A production process for traceability labels in high-temperature reflow soldering

Abstract

The invention discloses a production process of a traceability label for high-temperature reflow soldering, comprising S1, selecting a substrate: cutting or making a high-temperature resistant ceramic embryo; S2, first sintering: sintering the high-temperature resistant ceramic embryo at a high temperature of 800°C-1200°C; S3, printing: spraying or printing a barcode or a two-dimensional code on the high-temperature resistant ceramic embryo; S4, second sintering: sintering the high-temperature resistant ceramic embryo printed with the barcode or the two-dimensional code at a high temperature of 800°C-1200°C; S5, glazing: coating a layer of glaze on the surface of the high-temperature resistant ceramic embryo after the first sintering; S6, third sintering: sintering the glazed high-temperature resistant ceramic embryo at a high temperature of 800°C-1200°C; S7, cooling the finished product after being taken out of the furnace.

Description

Technical field:

[0001] The invention relates to the technical field of high-temperature reflow soldering, and in particular to a production process for a traceability label in high-temperature reflow soldering. Background technology:

[0002] Labels are important carriers of information transmission. Their main function is to identify and record the information of items. They play an indispensable role in production and life. From simple product logos to QR codes and barcodes that carry complex data, labels not only visualize product information, but also provide precise management tools for production and logistics. Through labels, consumers can quickly obtain product attributes, while producers can track the flow of materials and finished products more efficiently.

[0003] Labels in the traditional sense are mostly used for product identification and promotion. For example, paper or plastic labels are widely used in the food, clothing and retail industries. These labels carry information such as brand, specifications, production date, etc., helping consumers better understand the products. However, with the rapid development of industrialization, the functionality and durability of traditional labels are insufficient in complex production environments. Industrial production has put forward higher requirements for labels. Labels need to be able to adapt to harsh conditions such as high temperature, corrosive chemicals, strong mechanical friction, etc., and gradually develop into multifunctional and professional tools.

[0004] In industrial production, labels are no longer just information identifiers, but have become a key link in production management and information traceability. For example, in an automated production line, labels record and track material flow information through barcodes or QR codes. This information, combined with the Manufacturing Execution System (MES), can achieve real-time monitoring and data collection in the production process, greatly improving production efficiency and quality control capabilities. Especially in the electronics manufacturing industry, chemical industry, and logistics, the reliability of labels is directly related to the stability of the production process and the compliance of products.

[0005] Among them, high-temperature reflow soldering is one of the core processes in the field of electronic manufacturing, and it places extremely high performance requirements on labels. During the reflow soldering process, circuit boards and electronic components need to undergo high-temperature soldering processes exceeding 200°C or even 300°C. Ordinary paper or plastic labels cannot adapt to such an environment. They will deform, burn or even fall off at high temperatures, resulting in information loss. The loss of information will directly destroy the production traceability chain and affect process optimization and product quality control. Therefore, during the high-temperature reflow soldering process, the labels that enter the furnace with the products and fixtures need to meet special requirements such as high temperature resistance and corrosion resistance. These labels must be able to withstand multiple high-temperature cycles without falling off or failing, so as to ensure that the production process information, such as welding temperature, can be traced back when problems occur in subsequent products. Therefore, this type of label not only needs to record the fixture number, number of uses and maintenance records, but also must have the characteristics of long-term high temperature resistance, wear resistance and strong adhesion to ensure that the fixture is managed in an orderly manner throughout the production process. The reliability of the fixture label directly affects the stability and production efficiency of the process, and is an important part of ensuring the smooth progress of reflow soldering. Through these tags, the factory can accurately record the temperature curve and time parameters of each product during high-temperature welding, providing key data for quality traceability and process optimization. In addition, when quality problems occur, the tags can also help quickly locate the problem link and significantly reduce economic losses.

[0006] At present, the commonly used high-temperature resistant labels on the market are usually printed with high-temperature resistant ink on a metal substrate. Although the labels produced in this way can have a certain degree of high-temperature resistance, they have poor corrosion resistance and a short service life. After several high-temperature coolings, the barcode and QR code on the label will gradually dim and disappear, which is difficult to meet the requirements of long-term recording of production information. Therefore, when using this traditional high-temperature resistant label for high-temperature reflow soldering and other high-temperature environments, the label needs to be replaced frequently, which not only affects production efficiency, but also easily causes data loss.

[0007] In view of this, the inventor proposes the following technical solution. Summary of the invention:

[0008] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a production process for a traceability label in high-temperature reflow soldering.

[0009] In order to solve the above technical problems, the present invention adopts the following technical solution: a production process for traceability labels in high-temperature reflow soldering, comprising:

[0010] S1, select substrate: cut or make high temperature resistant ceramic embryo;

[0011] S2, first sintering: sintering the high temperature resistant ceramic embryo at 800℃-1200℃;

[0012] S3, printing: spraying or printing a barcode or a QR code on the high temperature resistant ceramic embryo;

[0013] S4, second sintering: sintering the high temperature resistant ceramic blank printed with the barcode or QR code at a high temperature of 800°C-1200°C;

[0014] S5, glazing: applying a layer of glaze on the surface of the high temperature resistant ceramic embryo after the primary sintering;

[0015] S6, the third sintering: sintering the glazed high temperature resistant ceramic embryo at a high temperature of 800°C-1200°C;

[0016] S7, the finished product is taken out of the oven and cooled.

[0017] Furthermore, in the above technical scheme, the steps of making high-temperature resistant ceramic embryos include a selecting powder raw materials, b mixing powder raw materials, c placing the powder raw materials in a mold cavity, and d cold pressing and forming, wherein the powder raw materials are mixed and stirred, and then placed on a rotating mold turntable, and the powder raw materials are flattened into the mold cavity during the rotation of the rotating mold, and the powder raw materials are extruded and formed when the mold cavity rotates to the stamping station, and finally the formed high-temperature resistant ceramic embryos are discharged onto the transfer mesh when the mold cavity rotates to the discharge port.

[0018] Furthermore, in the above technical solution, after the high temperature resistant ceramic embryo is placed on the mesh plate, it is transferred to a high temperature sintering furnace and fired at a temperature of 800° C.-1200° C. for 15 min-30 min.

[0019] Furthermore, in the above technical solution, the barcode or QR code is printed on the high temperature resistant ceramic embryo using high temperature ink, and the specific components of the high temperature ink include 10-20% high temperature resistant pigment content, 15-25% glass powder content, 10-15% high temperature silicone resin content, 10-15% cyclohexanone content, and 0.5-1% leveling agent content.

[0020] Furthermore, in the above technical solution, the high temperature ink is printed on the surface of the high temperature resistant ceramic embryo by pad printing, and then the high temperature resistant ceramic embryo is transferred to a high temperature furnace, sintered at 900℃-1100℃ for 15min-30min, and cooled for 8h.

[0021] Furthermore, in the above technical solution, the glaze composition includes 50-60% calcium borate glass powder, 20-30% feldspar, 10-20% quartz, and 1-3% zinc oxide.

[0022] Furthermore, in the above technical solution, the glaze is sprayed on the high-temperature resistant ceramic embryo and printed on one side of the barcode or QR code, and then the high-temperature resistant ceramic embryo is transferred to a high-temperature furnace, sintered at 950℃-1100°C for 30-60min, and cooled for 8-12h.

[0023] After adopting the above technical scheme, the present invention has the following beneficial effects compared with the prior art: in the present invention, high temperature resistant ceramics are used as substrates, and the high temperature resistant ceramic embryo is first sintered at a temperature above 1200°C to make the high temperature resistant ceramic plate maintain stable structural performance, and then a barcode or a two-dimensional code presented by high temperature ink is printed on the high temperature resistant ceramic plate, and the high temperature resistant ceramic plate is subjected to a second high temperature sintering, and the ink molecules and the ceramic molecules move, penetrate and combine with each other at high temperature, so that the barcode or the two-dimensional code is completely and firmly combined with the ceramic surface, and finally a layer of glaze is sprayed on the high temperature resistant ceramic plate, and the high temperature resistant ceramic plate is subjected to three high temperature sinterings, so that the glaze is completely attached to the high temperature resistant ceramic plate, and the high temperature ink is completely wrapped for protection, so that the barcode or the two-dimensional code on the high temperature resistant ceramic plate can meet the requirements of high temperature resistance, strong acid and alkali resistance, corrosion resistance, wear resistance, etc., and the label performance is stable during the high temperature reflow soldering process, and the barcode or the two-dimensional code can still be clear and complete in a high temperature environment for a long time, and information can still be stored and read. Description of the drawings:

[0024] Figure 1 It is a structural schematic diagram of the present invention. Specific implementation method:

[0025] The present invention is further described below in conjunction with specific embodiments and drawings.

[0026] See Figure 1 As shown, it is a structural schematic diagram. The label in the present invention has a three-layer structure. The first layer is a high-temperature resistant ceramic plate 1. The high-temperature resistant ceramic plate 1 is formed by mixing ceramic powders of multiple components, cold isostatic pressing, and then transferring to a high-temperature furnace for sintering at 800°C-1200°C to fuse the ceramic powder into a high-temperature resistant ceramic plate 1. Then, a layer of high-temperature ink 2 is sprayed on the high-temperature resistant ceramic plate 1. The high-temperature ink 2 is usually a barcode or a two-dimensional code for storing data. Of course, it can also be other shapes, patterns, or digital symbols. Then, the high-temperature resistant ceramic plate 1 sprayed with a barcode or a two-dimensional code is transferred to a high-temperature furnace for sintering at 800°C-1200°C to fuse and penetrate the high-temperature resistant ceramic plate 1 to ensure the structural stability of the high-temperature ink on the high-temperature resistant ceramic plate 1. Finally, a layer of glaze 3 is sprayed on the high-temperature ink 2, and transferred to a high-temperature furnace for sintering at 800°C-1200°C to make the glaze completely adhere to the high-temperature ink and the high-temperature resistant ceramic plate. The glaze 3 layer can protect the high-temperature ink 2 from damage and improve the service life.

[0027] Specifically, the production of labels includes the following steps:

[0028] S1. Select substrate: There are currently two ways. The first is to purchase a large-size high-temperature resistant ceramic motherboard that meets the requirements, and divide the motherboard into several standard-sized high-temperature resistant ceramic plates by wire cutting, laser cutting, etc., and cut two ear holes on the high-temperature resistant ceramic plate; the second is to mix high-temperature resistant ceramic powders, and form a high-temperature resistant ceramic embryo by isostatic pressing, and then transfer the high-temperature resistant ceramic embryo to a high-temperature furnace for sintering at 800℃-1200℃ to obtain a high-temperature ceramic plate.

[0029] Among them, the steps of making high-temperature resistant ceramic embryos include a selecting powder raw materials, b mixing powder raw materials, c placing the powder raw materials in a mold cavity, and d cold pressing and forming. Among them, the powder raw materials are mixed and stirred, and then put onto a rotating mold turntable. During the rotation of the rotating mold, the powder raw materials are flattened into the mold cavity. When the mold cavity rotates to the stamping station, the powder raw materials are extruded and formed. Finally, when the mold cavity rotates to the discharge port, the formed high-temperature resistant ceramic embryo is discharged onto a transfer mesh plate, and then the high-temperature resistant ceramic embryo is transferred to a high-temperature sintering furnace and fired at a temperature of 800℃-1200℃ for 15min-30min.

[0030] The main components of the powder raw materials are kaolin (40-50%), feldspar (25-30%), quartz (20-25%), and additive components stabilizer: alumina (3-5%) to improve high temperature resistance. Binder: PVA (0.5-1%) to enhance the strength of the green body. Lubricant: stearic acid (0.3-0.5%). The sintering temperature is 800℃-1350℃, the sintering time is 15min-2h, and the sintering time is selected according to the different green body thickness. The cooling time is 12h-24h, and the cooling rate is 3℃ / h. Specifically, the following materials can be used: kaolin 50%, feldspar 25%, quartz 25%, sintering temperature 1250℃-1350℃, sintering time 35min; kaolin 45%, feldspar 30%, quartz 20%, binder (1%) added, sintering temperature 800℃-1200℃, sintering temperature 20min, cooling time 6h, 10℃ / min. Since the structural properties of ceramics are already stable at the sintering temperature, the high-temperature resistant ceramic plate sintered at 1250℃ can meet the performance requirements of the high-temperature resistant ceramic plate sintered at 800℃. In order to simplify the manufacturing process, high-temperature resistant materials are usually fired at a higher sintering temperature, especially when a higher temperature sintering environment will be used in the subsequent process. A higher temperature is required to make the high-temperature resistant ceramic plate to ensure that the structural properties of the ceramic plate will not change in the high temperature environment of the subsequent process.

[0031] Of course, for the second method of making high temperature resistant ceramic plates, different high temperature resistant ceramic powders and different sintering temperatures and times can be selected according to different environmental requirements to obtain high temperature resistant ceramic plates with different performances, such as the following:

[0032] Alumina ceramics: 97% alumina, 2% magnesium oxide, 1% organic binder, sintered at 1600℃, kept warm for 3h, heating rate 8℃ / h.

[0033] Silicon carbide ceramics: 95% silicon carbide, 3% aluminum oxide, 2% magnesium oxide, sintered at 1850℃, vacuum environment, and kept warm for 4 hours.

[0034] Zirconia ceramics: 95% zirconium oxide, 5% yttrium oxide, sintered at 1450°C, kept warm for 2 hours, nitrogen environment.

[0035] S2, first sintering: sintering the high temperature resistant ceramic embryo at 800℃-1200℃;

[0036] Of course, if the first method is adopted, the first sintering can be omitted. The first sintering is mainly used to form a high-temperature resistant ceramic body with stable structural performance when the high-temperature resistant ceramic body is made of ceramic powder.

[0037] S3, Printing: Spray or print a barcode or QR code on the high temperature resistant ceramic embryo; in order to ensure that the barcode or QR code sprayed on the high temperature resistant ceramic embryo is stable and does not spread, it is usually necessary to dry the barcode or QR code after spraying. The drying temperature is usually 80℃-150℃, and the drying time is 10min-30min, which can be adjusted according to the ink thickness and the absorption capacity of the substrate. Drying uses a hot air circulation furnace or infrared drying equipment to achieve the initial fixation of the ink pattern through drying, prevent the pattern from shifting or spreading during the subsequent high temperature sintering process, and ensure that the barcode or QR code sprayed on the high temperature resistant ceramic plate can be used normally.

[0038] The barcode or QR code is printed on the high temperature resistant ceramic embryo with high temperature ink, and the specific components of the high temperature ink include 10-20% high temperature resistant pigment, 15-25% glass powder, 10-15% high temperature silicone resin, 10-15% cyclohexanone, and 0.5-1% leveling agent. The viscosity of the high temperature ink is within the range of 5000-15000 mPa·s, and the printing thickness is 10-30 μm.

[0039] The high-temperature ink is printed on the surface of the high-temperature resistant ceramic embryo by pad printing, and then the high-temperature resistant ceramic embryo is transferred to a high-temperature furnace and sintered at 900℃-1100℃ for 15min-30min. The heating rate is controlled at 15min-30min and the insulation time is 10-60min to ensure that the ink is completely sintered and firmly bonded to the ceramic surface. The cooling time is 8h and the cooling rate is controlled at 5-10℃ / min to avoid cracks caused by thermal shock.

[0040] S4, second sintering: sintering the high temperature resistant ceramic blank printed with the barcode or QR code at a high temperature of 800°C-1200°C;

[0041] The specific sintering time needs to be selected according to the specific formula of the ink and the requirements of the substrate. The specific common parameters are shown in the table below:

[0042] Parameter name Low temperature sintering Medium temperature sintering High temperature sintering Sintering temperature 800℃-950℃ 950℃-1100℃ 1100℃-1250℃ Heating rate 10℃-20℃ / min 5℃-15℃ / min 5℃-10℃ / min Insulation time 10-20min 20-40min 40-60min Drying temperature 80℃-100℃ 100℃-120℃ 120℃-150℃ Cooling rate 10℃-15℃ / min 5℃-10℃ / min 3℃-5℃ / min

[0043] S5, glazing: a layer of glaze is applied on the surface of the high temperature resistant ceramic blank after the first sintering; wherein the glaze is sprayed on the side of the high temperature resistant ceramic blank and printed with a barcode or a QR code. The glazing process can improve the wear resistance, corrosion resistance and waterproof performance of the high temperature resistant ceramic plate and high temperature ink. The glaze composition includes 50-60% calcium borate glass powder, 20-30% feldspar, 10-20% quartz and 1-3% zinc oxide.

[0044] Of course, depending on the usage scenario, the specific composition of the glaze is also different, and the corresponding sintering temperature, sintering time, cooling time and other parameters are also different. According to the different usage environments, it can be roughly divided into the following types:

[0045]

[0046] S6, the third sintering: the glazed high temperature resistant ceramic embryo is sintered at 800℃-1200℃; in the oil sintering process, factors such as sintering temperature, heating rate, holding time, cooling rate, etc. are crucial. In one embodiment, the high temperature resistant ceramic embryo is transferred to a high temperature furnace, sintered at 950℃-1100℃ for 30-60min, and cooled for 8-12h.

[0047] As mentioned above, different process parameters are required according to different glaze components. The specific commonly used parameters are shown in the following table:

[0048]

[0049] S7, the finished product is taken out of the oven and cooled.

[0050] To sum up, the present invention adopts high temperature resistant ceramic as a substrate, firstly sintering the high temperature resistant ceramic embryo at a temperature above 1200°C to make the high temperature resistant ceramic plate maintain stable structural performance, then printing a barcode or a two-dimensional code presented by high temperature ink on the high temperature resistant ceramic plate, and subjecting the high temperature resistant ceramic plate to a second high temperature sintering, utilizing the mutual movement, penetration and combination of ink molecules and ceramic molecules under high temperature to make the barcode or the two-dimensional code completely and firmly combined with the ceramic surface, finally spraying a layer of glaze on the high temperature resistant ceramic plate, and subjecting the high temperature resistant ceramic plate to three high temperature sinterings, so that the glaze is completely attached to the high temperature resistant ceramic plate, and the high temperature ink is completely wrapped for protection, so that the barcode or the two-dimensional code on the high temperature resistant ceramic plate can meet the requirements of high temperature resistance, strong acid and alkali resistance, corrosion resistance, wear resistance, etc., so as to achieve stable label performance during high temperature reflow soldering, and can ensure the clarity and integrity of the barcode or the two-dimensional code in a long-term high temperature environment, and can still store and read information.

[0051] Unless otherwise specified, the reagents and equipment used in this example are all purchased from the market. The methods and conditions used in this example are all conventional methods and conditions unless otherwise specified.

[0052] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. All equivalent changes or modifications made according to the structure, characteristics and principles described in the patent application scope of the present invention should be included in the patent application scope of the present invention.

Claims

1. A production process for traceability labels in high-temperature reflow soldering, characterized in that: include: S1, select substrate: cut or make high temperature resistant ceramic embryo; S2, first sintering: sintering the high temperature resistant ceramic embryo at 800℃-1200℃; S3, printing: spraying or printing a barcode or a QR code on the high temperature resistant ceramic embryo; S4, second sintering: sintering the high temperature resistant ceramic blank printed with the barcode or QR code at a high temperature of 800°C-1200°C; S5, glazing: applying a layer of glaze on the surface of the high temperature resistant ceramic embryo after the primary sintering; S6, the third sintering: sintering the glazed high temperature resistant ceramic embryo at a high temperature of 800°C-1200°C; S7, the finished product is taken out of the oven and cooled.

2. The production process of a traceability label for high temperature reflow soldering according to claim 1, characterized in that: The steps for making high-temperature resistant ceramic embryos include a. selecting powder raw materials, b. mixing powder raw materials, c. placing the powder raw materials in a mold cavity, and d. cold pressing and forming, wherein the powder raw materials are mixed and stirred and then placed on a rotating mold turntable, and the powder raw materials are flattened into the mold cavity during the rotation of the rotating mold, and the powder raw materials are extruded and formed when the mold cavity rotates to a stamping station, and finally the formed high-temperature resistant ceramic embryo is discharged onto a transfer mesh plate when the mold cavity rotates to a discharge port.

3. The production process of a traceability label for high temperature reflow soldering according to claim 2, characterized in that: After the high temperature resistant ceramic embryo is placed on the mesh plate, it is transferred to a high temperature sintering furnace and fired at a temperature of 800° C. to 1200° C. for 15 min to 30 min.

4. The production process of a traceability label for high temperature reflow soldering according to claim 1, characterized in that: The barcode or QR code is printed on the high temperature resistant ceramic embryo with high temperature ink. The specific components of the high temperature ink include 10-20% high temperature resistant pigment, 15-25% glass powder, 10-15% high temperature silicone resin, 10-15% cyclohexanone and 0.5-1% leveling agent.

5. The production process of a traceability label for high temperature reflow soldering according to claim 4, characterized in that: The high temperature ink is printed on the surface of the high temperature resistant ceramic embryo by pad printing, and then the high temperature resistant ceramic embryo is transferred to a high temperature furnace, sintered at 900℃-1100℃ for 15min-30min, and cooled for 8h.

6. The production process of a traceability label for high temperature reflow soldering according to claim 1, characterized in that: The glaze composition comprises 50-60% of calcium borate glass powder, 20-30% of feldspar, 10-20% of quartz and 1-3% of zinc oxide.

7. The production process of a traceability label for high temperature reflow soldering according to claim 6, characterized in that: The glaze is sprayed on the high-temperature resistant ceramic embryo and printed on one side of the barcode or QR code, and then the high-temperature resistant ceramic embryo is transferred to a high-temperature furnace, sintered at 950° C.-1100° C. for 30-60 minutes, and cooled for 8-12 hours.

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