Radiator, control method of radiator and radiating system

Abstract

The invention relates to the technical field of radiators, and particularly discloses a radiator, a control method of the radiator and a radiating system. The radiator comprises a fan structure, piezoelectric patches and a driving control circuit, the fan structure comprises a connecting part, a plurality of connecting rods and a plurality of fan blades, each fan blade is provided with one piezoelectric patch, the driving control circuit comprises sine wave units in one-to-one correspondence with the piezoelectric patches, and the sine wave units are electrically connected with the piezoelectric patches. The sine wave units are used for outputting sine alternating current signals for driving the piezoelectric patches corresponding to the sine wave units to vibrate; the control method of the radiator comprises the following steps: controlling the phase difference of sine alternating current signals output by sine wave units corresponding to two adjacent piezoelectric patches to be 2pi / N, wherein N is the total number of the piezoelectric patches; in addition, the phases of sine alternating current signals output by the sine wave units corresponding to the plurality of piezoelectric patches are sequentially increased or decreased along the hour hand direction. By using the control method of the radiator, the radiator can be controlled to generate cyclonic vortex, and the radiating performance of the radiator is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and in particular to a radiator, a radiator control method and a heat dissipation system. Background Art

[0002] In recent years, the computing power of microelectronic chips has been continuously improved under the continuous demand of the Internet of Things and intelligent systems, resulting in a continuous increase in chip power consumption, which makes the heat generated by the chips during operation more and more. In order to solve the heat dissipation problem, a radiator is usually set to dissipate the heat.

[0003] At present, in order to be suitable for microchips, a series of piezoelectric driven heat dissipation devices have been developed. These heat dissipation devices generally include multiple parallel and spaced heat dissipation fins. The piezoelectric sheet is placed on the heat dissipation fins, and the piezoelectric effect of the piezoelectric sheet drives the heat dissipation fins to vibrate to form air convection to achieve heat dissipation of the chip. However, the air volume generated by this heat dissipation device is small, and the heat dissipation performance is not high, which is difficult to meet the heat dissipation requirements of microchips with high power consumption.

[0004] Therefore, it is urgent to provide a radiator, a control method of the radiator and a heat dissipation system to solve the above technical problems. Summary of the invention

[0005] According to one aspect of the present invention, the present invention provides a control method for a radiator. The control method for a radiator can be used to control a radiator having a plurality of circumferentially arranged blades to generate a cyclonic vortex, thereby improving the heat dissipation performance of the radiator.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] The control method of the radiator is used to control the operation of the radiator.

[0008] The heat sink includes a fan structure, a piezoelectric sheet and a drive control circuit. The fan structure includes a connecting portion, a plurality of connecting rods and a plurality of fan blades. The plurality of connecting rods are arranged at intervals along the circumference of the connecting portion. One side of each connecting rod is provided with a fan blade, and each fan blade is provided with a piezoelectric sheet. The drive control circuit includes a sine wave unit corresponding to each piezoelectric sheet one by one. The sine wave unit is electrically connected to the piezoelectric sheet, and the sine wave unit is used to output a sine AC signal that drives the corresponding piezoelectric sheet to vibrate.

[0009] The control method of the radiator comprises:

[0010] The phase difference of the sinusoidal AC signals output by the sinusoidal wave units corresponding to two adjacent piezoelectric sheets is controlled to be 2π / N, where N is the total number of piezoelectric sheets; and the phases of the sinusoidal AC signals output by the sinusoidal wave units corresponding to multiple piezoelectric sheets increase or decrease successively in a clockwise or counterclockwise direction.

[0011] Optionally, the radiator control method further includes:

[0012] Determine the number of fan blades that need to work according to the heat dissipation requirement, and arrange the number of fan blades that need to work at intervals along the circumference of the connecting portion;

[0013] The driving control circuit is controlled to drive the piezoelectric sheets corresponding to the plurality of blades that need to work to vibrate.

[0014] Optionally, the number of the fan blades is greater than or equal to 4.

[0015] According to another aspect of the present invention, the present invention further provides a radiator, which is controlled by using any of the above-mentioned control methods for the radiator.

[0016] Optionally, the radiator further comprises a body, a ventilation hole is provided in the middle of the body, the connecting portion is located at the center of the ventilation hole, and one end of the connecting rod away from the connecting portion is connected to the inner peripheral wall of the ventilation hole.

[0017] Optionally, a first conductive sheet is provided on the connecting portion, a second conductive sheet corresponding to the piezoelectric sheets one by one is provided on the main body in the circumferential direction of the ventilation hole, and a third conductive sheet is also provided on the main body; one of the positive and negative electrodes of each piezoelectric sheet is electrically connected to the first conductive sheet, and the other is electrically connected to the corresponding second conductive sheet, the third conductive sheet is electrically connected to the first conductive sheet, and the third conductive sheet and the second conductive sheet are used to be electrically connected to the sinusoidal wave unit.

[0018] Optionally, the body includes a first end face for contacting the heat dissipation element and a second end face corresponding to the first end face, the ventilation hole passes through the first end face and the second end face, and the connecting rod is arranged on a side of the ventilation hole close to the second end face and is flush with the second end face.

[0019] Optionally, the area of ​​the fan blade is 25%-70% of the area of ​​the fan shape enclosed by two adjacent connecting rods and the inner peripheral wall of the ventilation hole; and / or the thickness of the main body is 200μm-750μm.

[0020] Optionally, the piezoelectric sheet is provided with one or more layers.

[0021] According to another aspect of the present invention, the present invention further provides a heat dissipation system, comprising at least one radiator as described in any of the above technical solutions, at least one of the radiators covers a component to be cooled.

[0022] The beneficial effects of the present invention are:

[0023] The present invention provides a heat sink, including a fan structure, a piezoelectric sheet and a drive control circuit. The piezoelectric sheet is powered by an external power supply. When powered on, the piezoelectric sheet can vibrate due to its own characteristics, thereby driving the fan blades to vibrate. The fan blade vibration drives the gas flow around the chip on which the heat sink acts, thereby achieving the purpose of cooling the chip. The heat dissipation method of driving each fan blade to vibrate individually by the piezoelectric sheet greatly simplifies the structure of the heat sink, which can not only make the size of the heat sink smaller, suitable for micro-chips at the micron level, but also reduce power consumption and noise.

[0024] The present invention also provides a control method for a radiator, which is used to drive the radiator to generate a stable cyclonic vortex, thereby improving the heat dissipation performance of the radiator.

[0025] The present invention also provides a heat dissipation system, comprising at least one heat sink as described above, wherein at least one heat sink covers a chip. Due to the use of the heat sink as described above, the heat dissipation system has a small overall volume, is suitable for microchips, and has a good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of a heat sink from one viewing angle provided by an embodiment of the present invention;

[0027] Figure 2 A schematic structural diagram of a heat sink from another perspective provided by an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the structure of a heat dissipation system provided in an embodiment of the present invention.

[0029] In the figure:

[0030] 10. Radiator; 100. Main body; 110. Ventilation hole; 120. Connecting part; 130. Connecting rod; 140. Fan blade; 150. First conductive sheet; 160. Second conductive sheet; 170. Third conductive sheet; 200. Piezoelectric sheet; 20. Heat dissipation system. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] Embodiment 1

[0036] The present embodiment provides a control method for a radiator. The control method for a radiator can be used to control a radiator having a plurality of circumferentially arranged blades to generate a cyclonic vortex, thereby improving the heat dissipation performance of the radiator.

[0037] Specifically, if Figure 1As shown, the radiator 10 controlled by the control method of the radiator includes a fan structure, a piezoelectric sheet 200 and a drive control circuit (not shown in the figure). The fan structure includes a connecting portion 120, a plurality of connecting rods 130 and a plurality of fan blades 140, wherein the plurality of connecting rods 130 are arranged at intervals along the circumference of the connecting portion 120, a fan blade 140 is provided on one side of each connecting rod 130, and a piezoelectric sheet 200 is provided on each fan blade 140.

[0038] It is worth noting that the piezoelectric sheet 200 is a type of electronic material with piezoelectric properties. The inverse piezoelectric effect is a type of piezoelectric effect, which refers to applying an electric field to the polarization direction of the piezoelectric sheet 200 with piezoelectric properties, and the electric field controls the deformation of the piezoelectric sheet 200, so that the piezoelectric sheet 200 generates mechanical deformation or mechanical pressure in a certain direction.

[0039] Therefore, the heat sink 10 provided in this embodiment supplies power to the piezoelectric sheet 200 through an external power supply. When the piezoelectric sheet 200 is powered on, due to its own characteristics, it can vibrate, thereby driving the fan blades 140 to vibrate. The vibration of the fan blades 140 will drive the gas flow around the chip acted by the heat sink 10, thereby achieving the purpose of heat dissipation of the chip (or other heat dissipation parts). The heat dissipation method of driving each fan blade 140 to vibrate individually by the piezoelectric sheet 200 greatly simplifies the structure of the heat sink 10, which can not only make the size of the heat sink 10 smaller, suitable for micro-chips at the micron level, but also reduce power consumption and noise.

[0040] The driving control circuit includes a sine wave unit corresponding to each piezoelectric sheet 200, the sine wave unit is electrically connected to the piezoelectric sheet 200, and the sine wave unit is used to output a sine AC signal that drives the corresponding piezoelectric sheet 200 to vibrate. The control method of the radiator includes:

[0041] The phase difference of the sinusoidal AC signals output by the sinusoidal wave units corresponding to two adjacent piezoelectric sheets 200 is controlled to be 2π / N, where N is the total number of piezoelectric sheets 200; and, in a clockwise or counterclockwise direction, the phases of the sinusoidal AC signals output by the sinusoidal wave units corresponding to multiple piezoelectric sheets 200 increase or decrease successively.

[0042] By controlling the radiator 10 through the control method of the radiator, a stable cyclonic vortex can be generated, thereby improving the heat dissipation performance of the radiator 10.

[0043] Optionally, the number of the fan blades 140 is greater than or equal to 4, that is, the total number N of the piezoelectric sheets 200 is greater than or equal to 4. With such a configuration, the heat dissipation effect is better. In this embodiment, the number of the fan blades 140 is 9.

[0044] Furthermore, the control method of the radiator also includes:

[0045] Determine the number of fan blades 140 that need to work according to the heat dissipation requirement, and the number of fan blades 140 that need to work are arranged at intervals along the circumference of the connecting portion 120;

[0046] The control circuit drives the piezoelectric sheets 200 corresponding to the plurality of blades 140 that need to work to vibrate.

[0047] For example, if the total number of blades 140 is 9, the number of working blades 140 may be three, with two blades 140 spaced between two adjacent blades 140. That is, the number of inactive blades 140 spaced between two adjacent blades 140 is equal among the blades 140 that need to be working.

[0048] Of course, all the fan blades 140 may also be controlled to operate.

[0049] Embodiment 2

[0050] This embodiment provides a radiator 10, which is controlled by the radiator control method provided in the first embodiment.

[0051] In this embodiment, the structure of the radiator 10 is substantially the same as the structure of the radiator 10 controlled by the control method of the radiator provided in the first embodiment, and only an improvement is made on the basis of the first embodiment. Therefore, only the differences between the two are described here, and the structures of this embodiment that are the same as those of the first embodiment are not repeated here. In this embodiment, the same or corresponding technical features as those of the first embodiment are marked with the same reference numerals.

[0052] Specifically, see Figure 1 and Figure 2 The heat sink 10 further includes a body 100, a ventilation hole 110 is provided in the middle of the body 100, a connecting portion 120 is located at the center of the ventilation hole 110, and an end of the connecting rod 130 away from the connecting portion 120 is connected to the inner peripheral wall of the ventilation hole 110. The body 100 is used to be fixed on the heat dissipation component to be cooled. Optionally, in a possible embodiment, the body 100, the connecting portion 120, the connecting rod 130 and the fan blade 140 are all integrated structures and are processed by MEMS processing technology.

[0053] Optionally, the connecting rod 130 may be an integrated structure with the fan blade 140. The connecting rod 130 has a certain elastic deformation capability, and during the swinging process of the fan blade 140, the connection between the connecting rod 130 and the fan blade 140 will deform to ensure the reliable swinging of the fan blade 140.

[0054] Optionally, a plurality of connecting rods 130 may be arranged at equal intervals along the circumference of the connecting portion 120. Such an arrangement is, on the one hand, convenient for processing; on the other hand, convenient for controlling the heat dissipation air volume.

[0055] Furthermore, according to the vibration amplitude requirement of the fan blade 140, a single layer of piezoelectric sheet 200 may be provided, or multiple layers of piezoelectric sheet 200 may be provided. Optionally, the material of the piezoelectric sheet 200 may be a PZT film.

[0056] Further, see Figure 1 , a first conductive sheet 150 is provided on the connecting portion 120, a second conductive sheet 160 corresponding to the piezoelectric sheet 200 is provided on the main body 100 in the circumferential direction of the ventilation hole 110, and a third conductive sheet 170 is also provided on the main body 100. One of the positive and negative electrodes of each piezoelectric sheet 200 is electrically connected to the first conductive sheet 150, and the other is electrically connected to the corresponding second conductive sheet 160, and the third conductive sheet 170 is electrically connected to the first conductive sheet 150. When the heat sink 10 is in use, the third conductive sheet 170 and the second conductive sheet 160 are used to be electrically connected to the sine wave unit. By arranging the first conductive sheet 150 on the connecting portion 120, it is convenient to electrically connect each piezoelectric sheet 200 to an electrode of the sine wave unit. By arranging the third conductive sheet 170 to be electrically connected to the first conductive sheet 150, the problem of difficult wiring in the middle is solved.

[0057] Optionally, the leads electrically connecting the piezoelectric sheet 200 and the first conductive sheet 150 , the leads electrically connecting the piezoelectric sheet 200 and the second conductive sheet 160 , and the leads electrically connecting the first conductive sheet 150 and the third conductive sheet 170 can all be processed by bonding.

[0058] Further, see Figure 2 The body 100 includes a first end face for contacting the heat dissipation element and a second end face corresponding to the first end face, the ventilation hole 110 passes through the first end face and the second end face, and the connecting rod 130 is arranged on the side of the ventilation hole 110 close to the second end face and is flush with the second end face. Such arrangement, on the one hand, allows the fan blade 140 to be as far away from the heat dissipation element as possible, provides a larger space for the vibration of the fan blade 140, and is conducive to improving the heat dissipation effect of the heat sink 10; on the other hand, it is easy to process.

[0059] Further, see Figure 1 In order to increase the air volume generated when the fan blade 140 is fanning, the area of ​​the fan blade 140 is 25%-70% of the area of ​​the fan shape enclosed by the inner peripheral wall of the two adjacent connecting rods 130 and the ventilation hole 110.

[0060] Optionally, the thickness of the body 100 is 200 μm-750 μm. The body 100 is relatively small in size and can be suitable for heat dissipation of micro-chips at the micron level.

[0061] The heat sink 10 provided in this embodiment has a compact and simple structure, a volume of micrometer level, occupies a small space, is easy to process, and is conducive to mass production. Each fan blade 140 can be independently controlled, and the swinging motion of multiple fan blades 140 drives the airflow to generate a cyclone, which gets rid of the complex design constraints of achieving stable rotational motion at the micrometer level, has a simple structure, and reduces costs. The airflow generated by the heat sink 10 has a variable flow direction, controllable flow, low power consumption, low noise, and high compatibility with microelectronic chips.

[0062] Embodiment 3

[0063] This embodiment provides a heat dissipation system 20, comprising at least one heat sink 10 provided in the second embodiment, and at least one heat sink 10 covers a component to be cooled.

[0064] like Figure 3 As shown, in one embodiment, a plurality of heat sinks 10 are provided, and the plurality of heat sinks 10 are arranged in an array. By arranging a plurality of heat sinks 10 to dissipate heat for the same heat dissipation component, the heat dissipation performance of the heat dissipation system 20 is better.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A radiator control method, used to control the operation of a radiator (10), characterized in that: The heat sink (10) comprises a fan structure, a piezoelectric sheet (200) and a drive control circuit. The fan structure comprises a connecting portion (120), a plurality of connecting rods (130) and a plurality of fan blades (140). The plurality of connecting rods (130) are arranged at intervals along the circumference of the connecting portion (120). A fan blade (140) is provided on one side of each connecting rod (130). A piezoelectric sheet (200) is provided on each fan blade (140). The drive control circuit comprises a sine wave unit corresponding to each piezoelectric sheet (200) on a one-to-one basis. The sine wave unit is electrically connected to the piezoelectric sheet (200). The sine wave unit is used to output a sine AC signal for driving the corresponding piezoelectric sheet (200) to vibrate. The control method of the radiator comprises: The phase difference of the sinusoidal AC signals output by the sinusoidal wave units corresponding to two adjacent piezoelectric sheets (200) is controlled to be 2π / N, where N is the total number of the piezoelectric sheets (200); and, in a clockwise or counterclockwise direction, the phases of the sinusoidal AC signals output by the sinusoidal wave units corresponding to the plurality of piezoelectric sheets (200) are increased or decreased in sequence.

2. The control method of the radiator according to claim 1, characterized in that: The control method of the radiator further includes: Determining a plurality of the fan blades (140) that need to be operated according to heat dissipation requirements, wherein the plurality of the fan blades (140) that need to be operated are arranged at intervals along the circumference of the connecting portion (120); The driving control circuit is controlled to drive the piezoelectric sheets (200) corresponding to the plurality of fan blades (140) that need to work to vibrate.

3. The control method of the radiator according to claim 1, characterized in that: The number of the fan blades (140) is greater than or equal to 4.

4. A heat sink, characterized in that: The radiator is controlled by the control method of any one of claims 1 to 3.

5. The heat sink according to claim 4, characterized in that: The radiator (10) further comprises a body (100), a ventilation hole (110) being provided in the middle of the body (100), the connecting portion (120) being located at the center of the ventilation hole (110), and one end of the connecting rod (130) away from the connecting portion (120) being connected to the inner peripheral wall of the ventilation hole (110).

6. The heat sink according to claim 5, characterized in that: A first conductive sheet (150) is provided on the connecting portion (120), and a second conductive sheet (160) corresponding to the piezoelectric sheet (200) is provided on the main body (100) in the circumferential direction of the ventilation hole (110), and a third conductive sheet (170) is also provided on the main body (100); one of the positive and negative electrodes of each piezoelectric sheet (200) is electrically connected to the first conductive sheet (150), and the other is electrically connected to the corresponding second conductive sheet (160), the third conductive sheet (170) is electrically connected to the first conductive sheet (150), and the third conductive sheet (170) and the second conductive sheet (160) are used to be electrically connected to the sinusoidal wave unit.

7. The heat sink according to claim 5, characterized in that: The body (100) comprises a first end face for contacting a heat dissipation element and a second end face corresponding to the first end face, the ventilation hole (110) passes through the first end face and the second end face, and the connecting rod (130) is arranged on a side of the ventilation hole (110) close to the second end face and flush with the second end face.

8. The heat sink according to claim 5, characterized in that The area of ​​the fan blade (140) is 25%-70% of the area of ​​the fan shape enclosed by the inner peripheral wall of the two adjacent connecting rods (130) and the ventilation hole (110); and / or the thickness of the main body (100) is 200μm-750μm.

9. The heat sink according to claim 4, characterized in that: The piezoelectric sheet (200) is provided with one or more layers.

10. A heat dissipation system, characterized in that: The invention comprises at least one heat sink (10) according to any one of claims 4 to 9, wherein at least one of the heat sinks (10) covers a component to be cooled.

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