Silicon photonic wafer testing apparatus and fiber pose adjustment mechanism, method and system thereof

Abstract

The application discloses a silicon light wafer testing device and a fiber pose adjusting mechanism, method and system thereof. The fiber pose adjusting mechanism comprises a camera assembly and a deflection optical path assembly; a probe station for carrying a silicon light wafer; a fiber coupling module; and a driving assembly. When the driving assembly drives the silicon light wafer to be located in the imaging field of view of the camera assembly, the camera assembly is adjusted to be parallel to the cutting path of the silicon light wafer. When the driving assembly drives the deflection optical path assembly to move into the imaging field of view of the camera assembly, the camera assembly collects lateral images of the end of the optical fiber in at least two different directions through the deflection optical path assembly. The fiber coupling module is used for adjusting the pose of the end of the optical fiber according to the lateral images and the direction of the camera assembly coordinate system, so that the end of the optical fiber is preliminarily aligned with the silicon light wafer. In the application, the operation difficulty and the equipment structure of the alignment coupling between the end of the optical fiber and the silicon light waveguide are simplified, and the equipment cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of silicon photonics wafer testing technology, and in particular to a fiber optic pose adjustment mechanism for silicon photonics wafer testing equipment, silicon photonics wafer testing equipment, a fiber optic pose adjustment method for silicon photonics wafer testing equipment, and a silicon photonics wafer testing system. Background Technology

[0002] Silicon photonics wafer testing equipment is mainly used to test whether the silicon photonics chips formed on silicon photonics wafers can work properly. In the actual testing process, it is necessary to use optical fibers or optical fiber arrays to transmit optical signals to the silicon photonics chips arranged in an array on the wafer, and to perform optical performance tests based on the optical signals output by the silicon photonics chips.

[0003] In the performance testing of silicon optical waveguides, ensuring effective alignment and coupling between the fiber optic port and the silicon optical waveguide on the wafer is a crucial factor in improving test accuracy. Therefore, achieving proper alignment and coupling between the fiber optic array port and the optical interface of the silicon optical waveguide on the wafer during silicon optical wafer testing is a key focus in the industry. Summary of the Invention

[0004] The purpose of this invention is to provide a fiber optic pose adjustment mechanism, coupling method, and testing system for silicon photonics wafer testing equipment, which enables simpler alignment between the optical waveguide and the fiber optic port during silicon photonics wafer testing, reducing the cost of testing equipment and simplifying the alignment and coupling process.

[0005] To address the aforementioned technical problems, this invention provides an optical fiber pose adjustment mechanism for a silicon photonics wafer testing device, comprising a micro-imaging assembly, a probe station, an optical fiber coupling module, and a driving assembly; the micro-imaging assembly includes a camera assembly and a deflection optical path assembly; the probe station is used to support the silicon photonics wafer; the driving assembly is used to drive the probe station and the deflection optical path assembly to switch between moving into the imaging field of view of the camera assembly;

[0006] When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component adjusts its coordinate system to be parallel to the dicing path of the silicon photonic wafer.

[0007] When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to acquire lateral images corresponding to at least two different lateral views of the optical fiber end of the deflection optical path component; the optical fiber coupling module is used to adjust the pose of the optical fiber end according to the lateral images and the orientation of the camera component coordinate system, so that the optical fiber end is initially aligned with the silicon photonic wafer.

[0008] In one optional embodiment of this application, a crosshair cursor is provided inside the camera lens of the camera assembly;

[0009] When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component is used to acquire a wafer image of the silicon photonic wafer, and adjust the crosshair of the camera in the camera component to be parallel to the dicing track on the silicon photonic wafer using the wafer image.

[0010] In one optional embodiment of this application, the deflecting optical path assembly includes at least two reflective elements;

[0011] When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to acquire a first lateral image of the fiber end of the fiber array in a first horizontal direction and a second lateral image in a second horizontal direction through the deflection optical path component; and uses the fiber coupling module to adjust the end face of the fiber end to a horizontal plane based on the first lateral image and the second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other;

[0012] The camera assembly is also used to acquire a vertical image of the end of the optical fiber from a vertical direction; the optical fiber coupling module is used to adjust the outline of the end of the optical fiber to be parallel to the crosshair of the camera according to the vertical image.

[0013] In one optional embodiment of this application, the deflecting optical path assembly includes a support stage connected to the probe stage, and a first reflective element and a second reflective element disposed on the support stage;

[0014] It also includes a first light source assembly and a second light source assembly disposed on the support platform;

[0015] Wherein, the first light source component is used to output a light beam to the first reflective element along the first horizontal direction, and the first reflective element is used to reflect the incident light beam in a vertically upward direction; the second light source component is used to output a light beam to the second reflective element along the second horizontal direction, and the second reflective element is used to reflect the incident light beam in a vertically upward direction; and the optical path between the first light source component and the first reflective element intersects with the optical path between the second light source component and the second reflective element at a predetermined intersection area;

[0016] When the deflection optical path assembly moves to below the camera assembly via the second driving assembly, the end of the optical fiber is located in the designated intersection area;

[0017] The camera assembly is used to capture the first lateral image when the camera is moved directly above the first reflective element, and to capture the second lateral image when the camera is moved directly above the second reflective element.

[0018] In one optional embodiment of this application, the end connection structure of the optical fiber coupling module for connecting the end of the optical fiber is further provided with a height probe structure;

[0019] Accordingly, a calibration substrate is also provided on the support platform corresponding to the designated intersection area;

[0020] When the driving component drives the deflection optical path component to move to a distance within a set height range between the lower surface of the height probe structure and the upper surface of the calibration substrate, the end of the optical fiber is located in the set intersection area.

[0021] In one optional embodiment of this application, the height detection structure is a nanocapacitive displacement sensor.

[0022] In one optional embodiment of this application, the first light source assembly includes a first surface light source and a third reflective element; the second light source assembly includes a second surface light source and a fourth reflective element;

[0023] Furthermore, the first reflective element, the second reflective element, the third reflective element, and the fourth reflective element are all right-angled triangular prisms, and a reflective film layer is provided on the inclined reflective surface of the right-angled triangular prism;

[0024] The oblique reflective surface of the third reflective element is located in the output light path of the first surface light source, and is used to reflect the light beam output by the first surface light source along the first horizontal direction through the set intersection area and incident on the first reflective element, so that the first reflective element reflects the light carrying the lateral contour information of the end of the optical fiber.

[0025] The oblique reflective surface of the fourth reflective element is located in the output light path of the second surface light source, and is used to reflect the light beam output by the second surface light source along the second horizontal direction through the set intersection area and incident on the second reflective element, so that the second reflective element reflects the light carrying the lateral contour information of the end of the optical fiber.

[0026] In one optional embodiment of this application, the fiber optic coupling module includes three translational components and three rotational components connected in sequence, as well as an end connection structure;

[0027] The three translational components are used to drive the end-connecting structure to translate along a first direction, a second direction, and a third direction, respectively. The three rotational components are used to drive the end-connecting structure to rotate around a first rotation axis, a second rotation axis, and a third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

[0028] A silicon photonics wafer testing device includes an optical fiber pose adjustment mechanism as described in any of the preceding claims.

[0029] A coupling method for an optical fiber pose adjustment mechanism of a silicon photonics wafer testing equipment, applied to the optical fiber pose adjustment mechanism of the silicon photonics wafer testing equipment as described in any of the preceding claims, the optical fiber pose adjustment method comprising:

[0030] The control drive component drives the silicon photonic wafer to translate into the imaging field of view of the camera component. The camera component is adjusted based on the wafer image acquired by the camera component so that the coordinate system of the camera component and the dicing track on the silicon photonic wafer are parallel to each other.

[0031] The silicon photonic wafer is controlled to move out of the imaging field of view of the camera assembly, and the deflection optical path assembly is moved into the imaging field of view of the camera assembly. The camera assembly acquires lateral images corresponding to at least two different lateral views of the end of the optical fiber that is deflected and transmitted by the deflection optical path assembly.

[0032] Based on the lateral image and the orientation of the camera assembly coordinate system, the fiber coupling module adjusts the pose of the fiber end and controls the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera assembly, so that the fiber array and the silicon photonic wafer are initially aligned.

[0033] In one optional embodiment of this application, the camera assembly is adjusted based on the wafer image acquired by the camera assembly to make the camera assembly coordinate system and the dicing track on the silicon photonic wafer parallel to each other, including:

[0034] The drive assembly is controlled to move the probe station carrying the silicon photonic wafer into the imaging field of view of the camera assembly;

[0035] The camera assembly is used to acquire wafer images of the silicon photonics wafer;

[0036] The camera assembly is adjusted using the wafer image so that the crosshair of the camera in the camera assembly is aligned parallel to the dicing marks on the silicon photonics wafer.

[0037] In one optional embodiment of this application, the fiber coupling module is used to adjust the pose of the fiber end according to the orientation of the lateral image and the coordinate system of the camera assembly, so as to initially align the fiber array with the silicon photonic wafer, including:

[0038] The camera assembly acquires lateral images in the first and second horizontal directions reflected by the optical fiber end through the deflection optical path assembly, thereby obtaining a first lateral image and a second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other;

[0039] Based on the first lateral image and the second lateral image, the fiber coupling module is controlled to adjust the end face of the fiber end to a horizontal plane;

[0040] The camera assembly acquires a vertical image of the end of the optical fiber from a vertical direction.

[0041] Based on the vertical image, the fiber optic coupling module is controlled to adjust the outline of the fiber end to be parallel to the crosshair of the camera.

[0042] In one optional embodiment of this application, controlling the fiber coupling module to adjust the end face of the fiber tip to a horizontal plane based on the first lateral image and the second lateral image includes:

[0043] Based on the end face contour line of the fiber end imaged in the first lateral image, a first included angle between the end face of the fiber end and the second horizontal direction is determined;

[0044] The fiber coupling module is controlled to drive the fiber end to rotate around the second rotation axis by a first included angle; wherein the second horizontal direction and the second rotation axis are parallel to each other.

[0045] Based on the end face contour line of the fiber end imaged in the second lateral image, a second included angle between the end face of the fiber end and the first horizontal direction is determined;

[0046] The fiber coupling module is controlled to drive the fiber end to rotate around the first rotation axis by a second included angle; wherein the first horizontal direction and the first rotation axis are parallel to each other.

[0047] In an optional embodiment of this application, after controlling the fiber coupling module to drive the fiber end to rotate around the second rotation axis by a first included angle, the method further includes:

[0048] The fiber coupling module is used to drive the fiber end to translate along a first direction. The distance, translated upwards along the third party The distance; among which, The distance between the end of the optical fiber and the second rotation axis; The first included angle;

[0049] Accordingly, after controlling the fiber coupling module to drive the fiber end to rotate around the first rotation axis by a second included angle, the method further includes:

[0050] The fiber coupling module is used to drive the fiber end to translate along the second direction. The distance, translated upwards along the third party The distance; among which, The distance between the end of the optical fiber and the first rotation axis; This is the second included angle;

[0051] Wherein, the first direction, the second direction, and the third direction are perpendicular to each other; the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction are vertical directions;

[0052] Furthermore, the first direction and the first horizontal direction are parallel to each other; the second direction and the second horizontal direction are parallel to each other.

[0053] In one optional embodiment of this application, controlling the fiber optic coupling module to adjust the outline of the fiber end to be parallel to the crosshair of the camera, based on the vertical image, includes:

[0054] Based on the end face contour line of the fiber end imaged in the vertical image, determine the third included angle between the end face contour line of the fiber end and the crosshair cursor.

[0055] The fiber coupling module is controlled to drive the fiber end to rotate around the third included angle about the third rotation axis; wherein the third rotation axis is a vertical rotation axis.

[0056] In an optional embodiment of this application, after controlling the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so that the fiber array and the silicon photonic wafer are initially aligned, the method further includes:

[0057] The camera assembly is controlled to acquire aligned images of the fiber optic end and the silicon photonic wafer within the same frame;

[0058] Based on the imaging positions of the fiber port at the end of the optical fiber and the optical interface in the silicon photonics wafer in the alignment image, the optical fiber coupling module is controlled to drive the end of the optical fiber to translate along the first direction and the second direction, so as to achieve initial alignment and coupling between the fiber port and the optical interface at the end of the optical fiber.

[0059] In an optional embodiment of this application, after initial alignment and coupling between the fiber optic port and the optical interface at the end of the fiber, the method further includes:

[0060] Control the output light wave of one optical fiber at each of the optical fiber ends;

[0061] The piezoelectric displacement stage connected to the end connection structure of the optical fiber coupling module drives the end of the optical fiber to translate in the horizontal plane.

[0062] The optical power that changes with the translational movement of the fiber end is detected by a photodetector connected to the end of the optical fiber away from the fiber end.

[0063] The optimal coupling position between the fiber end and each waveguide in the silicon photonic wafer is the location corresponding to the maximum optical power.

[0064] A silicon photonics wafer testing system includes an optical performance tester, a controller, and the silicon photonics wafer testing equipment described above;

[0065] The controller is used to perform the steps of the fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in any of the preceding claims using the silicon photonics wafer testing equipment.

[0066] This invention provides a silicon photonics wafer testing device and its fiber optic pose adjustment mechanism, method, and system. The fiber optic pose adjustment mechanism includes a micro-imaging component, a probe station, a fiber optic coupling module, and a driving component. The micro-imaging component includes a camera component and a deflection optical path component. The probe station carries the silicon photonics wafer. The driving component drives the probe station and the deflection optical path component to alternately move into the imaging field of view of the camera component. When the driving component drives the probe station carrying the silicon photonics wafer to move into the imaging field of view of the camera component, the camera component is adjusted so that its coordinate system is parallel to the dicing path of the silicon photonics wafer. When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component acquires lateral images corresponding to at least two different lateral views of the fiber end of the deflection optical path component. The fiber optic coupling module adjusts the pose of the fiber end according to the lateral images and the orientation of the camera component's coordinate system to initially align the fiber end with the silicon photonics wafer.

[0067] The fiber optic pose adjustment mechanism in this application is equipped with a deflection optical path component and a fiber optic coupling module. The deflection optical path component and the probe station are also connected to a driving component, which allows the driving component to switch the deflection optical path component and the probe station carrying the wafer between each other within the imaging field of view of the camera component. Thus, when the probe station carrying the wafer is moved into the imaging field of view of the camera component, the camera component is adjusted so that the coordinate system of the camera component is parallel to the dicing track on the wafer. When the deflection optical path component is moved and switched into the imaging field of view of the camera component, the deflection optical path component deflects and transmits at least two different lateral images of the fiber end to the camera component, thereby acquiring lateral images of the fiber end. Based on the lateral images and the orientation of the camera component coordinate system, the fiber optic coupling module can be used to adjust the pose of the fiber end, thereby achieving initial alignment between the fiber end and the silicon photonic wafer. The test equipment in this application only requires one set of camera components, and the alignment process of the test equipment is simple and easy to operate, realizing the initial alignment between the fiber end and the silicon waveguide, providing a favorable control basis for subsequent precise alignment and coupling, simplifying the structure of the adjustment mechanism in the entire test equipment, and reducing equipment costs. Attached Figure Description

[0068] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0069] Figure 1 This is a schematic diagram of the overall structure of the silicon photonics wafer testing equipment provided in the embodiments of this application;

[0070] Figure 2 A partial structural schematic diagram of the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment provided in this application embodiment;

[0071] Figure 3 This is a schematic diagram of the structure of a silicon photonics wafer;

[0072] Figure 4 This is a schematic diagram of the fiber end structure of an optical fiber array;

[0073] Figure 5 A schematic diagram of the deflection optical path component in the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment provided in this application embodiment;

[0074] Figure 6 This is a partial optical path structure diagram of the deflection optical path component provided in the embodiments of this application;

[0075] Figure 7This is a schematic diagram of the structure of the fiber optic coupling module provided in the embodiments of this application;

[0076] Figure 8 A schematic flowchart of the fiber optic pose adjustment method of the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment provided in this application embodiment;

[0077] Figure 9 This is a schematic diagram showing the relative positions of the optical waveguide and the optical fiber port within the imaging field of view of the camera provided in this embodiment of the application. Detailed Implementation

[0078] The core of this invention is to provide a fiber optic orientation adjustment mechanism for a silicon photonics wafer testing device, a silicon photonics wafer testing device, a fiber optic orientation adjustment method for a silicon photonics wafer testing device, and a silicon photonics wafer testing system. This simplifies the alignment process between the fiber end and the silicon photonics waveguide, simplifies the entire device mechanism, and reduces the device cost.

[0079] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0080] like Figures 1 to 7 As shown, Figure 1 This is a schematic diagram of the overall structure of the silicon photonics wafer testing equipment provided in the embodiments of this application; Figure 2 A partial structural schematic diagram of the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment provided in this application embodiment; Figure 3 This is a schematic diagram of the structure of a silicon photonics wafer; Figure 4 This is a schematic diagram of the fiber end structure of an optical fiber array; Figure 5 A schematic diagram of the deflection optical path component in the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment provided in this application embodiment; Figure 6 This is a partial optical path structure diagram of the deflection optical path component provided in the embodiments of this application; Figure 7 This is a schematic diagram of the structure of the optical fiber coupling module provided in the embodiment of this application.

[0081] To facilitate understanding of the technical solution of this application, firstly, in conjunction with... Figure 3 and Figure 4 A brief introduction to the alignment coupling between silicon photonic wafers and fiber arrays is given.

[0082] like Figure 3As shown, for the silicon photonics wafer 30, a large number of arrayed optical waveguides 31 are formed on its upper surface, and cutting grooves are cut between adjacent rows and adjacent columns of optical waveguides 31 to divide the adjacent optical waveguides 31. The straight area where the cutting groove is located is also called the cutting track 32. It can be seen that the silicon photonics wafer 30 contains cutting tracks 32 in two mutually perpendicular directions.

[0083] like Figure 4 As shown, the fiber end 20 of the fiber array includes several fiber ports 21 that are fixed together in a row on the fixing member 22. As far as the fiber end 20 is concerned, the end face formed by each fiber port 21 and the lower surface of the fixing member as a whole is roughly a rectangular plane.

[0084] During the actual coupling between the fiber array and the optical waveguide 31, when one fiber port 21 of the fiber array is located directly above and exactly opposite an optical waveguide 31, the fiber array achieves initial alignment with the optical waveguide 31. Furthermore, when the fiber ports 21 of the fiber array and the optical waveguide 31 are aligned and coupled, the vertical plane in which the fiber ports 21 are arranged should be parallel to the cleavage 32 in one direction on the silicon photonics wafer 30 and perpendicular to the cleavage 32 in another direction.

[0085] Based on the above discussion, and referring to... Figure 1 and Figure 2 In one specific embodiment of this application, the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment 10 may include:

[0086] The micro-imaging assembly includes a probe stage 11, an optical fiber coupling module 14, and a driving assembly. The micro-imaging assembly includes a camera assembly 15 and a deflecting optical path assembly 12. The probe stage 11 is used to support the silicon photonic wafer 30. The driving assembly is used to drive the probe stage 11 and the deflecting optical path assembly 12 to switch between moving into the imaging field of view of the camera assembly 15.

[0087] When the driving component 13 drives the probe station 11 carrying the silicon photonic wafer 30 to move into the imaging field of view of the camera component 15, the camera component 15 adjusts to make the camera component coordinate system parallel to the dicing track 32 of the silicon photonic wafer 30.

[0088] When the driving component 13 drives the deflection optical path component 12 to move into the imaging field of view of the camera component 15, the camera component 15 is used to acquire lateral images corresponding to at least two different lateral views of the optical fiber end 20 of the deflection optical path component 12 deflecting the transmission input. The optical fiber coupling module 14 is used to adjust the pose of the optical fiber end 20 according to the lateral images and the orientation of the camera component coordinate system so that the optical fiber end 20 is initially aligned with the silicon photonic wafer 30.

[0089] It is understood that in the actual testing process of the test equipment 10 in this embodiment, the silicon photonic wafer 30 is placed on the probe station 11, and the fiber port 21 of the fiber end 20 of the fiber array is vertically downward and directly facing the optical interface of the optical waveguide.

[0090] Furthermore, the camera component coordinate system refers to the coordinate system in which the camera of the camera component 15 captures and images, generally a two-dimensional rectangular coordinate system on the imaging plane of the camera component 15. In this embodiment, the parallelism between the camera component coordinate system and the dicing 32 of the silicon photonic wafer 30 means that the two mutually perpendicular coordinate axes of the two-dimensional rectangular coordinate system are respectively parallel to the two mutually perpendicular dicing 32 of the silicon photonic wafer 30. Based on this, the camera component 15 in this application captures images with the optical axis of the camera vertically downward. Therefore, when the driving component 13 drives the probe station 11 to position the silicon photonic wafer 30 in the imaging field of view of the camera component 15 (generally located directly below the camera), it is only necessary to control the camera component 15 to rotate and adjust around the optical axis of the camera to make the camera component coordinate system and the dicing 32 of the silicon photonic wafer 30 parallel to each other.

[0091] Optionally, a crosshair is provided within the camera lens of the camera assembly 15. This crosshair is formed by the intersection of two mutually perpendicular straight lines located in the middle region of the lens of the camera assembly 15. The two straight lines forming the crosshair are parallel to the two coordinate axes of the two-dimensional Cartesian coordinate system of the camera assembly 15. Thus, when the drive assembly 13 drives the probe station 11 carrying the silicon photonic wafer 30 to move into the imaging field of view of the camera assembly 15, the camera assembly 15 acquires a wafer image of the silicon photonic wafer 30 and uses this wafer image to adjust the crosshair of the camera lens in the camera assembly 15 to be parallel to the dicing marks on the silicon photonic wafer 30. Furthermore, in this embodiment, the camera lens of the camera assembly 15 can employ a multi-magnification fixed-magnification lens, enabling image acquisition of different sizes of imaging fields.

[0092] Based on this, in an optional implementation of this embodiment, the deflecting optical path assembly 12 can be an optical path structure including at least two reflective elements;

[0093] When the driving component 13 drives the deflection optical path component 12 to move into the imaging field of view of the camera component 15, the camera component 15 is used to acquire a first lateral image of the fiber end 20 in the first horizontal direction and a second lateral image in the second horizontal direction through the deflection optical path component 12; and uses the fiber coupling module 14 to adjust the end face of the fiber end 20 to the horizontal plane according to the first lateral image and the second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other;

[0094] The camera assembly 15 is also used to acquire a vertical image of the fiber end 20 from the vertical direction, and the fiber coupling module 14 is used to adjust the outline of the fiber end 20 to be parallel to the crosshair of the camera according to the vertical image.

[0095] In this embodiment, the first lateral image is equivalent to an image formed by capturing the first lateral view of the fiber optic end 20 from the first horizontal direction. Similarly, the second lateral image is an image formed by capturing the second lateral view of the fiber optic end 20 from the second horizontal direction. However, if the shooting direction of the camera assembly 15 is modulated to the horizontal direction and needs to be roughly on the same horizontal plane as the position of the fiber optic end 20, it will obviously make the adjustment of the camera assembly 15 too complicated. If multiple cameras with different shooting angles are added, the equipment cost will increase. Therefore, in this embodiment, the deflection optical path assembly 12 uses the reflection effect of at least two reflective elements to reflect the lateral images of the two fiber optic ends 20 in two different horizontal directions to the camera assembly 15. That is, only one camera assembly 15 is used, and there is no need to make overly complicated position adjustments to the camera assembly 15 to acquire images of the two different lateral directions of the fiber optic end 20.

[0096] Based on this, in this embodiment, by acquiring the side images corresponding to the side views of the fiber end 20 in two mutually perpendicular directions, the tilt angle between the end face of the fiber end 20 and the horizontal plane can be obtained, and the end face of the fiber end 20 can be adjusted to be horizontal based on the tilt angle.

[0097] Reference Figure 2 ,exist Figure 2 In the illustrated embodiment, the deflection optical path component 12 can be disposed on the side of the probe station 11 and fixedly connected to the probe station 11, while the probe station 11 is disposed on the drive component 13. In addition, the drive component 13 includes two mutually perpendicular slide rails, so that the drive component 13 can drive the probe station 11 and the deflection optical path component 12 to translate along two mutually perpendicular directions, that is, it can drive and adjust the position of the probe station 11 and the deflection optical path component 12 in the horizontal plane, thereby realizing that one of the probe station 11 and the deflection optical path component 12 is located directly below the camera in the camera component 15, that is, within the imaging field of view of the camera.

[0098] Once the camera assembly 15 is adjusted so that the crosshair and the dicing path 32 of the silicon photonics wafer 30 are parallel to each other, the drive assembly 13 can further drive the probe station 11 and the deflection optical path assembly 12 to move synchronously, thereby driving the deflection optical path assembly 12 to move below the camera, that is, within the imaging field of view of the camera. The deflecting optical path assembly 12 includes at least a first reflective element 121 and a second reflective element 122, and the reflective surfaces of the first reflective element 121 and the second reflective element 122 can be perpendicular to each other and both form a 45-degree angle with the horizontal plane; when the driving assembly 13 moves the deflecting optical path assembly 12 to a set position below the camera, the first reflective element 121, the second reflective element 122 and the optical fiber end 20 should be distributed in a right-angled triangle; and the end face height of the optical fiber end 20 should be approximately the same as the height of the middle area of ​​the first reflective element 121 and the second reflective element 122; ensuring that the side view of the optical fiber end 20 can be deflected by 90° by the first reflective element 121 and the second reflective element 122 respectively and then incident vertically into the camera.

[0099] Based on this, the camera in the camera assembly 15 can be moved horizontally above the first reflective element 121, the second reflective element 122, and the optical fiber end 20. When the camera is directly above the first reflective element 121, the first side view of the optical fiber end 20 can be reflected to the camera through the first reflective element 121, allowing the camera to capture the first side image of the optical fiber end 20. This first side image is equivalent to the image formed by the optical fiber end 20 when the camera is positioned at the first reflective element 121 along a first horizontal direction pointing towards the optical fiber end 20. Similarly, when the camera moves directly above the second reflective element 122, it can also capture the second side image of the optical fiber end 20. This second side image is equivalent to the image formed by the optical fiber end 20 when the camera is positioned at the second reflective element 122 along a second horizontal direction pointing towards the optical fiber end 20. Furthermore, the first and second horizontal directions are perpendicular to each other. Based on the principles of geometric optics, when the end face of the fiber optic end 20 is not parallel to the horizontal plane, the angle between the end face of the fiber optic end 20 and the second horizontal direction can be determined through the first lateral image, while the angle between the end face of the fiber optic end 20 and the first horizontal direction can be determined through the second lateral image. Therefore, the fiber optic coupling module 14 can modulate the end face of the fiber optic end 20 to the horizontal plane based on these two angles.

[0100] Understandably, when the ambient light is sufficiently bright, a clear image of the end face contour of the fiber optic end 20 can be captured simply by reflecting the lateral image of the fiber optic end 20 to the camera using only the first reflective element 121 and the second reflective element 122. However, considering that the structural components in the test equipment 10 are relatively numerous and complex, resulting in relatively dim ambient light at the location of the fiber optic end 20, a light source assembly 16 may be further included in an optional embodiment of this application to ensure a clearer image of the end face contour of the fiber optic end 20 in both the first and second lateral images. This light source assembly 16 is disposed on the support stage 120 of the deflecting optical path assembly 12. In this embodiment, the light source assembly 16 illuminates the fiber optic end 20, thereby ensuring the clarity of the image of the end face contour of the fiber optic end 20.

[0101] Further optionally, in this embodiment, the deflecting optical path assembly 12 may include a support stage 120 connected to the probe stage, and a first reflective element 121 and a second reflective element 122 disposed on the support stage 120 with their reflective surfaces forming a 45-degree angle with the horizontal plane.

[0102] The light source assembly 16 includes a first light source assembly 161 and a second light source assembly 162 disposed on the support stage 120;

[0103] The first light source assembly 161 is used to output a light beam to the first reflective element 121 along the first horizontal direction, and the first reflective element 121 is used to reflect the incident light beam in a vertically upward direction; the second light source assembly 162 is used to output a light beam to the second reflective element 122 along the second horizontal direction, and the second reflective element 122 is used to reflect the incident light beam in a vertically upward direction; and the optical path between the first light source assembly 161 and the first reflective element 121 intersects with the optical path between the second light source assembly 162 and the second reflective element 122 in a defined intersection area.

[0104] When the deflection optical path assembly 12 moves to below the camera assembly 15 via the second drive assembly 13, the fiber end 20 is located in the set intersection area.

[0105] The camera assembly 15 is used to capture a first lateral image when the camera is moved directly above the first reflective element 121, and to capture a second lateral image when the camera is moved directly above the second reflective element 122.

[0106] exist Figure 5 and Figure 6In the illustrated embodiment, the first light source assembly 161 outputs a light beam to the first reflective element 121 along a first horizontal direction, and the first reflective element 121 reflects the incident light beam in a vertically upward direction; the second light source assembly 162 outputs a light beam to the second reflective element 122 along a second horizontal direction, and the second reflective element 122 reflects the incident light beam in a vertically upward direction; the optical path between the first light source assembly 161 and the first reflective element 121 intersects with the optical path between the second light source assembly 162 and the second reflective element 122 in a predetermined intersection area; both the first reflective element 121 and the second reflective element 122 form a 45° angle with the horizontal plane; when the deflecting optical path assembly 12 moves to below the camera assembly 15 via the second driving assembly 13, the fiber optic end 20 is located in the predetermined intersection area;

[0107] The camera assembly 15 is used to capture a first lateral image when the camera is panned directly above the first reflective element 121, and to capture a second lateral image when the camera is panned directly above the second reflective element.

[0108] Specifically, when the camera moves to directly above the first reflective element 121, the first light source assembly 161 can output a light beam to the first reflective element 121 along the first horizontal direction. The light beam incident on the first reflective element 121 is deflected by 90° and then vertically upwards to the camera. At this time, the image captured by the camera is the first side image.

[0109] Because the fiber end 20 of the fiber array is located between the first light source component 161 and the first reflective element 121, it will inevitably partially block the light output by the first light source component 161, thereby making the outline of the fiber end 20 appear in the first lateral image captured by the camera; and the outline of the fiber end 20 shown in the first lateral image is equivalent to the outline shown when viewing the fiber end 20 along the first horizontal direction. Obviously, based on the image shown in the first lateral image, the angle between the end face of the fiber end 20 and the second horizontal direction can be determined, and this angle is set as the first angle; based on this, the fiber end 20 is controlled to rotate around a rotation axis parallel to the first horizontal direction by the fiber coupling module 14, and the rotation angle is equal to the first angle. Obviously, after rotation, the end face of the fiber end 20 is parallel to the second horizontal direction.

[0110] Furthermore, to reduce the difficulty of determining the first angle between the end face of the fiber optic end 20 and the second horizontal direction, a first marking line can be further provided on the first reflective element 121, which is parallel to the second horizontal direction. Thus, in the first lateral image captured by the camera, the direction in which the first marking line is imaged also represents the first horizontal direction, and the first angle can be determined directly based on the angle between the end face contour line of the fiber optic end 20 and the first marking line.

[0111] Similarly, when the camera is moved directly above the second reflective element 124, the second light source assembly 162 can output a light beam to the second reflective element 122 along the second horizontal direction. The light beam incident on the second reflective element 122 also undergoes a 90° deflection and is incident on the camera, so that the camera can acquire a second side image. Similar to the first side image mentioned above, the outline of the fiber end 20 shown in the second side image in this embodiment is equivalent to the outline shown when viewing the fiber end 20 along the second horizontal direction. That is, based on the second side image, the second included angle between the end face of the fiber end 20 and the first horizontal direction can be determined. By controlling the fiber end 20 to rotate at the second included angle with a rotation axis parallel to the second horizontal direction through the fiber coupling module 14, the end face of the fiber end 20 and the first horizontal direction can be made parallel to each other.

[0112] Similar to the first marking line provided on the first reflective element 121, a second marking line 1221 parallel to the first horizontal direction can also be provided on the second reflective element 122, thereby facilitating the determination of the second included angle based on the imaging of the second marking line 1221 and the end face contour line of the fiber end 20 in the second lateral image.

[0113] Furthermore, in this embodiment, the first light source component 161 and the second light source component 162 can be surface light sources, and the light beams output by the first light source component 161 and the second light source component 162 are both parallel light beams, thereby ensuring that the light beams output by the first light source component 161 and the second light source component 162 can more clearly illuminate the outline of the fiber end 20.

[0114] In addition, in order to ensure that the fiber end 20 can be located in the above-mentioned set area so that the end face of the fiber end 20 can be adjusted to be horizontal, a height detection structure is also provided on the end connection structure of the fiber coupling module 14 for connecting the fiber end 20.

[0115] Correspondingly, a calibration base plate 123 is also provided on the support platform 120;

[0116] When the driving component 13 drives the deflection optical path component to move until the lower surface of the height detection structure 147 and the upper surface of the calibration substrate 123 are within a set height range, the fiber end 20 is located in the set intersection area.

[0117] In this embodiment, the height probe structure 147 and the calibration substrate 123 are used as mutual identifiers. By measuring the relative height between the two, it is ensured that the fiber end 20 is exactly located in the above-mentioned set intersection area, that is, in the optical path of the deflection optical path component, thereby reducing the difficulty of adjusting the drive deflection component 12 to adjust the fiber end 20 to be located in the set intersection area.

[0118] In another optional implementation of this embodiment, the height detection structure can be a nanocapacitive displacement sensor, which can further detect the vertical distance between the end connection structure that clamps and connects the end of the optical fiber 20 and other structural components below it during the subsequent position adjustment of the optical fiber end 20, thereby avoiding collisions between the optical fiber end 20 and other structural components.

[0119] Reference Figure 6 In another optional embodiment of this example, the deflecting optical path component 12 may further include:

[0120] The first light source assembly 161 includes a first surface light source 1611 and a third reflective element 1612; the second light source assembly 162 includes a second surface light source and a fourth reflective element; and the first reflective element 121, the second reflective element 122, the third reflective element 1612 and the fourth reflective element are all right-angled triangular prisms, and a reflective film layer is provided on the inclined reflective surface of the right-angled triangular prism.

[0121] The oblique reflective surface of the third reflective element 1612 is located on the output light path of the first surface light source 1611. It is used to reflect the light beam output by the first surface light source 1611 along the first horizontal direction through the set intersection area and incident on the first reflective element 121, so that the first reflective element 121 reflects the light carrying the lateral contour information of the fiber end 20.

[0122] The oblique reflective surface of the fourth reflective element is located in the output light path of the second light source. It is used to reflect the light beam output by the second light source along the second horizontal direction through the set intersection area and into the second reflective element 122, so that the second reflective element 122 reflects the light carrying the lateral contour information of the fiber end 20.

[0123] exist Figure 6The diagram shows the optical path structure between the first light source 1611 and the first reflective element 121. In addition to the first light source 1611, the first light source 1611 structure further includes a third reflective element 1612 in the output optical path of the first light source 1611. Therefore, in this embodiment, in order for the beam of light output vertically upward from the first light source 1611 to first be perpendicularly incident on the vertical plane of the right-angle side of the third reflective element 1612, and then deflected by 90° by the inclined reflective surface in the third reflective element 1612, and then incident on the first reflective element 121 along the first horizontal direction, the optical path structure composed of the first light source 1611 and the third reflective element 1612 can finally output a beam of light to the first reflective element 121 along the first horizontal direction.

[0124] In practical applications, the first surface light source 1611 can be a surface light source or a light source that outputs a diverging beam. In this case, optical elements such as convex lenses can be further added to the first light source assembly 161 to modulate the diverging beam, so that the first light source assembly 161 outputs a parallel beam.

[0125] Based on the above discussion, when the end face of the fiber array is parallel to both the first horizontal direction and the second horizontal direction, it is clear that the end face of the fiber array is also in the horizontal plane.

[0126] After adjusting the end face of the fiber optic end 20 to be horizontal, a vertical image can be further captured vertically downwards from above the fiber optic end 20 using a camera. Obviously, the third angle between the vertical plane where the side wall of the fiber optic end 20 is located and the crosshair in the camera can be displayed in the vertical image. By controlling the fiber optic coupling module 14 to rotate the fiber optic end 20 around the vertical rotation axis at the third angle, the fiber optic end 20 can be adjusted to a state where the outline and the crosshair of the camera are aligned with each other.

[0127] As mentioned earlier, the dicing 32 of the silicon photonic wafer 30 has been adjusted to be parallel to the crosshair in the camera. Thus, when the driving component 13 drives the probe station 11 back to below the camera, the fiber end 20 located below the camera and the silicon photonic wafer 30 are simultaneously positioned so that the outline of the fiber end 20 and the silicon photonic wafer 30 are parallel to each other, thus achieving the initial positioning between the fiber end 20 and the silicon photonic wafer 30.

[0128] Furthermore, the camera in the camera system of this application can be a multi-magnification fixed-magnification lens.

[0129] Based on any of the above embodiments, refer to Figure 7In this application, the fiber coupling module 14 that realizes the position adjustment of the fiber end 20 in space may include three translation components and three rotation components connected in sequence, as well as an end connection structure.

[0130] Among them, three translation components are used to drive the end connection structure to translate along the first direction, the second direction and the third direction respectively; three rotation components are used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis and the third rotation axis respectively; the first direction, the second direction and the third direction are perpendicular to each other; the first rotation axis, the second rotation axis and the third rotation axis are perpendicular to each other.

[0131] The fiber optic coupling module 14 in this embodiment can realize movement of the fiber end 20 in six different degrees of freedom directions, that is, it can translate along the first direction, the second direction, and the third direction, and rotate around the first rotation axis, the second rotation axis, and the third rotation axis, respectively. The fiber optic coupling module 14 in this embodiment simply connects the structural components that realize one degree of freedom of movement in series, and finally realizes the movement of the fiber end 20 in six different degrees of freedom. The structure is simple, easy to implement, and helps to reduce the practical cost of the equipment.

[0132] Based on this, the fiber optic coupling module 14 in this embodiment may specifically include:

[0133] The first translation component 141, the second translation component 142, the third translation component 143, the first rotation component 144, the second rotation component 145, and the third rotation component 146 are connected in sequence; the end connection structure of the fiber optic coupling module 14 is connected to the third rotation component 146.

[0134] The first translation component 141 is used to drive the second translation component 142, the third translation component 143, the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure to translate synchronously along the first direction.

[0135] The second translation component 142 is used to drive the third translation component 143, the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure to translate synchronously along the second direction.

[0136] The third translation component 143 is used to drive the first rotation component 144, the second rotation component 145, the third rotation component 146, and the end connection structure to translate synchronously along the third direction.

[0137] The first rotating component 144 is used to drive the second rotating component 145 and the third rotating component and the end connection structure to rotate synchronously around the first rotating axis as the rotation center.

[0138] The second rotating component 145 is used to drive the third rotating component 146 and the end connection structure to rotate synchronously with the second rotating axis as the rotation center.

[0139] The third rotating component 146 is used to drive the end connection structure to rotate around the third rotating axis as the rotation center;

[0140] Among them, the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are parallel to each other; and the first direction and the first horizontal direction are parallel to each other; the second direction and the second horizontal direction are parallel to each other.

[0141] As shown above, using the fiber coupling module 14 to move the fiber end 20 can only achieve preliminary alignment between the fiber end 20 and the optical waveguide 31 on the silicon photonic wafer 30. Therefore, the fiber coupling module 14 in this application is also connected to a piezoelectric displacement stage 4 by the end connection structure that connects to the fiber end 20. When different control voltages are applied, the fiber end 20 is moved through the end connection structure to control the alignment and coupling between the fiber end 20 and the silicon photonic wafer 30.

[0142] In actual testing, each fiber in the fiber array is typically connected to a photodetector for coupling at one end of the fiber end 20 that is opposite to the fiber coupling module 14. Based on this, the piezoelectric displacement stage 4 in this embodiment is specifically a driving device containing piezoelectric ceramics. As the voltage of the piezoelectric displacement stage 4 changes, the piezoelectric ceramics in the stage 4 can drive the fine-tuning of the position of the fiber end 20. During this process, light waves can be input into the fiber array. These light waves propagate from the port of the fiber end 20 to the optical interface of the optical waveguide 31. After propagation within the optical waveguide 31, the light waves can be re-transmitted to the fiber port 21 and received by the photodetector for coupling after fiber propagation. When the optical fiber port 21 of the fiber array and the optical interface of the optical waveguide 31 reach the optimal alignment coupling state, the optical wave power transmitted back through the optical waveguide 31 is also the maximum. As a result, as the piezoelectric displacement stage 4 moves with the fine adjustment of the fiber end 20, the magnitude of the optical wave power measured by the coupling photodetector also changes. When the power measured by the coupling photodetector is the maximum, that is, when the alignment coupling between the optical fiber port 21 of the fiber array and the optical interface of the optical waveguide 31 is the best, fine alignment coupling between the fiber array and the optical waveguide 31 can be achieved.

[0143] In addition, to avoid the distance between the fiber end 20 and the silicon photonic wafer 30 being too close, a nanocapacitive displacement sensor is used to detect the relative position between the fiber end 20 and the silicon photonic wafer 30 below it, so as to avoid the fiber end 20 being too low and causing damage to the silicon photonic wafer 30.

[0144] In summary, the fiber optic pose adjustment mechanism of this application is configured with a deflection optical path component and a fiber optic coupling module, and the deflection optical path component and the probe station are jointly connected to the driving component 13. This allows the driving component 13 to switch between the deflection optical path component and the probe station carrying the wafer within the imaging field of view of the camera component. Thus, when the probe station carrying the wafer is moved into the imaging field of view of the camera component, the camera component is adjusted so that the coordinate system of the camera component is parallel to the dicing track on the wafer. When the deflection optical path component is moved and switched into the imaging field of view of the camera component, the deflection optical path component deflects and transmits at least two different lateral images of the fiber end to the camera component, thereby acquiring lateral images of the fiber end. Based on the lateral images and the direction of the coordinate system of the camera component, the fiber optic coupling module can be used to adjust the pose of the fiber end, thereby achieving preliminary alignment between the fiber end and the silicon photonic wafer. The test equipment in this application only requires one set of camera components, and the alignment process of the test equipment is simple and easy to operate, realizing the initial alignment between the fiber end and the silicon waveguide, providing a favorable control basis for subsequent precise alignment and coupling, simplifying the structure of the adjustment mechanism in the entire test equipment, and reducing equipment costs.

[0145] This application also discloses a method such as Figure 1 The silicon photonics wafer testing equipment shown includes an optical fiber pose adjustment mechanism as described in any of the preceding claims.

[0146] This application also discloses a coupling method for the fiber optic pose adjustment mechanism of a silicon photonics wafer testing device, such as... Figure 8 As shown, this fiber optic pose adjustment method is applied to the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in any of the above claims.

[0147] In one specific embodiment of this application, the fiber pose adjustment method of the fiber pose adjustment mechanism of the silicon photonics wafer testing equipment includes:

[0148] S1: Control drive component 13 drives the silicon photonic wafer to be translated into the imaging field of view of the camera component. The camera component is adjusted by the wafer image acquired by the camera component so that the coordinate system of the camera component and the dicing track on the silicon photonic wafer are parallel to each other.

[0149] S2: Control the silicon photonic wafer to move out of the imaging field of view of the camera assembly, and move the deflection optical path assembly into the imaging field of view of the camera assembly, and acquire lateral images corresponding to at least two different lateral images of the end of the optical fiber that is deflected by the deflection optical path assembly through the camera assembly.

[0150] S3: Based on the orientation of the lateral image and the coordinate system of the camera assembly, the fiber coupling module adjusts the pose of the fiber end and controls the drive component 13 to drive the silicon photonic wafer to translate into the imaging field of view of the camera assembly, so that the fiber array and the silicon photonic wafer are initially aligned.

[0151] Optionally, the process of adjusting the camera assembly to make the camera assembly coordinate system and the dicing track on the silicon photonics wafer parallel to each other may specifically include:

[0152] S11: Control drive component 13 drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component;

[0153] S12: Used to acquire wafer images of silicon photonic wafers via camera components;

[0154] S13: Adjust the camera assembly using the wafer image so that the crosshair of the camera in the camera assembly is aligned with the dicing track on the silicon photonics wafer.

[0155] Optionally, the fiber coupling module is controlled to adjust the pose of the fiber end according to the orientation of the lateral image and the camera assembly coordinate system, and the driving component 13 is controlled to drive the silicon photonic wafer to translate into the imaging field of view of the camera assembly, so as to initially align the fiber array with the silicon photonic wafer, including:

[0156] S31: The camera assembly acquires lateral images in the first and second horizontal directions through the reflection of the optical fiber end by the deflection optical path assembly, thereby obtaining a first lateral image and a second lateral image; wherein the first and second horizontal directions are perpendicular to each other.

[0157] S32: Control the fiber coupling module to adjust the end face of the fiber end to the horizontal plane according to the first lateral image and the second lateral image;

[0158] S33: Acquire vertical images of the fiber optic end from the vertical direction using a camera assembly;

[0159] S34: According to the vertical image control fiber coupling module, adjust the outline of the fiber end to be parallel to the crosshair of the camera.

[0160] In this embodiment, by acquiring the side images corresponding to the side views of the fiber end 20 in two mutually perpendicular directions, the tilt angle between the end face of the fiber end 20 and the horizontal plane can be obtained. Based on the tilt angle, the end face of the fiber end 20 can be adjusted to be horizontal.

[0161] Further, step S32 may also include:

[0162] S321: Determine the first included angle between the end face of the fiber optic end and the second horizontal direction based on the end face contour line imaged in the first lateral image.

[0163] S322: Control the fiber optic coupling module to drive the fiber end to rotate around the second rotation axis by a first included angle; wherein, the second horizontal direction and the second rotation axis are parallel to each other;

[0164] S323: Determine the second included angle between the end face of the fiber optic end and the first horizontal direction based on the end face contour line imaged in the second lateral image.

[0165] S324: Control the fiber coupling module to drive the fiber end to rotate around the first rotation axis by a second included angle; wherein, the first horizontal direction and the first rotation axis are parallel to each other.

[0166] Based on the deflection optical path component in the above-mentioned test equipment embodiment, it can be seen that the first lateral image in this embodiment is equivalent to taking an image of the fiber end along the first horizontal direction. Based on the imaging position of the end face contour line of the fiber end in the first lateral image, the first included angle between the end face of the fiber end and the second horizontal direction can obviously be determined.

[0167] Furthermore, when a first marking line parallel to the second horizontal direction is provided on the first reflective element in the deflection optical path assembly, the first angle can be directly determined based on the angle between the first marking line and the end face contour line of the optical fiber end in the first lateral image.

[0168] Similarly, when the second reflective element in the deflecting optical path assembly is provided with a second marking line that is parallel to the first horizontal direction, the second included angle can also be determined directly based on the second marking line. This will not be elaborated further in this embodiment.

[0169] Additionally, refer to Figure 7 Based on the embodiments of the above-mentioned testing equipment, the fiber optic coupling module in this application can include a first translation component 141, a second translation component 142, a third translation component 143, a first rotation component 144, a second rotation component 145, and a third rotation component 146 connected in series. The first translation component 141, the second translation component 142, and the third translation component 143 are used to achieve translation in the first, second, and third directions, respectively; while the first rotation component 144, the second rotation component 145, and the third rotation component 146 are used to achieve rotation around the first, second, and third rotation axes, respectively. Figure 7As shown, a three-dimensional rectangular coordinate system XYZ is established, in which the X-axis, Y-axis and Z-axis are parallel to the first direction, the second direction and the third direction, respectively, and the first rotation axis, the second rotation axis and the third rotation axis are also parallel to the X-axis, the Y-axis and the Z-axis, respectively.

[0170] Furthermore, in this embodiment, the first direction should be parallel to the first horizontal direction of acquiring the first lateral image, while the second direction should be parallel to the second horizontal direction of acquiring the second lateral image.

[0171] Therefore, when the fiber end is rotated at the first included angle in a direction parallel to the second direction by a six-axis series displacement platform, that is, the fiber end is driven to rotate at the second included angle around the second rotation axis by the second rotation component.

[0172] However, this rotation will inevitably cause a change in the position of the fiber optic end in space, and may even move it out of the camera's field of view. Therefore, after driving the fiber optic end to rotate around the second rotation axis by the second rotation component at the second included angle, it can further include:

[0173] The fiber optic coupling module drives the fiber tip to translate along the first direction. The distance, translated upwards along the third side. The distance; among which, The distance between the fiber end and the second rotation axis; This is the first included angle.

[0174] Understandably, in practical applications, the fiber end can be driven to translate along a first direction by the first translation component in the fiber coupling module. The distance is then measured, and the fiber end is driven to translate along a third direction by the third translation component. The distance is such that the end of the optical fiber can be rotated and adjusted to return to its original position.

[0175] Similarly, after driving the fiber end to rotate around the second rotation axis at a second included angle using the second rotating component, the process may further include:

[0176] The fiber end is driven to translate along the second direction using an optical fiber coupling module. The distance, translated upwards along the third side. The distance; among which, The distance between the fiber end and the first rotation axis; This is the second included angle.

[0177] Specifically, the second translation component can be used to drive the fiber end to translate along the second direction. The distance is then measured, and the fiber end is driven to translate along a third direction by the third translation component. The distance is such that after the end face of the fiber is aligned with the horizontal plane, the position of the fiber end remains unchanged.

[0178] It is understandable that the fiber optic end is roughly rectangular in shape. The vertical image taken from directly above the fiber optic end is also a top view of the fiber optic end. Each fiber optic port is arranged on one side of the cuboid. Adjusting the outline of the fiber optic end to be parallel to the crosshair of the camera means that the vertical plane where each fiber optic port is located is parallel to one of the lines of the crosshair. As mentioned earlier, the two lines of the crosshair are parallel to the two dicing marks on the silicon photonics wafer, respectively. Thus, the plane where each fiber optic port is located is parallel to one of the dicing marks on the silicon photonics wafer.

[0179] In an optional implementation of this embodiment, the process of rotating and adjusting the fiber end based on the vertical image may include:

[0180] Based on the end face contour line of the fiber end imaged in the vertical image, determine the third included angle between the end face contour line of the fiber end and the crosshair cursor.

[0181] The fiber optic coupling module is used to drive the fiber end to rotate around a third included angle about a third rotation axis; wherein the third rotation axis is a vertical rotation axis.

[0182] In this embodiment, the third rotating component in the optical fiber coupling module can be used to drive the end of the optical fiber to rotate around the third rotating axis at a third included angle.

[0183] Based on the above discussion, in this embodiment, the crosshair in the camera lens is first adjusted to be parallel to the dicing marks on the silicon photonics wafer. Then, by utilizing the interaction between the deflection optical path assembly and the camera, two mutually perpendicular horizontal lateral images and a second lateral image are acquired at the end of the optical fiber. Based on these images, the angle between the end face of the optical fiber in the fiber array and the horizontal plane can be determined. Then, a six-axis serial displacement platform is used to control the optical fiber end to rotate and adjust in the first and second horizontal directions respectively, so that the end face of the optical fiber is adjusted to the horizontal plane. Furthermore, the camera is used to... A vertical image of the fiber optic end is measured in a downward direction. Based on this vertical image, the angle between the side of the fiber optic end and the crosshair of the camera can be determined. Then, a six-axis serial displacement platform is used to control the fiber optic end to rotate around the vertical axis, so that the side of the fiber optic end and the crosshair of the camera are aligned parallel to each other. On this basis, since the crosshair of the camera and the dicing marks on the silicon photonics wafer are parallel to each other, the silicon photonics wafer is then moved back to be directly below the camera. The sidewall of the fiber optic end will then be parallel to the dicing marks on the silicon photonics wafer, thus achieving the initial alignment and coupling between the fiber optic end and the optical waveguide on the silicon photonics wafer.

[0184] In one optional embodiment of this application, after achieving initial alignment coupling between the fiber end and the silicon photonic wafer, the process may further include:

[0185] The camera assembly is controlled to acquire aligned images of the fiber optic end and the silicon photonic wafer within the same frame.

[0186] Based on the imaging positions of the fiber port at the end of the optical fiber and the optical interface in the silicon photonics wafer in the alignment image, the fiber coupling module is controlled to drive the end of the optical fiber to translate along the first and second directions, so as to achieve initial alignment and coupling between the fiber port and the optical interface at the end of the optical fiber.

[0187] Reference Figure 4 and Figure 9 As can be seen, each fiber optic port 21 is arranged side by side on the side of the fiber optic end 20. Therefore, the position of each fiber optic port 21 in the alignment image can be determined based on the imaging position of the side of the fiber optic end 20. Furthermore, the optical interfaces of each optical waveguide 31 will also be imaged in the alignment image. Based on this alignment image, the relative position between a fiber optic port 21 and an optical interface can be determined. Thus, the fiber optic coupling module can drive the fiber optic end 20 to translate horizontally, so that a fiber optic port 21 is positioned directly above an optical interface, thereby achieving initial alignment between the fiber optic port 21 and the optical interface.

[0188] Building upon this, to achieve even more precise alignment between fiber optic ports and optical interfaces, after moving a fiber optic port directly above an optical interface, the following further steps can be taken:

[0189] Control the output light wave of the corresponding optical fiber at each optical fiber end;

[0190] The piezoelectric displacement stage connected to the end connection structure of the fiber optic coupling module drives the fiber end to translate in the horizontal plane.

[0191] The optical power that changes with the translational movement of the fiber end is detected by a photodetector connected to the end of the optical fiber away from the fiber end.

[0192] The optimal coupling position between the fiber end and each waveguide in the silicon photonic wafer is determined by the location of the fiber end corresponding to the maximum optical power.

[0193] In this embodiment, light waves can be input into the fiber optic array. These light waves are transmitted from the fiber optic port to the optical interface of the optical waveguide, and after propagation within the optical waveguide, they are transmitted to the optical interface and then back to the fiber optic port, where they are received by the photodetector used for coupling. Therefore, the better the alignment coupling effect between the fiber optic port of the fiber optic array and the optical interface of the optical waveguide, the greater the power of the light wave that is re-propagated back through the optical waveguide. As the piezoelectric displacement stage moves with the fine adjustment of the fiber end, the power of the light wave measured by the photodetector used for coupling also changes. When the power measured by the photodetector used for coupling is the maximum, that is, when the alignment coupling between the fiber optic port of the fiber optic array and the optical interface of the optical waveguide is the best, fine alignment coupling between the fiber optic array and the optical waveguide can be achieved.

[0194] This application also provides an embodiment of a silicon photonics wafer testing system, which may include an optical performance tester, a controller, and an optical fiber pose adjustment mechanism for the silicon photonics wafer testing equipment as described in any of the preceding claims;

[0195] The controller is used to perform the steps of the fiber array coupling method as described in any of the preceding claims using the silicon photonics wafer testing equipment.

[0196] It is understood that the controller in this embodiment can be built into the test equipment or it can be a host computer connected to the test equipment; in short, it can control and realize automated testing of silicon photonic wafers.

[0197] In addition, the optical performance tester has a built-in motion controller that communicates with the aforementioned fiber coupling module and piezoelectric displacement stage, a tunable light source for outputting light waves to the fiber array, a tunable light source and a polarization scrambler connected to the end of the fiber array away from the aforementioned fiber end, and an optical power meter and a coupling photodetector connected to the output end of the polarization scrambler.

[0198] In practical applications, the motion controller first controls the fiber coupling module to drive the attitude adjustment of the fiber end, achieving initial alignment between the fiber end and the optical waveguide on the silicon photonic wafer. Then, a tunable light source outputs light waves to the fiber in the fiber array. These light waves are transmitted through the fiber end to the optical waveguide on the silicon photonic wafer, and the light waves transmitted back from the silicon photonic wafer are received. These light waves are then transmitted along the fiber in the fiber array to the polarization scrambler, and split into two light waves by the polarization scrambler, which are transmitted to the photodetector for coupling and the optical power meter, respectively. The photodetector for coupling converts the received optical signal into a voltage signal, which is then used by the motion controller to control the piezoelectric displacement stage to finely adjust the position of the fiber end. The position point corresponding to the fiber end when the voltage signal is at its maximum is taken as the optimal alignment and coupling position point between the fiber end and the optical waveguide on the silicon photonic wafer.

[0199] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that the elements inherent in a process, method, article, or apparatus that includes a list of elements are included. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Additionally, portions of the technical solutions provided in the embodiments of this application that are consistent with the implementation principles of corresponding technical solutions in the prior art have not been described in detail to avoid excessive elaboration.

Claims

1. A fiber optic pose adjustment mechanism for a silicon photonics wafer testing device, characterized in that, The device includes a micro-imaging assembly, a probe stage, an optical fiber coupling module, and a driving assembly. The micro-imaging assembly includes a camera assembly and a deflecting optical path assembly. The probe stage is used to support a silicon photonic wafer. The driving assembly is used to drive the probe stage and the deflecting optical path assembly to switch between moving into the imaging field of view of the camera assembly. When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component adjusts its coordinate system to be parallel to the dicing path of the silicon photonic wafer. When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to acquire lateral images corresponding to at least two different lateral views of the optical fiber end of the deflection optical path component. The fiber coupling module is used to adjust the pose of the fiber end according to the direction of the lateral image and the coordinate system of the camera assembly, so that the fiber end is initially aligned with the silicon photonic wafer.

2. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in claim 1, characterized in that, The camera assembly has a crosshair cursor inside its lens. When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component is used to acquire a wafer image of the silicon photonic wafer, and adjust the crosshair of the camera in the camera component to be parallel to the dicing track on the silicon photonic wafer using the wafer image.

3. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in claim 2, characterized in that, The deflecting optical path assembly includes at least two reflective elements; When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to acquire a first lateral image of the fiber end of the fiber array in a first horizontal direction and a second lateral image in a second horizontal direction through the deflection optical path component. The fiber coupling module is used to adjust the end face of the fiber to a horizontal plane based on the first lateral image and the second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other; The camera assembly is also used to acquire a vertical image of the end of the optical fiber from a vertical direction; the optical fiber coupling module is used to adjust the outline of the end of the optical fiber to be parallel to the crosshair of the camera according to the vertical image.

4. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in claim 3, characterized in that, The deflecting optical path assembly includes a support platform connected to the probe station, and a first reflective element and a second reflective element disposed on the support platform; It also includes a first light source assembly and a second light source assembly disposed on the support platform; Wherein, the first light source component is used to output a light beam to the first reflective element along the first horizontal direction, and the first reflective element is used to reflect the incident light beam in a vertically upward direction; the second light source component is used to output a light beam to the second reflective element along the second horizontal direction, and the second reflective element is used to reflect the incident light beam in a vertically upward direction; and the optical path between the first light source component and the first reflective element intersects with the optical path between the second light source component and the second reflective element at a predetermined intersection area; When the deflection optical path assembly moves to below the camera assembly via the drive assembly, the end of the optical fiber is located in the designated intersection area; The camera assembly is used to capture the first lateral image when the camera is moved directly above the first reflective element, and to capture the second lateral image when the camera is moved directly above the second reflective element.

5. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in claim 4, characterized in that, The fiber optic coupling module is equipped with a height probe structure on the end connection structure for connecting the ends of the fiber optic cable. Accordingly, a calibration substrate is also provided on the support platform corresponding to the designated intersection area; When the driving component drives the deflection optical path component to move to a distance within a set height range between the lower surface of the height probe structure and the upper surface of the calibration substrate, the end of the optical fiber is located in the set intersection area.

6. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in claim 5, characterized in that, The height detection structure is a nanocapacitive displacement sensor.

7. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in claim 4, characterized in that, The first light source assembly includes a first surface light source and a third reflective element; the second light source assembly includes a second surface light source and a fourth reflective element; Furthermore, the first reflective element, the second reflective element, the third reflective element, and the fourth reflective element are all right-angled triangular prisms, and a reflective film layer is provided on the inclined reflective surface of the right-angled triangular prism; The oblique reflective surface of the third reflective element is located in the output light path of the first surface light source, and is used to reflect the light beam output by the first surface light source along the first horizontal direction through the set intersection area and incident on the first reflective element, so that the first reflective element reflects the light carrying the lateral contour information of the end of the optical fiber. The oblique reflective surface of the fourth reflective element is located in the output light path of the second surface light source, and is used to reflect the light beam output by the second surface light source along the second horizontal direction through the set intersection area and incident on the second reflective element, so that the second reflective element reflects the light carrying the lateral contour information of the end of the optical fiber.

8. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in any one of claims 1 to 7, characterized in that, The fiber optic coupling module includes three translation components and three rotation components connected in sequence, as well as an end connection structure; The three translation components are used to drive the end connection structure to translate along the first direction, the second direction, and the third direction, respectively. The three rotation components are used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis, and the third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

9. The fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in claim 8, characterized in that, The end connection structure is also connected to a piezoelectric displacement stage, which is used to drive the fiber end to move when different control voltages are applied, so as to control the alignment and coupling between the fiber end and the silicon photonic wafer.

10. A silicon photonics wafer testing device, characterized in that, Includes the fiber optic pose adjustment mechanism of the silicon photonics wafer testing equipment as described in any one of claims 1 to 9.

11. A method for adjusting the fiber optic pose of a silicon photonics wafer testing device, characterized in that, The fiber optic pose adjustment mechanism is applied to the silicon photonics wafer testing equipment as described in any one of claims 1 to 9, wherein the fiber optic pose adjustment method includes: The control drive component drives the silicon photonic wafer to translate into the imaging field of view of the camera component. The camera component is adjusted based on the wafer image acquired by the camera component so that the coordinate system of the camera component and the dicing track on the silicon photonic wafer are parallel to each other. The silicon photonic wafer is controlled to move out of the imaging field of view of the camera assembly, and the deflection optical path assembly is moved into the imaging field of view of the camera assembly. The camera assembly acquires lateral images corresponding to at least two different lateral views of the end of the optical fiber that is deflected and transmitted by the deflection optical path assembly. Based on the lateral image and the orientation of the camera assembly coordinate system, the fiber coupling module adjusts the pose of the fiber end and controls the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera assembly, so that the fiber array and the silicon photonic wafer are initially aligned.

12. The fiber optic pose adjustment method for silicon photonics wafer testing equipment as described in claim 11, characterized in that, Adjusting the camera assembly based on the wafer image acquired by the camera assembly to make the camera assembly coordinate system parallel to the dicing traces on the silicon photonic wafer includes: The drive assembly is controlled to move the probe station carrying the silicon photonic wafer into the imaging field of view of the camera assembly; The camera assembly is used to acquire wafer images of the silicon photonics wafer; The camera assembly is adjusted using the wafer image so that the crosshair of the camera in the camera assembly is aligned parallel to the dicing marks on the silicon photonics wafer.

13. The fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in claim 12, characterized in that, Based on the lateral image and the orientation control of the camera assembly coordinate system, the fiber coupling module adjusts the pose of the fiber end to initially align the fiber array with the silicon photonic wafer, including: The camera assembly acquires lateral images in the first and second horizontal directions reflected by the optical fiber end through the deflection optical path assembly, thereby obtaining a first lateral image and a second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other; Based on the first lateral image and the second lateral image, the fiber coupling module is controlled to adjust the end face of the fiber end to a horizontal plane; The camera assembly acquires a vertical image of the end of the optical fiber from a vertical direction. Based on the vertical image, the fiber optic coupling module is controlled to adjust the outline of the fiber end to be parallel to the crosshair of the camera.

14. The fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in claim 13, characterized in that, Controlling the fiber coupling module to adjust the end face of the fiber optic cable to a horizontal plane based on the first lateral image and the second lateral image includes: Based on the end face contour line of the fiber end imaged in the first lateral image, a first included angle between the end face of the fiber end and the second horizontal direction is determined; The fiber coupling module is controlled to drive the fiber end to rotate around a second rotation axis by a first included angle; wherein the second horizontal direction and the second rotation axis are parallel to each other. Based on the end face contour line of the fiber end imaged in the second lateral image, a second included angle between the end face of the fiber end and the first horizontal direction is determined; The fiber coupling module is controlled to drive the fiber end to rotate around a first rotation axis at a second included angle; wherein the first horizontal direction and the first rotation axis are parallel to each other.

15. The fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in claim 14, characterized in that, After controlling the fiber coupling module to drive the fiber end to rotate around the second rotation axis by a first included angle, the method further includes: The fiber coupling module is used to drive the fiber end to translate along a first direction. The distance, translated upwards along the third side. The distance; among which, The distance between the end of the optical fiber and the second rotation axis; The first included angle; Accordingly, after controlling the fiber coupling module to drive the fiber end to rotate around the first rotation axis by a second included angle, the method further includes: The fiber coupling module is used to drive the fiber end to translate along the second direction. The distance, translated upwards along the third party The distance; among which, The distance between the end of the optical fiber and the first rotation axis; This is the second included angle; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other; the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction are vertical directions; Furthermore, the first direction and the first horizontal direction are parallel to each other; the second direction and the second horizontal direction are parallel to each other.

16. The fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in claim 13, characterized in that, Based on the vertical image, the fiber optic coupling module is controlled to adjust the outline of the fiber optic end to be parallel to the crosshair of the camera, including: Based on the end face contour line of the fiber end imaged in the vertical image, determine the third included angle between the end face contour line of the fiber end and the crosshair cursor. The fiber coupling module is controlled to drive the fiber end to rotate around the third included angle about the third rotation axis; wherein the third rotation axis is a vertical rotation axis.

17. The fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in claim 11, characterized in that, After controlling the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so as to initially align the fiber array with the silicon photonic wafer, the method further includes: The camera assembly is controlled to acquire aligned images of the fiber optic end and the silicon photonic wafer within the same frame; Based on the imaging positions of the fiber port at the end of the optical fiber and the optical interface in the silicon photonics wafer in the alignment image, the optical fiber coupling module is controlled to drive the end of the optical fiber to translate along the first direction and the second direction, so as to achieve initial alignment and coupling between the fiber port and the optical interface at the end of the optical fiber.

18. The fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in claim 17, characterized in that, After initial alignment and coupling between the fiber optic port and the optical interface at the end of the fiber, the process further includes: Control the output light wave of one optical fiber at each of the optical fiber ends; The piezoelectric displacement stage connected to the end connection structure of the optical fiber coupling module drives the end of the optical fiber to translate in the horizontal plane. The optical power that changes with the translational movement of the fiber end is detected by a photodetector connected to the end of the optical fiber away from the fiber end. The optimal coupling position between the fiber end and each waveguide in the silicon photonic wafer is the location corresponding to the maximum optical power.

19. A silicon photonics wafer testing system, characterized in that, Includes an optical performance testing machine, a controller, and a silicon photonics wafer testing device as described in claim 10; The controller is used to perform the steps of the fiber optic pose adjustment method for the silicon photonics wafer testing equipment as described in any one of claims 11 to 18 using the silicon photonics wafer testing equipment.

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