A thermistor chip press-fitting tool and press-fitting method thereof

Abstract

The invention relates to the technical field of thermistor chip press-fitting, and in particular to a thermistor chip press-fitting tool and a press-fitting method thereof, comprising a printing plate, a pressure-sensitive chip position adjustment mechanism being arranged at the lower end of the printing plate, and a thermistor chip positioning mechanism being arranged at the lower end of the pressure-sensitive chip position adjustment mechanism; the thermistor chip positioning mechanism comprising a positioning plate, a middle through hole being arranged in the middle of the positioning plate, a stopper being fixedly connected to the inner side of the bottom end of the middle through hole, foot pads being fixedly connected to the lower ends of the four corners of the positioning plate, wherein telescopic rods are arranged at the upper ends of two foot pads, and adjusting bolts are rotatably connected to the inner sides of the upper ends of the other two foot pads. In the invention, in the process of thermistor chip press-fitting, the thermistor chip and the pressure-sensitive chip can be stably limited and fixed to ensure that the corresponding thermistor chip and the pressure-sensitive chip are coaxial after the fixing is completed, thereby improving the overall aesthetics of the thermistor and the quality of the thermistor.

Description

Technical Field

[0001] The invention relates to the technical field of thermistor chip press-fitting, in particular to a thermistor chip press-fitting tool and a press-fitting method thereof. Background Art

[0002] Thermistor chip press-fitting tooling is a precision manufacturing device used to connect thermistor chips to electrodes on circuit boards. It starts with placing thermistor chips evenly on the substrate. Finally, solder paste is applied to the chip using a silver printing machine through film silk screen welding technology or steel mold printing technology. It melts at a certain temperature to form a stable electrical connection. After the solder paste is applied, the worker will manually or use tweezers to accurately place the side coated with solder paste on the corresponding position of the pressure-sensitive chip. Finally, the entire assembly will go through a baking process to solidify the solder paste. Through this process, the thermistor can accurately sense temperature changes in the circuit and provide necessary feedback. It is widely used in various electronic devices, such as temperature sensors, overheat protection circuits, etc. In the process of press-fitting thermistor chips, if the corresponding thermistor chips and varistor chips cannot keep the same axis, the overall aesthetics of the device will be affected after the press-fitting is completed. At the same time, the axis offset between the thermistor chips and the varistor chips is large, which will affect the quality of the thermistor. Therefore, a thermistor chip press-fitting tool and a press-fitting method thereof are proposed to solve the above problems. Summary of the invention

[0003] The object of the present invention is to provide a thermistor chip press-fitting tool and a press-fitting method thereof, so as to solve the problem that in the process of press-fitting the thermistor chip, if the corresponding thermistor chip and the varistor chip cannot keep the same axis, after the press-fitting is completed, the overall aesthetics of the device will be affected. At the same time, the axis offset between the thermistor chip and the varistor chip is large, which will affect the quality of the thermistor.

[0004] To achieve the above object, the present invention provides the following technical solutions: A thermistor chip press-fitting tool and a press-fitting method thereof, comprising a printing plate, a pressure-sensitive chip position adjustment mechanism is provided at the lower end of the printing plate, and a thermistor chip positioning mechanism is provided at the lower end of the pressure-sensitive chip position adjustment mechanism; the thermistor chip positioning mechanism comprises a positioning plate, a middle through hole is provided in the middle of the positioning plate, a stopper is fixedly connected to the inner side of the bottom end of the middle through hole, and foot pads are fixedly connected to the lower ends of the four corners of the positioning plate, wherein telescopic rods are installed at the upper ends of two of the foot pads, and adjusting bolts are rotatably connected to the inner sides of the upper ends of the other two foot pads, and the upper ends of the adjusting bolts are spirally connected to the fixing plate. A circular hole is provided inside the fixing plate, sliding holes are provided around the circular hole, a locking mechanism is installed inside the circular hole, and positioning pins are fixedly connected to the four corners of the upper end of the fixing plate; the pressure-sensitive chip position adjustment mechanism includes an adjustment plate, an adjustment hole is provided on the inner side of the adjustment plate, rubber caps are provided around the adjustment hole, a rubber diaphragm is provided at the lower end of the rubber cap, and an adjustment column is provided between the rubber cap and the rubber diaphragm; the locking mechanism includes a locking plate, a guide rod is fixedly connected to the middle of the outer side of the locking plate, a telescopic spring is fixedly connected to the other end of the guide rod, and an inclined panel is fixedly connected to the lower end of the locking plate.

[0005] As a further optimization of the present invention, the vertical projections of the positioning plate and the fixing plate are equal in size, the positioning plate and the fixing plate are parallel to each other, and the through hole opened inside the positioning plate, the circular hole opened inside the fixing plate and the locking mechanism correspond one to one.

[0006] As a further optimization of the present invention, two telescopic rods are provided, the top end of the telescopic rod is fixedly connected to the bottom end of the fixed plate, the telescopic rods are distributed diagonally, and the telescopic rods are parallel to the adjusting bolts.

[0007] As a further optimization of the present invention, there are two adjusting bolts, the lower ends of the adjusting bolts pass through the positioning plate, and the adjusting bolts and the positioning plate are rotatably connected, and the adjusting ends of the adjusting bolts are arranged in blind holes opened on the inner side of the bottom end of the foot pad.

[0008] As a further optimization of the present invention, there are four locking plates, inclined plates, guide rods and telescopic springs arranged inside any of the locking mechanisms, and there is a one-to-one correspondence between the locking plates, inclined plates, guide rods and telescopic springs.

[0009] As a further optimization of the present invention, the guide rod is rotatably connected to the fixed plate through a sliding hole, the telescopic spring is arranged inside the sliding hole, and one side of the inclined surface of the inclined panel is tightly attached to the positioning plate through the middle through hole.

[0010] As a further optimization of the present invention, a plurality of T-shaped holes are opened on the inner side of the adjustment plate, and the T-shaped holes are distributed around the adjustment hole. The adjustment column is slidably connected to the adjustment plate through the T-shaped hole. The vertical projection of the adjustment column is T-shaped, and the side of the adjustment column close to the center point of the adjustment hole is arc-shaped, and the three ports of the T-shaped hole all pass through the adjustment plate.

[0011] As a further optimization of the present invention, pin holes are provided at the four corners of the lower end of the adjustment plate, the pin holes provided at the four corners of the lower end of the adjustment plate correspond to the positioning pins, and the upper edge of the positioning pin is arc-shaped.

[0012] As a further optimization of the present invention, the gap between the locking plates is used to position the thermistor chip, the adjustment hole is used to position the varistor chip, and the upper end of the thermistor chip is exposed on the upper end of the fixing plate.

[0013] As a further optimized content of the present invention, the following steps are included: Step I: adjusting the locking mechanism according to the diameter of the thermistor chip: synchronously adjusting two set adjusting bolts to adjust the spacing between the positioning plate and the fixed plate. During the adjustment process, the fixed plate positions the inclined plate through the circular hole set inside. After the inclined plate is positioned, it synchronously drives the locking plate to complete the positioning; Step II: Positioning multiple thermistor chips: placing multiple thermistor chips between the locking plates to achieve synchronous positioning of multiple thermistor chips; After multiple thermistor chips are positioned, evenly apply solder paste to the surface of the thermistor chip exposed on the upper side of the fixing plate; Step III: Positioning the pressure-sensitive chip: Place the adjustment plate on the upper end of the fixed plate, and use the pin hole at the bottom of the adjustment plate to connect the positioning pin to the upper end of the fixed plate to achieve the positioning of the adjustment plate. After the positioning is completed, place the pressure-sensitive chip into the adjustment hole and achieve a one-to-one correspondence with the thermistor chip. Step IV: Fixing the printing plate: After the pressure-sensitive chip is placed in the adjustment hole, the printing plate is placed at the upper end of the pressure-sensitive chip, and a weight is applied to the upper end of the printing plate to squeeze it. During this process, the printing plate squeezes the rubber cap, causing the air inside the rubber cap to enter the T-hole. A part of the air entering the T-hole is used to squeeze out the adjustment column to position the pressure-sensitive chip, and a part of the air is used to deform the rubber diaphragm. Step V: Baking process to make the chips stick together: After the overall placement is completed, heat and bake to make the printing plate, pressure-sensitive chip and thermistor chip stick together stably. Finally, adjust the position of the locking plate so that the locking plate no longer positions the thermistor chip, and remove the thermistor chip positioning mechanism, then remove the pressure-sensitive chip position adjustment mechanism to complete the thermistor chip press-fitting process.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, during the process of thermistor chip press fitting, the thermistor chip and the varistor chip can be stably limited and fixed to ensure that the corresponding thermistor chip and the varistor chip are coaxial after the fixation is completed, thereby improving the overall aesthetics of the thermistor and the quality of the thermistor; 2. In the present invention, in the actual application process, thermistor chips with different diameters can be positioned, and the varistor chip can be automatically adjusted according to the diameter of the varistor chip to ensure that the thermistor chip and the varistor chip are located on the same axis, thereby effectively improving the convenience of the thermistor chip press fitting process; 3. In the present invention, the press-fitting tool adopts a modular design as a whole, which is convenient for positioning the thermistor chip and the varistor chip in sequence. After the thermistor chip, the varistor chip and the printing plate are fixed in the later stage, the positioning mechanism of the thermistor chip and the varistor chip can be removed layer by layer. At the same time, if any position is damaged, it can be replaced independently, which reduces the cost of later maintenance of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the thermistor chip positioning mechanism of the present invention; Figure 3 It is a schematic diagram of the locking mechanism structure of the present invention; Figure 4 This is a schematic diagram of the positioning plate structure of the present invention; Figure 5 For the present invention Figure 4 The enlarged structural diagram at B in the middle; Figure 6 This is a schematic diagram of the structure of the pressure-sensitive chip position adjustment mechanism of the present invention; Figure 7 For the present invention Figure 6 Enlarged structural diagram at A in the middle.

[0016] In the figure: 1, thermistor chip positioning mechanism; 11, positioning plate; 12, middle through hole; 13, stopper; 14, telescopic rod; 15, adjustment bolt; 16, foot pad; 17. Locking mechanism; 171. Locking plate; 172. Inclined plate; 173. Guide rod; 174. Telescopic spring; 18. fixing plate; 19. positioning pin; 110. round hole; 111. sliding hole; 2. Thermistor chip; 3. Pressure-sensitive chip position adjustment mechanism; 31. Adjustment plate; 32. Adjustment hole; 33. Rubber cap; 34. Adjustment column; 35. Rubber diaphragm; 4. Pressure-sensitive chip; 5. Printing plate. DETAILED DESCRIPTION

[0017] See also Figure 1-7 , the present invention provides a technical solution: A thermistor chip press-fitting tool and a press-fitting method thereof, comprising a printing plate 5, a pressure-sensitive chip position adjustment mechanism 3 is provided at the lower end of the printing plate 5, and a thermistor chip positioning mechanism 1 is provided at the lower end of the pressure-sensitive chip position adjustment mechanism 3; the thermistor chip positioning mechanism 1 comprises a positioning plate 11, a middle through hole 12 is provided in the middle of the positioning plate 11, a stopper 13 is fixedly connected to the inner side of the bottom end of the middle through hole 12, and foot pads 16 are fixedly connected to the lower ends of the four corners of the positioning plate 11, wherein two foot pads 16 are installed with telescopic rods 14 at the upper ends, and the inner sides of the upper ends of the other two foot pads 16 are rotatably connected with adjusting bolts 15, and the upper ends of the adjusting bolts 15 are spirally connected to the fixing plate 18, and the fixing plate 18 has a circular hole 11 provided inside. 0, a sliding hole 111 is provided around the circular hole 110, a locking mechanism 17 is installed inside the circular hole 110, and positioning pins 19 are fixedly connected to the four corners of the upper end of the fixing plate 18; the pressure-sensitive chip position adjustment mechanism 3 includes an adjustment plate 31, an adjustment hole 32 is provided on the inner side of the adjustment plate 31, rubber caps 33 are provided around the adjustment hole 32, a rubber diaphragm 35 is provided at the lower end of the rubber cap 33, and an adjustment column 34 is provided between the rubber cap 33 and the rubber diaphragm 35; the locking mechanism 17 includes a locking plate 171, a guide rod 173 is fixedly connected to the middle of the outer side of the locking plate 171, a telescopic spring 174 is fixedly connected to the other end of the guide rod 173, and an inclined plate 172 is fixedly connected to the lower end of the locking plate 171.

[0018] As a technical solution for further implementation of this scheme, the vertical projections of the positioning plate 11 and the fixing plate 18 are equal in size, the positioning plate 11 and the fixing plate 18 are parallel to each other, and the through hole 12 opened inside the positioning plate 11, the circular hole 110 opened inside the fixing plate 18 and the locking mechanism 17 correspond to each other one by one. Through the above arrangement, the stability of the thermistor chip 2 during positioning can be improved; As a further technical solution of the present invention, two telescopic rods 14 are provided, the top end of the telescopic rod 14 is fixedly connected to the bottom end of the fixed plate 18, the telescopic rods 14 are diagonally distributed, and the telescopic rods 14 and the adjusting bolts 15 are parallel. Through the above arrangement, the stability of the fixed plate 18 during adjustment can be improved; As a further technical solution of the present invention, two adjusting bolts 15 are provided, the lower end of the adjusting bolt 15 passes through the positioning plate 11, and the adjusting bolt 15 and the positioning plate 11 are rotatably connected, and the adjusting end of the adjusting bolt 15 is arranged in a blind hole opened on the inner side of the bottom end of the foot pad 16. Through the above arrangement, the accuracy of the position adjustment of the fixing plate 18 is further improved; As a technical solution for further implementation of this scheme, any locking plate 171, inclined plate 172, guide rod 173 and telescopic spring 174 are provided inside any locking mechanism 17, and there are four locking plates 171, inclined plates 172, guide rods 173 and telescopic springs 174, and there is a one-to-one correspondence between the locking plates 171, the inclined plates 172, the guide rods 173 and the telescopic springs 174. Through the above arrangement, the thermistor chip 2 can be stably limited by the locking mechanism 17; As a technical solution for further implementation of this scheme, the guide rod 173 is rotatably connected to the fixed plate 18 through the sliding hole 111, the telescopic spring 174 is arranged inside the sliding hole 111, and one side of the inclined surface of the inclined plate 172 is in close contact with the positioning plate 11 through the middle through hole 12. Through the above arrangement, thermistor chips 2 with different diameters can be positioned; As a technical solution for further implementation of this solution, a plurality of T-shaped holes are opened on the inner side of the adjustment plate 31, and the T-shaped holes are distributed around the adjustment hole 32. The adjustment column 34 is slidably connected to the adjustment plate 31 through the T-shaped holes. The vertical projection of the adjustment column 34 is T-shaped, and the side of the adjustment column 34 close to the center point of the adjustment hole 32 is arc-shaped. The three ports of the T-shaped holes all penetrate the adjustment plate 31. Through the above arrangement, the adjustment column 34 and the rubber diaphragm 35 can be stably limited. As a further technical solution of this scheme, pin holes are provided at the four corners of the lower end of the adjustment plate 31, and the pin holes provided at the four corners of the lower end of the adjustment plate 31 correspond to the positioning pins 19, and the upper edge of the positioning pins 19 is arc-shaped. Through the above arrangement, the adjustment plate 31 can be stably connected to the fixed plate 18; As a technical solution for further implementation of this scheme, the gap between the locking plates 171 is used to position the thermistor chip 2, and the adjustment hole 32 is used to position the pressure-sensitive chip 4. The upper end of the thermistor chip 2 is exposed at the upper end of the fixing plate 18. Through the above arrangement, the pressure-sensitive chip 4 can be automatically adjusted so that the pressure-sensitive chip 4 and the thermistor chip 2 are installed coaxially. As a technical solution for further implementation of this scheme, the following steps are included: Step I: adjusting the locking mechanism 17 according to the diameter of the thermistor chip 2: synchronously adjusting the two set adjusting bolts 15 to adjust the spacing between the positioning plate 11 and the fixing plate 18. During the adjustment process, the fixing plate 18 positions the inclined plate 172 through the circular hole 110 set inside. After the inclined plate 172 is positioned, it synchronously drives the locking plate 171 to complete the positioning; Step II: Positioning multiple thermistor chips 2: placing multiple thermistor chips 2 between the locking plates 171 to achieve synchronous positioning of multiple thermistor chips 2; After the positioning of the multiple thermistor chips 2 is completed, solder paste is evenly applied to the surface of the thermistor chip 2 exposed on the upper side of the fixing plate 18; Step III: Positioning the pressure-sensitive chip 4: Place the adjustment plate 31 on the upper end of the fixed plate 18, and use the pin hole at the bottom of the adjustment plate 31 to fix the positioning pin 19 on the upper end of the fixed plate 18 to position the adjustment plate 31. After positioning, place the pressure-sensitive chip 4 in the adjustment hole 32, and achieve a one-to-one correspondence with the thermistor chip 2. Step IV: Fixing the printing plate 5: After the pressure-sensitive chip 4 is placed in the adjustment hole 32, the printing plate 5 is placed at the upper end of the pressure-sensitive chip 4, and a weight is applied to the upper end of the printing plate 5 to squeeze. During this process, the printing plate 5 squeezes the rubber cap 33, so that the air inside the rubber cap 33 enters the T-shaped hole. A part of the air entering the T-shaped hole is used to squeeze out the adjustment column 34 to position the pressure-sensitive chip 4, and a part of the air is used to deform the rubber diaphragm 35. Step V: Baking process to make the chips stick together: After the overall placement is completed, heat and bake to make the printing plate 5, the pressure-sensitive chip 4 and the thermistor chip 2 stably stick together. Finally, adjust the position of the locking plate 171 so that the locking plate 171 no longer positions the thermistor chip 2, and remove the thermistor chip positioning mechanism 1, then remove the pressure-sensitive chip position adjustment mechanism 3, and complete the press-fitting process of the thermistor chip.

[0019] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. The above is only a preferred implementation of the present invention. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the protection scope of the present invention.

Claims

1. A thermistor chip press-fitting tool, comprising a printing plate (5), characterized in that: A pressure-sensitive chip position adjustment mechanism (3) is provided at the lower end of the printing plate (5), and a thermistor chip positioning mechanism (1) is provided at the lower end of the pressure-sensitive chip position adjustment mechanism (3); The thermistor chip positioning mechanism (1) comprises a positioning plate (11), a middle through hole (12) is provided in the middle of the positioning plate (11), a stopper (13) is fixedly connected to the inner side of the bottom end of the middle through hole (12), foot pads (16) are fixedly connected to the lower ends of the four corners of the positioning plate (11), two of the foot pads (16) are installed with telescopic rods (14) at their upper ends, and adjusting bolts (15) are rotatably connected to the inner sides of the upper ends of the other two foot pads (16), the upper ends of the adjusting bolts (15) are spirally connected to the fixing plate (18), a circular hole (110) is provided inside the fixing plate (18), sliding holes (111) are provided around the circular hole (110), a locking mechanism (17) is installed inside the circular hole (110), and positioning pins (19) are fixedly connected to the four corners of the upper end of the fixing plate (18); The pressure-sensitive chip position adjustment mechanism (3) comprises an adjustment plate (31), an adjustment hole (32) is provided on the inner side of the adjustment plate (31), rubber caps (33) are provided around the adjustment hole (32), a rubber diaphragm (35) is provided at the lower end of the rubber cap (33), and an adjustment column (34) is provided between the rubber cap (33) and the rubber diaphragm (35); The locking mechanism (17) comprises a locking plate (171), a guide rod (173) being fixedly connected to the middle of the outer side of the locking plate (171), a telescopic spring (174) being fixedly connected to the other end of the guide rod (173), and a bevel plate (172) being fixedly connected to the lower end of the locking plate (171).

2. The thermistor chip press-fitting tool according to claim 1, characterized in that: The vertical projections of the positioning plate (11) and the fixing plate (18) are equal in size, the positioning plate (11) and the fixing plate (18) are parallel to each other, and the through hole (12) provided inside the positioning plate (11), the circular hole (110) provided inside the fixing plate (18), and the locking mechanism (17) correspond one to one.

3. The thermistor chip press-fitting tool according to claim 1, characterized in that: Two telescopic rods (14) are provided, the top end of the telescopic rod (14) is fixedly connected to the bottom end of the fixing plate (18), the telescopic rods (14) are distributed diagonally, and the telescopic rods (14) and the adjusting bolts (15) are parallel.

4. The thermistor chip press-fitting tool according to claim 1, characterized in that: Two adjusting bolts (15) are provided, the lower ends of the adjusting bolts (15) pass through the positioning plate (11), and the adjusting bolts (15) and the positioning plate (11) are rotatably connected, and the adjusting ends of the adjusting bolts (15) are arranged in blind holes opened on the inner side of the bottom end of the foot pad (16).

5. The thermistor chip press-fitting tool according to claim 1, characterized in that: There are four locking plates (171), inclined plates (172), guide rods (173) and telescopic springs (174) disposed inside any of the locking mechanisms (17), and there is a one-to-one correspondence between the locking plates (171), inclined plates (172), guide rods (173) and telescopic springs (174).

6. The thermistor chip press-fitting tool according to claim 1, characterized in that: The guide rod (173) is rotatably connected to the fixed plate (18) via the sliding hole (111); the telescopic spring (174) is arranged inside the sliding hole (111); and one side of the inclined surface of the inclined plate (172) is tightly attached to the positioning plate (11) via the middle through hole (12).

7. The thermistor chip press-fitting tool according to claim 1, characterized in that: A plurality of T-shaped holes are formed on the inner side of the adjustment plate (31), the T-shaped holes being distributed around the adjustment hole (32), the adjustment column (34) being slidably connected to the adjustment plate (31) via the T-shaped holes, the vertical projection of the adjustment column (34) being T-shaped, the side of the adjustment column (34) close to the center point of the adjustment hole (32) being arc-shaped, and the three ports of the T-shaped holes all penetrate the adjustment plate (31).

8. The thermistor chip press-fitting tool according to claim 1, characterized in that: Pin holes are provided at four corners of the lower end of the adjustment plate (31), and the pin holes provided at the four corners of the lower end of the adjustment plate (31) correspond to the positioning pins (19), and the upper edge of the positioning pins (19) is arc-shaped.

9. The thermistor chip press-fitting tool according to claim 1, characterized in that: The gap between the locking plates (171) is used to position the thermistor chip (2), the adjustment hole (32) is used to position the pressure-sensitive chip (4), and the upper end of the thermistor chip (2) is exposed at the upper end of the fixing plate (18).

10. A press-fitting method for a thermistor chip press-fitting tool according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: Step I: adjusting the locking mechanism (17) according to the diameter of the thermistor chip (2): synchronously adjusting two adjustment bolts (15) to adjust the spacing between the positioning plate (11) and the fixing plate (18); during the adjustment process, the fixing plate (18) positions the inclined plate (172) through the circular hole (110) provided inside; after the inclined plate (172) is positioned, it synchronously drives the locking plate (171) to complete the positioning; Step II: Positioning the multiple thermistor chips (2): placing the multiple thermistor chips (2) between the locking plates (171) to achieve synchronous positioning of the multiple thermistor chips (2); After the positioning of the plurality of thermistor chips (2) is completed, solder paste is evenly applied to the surface of the thermistor chips (2) exposed on the upper side of the fixing plate (18); Step III: Positioning the pressure-sensitive chip (4): placing the adjustment plate (31) on the upper end of the fixing plate (18), and positioning the adjustment plate (31) by means of a positioning pin (19) fixedly connected to the upper end of the fixing plate (18) through a pin hole provided at the bottom of the adjustment plate (31). After positioning, the pressure-sensitive chip (4) is placed in the adjustment hole (32) and a one-to-one correspondence is achieved between the pressure-sensitive chip (4) and the thermistor chip (2); Step IV: Fixing the printing plate (5): After the pressure-sensitive chip (4) is placed in the adjustment hole (32), the printing plate (5) is placed at the upper end of the pressure-sensitive chip (4), and a weight is applied to the upper end of the printing plate (5) to squeeze. During this process, the printing plate (5) squeezes the rubber cap (33), causing the air inside the rubber cap (33) to enter the T-shaped hole. A part of the air entering the T-shaped hole is used to squeeze out the adjustment column (34) to position the periphery of the pressure-sensitive chip (4), and a part of the air is used to deform the rubber diaphragm (35); Step V: Baking process to make the chips adhere to each other: After the overall placement is completed, heat and bake to make the printing plate (5), the pressure-sensitive chip (4) and the thermistor chip (2) adhere together stably. Finally, adjust the position of the locking plate (171) so that the locking plate (171) no longer positions the thermistor chip (2), remove the thermistor chip positioning mechanism (1), and then remove the pressure-sensitive chip position adjustment mechanism (3), completing the press-fitting process of the thermistor chip.

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