A quartz wafer testing device and method

Abstract

The present invention provides a quartz wafer testing device and method, which relates to the field of wafer testing technology, including: a testing platform, a positioning seat for placing a quartz wafer to be tested is provided on the testing platform, and the testing platform is used to adjust the position of the positioning seat on a horizontal plane; an image recognition device, which is arranged above the testing platform and is used to perform image recognition and positioning on the quartz wafer to be tested; a pair of test arms, the two test arms are respectively arranged on both sides of the testing platform, and the front end of the test arm is provided with a probe for testing the quartz wafer, and the test arm is used to adjust the position of the probe according to the recognition result of the image recognition device. The beneficial effect is that the automation degree of the test is improved, the time required for the test is further reduced, and it is ensured that the probe can contact the wafer at a uniform and accurate position each time the test is performed, the test error is reduced, the test cost is reduced, and the test efficiency is improved, so that the test device can easily cope with the test tasks of wafers of various specifications.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular to a quartz wafer testing device and method. Background Art

[0002] In the production and processing of quartz crystal oscillators, or crystal oscillators for short, the coated quartz wafers need to undergo rigorous electrical performance sampling tests to ensure that the electrical performance parameters of the final product meet the standards. However, most traditional test devices rely on straight needle measurement, which has significant technical limitations.

[0003] First, the probe and wafer test positions of traditional test equipment are fixed, which makes alignment extremely difficult when testing small or special-sized quartz wafers. Since the probe pressing position cannot be kept consistent, this not only increases the risk of test errors, but also seriously affects the accuracy and reliability of the test.

[0004] Secondly, the entire test cycle under the traditional test method is relatively long. This is mainly because the alignment is difficult and the test errors frequently occur, forcing the testers to repeatedly debug and calibrate, thus prolonging the test time.

[0005] Furthermore, since the probe position and test specifications are fixed, when testing quartz wafers of different specifications, testers have to perform tedious work of replacing the probe and positioning seat. This not only increases the test cost, but also reduces the test efficiency, making the entire test process complicated and time-consuming.

[0006] In summary, traditional quartz crystal oscillator testing devices have significant technical problems such as difficult alignment, large test errors, long test cycles, and fixed test specifications when testing small or special specification chips, and technical improvement and optimization are urgently needed. Summary of the invention

[0007] In view of the problems existing in the prior art, the present invention provides a quartz wafer testing device, comprising:

[0008] A test platform, wherein a positioning seat for placing a quartz wafer to be tested is provided on the test platform, and the test platform is used to adjust the position of the positioning seat on a horizontal plane;

[0009] An image recognition device, disposed above the test platform, for performing image recognition and positioning on the quartz wafer to be tested;

[0010] A pair of test arms, the two test arms are respectively arranged on both sides of the test platform, the front ends of the test arms are provided with probes for testing the quartz wafer, and the test arms are used to adjust the positions of the probes according to the recognition results of the image recognition device.

[0011] Preferably, the test platform comprises:

[0012] A first adjusting member, the top of which is connected to the positioning seat and is used to adjust the position of the positioning seat in a first direction;

[0013] The second adjusting member is fixed perpendicularly to the first adjusting member and is used to adjust the position of the positioning seat in a second direction perpendicular to the first direction.

[0014] Preferably, it also includes a mounting plate, on which a slide rail and a plurality of mounting holes are provided, and a support column is installed in each mounting hole;

[0015] A slider is provided at the bottom of the second adjusting member, and the slider is slidably fixed to the slide rail;

[0016] The two test arms and the image recognition device are respectively fixed on one of the support columns.

[0017] Preferably, the first adjusting member and the second adjusting member are micrometers.

[0018] Preferably, the test platform further comprises a lifting adjustment member, wherein the lifting adjustment member is arranged between the bottom of the positioning seat and the top of the first adjustment member, and is used to adjust the position of the positioning seat in the vertical direction.

[0019] Preferably, a material trough for placing the quartz wafer to be tested is provided in the positioning seat.

[0020] Preferably, a negative pressure device is further included, a negative pressure hole is opened at the center of the material trough, and the negative pressure hole is connected to the negative pressure device.

[0021] The present invention also provides a quartz wafer testing method, which is applied to the above-mentioned testing device, comprising:

[0022] Step S1, after the quartz wafer to be tested is installed in the positioning seat, controlling the test platform to adjust the position of the positioning seat;

[0023] Step S2, the image recognition device performs image recognition on the quartz wafer to be tested and locates the angular position of the quartz wafer to be tested;

[0024] Step S3, according to the positioning result of the angular positioning, each of the test arms is controlled to contact the probe with the angular position corresponding to the quartz wafer to be tested to start frequency testing to obtain the test result.

[0025] The above technical solution has the following advantages or beneficial effects:

[0026] 1. The introduction of the image recognition device provides a means of image recognition and positioning for the quartz wafer to be tested, improves the degree of automation of the test, and further reduces the time required for testing.

[0027] 2. Regardless of the size of the chip, the position of the positioning seat can be adjusted and the probe can be fine-tuned according to the actual position and specifications of the chip to ensure that the probe can contact the chip in a uniform and accurate position during each test, reducing test errors.

[0028] 3. It can adapt to the testing requirements of quartz wafers of different specifications without changing the probe or positioning seat. This not only reduces the testing cost, but also improves the testing efficiency, making the testing device able to easily cope with the testing tasks of wafers of various specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A front view of a quartz wafer testing device in a preferred embodiment of the present invention;

[0030] Figure 2 A top view of a quartz wafer testing device in a preferred embodiment of the present invention;

[0031] Figure 3 A top view of the installation plate in a preferred embodiment of the present invention;

[0032] Figure 4 The figure is a flow chart of a method for testing a quartz wafer in a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0033] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment, and other embodiments may also fall within the scope of the present invention as long as they conform to the gist of the present invention.

[0034] In a preferred embodiment of the present invention, based on the above problems existing in the prior art, a quartz wafer testing device is provided. Figure 1 As shown, including:

[0035] A test platform 1, on which a positioning seat 2 for placing a quartz wafer to be tested is disposed, and the test platform 1 is used to adjust the position of the positioning seat 2 on a horizontal plane;

[0036] A pair of test arms 3, the two test arms 3 are respectively arranged on both sides of the test platform 1, the front ends of the test arms 3 are provided with probes 4 for testing quartz wafers, and the test arms 3 are used to adjust the positions of the probes 4;

[0037] The image recognition device 5 is disposed above the test platform 1 and is used for performing image recognition and positioning on the quartz wafer to be tested.

[0038] Specifically, the quartz wafer testing device provided in this embodiment can solve the following technical problems existing in the traditional technology:

[0039] 1. Solve the problems of difficult alignment and inconsistent test positions:

[0040] The device accurately places the quartz wafer to be tested through the positioning seat 2 on the test platform 1, and the test platform 1 can adjust the position of the positioning seat 2 on the horizontal plane. This means that no matter what the size of the wafer is, the position of the positioning seat 2 can be adjusted to ensure that the wafer and the probe are accurately aligned, thereby avoiding the problem of difficult alignment in traditional technologies.

[0041] At the same time, a probe 4 is provided at the front end of the test arm 3, and the test arm 3 itself has the function of adjusting the position of the probe 4. This means that the probe 4 can be fine-tuned according to the actual position and specifications of the wafer, ensuring that the probe can contact the wafer at a uniform and accurate position during each test, thereby reducing test errors.

[0042] 2. Shorten the test cycle:

[0043] Since the positions of the positioning seat 2 and the probe 4 can be accurately adjusted, there is no need for frequent debugging and calibration during the test, thereby greatly shortening the test cycle. In addition, the introduction of the image recognition device 5 provides an image recognition and positioning means for the quartz wafer to be tested, which also improves the automation of the test and further reduces the time required for the test.

[0044] 3. Solve the problem of fixed test specifications:

[0045] The design of the test device is highly flexible and scalable. The test arm 3 can adjust the position of the probe 4, which means that it can adapt to the testing needs of quartz wafers of different specifications without changing the probe or positioning seat. This not only reduces the test cost, but also improves the test efficiency, allowing the test device to easily cope with the test tasks of wafers of various specifications.

[0046] 4. Improve the accuracy and reliability of testing:

[0047] The introduction of the image recognition device 5 provides additional visual feedback for the test process. By taking an image of the quartz wafer to be tested, the tester can monitor the state and position of the wafer in real time, and provide a positioning basis for the test arm to adjust the position probe, thereby ensuring the accuracy and reliability of the test. In addition, image recognition technology can also be used to automatically identify and classify wafers of different specifications, further improving the automation and efficiency of the test.

[0048] In summary, the quartz wafer testing device provided in this embodiment effectively solves the problems of difficult alignment, large test errors, long test cycles, and fixed test specifications existing in traditional technologies by accurately adjusting the positions of the positioning seat and the probe, introducing innovative means such as an image recognition device, and provides a more efficient, accurate, and reliable solution for the testing of quartz wafers.

[0049] In a preferred embodiment of the present invention, Figure 1 As shown, the test platform 1 includes:

[0050] A first adjusting member 11, the top of which is connected to the positioning seat 2 and is used to adjust the position of the positioning seat 2 in the first direction X;

[0051] The second adjusting member 12 is fixed perpendicularly to the first adjusting member 11 and is used to adjust the position of the positioning seat 2 in a second direction Y perpendicular to the first direction X.

[0052] In a preferred embodiment of the present invention, the first adjusting member 11 and the second adjusting member 12 are micrometers.

[0053] Specifically, in this embodiment, the position of the positioning seat 2 is adjusted on the horizontal plane by two micrometers, referring to Figure 2 , the first direction X and the second direction Y are perpendicular to each other on the horizontal plane. Since the size of the quartz wafer to be tested is very small, usually a few tenths of a millimeter, in order to ensure the adjustment accuracy, the first adjustment member 11 and the second adjustment member 12 are preferably micrometers. Of course, in other embodiments, the first adjustment member 11 and the second adjustment member 12 can also use ordinary drive motors, and the drive motors are controlled by software programs to adjust the positioning seat, but the accuracy is not as high as that of micrometers.

[0054] In a preferred embodiment of the present invention, a mounting plate 6 is further included, on which a slide rail 63 and a plurality of mounting holes 61 are provided, and a support column 62 is installed in each mounting hole 61;

[0055] A slider 13 is provided at the bottom of the second adjusting member 12, and the slider 13 is slidably fixed to the slide rail 63;

[0056] The two test arms 3 and the image recognition device 5 are respectively fixed on a supporting column 62 .

[0057] Specifically, in this embodiment, refer to Figure 2 , Figure 3 The slider 13 slides in the slide rail 63 along the first direction X, and the test platform 1 is pulled out more quickly by the slider 13 to avoid the image recognition device 5 and the test arm 3, thereby completing the loading and unloading action.

[0058] In a preferred embodiment of the present invention, the test platform 1 further comprises a lifting adjustment member 14 , which is disposed between the bottom of the positioning seat 2 and the top of the first adjustment member 11 and is used to adjust the position of the positioning seat 2 in the vertical direction Z.

[0059] Specifically, in addition to adjusting the position of the positioning seat 2 through the first adjusting member 11 and the second adjusting member 12, the test platform 1 is also provided with a lifting adjusting member 14 to adjust the position of the positioning seat 2 in the vertical direction Z, which can meet the full range of position adjustment of the positioning seat.

[0060] In a preferred embodiment of the present invention, a material slot for placing the quartz wafer to be tested is provided in the positioning seat 2 .

[0061] In a preferred embodiment of the present invention, a negative pressure device 7 is further included. A negative pressure hole is opened at the center of the material trough, and the negative pressure hole is connected to the negative pressure device 7.

[0062] Specifically, in the present embodiment, the quartz wafer to be tested is small in size and light in weight. External factors such as the moving test platform and probe contact may cause the quartz wafer to be tested to be displaced. In order to avoid displacement, the quartz wafer to be tested needs to be fixed. After the quartz wafer to be tested is placed in the material tank, the negative pressure device is started to generate suction to the quartz wafer to be tested through the negative pressure hole, so that the quartz wafer to be tested is fixed in the material tank to prevent movement.

[0063] The present invention also provides a quartz wafer testing method, which is applied to the above-mentioned testing device, such as Figure 4 As shown, including:

[0064] Step S1, after the quartz wafer to be tested is installed in the positioning seat, the position of the positioning seat is adjusted by the test platform;

[0065] Step S2, the image recognition device performs image recognition on the quartz wafer to be tested and locates the angular position of the quartz wafer to be tested;

[0066] Step S3, according to the positioning result of the angular position positioning, each test arm is controlled to contact the probe with the angular position corresponding to the quartz wafer to be tested to start the frequency test and obtain the test result.

[0067] Specifically, the testing method for quartz wafer in this embodiment is applied to the above-mentioned testing device, and its beneficial effects are mainly reflected in the following aspects:

[0068] 1. Improve the accuracy and consistency of testing:

[0069] By accurately adjusting the position of the positioning seat by the test platform in step S1, it can be ensured that the quartz wafer to be tested is in the best test position on the test platform, reducing the test error caused by position deviation. According to the above embodiments, when the adjustment member in the test platform is a micrometer, it is adjusted manually, and when the adjustment member is a drive motor, it is adjusted through a software program.

[0070] The image recognition device in step S2 performs image recognition on the chip and locates the corner position (the corner position in this embodiment, i.e., the test pin of the chip, or the input and output ends of the chip) (the image recognition algorithm can adopt an existing image recognition model or algorithm, which can recognize the quartz chip to be tested in the image and the corner position on the chip). This step not only improves the degree of automation of the test, but also ensures that the probe can accurately contact the predetermined position of the chip during each test, thereby improving the accuracy and consistency of the test.

[0071] 2. Optimize the test process and shorten the test time:

[0072] Traditional testing methods may require manual adjustment of the wafer position or probe position, which is not only time-consuming but also prone to errors. However, this testing method greatly simplifies the testing process and shortens the testing time through automated adjustment and image recognition technology.

[0073] At the same time, since the test arm can automatically adjust the probe position according to the image recognition results, it avoids repeated debugging due to difficult alignment in traditional methods, further improving test efficiency.

[0074] Specifically, in the quartz wafer testing method based on the image recognition technology, the process of adjusting the test arm to move the probe to the corner position on the quartz wafer to be tested and correspondingly contacting can be performed as follows:

[0075] First, an image recognition device (such as a high-resolution camera) is installed above the test platform to capture images of the quartz wafer to be tested placed in the positioning seat. The device can capture a clear image of the wafer and transmit it to the computer processing system.

[0076] Next, the computer processing system uses image recognition algorithms to analyze the captured images. These algorithms can identify key features such as the outline, shape, and corner position of the wafer. During the recognition process, the system may perform a series of image processing operations, such as image binarization and contour detection, to more accurately extract the characteristic information of the wafer. (The image recognition algorithm can use an existing image recognition model or algorithm that can identify the quartz wafer to be tested in the image and the corner position on the wafer. For example, in a quartz wafer positioning and sorting system, the system uses a camera and an appropriate lighting system to take an image of the quartz wafer to be tested online, and transmits the image to a computer. The computer analyzes the received image of the wafer to be tested and performs image binarization and contour detection processing to complete the identification and positioning of the quartz wafer to be tested. Then, the system determines its center coordinates and corner coordinates.)

[0077] Once the corner position of the wafer is accurately located, the computer processing system will calculate the exact position to which the probe needs to move (the relative position between the camera and the test arm can be pre-established with a coordinate system and position calibration input). This position information is then sent to the control system of the test arm.

[0078] After receiving the position information, the control system of the test arm will drive the test arm to move. The test arm usually contains a precision motor and transmission mechanism that can move in any direction in space, ensuring that the probe moves to the specified position with extremely high accuracy. During the movement, the control system may monitor the position and speed of the probe in real time to ensure that it moves according to the predetermined trajectory.

[0079] Finally, when the probe accurately touches the corner of the quartz wafer to be tested, the test can begin. The probe on the test arm will perform frequency test or other related tests on the wafer to be tested, and transmit the test results to the computer processing system for recording and analysis.

[0080] Through the application of image recognition technology, the test arm can automatically and accurately adjust the position of the probe so that it contacts the corresponding corners of the quartz wafer to be tested, thereby greatly improving the efficiency and accuracy of the test.

[0081] 3. Strong adaptability, supporting testing of chips of various specifications:

[0082] The test method uses an image recognition device to identify the wafer and automatically adjusts the probe position according to the recognition result, so it can adapt to the testing requirements of quartz wafers of different specifications, thereby reducing the test cost and improving the utilization rate of the test device.

[0083] Improve test reliability and repeatability:

[0084] Because image recognition technology is used for wafer positioning and probe adjustment during the test process, the conditions of each test are as consistent as possible, which helps improve the reliability and repeatability of the test.

[0085] At the same time, automated testing reduces the interference of human factors, making the test results more objective and accurate.

[0086] 4. Easy to integrate and expand:

[0087] The test device on which the test method relies is reasonably designed and can be easily integrated with other test equipment or systems to form a complete test production line.

[0088] In addition, as technology continues to develop, this test method can be further expanded and optimized to meet more complex testing needs in the future.

[0089] In summary, the quartz wafer testing method significantly improves the accuracy and consistency of the test, optimizes the test process, enhances adaptability, improves the reliability and repeatability of the test, and is easy to integrate and expand by accurately adjusting the position of the positioning seat, using image recognition technology to position the wafer and adjust the probe, and other innovative means. These beneficial effects make the testing method have broad application prospects in the field of quartz wafer testing.

[0090] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the contents of this specification and illustrations should be included in the protection scope of the present invention.

Claims

1. A quartz wafer testing device, characterized in that: include: A test platform, wherein a positioning seat for placing a quartz wafer to be tested is provided on the test platform, and the test platform is used to adjust the position of the positioning seat on a horizontal plane; An image recognition device, disposed above the test platform, for performing image recognition and positioning on the quartz wafer to be tested; A pair of test arms, the two test arms are respectively arranged on both sides of the test platform, the front ends of the test arms are provided with probes for testing the quartz wafer, and the test arms are used to adjust the positions of the probes according to the recognition results of the image recognition device.

2. The testing device according to claim 1, characterized in that: The test platform comprises: A first adjusting member, the top of which is connected to the positioning seat and is used to adjust the position of the positioning seat in a first direction; The second adjusting member is fixed perpendicularly to the first adjusting member and is used to adjust the position of the positioning seat in a second direction perpendicular to the first direction.

3. The testing device according to claim 2, characterized in that: It also includes a mounting plate, on which a slide rail and a plurality of mounting holes are provided, and a support column is installed in each mounting hole; A slider is provided at the bottom of the second adjusting member, and the slider is slidably fixed to the slide rail; The two test arms and the image recognition device are respectively fixed on one of the support columns.

4. The testing device according to claim 2, characterized in that: The first adjusting member and the second adjusting member are micrometers.

5. The testing device according to claim 2, characterized in that: The test platform further comprises a lifting adjustment member, which is disposed between the bottom of the positioning seat and the top of the first adjustment member and is used to adjust the position of the positioning seat in the vertical direction.

6. The testing device according to claim 1, characterized in that: The positioning seat is provided with a material trough for placing the quartz wafer to be tested.

7. The testing device according to claim 6, characterized in that: It also includes a negative pressure device. A negative pressure hole is opened at the center of the material trough, and the negative pressure hole is connected to the negative pressure device.

8. A method for testing a quartz wafer, characterized in that: A test device as claimed in any one of claims 1 to 7, comprising: Step S1, after the quartz wafer to be tested is installed in the positioning seat, the position of the positioning seat is adjusted by the test platform; Step S2, the image recognition device performs image recognition on the quartz wafer to be tested and locates the angular position of the quartz wafer to be tested; Step S3, according to the positioning result of the angular positioning, each of the test arms is controlled to contact the probe with the angular position corresponding to the quartz wafer to be tested to start frequency testing to obtain the test result.

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