A high-precision punching and shaping die for chip production

Abstract

The present invention discloses a high-precision punching and shaping die for chip production, belonging to the technical field of chip production punching and shaping die. The present invention comprises a lower die base and an upper die base connected in a lifting manner, and the lower surface of the upper die base is elastically and telescopically connected to a buffer die, and a punching knife group is fixedly installed on the lower surface of the buffer die, and a roller is also rotatably installed on the lower surface of the buffer die. A conveying frame is fixedly installed on the lower die base, and a slide groove is symmetrically provided on the lower die base, and a positioning and collecting component for collecting waste is elastically and slidably installed on the inner side of the slide groove; a support seat is also fixedly installed on the upper surface of the lower die base, and an adsorption component is provided on the inner side of the support seat. The high-precision punching and shaping die for chip production can synchronously position the chip and the pin during the punching process, effectively ensuring the punching stability and processing accuracy, and can automatically collect the waste after the punching is completed.

Description

Technical Field

[0001] The invention relates to the technical field of chip production punching dies, in particular to a high-precision punching and shaping die for chip production. Background Art

[0002] A chip is a carrier that uses integrated circuit technology to make electronic components. It is usually composed of one or more semiconductor wafers. During the chip production process, the chip pins need to be punched and shaped to improve the stability of subsequent circuit connections.

[0003] Prior art (Chinese Patent Application No. 202321234987.4, filed May 19, 2023) discloses a chip punching device comprising a slide base. An L-shaped bracket is bolted to the upper rear end of the slide base, and an electric punching cylinder is bolted to the upper front end of the L-shaped bracket. The device is characterized in that an adjustable tool holder is bolted to the lower portion of the output rod of the electric punching cylinder, and punching tools are provided on the left and right sides of the lower portion of the adjustable tool holder. Chip positioning tables are placed on the left and right sides of the upper portion of the slide base, respectively, and compound threaded rods are provided at the front and rear ends of the chip positioning tables. The arrangement of the movable base, cylindrical receiving holes, threaded connection holes, and compound threaded rods facilitates the support and cutting of chips of various shapes and sizes. While the device can support and punch chips, it only positions the chip body during operation and cannot simultaneously position the pins. This results in limited punching stability and an inability to automatically and quickly collect the waste generated by punching, resulting in certain operational drawbacks. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-precision punching and shaping mold for chip production, so as to solve the problem raised in the above background technology that the high-precision punching and shaping mold for chip production on the current market is inconvenient to synchronously limit the chip and the pins, and it is inconvenient to automatically collect and clean the waste after the punching is completed.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-precision punching and shaping die for chip production, comprising a lower die base and an upper die base connected in a lifting manner, and the lower surface of the upper die base is elastically and telescopically connected to a buffer die, and a punching knife group is fixedly installed on the lower surface of the buffer die, and a roller is rotatably installed on the lower surface of the buffer die, a conveying frame is fixedly installed on the lower die base, and a punching seat is fixedly installed on the upper surface of the conveying frame, and a conveyor belt is installed on the conveying frame through a conveyor roller, and chips are conveyed on the conveyor belt at the same time, and slide grooves are symmetrically opened on the lower die base, and a positioning and collecting component for collecting waste is elastically and slidably installed on the inner side of the slide groove, and the position of the chip pins is corrected and fixed during the sliding process of the positioning and collecting component;

[0006] A support base is fixedly mounted on the upper surface of the lower die base, and an adsorption component is provided on the inner side of the support base, and the adsorption component realizes adsorption and positioning of the chip during the sliding process of the positioning and collecting component.

[0007] Preferably, a guide column is fixedly installed above the buffer die, and the guide column is telescopically connected to the upper die base, and a buffer spring is fixedly connected between the upper die base and the buffer die.

[0008] Preferably, the positioning and collecting assembly includes a slide seat slidably mounted on the inner side of the slide groove, and a first spring is fixedly connected between the slide seat and the inner wall of the slide groove, and an air cylinder is fixedly mounted on the outer side of the slide seat through a frame, and one end of the air cylinder is telescopically connected to a telescopic rod, and an end of the telescopic rod located on the inner side of the air cylinder is fixedly connected to a first sealing plug, and a second spring is connected between the first sealing plug and the inner wall of the air cylinder, and the one end of the telescopic rod located on the outer side of the air cylinder is fixedly connected to a fixed cylinder, and an inclined pressure plate is elastically connected to the fixed cylinder through a third spring, and the roller contacts and pushes the pressure plate during the downward movement, the elastic force of the third spring is greater than the elastic force of the first spring, and the elastic force of the third spring is less than the elastic force of the second spring, and the roller drives the slide to slide along the slide groove after pushing the pressure plate during the downward movement.

[0009] Preferably, the slide is a hollow structure, and positioning holes are evenly provided on the upper end of the slide, and the positioning holes are connected to the internal space of the slide. At the same time, a positioning airbag is embedded in the inner wall of the positioning hole, and the positioning airbag and the chip pin clearance are matched.

[0010] Preferably, an air storage bag is connected between the column at the lower part of the pressure plate and the fixed cylinder, and the air storage bag is connected to the positioning air bag through a pipeline, and when the pressure plate is moved downward for adjustment, part of the gas in the air storage bag is transported to the positioning air bag, and at the same time, the positioning air bag is inflated to seal and clamp the chip pins.

[0011] Preferably, the air cylinder is respectively connected to an exhaust pipe and an intake pipe, and both the exhaust pipe and the intake pipe are provided with a one-way valve structure, and the other end of the intake pipe is connected to the inner side of the slide, and at the same time, when the first sealing plug slides toward the slide, the intake pipe extracts the air inside the slide, and a material collection drawer is installed on the inner side of the slide, and the material collection drawer is located above the end of the intake pipe.

[0012] Preferably, the adsorption component includes an adjusting rod telescopically mounted on the outside of the support seat, and a second magnet is fixedly mounted on one end of the adjusting rod located on the outside of the support seat, and a first magnetic block is fixedly connected to the pressure plate through a bracket. At the same time, the pressure plate drives the first magnetic block to move downward and close to the second magnet during the downward adjustment process, and the magnetic poles of the relative surfaces of the first magnetic block and the second magnet are opposite. At the same time, the second magnet will drive the adjusting rod to perform telescopic adjustment under the action of magnetic attraction.

[0013] Preferably, one end of the adjusting rod located on the inner side of the support seat is fixedly connected to a pull rope, a suction cup is embedded in the inner side of the support seat, and the inner side of the suction cup is sealed with a second sealing plug, and the second sealing plug and the other end of the pull rope are fixedly connected, and a return spring is fixedly connected between the second sealing plug and the inner wall of the lower end of the suction cup, and the second sealing plug is pulled up and down by the pull rope when the adjusting rod is telescopically adjusted.

[0014] Preferably, the upper end of the suction cup is made of silicone material, and the upper end of the suction cup is flush with the upper end surface of the support seat, and the suction cup and the chip are sealed and fitted.

[0015] Compared with the existing technology, the present invention has the following advantages: the high-precision punching and shaping die for chip production can synchronously position the chip and pins during the punching process, effectively ensuring punching stability and processing accuracy, and can automatically collect waste after punching is completed. The specific contents are as follows;

[0016] 1. It is equipped with rollers, slides and positioning sockets. As the upper die and buffer die move downward, the rollers contact the push plate, thereby driving the slide to slide along the slide groove, so that the positioning sockets on the slide can be sleeved on the outside of the pins to achieve the initial positioning of the pins. As the positioning airbag expands, it can be clamped and fixed along with the pins. At the same time, the position of the chip can be corrected through the pins, thereby improving the subsequent punching accuracy.

[0017] 2. A slide, an air cylinder and an air suction pipe are provided. When the pressing plate cannot be moved downward, the telescopic rod can be used to drive the first sealing plug to slide and adjust on the inside of the air cylinder, so that the air cylinder can extract the air inside the slide through the air suction pipe. At this time, the inside of the slide maintains a negative pressure state, thereby further improving the positioning stability of the chip. When the pins are cut off, the disconnected waste will be sucked into the inside of the slide under the action of negative pressure, and then collected by the collection drawer, thereby realizing automatic collection of waste;

[0018] 3. A support seat and a suction cup are provided. As the pressure plate moves downward, the first magnetic block connected to the outside thereof will be close to the second magnet, so that the second magnet drives the adjustment rod to extend and retract under the action of magnetic force, so that the adjustment rod can pull the second sealing plug on the inside of the suction cup through the pull rope to adjust the height. At this time, the suction cup can automatically adsorb the chip, further improving the subsequent punching accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of the present invention when viewed from above;

[0021] Figure 3 It is a schematic diagram of the cross-sectional structure of the present invention;

[0022] Figure 4 This is a schematic diagram of the conveyor belt installation structure of the present invention;

[0023] Figure 5 For the present invention Figure 4 A in the middle is an enlarged structural diagram;

[0024] Figure 6 This is a schematic diagram of the slide installation structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the gas cylinder installation structure of the present invention;

[0026] Figure 8 This is a schematic cross-sectional structural diagram of the support base of the present invention;

[0027] Figure 9 This is a schematic diagram of the cross-sectional structure of the slide of the present invention.

[0028] In the figure: 1. Lower die base; 2. Upper die base; 3. Buffer die; 4. Guide column; 5. Buffer spring; 6. Punching knife group; 7. Roller; 8. Conveyor rack; 801, Punching seat; 9. Conveyor belt; 10. Slide; 11. Slide; 12. First spring; 13. Air cylinder; 1301, Exhaust pipe; 1302, Intake pipe; 14. Telescopic rod; 15. First sealing plug; 16. Second spring; 17. Fixed cylinder; 18. Press plate; 1801, Bracket; 1802, First magnetic block; 19. Third spring; 20. Air storage bag; 21. Positioning socket; 22. Positioning air bag; 23. Collecting drawer; 24. Support seat; 25. Suction cup; 26. Adjusting rod; 27. Second magnet; 28. Second sealing plug; 29. ​​Return spring; 30. Pull rope. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Example 1: Please refer to Figures 1-8As shown, the existing high-precision punching and shaping mold for chip production only performs a single positioning on the chip body during use, which makes it easy for position deviation to occur during the pin punching process and affects the processing accuracy. In order to solve this technical problem, this embodiment discloses the following technical content: a high-precision punching and shaping mold for chip production, comprising a lower mold base 1 and an upper mold base 2 connected by lifting, and the lower surface of the upper mold base 2 is elastically and telescopically connected to a buffer mold 3, and the lower surface of the buffer mold 3 is fixedly installed with a punching knife group 6, and the lower surface of the buffer mold 3 is also rotatably installed with a roller 7 through a frame, and the lower mold base 1 is fixedly installed with a There is a conveying rack 8, and a punching seat 801 is fixedly installed on the upper surface of the conveying rack 8, and a conveyor belt 9 is installed on the conveying rack 8 through a conveying roller, and chips are conveyed on the conveyor belt 9. The lower mold base 1 is symmetrically provided with a slide groove 10, and the inner side of the slide groove 10 is elastically slidably installed with a positioning and collecting component for collecting waste, and the chip pin position is corrected and fixed during the sliding process of the positioning and collecting component; the upper surface of the lower mold base 1 is also fixedly installed with a support seat 24, and the inner side of the support seat 24 is provided with an adsorption component, and the adsorption component realizes the adsorption and positioning of the chip during the sliding process of the positioning and collecting component.

[0031] A guide column 4 is fixedly installed above the buffer mold 3, and the guide column 4 is telescopically connected to the upper mold base 2, and a buffer spring 5 is fixedly connected between the upper mold base 2 and the buffer mold 3; the positioning and collecting assembly includes a slide 11 slidably installed on the inner side of the slide 10, and a first spring 12 is fixedly connected between the slide 11 and the inner wall of the slide 10, and an air cylinder 13 is fixedly installed on the outer side of the slide 11 through a frame, and one end of the air cylinder 13 is telescopically connected to a telescopic rod 14, and one end of the telescopic rod 14 located on the inner side of the air cylinder 13 is fixedly connected to a first sealing plug 15, At the same time, a second spring 16 is connected between the first sealing plug 15 and the inner wall of the gas cylinder 13, and the end of the telescopic rod 14 located outside the gas cylinder 13 is fixedly connected to the fixed cylinder 17, and the fixed cylinder 17 is elastically connected to an inclined pressure plate 18 through a third spring 19, and the roller 7 contacts and pushes the pressure plate 18 during the downward movement. The elastic force of the third spring 19 is greater than the elastic force of the first spring 12, and the elastic force of the third spring 19 is less than the elastic force of the second spring 16, and the roller 7 pushes the pressure plate 18 during the downward movement to drive the slide 11 to slide along the slide groove 10.

[0032] The slide 11 is a hollow structure, and positioning holes 21 are evenly provided on the upper end of the slide 11, and the positioning holes 21 are connected to the internal space of the slide 11. At the same time, a positioning airbag 22 is embedded in the inner wall of the positioning hole 21, and the positioning airbag 22 and the chip pin clearance are matched.

[0033] An air storage bag 20 is connected between the column at the lower part of the pressure plate 18 and the fixed cylinder 17, and the air storage bag 20 is connected to the positioning air bag 22 through a pipeline. When the pressure plate 18 moves downward for adjustment, part of the gas in the air storage bag 20 is transported to the positioning air bag 22, and at the same time, the positioning air bag 22 is inflated to seal and clamp the chip pins.

[0034] The adsorption component includes an adjusting rod 26 telescopically mounted on the outside of the support seat 24, and a second magnet 27 is fixedly mounted on one end of the adjusting rod 26 located on the outside of the support seat 24, and a first magnetic block 1802 is fixedly connected to the pressure plate 18 through a bracket 1801. At the same time, the pressure plate 18 drives the first magnetic block 1802 to move downward and close to the second magnet 27 during the downward adjustment process, and the magnetic poles of the opposing surfaces of the first magnetic block 1802 and the second magnet 27 are opposite. At the same time, the second magnet 27 will drive the adjusting rod 26 to perform telescopic adjustment under the action of magnetic attraction.

[0035] One end of the adjusting rod 26 located on the inner side of the support seat 24 is fixedly connected to a pull rope 30, and a suction cup 25 is embedded in the inner side of the support seat 24, and the inner side of the suction cup 25 is sealed with a second sealing plug 28. At the same time, the second sealing plug 28 and the other end of the pull rope 30 are fixedly connected, and a return spring 29 is fixedly connected between the second sealing plug 28 and the inner wall of the lower end of the suction cup 25. At the same time, when the adjusting rod 26 is telescopically adjusted, the second sealing plug 28 is pulled up and down by the pull rope 30; the upper end of the suction cup 25 is made of silicone material, and the upper end of the suction cup 25 is flush with the upper end surface of the support seat 24, and the suction cup 25 is sealed and fits with the chip.

[0036] By adopting the above technical solution, the chip is intermittently conveyed by the conveyor belt 9, so that the chip can be automatically transported to the top of the support seat 24, and during the chip conveying process, the conveying frame 8 can perform preliminary limit on the chip. When the chip moves to the top of the support seat 24, the upper mold seat 2 is controlled to drive the buffer mold 3 to move downward, so that the roller 7 under the buffer mold 3 first contacts the pressure plate 18. At this time, due to the elastic force difference between the first spring 12, the second spring 16 and the third spring 19, the pressure plate 18 can be forced to drive the slide 11 to slide along the slide groove 10, so that the positioning socket 21 on the slide 11 is sleeved on the outside of the chip pins, thereby achieving preliminary limit on the chip pins. When the slide 11 cannot move, the roller 7 continues to move downward. At this time, the roller 7 will push the pressure plate 18 and the fixed cylinder 17 to perform telescopic adjustment, thereby squeezing the air storage bag 20 inside the fixed cylinder 17, so that part of the gas in the air storage bag 20 enters the positioning air bag 22, causing the positioning air bag 22 to expand and deform. The inflated positioning airbag 22 can seal and clamp the pin part inside the positioning socket 21, thereby realizing the correction of the chip position, and then continue to move the roller 7 downward. At this time, the fixing cylinder 17 will drive the first sealing plug 15 to slide elastically on the inside of the air cylinder 13 through the telescopic rod 14. At this time, the air cylinder 13 can extract the air in the slide 11 through the suction pipe 1302, so that the inside of the slide 11 maintains a negative pressure state, thereby further improving the fixing effect of the pin. At the same time, during the downward movement of the pressing plate 18, the bracket 1801 on its outer side will drive the first magnetic block 1802 to gradually approach the second magnet 27, so that the second magnet 27 drives the adjusting rod 26 to telescopically adjust on the support seat 24 under the action of magnetic force. At the same time, the adjusting rod 26 will drive the second sealing plug 28 to move down on the inside of the suction cup 25 through the pull rope 30. At this time, the suction cup 25 can synchronously adsorb and fix the chip above the support seat 24, thereby realizing automatic correction and positioning of the pins and chips, and ensuring the subsequent punching progress.

[0037] Example 2: The technical content disclosed in this embodiment is a further improvement based on the above-mentioned Example 1. The existing high-precision punching and shaping molds for chip production are not convenient for automatically collecting waste after punching. In order to further solve this technical problem, this embodiment discloses the following technical content, such as Figure 7 and Figure 9 As shown; the air cylinder 13 is respectively connected to the exhaust pipe 1301 and the intake pipe 1302, and both the exhaust pipe 1301 and the intake pipe 1302 are provided with a one-way valve structure, and the other end of the intake pipe 1302 is connected to the inner side of the slide 11. At the same time, when the first sealing plug 15 slides toward the slide 11, the intake pipe 1302 extracts the air inside the slide 11, and a material collection drawer 23 is installed on the inner side of the slide 11, and the material collection drawer 23 is located above the end of the intake pipe 1302.

[0038] By adopting the above technical solution, when the buffer mold 3 is controlled to move downward, the punching knife group 6 can cooperate with the punching seat 801 to automatically cut off the excess part of the stitches. As the stitches are cut, the waste part cut off at this time will move under the negative pressure inside the slide 11 and enter the inner side of the slide 11. At this time, the collection drawer 23 can automatically collect the sucked waste, realizing automatic collection of waste, and preventing waste from falling into the mold working area and affecting the subsequent punching accuracy.

[0039] The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0040] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-precision punching and shaping die for chip production, comprising a lower die base (1) and an upper die base (2) connected in a lifting manner, wherein the lower surface of the upper die base (2) is elastically and telescopically connected to a buffer die (3), and a punching knife group (6) is fixedly installed on the lower surface of the buffer die (3), characterized in that: The lower surface of the buffer mold (3) is also rotatably mounted with a roller (7) through a frame body, a conveying frame (8) is fixedly mounted on the lower mold base (1), and a punching seat (801) is fixedly mounted on the upper surface of the conveying frame (8), and a conveyor belt (9) is mounted on the conveying frame (8) through a conveying roller, and chips are transported on the conveyor belt (9), and a slidable groove (10) is symmetrically provided on the lower mold base (1), and a positioning and collecting component for collecting waste is elastically slidably mounted on the inner side of the slidable groove (10), and the position of the chip pins is corrected and fixed during the sliding process of the positioning and collecting component; A support seat (24) is fixedly mounted on the upper surface of the lower die seat (1), and an adsorption component is provided on the inner side of the support seat (24), and the adsorption component realizes adsorption and positioning of the chip during the sliding process of the positioning and collecting component; The positioning and collecting assembly comprises a slide seat (11) slidably mounted on the inner side of the slide groove (10), and a first spring (12) is fixedly connected between the slide seat (11) and the inner wall of the slide groove (10), and a gas cylinder (13) is fixedly mounted on the outer side of the slide seat (11) through a frame, and one end of the gas cylinder (13) is telescopically connected to a telescopic rod (14), and one end of the telescopic rod (14) located on the inner side of the gas cylinder (13) is fixedly connected to a first sealing plug (15), and a second spring (16) is connected between the first sealing plug (15) and the inner wall of the gas cylinder (13). The telescopic rod (14) is located at one end outside the gas delivery cylinder (13) and is fixedly connected to a fixed cylinder (17), and the fixed cylinder (17) is elastically connected to an inclined pressure plate (18) via a third spring (19), and the roller (7) contacts and pushes the pressure plate (18) during the downward movement, the elastic force of the third spring (19) is greater than the elastic force of the first spring (12), and the elastic force of the third spring (19) is less than the elastic force of the second spring (16), and the roller (7) pushes the pressure plate (18) during the downward movement to drive the slide (11) to slide along the slide groove (10); The gas cylinder (13) is connected to an exhaust pipe (1301) and an intake pipe (1302), respectively, and both the exhaust pipe (1301) and the intake pipe (1302) are provided with a one-way valve structure, and the other end of the intake pipe (1302) is connected to the inner side of the slide (11), and when the first sealing plug (15) slides toward the slide (11), the intake pipe (1302) extracts air from the inner side of the slide (11), and a material collection drawer (23) is installed on the inner side of the slide (11), and the material collection drawer (23) is located above the end of the intake pipe (1302); The adsorption component includes an adjustment rod (26) telescopically mounted on the outside of the support seat (24), and a second magnet (27) is fixedly mounted on one end of the adjustment rod (26) located on the outside of the support seat (24), and a first magnetic block (1802) is fixedly connected to the pressure plate (18) through a bracket (1801), and when the pressure plate (18) moves downward and adjusts, the first magnetic block (1802) is driven to move downward and close to the second magnet (27), and the magnetic poles of the opposing surfaces of the first magnetic block (1802) and the second magnet (27) are opposite, and the second magnet (27) drives the adjustment rod (26) to be telescopically adjusted under the action of magnetic attraction; One end of the adjusting rod (26) located on the inner side of the support seat (24) is fixedly connected to a pull rope (30), a suction cup (25) is embedded and installed on the inner side of the support seat (24), and the inner side of the suction cup (25) is sealed with a second sealing plug (28), and the second sealing plug (28) and the other end of the pull rope (30) are fixedly connected, and a return spring (29) is fixedly connected between the second sealing plug (28) and the inner wall of the lower end of the suction cup (25), and when the adjusting rod (26) is telescopically adjusted, the second sealing plug (28) is pulled up and down by the pull rope (30); The upper end of the suction cup (25) is made of silicone material, and the upper end of the suction cup (25) is flush with the upper end surface of the support seat (24), and the suction cup (25) and the chip are sealed and fitted.

2. The high-precision punching and shaping die for chip production according to claim 1, characterized in that: A guide column (4) is fixedly mounted above the buffer die (3), and the guide column (4) and the upper die seat (2) are telescopically connected, and a buffer spring (5) is fixedly connected between the upper die seat (2) and the buffer die (3).

3. The high-precision punching and shaping die for chip production according to claim 1, characterized in that: The slide (11) is a hollow structure, and the upper end of the slide (11) is evenly provided with positioning holes (21), and the positioning holes (21) are connected to the internal space of the slide (11), and the inner wall of the positioning hole (21) is embedded with a positioning airbag (22), and the positioning airbag (22) and the pin clearance of the chip are matched.

4. The high-precision punching and shaping die for chip production according to claim 3, characterized in that: An air storage bag (20) is connected between the column at the lower part of the pressure plate (18) and the fixed cylinder (17), and the air storage bag (20) is connected to the positioning air bag (22) through a pipeline. When the pressure plate (18) is adjusted downward, part of the gas in the air storage bag (20) is transported to the positioning air bag (22), and at the same time, the positioning air bag (22) is expanded to seal and clamp the chip pins.

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