Single-sided alternating dual-station wafer double-sided coating apparatus and coating method

Abstract

This application discloses a single-sided alternating dual-station wafer double-sided coating apparatus and method. The coating apparatus includes a working chamber, two sets of carriers, a target material, a rotation mechanism, and a switching mechanism. The rotation mechanism drives the carriers to rotate to facilitate wafer flipping, and the switching mechanism drives the two sets of carriers to revolve to facilitate the exchange of positions between the two sets of carriers. The coating apparatus and method provided in this application enable double-sided wafer coating in a single chamber, which simplifies the production process, reduces equipment space requirements, shortens material transfer time, and improves the overall production efficiency and output capacity. Through the rotation and revolution of the two sets of carriers, double-sided coating of two wafers can be performed in a single closed-chamber operation without changing the target material form, further optimizing the dual-wafer coating process and improving the efficiency of double-sided wafer coating.

Description

Technical Field

[0001] This application relates to the field of wafer coating technology, and in particular to a single-sided alternating dual-station wafer double-sided coating apparatus and coating method. Background Technology

[0002] Wafer coating is a technique that involves covering the surface of a wafer with one or more thin films. These films can be made of different materials such as metals, non-metals, and compounds, and possess specific electrical, optical, or mechanical properties. Coating improves the performance of the wafer, making it more suitable for various applications.

[0003] Some special processes require coating on both sides of a wafer. In the prior art, if double-sided coating of a wafer is required, two process chambers are often set up. One process chamber is used to perform coating on the front side of the wafer. After the front side coating is completed, the wafer is sent to the other process chamber for back side coating. In this way, the coating on both sides of the wafer is finally completed.

[0004] Configuring two process chambers increases the equipment layout cost and floor space, and also adds wafer movement steps, which increases the possibility of wafer contamination and can easily affect the process performance. Summary of the Invention

[0005] The purpose of this application is to overcome the shortcomings of the prior art and to provide a single-sided alternating dual-station wafer double-sided coating apparatus and coating method.

[0006] This application provides a single-sided alternating dual-station wafer double-sided coating apparatus, comprising: a working cavity for providing space for wafer coating; two sets of carriers arranged side-by-side in the working cavity along a vertical direction, the carriers being used to receive and fix the wafer; a target material disposed above the two sets of carriers; a rotation mechanism for driving the carriers to rotate, so that the carriers can rotate carrying the wafer, thereby realizing the flipping of the wafer; and a transposition mechanism for driving the two sets of carriers to revolve, so that the two sets of carriers can exchange positions; wherein, the wafer includes an A-side and a B-side; through the rotation mechanism, the wafer on the carrier can be changed from facing the target with the A-side to facing the target with the B-side, or the wafer on the carrier can be changed from facing the target with the B-side to facing the target with the A-side; through the transposition mechanism, the positions of the two sets of carriers can be exchanged, and the wafer on the carrier can be changed from facing the target with the A-side to facing the target with the B-side, or from facing the target with the B-side to facing the target with the A-side.

[0007] Furthermore, the carrier includes: a receiving component for supporting the wafer; and a magnetic suction component for abutting against the receiving component and fixing the wafer between the receiving component and the magnetic suction component by adsorbing the receiving component; wherein the receiving component has an open middle section to expose the B side of the wafer, and the magnetic suction component has an open middle section to expose the A side of the wafer.

[0008] Furthermore, the magnetic suction component is equipped with an electromagnet. When the electromagnet is energized, the magnetic suction component can attract the receiving component. An elastic component is provided between the receiving component and the magnetic suction component. After the electromagnet is de-energized, the elastic component recovers and can push the receiving component and the magnetic suction component apart.

[0009] Furthermore, the carrier also includes a motion drive assembly for driving the receiving part and the magnetic suction part closer to or further apart from each other.

[0010] Furthermore, the single-sided alternating dual-station wafer double-sided coating apparatus also includes: a main rotating support shaft, rotatably mounted on the cavity wall of the working chamber; a second mounting plate, mounted on the main rotating support shaft; and two sets of auxiliary rotating support shafts, each set of which is rotatably mounted on the second mounting plate, the two sets of auxiliary rotating support shafts being symmetrically arranged, and each set of carriers being connected to one set of auxiliary rotating support shafts.

[0011] Furthermore, the carrier includes a receiving component and a magnetic suction component. The magnetic suction component is equipped with an electromagnet, and an elastic component is provided between the receiving component and the magnetic suction component. The main rotating support shaft and the auxiliary rotating support shaft are provided with wiring channels, and the electromagnet's cable can be connected to an external power supply and controller through the wiring channels.

[0012] Furthermore, the single-sided alternating dual-station wafer double-sided coating apparatus also includes: a connecting plate, connected to the switching mechanism, and capable of rotating within the working cavity under the drive of the switching mechanism; a first transmission joint, connected to one set of carriers, and rotatably mounted on the connecting plate; a second transmission joint, connected to the other set of carriers, and also rotatably mounted on the connecting plate; when the connecting plate rotates, the first and second transmission joints can carry the two sets of carriers to revolve around the rotation axis of the connecting plate; the rotating mechanism includes: a first rotating drive member, the movable end of which is provided with a third transmission joint; a second rotating drive member, the movable end of which is provided with a fourth transmission joint; and a first translational drive member, used for driving... The first rotary drive member moves closer to or away from the vehicle; the second translational drive member moves the second rotary drive member closer to or away from the vehicle; when both sets of vehicles need to rotate, the first translational drive member moves the first rotary drive member closer to the vehicle, and the second translational drive member moves the second rotary drive member closer to the vehicle; the third transmission joint can engage with one of the first transmission joint and the second transmission joint, and the fourth transmission joint can engage with the other of the first transmission joint and the second transmission joint; when both sets of vehicles need to revolve, the first translational drive member moves the first rotary drive member away from the vehicle, and the second translational drive member moves the second rotary drive member away from the vehicle, thereby avoiding interference between the first rotary drive member and the second rotary drive member on the rotation of the connecting plate.

[0013] Furthermore, the single-sided alternating dual-station wafer double-sided coating apparatus also includes: two sets of variable connection structures, each set of carriers being connected to one set of variable connection structures; a first mounting plate, through which the two sets of variable connection structures are connected; wherein, the variable connection structure includes: a connecting seat for connecting one set of carriers, the connecting seat having a recessed cavity, and a threaded hole at the end of the connecting seat away from the carrier, the threaded hole communicating with the recessed cavity, and a keyway extending horizontally toward the carrier; a connecting rod connected to the first mounting plate and inserted into the connecting seat, the front section of the connecting rod having a key extending coaxially with the keyway, the key being able to enter the recessed cavity along the keyway. The rear section of the connecting rod is provided with an external thread. After the key enters the relief cavity, the external thread can be threadedly connected to the threaded hole. The single-sided alternating dual-station wafer double-sided coating device also includes: a rotary drive for driving the first mounting plate to rotate; a translation drive for driving the first mounting plate to move along the extension direction of the keyway; when the switching mechanism needs to work, the key is inserted into the keyway, the rotary drive drives the first mounting plate to rotate, and the two sets of variant connection structures revolve and exchange positions; when the rotation mechanism needs to work, the key leaves the keyway and enters the relief cavity, the translation drive continues to drive the first mounting plate and drive the connecting rod to translate towards the carrier, and the connecting seat rotates through the threaded transmission.

[0014] This application also provides a coating method that can be implemented using the above-described single-sided alternating dual-station wafer double-sided coating apparatus, comprising the following steps: two sets of carriers respectively fix one wafer, both wafers being in a state where side A faces the target; a first coating is performed, and side A of the first wafer is coated; a rotation mechanism is activated, and the two sets of carriers rotate, so that both wafers change to a state where side B faces the target; a second coating is performed, and side B of the first wafer is coated; a repositioning mechanism is activated, and the two sets of carriers revolve and exchange positions, so that both wafers change to a state where side A faces the target; a third coating is performed, and side A of the second wafer is coated; a rotation mechanism is activated, and the two sets of carriers rotate, so that both wafers change to a state where side B faces the target; a fourth coating is performed, and side B of the second wafer is coated.

[0015] Furthermore, after the fourth coating is completed, the switching mechanism is activated, and the two sets of carriers revolve and exchange positions again, so that both wafers are changed to the state where surface A faces the target material 300; the two wafers are reset to facilitate the correction of the wafer state.

[0016] This application provides a single-sided alternating dual-station wafer double-sided coating apparatus and method. The coating apparatus includes a working chamber, two sets of carriers, a target material, a rotation mechanism, and a transposition mechanism. The rotation mechanism drives the carriers to rotate to facilitate wafer flipping, and the transposition mechanism drives the two sets of carriers to revolve to facilitate the exchange of positions between the two sets of carriers. The revolve not only changes the position of the carriers but, when used appropriately, can also replace the rotation mechanism for one wafer flipping operation. The coating apparatus and method provided in this application enable double-sided wafer coating in a single chamber, simplifying the production process, reducing equipment space requirements, shortening material transfer time, and improving the overall production line efficiency and output capacity. Through the rotation and revolve of the two sets of carriers, double-sided coating of two wafers can be performed in a single closed-chamber operation without changing the target material form, further optimizing the dual-wafer coating process and improving the efficiency of double-sided wafer coating. Attached Figure Description

[0017] Figure 1 A schematic diagram of a single-sided alternating dual-station wafer double-sided coating apparatus provided in this application;

[0018] Figure 2 for Figure 1 A cross-sectional view of the single-sided alternating dual-station wafer double-sided coating apparatus shown.

[0019] Figure 3 for Figure 2 The diagram shown is a single-sided alternating dual-station wafer double-sided coating apparatus with the working chamber and target material omitted.

[0020] Figure 4 for Figure 3 Structural sectional view;

[0021] Figure 5 for Figure 4 Enlarged view of the inner structure of the center circle;

[0022] Figure 6 A schematic diagram of another single-sided alternating dual-station wafer double-sided coating apparatus provided in this application;

[0023] Figure 7 This is a schematic diagram of the process state of a coating method provided in this application. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0025] This application provides a single-sided alternating dual-station wafer double-sided coating apparatus, comprising: a working cavity 100 for providing space for wafer coating; two sets of carriers 200 arranged side-by-side vertically within the working cavity 100, the carriers 200 for receiving and fixing the wafers; a target material 300 disposed above the two sets of carriers 200; a rotation mechanism for driving the carriers 200 to rotate, thereby enabling the carriers 200 to rotate while carrying the wafers, thus achieving wafer flipping; and a transposition mechanism for driving the two sets of carriers 200 to revolve, thereby enabling the two sets of carriers 200 to revolve. 0. Position exchange; wherein, the wafer includes an A-side and a B-side; through the rotation mechanism, the wafer on the carrier 200 can be changed from facing the target 300 from the A-side to facing the target 300, or the wafer on the carrier 200 can be changed from facing the target 300 from the B-side to facing the target 300; through the position exchange mechanism, the positions of the two sets of carriers 200 can be exchanged, and the wafer on the carrier 200 can be changed from facing the target 300 from the A-side to facing the target 300, or from facing the target 300 from the B-side to facing the target 300, or from facing the target 300 from the B-side to facing the target 300.

[0026] For details, please refer to Figure 1 In the illustrated embodiment, the working cavity 100 is provided with two wafer inlets and outlets, which are arranged side by side along the vertical direction. (Refer to reference...) Figure 2 The working cavity 100 is equipped with two sets of carriers 200, which are arranged side by side in a vertical direction. Each set of carriers 200 is opposite to a wafer inlet / outlet. Wafer handling mechanisms such as robotic arms can transfer wafers to the corresponding carriers 200 through the wafer inlet / outlet.

[0027] Furthermore, the working chamber 100 has an air inlet channel and an air outlet channel on its cavity wall. The air inlet channel connects the working chamber 100 to the air supply device, and the air outlet channel connects the working chamber 100 to the air extraction device. The air supply device can introduce the reaction gas for coating into the working chamber 100 through the air inlet channel, and the air extraction device can extract the gas from the working chamber 100 through the air outlet channel. The air supply device and the air extraction device work together to maintain the cavity air pressure required for coating.

[0028] Continue to refer to Figure 2The target 300 is located at the top of the working cavity 100, and the carrier 200 is located directly below the target 300. The target 300 is connected to the radio frequency power supply. During operation, the radio frequency power supply supplies power to the target 300. After the target 300 is powered on, it can ionize the reactive gas. The electrons generated by ionization bombard the target 300, which can blast out the metal atoms on the surface of the target 300. The metal atoms move towards the carrier 200 and can be deposited on the wafer surface, thereby realizing the wafer coating.

[0029] For ease of description, Figure 2 The group of vehicles 200 positioned above is called the first group of vehicles 200A, and the other group of vehicles 200 positioned below is called the second group of vehicles 200B.

[0030] Figure 2 In the embodiment shown, after both sets of carriers 200 acquire wafers, the front side of the wafer on the first set of carriers 200A faces the target material 300 and can be coated, while the back side of the wafer on the first set of carriers 200A and the wafer on the second set of carriers 200B are blocked and cannot be coated.

[0031] The rotating mechanism can be any drive component capable of rotating the vehicle 200 degrees, such as a rotary cylinder or motor. In one embodiment, refer to... Figure 6 The coating apparatus includes two sets of rotating mechanisms, each connected to a carrier 200. When needed, the rotating mechanisms operate to achieve the rotation of the carrier 200, thereby enabling the wafer to be flipped.

[0032] The transposition mechanism can be configured as a turntable, with two sets of carriers 200 positioned relative to the turntable's rotation axis. When needed, the turntable can be rotated 180° to swap the positions of the two sets of carriers 200. The first set of carriers 200A, originally positioned above, moves to the lower workstation, while the second set of carriers 200B, originally positioned below, moves to the upper workstation facing the target material 300. Because the carriers 200 revolve, after rotating 180°, the wafers that were originally facing upwards (A-side up) and towards the target material 300 will simultaneously change to facing upwards (B-side up). Therefore, this revolve motion can not only change the position of the carriers 200, but, when used appropriately, can also replace the rotation mechanism for one wafer face-changing operation.

[0033] In summary, the single-sided alternating dual-station wafer double-sided coating apparatus provided in this application enables double-sided coating of wafers within a single cavity, simplifying the production process, reducing equipment footprint, and decreasing material transfer time, while also improving the overall production efficiency and output capacity of the line. Through the rotation and revolution of the two sets of carriers 200, double-sided coating of two wafers can be performed in a single closed-cavity operation without changing the form of the target material 300, further optimizing the dual-wafer coating process and improving the efficiency of wafer double-sided coating.

[0034] In this application, the carrier 200 can be any carrier structure that is convenient for fixing the wafer, such as a clamp or suction cup.

[0035] In one embodiment, the carrier 200 is arranged in a ring shape, and the carrier 200 has a slot for supporting it. The side of the carrier 200 has an opening that connects to the slot. The wafer transport mechanism can place the wafer into the slot through the opening. The slot can support the edge of the wafer and expose the middle part of the wafer to be coated through the inner ring of the ring.

[0036] At this point, the top, bottom, sides, and edges of the wafer are all constrained by the slot; ensuring that the depth of the slot is close to the thickness of the wafer, the wafer can be stably placed in the slot after being inserted, and it will not easily fall out of the slot even if it is rotated or flipped.

[0037] Furthermore, the rotation axis of the carrier 200 is parallel to the moving direction of the wafer transport mechanism (or the direction in which the wafer enters and exits the slot), which can prevent the wafer from deviating from the slot through the opening during the rotation or revolution of the carrier 200.

[0038] Alternatively, a door can be installed at the opening; an elastic structure such as a torsion spring can be used to allow the door to automatically block the opening without external force; a drive structure such as an electromagnet can be installed to provide external force to the door away from the opening when needed, and to remove the external force after the wafer is in place so that the door can actively reset, which can also prevent the wafer from deviating from the slot through the opening during the rotation or revolution of the carrier 200.

[0039] In another embodiment, the carrier 200 includes: a receiving member 210 for supporting the wafer; and a magnetic suction member 220 for abutting against the receiving member 210 and fixing the wafer between the receiving member 210 and the magnetic suction member 220 by adsorbing the receiving member 210; wherein the receiving member 210 is open in the middle to expose the B side of the wafer; and the magnetic suction member 220 is open in the middle to expose the A side of the wafer.

[0040] The receiving component 210 and the magnetic suction component 220 can be of any shape, as long as they can support the wafer and have open portions that can expose the surface of the wafer to be coated.

[0041] Figure 2 and Figure 3 In the illustrated embodiment, both the receiving component 210 and the magnetic chuck 220 are annular in shape. The receiving component 210 has a notch on one side, allowing the wafer transport mechanism to move through the notch for easy insertion and removal of the wafer. Specifically, when the receiving component 210 receives the wafer, the edge of the wafer rests on the receiving component 210, causing the magnetic chuck 220 to abut against the edge of the wafer from top to bottom, thus securing the wafer in place with the receiving component 210. Side A of the wafer is exposed to the outside through the open inner ring of the magnetic chuck 220, and side B is also exposed to the outside through the open inner ring of the receiving component 210.

[0042] The magnetic chuck 220 can be made of a magnet or have a magnet embedded within it. The magnetic chuck 220 possesses the magnetism to attract metal products. The receiving component 210 can be made of metal or have a metal material embedded within it. When the magnetic chuck 220 approaches the receiving component 210, it can attract the receiving component 210, thus pressing the wafer firmly between the two, preventing the wafer from easily shifting even if the carrier 200 rotates or revolves.

[0043] To prevent the magnetic force of the magnetic chuck 220 from damaging the wafer due to excessive magnetic force, the magnetic chuck 220 is set to weak magnetism.

[0044] In one embodiment, the magnetic suction component 220 is provided with an electromagnet. When the electromagnet is energized, the magnetic suction component 220 can attract the receiving component 210. An elastic component is provided between the receiving component 210 and the magnetic suction component 220. After the electromagnet is de-energized, the elastic component recovers and can push the receiving component 210 and the magnetic suction component 220 apart, so that the receiving component 210 and the magnetic suction component 220 are far apart, so as to facilitate wafer loading and unloading.

[0045] The elastic element can be made of elastic materials such as rubber or plastic, or it can be an elastic structure such as a spring or sheet. The elastic element is located between the receiving part 210 and the magnetic attracting part 220. When the electromagnet is energized, the magnetic force generated can overcome the elastic force of the elastic element, thereby compressing the elastic element and bringing the receiving part 210 and the magnetic attracting part 220 closer together. When the electromagnet is de-energized and loses its magnetic force, the elastic element returns to its original state, allowing the receiving part 210 and the magnetic attracting part 220 to separate.

[0046] In one specific embodiment, the magnetic chuck 220 is connected to the rotation mechanism and the transfer mechanism for receiving the wafer. The receiving component 210 is positioned above the magnetic chuck 220 via an elastic element. After the magnetic chuck 220 supports the wafer, the electromagnet is energized, and the magnetic chuck 220 attracts the receiving component 210. The receiving component 210 compresses the elastic element and moves toward the magnetic chuck 220. Finally, the receiving component 210 presses against the wafer, firmly pressing it onto the magnetic chuck 220. After the coating is completed, the electromagnet is de-energized, the elastic element returns to its original position, and the receiving component 210 is pushed open, allowing the wafer transport mechanism to remove the wafer from the magnetic chuck 220.

[0047] In another embodiment, the carrier 200 further includes a motion drive assembly 230 for driving the receiving member 210 and the magnetic member 220 closer to or further apart from each other.

[0048] The mobile drive component 230 can be any convenient gripper such as a clamp, suction cup, or magnet to grasp the receiving component 210 and / or the magnetic suction component 220, and can move the receiving component 210 and the magnetic suction component 220 closer or further apart through lifting, translation, or flipping.

[0049] This application does not limit the specific configuration of the mobile drive component 230.

[0050] In one embodiment, reference may be made to Figure 2 and Figure 3 The receiving component 210 is connected to the rotating mechanism and the transposition mechanism for receiving wafers. The receiving component 210 is connected to the moving drive assembly 230 and is located above the magnetic suction component 220. The moving drive assembly 230 includes: two sets of top plates 231, one set of top plates 231 being located below each magnetic suction component 220; and a lifting drive component 232 for driving the two sets of top plates 231 to move synchronously in the vertical direction.

[0051] Specifically, during the coating process, the wafer falls onto the receiving component 210, and the lifting drive component 232 drives the top plate 231 carrying the magnetic suction component 220 to descend, so that the magnetic suction component 220 approaches and attracts the receiving component 210; the lifting drive component 232 drives the top plate 231 to continue to descend, and the top plate 231 disengages from the magnetic suction component 220 so that the magnetic suction component 220 can rotate with the receiving component 210.

[0052] The lifting drive component 232 can be any drive structure that can drive the top plate 231 to move up and down, such as a cylinder or an electric cylinder. Figure 2 In the embodiment shown, the fixed end of the lifting drive 232 is located outside the working cavity 100, and the movable end is connected to the two sets of top plates 231 through a bellows-sealed transmission connection and extends into the working cavity 100. Under the drive of the lifting drive 232, the two sets of top plates 231 can move up and down synchronously, thereby simultaneously fixing or releasing the wafers on the two sets of carriers 200.

[0053] By setting the top plate 231 to lift the magnetic suction component 220, after the magnetic suction component 220 attracts the receiving component 210, the top plate 231 can completely detach from the magnetic suction component 220. With this setting, the moving drive component 230 will not interfere with the rotation of the receiving component 210 and the magnetic suction component 220.

[0054] The single-sided alternating dual-station wafer double-sided coating apparatus provided in this application further includes: a main rotating support shaft 510, rotatably mounted on the cavity wall of the working cavity 100; a second mounting plate 520, mounted on the main rotating support shaft 510; and two sets of auxiliary rotating support shafts 530, each set of auxiliary rotating support shafts 530 being rotatably mounted on the second mounting plate 520, the two sets of auxiliary rotating support shafts 530 being symmetrically arranged, and each set of carriers 200 being connected to one set of auxiliary rotating support shafts 530.

[0055] For details, please refer to Figure 2 or Figure 6In the illustrated embodiment, the main rotary support shaft 510 passes through the left side wall of the working cavity 100 and is rotatably mounted on the working cavity 100 via a rotary support and bearings. A second mounting plate 520 is located at the right end of the main rotary support shaft 510. Two sets of auxiliary rotary support shafts 530 are rotatably mounted at both ends of the second mounting plate 520 along its length via bearings. The two sets of auxiliary rotary support shafts 530 are symmetrically arranged about the main rotary support shaft 510 as a central axis. Each of the two sets of auxiliary rotary support shafts 530 is connected to a carrier 200.

[0056] When the vehicle 200 rotates, it can drive the secondary rotary support shaft 530 to rotate as well. When the vehicle 200 revolves, the second mounting plate 520 can rotate as well.

[0057] The secondary rotary support shaft 530 and the second mounting plate 520 can serve as rotary supports, which can stabilize the installation of the carrier 200 and maintain support for the carrier 200 when it rotates, thereby improving the balance and reliability of the carrier 200.

[0058] In one embodiment, reference is made to Figure 2 The carrier 200 includes a receiving component 210 and a magnetic suction component 220. The receiving component 210 is connected to the secondary rotary support shaft 530, and the magnetic suction component 220 can move closer to or away from the receiving component 210 under the drive of the motion drive assembly 230.

[0059] In another embodiment, the carrier 200 includes a receiving component 210 and a magnetic suction component 220. The magnetic suction component 220 is equipped with an electromagnet. An elastic element is provided between the receiving component 210 and the magnetic suction component 220. The main rotating support shaft 510 and the auxiliary rotating support shaft 530 are provided with wiring channels. The cable of the electromagnet can be connected to an external power supply and controller through the wiring channels.

[0060] For details, please refer to Figure 6 The magnetic suction component 220 is connected to the secondary rotary support shaft 530, and the receiving component 210 is positioned above the magnetic suction component 220 via an elastic element. Both the main rotary support shaft 510 and the secondary rotary support shaft 530 are cylindrical, and each has a wiring channel that runs horizontally through the support shaft. The cables of the two sets of magnetic suction components 220 can extend towards the main rotary support shaft 510 through the wiring channel in the connected secondary rotary support shaft 530, and then connect to an external power supply and controller through the wiring channel in the main rotary support shaft 510.

[0061] The design of the wiring channel inside the support shaft enables the safe external connection of the cables, which not only facilitates the sealing design of the working cavity 100, but also limits the relative position of the cables and prevents the two sets of cables from getting tangled together during the rotation of the carrier 200.

[0062] In one embodiment, the single-sided alternating dual-station wafer double-sided coating apparatus provided in this application further includes: a connecting plate 401, connected to a switching mechanism, and capable of rotating within the working cavity 100 under the drive of the switching mechanism; a first transmission joint 402, connected to one set of carriers 200, and rotatably mounted on the connecting plate 401; a second transmission joint 403, connected to the other set of carriers 200, and also rotatably mounted on the connecting plate 401; when the connecting plate 401 rotates, the first transmission joint 402 and the second transmission joint 403 can carry the two sets of carriers 200 to revolve around the rotation axis of the connecting plate 401; the rotating mechanism includes: a first rotating drive member 404, the movable end of the first rotating drive member 404 being provided with a third transmission joint 405; a second rotating drive member 406, the movable end of the second rotating drive member 406 being provided with a fourth transmission joint 407; and a first translation drive member 408, used to drive the first rotating drive member. 404 moves closer to or further away from vehicle 200; a second translation drive 409 drives the second rotation drive 406 closer to or further away from vehicle 200; when both sets of vehicles 200 need to rotate, the first translation drive 408 drives the first rotation drive 404 closer to vehicle 200, and the second translation drive 409 drives the second rotation drive 406 closer to vehicle 200; a third transmission joint 405 can engage with one of the first transmission joint 402 and the second transmission joint 403, and a fourth transmission joint 407 can engage with the other of the first transmission joint 402 and the second transmission joint 403; when both sets of vehicles 200 need to revolve, the first translation drive 408 drives the first rotation drive 404 further away from vehicle 200, and the second translation drive 409 drives the second rotation drive 406 further away from vehicle 200, thereby avoiding interference between the first rotation drive 404 and the second rotation drive 406 and the rotation of the connecting plate 401.

[0063] For details, please refer to Figure 6 In the illustrated embodiment, the switching mechanism can employ rotary cylinders, motors, or other rotary drive components. The fixed end of the switching mechanism is located outside the working chamber 100 for easy installation, debugging, and maintenance; the movable end is connected via a bellows-sealed transmission connection and extends into the working chamber 100 to connect with the connecting plate 401. The carrier 200 is rotatably mounted on the connecting plate 401 via bearings, and two sets of carriers 200 are arranged side-by-side at both ends of the connecting plate 401, with the distance between the two sets of carriers 200 and the rotation center of the connecting plate 401 being consistent.

[0064] Continue to refer to Figure 4 The first set of vehicles 200 located on the top has a first transmission joint 402 on its right end, and the second set of vehicles 200 located on the bottom has a second transmission joint 403 on its right end.

[0065] Continue to refer to Figure 4The first rotary drive component 404 and the second rotary drive component 406 can be rotary drive components such as rotary cylinders or motors. The fixed ends of the first rotary drive component 404 and the second rotary drive component 406 are located outside the working cavity 100, and the movable ends are connected to the working cavity 100 through a bellows-sealed transmission connection. The first rotary drive component 404 is located at the top, facing a set of carriers 200 in the upper position; the second rotary drive component 406 is located at the bottom, facing another set of carriers 200 in the lower position. The movable end of the first rotary drive component 404 is provided with a third transmission joint 405, and the movable end of the second rotary drive component 406 is provided with a fourth transmission joint 407. The third transmission joint 405 and the fourth transmission joint 407 are located inside the working cavity 100.

[0066] The first transmission joint 402 and the second transmission joint 403 are of the same type and can both be connected to the third transmission joint 405 and the fourth transmission joint 407 to transmit torque. The third transmission joint 405 and the fourth transmission joint 407 are of the same type.

[0067] The first transmission joint 402 and the third transmission joint 405 are used as examples for explanation. The first transmission joint 402 and the third transmission joint 405 can be clutches, gear sets, or rack and pinion systems, or any structure that can transmit torque when in contact.

[0068] Figure 6 In the illustrated embodiment, the first transmission joint 402 and the third transmission joint 405 employ a jaw clutch. The right end of the first transmission joint 402 has engaging teeth, and the left end of the third transmission joint 405 has engaging teeth. When the first transmission joint 402 and the third transmission joint 405 are abutting, their engaging teeth engage, thereby transmitting torque; when the first transmission joint 402 and the third transmission joint 405 move away from each other, their engaging teeth disengage, and transmission ceases. After the two sets of carriers 200 revolve and switch positions, the second transmission joint 403, which was originally at the lower position, will move to the upper position, directly opposite the third transmission joint 405. When the carrier 200 needs to rotate after changing position, the third transmission joint 405 can engage with the second transmission joint 403 for transmission. Similarly, the fourth transmission joint 407 can engage with both the second transmission joint 403 and the first transmission joint 402 for transmission.

[0069] Continue to refer to Figure 6The first translation drive 408 and the second translation drive 409 can be translation drive components such as cylinders or electric cylinders. The first translation drive 408 and the second translation drive 409 are disposed outside the working cavity 100 and are respectively connected to the first rotary drive 404 and the second rotary drive 406. The first translation drive 408 can drive the first rotary drive 404 to translate in the left and right direction to move closer to or away from a set of carriers 200 located at the upper work position; the second translation drive 409 can drive the second rotary drive 406 to translate in the left and right direction to move closer to or away from another set of carriers 200 located at the lower work position.

[0070] by Figure 6 Taking an example, when the carrier 200 needs to rotate, the first translational drive 408 drives the first rotary drive 404 to move towards the first set of carriers 200, causing the third transmission joint 405 to engage with the first transmission joint 402; the second translational drive 409 drives the second rotary drive 406 to move towards the second set of carriers 200, causing the fourth transmission joint 407 to engage with the second transmission joint 403. When the first rotary drive 404 and the second rotary drive 406 are activated, torque is transmitted through the transmission joints, causing both sets of carriers 200 to rotate, thereby achieving wafer flipping.

[0071] Since the first rotary drive 404 and the second rotary drive 406 can operate independently, if necessary, one of the vehicles 200 can also be rotated according to the actual situation.

[0072] Continue with Figure 6 Taking an example, when the carrier 200 needs to revolve, the first translational drive 408 drives the first rotational drive 404 away from the first set of carriers 200, causing the third transmission joint 405 to disengage from the first transmission joint 402; the second translational drive 409 drives the second rotational drive 406 away from the second set of carriers 200, causing the fourth transmission joint 407 to disengage from the second transmission joint 403. Subsequently, the switching mechanism drives the connecting plate 401 to rotate 180°, thereby changing the positions of the two sets of carriers 200. Since the transmission joints are in a disengaged state, the revolve of the carrier 200 is not affected by the rotation mechanism and will not affect the rotation mechanism.

[0073] The separable design of the transmission joint simplifies the installation of the rotating mechanism and avoids problems such as cable tangling caused by the two sets of rotating drive components participating in the revolution. It also relatively fixes the position of the rotating mechanism and prevents the rotating mechanism from participating in the revolution, thus avoiding affecting the accuracy of operation.

[0074] In another embodiment, the single-sided alternating dual-station wafer double-sided coating apparatus further includes: two sets of variable connection structures 410, wherein any set of carriers 200 is connected to one set of variable connection structures 410; and a first mounting plate 420, through which the two sets of variable connection structures 410 are connected; wherein the variable connection structure 410 includes: a connecting seat 411 for connecting one set of carriers 200, the connecting seat 411 having a clearance cavity 411a, and the connecting seat 411... A threaded hole 411b is provided at the end away from the carrier 200. The threaded hole 411b connects to the clearance cavity 411a. A keyway 411c is also provided in the threaded hole 411b, extending horizontally toward the carrier 200. A connecting rod 412 is connected to the first mounting plate 420 and inserted into the connecting seat 411. The front section of the connecting rod 412 is provided with a key 412a, which extends coaxially with the keyway 411c. The key 412a can move along the keyway 411c. 11c enters the clearance cavity 411a. The rear section of the connecting rod 412 is provided with an external thread 412b. After the key 412a enters the clearance cavity 411a, the external thread 412b can be threadedly connected to the threaded hole 411b. The single-sided alternating dual-station wafer double-sided coating device also includes: a rotary drive 430 for driving the first mounting plate 420 to rotate; a translation drive 440 for driving the first mounting plate 420 to move along the extension direction of the keyway 411c; (The last sentence appears to be incomplete and possibly refers to a different device.) When the positioning mechanism is working, the key 412a is inserted into the keyway 411c, and the rotation drive 430 drives the first mounting plate 420 to rotate. The two sets of variant connection structures 410 revolve and exchange positions. When the rotation mechanism needs to work, the key 412a leaves the keyway 411c and enters the clearance cavity 411a. The translation drive 440 continues to drive the first mounting plate 420 and drives the connecting rod 412 to translate towards the carrier 200. Through threaded transmission, the connecting seat 411 rotates.

[0075] For details, please refer to Figure 1 and Figure 2 In the illustrated embodiment, the fixed end of the rotary drive 430 is located outside the working cavity 100, and the movable end is connected to the first mounting plate 420 via a bellows-sealed transmission connection. The translation drive 440 is located outside the working cavity 100 and connected to the rotary drive 430, and is used to drive the rotary drive 430 to move the first mounting plate 420 horizontally.

[0076] The rotary drive component 430 can be a rotary drive component such as a rotary cylinder or a motor. The translation drive component 440 can be a linear drive component such as a cylinder or an electric cylinder.

[0077] Combined with reference Figure 3 A set of variant connection structures 410 is provided at each end of the first mounting plate 420, and the distance between the two sets of variant connection structures 410 and the rotation center of the first mounting plate 420 is the same.

[0078] Combined with reference Figures 3 to 5 The carrier 200 includes a receiving component 210 and a magnetic suction component 220, with the magnetic suction component 220 positioned above the receiving component 210 under the support of the top plate 231. The receiving component 210 is connected to a connecting seat 411. The connecting seat 411 has a recessed cavity 411a in its front section near the receiving component 210 and a threaded hole 411b in its rear section away from the receiving component 210. The front end of the threaded hole 411b communicates with the recessed cavity 411a, and the rear end penetrates the connecting seat 411. A keyway 411c is provided in the threaded hole 411b, extending horizontally axially. A connecting rod 412 is inserted into the connecting seat 411. The connecting rod 412 has a key 412a in its front section near the receiving component 210 and an external thread 412b in its rear section away from the receiving component 210. The front end of the connecting rod 412 is inserted into the connecting seat 411, and the rear end is fixedly mounted on the first mounting plate 420.

[0079] In actual use, the connecting rod 412 is always inserted into the connecting seat 411.

[0080] Continue to refer to Figure 5 The key 412a extends coaxially with the keyway 411c, and the key 412a can move horizontally in the axial direction along the keyway 411c. The external thread 412b is threadedly matched with the threaded hole 411b.

[0081] It is easy to understand that when the key 412a is in the keyway 411c, the key 412a can transmit radial force to the connecting seat 411 through the keyway 411c. At this time, the rotary drive 430 is activated, which can drive the two sets of carriers 100 to revolve through the first mounting plate 420.

[0082] When the vehicle 100 needs to rotate, the translation drive 440 drives the first mounting plate 420 to translate toward the vehicle 200, causing the front section of the connecting rod 412 with the key 412a to enter the clearance cavity 411a. Since the inner diameter of the clearance cavity 411a is larger than the outer diameter of the front section of the connecting rod 412, the clearance cavity 411a and the front section of the connecting rod 412 do not contact each other and cannot transmit power. As the translation drive 440 drives the connecting rod 412 to move forward continuously, the rear section of the connecting rod 412 with the external thread 412b enters the threaded hole 411b. The external thread 412b is threadedly connected to the threaded hole 411b. The external thread 412b translates continuously, which can drive the connecting seat 411 with the threaded hole 411b to rotate, thereby realizing the rotation of the vehicle 200. In addition, when the external thread 412b is in the threaded hole 411b, the first mounting plate 420 is driven to move away from the carrier 200 by the translation drive 440. As the external thread 412b continuously exits the threaded hole 411b, it can also drive the connecting seat 411 to rotate.

[0083] In this embodiment, the vehicle 200's rotation and revolution can be achieved as needed by using two sets of variant connection structures 410, a set of rotary drive components 430, and a set of translational drive components 440. This configuration reduces the number of drive structures, which helps simplify electrical control and reduce equipment costs.

[0084] This application also provides a coating method that can be implemented using the above-described single-sided alternating dual-station wafer double-sided coating apparatus, comprising the following steps:

[0085] Two sets of carriers 200 each fix one wafer, and both wafers are in the state where surface A faces the target material 300;

[0086] The first coating is performed on the A side of the first wafer on the substrate;

[0087] The rotating mechanism is activated, and the two sets of carriers 200 rotate, so that both wafers are transformed into a state where the B side faces the target material 300.

[0088] The second coating is then performed, and the coating is completed on the B side of the first wafer;

[0089] The switching mechanism is activated, and the two sets of carriers rotate 200 degrees and exchange positions, so that both wafers are transformed into a state where surface A faces the target material 300.

[0090] The third coating is then performed, and the coating on side A of the second wafer is completed.

[0091] The rotating mechanism is activated, and the two sets of carriers 200 rotate, so that both wafers are transformed into a state where the B side faces the target material 300.

[0092] The fourth coating process is performed, and the B-side of the second wafer is now coated.

[0093] For details, please refer to the reference. Figure 2 and Figure 6 After both sets of carriers 200 are fixed with the wafers, both wafers a and b are in a state where surface A is facing up and surface B is facing down. Since the first wafer a is facing the target material 300, metal atoms can be deposited on surface A of the first wafer a, thereby achieving the coating on surface A of the first wafer.

[0094] by Figure 4 and Figure 5 The illustrated implementation is described below. In the initial state, both sets of variant connection structures 410 are in a state of threaded connection between the external thread 412b and the threaded hole 411b. The translation drive 440 is activated, driving the connecting rod 412 to move backward away from the carrier 200. Through threaded transmission, the connecting seat 411 begins to rotate; the two sets of connecting seats 411 rotate synchronously, driving the two sets of carriers 200 to rotate synchronously. Refer to the reference. Figure 6The carrier 200 rotates 180°, so that both wafers are in a state where the B-side is facing up and the A-side is facing down. Since the first wafer a is facing the target 300, metal atoms can be deposited on the B-side of the first wafer a, thereby achieving the coating on the B-side of the first wafer.

[0095] Continue to refer to Figure 4 and Figure 5 Both sets of variant connection structures 410 are in the state where the key 412a is inserted into the keyway 411c. The rotation drive 430 is activated, and the first mounting plate 420 drives the two sets of carriers 100 to begin revolution. After the first mounting plate 420 rotates 180°, the positions of the two sets of carriers 100 are swapped. (Refer to reference...) Figure 6 After revolution, the second wafer b is located at the upper station, and the first wafer a is located at the lower station; both wafers are in a state where A-face is facing up and B-face is facing down. Since the second wafer b is facing the target material 300, metal atoms can be deposited on the A-face of the second wafer b, thereby achieving the coating on the A-face of the second wafer.

[0096] Continue to refer to Figure 4 and Figure 5 The translation drive 440 is activated, driving the connecting rod 412 forward toward the carrier 200. After the external thread 412b enters the threaded hole 411b, the connecting seat 411 begins to rotate through thread transmission; the two sets of connecting seats 411 rotate synchronously, driving the two sets of carriers 200 to rotate synchronously. (Refer to reference...) Figure 6 The carrier 200 rotates 180°, so that both wafers are in a state where the B-side is facing up and the A-side is facing down. Since the second wafer b is still facing the target 300, metal atoms can be deposited on the B-side of the second wafer b, thereby achieving the coating on the B-side of the second wafer.

[0097] At this point, both wafers have completed double-sided coating.

[0098] Furthermore, after the fourth coating is completed, the transposition mechanism is activated, and the two sets of carriers 200 revolve and exchange positions again, so that both wafers are now facing the target material 300 with their A-side facing the target. The two wafers are then reset to align their states.

[0099] After completing the double-sided coating of the two wafers, the first carrier 200A carries the first wafer a back to the upper station, and the second carrier 200B carries the second wafer b back to the lower station, so that both wafers are restored to the state of A-side up and B-side down.

[0100] This allows the wafer to return to its cavity state, facilitating downstream wafer processing or recording of wafer information.

[0101] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A single-sided alternating dual-station wafer double-sided coating apparatus, characterized in that, include: The working cavity (100) is used to provide space for wafer coating; Two sets of carriers (200) are arranged side by side in the working cavity (100) in a vertical direction. The carriers (200) are used to receive and fix the wafer. The target (300) is positioned above the two sets of carriers (200); A rotating mechanism is used to drive the carrier (200) to rotate so that the carrier (200) can rotate with the wafer, thereby realizing the flipping of the wafer; A switching mechanism is used to drive the two sets of said vehicles (200) to revolve so as to facilitate the exchange of positions between the two sets of said vehicles (200); The wafer includes an A-side and a B-side; Through the rotation mechanism, the wafer on the carrier (200) can be changed from facing the target (300) from side A to facing the target (300), or the wafer on the carrier (200) can be changed from facing the target (300) from side B to facing the target (300). The switching mechanism can exchange the positions of the two sets of carriers (200) and change the wafer on the carrier (200) from facing the target (300) from side A to facing the target (300) from side B to facing the target (300), or from facing the target (300) from side B to facing the target (300) from side A to facing the target (300).

2. The single-sided alternating dual-station wafer double-sided coating apparatus according to claim 1, characterized in that, The vehicle (200) includes: The receiving component (210) is used to support the wafer; A magnetic attractor (220) is used to abut against the receiving member (210) and can fix the wafer between the receiving member (210) and the magnetic attractor (220) by attracting the receiving member (210); The receiving component (210) has an open middle section to expose the B-side of the wafer; The magnetic chuck (220) is open in the middle to expose the A-side of the wafer.

3. The single-sided alternating dual-station wafer double-sided coating apparatus according to claim 2, characterized in that, The magnetic attractor (220) is equipped with an electromagnet. When the electromagnet is energized, the magnetic attractor (220) can attract the receiving part (210). An elastic element is provided between the receiving component (210) and the magnetic suction component (220). After the electromagnet is de-energized, the elastic element recovers and can push open the receiving component (210) and the magnetic suction component (220).

4. The single-sided alternating dual-station wafer double-sided coating apparatus according to claim 2, characterized in that, The carrier (200) also includes a motion drive assembly (230) for driving the receiving part (210) and the magnetic attractor (220) to move closer or further apart from each other.

5. The single-sided alternating dual-station wafer double-sided coating apparatus according to claim 1, characterized in that, Also includes: The main rotating support shaft (510) is rotatably mounted on the cavity wall of the working cavity (100); The second mounting plate (520) is disposed on the main rotating support shaft (510); Two sets of auxiliary rotating support shafts (530) are provided, and any one set of the auxiliary rotating support shafts (530) is rotatably mounted on the second mounting plate (520). The two sets of auxiliary rotating support shafts (530) are symmetrically arranged, and any one set of the carrier (200) is connected to one set of the auxiliary rotating support shafts (530).

6. The single-sided alternating dual-station wafer double-sided coating apparatus according to claim 5, characterized in that, The carrier (200) includes a receiving component (210) and a magnetic suction component (220). The magnetic suction component (220) is provided with an electromagnet, and an elastic element is provided between the receiving component (210) and the magnetic suction component (220). The main rotating support shaft (510) and the auxiliary rotating support shaft (530) are provided with wiring channels, and the cable of the electromagnet can be connected to an external power supply and controller through the wiring channels.

7. The single-sided alternating dual-station wafer double-sided coating apparatus according to any one of claims 1-6, characterized in that, Also includes: The connecting plate (401) is connected to the switching mechanism and can rotate within the working cavity (100) under the drive of the switching mechanism; The first transmission joint (402) is connected to one of the sets of said carriers (200) and is rotatably mounted on the connecting plate (401); The second transmission joint (403) is connected to another set of the carriers (200) and is also rotatably mounted on the connecting plate (401); When the connecting plate (401) rotates, the first transmission joint (402) and the second transmission joint (403) can carry the two sets of the carriers (200) to revolve around the rotation axis of the connecting plate (401); The rotating mechanism includes: The first rotary drive member (404) has a third transmission joint (405) at its movable end. The second rotary drive member (406) has a fourth transmission joint (407) at its movable end. The first translation drive (408) is used to drive the first rotation drive (404) to move closer to or away from the vehicle (200). The second translation drive (409) is used to drive the second rotation drive (406) to move closer to or away from the vehicle (200). When both sets of the vehicles (200) need to rotate, the first translation drive (408) drives the first rotation drive (404) to approach the vehicle (200), the second translation drive (409) drives the second rotation drive (406) to approach the vehicle (200), the third transmission joint (405) can engage with one of the first transmission joint (402) and the second transmission joint (403), and the fourth transmission joint (407) can engage with the other of the first transmission joint (402) and the second transmission joint (403); When the two sets of the vehicles (200) need to revolve, the first translation drive (408) drives the first rotation drive (404) away from the vehicle (200), and the second translation drive (409) drives the second rotation drive (406) away from the vehicle (200), thereby avoiding interference between the first rotation drive (404) and the second rotation drive (406) on the rotation of the connecting plate (401).

8. The single-sided alternating dual-station wafer double-sided coating apparatus according to any one of claims 1-6, characterized in that, Also includes: Two sets of variant connection structures (410), wherein any one of the carriers (200) is connected to one of the variant connection structures (410); The first mounting plate (420) is used to connect the two sets of the variant connection structures (410). The variant connection structure (410) includes: A connecting seat (411) is used to connect a set of the carriers (200). The connecting seat (411) is provided with a clearance cavity (411a). The end of the connecting seat (411) away from the carrier (200) is also provided with a threaded hole (411b). The threaded hole (411b) communicates with the clearance cavity (411a). The threaded hole (411b) is also provided with a keyway (411c). The keyway (411c) extends horizontally toward the carrier (200). A connecting rod (412) is connected to the first mounting plate (420) and inserted into the connecting seat (411). The front section of the connecting rod (412) is provided with a key (412a). The key (412a) extends coaxially with the keyway (411c). The key (412a) can enter the clearance cavity (411a) along the keyway (411c). The rear section of the connecting rod (412) is provided with an external thread (412b). After the key (412a) enters the clearance cavity (411a), the external thread (412b) can be threadedly connected to the threaded hole (411b). The single-sided alternating dual-station wafer double-sided coating apparatus also includes: A rotary drive (430) is used to drive the first mounting plate (420) to rotate; Translation drive (440) is used to drive the first mounting plate (420) to move along the extension direction of the keyway (411c); When the shifting mechanism is required to work, the key (412a) is inserted into the keyway (411c), and the rotary drive (430) drives the first mounting plate (420) to rotate, and the two sets of the variant connection structures (410) revolve and exchange positions. When the rotating mechanism is required to work, the key (412a) leaves the keyway (411c) and enters the clearance cavity (411a). The translation drive (440) continues to drive the first mounting plate (420) and drive the connecting rod (412) to translate toward the carrier (200). Through threaded transmission, the connecting seat (411) rotates.

9. A coating method, which can be implemented using the single-sided alternating dual-station wafer double-sided coating apparatus according to any one of claims 1-8, characterized in that, Includes the following steps: Two sets of carriers (200) each fix a wafer, and both wafers are in a state where surface A faces the target material (300); The first coating is performed on the A-side of the first wafer on the substrate. The rotation mechanism is activated, and the two sets of carriers (200) rotate, so that both wafers are transformed into a state where the B side faces the target material (300); The second coating is then performed, and the coating is completed on the B side of the first wafer; The switching mechanism is activated, and the two sets of carriers (200) revolve and exchange positions, so that both wafers are transformed into a state where surface A faces the target material (300); The third coating is then performed, and the coating on side A of the second wafer is completed. The rotation mechanism is activated, and the two sets of carriers (200) rotate, so that both wafers are transformed into a state where the B side faces the target material (300); The fourth coating process is performed, and the B-side of the second wafer is now coated.

10. The coating method according to claim 9, characterized in that, After the fourth coating is completed, the switching mechanism is activated, and the two sets of carriers (200) revolve and exchange positions again, so that both wafers are changed to face A facing the target material (300); The two wafers are reset to facilitate the correction of their state.

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