Elastic interposer and conductive device thereof

Abstract

The invention provides an elastic interposer including a flexible substrate and a conductive device. The flexible substrate comprises a plurality of circuits, the first ends of the circuits are exposed on the first surface of the flexible substrate, and the second ends of the circuits are exposed on the second surface of the flexible substrate. The first ends of the circuits are in a first pattern on the first surface, the second ends of the circuits are in a second pattern on the second surface, and the first pattern is different from the second pattern. The conductive device includes a first flexible conductive member and a second flexible conductive member. The first flexible conductive piece is arranged on the first surface of the flexible substrate and comprises a plurality of first elastic conductive parts. The first elastic conductive parts are electrically connected with the first ends of the circuits. The second flexible conductive member is arranged on the second surface of the flexible substrate and comprises a plurality of second elastic conductive parts. The second elastic conductive parts are electrically connected with the second ends of the circuits.

Description

Technical Field

[0001] The present disclosure relates to an elastic intermediary layer, and in particular to a soft elastic intermediary layer and a conductive device thereof. Background Art

[0002] Various integrated circuit chips need to be tested for electrical properties during the manufacturing process. When the DUT needs to be tested for high-frequency signals, the shorter the circuit path for signal transmission, the more reliable the test effect. In the existing technology, space transformation substrates or pogo pins are often used to transmit high-frequency test signals between the DUT and the circuit board.

[0003] However, due to the inherent mechanical characteristics of the spring pin, it is not easy to reduce its size, so it is difficult to provide a shorter signal transmission path. In addition, due to the difficulty and cost of the process, it is also difficult to provide a shorter signal transmission path for the use of the space conversion substrate. Furthermore, since the existing space conversion substrates are all made of hard materials, the flexibility and flexibility they can provide are limited, so it is easy to cause damage to the object under test when contacting the object under test. Therefore, how to provide a structure with a short signal transmission path and high flexibility to stably transmit high-frequency test signals between the object under test and the circuit board is a problem that needs to be solved in this field.

[0004] The above “prior art” description is only to provide background technology, and does not admit that the above “prior art” description reveals the subject matter of the present disclosure, does not constitute the prior art of the present disclosure, and any description of the above “prior art” should not be regarded as any part of this case. Summary of the invention

[0005] In view of this, an object of the present disclosure is to provide an elastic interposer with a relatively short conductive path and high flexibility and high flexibility.

[0006] One embodiment of the present disclosure provides an elastic interposer, comprising a flexible substrate and a conductive device. The flexible substrate comprises a plurality of circuits. The first ends of the circuits are exposed to the first surface of the flexible substrate, and the second ends of the circuits are exposed to the second surface of the flexible substrate. The first ends of the circuits are in a first style on the first surface, and the second ends of the circuits are in a second style on the second surface, and the first style is different from the second style. The conductive device comprises a first flexible conductive member and a second flexible conductive member. The first flexible conductive member is disposed on the first surface of the flexible substrate, and comprises a plurality of first elastic conductive portions. The first ends of the first elastic conductive portions are exposed to the third surface of the first flexible conductive portion, and the second ends of the first elastic conductive portions are exposed to the fourth surface of the first flexible conductive portion and are electrically connected to the first ends of the circuits. The second flexible conductive member is disposed on the second surface of the flexible substrate, and comprises a plurality of second elastic conductive portions. The first ends of the second elastic conductive portions are exposed to the fifth surface of the second flexible conductive portion and are electrically connected to the second ends of the circuits, and the second ends of the second elastic conductive portions are exposed to the sixth surface of the second flexible conductive portion.

[0007] Another embodiment of the present disclosure provides a conductive device of an elastic intermediary layer, comprising a first soft conductive member and a second soft conductive member. The first soft conductive member is disposed on a first surface of a soft substrate, comprising a first soft body and a plurality of first elastic conductive portions. The first elastic conductive portions are disposed on the first soft body to electrically connect the first ends of the plurality of circuits of the soft substrate. The second soft conductive member is disposed on a second surface of the soft substrate, comprising a second soft body and a plurality of second elastic conductive portions. The second elastic conductive portions are disposed on the second soft body to electrically connect the second ends of the circuits of the soft substrate. The first ends of the circuits are exposed to the first surface and present a first style on the first surface, and the second ends of the circuits are exposed to the second surface and present a second style on the second surface, and the first style is different from the second style.

[0008] Accordingly, since the components of the elastic intermediate layer of the present invention are all soft, the overall flexibility and flexibility can be greatly improved, and the two soft conductive parts of the conductive device of the present invention can be made by filling a metal conductive part in a sheet-like soft insulating material (for example: conductive paste) to provide a relatively short conductive path between the object to be tested and the circuit board.

[0009] The above has outlined the technical features and advantages of the present disclosure in a fairly broad manner, so that the detailed description of the present disclosure below can be better understood. Other technical features and advantages that constitute the subject matter of the claims of the present disclosure will be described below. It should be understood by those with ordinary knowledge in the technical field to which the present disclosure belongs that the concepts and specific embodiments disclosed below can be used to modify or design other structures or processes to achieve the same purpose as the present disclosure. It should also be understood by those with ordinary knowledge in the technical field to which the present disclosure belongs that such equivalent constructions cannot depart from the spirit and scope of the present disclosure as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] A more complete understanding of the disclosure of the present application may be obtained by referring to the embodiments and claims in conjunction with the drawings, in which the same reference numerals refer to the same elements.

[0011] Figure 1A is a schematic diagram of an elastic interposer according to some embodiments of the present disclosure.

[0012] Figure 1B is a schematic diagram of an elastic interposer according to some embodiments of the present disclosure.

[0013] Figure 1C is a top view of a flexible substrate according to some embodiments of the present disclosure.

[0014] Figure 1D is a bottom view of a flexible substrate according to some embodiments of the present disclosure.

[0015] Figure 2A is a schematic diagram of an elastic interposer according to some embodiments of the present disclosure.

[0016] Figure 2B is a schematic diagram of an elastic interposer according to some embodiments of the present disclosure.

[0017] Figure 2C is a bottom view of the first soft conductive member of some embodiments of the present disclosure.

[0018] Figure 2D is a top view of a flexible substrate according to some embodiments of the present disclosure.

[0019] Figure 2E is a bottom view of a flexible substrate according to some embodiments of the present disclosure.

[0020] Figure 2F is a top view of the second soft conductive member of some embodiments of the present disclosure.

[0021] Figure 2G It is an enlarged schematic diagram of the first soft conductive member of the conductive device of some embodiments of the present disclosure.

[0022] Figure 2HIt is an enlarged schematic diagram of the second conductive member of the conductive device of some embodiments of the present disclosure.

[0023] The reference numerals are described as follows:

[0024] 1: Elastic intermediary layer

[0025] 11: Flexible substrate

[0026] 11S1: Side 1

[0027] 11S2: Side 2

[0028] 111: Circuit

[0029] 111A: First end

[0030] 111B: Second end

[0031] 13: Conductive device

[0032] 131: First soft conductive member

[0033] 131C: first elastic conductive portion

[0034] 133: Second soft conductive member

[0035] 133C: Second elastic conductive portion

[0036] 91: Object under test

[0037] 913: Contact

[0038] 93: Rigid substrate

[0039] 931: Contact

[0040] A1: Unit area

[0041] 2: Elastic intermediary layer

[0042] 21: Flexible substrate

[0043] 21S1: Side 1

[0044] 21S2: Side 2

[0045] 211: Circuit

[0046] 211A: First End

[0047] 211B: Second end

[0048] 23: Conductive device

[0049] 231: First soft conductive member

[0050] 231C: first elastic conductive part

[0051] 231C1: First End

[0052] 231C2: Second end

[0053] 231S1: Side 3

[0054] 231S2: Side 4

[0055] 2311: The first soft subject

[0056] 233: Second soft conductive member

[0057] 233C: Second elastic conductive part

[0058] 233C1: First end

[0059] 233C2: Second end

[0060] 233S1: Side 5

[0061] 233S2: Side 6

[0062] 2331: Second soft subject

[0063] 81: Object under test

[0064] 813: Contact

[0065] 83: Rigid substrate

[0066] 831: Contact

[0067] A2: Unit area

[0068] V2: unit volume

[0069] P21: First Style

[0070] P22: Second Style

[0071] P23: The third style

[0072] P24: The fourth style DETAILED DESCRIPTION

[0073] The following description of the present disclosure is accompanied by the drawings which are incorporated into and constitute a part of the specification, and illustrates an embodiment of the present disclosure, but the present disclosure is not limited to the embodiment. In addition, the following embodiments can be properly integrated to complete another embodiment.

[0074] "One embodiment", "an embodiment", "illustrative embodiment", "another embodiment", "another embodiment", etc. mean that the embodiments described in the present disclosure may include specific features, structures or characteristics, but not every embodiment must include the specific features, structures or characteristics. Furthermore, repeated use of the phrase "in an embodiment" does not necessarily refer to the same embodiment, but may refer to the same embodiment.

[0075] In order to make the present disclosure fully understood, the following description provides detailed steps and structures. Obviously, the implementation of the present disclosure will not be limited to the specific details known to those skilled in the art. In addition, the known structures and steps are no longer described in detail to avoid unnecessarily limiting the present disclosure. The preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure can also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the content of the detailed description, but is defined by the claims.

[0076] It should be understood that the following disclosure provides many different embodiments or examples for implementing different features of the present invention. Specific embodiments or examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, the size of the element is not limited to the disclosed range or value, but may depend on the process conditions and / or the desired properties of the device. In addition, the following description of forming a first feature "on" or "on" a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. For the sake of simplicity and clarity, various features can be drawn arbitrarily at different scales. In the accompanying drawings, some layers / features may be omitted for simplicity.

[0077] Furthermore, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature shown in the figures to another (other) element or feature. The spatially relative terms are intended to encompass different orientations of the elements in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0078] The elastic intermediary layer of the embodiment of the present disclosure includes a flexible substrate and a conductive device. The conductive device has two flexible conductive parts. One of the two flexible conductive parts is arranged on one side of the flexible substrate, and is used to connect the circuit contacts of the flexible substrate and the circuit contacts of the object to be tested; the other flexible conductive part is placed on the other side of the flexible substrate, and is used to connect the circuit contacts of the flexible substrate and the circuit contacts of the circuit board. Accordingly, since the flexible substrate and the flexible conductive part of the elastic intermediary layer are both soft, the overall flexibility and flexibility can be greatly improved, so that the impact caused by various physical contacts can be absorbed and buffered to reduce damage to the object to be tested. In addition, the soft conductive part is made by filling a metal conductive part (for example: conductive glue, conductive paste) in a thin sheet-like soft insulating material, which effectively reduces the overall thickness of the elastic intermediary layer and provides a relatively short conductive path between the object to be tested and the circuit board. The detailed structure and description are shown in the following embodiments.

[0079] refer to Figure 1A and Figure 1B . Figure 1A is a schematic diagram of an elastic intermediary layer 1 according to some embodiments of the present disclosure. Figure 1B is another schematic diagram of an elastic intermediary layer 1 of some embodiments of the present disclosure. Specifically, the elastic intermediary layer 1 includes a flexible substrate 11 and a conductive device 13. The flexible substrate 11 includes a plurality of circuits 111 and has a first surface 11S1 and a second surface 11S2. The conductive device 13 includes a first flexible conductive member 131 and a second flexible conductive member 133. The first flexible conductive member 131 is disposed on the first surface 11S1 of the flexible substrate 11 and includes a plurality of first elastic conductive portions 131C. The second flexible conductive member 133 is disposed on the second surface 11S2 of the flexible substrate 11 and includes a plurality of second elastic conductive portions 133C. In some embodiments, the first elastic conductive portion 131C may be flexible, and the second elastic conductive portion 133C may also be flexible.

[0080] In some embodiments, the circuit 111 of the flexible substrate 11 has a first end 111A and a second end 111B. The first end 111A of the circuit 111 is exposed to the first surface 11S1 of the flexible substrate 11 and is electrically connected to the first elastic conductive portion 131C of the first flexible conductive member 131. The second end 111B of the circuit 111 is exposed to the second surface 11S2 of the flexible substrate 11 and is electrically connected to the second elastic conductive portion 133C of the second flexible conductive member 133.

[0081] Please refer to Figure 1C and Figure 1D . Figure 1C 1 is a top view of the flexible substrate 11 according to some embodiments of the present disclosure. Figure 1D1 is a bottom view of the flexible substrate 11 of some embodiments of the present disclosure. In some embodiments, the first end 111A of the circuit 111 presents a first style on the first surface 11S1 of the flexible substrate 11, and the second end 111B of the circuit 111 presents a second style on the second surface 11S2 of the flexible substrate 11, and the first style is different from the second style. In other words, the layout and trace of the circuit 111 change from the first end 111A through the flexible substrate 11 to the second end 111B, so the first style presented by the first end 111A on the first surface 11S1 is different from the second style presented by the second end 111B on the second surface 11S2.

[0082] In some embodiments, the density of the first end 111A of the circuit 111 within a unit area A1 is greater than the density of the second end 111B of the circuit 111 within the same unit area A1. In other words, within the unit area A1 of the same size, the density of the first end 111A of the circuit 111 is denser, and the density of the second end 111B of the circuit 111 is sparser.

[0083] In some embodiments, the minimum distance between any two first ends 111A in the first pattern is smaller than the minimum distance between any two second ends 111B in the second pattern. In some embodiments, excluding the more extreme (far away from the center or the edge) first ends 111A in the first pattern and excluding the more extreme (far away from the center or the edge) second ends 111B in the second pattern, the minimum distance between any two first ends 111A in the first pattern is smaller than the minimum distance between any two second ends 111B in the second pattern. In some embodiments, excluding the dummy contacts in the first pattern and excluding the dummy contacts in the second pattern, the minimum distance between any two first ends 111A in the first pattern is smaller than the minimum distance between any two second ends 111B in the second pattern.

[0084] In some embodiments, the first elastic conductive portion 131C of the first soft conductive member 131 is further used to electrically contact with a plurality of contacts 913 of a DUT 91, and the second elastic conductive portion 133C of the second soft conductive member 133 is further used to electrically contact with a plurality of contacts 931 of a rigid substrate 93. In this way, the electrical path generated by the circuit 111 of the elastic intermediary layer 1, the first elastic conductive portion 131C, and the second elastic conductive portion 133C can be used to transmit a test signal (e.g., a high-frequency test signal) between the DUT 91 and the rigid substrate 93.

[0085] refer to Figure 2A and Figure 2B . Figure 2A is a schematic diagram of an elastic intermediary layer 2 according to some embodiments of the present disclosure. Figure 2B2 is another schematic diagram of an elastic interposer 2 according to some embodiments of the present disclosure. Specifically, the elastic interposer 2 includes a flexible substrate 21 and a conductive device 23. The flexible substrate 21 includes a plurality of circuits 211 and has a first surface 21S1 and a second surface 21S2. For example, the flexible substrate 21 may be a flexible circuit board, and the plurality of circuits 211 may be conductive traces in the flexible circuit board.

[0086] In some embodiments, the conductive device 23 includes a first soft conductive member 231 and a second soft conductive member 233. The first soft conductive member 231 has a third surface 231S1 and a fourth surface 231S2, and the second soft conductive member 233 has a fifth surface 233S1 and a sixth surface 233S2. The first soft conductive member 231 includes a first soft body 2311 and a plurality of first elastic conductive portions 231C. The first soft conductive member 231 is disposed on the first surface 21S1 of the flexible substrate 21, and the fourth surface 231S2 of the first soft conductive member 231 faces the first surface 21S1 of the flexible substrate 21 and is bonded to the flexible substrate 21. The second soft conductive member 233 includes a second soft body 2311 and a plurality of second elastic conductive portions 233C. The second flexible conductive member 233 is disposed on the second surface 21S2 of the flexible substrate 21, and the fifth surface 233S1 of the second flexible conductive member 233 faces the second surface 21S2 of the flexible substrate 21 and is bonded to the flexible substrate 21. In some embodiments, the first elastic conductive portion 231C may be flexible, and the second elastic conductive portion 233C may also be flexible.

[0087] In some embodiments, the first flexible conductive member 231 includes a plurality of first elastic conductive portions 231C disposed in the first flexible body 2311 and having a first end 231C1 and a second end 231C2. The first ends 231C1 and the second ends 231C2 of the first flexible conductive portions 231C are exposed to the third surface 231S1 and the fourth surface 231S2 of the first flexible body 2311, respectively. The second flexible conductive portions 233C of the second flexible conductive member 233 are disposed in the second flexible body 2331 and have a first end 233C1 and a second end 233C2. The first ends 233C1 and the second ends 233C2 of the second flexible conductive portions 233C are exposed to the fifth surface 233S1 and the sixth surface 233S2 of the second flexible body 2331, respectively.

[0088] In some embodiments, the circuit 211 of the flexible substrate 21 has a first end 211A and a second end 211B. The first end 211A of the circuit 211 is exposed to the first surface 21S1 of the flexible substrate 21 and is electrically connected to the second end 231C2 of the first elastic conductive portion 231C of the first flexible conductive member 231. The second end 211B of the circuit 211 is exposed to the second surface 21S2 of the flexible substrate 21 and is electrically connected to the first end 233C1 of the second elastic conductive portion 233C of the second flexible conductive member 233.

[0089] In some embodiments, the first end 231C1 of the first elastic conductive portion 231C of the first soft conductive member 231 is further used to electrically contact with a plurality of contacts 813 of a DUT 81, and the second end 233C2 of the second elastic conductive portion 233C of the second soft conductive member 233 is further used to electrically contact with a plurality of contacts 831 of a rigid substrate 83. In this way, the electrical path generated by the circuit 211 of the elastic intermediary layer 2, the first elastic conductive portion 231C, and the second elastic conductive portion 233C can be used to transmit a test signal (e.g., a high-frequency test signal) between the DUT 81 and the rigid substrate 83.

[0090] In some embodiments, when the object to be tested 81 contacts the first end 231C1 of the first elastic conductive portion 231C, the flexible substrate 21, the first flexible conductive member 231, and the second flexible conductive member 233 are deformed together based on the force applied when the object to be tested 81 contacts. In other words, the elastic intermediary layer 2 of this contact can buffer the force applied when the object to be tested 81 contacts through the flexible element and maintain good electrical contact. On the other hand, when the rigid substrate 83 contacts the second end 233C2 of the second elastic conductive portion 233C, the flexible substrate 21, the first flexible conductive member 231, and the second flexible conductive member 233 are deformed together based on the force applied when the rigid substrate 83 contacts. In other words, the elastic intermediary layer 2 of this contact can buffer the force applied when the rigid substrate 83 contacts through the flexible element and maintain good electrical contact.

[0091] In some embodiments, since the size of the object to be tested 81 (for example, the size of the test surface of the object to be tested) is different from (for example, smaller than) the size of the rigid substrate 83 (for example, the size of the test surface of the rigid circuit board), the size of the first soft conductive component 231 corresponding to the object to be tested 81 (for example, the size of the area in contact with the object to be tested) is different from (for example, smaller than) the size of the second soft conductive component 233 corresponding to the rigid substrate 83 (for example, the size of the area in contact with the rigid substrate).

[0092] Furthermore, the average spacing between the multiple contacts 813 of the object to be tested 81 is smaller than the average spacing between the multiple contacts 831 of the rigid substrate 83. In other words, the unit area density of the multiple contacts 813 of the object to be tested 83 is greater than the unit area density of the multiple contacts 831 of the rigid substrate 83. Therefore, it is necessary to correspond the multiple contacts 831 of the rigid substrate 83 with a larger average spacing or a smaller unit area density to the multiple contacts 813 of the object to be tested 81 with a smaller average spacing or a larger unit area density through the circuit 211 of the flexible substrate 21, and to generate an electrical connection through the corresponding first flexible conductive member 231 (between the flexible substrate 21 and the object to be tested 81) and the second flexible conductive member 233 (between the flexible substrate 21 and the rigid substrate 83).

[0093] In some embodiments, since the object to be tested 81 needs to be tested in a test socket (not shown), the size of the first flexible conductive member 231 corresponding to the object to be tested 81 (e.g., the size of the surface in contact with the object to be tested) needs to be smaller than or equal to the size of the test socket that can receive the object to be tested 81. Based on the aforementioned structural conditions, in some embodiments, the area in which the first flexible conductive member 231 contacts the first surface 21S1 of the flexible substrate 21 is smaller than the area in which the second flexible conductive member 233 contacts the second surface 21S2 of the flexible substrate 21.

[0094] In some embodiments, since the area of ​​the single contact 813 of the object to be tested 81 is smaller than the area of ​​the single contact 831 of the rigid substrate 83, in terms of configuration: (1) the first end 231C1 (corresponding to the contact 813) and the second end 231C2 of the first elastic conductive portion 231C may have the same area; (2) the first end 233C1 and the second end 233C2 (corresponding to the contact 831) of the second elastic conductive portion 233C may have the same area; (3) in each circuit 211, the area of ​​the first end 211A (corresponding to the second end 231C2 of the first soft conductive member 231) may be smaller than the area of ​​the corresponding second end 211B (corresponding to the first end 233C1 of the second soft conductive member 233).

[0095] Based on the above configuration, since: (1) the contact area between the first end 211A of each circuit 211 and the second end 231C2 of the corresponding first soft conductive member 231 is smaller than the contact area between the second end 211B of each circuit 211 and the first end 233C1 of the corresponding second soft conductive member 233; and (2) the contact number between the first end 211A of the circuit 211 and the second end 231C2 of the corresponding first soft conductive member 231 is equal to the contact number between the second end 211B of the circuit 211 and the second end 233C1 of the corresponding second soft conductive member 233. 33, therefore, the total contact area of ​​the first end 211A of the circuit 211 and the second end 231C2 of the corresponding first soft conductive member 231 is smaller than the total contact area of ​​the second end 211B of the circuit 211 and the first end 233C1 of the corresponding second soft conductive member 233. In other words, the area of ​​electrical contact between the first soft conductive member 231 and the first surface 21S1 of the flexible substrate 21 is smaller than the area of ​​electrical contact between the second soft conductive member 233 and the second surface 21S2 of the flexible substrate 21.

[0096] Please refer to Figure 2C to Figure 2F . Figure 2C 4 is a bottom view of the first soft conductive member 231 according to some embodiments of the present disclosure. Figure 2D is a top view of the flexible substrate 21 according to some embodiments of the present disclosure. Figure 2E 2 is a bottom view of the flexible substrate 21 according to some embodiments of the present disclosure. Figure 2F is a top view of the second soft conductive member 233 according to some embodiments of the present disclosure.

[0097] In some embodiments, the first end 211A of the circuit 211 presents a first pattern P21 on the first surface 21S1 of the flexible substrate 21, and the second end 211B of the circuit 211 presents a second pattern P22 on the second surface 21S2 of the flexible substrate 21, and the first pattern P21 is different from the second pattern P22. In other words, the layout and traces of the circuit 211 change from the first end 211A through the flexible substrate 21 to the second end 211B, so the first pattern P21 presented by the first end 211A on the first surface 21S1 is different from the second pattern P22 presented by the second end 211B on the second surface 21S2.

[0098] In some embodiments, the second ends 231C2 of the multiple first elastic conductive parts 231C of the first soft conductive member 231 are exposed to the fourth surface 231S2 of the first soft body 2311 and present a third style P23, and the first ends 233C1 of the multiple second elastic conductive parts 233C of the second soft conductive member 233 are exposed to the fifth surface 233S1 of the second soft body 2331 and present a second style P24.

[0099] In some embodiments, the first pattern P21 and the third pattern P23 are mirror images, and the first ends 211A of the plurality of circuits 211 correspond one-to-one with the second ends 231C2 of the plurality of first elastic conductive portions 231C. The second pattern P22 and the fourth pattern P24 are mirror images, and the second ends 211B of the plurality of circuits 211 correspond one-to-one with the first ends 233C1 of the plurality of second elastic conductive portions 233C.

[0100] In some embodiments, in the same area as the comparison reference, the dot density of the first pattern P21 is greater than that of the second pattern P22. Of course, the third pattern P23 is different from the fourth pattern P24 and the dot density of the third pattern P23 is greater than that of the fourth pattern P24.

[0101] Please refer to Figure 2D and 2E In some embodiments, the density of the first end 211A of the circuit 211 in a unit area A2 is greater than the density of the second end 211B of the circuit 211 in the same unit area A1. In other words, within the same area range A2, the density of the first end 211A of the circuit 211 is denser, and the density of the second end 211B of the circuit 211 is sparser.

[0102] In some embodiments, the minimum spacing between any two first ends 211A in the first style P21 is smaller than the minimum spacing between any two second ends 211B in the second style P22. In some embodiments, excluding the more extreme (farther from the center or the edge) first ends 211A in the first style P21 and excluding the more extreme (farther from the center or the edge) second ends 211B in the second style P22, the minimum spacing between any two first ends 211A in the first style P21 is smaller than the minimum spacing between any two second ends 211B in the second style P22. In some embodiments, excluding the pseudo contacts in the first style P21 and excluding the pseudo contacts in the second style P22, the minimum spacing between any two first ends 211A in the first style P21 is smaller than the minimum spacing between any two second ends 211B in the second style P22.

[0103] Please refer to Figure 2A , Figure 2C and Figure 2F In some embodiments, the density of the first elastic conductive parts 231C in a unit volume V2 is greater than the density of the second elastic conductive parts 233C in a unit volume V2. In other words, within the same volume range V2, the arrangement density of the first elastic conductive parts 231C is denser, and the arrangement density of the second elastic conductive parts 233C is sparser.

[0104] Accordingly, through the aforementioned structural configuration, the elastic interposer 2 of the present invention can electrically connect the contacts with higher density on the object to be tested (e.g., an integrated circuit) to the contacts with lower density on the rigid substrate (e.g., a printed circuit board). In this way, the elastic interposer 2 of the present invention can achieve the function of space transformation and generate an effective electrical path between the contacts of the object to be tested and the contacts of the rigid substrate.

[0105] Please refer to Figure 2G and Figure 2H . Figure 2G It is an enlarged schematic diagram of the first soft conductive member 231 of the conductive device 23 of the present disclosure. Figure 2H 2 is an enlarged schematic diagram of the second conductive member 233 of the conductive device 23 of the present disclosure. In some embodiments, the first soft conductive member 231 is a conductive paste, and the first soft body 2311 is made of a viscous material. In some embodiments, the fourth surface 231S2 of the first soft conductive member 231 is a viscous material. In one embodiment, a first adhesive layer (not shown) is attached to the fourth surface 231S2 of the first soft conductive member 231. In the aforementioned embodiments, the purpose is to make the first soft conductive member 231 detachably (or removably) fixed to the first surface 21S1 of the soft substrate 21. In some embodiments, when the first soft conductive member 231 is separated from the soft base 21, the first soft conductive member 231 and the first adhesive layer are separated from the soft substrate 21 as a whole. In other words, the first soft conductive member 231 and the first adhesive layer are regarded as a whole and are separated from the soft substrate 21 at the same time and together.

[0106] In some embodiments, when an adhesive layer is attached to the fourth surface 231S2 of the first soft conductive member 231, the first elastic conductive portion 231C is electrically connected to the first end 211A of the circuit 211 through the adhesive layer. For example, when the adhesive layer is disposed on the fourth surface 231S2 of the first soft conductive member 231, it can be disposed away from the second end 231C2 of the first elastic conductive portion 231C, so that when the first soft conductive member 231 is fixed to the flexible substrate 21, the electrical connection between the first elastic conductive portion 231C and the circuit 211 is not hindered. For example, the first elastic conductive portion 231C can slightly protrude from the fourth surface 231S2, so that when the first soft conductive member 231 is fixed to the flexible substrate 21, the electrical connection between the first elastic conductive portion 231C and the circuit 211 is not hindered.

[0107] In some embodiments, each first elastic conductive portion 231C includes a plurality of metal particles (e.g., gold-plated copper particles or gold-plated nickel particles), and is arranged in a columnar shape (e.g., cylindrical, square columnar, etc.) in the first flexible body 2311. When the first flexible conductive member 231 is adhered to the first surface 21S1 of the flexible substrate 21 through the first flexible body 2311, the second end 231C2 of the first elastic conductive portion 231C is aligned with and electrically connected to the first end 211A of the circuit 211 of the flexible substrate 21.

[0108] Similarly, in some embodiments, the second soft conductive member 233 is a conductive glue, and the second soft body 2331 is made of a viscous material. In some embodiments, the fifth surface 233S1 of the second soft conductive member 233 is a viscous material. In some embodiments, the fifth surface 233S1 of the first soft conductive member 231 is attached with a second adhesive layer (not shown). In the aforementioned embodiments, the purpose is to make the second soft conductive member 233 detachably (or removably) fixed to the second surface 21S2 of the soft substrate 21. In some embodiments, when the second soft conductive member 233 is separated from the soft base 21, the second soft conductive member 233 and the second adhesive layer are separated from the soft substrate 21 as a whole. In other words, the second soft conductive member 233 and the second adhesive layer are regarded as a whole, and are separated from the soft substrate 21 at the same time and together.

[0109] In some embodiments, each second elastic conductive portion 233C includes a plurality of metal particles (e.g., gold-plated copper particles or gold-plated nickel particles), and is arranged in a columnar shape (e.g., cylindrical, square columnar, etc.) in the second flexible body 2331. When the second flexible conductive member 233 is adhered to the second surface 21S2 of the flexible substrate 21 through the second flexible body 2331, the first end 233C1 of the second elastic conductive portion 233C is aligned with and electrically connected to the second end 211B of the circuit 211 of the flexible substrate 21.

[0110] In one embodiment, when an adhesive layer is attached to the fifth surface 233S1 of the second soft conductive member 233, the second elastic conductive portion 233C is electrically connected to the first end 211A of the circuit 211 through the adhesive layer. For example, when the adhesive layer is disposed on the fourth surface 231S2 of the first soft conductive member 231, it can be disposed away from the second end 231C2 of the first elastic conductive portion 231C, so that when the first soft conductive member 231 is fixed to the soft substrate 21, the electrical connection between the first elastic conductive portion 231C and the circuit 211 is not hindered. For example, the first elastic conductive portion 231C can slightly protrude from the fourth surface 231S2, so that when the first soft conductive member 231 is fixed to the soft substrate 21, the electrical connection between the first elastic conductive portion 231C and the circuit 211 is not hindered.

[0111] In some embodiments, the average size of the first metal grains of the first elastic conductive portion 231C is different from the average size of the second metal grains of the second elastic conductive portion 233C. For example, the first metal grains of the first elastic conductive portion 231C are substantially circular, and each of the first metal grains has a first grain size. Basically, each of the first metal grains has the same size, and the average size of the first metal grains is approximately the first grain size of the first metal grains. The second metal grains of the second elastic conductive portion 233C are substantially circular, and each of the second metal grains has a second grain size. Basically, each of the second metal grains has the same size, and the average size of the second metal grains is approximately the second grain size of the second metal grains. In the above example, the average size of the first metal grains (i.e., the first grain size) is different from the average size of the second metal grains (i.e., the second grain size).

[0112] By setting the conductive device 23, when the first soft conductive member 231 and the second soft conductive member 233 contact the object to be tested 81 and the rigid substrate 83 respectively, the first soft body 2311 of the first soft conductive member 231 and the second soft body 2331 of the second soft conductive member 233 can absorb and buffer the force generated during the contact to effectively avoid damage. At the same time, the first elastic conductive part 231C of the first soft conductive member 231, the second elastic conductive part 233 of the second soft conductive member 233 and the circuit 211 of the flexible substrate 21 in contact form a relatively short electrical path, which can efficiently and correctly transmit the high-frequency test signal transmitted between the object to be tested 81 and the rigid substrate 83. In some embodiments, since the first soft conductive member 231 and the second soft conductive member 233 can be removed from the flexible substrate 21 and replaced, the flexibility of the elastic intermediary layer 2 can be greatly improved.

[0113] In some embodiments, the first flexible conductive element 231, the second flexible conductive element 233 and the flexible substrate 21 have a first thickness, a second thickness and a third thickness respectively. To meet various usage scenarios or requirements, the first thickness, the second thickness and the third thickness can be adjusted to be the same, different or partially the same.

[0114] It should be particularly noted that in the aforementioned embodiments and related drawings, the configuration of the circuit (e.g., circuit 111, 211) in the flexible substrate (e.g., flexible substrate 11, 21), the number of the conductive parts (e.g., the first elastic conductive parts 131C, 231C and the second elastic conductive parts 231C, 233C), and the first style, second style, third style, and fourth style of the conductive parts or circuits on each surface are only examples and are not intended to limit the implementation aspects of the present disclosure.

[0115] In summary, the elastic interposer and the conductive device of the embodiments of the present disclosure can absorb and buffer the impact caused by various physical contacts through the soft conductive parts to reduce the damage to the object under test and the hard substrate. In addition, the elastic interposer and the conductive device of the embodiments of the present disclosure utilize the relatively short electrical path generated by the circuit of the soft substrate and the conductive part of the soft conductive parts to efficiently and correctly transmit high-frequency test signals between the object under test and the hard substrate, and avoid using the traditional structure of joining the space conversion plate and the hard substrate through soldering, effectively reducing the impedance caused by the electrical path.

[0116] Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and replacements may be made without departing from the spirit and scope of the present disclosure as defined in the claims. For example, many of the above processes may be implemented in different ways, and other processes or combinations thereof may be used to replace many of the above processes.

[0117] Furthermore, the scope of the present application is not limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, means, methods, and steps described in the specification. A person skilled in the art can understand from the disclosure of the present disclosure that existing or future developed processes, machines, manufactures, compositions of matter, means, methods, or steps that have the same functions or achieve substantially the same results as the corresponding embodiments described herein can be used according to the present disclosure. Accordingly, such processes, machines, manufactures, compositions of matter, means, methods, or steps are included in the claims of the present application.

Claims

1. An elastic intermediary layer, comprising: A flexible substrate includes a plurality of circuits, wherein: A first end of each of the plurality of circuits is exposed to a first surface of the flexible substrate, and a second end of each of the plurality of circuits is exposed to a second surface of the flexible substrate, the first ends of the plurality of circuits are in a first pattern on the first surface, and the second ends of the plurality of circuits are in a second pattern on the second surface, the first pattern being different from the second pattern; and A conductive device comprising: a first flexible conductive member disposed on the first surface of the flexible substrate, comprising a plurality of first elastic conductive portions, wherein first ends of the plurality of first elastic conductive portions are exposed to a third surface of the first flexible conductive member, and second ends of the plurality of first elastic conductive portions are exposed to a fourth surface of the first flexible conductive member and electrically connected to the first ends of the plurality of circuits; and A second flexible conductive member is disposed on the second surface of the flexible substrate, and includes a plurality of second elastic conductive portions, wherein the first ends of the plurality of second elastic conductive portions are exposed to a fifth surface of the second flexible conductive member and are electrically connected to the second ends of the plurality of circuits, and the second ends of the plurality of second elastic conductive portions are exposed to a sixth surface of the second flexible conductive member.

2. The elastic interposer according to claim 1, wherein: The area of ​​the first flexible conductive element electrically contacting the first surface of the flexible substrate is smaller than the area of ​​the second flexible conductive element electrically contacting the second surface of the flexible substrate.

3. The elastic interposer according to claim 1, wherein: The second ends of the plurality of first elastic conductive parts are used to electrically contact with a plurality of contact points of a to-be-tested object, and the second ends of the plurality of second elastic conductive parts are used to electrically contact with a plurality of contact points of a rigid substrate.

4. The elastic interposer according to claim 3, wherein: When the object to be tested contacts the first ends of the plurality of first elastic conductive parts, the flexible substrate, the first flexible conductive component and the second flexible conductive component are deformed together based on the force exerted by the object to be tested when in contact.

5. The elastic interposer according to claim 1, wherein: The first soft conductive element is detachably fixed to the first surface of the soft substrate, and the second soft conductive element is detachably fixed to the second surface of the soft substrate.

6. The elastic intermediary layer as claimed in claim 5, further comprising a first adhesive layer and a second adhesive layer, wherein: The first adhesive layer is disposed between the first soft conductive component and the soft substrate, and the second adhesive layer is disposed between the second soft conductive component and the soft substrate.

7. The elastic interposer of claim 6, wherein: The first adhesive layer and the first flexible conductive component are separated from the flexible substrate in one piece, and the second adhesive layer and the second flexible conductive component are separated from the flexible substrate in one piece.

8. The elastic interposer of claim 6, wherein: The plurality of first elastic conductive parts pass through the first adhesive layer to be electrically connected to the first ends of the plurality of circuits, and the plurality of second elastic conductive parts pass through the second adhesive layer to be electrically connected to the second ends of the plurality of circuits.

9. The elastic interposer of claim 1, wherein: The size of the first flexible conductive component is different from the size of the second flexible conductive component.

10. A conductive device of an elastic intermediary layer, the conductive device comprising: A first flexible conductive element, disposed on a first surface of a flexible substrate, comprises: a first soft body; A plurality of first elastic conductive parts are arranged on the first flexible body, wherein: The plurality of first elastic conductive parts are used to electrically connect the first ends of the plurality of circuits of the flexible substrate; and a second flexible conductive member is disposed on a second surface of the flexible substrate, comprising: A second soft subject; A plurality of second elastic conductive parts are disposed on the second flexible body, wherein the plurality of second elastic conductive parts are used to electrically connect the second ends of the plurality of circuits of the flexible substrate; The first ends of the circuits are exposed to the first surface and present a first pattern on the first surface, and the second ends of the circuits are exposed to the second surface and present a second pattern on the second surface, and the first pattern is different from the second pattern.

11. The conductive device according to claim 10, wherein: The plurality of first elastic conductive parts are disposed in the first flexible body, the first ends of the plurality of first elastic conductive parts are exposed to a third surface of the first flexible body, and the second ends of the plurality of first elastic conductive parts are exposed to a fourth surface of the first flexible body.

12. The conductive device according to claim 11, wherein: The plurality of second elastic conductive parts are disposed in the second flexible body, the first ends of the plurality of second elastic conductive parts are exposed to a fifth surface of the second flexible body, and the second ends of the plurality of second elastic conductive parts are exposed to a sixth surface of the second flexible body.

13. The conductive device according to claim 12, wherein: The second ends of the plurality of first elastic conductive parts are used to electrically connect to the first ends of the plurality of circuits of the flexible substrate, and the first ends of the plurality of second elastic conductive parts are used to electrically connect to the second ends of the plurality of circuits of the flexible substrate.

14. The conductive device according to claim 13, wherein: The second ends of the multiple first elastic conductive parts are exposed to the fourth surface of the first flexible body and present a third style on the fourth surface of the first flexible body. The first ends of the multiple second elastic conductive parts are exposed to the fifth surface of the second flexible body and present a fourth style on the fifth surface of the second flexible body. The third style is different from the fourth style.

15. The conductive device according to claim 10, wherein: Each first elastic conductive part is column-shaped in the first flexible body, and each second elastic conductive part is column-shaped in the second flexible body.

16. The conductive device according to claim 10, wherein: Each first elastic conductive part includes a plurality of first metal particles, and each second elastic conductive part includes a plurality of second metal particles.

17. The conductive device according to claim 16, wherein: An average size of the first metal grains is different from an average size of the second metal grains.

18. The conductive device according to claim 10, wherein: The first soft conductive member and the second soft conductive member are conductive glue.

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