Thermal management loop

Abstract

A heat management circuit is provided with: a storage battery circuit (low-temperature circuit) (equipment arrangement circuit) through which a heat medium that exchanges heat with a storage battery (eAxel) (equipment to be temperature-adjusted) flows; a refrigeration cycle device connected to a cooler and a water-cooled condenser; a heat exchange device that exchanges heat between outside air and the heat medium; and a switching device. The heat exchange device comprises an LT radiator (a first heat exchanger), an HT radiator (a second heat exchanger) and a supercooling condenser (a third heat exchanger) which are arranged separately from one another. The connection states between the LT radiator, the HT radiator, and the supercooling condenser and the storage battery circuit (low temperature circuit) and the refrigeration cycle device are switched by a switching device.

Description

Technical Field

[0001] The present disclosure relates to thermal management loops. Background Art

[0002] Japanese Patent Application Laid-Open No. 2020-185880 discloses a cooling water circuit, which includes a first heat exchanger and a second heat exchanger for performing heat exchange between external air and cooling water. The cooling water circuit is configured to be able to switch between a circuit state in which the first heat exchanger and the second heat exchanger are connected in series and a circuit state in which the first heat exchanger and the second heat exchanger are connected in parallel. The heat exchange efficiency of the heat medium (cooling water) is adjusted by switching the connection state between the first heat exchanger and the second heat exchanger.

[0003] In the cooling water circuit of Japanese Patent Application Laid-Open No. 2020-185880, as described above, the heat exchange efficiency of the heat medium is adjusted by switching the connection state between the first heat exchanger and the second heat exchanger. In view of this, it is desired to be able to more easily adjust the heat exchange efficiency of the heat medium. Summary of the invention

[0004] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a heat management circuit capable of easily adjusting the heat exchange efficiency of a heat medium.

[0005] A thermal management circuit of one embodiment of the present disclosure is a thermal management circuit installed in an electrical device, and comprises: an equipment configuration circuit for circulating a heat medium for heat exchange with a temperature control target device, the temperature control target device being a device to be temperature controlled; a refrigeration cycle device connected to a cooler and a water-cooled condenser; a heat exchange device for heat exchange between external air and the heat medium; and a switching device capable of switching the flow path of the heat medium. The heat exchange device includes a first heat exchanger, a second heat exchanger, and a third heat exchanger that are separately arranged. The connection state of each of the first heat exchanger, the second heat exchanger, and the third heat exchanger with the equipment configuration circuit and the refrigeration cycle device is switched by the switching device.

[0006] In a heat management circuit of an embodiment of the present disclosure, as described above, the connection states of each of the first heat exchanger, the second heat exchanger, and the third heat exchanger with the equipment configuration circuit and the refrigeration cycle device are switched by a switching device. Thus, by providing three heat exchangers in the heat exchange device, the combination of heat exchangers used in heat exchange can be varied compared to the case where there are two heat exchangers. As a result, the adjustment based on the heat exchange efficiency of the heat exchange device can be facilitated. Thus, the temperature adjustment of the temperature-adjusting target equipment in the equipment configuration circuit can be facilitated, and the refrigeration cycle device can easily meet the air conditioning requirements.

[0007] In the thermal management circuit of the above-mentioned scheme, it is preferred that the third heat exchanger is connected to the refrigeration cycle device. The water-cooled condenser includes a condensation portion that changes the heat medium from a gas phase to a liquid phase. In the third heat exchanger, the heat medium that has changed into a liquid phase in the condensation portion is heat-exchanged with the outside air. With such a configuration, the third heat exchanger can easily exchange heat between the outside air and the refrigerant of the refrigeration cycle device.

[0008] In the thermal management circuit of the above-mentioned scheme, it is preferred that the water-cooled condenser includes: a condensation section that changes the heat medium from the gas phase to the liquid phase; and a supercooling section that cools the heat medium that has changed into the liquid phase in the condensation section. The condensation section and the supercooling section are connected to the switching device through a first flow path and a second flow path, respectively. The first flow path and the second flow path respectively have: a first direction flow path, in which the heat medium flows toward the switching device; and a second direction flow path, in which the heat medium flows in a direction opposite to the direction in which the heat medium flows in the first direction flow path. If so configured, heat exchange of the heat medium can be performed independently of each other in a closed circuit through the condensation section and the first flow path and a closed circuit through the supercooling section and the second flow path. As a result, the heat exchange efficiency of the heat medium can be adjusted more easily.

[0009] In the thermal management circuit of the above-mentioned scheme, it is preferred that the water-cooled condenser includes: a condensation section that changes the heat medium from the gas phase to the liquid phase; and a supercooling section that cools the heat medium that has changed into the liquid phase in the condensation section. The condensation section and the supercooling section are connected to the switching device through a third flow path and a fourth flow path, respectively. The third flow path is composed of a third directional flow path for the heat medium to flow from the condensation section to the switching device. The fourth flow path is composed of a fourth directional flow path for the heat medium to flow from the switching device to the supercooling section. If so constituted, the structure of the thermal management circuit can be simplified compared to the case where the third flow path and the fourth flow path are respectively composed of a plurality of flow paths.

[0010] In the heat management circuit of the above-mentioned embodiment, it is preferred that the first heat exchanger and the third heat exchanger are respectively arranged on the upstream side of the second heat exchanger in the flow direction of the outside air flowing into the heat exchange device. With such a configuration, the outside air passes through the first heat exchanger and the third heat exchanger before passing through the second heat exchanger, so that the temperature of the outside air passing through the first heat exchanger and the third heat exchanger can be relatively low. As a result, the heat release amount of the heat medium in the first heat exchanger and the third heat exchanger can be increased.

[0011] According to the present disclosure, the heat exchange efficiency of the heat medium can be easily adjusted by using the first to third heat exchangers. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Features, advantages, technical and industrial significance of embodiments of the present invention are described below with reference to the accompanying drawings, wherein like reference numerals denote like elements.

[0013] Figure 1 It is a diagram showing the structure of the heat management system according to the first embodiment.

[0014] Figure 2 1 is a diagram showing a circuit model 1A of the heat management circuit according to the first embodiment.

[0015] Figure 3 1 is a diagram showing a circuit model 1B of the heat management circuit according to the first embodiment.

[0016] Figure 4 1 is a diagram showing a circuit model 1C of the heat management circuit according to the first embodiment.

[0017] Figure 5 1 is a diagram showing a circuit model 1D of the heat management circuit according to the first embodiment.

[0018] Figure 6 1 is a diagram showing a circuit model 1E of the heat management circuit according to the first embodiment.

[0019] Figure 7 1 is a diagram showing the correspondence between various temperature conditions and circuit modes in the heat management circuit according to the first embodiment.

[0020] Figure 8 It is a diagram showing the structure of a heat management system according to a second embodiment.

[0021] Fig. 9 1 is a diagram showing a circuit model 2A of the heat management circuit according to the second embodiment.

[0022] Fig.10 1 is a diagram showing a circuit model 2B of the heat management circuit according to the second embodiment.

[0023] Fig.11 1 is a diagram showing a circuit model 2C of the heat management circuit according to the second embodiment.

[0024] Fig.12 1 is a diagram showing a circuit model 2D of the heat management circuit according to the second embodiment.

[0025] Fig.13 1 is a diagram showing a circuit model 2E of the heat management circuit according to the second embodiment.

[0026] Fig.14 1 is a diagram showing the correspondence between various temperature conditions and circuit modes in the heat management circuit according to the second embodiment.

[0027] Fig.15It is a diagram showing the structure of a heat management system according to a third embodiment.

[0028] Fig.16 3A is a diagram showing a circuit model of a heat management circuit according to the third embodiment.

[0029] Fig.17 3B is a diagram showing a circuit model of the heat management circuit according to the third embodiment.

[0030] Fig.18 3C is a diagram showing a circuit model of the heat management circuit according to the third embodiment.

[0031] Fig.19 FIG. 3 is a diagram showing a circuit model 3D of a heat management circuit according to the third embodiment.

[0032] Fig. 20 3E is a diagram showing a circuit model of the heat management circuit according to the third embodiment.

[0033] Fig.21 1 is a diagram showing the correspondence between various temperature conditions and circuit modes in the heat management circuit according to the third embodiment. DETAILED DESCRIPTION

[0034] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the same or corresponding parts in the drawings are denoted by the same reference numerals and their description will not be repeated.

[0035] First embodiment

[0036] Figure 1 1 is a diagram showing the overall structure of a thermal management system 1 including a thermal management circuit 10 according to a first embodiment. The thermal management system 1 includes the thermal management circuit 10, an electronic control unit (ECU) 80, and a human machine interface (HMI: Human Machine Interface) 90. The thermal management system 1 is mounted on, for example, an electrified vehicle 1a (see Figure 2 ). It should be noted that the electric vehicle 1a is an example of the “electrical device” of the present disclosure.

[0037] The thermal management circuit 10 includes a battery circuit 100, a low temperature circuit 200, a heat exchange device 300, a refrigeration cycle device 400, a switching device 500, a heater core 600, and a water pump 700. It should be noted that in this specification, the heat medium flowing in the refrigeration cycle device 400 is referred to as "refrigerant", and the heat medium flowing in other circuits is referred to as "coolant". It should be noted that the refrigerant and the coolant are each an example of the "heat medium" of the present disclosure.

[0038] The battery circuit 100 connects the cooler 410 described later to the switching device 500. The battery circuit 100 includes a battery 110 and a water pump 120. The battery 110 is a device that is an object of temperature adjustment (e.g., cooling). In the battery circuit 100, a coolant that performs heat exchange with the battery 110 circulates. The battery 110 stores electric power used in the driving of the electric vehicle 1a, etc. The water pump 120 is arranged on the downstream side of the battery 110 and the upstream side of the cooler 410 in the flow direction of the coolant flowing in the battery circuit 100. It should be noted that the battery 110 and the battery circuit 100 are examples of "temperature adjustment object device" and "device configuration circuit" respectively disclosed in the present invention.

[0039] The low-temperature circuit 200 includes an eAxle (battery) 210 and a water pump 220. In the low-temperature circuit 200, a coolant that performs heat exchange with the eAxle 210 circulates. The eAxle 210 includes a power control unit (PCU: Power Control Unit) and an oil cooler, etc., which are not shown in the figure. The eAxle 210 is a device that is an object of temperature adjustment (for example, cooling). The water pump 220 is arranged on the upstream side of the eAxle 210 in the flow direction of the coolant circulating in the low-temperature circuit 200. It should be noted that the eAxle 210 and the low-temperature circuit 200 are examples of "temperature adjustment object equipment" and "equipment configuration circuit" in the present disclosure, respectively.

[0040] The heat exchange device 300 includes a low temperature (LT: Low Temperature) radiator 310, a high temperature (HT: High Temperature) radiator 320, and a supercooling condenser 330. The LT radiator 310, the HT radiator 320, and the supercooling condenser 330 are separately (independently) arranged. In the LT radiator 310 and the HT radiator 320, heat exchange is performed between the outside air and the cooling water, respectively. In the supercooling condenser 330, heat exchange is performed between the outside air and the refrigerant of the refrigeration cycle device 400. The refrigerant of the refrigeration cycle device 400 directly exchanges heat with the outside air, so it is cooled more efficiently. The supercooling condenser 330 is connected to the refrigeration cycle device 400. It should be noted that the LT radiator 310 and the HT radiator 320 are examples of the "first heat exchanger" and the "second heat exchanger" of the present disclosure, respectively. In addition, the supercooling condenser 330 is an example of the "third heat exchanger" of the present disclosure.

[0041] The refrigeration cycle device 400 includes a cooler 410 , an evaporator 420 , a compressor 430 , a water-cooled condenser 440 , an expansion valve 450 , an expansion valve 460 , a three-way valve 470 , and a three-way valve 480 .

[0042] The three-way valve 470 and the three-way valve 480 are connected by the flow path 475. The three-way valve 470 and the three-way valve 480 are configured to switch the refrigerant from the water-cooled condenser 440 to flow to the subcooling condenser 330 or not to flow to the subcooling condenser 330 by flowing to the flow path 475.

[0043] The cooler 410 is connected to each of the refrigeration cycle device 400 and the battery circuit 100 . Thus, the refrigerant flowing through the refrigeration cycle device 400 and the coolant flowing through the battery circuit 100 perform heat exchange in the cooler 410 .

[0044] The refrigerant (gas-phase refrigerant or liquid-phase refrigerant) circulating in the refrigeration cycle device 400 flows in one or both of the first path of compressor 430-water-cooled condenser 440-subcooling condenser 330 (or flow path 475)-expansion valve 460-evaporator 420-compressor 430 and the second path of compressor 430-water-cooled condenser 440-subcooling condenser 330 (or flow path 475)-expansion valve 450-cooler 410-compressor 430.

[0045] The water-cooled condenser 440 includes a condensing section 441 and a liquid storage section 442. The condensing section 441 condenses the high-temperature and high-pressure gas refrigerant pumped from the compressor 430 and converts it into a liquid refrigerant. In addition, the condensing section 441 performs heat exchange between the cooling liquid from the switching device 500 and the liquid refrigerant. The liquid storage section 442 performs gas-liquid separation of the liquid-phase refrigerant that has passed through the condensing section 441. The subcooling condenser 330 performs heat exchange between the liquid-phase refrigerant that has passed through the liquid storage section 442 and the outside air.

[0046] The switching device 500 is configured to be able to switch the flow path of the heat medium (coolant). The switching device 500 has ports P1 to P16. Port P1 is an outlet port for the coolant to flow out to the LT radiator 310. Port P2 is an inlet port for the coolant from the LT radiator 310 to flow in. There is no flow path connected to each of the ports P3 and P4. Port P5 is an outlet port for the coolant to flow out to the HT radiator 320. Port P6 is an inlet port for the coolant from the HT radiator 320 to flow in. Port P7 is an outlet port for the coolant to flow out to the heater core 600. Port P8 is an inlet port for the coolant from the heater core 600 to flow in.

[0047] Port P9 is an outlet port for the coolant to flow out to the water pump 220 (eAxle210). Port P10 is an inlet port for the coolant from the eAxle210 to flow in. Port P11 is an outlet port for the coolant to flow out to the battery 110. Port P12 is an inlet port for the coolant from the cooler 410 flowing in the battery circuit 100 to flow in. Port P13 is an inlet port for the coolant from the water pump 700 provided between the condensing section 441 and the switching device 500 to flow in. Port P14 is an outlet port for the coolant to flow out to the condensing section 441. Ports P13 and P14 are connected to the condensing section 441 through the flow path 710 and the flow path 720, respectively. The coolant flowing out of the condensing section 441 passes through the flow path 710 and flows into the switching device 500 from the port P13. The coolant flowing out of the port P14 passes through the flow path 720 and flows into the condensing section 441. The cooling liquid flowing into the condensing section 441 exchanges heat with the refrigerant of the refrigeration cycle device 400 in the condensing section 441, and then flows out to the water pump 700. There is no flow path connected to each port of the port P15 and the port P16. It should be noted that the flow path 710 and the flow path 720 are examples of the "first flow path" of the present disclosure, respectively. In addition, the flow path 710 and the flow path 720 are examples of the "first direction flow path" and the "second direction flow path" of the present disclosure, respectively.

[0048] ECU 80 controls the thermal management circuit 10. ECU 80 includes a processor (PRC) 81, a memory (MEM) 82, a storage (STR) 83, and an interface (I / F) 84. ECU 80 controls the states of the switching device 500, the three-way valve 470, and the three-way valve 480, and adjusts the flow rate of each water pump.

[0049] Here, in the conventional heat management circuit, it is desired to be able to more easily adjust the heat exchange efficiency of the heat medium (coolant, refrigerant).

[0050] Therefore, in the thermal management circuit 10 of the first embodiment, the connection states between the LT radiator 310, the HT radiator 320, and the subcooling condenser 330 and the battery circuit 100, the low temperature circuit 200, and the refrigeration cycle device 400 are switched by the switching device 500. Specifically, the thermal management circuit 10 can adopt the following Figure 2~Figure 6 Loop mode shown.

[0051] Figure 2 1A is a diagram showing a circuit mode 1A of the heat management circuit 10. Figure 2 In the example shown, the eAxle 210 is connected to the LT radiator 310 via the switching device 500. Furthermore, the condenser 441 is connected to the HT radiator 320 via the switching device 500. Furthermore, by making the ports P11 and P12 (see Figure 1 ) is in a closed state, and the coolant does not flow in the cooler 410. In addition, by making the ports P7 and P8 (see Figure 1 ) is in a closed state, and the coolant does not flow in the heater core 600. In addition, the three-way valve 470 and the three-way valve 480 are respectively controlled in such a way that the refrigerant of the refrigeration cycle device 400 flows in the subcooling condenser 330. It should be noted that in the circuit mode 1A, the HT radiator 320 and the LT radiator 310 are separated.

[0052] And, if Figure 2 As shown, the LT radiator 310 and the supercooling condenser 330 are respectively arranged at the upstream side of the HT radiator 320 in the flow direction of the outside air flowing into the heat exchange device 300. Specifically, the outside air flows into the vehicle from the grille 1b provided at the front end of the electric vehicle 1a. Therefore, the LT radiator 310 and the supercooling condenser 330 are respectively arranged at the front side of the HT radiator 320 in the front-rear direction of the electric vehicle 1a. In addition, at least a part of each of the LT radiator 310 and the supercooling condenser 330 may be arranged at a position that does not overlap with the HT radiator 320 when viewed from the front of the electric vehicle 1a. Thus, it is possible to suppress the outside air that has passed through the LT radiator 310 and the supercooling condenser 330 and become warm from passing through the HT radiator 320.

[0053] Figure 3 1B is a diagram showing a circuit pattern 1B of the heat management circuit 10. Figure 3 In the example shown, the eAxle 210 and the condenser 441 are connected to the LT radiator 310 and the HT radiator 320 respectively via the switching device 500. Figure 2 The three-way valve 470 and the three-way valve 480 are respectively controlled so that the refrigerant of the refrigeration cycle device 400 flows in the subcooling condenser 330. It should be noted that in the circuit mode 1B, the HT radiator 320 and the LT radiator 310 are combined.

[0054] Figure 4 1C is a diagram showing a circuit model of the heat management circuit 10. Figure 4 In the example shown, the eAxle 210 and the cooler 410 are connected to the LT radiator 310 and the HT radiator 320 respectively via the switching device 500. The condensing unit 441 is connected to the heater core 600 via the switching device 500. The three-way valve 470 and the three-way valve 480 are respectively controlled in such a manner that the refrigerant of the refrigeration cycle device 400 does not flow in the subcooling condenser 330 but flows in the flow path 475. It should be noted that in the circuit mode 1C, the HT radiator 320 and the LT radiator 310 are combined.

[0055] Figure 5 1D is a diagram showing a circuit pattern 1D of the thermal management circuit 10. Figure 5 In the example shown, the cooler 410 is connected to the LT radiator 310 and the HT radiator 320 via the switching device 500. In addition, the condensing unit 441 is connected to the heater core 600 via the switching device 500. In addition, the switching device 500 is controlled in a manner that the eAxle210 (low-temperature circuit 200) is separated from other circuits and is independent. The three-way valve 470 and the three-way valve 480 are respectively controlled in a manner that the refrigerant of the refrigeration cycle device 400 does not flow in the supercooling condenser 330 but flows in the flow path 475. It should be noted that in the circuit mode 1D, the HT radiator 320 and the LT radiator 310 are combined.

[0056] Figure 6 1 is a diagram showing a circuit model 1E of the heat management circuit 10. Figure 6 In the example shown, the cooler 410 is connected to the HT radiator 320 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The condensing unit 441 is connected to the heater core 600 via the switching device 500. The three-way valve 470 and the three-way valve 480 are respectively controlled in such a manner that the refrigerant of the refrigeration cycle device 400 does not flow in the supercooling condenser 330 but flows in the flow path 475. It should be noted that in the circuit mode 1E, the HT radiator 320 and the LT radiator 310 are separated.

[0057] Figure 7 1A is a diagram showing the circuit modes of the thermal management circuit 10 corresponding to a plurality of temperature conditions. For example, in summer, the circuit mode is switched based on the cooling requirement of the eAxle 210 and the heat release requirement of the refrigerant (the cooling requirement of the battery 110). When the cooling requirement of the eAxle 210 is high and the heat release requirement of the refrigerant is high, the thermal management circuit 10 is switched to the circuit mode 1A (see FIG. 1A ). Figure 2 When the cooling requirement of the eAxle 210 is low and the heat release requirement of the refrigerant is high, the thermal management circuit 10 is switched to circuit mode 1B (refer to Figure 3). When the cooling requirement of eAxle210 is high and the heat release requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit mode 1A. When the cooling requirement of eAxle210 is low and the heat release requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit mode 1A. It should be noted that the situation where the cooling requirement of eAxle210 is high may be, for example, a situation where the temperature of the coolant circulating in the low-temperature circuit 200 is above a predetermined value or a situation where the temperature of the eAxle210 is above a predetermined value. In addition, the situation where the heat release requirement of the refrigerant is high may be, for example, a situation where the temperature of the coolant circulating in the battery circuit 100 is above a predetermined value or a situation where the temperature of the battery 110 is above a predetermined value.

[0058] Furthermore, in winter, the circuit mode is switched based on the cooling requirement of the eAxle 210 and the heat absorption requirement of the refrigerant. For example, when the cooling of the eAxle 210 is required (for example, the preheating of the eAxle 210 has been completed) and the heat absorption requirement of the refrigerant is high, the thermal management circuit 10 is switched to the circuit mode 1C (refer to Figure 4 When the eAxle 210 is relatively cold (ie, no cooling requirement) and the refrigerant has a high heat absorption requirement, the thermal management circuit 10 is switched to circuit mode 1D (refer to Figure 5 When cooling of the eAxle 210 is required and the heat absorption requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit mode 1E (refer to Figure 6 ). When eAxle210 is cold and the heat absorption requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit mode 1D. It should be noted that the cooling requirement of eAxle210 may be, for example, the preheating of eAxle210 is completed as described above or the temperature of eAxle210 (coolant of the low temperature circuit 200) is above a predetermined value. In addition, the heat absorption requirement of the refrigerant is high when the output of the heat pump heating is required to be above a predetermined value.

[0059] As described above, in the first embodiment, the connection states of the LT radiator 310, the HT radiator 320, and the supercooling condenser 330 with the battery circuit 100, the low temperature circuit 200, and the refrigeration cycle device 400 are switched by the switching device 500. As a result, the heat exchange of the heat medium (cooling water, refrigerant) using the LT radiator 310, the HT radiator 320, and the supercooling condenser 330 can be performed according to the temperature conditions required by the battery circuit 100, the low temperature circuit 200, and the refrigeration cycle device 400. As a result, the heat exchange amount (efficiency) of the heat medium can be easily adjusted. As a result, the cooling performance of the battery 110, the eAxel 210, etc. can be improved, and the driving performance of the electric vehicle 1a and the charging performance of the battery 110 can be improved. In addition, the heat absorption performance (heat pump heating performance) can be improved, and the cruising distance of the electric vehicle 1a can be increased.

[0060] Furthermore, the LT radiator 310 and the subcooling condenser 330 are respectively arranged on the upstream side of the HT radiator 320 in the flow direction of the external air flowing into the heat exchange device 300. Here, a relatively low upper limit temperature value (for example, 65° C.) is set for the cooling water of the low temperature circuit 200 that performs heat exchange with the eAxle 210. Therefore, by arranging the LT radiator 310 that mainly cools the eAxle 210 on the upstream side in the flow direction of the external air, it is possible to suppress the external air with a temperature above the above-mentioned lower limit temperature value from flowing in the LT radiator 310. As a result, the temperature of the external air flowing in the LT radiator 310 becomes relatively low, and the air-water temperature difference in the LT radiator 310 can be made larger. Therefore, the same cooling performance can be achieved with a smaller heat exchange area, so the LT radiator 310 can be miniaturized. As a result, the subcooling condenser 330 can be arranged in the space formed by miniaturizing the LT radiator 310.

[0061] Second embodiment

[0062] Next, refer to Figure 8~Figure 14 A second embodiment of the present disclosure will be described. In the second embodiment, a water-cooled condenser 440A is provided with a supercooling unit 443. The same reference numerals as those in the first embodiment are used for the same structures as those in the first embodiment, and the description thereof will not be repeated.

[0063] Figure 8 1 is a diagram showing the overall structure of a heat management system 2 including a heat management circuit 20 according to a second embodiment. The heat management circuit 20 is different from the heat management circuit 10 according to the first embodiment in that a refrigeration cycle device 400 is replaced with a refrigeration cycle device 400A and a heat exchange device 300A is replaced with a heat exchange device 300.

[0064] The refrigeration cycle device 400A is different from the refrigeration cycle device 400 of the first embodiment in that the water-cooled condenser 440 is replaced with the water-cooled condenser 440A. The water-cooled condenser 440A includes a condensing section 441, a liquid storage section 442, and a supercooling section 443. The condensing section 441, the liquid storage section 442, and the supercooling section 443 are connected in series with each other in the refrigeration cycle device 400A (on the flow path of the refrigerant flowing in the refrigeration cycle device 400A). The refrigerant of the refrigeration cycle device 400A flows in the order of the condensing section 441, the liquid storage section 442, and the supercooling section 443. The supercooling section 443 cools the refrigerant that has changed into a liquid phase in the condensing section 441 by heat exchange with the coolant circulating in the supercooling section 443. The refrigerant flowing to the supercooling section 443 flows toward the expansion valves 450 and 460.

[0065] The heat exchange device 300A is different from the heat exchange device 300 of the first embodiment in that the HT sub-radiator 340 is included instead of the sub-cooling condenser 330. The configuration position of the HT sub-radiator 340 is the same as the configuration position of the sub-cooling condenser 330. The heat management circuit 30 has excellent heat absorption performance by providing three radiators. It should be noted that the HT sub-radiator 340 is an example of the "third heat exchanger" of the present disclosure.

[0066] Port P15 of the switching device 500 is an inlet port for the coolant from the supercooling section 443 to flow in. Port P15 and the supercooling section 443 are connected by a flow path 730. Port P16 of the switching device 500 is an outlet port for the coolant to flow out to the supercooling section 443. Port P16 and the supercooling section 443 are connected by a flow path 740. Flow paths 730 and 740 are examples of the “second flow path” of the present disclosure, respectively. Flow paths 730 and 740 are examples of the “first direction flow path” and “second direction flow path” of the present disclosure, respectively.

[0067] The port P3 of the switching device 500 is an outlet port for allowing the coolant to flow out to the HT sub-radiator 340. The port P4 of the switching device 500 is an inlet port for allowing the coolant from the HT sub-radiator 340 to flow in.

[0068] Fig. 9 2A is a diagram showing a circuit pattern 2A of the thermal management circuit 20. Fig. 9 In the example shown, the eAxle 210 is connected to the LT radiator 310 via the switching device 500. The condensing unit 441 is connected to the HT radiator 320 via the switching device 500. The overcooling unit 443 is connected to the HT sub-radiator 340 via the switching device 500. By making the ports P11 and P12 (see Figure 8) is in a closed state, and the coolant does not flow in the cooler 410. By making the ports P7 and P8 (refer to Figure 8 ) is in a closed state, and the coolant does not flow in the heater core 600. It should be noted that in the circuit mode 2A, the HT radiator 320, the LT radiator 310 and the HT sub-radiator 340 are separated.

[0069] Fig.10 2B is a diagram showing a circuit pattern 2B of the thermal management circuit 20. Fig.10 In the example shown, the eAxle 210 and the condenser 441 are connected to the LT radiator 310 and the HT radiator 320 respectively via the switching device 500. The overcooling unit 443 is connected to the HT sub-radiator 340 via the switching device 500. Fig. 9 It should be noted that, in loop mode 2B, the HT radiator 320 and the LT radiator 310 are combined.

[0070] Fig.11 2C is a diagram showing a circuit pattern of the thermal management circuit 20. Fig.11 In the example shown, the eAxle 210 and the cooler 410 are respectively connected to the LT radiator 310, the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. The condensing unit 441 and the supercooling unit 443 are respectively connected to the heater core 600 via the switching device 500. It should be noted that in the loop mode 2C, the HT radiator 320, the LT radiator 310 and the HT sub-radiator 340 are combined.

[0071] Fig.12 2D is a diagram showing a circuit model 2D of the thermal management circuit 20. Fig.12 In the example shown, the cooler 410 is connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via the switching device 500. The condensing unit 441 and the supercooling unit 443 are respectively connected to the heater core 600 via the switching device 500. The switching device 500 is controlled in a manner that the eAxle 210 (low temperature circuit 200) is separated from other circuits and is independent. It should be noted that in the circuit mode 2D, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are combined.

[0072] Fig.13 2E is a diagram showing a circuit pattern of the heat management circuit 20. Fig.13In the example shown, the cooler 410 is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The condensing unit 441 and the supercooling unit 443 are respectively connected to the heater core 600 via the switching device 500. It should be noted that in the loop mode 2E, the HT radiator 320 and the HT sub-radiator 340 are combined.

[0073] Fig.14 2A is a diagram showing the circuit modes of the heat management circuit 20 corresponding to a plurality of temperature conditions. For example, in summer, when the cooling requirement of the eAxle 210 is high and the heat release requirement of the refrigerant is high, the heat management circuit 20 is switched to the circuit mode 2A (see FIG. Fig. 9 When the cooling requirement of the eAxle 210 is low and the heat release requirement of the refrigerant is high, the thermal management circuit 20 is switched to circuit mode 2B (refer to Fig.10 ). When the cooling requirement of the eAxle 210 is high and the heat release requirement of the refrigerant is low, the thermal management circuit 20 is switched to circuit mode 2A. When the cooling requirement of the eAxle 210 is low and the heat release requirement of the refrigerant is low, the thermal management circuit 20 is switched to circuit mode 2A.

[0074] Furthermore, in winter, when the eAxle 210 is required to cool and the refrigerant heat absorption requirement is high, the thermal management circuit 20 is switched to the circuit mode 2C (see Fig.11 When the eAxle 210 is cold and the refrigerant has a high heat absorption requirement, the thermal management circuit 20 is switched to circuit mode 2D (refer to Fig.12 When cooling of the eAxle 210 is required and the heat absorption requirement of the refrigerant is low, the thermal management circuit 20 is switched to circuit mode 2E (refer to Fig.13 ). When the eAxle 210 is relatively cold and the heat absorption requirement of the refrigerant is relatively low, the thermal management circuit 20 is switched to circuit mode 2D.

[0075] It should be noted that other structures and effects are the same as those of the first embodiment, and thus their description will not be repeated.

[0076] Third embodiment

[0077] Next, refer to Figure 15~Figure 21 The third embodiment of the present disclosure is described. In the third embodiment, the structure of the flow path between the water-cooled condenser 440A and the switching device 500 is different from that of the second embodiment. The same reference numerals as those of the second embodiment are used for the same structures as those of the second embodiment and the description is not repeated.

[0078] Fig.15 3 is a diagram showing the overall structure of a thermal management system 3 including a thermal management circuit 30 according to the third embodiment. The thermal management circuit 30 does not have a flow path 720 and a flow path 730 (both refer to Figure 8 ) is different from the thermal management circuit 20 of the above-mentioned second embodiment. That is, in the third embodiment, the condensing section 441 and the switching device 500 are connected only by the flow path 710. In other words, the flow path connecting the condensing section 441 and the switching device 500 is composed only of the flow path 710. The supercooling section 443 and the switching device 500 are connected only by the flow path 740. In other words, the flow path connecting the supercooling section 443 and the switching device 500 is composed only of the flow path 740. In this case, the flow path 710 is an example of the "third flow path" and the "third directional flow path" of the present disclosure. Furthermore, the flow path 740 is an example of the "fourth flow path" and the "fourth directional flow path" of the present disclosure.

[0079] Fig.16 3A is a diagram showing a circuit model of the heat management circuit 30. Fig.16 In the example shown, the eAxle 210 is connected to the LT radiator 310 via the switching device 500. The water-cooled condenser 440A is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. Fig.15 ) is in a closed state, and the coolant does not flow in the cooler 410. In addition, by making the ports P7 and P8 (see Fig.15 ) is in a closed state, and the coolant does not flow in the heater core 600. It should be noted that in the circuit mode 3A, the HT radiator 320 and the HT sub-radiator 340 are combined.

[0080] Fig.17 3B is a diagram showing a circuit model of the heat management circuit 30. Fig.17 In the example shown, the eAxle 210 and the water-cooled condenser 440A are connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via the switching device 500, respectively. Fig.16 It should be noted that, in the loop mode 3B, the HT radiator 320, the LT radiator 310 and the HT auxiliary radiator 340 are combined.

[0081] Fig.18 3C is a diagram showing a circuit pattern of the heat management circuit 30. Fig.18In the example shown, the eAxle 210 and the cooler 410 are connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340, respectively, via the switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. It should be noted that in the loop mode 3C, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are combined.

[0082] Fig.19 3D is a diagram showing a circuit model 3D of the thermal management circuit 30. Fig.19 In the example shown, the cooler 410 is connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via the switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. The switching device 500 is controlled in such a way that the eAxle 210 (low temperature circuit 200) is separated from other circuits and is independent. It should be noted that in the circuit mode 3D, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are combined.

[0083] Fig. 20 3E is a diagram showing a circuit pattern of the heat management circuit 30. Fig. 20 In the example shown, the cooler 410 is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. It should be noted that in the loop mode 2E, the HT radiator 320 and the HT sub-radiator 340 are combined.

[0084] Fig.21 3A is a diagram showing the circuit modes of the heat management circuit 30 corresponding to a plurality of temperature conditions. For example, in summer, when the cooling requirement of the eAxle 210 is high and the heat release requirement of the refrigerant is high, the heat management circuit 30 is switched to the circuit mode 3A (see Fig.16 When the cooling requirement of the eAxle 210 is low and the heat release requirement of the refrigerant is high, the thermal management circuit 30 is switched to circuit mode 3B (refer to Fig.17 ). When the cooling requirement of the eAxle 210 is high and the heat release requirement of the refrigerant is low, the thermal management circuit 30 is switched to the circuit mode 3A. When the cooling requirement of the eAxle 210 is low and the heat release requirement of the refrigerant is low, the thermal management circuit 30 is switched to the circuit mode 3A.

[0085] Furthermore, in winter, when cooling of the eAxle 210 is required and the heat absorption requirement of the refrigerant is high, the thermal management circuit 30 is switched to the circuit mode 3C (see Fig.18 When the eAxle 210 is cold and the refrigerant has a high heat absorption requirement, the thermal management circuit 30 is switched to circuit mode 3D (refer to Fig.19 When cooling of the eAxle 210 is required and the heat absorption requirement of the refrigerant is low, the thermal management circuit 30 is switched to circuit mode 3E (refer to Fig. 20 ). When the eAxle 210 is relatively cold and the heat absorption requirement of the refrigerant is relatively low, the thermal management circuit 30 is switched to circuit mode 3D.

[0086] It should be noted that other structures and effects are the same as those of the first and second embodiments described above, and thus, a repeated description will not be given.

[0087] In the first to third embodiments, the thermal management circuit is mounted on an electric vehicle, but the present disclosure is not limited thereto. The thermal management circuit may be mounted on an electric device other than an electric vehicle (eg, a stationary power storage device).

[0088] In the above embodiment, an example is shown in which the HT radiator 320 and the supercooling condenser 330 (HT sub-radiator 340) are arranged in front of the LT radiator 310 in the front-rear direction of the electric vehicle 1a (the upstream side of the wind). However, the present disclosure is not limited to this. The positional relationship between the HT radiator 320 and the supercooling condenser 330 (HT sub-radiator 340) and the LT radiator 310 is not limited to the example of the above embodiment. For example, the HT radiator 320 and the supercooling condenser 330 (HT sub-radiator 340) and the LT radiator 310 may also be arranged in a row in the left-right direction (a direction intersecting the wind flow direction).

[0089] The embodiments disclosed herein are to be understood as examples in all respects and not to be restrictive. The scope of the present disclosure is indicated by the claims rather than the description of the embodiments described above, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Claims

1. A thermal management circuit, mounted on an electrical device, wherein: The thermal management circuit has: The equipment is provided with a circuit for circulating a heat medium for heat exchange with a temperature control target equipment, wherein the temperature control target equipment is equipment to be temperature controlled; A refrigeration cycle device connected to the cooler and the water-cooled condenser; A heat exchange device for performing heat exchange between external air and heat medium; and A switching device capable of switching the flow path of the heat medium. The heat exchange device comprises a first heat exchanger, a second heat exchanger and a third heat exchanger which are arranged separately from each other. The connection state of each of the first heat exchanger, the second heat exchanger, and the third heat exchanger with the equipment configuration circuit and the refrigeration cycle device is switched by the switching device.

2. The thermal management circuit according to claim 1, wherein: The third heat exchanger is connected to the refrigeration cycle device, The water-cooled condenser includes a condensing part that changes the heat medium from a gas phase to a liquid phase. In the third heat exchanger, the heat medium changed into a liquid phase in the condensation portion exchanges heat with the outside air.

3. The thermal management circuit according to claim 1, wherein: The water-cooled condenser includes: a condensing part, which changes the heat medium from a gas phase to a liquid phase; and a supercooling part, which cools the heat medium that has changed into a liquid phase in the condensing part. The condensing part and the supercooling part are connected to the switching device through a first flow path and a second flow path respectively. The first flow path and the second flow path each include: a first direction flow path through which the heat medium flows toward the switching device; and a second direction flow path through which the heat medium flows in a direction opposite to a flow direction of the heat medium in the first direction flow path.

4. The thermal management circuit according to claim 1, wherein: The water-cooled condenser includes: a condensing part, which changes the heat medium from a gas phase to a liquid phase; and a supercooling part, which cools the heat medium that has changed into a liquid phase in the condensing part. The condensing part and the supercooling part are connected to the switching device through a third flow path and a fourth flow path, respectively. The third flow path is a third directional flow path through which the heat supply medium flows from the condensation unit to the switching device. The fourth flow path is formed by a fourth directional flow path through which the heat supply medium flows from the switching device to the supercooling unit.

5. The thermal management circuit according to any one of claims 1 to 4, wherein: The first heat exchanger and the third heat exchanger are respectively arranged on an upstream side of the second heat exchanger in a flow direction of outside air flowing into the heat exchange device.

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