A storage system

Abstract

The application provides a storage system, and relates to the technical field of memory expansion card, and the storage system comprises: each memory expansion board card in the plurality of memory expansion board cards is connected with a corresponding type of memory unit in the plurality of types of memory units; the memory expansion chip board card is provided with a memory expansion chip, the memory expansion board card is provided with a connector, the memory expansion chip board card and the memory expansion board card are connected through the connector, the multiplexing rate of the memory expansion chip board card can be improved, and the cost of memory update and replacement can be reduced.

Description

Technical Field

[0001] This application relates to the field of memory expansion card technology, and in particular to a storage system. Background Technology

[0002] CXL (Compute Express Link) technology is a new high-speed interconnect technology designed to provide higher data throughput and lower latency to meet the needs of modern computing and storage systems. With the increasing demands of computing, traditional PCI Express (PCIe) technology can no longer meet the needs of data centers and high-performance computing for faster and more efficient interconnect technologies. To address the memory wall and I / O wall issues, Intel launched CXL technology based on the PCIe protocol in 2019, which quickly became the industry-recognized advanced device interconnect standard. Through CXL, the CPU can access a larger memory pool on connected devices with low latency and high bandwidth, thereby expanding memory capacity and improving the performance of AI / ML applications. DDR4 is a high-speed, high-capacity dynamic random access memory (DRAM) widely used in computers and other electronic systems. DDR5 technology is the latest generation of Double Data Rate Synchronous Dynamic Random Access Memory (SDRAM), featuring even higher speeds, larger capacities, and lower power consumption. Compared to its predecessor DDR4, DDR5 brings many significant improvements and innovative features, making it more suitable for high-performance computing and big data processing needs.

[0003] Because the CXL protocol enables cache coherency between two chips, memory expansion can be achieved through CXL expansion chips. Since CXL expansion chips are compatible with different DDR speeds, existing memory expansion cards based on the CXL protocol generally support both DDR5 and DDR4 memory modules. However, DDR5 and DDR4 memory modules have many differences and cannot be perfectly compatible on the same chip. With the phasing out of DDR4 memory and the popularization of DDR5 memory, these shortcomings will lead to users needing to frequently replace expansion cards, increasing the cost of expansion cards and wasting resources. Summary of the Invention

[0004] In view of this, embodiments of this application provide a storage system to overcome or at least partially solve the above problems.

[0005] The first aspect of this application provides a storage system, which includes: multiple memory expansion cards, memory expansion chip cards, and various types of memory units; Each of the plurality of memory expansion cards is connected to a memory unit of the corresponding type among the plurality of memory units; The memory expansion chip board is equipped with a memory expansion chip and a connector, and the memory expansion chip board and the memory expansion board are connected through the connector.

[0006] Optionally, the memory expansion board is configured with a first pin, and the memory expansion chip board is configured with various types of second pins; The various types of second pins correspond to the various types of memory units.

[0007] Optionally, the voltage conversion module is connected to the server motherboard via a first gold finger to obtain power from the server motherboard; The voltage conversion module is connected to the memory unit on the memory expansion board and the memory expansion chip board on the memory expansion board; The voltage conversion module is used to determine the voltage requirements of the memory expansion chip board and the voltage requirements of the memory units on the memory expansion board. The voltage conversion module is used to perform a first voltage conversion on the power supply provided by the server motherboard according to the voltage requirements required by the memory expansion chip board, so that the memory expansion chip board can obtain a first power supply that meets the voltage requirements required by the memory expansion chip board. The voltage conversion module is used to perform a second voltage conversion on the power supply provided by the server motherboard according to the voltage requirements of the memory units on the memory expansion card, so that the memory units on the memory expansion card can obtain a second power supply that meets the voltage requirements of the memory units on the memory expansion card. The memory expansion chip board obtains the first power supply after the voltage conversion module has performed the first voltage conversion through the connector.

[0008] Optionally, the memory expansion board connects to multiple expansion chip boards via multiple connectors; The memory expansion board is also equipped with a clock signal buffer, which is connected to multiple expansion chip boards on the memory expansion board.

[0009] Optionally, the plurality of memory expansion cards include a first memory expansion card and a second memory expansion card, and the plurality of memory units are divided into memory units of a first target type and memory units of a second target type; The first memory expansion card is connected to the memory unit of the first target type; The second memory expansion card is connected to the memory unit of the second target type; When a memory unit of the first target type is required, the memory expansion chip board can be detachably connected to the first memory expansion board via a connector on the first memory expansion board. When a second type of memory unit is required, the memory expansion chip board is detached from the first memory expansion board. The memory expansion chip board is detachably connected to the second memory expansion board via a connector on the second memory expansion board.

[0010] Optionally, the memory expansion card is equipped with memory slots; the memory unit includes at least a memory module; The memory module is indirectly connected to the memory expansion card via the memory slot.

[0011] Optionally, the memory unit includes at least memory chips; The memory chips are connected to the memory expansion board via surface mount soldering on both sides.

[0012] Optionally, the memory unit may further include a parity chip; The verification chip is connected to the memory expansion board by surface mounting on both sides.

[0013] Optionally, the memory expansion board further includes a baseboard slot, and the memory expansion chip board comprises a first side and a second side, the first side being perpendicular to the second side, and the area of ​​the first side being larger than the area of ​​the second side; wherein: The memory expansion chip is connected to the memory expansion chip board on the first surface via the connector; The second side of the memory expansion chip board is also provided with a second gold finger, and the memory expansion chip board is connected to the base plate slot of the memory expansion board through the second gold finger.

[0014] Optionally, the memory expansion chip board further includes a third side, which is parallel to the first side; A heat sink is also provided on the third side of the memory expansion chip board.

[0015] The beneficial effects of this application are: This application provides a storage system, which includes: multiple memory expansion cards, memory expansion chip cards, and various types of memory units; each of the multiple memory expansion cards is connected to a corresponding type of memory unit among the various types of memory units; the memory expansion chip cards are configured with memory expansion chips, the memory expansion cards are configured with connectors, and the memory expansion chip cards and the memory expansion cards are connected through the connectors.

[0016] The technical solution of this application decouples the memory expansion chip from the memory expansion board through the memory expansion chip board. The same memory expansion chip can be reused on multiple memory expansion boards. Furthermore, the use of connectors improves the convenience of disassembling and installing the memory expansion chip board, avoids the cost waste of scrapping the entire expansion card after memory upgrade, and greatly reduces the total cost of memory and the cost of memory upgrades. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0018] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a memory expansion board in a storage system according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a memory expansion board including a voltage conversion module provided in this application; Figure 3 This is a schematic diagram of the structure of a memory expansion board including multiple memory expansion chip boards according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a memory expansion board including memory slots according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a memory expansion board including memory chips according to an embodiment of this application; Figure 6 This is a schematic diagram showing the placement of another memory expansion chip board provided in one embodiment of this application; Figure 7This is a side view of a memory expansion board including a heat sink, provided in one embodiment of this application. Detailed Implementation

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] DDR4 is a high-speed, high-capacity Dynamic Random Access Memory (DRAM) widely used in computers and other electronic systems. DDR4 uses capacitors and transistors to store and read / write data. A charged capacitor represents a "1", and a discharged capacitor represents a "0". Transistors are used as switches to control the charging and discharging process of the capacitors. Each memory cell in DDR4 is located on a cross-linked word line and bit line. Data reading and writing are achieved by selectively activating transistors on the word lines and connecting the bit lines and capacitors. Compared to its predecessor, DDR3, DDR4 has improved data prefetching capabilities, enabling faster data processing. DDR4 chips support higher memory frequencies and lower power consumption, typically operating at 1.2V, making them more energy-efficient than DDR3.

[0023] DDR5 technology is the latest generation of Double Data Rate Synchronous Dynamic Random Access Memory (SDRAM), offering higher speeds, larger capacities, and lower power consumption. Compared to its predecessor, DDR4, DDR5 brings many significant improvements and innovative features, making it more suitable for high-performance computing and large data processing demands. DDR5 starts at 4800MT / s and can reach a maximum of 8400MT / s, even exceeding 10000MT / s under overclocking conditions. This is a significant improvement over the standard speed range of DDR4 (2133MT / s to 3200MT / s). DDR5 performs data transfer on both the rising and falling edges of each clock cycle, a bidirectional data transfer architecture that greatly improves efficiency and bandwidth. The voltage has been reduced from 1.2V in DDR4 to 1.1V in DDR5, effectively reducing operating power consumption and improving energy efficiency. DDR5 memory modules are divided into two independent sub-channels, each with its own independent data path. This design allows for concurrent data access, improving transfer speeds and reducing access latency.

[0024] Currently, there are several types of memory expansion cards.

[0025] The first method involves using different memory expansion chips and corresponding firmware (FW) to support DDR5 and DDR4 memory. This method requires the creation of two expansion cards: one using a DDR4 memory slot and the other using a DDR5 memory slot.

[0026] The second method involves using a memory expansion chip to bring out all the signals required by the DDR5 and DDR4 protocols, and using different firmware to support different memory modules. However, this usually requires making two expansion cards and soldering different memory slots to install different memory modules.

[0027] The above two forms have the following disadvantages: The first type: Disadvantages of different memory expansion chips: Different expansion chips mean that expansion cards for DDR4 memory are completely incompatible with DDR5 memory. As DDR4 memory is gradually being phased out, DDR4 expansion cards can no longer be reused, further increasing costs and reducing the cost-effectiveness of expansion cards, making them unsuitable for continued development in future machines.

[0028] The second type: Disadvantages of using one chip for two expansion cards: Since ordinary expansion card chips are soldered onto the circuit board, DDR4 expansion cards still cannot be reused on DDR5 memory. This results in a waste of the chip's compatibility and fails to fully utilize the advantage of chip-reusable memory. As DDR4 memory is gradually phased out, the cost-reducing ability of DDR4 expansion cards will also gradually disappear.

[0029] In view of the disadvantages of the above two forms, an embodiment of this application provides a storage system, which includes: multiple memory expansion cards, memory expansion chip cards and various types of memory units; Each of the plurality of memory expansion cards is connected to a memory unit of the corresponding type among the plurality of memory units; The memory expansion chip board is equipped with a memory expansion chip and a connector, and the memory expansion chip board and the memory expansion board are connected through the connector.

[0030] Specifically, Figure 1 This is a schematic diagram illustrating the structure of a memory expansion board in a storage system according to an embodiment of this application. In one embodiment, this application provides a storage system comprising multiple memory expansion boards, memory expansion chip boards, and various types of memory units, such as... Figure 1As shown, a memory expansion card refers to a memory expansion card designed for a specific type of memory cell. This card allows for the expansion of that type of memory cell. Each memory expansion card is specifically optimized to accommodate a particular type of memory cell, thereby ensuring optimal performance and compatibility. Examples include DDR4 memory, DDR5 memory, or other types of memory.

[0031] Therefore, in order to accommodate the expansion of various types of memory units, this storage system needs to include various types of memory expansion cards. In addition, the storage system also includes memory expansion chip cards, which are based on CXL technology. CXL technology can expand memory capacity, improve memory scalability and bandwidth, and reduce latency. Therefore, the memory expansion chip cards are compatible with various types of memory units.

[0032] In addition, the storage system also includes various types of memory units to ensure the storage capacity, data transmission and other requirements of the storage system.

[0033] Among them, multiple memory expansion cards are suitable for various types of memory units. The memory units are connected to their corresponding memory expansion cards, and the connection method can be by using specific memory slots or soldering.

[0034] The memory expansion chip board integrates a memory expansion chip. This chip, designed as a board, can be reused across different memory expansion boards. Specifically, it manages and controls the memory expansion boards connected to the storage system, as well as the memory cells on those boards. The memory expansion chip acts as the brain of the entire memory expansion board, handling all memory-related data processing tasks within the memory cells of the connected expansion boards, including data transfer, memory allocation, cache coherency, and error correction.

[0035] The memory expansion board has a connector that allows for the detachable connection of the memory expansion chip board to the memory expansion board containing the target type of memory cell when multiple types of memory cells are required. The connector can be a board-to-board connector, which is designed to achieve fast and reliable connection between boards.

[0036] Memory expansion cards can be connected to the server motherboard to expand memory units.

[0037] This approach, by placing the memory expansion chip on a separate board (the memory expansion chip board), achieves a modular design that decouples the memory expansion chip from the memory expansion board. This allows the memory expansion chip connected to one memory expansion board to be detached and connected to other memory expansion boards, thus enabling memory expansion chip reuse. Especially when a specific type (i.e., the target type) of memory cells is required, users can detachably connect the memory expansion chip board to the memory expansion board containing the desired specific type of memory cells via connectors. This design allows users to flexibly configure the storage system according to specific needs without replacing the entire memory expansion board. Furthermore, the memory expansion board can also be connected to other memory expansion chip boards.

[0038] Through the above embodiments, the design of this storage system allows users to easily add, remove, or replace the original memory expansion cards using detachable memory expansion chip cards according to application needs, thereby achieving instant expansion of storage capacity and performance, improving the material utilization rate of memory expansion chips, and reducing the overall cost of memory expansion cards.

[0039] Furthermore, this flexibility is particularly important in a rapidly changing technological environment, enabling the system to adapt to new memory technologies without requiring a complete hardware overhaul. Through the modular design of memory expansion chip cards, users can utilize different types of memory using only a single card, significantly improving the ease of use of memory expansion cards.

[0040] Furthermore, the reusability of memory expansion cards reduces long-term operating costs. Each memory expansion card is optimized for its specific memory cell, allowing the storage system to provide the best-performing memory expansion chip for each memory type. Centralized management of the memory expansion chips further ensures efficient data transfer and fast memory access. When maintenance or upgrades to the storage system are required, users can easily remove and replace specific memory expansion card cards without affecting the operation of other parts or requiring major changes to the entire storage system architecture. This ensures long-term system compatibility and sustainable development.

[0041] Optionally, the memory expansion board is configured with a first pin, and the memory expansion chip board is configured with various types of second pins; The various types of second pins correspond to the various types of memory units.

[0042] Specifically, in one embodiment, in order to ensure that the same memory expansion chip board can provide and receive the required signals to different types of memory units, corresponding pins need to be brought out on the memory expansion board and the memory expansion chip of the memory expansion chip board.

[0043] Each memory expansion board has a first pin that corresponds to the type of memory cell it is compatible with. Since the memory expansion chip board needs to be compatible with different types of memory cells, it also needs to have a variety of second pins corresponding to the various types of memory cells it is compatible with.

[0044] Therefore, after the memory expansion chip board is detachably connected to the memory expansion board where the target type memory cell is located, the signal required by the target type memory cell can be led out to the corresponding first pin of the target type memory cell on the memory expansion board through the second pin corresponding to the target type memory cell, so that the first pin and the second pin are electrically connected.

[0045] In this way, the memory expansion chip of the memory expansion chip board can bring out the signals required by the memory cell of the target type through the second pin of the target type and the first pin on the memory expansion chip board. These signals include data signals, address signals, EEC check signals, etc., and these signals can be multiplexed. The specific connection can be brought out according to the design of the memory expansion chip.

[0046] Through the above embodiments, by designing specific pins for each type of memory cell, the storage system can easily adapt to different memory technologies without replacing the entire board. This modular design concept greatly improves the system's flexibility and scalability. Multiple types of second pins on the memory expansion chip board ensure that different types of memory cells receive the correct signals, including data, address, and parity signals. This helps improve data transmission reliability and system stability. By standardizing the connections between memory expansion chip boards and memory expansion boards, storage system design becomes simpler. Designers can easily add or replace memory expansion boards to adapt to different application needs or technology upgrades. When memory cells or expansion chips require maintenance or upgrades, the relevant boards can be quickly and easily disassembled and replaced without affecting other parts of the storage system. This reduces maintenance costs and system downtime. This design allows the system to be compatible with multiple types of memory cells, including current and future technologies. The storage system can easily adapt to new memory standards without a complete hardware replacement. By precisely providing the required signals for each memory cell, the storage system can avoid unnecessary energy waste.

[0047] Optionally, the voltage conversion module is connected to the server motherboard via a first gold finger to obtain power from the server motherboard; The voltage conversion module is connected to the memory unit on the memory expansion board and the memory expansion chip board on the memory expansion board; The voltage conversion module is used to determine the voltage requirements of the memory expansion chip board and the voltage requirements of the memory units on the memory expansion board. The voltage conversion module is used to perform a first voltage conversion on the power supply provided by the server motherboard according to the voltage requirements required by the memory expansion chip board, so that the memory expansion chip board can obtain a first power supply that meets the voltage requirements required by the memory expansion chip board. The voltage conversion module is used to perform a second voltage conversion on the power supply provided by the server motherboard according to the voltage requirements of the memory units on the memory expansion card, so that the memory units on the memory expansion card can obtain a second power supply that meets the voltage requirements of the memory units on the memory expansion card. The memory expansion chip board obtains the first power supply after the voltage conversion module has performed the first voltage conversion through the connector.

[0048] Specifically, Figure 2 This is a schematic diagram of the structure of a memory expansion board including a voltage conversion module provided in this application. In one embodiment, such as... Figure 2 As shown, considering that the power supply voltage required by each electronic component on the memory expansion card may be different, for example, DDR5 memory requires 12V and 3.3V power supply, while DDR4 memory requires 2.5V, 0.6V, and 1.2V power supply.

[0049] Therefore, in this embodiment, a voltage conversion module is provided, located on the memory expansion board, and connected to the power supply provided by the server motherboard via a first gold finger. The core function of this voltage conversion module is to identify and provide the specific voltage required by the memory expansion chip board and memory units.

[0050] Specifically, before voltage conversion, the voltage conversion module can determine the voltage requirements of the memory expansion chip board and the voltage requirements of the memory cells on the memory expansion board.

[0051] Furthermore, during the voltage conversion process, the voltage conversion module first performs a first voltage conversion on the power supplied by the server motherboard according to the voltage requirements of the memory expansion chip board. In this way, the memory expansion chip board receives a first power supply that meets its operating voltage requirements. Specifically, the memory expansion chip board obtains this first power supply, after the voltage conversion by the voltage conversion module, through a connector.

[0052] Next, the voltage conversion module performs a second voltage conversion on the power supply provided by the server motherboard, based on the voltage requirements of the memory units connected to the memory expansion card. This ensures that the memory units receive a second power supply that meets their operating voltage requirements.

[0053] Through the above embodiments, by providing precise power supply voltage, the voltage conversion module ensures that memory expansion chips and memory cells can operate stably at the required voltage, avoiding the risk of performance degradation or damage caused by voltage mismatch. Furthermore, this design allows memory expansion cards to adapt to memory cells and expansion chips with different voltage requirements, improving the compatibility and flexibility of the storage system. Voltage conversion modules typically employ efficient conversion technologies, such as switching regulators, which reduce energy loss and improve power efficiency compared to traditional linear regulators. The design of the voltage conversion module also supports hot-swapping, allowing memory expansion cards to be replaced or upgraded without restarting the system, increasing system maintenance convenience. The voltage conversion module provides overvoltage and undervoltage protection for the system, preventing damage to the circuitry caused by abnormal voltage. The voltage conversion module integrated on the memory expansion card provides a flexible, efficient, and safe power solution for the storage system, meeting the specific power supply voltage requirements of different electronic components and ensuring the stable operation and performance of the entire storage system.

[0054] Optionally, the memory expansion board connects to multiple expansion chip boards via multiple connectors; The memory expansion board is also equipped with a clock signal buffer, which is connected to multiple expansion chip boards on the memory expansion board.

[0055] Specifically, Figure 3 This is a schematic diagram of the structure of a memory expansion board including multiple memory expansion chip boards according to an embodiment of this application. In one embodiment, such as Figure 3 As shown, a single memory expansion card can connect to multiple memory expansion chip cards simultaneously to manage multiple memory units on a single card. However, standard PCIe contacts only provide one 100MHz clock signal, which is insufficient for scenarios with multiple memory expansion chips.

[0056] Therefore, a clock signal buffer needs to be integrated onto the memory expansion board. This allows for the provision of multiple sets of clock signals to the memory expansion chips when multiple expansion boards are connected, ensuring that each chip receives a stable clock signal. Clock signals are crucial for synchronous circuit operation, especially in high-speed data processing and communication. By providing each expansion chip with an independent clock signal, data can be transmitted synchronously between chips, avoiding data errors or processing delays caused by clock skew.

[0057] The memory expansion board is equipped with a clock signal buffer, an electronic device used to receive, amplify, and redistribute clock signals. When multiple expansion chip boards are connected, the clock signal buffer ensures that each chip receives a synchronized clock signal from a single clock source.

[0058] Through the above embodiments, when connecting multiple expansion chip boards, the memory expansion board can use a clock signal buffer to ensure that each chip receives a stable and synchronized clock signal, even in a multi-chip environment. This is crucial for maintaining the accuracy of data transmission and the reliability of the system. Due to the design of the clock signal buffer and connectors, system maintenance and upgrades become more flexible. If it is necessary to replace or upgrade a memory expansion chip, it can be done easily without affecting the operation of other memory expansion chips or the entire storage system.

[0059] Optionally, the plurality of memory expansion cards include a first memory expansion card and a second memory expansion card, and the plurality of memory units are divided into memory units of a first target type and memory units of a second target type; The first memory expansion card is connected to the memory unit of the first target type; The second memory expansion card is connected to the memory unit of the second target type; When a memory unit of the first target type is required, the memory expansion chip board can be detachably connected to the first memory expansion board via a connector on the first memory expansion board. When a second type of memory unit is required, the memory expansion chip board is detached from the first memory expansion board. The memory expansion chip board is detachably connected to the second memory expansion board via a connector on the second memory expansion board.

[0060] Specifically, in one embodiment, the storage system supports different types of memory cells by using different types of memory expansion cards. In this design, there are two types of memory expansion cards: a first memory expansion card and a second memory expansion card, which are used to connect to two different target types of memory cells, respectively. The first memory expansion card connects to memory cells of the first target type, and the second memory expansion card connects to memory cells of the second target type.

[0061] For example, if the first target type of memory unit is DDR4 memory and the second target type of memory unit is DDR5 memory, then the first memory expansion card can connect to DDR4 memory, and the second memory expansion card can connect to DDR5 memory. Conversely, the first target type of memory unit can also be DDR5 memory, and the second target type of memory unit can also be DDR4 memory. When the first target type of memory unit needs to be used, the memory expansion chip card can be detachably connected to the first memory expansion card through the connector on the first memory expansion card, thereby enabling the memory expansion chip to manage the memory units of the first target type. Similarly, when it is necessary to use the memory expansion chip already connected to the first memory expansion card to manage the memory cells of the second target type, the memory expansion chip board already connected to the first memory expansion card can be removed from the first memory expansion card, and the removed memory expansion chip board can be detachably connected to the second memory expansion card with the memory cells of the second target type connected through the connector on the second memory expansion card, so as to realize the memory expansion chip's management of the memory cells of the second target type. In the whole process, only the memory expansion chip board needs to be replaced, without replacing the entire memory expansion card.

[0062] Through the above embodiments, memory requirements can be quickly adjusted and optimized based on current memory unit usage needs without replacing the entire memory expansion board. In this way, the storage system can rapidly adapt to different memory demands; switching between different types of memory units is as simple as disassembling and reconnecting the memory expansion chip board. Users can upgrade or expand memory as needed without incurring significant costs by replacing the entire memory expansion board, thus improving the economics of memory expansion boards. Because the connection between the memory expansion chip board and the memory expansion board is detachable, maintenance and troubleshooting become much easier.

[0063] Optionally, the memory expansion card is equipped with memory slots; the memory unit includes at least a memory module; The memory module is indirectly connected to the memory expansion card via the memory slot.

[0064] Specifically, Figure 4This is a schematic diagram of a memory expansion card including memory slots according to an embodiment of this application. In one embodiment, such as... Figure 4 As shown, the memory unit and the memory expansion card can be indirectly connected. In this implementation, the memory unit is in the form of a memory module. Therefore, a corresponding memory slot needs to be configured on the memory expansion card so that the memory module can be indirectly connected to the memory expansion card through the memory slot.

[0065] Through the above embodiments, this memory module design allows for easy disassembly and replacement of memory units in case of malfunction or upgrades, thus improving user convenience.

[0066] Specifically, Figure 5 This is a schematic diagram of a memory expansion board including memory chips according to an embodiment of this application. In one embodiment, such as... Figure 5 As shown, the memory unit and the memory expansion card can be directly connected. In this implementation, the memory unit is in the form of a memory chip. The memory chip does not need a corresponding memory slot on the memory expansion card; it can be directly fixed to the memory expansion card using surface-mount soldering on both sides, allowing direct connection between the memory chip and the memory expansion card via a memory slot. Since the type of memory unit and the memory expansion card are bound together, the memory unit can be directly soldered onto the memory expansion card using memory chips. Through the above embodiment, using this memory chip method improves the space utilization of the memory expansion card, optimizes circuit signal instructions, and allows for the addition of a heatsink to accommodate larger memory chips with higher power consumption, thereby improving storage performance.

[0067] Optionally, the memory unit may further include a parity chip; The verification chip is connected to the memory expansion board by surface mounting on both sides.

[0068] Specifically, in one embodiment, since memory chips occupy less area than memory modules and do not require memory slots, the remaining space of the memory expansion card can also be used to configure a verification chip, which is used to provide a verification mechanism for the data in the memory chip.

[0069] Optionally, the memory expansion board further includes a baseboard slot, and the memory expansion chip board comprises a first side and a second side, the first side being perpendicular to the second side, and the area of ​​the first side being larger than the area of ​​the second side; wherein: The memory expansion chip is connected to the memory expansion chip board on the first surface via the connector; The second side of the memory expansion chip board is also provided with a second gold finger, and the memory expansion chip board is connected to the base plate slot of the memory expansion board through the second gold finger.

[0070] Specifically, Figure 6 This is a schematic diagram illustrating the placement of another memory expansion chip board according to an embodiment of this application, as shown below. Figure 6 As shown, in one embodiment, to further utilize the space of the memory expansion board and accommodate different structural requirements, the position and connection method of the memory expansion chip board can be adjusted on the memory expansion board. Multiple substrate slots are provided on the memory expansion board, and a second gold finger is also configured on the memory expansion chip board. Simultaneously, the memory expansion chip board includes a first side and a second side, with the first side perpendicular to the second side and the area of ​​the first side larger than that of the second side. On the first side of the memory expansion chip board, the memory expansion chip is connected to the memory expansion chip board via a connector. On the second side, the second gold finger can be provided, through which the memory expansion chip is connected to the memory expansion chip board. The memory expansion chip card is connected to the memory expansion board, changing the connection from the first side to the second side. Since the area of ​​the second side is smaller, the second gold fingers on the second side can connect the memory expansion chip card to the base slot of the memory expansion board. This allows the memory expansion chip card to be placed vertically on the memory expansion board, thus reducing the contact area between individual memory expansion chip cards. This allows for the placement of more memory expansion chip cards on the memory expansion board or the use of the saved space to accommodate more memory cells.

[0071] The second gold finger on the memory expansion chip board is a set of conductive contacts that not only transmit power and signals but also ensure the electrical connection and physical fixation between memory expansion chip boards. The baseboard slot on the memory expansion board acts as a receiver, designed with specific dimensions and shapes to accommodate the second gold finger. This slot allows the memory expansion chip board to be inserted vertically, saving space and improving the compactness of the server's internal structure.

[0072] Through the above embodiments, the vertically arranged memory expansion chip cards help save space on the memory expansion cards, allowing more memory expansion cards to be installed within limited rack space, thus improving the server's memory expansion capabilities. The cooperation between the second gold finger and the baseboard slot provides a stable and reliable electrical connection, ensuring efficient data and power transmission between the memory expansion chip cards. The vertically placed memory expansion chip cards help improve heat dissipation because this layout provides more space for other components, such as heat sinks. This modular design concept simplifies maintenance and upgrades. If it is necessary to replace or upgrade the memory expansion chip card, it can simply be removed from the baseboard slot and replaced, without requiring complex operations on the entire system.

[0073] Optionally, the memory expansion chip board further includes a third side, which is parallel to the first side; A heat sink is also provided on the third side of the memory expansion chip board.

[0074] Specifically, Figure 7 This is a side view of a memory expansion card including a heatsink, according to an embodiment of this application. In one embodiment, such as... Figure 7 As shown, the memory expansion chip board also includes a third side, which is the back of the first side. Therefore, in scenarios where the second side of the memory expansion chip board is placed vertically on the memory expansion board, considering that the memory expansion board is designed with a dedicated heatsink for heat dissipation, this heatsink is connected horizontally to the memory expansion chip board on the third side, plate-to-plate. In other words, the heatsink is not mounted vertically on the memory expansion board, but rather connected parallel to the third side, thus utilizing the vertical placement of the memory expansion chip board to optimize its spatial layout and improve heat dissipation efficiency.

[0075] The above embodiments achieve efficient heat dissipation and space optimization, making them particularly suitable for server and data center environments with strict requirements for space and heat dissipation, thereby improving the heat dissipation efficiency of memory expansion chip boards and ensuring stable system operation.

[0076] Based on the same inventive concept, another embodiment of this application provides a memory expansion chip board, on which a memory expansion chip is configured, and the memory expansion chip board is connected to the memory expansion board via a connector on the memory expansion board. The memory expansion chip board is provided with various types of second pins, which are used to bring out signals required by various types of memory units. When a target type of memory cell is required among the various types of memory cells, the second pin of the various types corresponding to the target type of memory cell is connected to the first pin of the memory expansion board corresponding to the target type of memory cell, so that after the memory expansion chip board is detachably connected to the memory expansion board where the target type of memory cell is located, the signal required by the target type of memory cell is led out through the second pin corresponding to the target type of memory cell.

[0077] The key feature of memory expansion chip cards is that they can be modularly separated from memory slots, allowing them to be directly replaced with other memory expansion cards. This avoids the waste of the entire expansion card after memory upgrades, greatly reducing the total cost of memory. Furthermore, the modular design can also be applied to the compatibility design of future DDR5 and DDR6 memory.

[0078] As for memory expansion chip boards, since they are basically similar to the above-described storage system embodiments, the description is relatively simple. For relevant details, please refer to the description of the storage system embodiments.

[0079] Alternatively, in a storage system, the following expansion and improvement schemes can be considered to improve the system's flexibility, maintainability, and performance.

[0080] Each type of memory unit can be designed with a modular structure, allowing for dynamic replacement and upgrades based on actual needs. Standardized interfaces (e.g., DDR4, DDR5, LPDDR, etc.) ensure compatibility between different types of memory modules, facilitating easy replacement and upgrades.

[0081] A more advanced management chip is added to the memory expansion chip card, equipped with intelligent algorithms to monitor the usage and performance of each memory unit. This management system can dynamically adjust memory resource allocation by collecting and analyzing usage data, so that more resources can be allocated to critical tasks during peak load periods.

[0082] The management system integrates real-time monitoring functions to detect memory temperature, power consumption, status, etc., so as to respond promptly in the event of a fault.

[0083] By combining memory expansion cards with emerging storage technologies such as flash memory and SSDs, a multi-tiered storage architecture can be built between memory and persistent storage. This not only improves performance but also enables automatic data migration and tiered storage, optimizing storage strategies based on data usage and access frequency.

[0084] For the connectors, a multi-port design allows a single expansion card to connect to multiple types of memory units simultaneously, improving expandability and flexibility. For example, by implementing high-speed interfaces such as PCIe, data transfer and expansion can be performed faster.

[0085] A hardware encryption module is integrated on the memory expansion chip board to encrypt and protect the data stored in memory, thereby enhancing data security.

[0086] For critical data, a RAID-like mechanism is used to distribute the data across multiple memory units, enhancing data reliability and recoverability.

[0087] With real-time data mirroring, if a memory cell fails, the system can quickly switch to another backup cell.

[0088] The system uses visual information displays to help users quickly identify problems and take action. Furthermore, the storage system supports remote monitoring and management. Maintenance personnel can remotely manage and monitor performance, and perform firmware updates via network connection. It enables automated fault handling and resource allocation, allowing the system to self-adjust when the load changes.

[0089] The above embodiments enhance the flexibility, maintainability, and performance of existing storage systems. These improvements not only optimize the use of system resources but also enhance security and user experience, laying the foundation for future technological updates. This comprehensive solution will make the storage system more competitive in the market, adapting to ever-changing technological demands and business scenarios.

[0090] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0091] Those skilled in the art will understand that embodiments of this application can be provided as methods, apparatus, or computer program products. Therefore, embodiments of this application can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of this application can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0092] This application describes embodiments with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0093] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0094] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0095] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0096] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0097] The storage system provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A storage system, characterized in that, The storage system includes: multiple memory expansion cards, memory expansion chip cards, and various types of memory units; Each of the plurality of memory expansion cards is connected to a memory unit of the corresponding type among the plurality of memory units; The memory expansion chip board is equipped with a memory expansion chip and a connector. The memory expansion chip board and the memory expansion board are detachably connected through the connector. The connector is a board-to-board connector. The memory expansion board is configured with a first pin, and the memory expansion chip board is configured with multiple types of second pins; the multiple types of second pins correspond to the multiple types of memory cells; after the memory expansion chip board is detachably connected to the memory expansion board containing the target type of memory cell, the signal required by the target type of memory cell is led out to the corresponding first pin of the target type of memory cell on the memory expansion board through the second pin corresponding to the target type of memory cell, so that the first pin and the second pin are electrically connected; The memory expansion chip board includes a first side, a second side, and a third side. The second side of the memory expansion chip board is placed vertically on the memory expansion chip board, and a heat sink is disposed on the third side of the memory expansion chip board. The third side is the back side of the first side of the memory expansion chip board. The memory expansion board is equipped with a clock signal buffer; the clock signal buffer is used to ensure that each memory expansion chip obtains a synchronized clock signal when multiple memory expansion chip boards are connected. The memory expansion board is equipped with a voltage conversion module, which is connected to the power supply provided by the server motherboard via a first gold finger; the voltage conversion module is used to identify and provide the voltage required by the memory expansion chip board and the memory unit.

2. The storage system according to claim 1, characterized in that, The voltage conversion module is connected to the server motherboard via a first gold finger to obtain power from the server motherboard. The voltage conversion module is connected to the memory unit on the memory expansion board and the memory expansion chip board on the memory expansion board; The voltage conversion module is used to determine the voltage requirements of the memory expansion chip board and the voltage requirements of the memory units on the memory expansion board. The voltage conversion module is used to perform a first voltage conversion on the power supply provided by the server motherboard according to the voltage requirements required by the memory expansion chip board, so that the memory expansion chip board can obtain a first power supply that meets the voltage requirements required by the memory expansion chip board. The voltage conversion module is used to perform a second voltage conversion on the power supply provided by the server motherboard according to the voltage requirements of the memory units on the memory expansion card, so that the memory units on the memory expansion card can obtain a second power supply that meets the voltage requirements of the memory units on the memory expansion card. The memory expansion chip board obtains the first power supply after the voltage conversion module has performed the first voltage conversion through the connector.

3. The storage system according to claim 1, characterized in that, The memory expansion board is connected to multiple expansion chip boards via multiple connectors; The clock signal buffer is connected to multiple expansion chip boards on the memory expansion board.

4. The storage system according to claim 1, characterized in that, The plurality of memory expansion cards include a first memory expansion card and a second memory expansion card, and the plurality of memory units are divided into memory units of a first target type and memory units of a second target type; The first memory expansion card is connected to the memory unit of the first target type; The second memory expansion card is connected to the memory unit of the second target type; When a memory unit of the first target type is required, the memory expansion chip board can be detachably connected to the first memory expansion board via a connector on the first memory expansion board. When a second type of memory unit is required, the memory expansion chip board is detached from the first memory expansion board. The memory expansion chip board is detachably connected to the second memory expansion board via a connector on the second memory expansion board.

5. The storage system according to claim 1, characterized in that, The memory expansion card is equipped with memory slots; the memory unit includes at least a memory module. The memory module is indirectly connected to the memory expansion card via the memory slot.

6. The storage system according to claim 1, characterized in that, The memory unit includes at least memory chips; The memory chips are connected to the memory expansion board via surface mount soldering on both sides.

7. The storage system according to claim 5 or 6, characterized in that, The memory unit also includes a parity chip; The verification chip is connected to the memory expansion board by surface mounting on both sides.

8. The storage system according to claim 1, characterized in that, The memory expansion card is also equipped with a baseboard slot, the first side is perpendicular to the second side, and the area of ​​the first side is larger than the area of ​​the second side; wherein: The memory expansion chip is connected to the memory expansion chip board on the first surface via the connector; The second side of the memory expansion chip board is also provided with a second gold finger, and the memory expansion chip board is connected to the base plate slot of the memory expansion board through the second gold finger.

9. The storage system according to claim 8, characterized in that, The third surface is parallel to the first surface.

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