) and the limit ring (905). The two control wheels (910) are drivingly connected by the belt (908). The monitoring structure (8) includes an infrared emitter (804). One side of the infrared emitter (804) is slidably connected to a chute. A limit screw (803) is arranged at the top of the infrared emitter (804). The limit screw (803) can control the up and down movement of the infrared emitter (804) along the chute. An alarm (12) is arranged at the top of the adapter seat (7). A movable ring (802) is fixedly arranged on one side of the adapter seat (7). A clamping groove is arranged on one side of the movable ring (802). The clamping groove is adapted to a threaded rod (901). An infrared receiver (801) is arranged on one side of the movable ring (802). The infrared receiver (801) and the infrared emitter (804) are used in cooperation with each other. The infrared receiver (801) is electrically connected to the alarm (12).
2. The semiconductor coating equipment for exhaust pipelines with anti-blocking function according to claim 1, characterized in that: A fixed ring (903) is fixedly arranged on one side of the connecting shell (6). Four chutes are formed on one side of the fixed ring (903). A threaded rod (901) is fixedly arranged on one side of the control wheel (910). One side of the threaded rod (901) sequentially penetrates through the connecting shell (6) and the fixed ring (903) and extends to the outside of the fixed ring (903).
3. The semiconductor coating equipment for an exhaust pipeline with an anti-blocking function according to claim 2, wherein: Tooth plates (902) are fixedly arranged on the front and back of the fixed ring (903). A moving ring (904) is in threaded cooperation with the threaded rod (901). Empty slots (906) are formed on the front and back of one side of the moving ring (904). The empty slots (906) are in a semi-circular arc shape.
4. The semiconductor coating device for an exhaust pipeline with a clogging prevention function according to claim 3, wherein: Rotating shafts (912) are rotatably connected to the front and back of the moving ring (904). A torsion spring is arranged inside the rotating shafts (912). A touch plate (913) is arranged on the front of the rotating shafts (912). Impact plates (911) are arranged at the top and bottom of the front of the rotating shafts (912). Impact needles are fixedly arranged on both sides of the front of the impact plates (911).
5. The semiconductor coating device for an exhaust pipeline with a clogging prevention function according to claim 1, wherein: At the top of the inner wall of the connecting shell (6), there is a motor (10), and a driving wheel (11) is fixedly arranged on the output shaft of the motor (10). On one side of one of the control wheels (910), a driven wheel (907) is fixedly arranged, and the driven wheel (907) is engaged with the driving wheel (11).
6. The semiconductor coating equipment for an exhaust pipeline with a clogging prevention function according to claim 1, wherein: On both sides of the exhaust pipe (2), there are flange plates (5). On both sides of the top of the exhaust pipe (2), auxiliary pipes (4) are fixedly communicated. On both sides of the auxiliary pipes (4), there are control valves (3).
Citation Information
Patent Citations
Semiconductor coating equipment
CN117512526A
Special tool for dredging crystallization blockage of valve of gas purification device
CN116833176A
Heat exchanger and cleaning device with the same
CN1890510A