Compact radiator and electronic equipment

Abstract

The present invention relates to the field of radiators, and specifically to a compact radiator and electronic equipment, including the present embodiment, by designing a compact radiator, a heat-conducting component in the radiator is directly in contact with electronic components on a circuit board inside the electronic equipment, and is absorbed and carried away by the heat-conducting component through heat transfer, and then the temperature of the heat-conducting component itself gradually rises, and a transverse heat dissipation component cooperates with a longitudinal heat dissipation component to work together to dissipate the heat of the heat-conducting component, specifically, the transverse heat dissipation component dissipates the heat of the plate body, and the longitudinal heat dissipation component dissipates the heat of the heat column, and the transverse heat dissipation component and the longitudinal heat dissipation component operate without affecting each other, but play a role of superimposing the heat dissipation effects, and can perform heat dissipation and cooling treatment on the heat-conducting component in all aspects, so that the heat-conducting component can more efficiently absorb the heat generated by the operation of the electronic equipment.

Description

Technical Field

[0001] The invention relates to the field of radiators, in particular to a compact radiator and electronic equipment. Background Art

[0002] When electronic equipment is running, it will generate heat, and the heat needs to be dissipated in time, otherwise it will affect the operating stability of the electronic equipment; the heat generated by electronic equipment is generally generated by electronic components on circuit boards; there are generally two ways to dissipate the heat generated by electronic components: air convection and heat transfer by heat-absorbing conductors; some electronic components are only suitable for conductor heat transfer because these electronic components are in sheet form with a flat surface, poor convection effect with the outside air, and low heat dissipation efficiency.

[0003] Using some large radiators on electronic devices can achieve the effect of heat dissipation, but the size of the electronic device plus the size of the radiator makes the entire electronic device appear bulky and takes up space. At the same time, due to structural design reasons, the current radiators have limited heat transfer heat dissipation methods. After the heat-absorbing conductor absorbs heat, it dissipates heat through the fan, but the air convection caused by the fan is in a single direction and can only provide air convection heat dissipation in one direction for the heat-absorbing conductor. If air convection heat dissipation in multiple directions is set, the air convection will be bypassed and a large amount of heat will still remain inside the electronic device.

[0004] Therefore, in order to solve the above problems, a compact radiator and an electronic device are proposed. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows: a compact radiator described in the present invention comprises a heat dissipation unit, the heat dissipation unit comprises a heat conduction component, a transverse heat dissipation component and a longitudinal heat dissipation component;

[0007] The heat-conducting component includes a plate body with two end surfaces penetrating therethrough and a heat dissipation column arranged on the upper surface of the plate body; the lower surface of the plate body is attached to the heat-generating part of the electronic equipment, horizontal heat dissipation components are installed at both ends of the plate body, and longitudinal heat dissipation components are installed on the front and rear sides of the horizontal heat dissipation components; the horizontal heat dissipation component is used to dissipate heat and cool down the inside of the plate body; the longitudinal heat dissipation component is used to dissipate heat and cool down the heat dissipation column.

[0008] Preferably, a plurality of diamond-shaped heat absorbing blocks are arranged inside the plate body, and the tip edges of the heat absorbing blocks point to the horizontal heat dissipation component;

[0009] The horizontal heat dissipation component includes an air inlet hood and an air outlet hood; the air inlet hood and the air outlet hood are both arranged in a flared shape; a fan is installed at the air inlet position of the air inlet hood, and the air outlet of the air inlet hood is connected to one end of the plate body; the other end of the plate body is connected to the air inlet of the air outlet hood, and a fan is installed at the air outlet position of the air outlet hood.

[0010] Preferably, a plurality of heat dissipation columns are arranged on the upper surface of the plate body, and the heat dissipation columns are integrally arranged with the heat absorption block inside the plate body; the longitudinal heat dissipation component includes a fixed cover, and a plurality of fans are installed on the fixed cover.

[0011] Preferably, a cover plate is provided above the air inlet hood and the air outlet hood, and the two ends of the cover plate are U-shaped. A vertical connecting tube is fixed inside the U-shaped portion of the cover plate, and the connecting tube passes through the cover plate up and down; the lower surface of the cover plate is attached to the upper end surface of the heat dissipation column, and the two ends of the cover plate are fastened to the fixed cover on both sides by bolts.

[0012] Preferably, a plurality of heat sinks are disposed on the surface of each heat sink column, and a plurality of notches are also formed on the surface of each heat sink column, wherein the notches are located between two adjacent heat sinks above and below.

[0013] Preferably, each of the heat dissipation columns is arranged on the plate body in an inclined state.

[0014] Preferably, a water cooling assembly is provided between the heat dissipation columns in the same row; the water cooling assembly comprises a water pipe, the water pipe runs through the heat dissipation column, and the water pipe in the heat dissipation column is bent and laid inside the heat dissipation column.

[0015] Preferably, an air inlet side port is formed on the inner bottom surface of the air inlet hood, and a guide inclined plate is provided at the position of the air inlet side port; an air outlet side port is formed on the inner bottom surface of the air outlet hood, and a guide inclined plate is provided at the position of the air outlet side port.

[0016] Preferably, a T-shaped slide groove is provided on the upper surface of the fixed cover, a support rod is slidably connected in the slide groove, and a clamping ring provided at the end of the support rod clamps the water pipe.

[0017] An electronic device is suitable for the above-mentioned compact radiator. The electronic device includes a shell and a circuit board in the shell. The heating point on the circuit board is attached to the lower surface of the board. The port side wall of the shell is fixed to the lower corner position of the fixed cover by bolts.

[0018] The present invention is beneficial in that:

[0019] 1. In the present invention, a compact radiator is designed, in which a heat-conducting component is in direct contact with electronic components on a circuit board inside an electronic device, and is absorbed and carried away by the heat-conducting component through heat transfer, and then the temperature of the heat-conducting component itself gradually rises, and the transverse heat dissipation component cooperates with the longitudinal heat dissipation component to work together to dissipate the heat of the heat-conducting component. Specifically, the transverse heat dissipation component dissipates the heat of the plate body, and the longitudinal heat dissipation component dissipates the heat of the heat column, and the transverse heat dissipation component and the longitudinal heat dissipation component operate without affecting each other, but play a role of superimposing the heat dissipation effects, and can perform heat dissipation and cooling treatment on the heat-conducting component in all aspects, so that the heat-conducting component can more efficiently absorb the heat generated by the operation of the electronic equipment.

[0020] 2. The plate body contacts the hot spot on the electronic device to transfer heat, and then the plate body transfers the heat to the heat absorbing block and the heat dissipation column. The horizontal heat dissipation component and the vertical heat dissipation component jointly perform heat dissipation, and the heat dissipation is more efficient. At the same time, the horizontal heat dissipation component and the vertical heat dissipation component are modularly arranged and spliced ​​and fixed together. The structure is compact, and it can reduce the overall volume of the radiator and reduce the occupied space. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional diagram of the cooperation between the compact heat sink and the electronic device in the present invention;

[0022] Figure 2 It is a front view of the cooperation between the compact heat sink and the electronic device in the present invention;

[0023] Figure 3 It is a three-dimensional diagram of the coordination of the horizontal heat dissipation component and the vertical heat dissipation component in the present invention;

[0024] Figure 4 A three-dimensional diagram of the cooperation between the compact heat sink and the circuit board in the present invention;

[0025] Figure 5 is a three-dimensional diagram of a compact radiator in the present invention;

[0026] Figure 6 is a cross-sectional view of the plate body in the present invention;

[0027] Figure 7 is a cross-sectional view of the heat absorbing block in the present invention;

[0028] Figure 8 It is a three-dimensional diagram of the cooperation between the plate body and the horizontal heat dissipation component in the present invention;

[0029] Fig. 9 It is a three-dimensional diagram of the longitudinal heat dissipation component of the present invention;

[0030] Fig.10 It is a structural schematic diagram of the cover plate in the present invention;

[0031] Fig.11 It is a schematic diagram of the cooperation between the compact heat sink and the electronic device in the present invention;

[0032] Fig.12 A three-dimensional diagram of the cooperation between the heat dissipation column and the plate body in the present invention;

[0033] Fig.13 is a three-dimensional diagram of the water pipe in the present invention;

[0034] Fig.14 It is a three-dimensional diagram of the heat dissipation column in the present invention.

[0035] In the figure: 1. plate; 2. heat dissipation column; 3. heat absorption block; 4. air inlet cover; 5. air outlet cover; 6. fan; 7. fixed cover; 8. cover plate; 9. connecting pipe; 10. bolt; 11. heat sink; 12. notch; 13. water pipe; 14. air inlet side port; 15. guide inclined plate; 16. air outlet side port; 17. slide groove; 18. support rod; 19. shell; 20. circuit board. DETAILED DESCRIPTION

[0036] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0037] Reference Figure 1 - Fig.14 , a compact heat sink, comprising a heat dissipation unit, the heat dissipation unit comprising a heat conduction component, a transverse heat dissipation component and a longitudinal heat dissipation component;

[0038] The heat-conducting component comprises a plate body 1 with two end surfaces penetrating therethrough and a heat dissipation column 2 arranged on the upper surface of the plate body 1; the lower surface of the plate body 1 is attached to the heat-generating part of the electronic device, and horizontal heat dissipation components are installed at both ends of the plate body 1, and longitudinal heat dissipation components are installed on both the front and rear sides of the horizontal heat dissipation components; the horizontal heat dissipation components are used to dissipate heat and cool down the inside of the plate body 1; the longitudinal heat dissipation components are used to dissipate heat and cool down the heat dissipation columns 2;

[0039] In the present embodiment, a compact radiator is designed, in which a heat-conducting component is in direct contact with electronic components on a circuit board 20 inside the electronic device, and is absorbed and carried away by the heat-conducting component through heat transfer, and then the temperature of the heat-conducting component itself gradually rises, and the transverse heat dissipation component cooperates with the longitudinal heat dissipation component to work together to dissipate the heat of the heat-conducting component. Specifically, the transverse heat dissipation component dissipates the heat of the plate body 1, and the longitudinal heat dissipation component dissipates the heat of the heat column 2, and the transverse heat dissipation component and the longitudinal heat dissipation component operate without affecting each other, but play a role in superimposing the heat dissipation effects, and can perform heat dissipation and cooling treatment on the heat-conducting component in all aspects, so that the heat-conducting component can more efficiently absorb the heat generated by the operation of the electronic device.

[0040] Reference Figure 6 and Figure 7 A plurality of diamond-shaped heat absorbing blocks 3 are arranged inside the plate body 1, and the tip edges of the heat absorbing blocks 3 point to the horizontal heat dissipation component;

[0041] The horizontal heat dissipation assembly includes an air inlet cover 4 and an air outlet cover 5; the air inlet cover 4 and the air outlet cover 5 are both arranged in a flared shape; a fan 6 is installed at the air inlet position of the air inlet cover 4, and the air outlet of the air inlet cover 4 is connected to one end of the plate body 1; the other end of the plate body 1 is connected to the air inlet of the air outlet cover 5, and a fan 6 is installed at the air outlet position of the air outlet cover 5;

[0042] Reference Figure 2 , Fig.11 and Fig.12 , a plurality of heat dissipation columns 2 are arranged on the upper surface of the plate body 1, and the heat dissipation columns 2 are integrally arranged with the heat absorption block 3 inside the plate body 1; the longitudinal heat dissipation assembly includes a fixed cover 7, and a plurality of fans 6 are installed on the fixed cover 7;

[0043] The two ends of the plate body 1 are through-set, and a heat absorbing block 3 is also set. When the horizontal heat dissipation component is running, the fan 6 blows the external wind into the plate body 1 from the air inlet cover 4, takes away the heat inside the plate body 1, and discharges it from the air outlet cover 5. At this time, the heat on the heat absorbing block 3 and the plate body 1 is discharged, and then the heat absorbing block 3 and the plate body 1 can continue to exchange heat with the heat generated by the electronic equipment; the heat absorbed by the plate body 1 is transferred to the heat dissipation column 2, and the heat dissipation column 2 cooperates with the horizontal and vertical heat dissipation components to discharge the heat again. Specifically, the fan 6 on the fixed cover 7 blows the external wind into the heat dissipation column 2, and the wind takes away the heat from the surface of the heat dissipation column 2 and discharges the heat; the plate body 1 contacts the hot spot on the electronic device for heat transfer, and then the plate body 1 transfers the heat to the heat absorbing block 3 and the heat dissipation column 2. The horizontal heat dissipation component and the vertical heat dissipation component jointly perform heat dissipation, and the heat dissipation is more efficient. At the same time, the horizontal heat dissipation component and the vertical heat dissipation component are modularly arranged, spliced ​​and fixed together, with a compact structure, and can reduce the overall volume of the radiator and reduce the occupied space.

[0044] Reference Figure 1 - Figure 5 ,as well as Fig.10 and Fig.11, a cover plate 8 is provided above the air inlet cover 4 and the air outlet cover 5, and the two ends of the cover plate 8 are U-shaped. A connecting pipe 9 in a vertical state is fixedly connected in the U-shaped part of the cover plate 8, and the connecting pipe 9 passes through the cover plate 8 up and down; the lower surface of the cover plate 8 is attached to the upper end surface of the heat dissipation column 2, and the two ends of the cover plate 8 are fastened to the fixed cover 7 by bolts 10 on both sides; the cover plate 8 is provided, and the cover plate 8 can first cover a plurality of heat dissipation columns 2 to physically protect the heat dissipation columns 2 and prevent foreign matter from contacting the heat dissipation columns 2. At the same time, it cooperates with the fixed cover 7 to wrap the heat dissipation columns 2 to reduce the pollution of the heat dissipation columns 2 by the external environment. Moreover, the cover plate 8 is connected to the fixed cover 7 by bolts 10, which can be flexibly disassembled, which is convenient for cleaning the surface of the heat dissipation column 2 in the later stage; and the cooperation of the shapes at both ends of the cover plate 8 and the connecting pipe 9 plays a supporting and protecting role for the cover plate 8 itself, thereby ensuring the protection of the heat dissipation column 2 by the cover plate 8.

[0045] Reference Fig.12 and Fig.14 A plurality of heat sinks 11 are provided on the surface of each heat sink column 2, and a plurality of notches 12 are also provided on the surface of each heat sink column 2, wherein the notch 12 is located between two adjacent heat sinks 11 above and below; the arrangement of the heat sink 11 and the notch 12 increases the contact area between the heat sink column 2 and the flowing air, improves the heat dissipation efficiency of the heat sink column 2, thereby improving the heat dissipation efficiency of the board body 1, and then improves the operating stability of the electronic equipment.

[0046] Reference Fig.11 Each of the heat dissipation columns 2 is arranged on the plate body 1 in an inclined state; in order to reduce the volume of the radiator, the radiator is arranged in a flat shape, but this shape setting will affect the height of the heat dissipation column 2. The height of the heat dissipation column 2 is reduced, and the corresponding heat dissipation surface is reduced, which will also affect the heat dissipation effect. For this reason, the heat dissipation column 2 is arranged obliquely to ensure the length of the heat dissipation column 2 while taking into account the heat dissipation effect, and also taking into account the overall volume of the radiator.

[0047] Reference Figure 1 - Figure 5 ,as well as Figure 11-14, a water cooling component is provided between the heat dissipation columns 2 in the same row; the water cooling component includes a water pipe 13, the water pipe 13 runs through the heat dissipation column 2, and the water pipe 13 in the heat dissipation column 2 is bent and laid inside the heat dissipation column 2; a water cooling component is provided to cope with the high load state of the electronic equipment. When the electronic equipment is running at high load, more heat will be generated. It is difficult to dissipate heat by the horizontal heat dissipation component and the longitudinal heat dissipation component alone. For this reason, a water cooling component is provided, and the water cooling component includes not only the water pipe 13, but also a water pump. The water pump can be provided independently and is not spliced ​​with the compact radiator. The pump body and the water pipe 13 can be connected by a hose, so as to ensure that the volume of the radiator will not increase; the water pipe 13 is laid in the heat dissipation column 2, and cold water flows through the water pipe 13 to take away the heat, and dissipates the heat for the electronic equipment together with the horizontal heat dissipation component and the longitudinal heat dissipation component, so as to ensure that the electronic equipment can operate stably even under high load.

[0048] Reference Figure 6 An air inlet side port 14 is provided on the inner bottom surface of the air inlet cover 4, and a guide ramp 15 is provided at the position of the air inlet side port 14; an air outlet side port 16 is provided on the inner bottom surface of the air outlet cover 5, and a guide ramp 15 is provided at the position of the air outlet side port 16; the lower surface of the board body 1 is generally flat, but it can also be designed to be highly matched with the electronic components, that is, the lower surface of the board body 1 is uneven, so that the lower surface of the board body 1 can contact with more electronic components, and realize heat dissipation by contact heat transfer. Compared with air convection and radiation heat dissipation, this heat dissipation method has better heat dissipation effect, but some electronic components fail to contact with the lower surface of the board body 1. For this reason, a guide ramp 15 is provided, and the fan 6 at the position of the air inlet cover 4 blows part of the wind into the electronic equipment along the air inlet side port 14, and performs air cooling and heat dissipation on the electronic components on the circuit board 20 that fail to contact with the board body 1, and then extracts them from the position of the air outlet side port 16, so as to dissipate heat for the electronic equipment more comprehensively.

[0049] Reference Figure 1 and Figure 5 A T-shaped slide groove 17 is provided on the upper surface of the fixed cover 7, and a support rod 18 is slidably connected in the slide groove 17. A clamping ring arranged at the end of the support rod 18 clamps the water pipe 13; the support rod 18 is arranged to support and fix the water pipe 13 on the fixed cover 7, thereby improving the stability of the water pipe 13 exposed outside the radiator.

[0050] Reference Figure 1 - Figure 5, an electronic device, which is suitable for the above-mentioned compact radiator, and the electronic device includes a shell 19 and a circuit board 20 in the shell 19, and the heat point on the circuit board 20 is attached to the lower surface of the plate body 1; the port side wall of the shell 19 is fixed to the lower corner position of the fixed cover 7 by bolts 10; the shell 19 is fixed to the fixing seat by bolts 10, the fixing seat is fixed to the cover plate 8 by bolts 10, and the cover plate 8 is fixed to the air inlet cover 4 and the air outlet cover 5 by bolts 10, that is, the electronic device is fixed together with the compact radiator to improve the integrity, so that the electronic device and the compact radiator can operate more stably.

[0051] Working principle: In this embodiment, a compact heat sink is designed, in which the heat-conducting component in the heat sink is in direct contact with the electronic components on the circuit board 20 inside the electronic device, and is absorbed and carried away by the heat-conducting component through heat transfer, and then the temperature of the heat-conducting component itself gradually rises, and the horizontal heat-dissipating component cooperates with the vertical heat-dissipating component to work together to dissipate the heat of the heat-conducting component. Specifically, the horizontal heat-dissipating component dissipates the heat of the plate body 1, and the vertical heat-dissipating component dissipates the heat of the heat-dissipating column 2. The horizontal heat-dissipating component and the vertical heat-dissipating component operate without affecting each other, but play a role of superimposing the heat-dissipating effect, and can perform heat dissipation and cooling treatment on the heat-conducting component in all aspects, so that the heat-conducting component can more efficiently absorb the heat generated by the operation of the electronic device;

[0052] The two ends of the plate body 1 are through-set, and a heat absorbing block 3 is also set. When the horizontal heat dissipation component is running, the fan 6 blows the external wind from the air inlet cover 4 into the plate body 1, takes away the heat inside the plate body 1, and discharges it from the air outlet cover 5. At this time, the heat on the heat absorbing block 3 and the plate body 1 is discharged, and then the heat absorbing block 3 and the plate body 1 can continue to exchange heat with the heat generated by the electronic equipment; the heat absorbed by the plate body 1 is transferred to the heat dissipation column 2, and the heat dissipation column 2 cooperates with the horizontal and vertical heat dissipation components to discharge the heat again. Specifically, the fan 6 on the fixed cover 7 blows the external wind into the heat dissipation column 2, and the wind takes away the heat from the surface of the heat dissipation column 2 and discharges the heat; the plate body 1 contacts the hot spot on the electronic device for heat transfer, and then the plate body 1 transfers the heat to the heat absorbing block 3 and the heat dissipation column 2. The horizontal heat dissipation component and the vertical heat dissipation component jointly perform heat dissipation, and the heat dissipation is more efficient. At the same time, the horizontal heat dissipation component and the vertical heat dissipation component are modularly arranged, spliced ​​and fixed together, and the structure is compact, and the overall volume of the radiator can be reduced, and the occupied space can be reduced;

[0053] A cover plate 8 is provided. The cover plate 8 can firstly cover a plurality of heat dissipation columns 2 to provide physical protection for the heat dissipation columns 2, thereby preventing foreign matter from contacting the heat dissipation columns 2. At the same time, the cover plate 8 cooperates with the fixed cover 7 to wrap the heat dissipation columns 2, thereby reducing the pollution of the heat dissipation columns 2 by the external environment. Furthermore, the cover plate 8 is connected to the fixed cover 7 by bolts 10, and can be flexibly disassembled, which is convenient for cleaning the surface of the heat dissipation columns 2 at a later stage. The shapes of the two ends of the cover plate 8 cooperate with the connecting tube 9 to provide support and protection for the cover plate 8 itself, thereby ensuring the protection of the heat dissipation columns 2 by the cover plate 8.

[0054] The arrangement of the heat sink 11 and the notch 12 increases the contact area between the heat sink 2 and the flowing air, improves the heat dissipation efficiency of the heat sink 2, thereby improving the heat dissipation efficiency of the plate body 1, and then improves the operating stability of the electronic equipment; in order to reduce the volume of the radiator, the radiator is arranged in a flat shape, but this shape setting will affect the height of the heat sink 2. When the height of the heat sink 2 is reduced, the corresponding heat dissipation surface is reduced, which will also affect the heat dissipation effect. For this reason, the heat sink 2 is arranged obliquely to ensure the length of the heat sink 2 while taking into account the heat dissipation effect, and also taking into account the overall volume of the radiator;

[0055] A water cooling component is provided to cope with the high load state of the electronic equipment. When the electronic equipment is running at a high load, more heat will be generated. It is difficult to dissipate heat by the horizontal heat dissipation component and the vertical heat dissipation component alone. For this purpose, a water cooling component is provided, and the water cooling component includes not only a water pipe 13, but also a water pump. The water pump can be provided independently and is not spliced ​​with the compact radiator. The pump body and the water pipe 13 can be connected through a hose, so that the volume of the radiator will not increase. The water pipe 13 is laid in the heat dissipation column 2, and cold water flows through the water pipe 13 to take away the heat, and dissipates the heat of the electronic equipment together with the horizontal heat dissipation component and the vertical heat dissipation component, so as to ensure that the electronic equipment can run stably even in a high load state;

[0056] The lower surface of the board body 1 is generally flat, but it can also be designed to match the height of the electronic components, that is, the lower surface of the board body 1 is uneven, so that the lower surface of the board body 1 can contact with more electronic components, realizing heat dissipation by contact heat transfer. This heat dissipation method is better than air convection and radiation heat dissipation, but some electronic components fail to contact with the lower surface of the board body 1. For this reason, a guide inclined plate 15 is provided, and the fan 6 at the position of the air inlet cover 4 blows part of the wind into the electronic equipment along the air inlet side port 14, and performs air cooling on the electronic components on the circuit board 20 that fail to contact the board body 1, and then extracts them from the air outlet side port 16 to more comprehensively dissipate heat for the electronic equipment.

[0057] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A compact radiator, characterized in that: It includes a heat dissipation unit, which includes a heat conduction component, a horizontal heat dissipation component and a vertical heat dissipation component; The heat-conducting component comprises a plate body (1) with two end surfaces extending therethrough and a heat dissipation column (2) arranged on the upper surface of the plate body (1); the lower surface of the plate body (1) is attached to a heat-generating part of the electronic device, transverse heat dissipation components are installed at both ends of the plate body (1), and longitudinal heat dissipation components are installed on both the front and rear sides of the transverse heat dissipation components; the transverse heat dissipation components are used to dissipate heat and cool the inside of the plate body (1); the longitudinal heat dissipation components are used to dissipate heat and cool the heat dissipation columns (2); A plurality of diamond-shaped heat absorbing blocks (3) are arranged inside the plate body (1), and the tip edges of the heat absorbing blocks (3) point toward the lateral heat dissipation component; The transverse heat dissipation assembly comprises an air inlet cover (4) and an air outlet cover (5); the air inlet cover (4) and the air outlet cover (5) are both arranged in a flared shape; a first fan is installed at the air inlet position of the air inlet cover (4), and the air outlet of the air inlet cover (4) is connected to a port of the plate body (1); the other end of the plate body (1) is connected to the air inlet of the air outlet cover (5), and a second fan is installed at the air outlet position of the air outlet cover (5); A plurality of heat dissipation columns (2) are arranged on the upper surface of the plate body (1), and the heat dissipation columns (2) are integrally arranged with a heat absorption block (3) inside the plate body (1); the longitudinal heat dissipation assembly comprises a fixed cover (7), and a plurality of third fans are mounted on the fixed cover (7).

2. A compact radiator according to claim 1, characterized in that: A cover plate (8) is provided above the air inlet cover (4) and the air outlet cover (5), the two ends of the cover plate (8) being in a U shape, a connecting pipe (9) in a vertical state being fixedly connected inside the U-shaped portion of the cover plate (8), and the connecting pipe (9) passes through the cover plate (8) from top to bottom; the lower surface of the cover plate (8) is attached to the upper end surface of the heat dissipation column (2), and the two ends of the cover plate (8) are fastened to the fixed cover (7) by bolts (10) on both sides.

3. A compact radiator according to claim 2, characterized in that: The surface of each heat dissipation column (2) is provided with a plurality of heat dissipation fins (11), and the surface of each heat dissipation column (2) is also provided with a plurality of notches (12), wherein the notches (12) are located between two upper and lower adjacent heat dissipation fins (11).

4. A compact radiator according to claim 3, characterized in that: Each of the heat dissipation columns (2) is arranged on the plate body (1) in an inclined state.

5. A compact radiator according to claim 4, characterized in that: A water cooling assembly is provided between the heat dissipation columns (2) in the same row; the water cooling assembly comprises a water pipe (13), the water pipe (13) penetrates into the heat dissipation columns (2), and the water pipe (13) in the heat dissipation columns (2) is bent and laid inside the heat dissipation columns (2).

6. A compact radiator according to claim 2, characterized in that: The inner bottom surface of the air inlet cover (4) is provided with an air inlet side opening (14), and a first guide inclined plate is provided at the position of the air inlet side opening (14); the inner bottom surface of the air outlet cover (5) is provided with an air outlet side opening (16), and a second guide inclined plate is provided at the position of the air outlet side opening (16).

7. A compact radiator according to claim 2, characterized in that: The upper surface of the fixed cover (7) is provided with a T-shaped slide groove (17), a support rod (18) is slidably connected in the slide groove (17), and a clamping ring provided at the end of the support rod (18) clamps the water pipe (13).

8. An electronic device comprising any one of the compact heat sinks of claims 1 to 7, characterized in that: The electronic device comprises a housing (19) and a circuit board (20) in the housing (19); a heating point on the circuit board (20) is attached to the lower surface of the board body (1); and a port side wall of the housing (19) is fixedly connected to a lower corner position of a fixed cover (7) by means of bolts (10).

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