Trajectory optimization method and device for laser on-the-fly processing

Abstract

The present invention relates to the technical field of laser processing, and discloses a trajectory optimization method and device for laser flying processing, the method comprising: dividing a processing area into N sub-areas, and obtaining part feature parameters and process feature parameters of the sub-areas; performing incident feature calculation to obtain incident path length and incident angle; performing calculation according to the incident path length and incident angle to obtain reflection path length; performing area calculation to obtain incident sub-area area and reflection sub-area area; performing energy calculation to obtain laser energy; performing time calculation to obtain process time; performing distribution map construction operation according to laser energy and process time to obtain laser energy distribution map and process time distribution map; performing trajectory optimization operation based on preset laser energy threshold and preset process time threshold according to laser energy release map and process time distribution map.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a trajectory optimization method and device for laser flying processing. Background Art

[0002] At present, laser flight processing technology is a new type of three-dimensional component processing and manufacturing technology. It integrates machine tools, robots, galvanometers, lasers and automatic control technologies, and uses computer programming to realize the scanning and cutting of complex parts. This technology has the advantages of high flexibility, high processing efficiency and strong adaptability.

[0003] In one prior art, machining trajectories are generated based on the pose parameters of each triangle on the part. Although this method is accurate, the trajectory optimization method is complicated and cumbersome because the parameters of each triangle are different. At the same time, an infinite loop occurs during the trajectory generation process due to floating-point calculation and algorithm problems, which leads to the failure of trajectory optimization.

[0004] In summary, the existing technology still has the problem of being cumbersome and inefficient in trajectory optimization of laser flight processing. Summary of the invention

[0005] The present invention provides a trajectory optimization method and device for laser flight processing, which simplifies the generation and optimization process of the processing trajectory by optimizing trajectory generation and flight path.

[0006] In the first aspect, in order to solve the above technical problems, the present invention provides a data processing method based on drone airspace monitoring, comprising: The processing area is divided into sub-regions, and obtaining part feature parameters and process feature parameters of the sub-regions; According to the part characteristic parameters and the process characteristic parameters, incident characteristic calculation is performed to obtain the incident path length and the incident angle; Calculating according to the incident path length and the incident angle to obtain the reflection path length; Performing area calculation according to the process characteristic parameters, the incident path length, and the reflection path length to obtain the incident sub-region area and the reflection sub-region area; Performing energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameters to obtain laser energy; Performing time calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain process time; According to the laser energy and the process time, a distribution map construction operation is performed to obtain a laser energy distribution map and a process time distribution map; According to the laser energy distribution diagram and the process time distribution diagram, a trajectory optimization operation is performed based on a preset laser energy threshold and a preset process time threshold.

[0007] Preferably, the processing area is divided into sub-regions, and obtain part feature parameters and process feature parameters of the sub-regions, including: The part characteristic parameters include part length, part width and part inclination angle; The process characteristic parameters include spot diameter, laser power, scanning speed, reflection energy ratio, absorption coefficient, part processing time, upper boundary ordinate and lower boundary ordinate.

[0008] Preferably, the calculation of the incident characteristic is performed according to the part characteristic parameter and the process characteristic parameter to obtain the incident path length and the incident angle, including: The calculation formula of the incident path length is: ; In the formula, is the part length; Indicates Area number; is the part width; is the incident path length; The calculation formula of the incident angle is: ; In the formula, is the angle of incidence; is the part tilt angle; is the upper boundary ordinate; is the lower boundary ordinate.

[0009] Preferably, the calculating according to the incident path length and the incident angle to obtain the reflection path length comprises: The calculation formula of the reflection path length is: ; In the formula, is the reflection path length; is the incident path length; is the angle of incidence.

[0010] Preferably, the area calculation is performed according to the process characteristic parameter, the incident path length and the reflection path length to obtain the incident sub-region area and the reflection sub-region area, including: The calculation formula of the incident sub-region area is: ; In the formula, is the area of ​​the incident sub-region; is the incident path length; is the spot diameter; The calculation formula of the reflection sub-region area is: ; In the formula, is the area of ​​the reflection sub-region; is the reflection path length.

[0011] Preferably, the energy calculation is performed according to the incident sub-region area, the reflection sub-region area and the process characteristic parameter to obtain the laser energy, including: The calculation formula of the laser energy is: ; In the formula, is the reflected energy ratio; is the absorption coefficient; is the laser power; is the area of ​​the incident sub-region; is the area of ​​the reflection sub-region; For the The laser energy in the area.

[0012] Preferably, performing time calculation according to the process characteristic parameter, the incident path length and the reflection path length to obtain the process time comprises: The calculation formula of the process time is: ; In the formula, For the Process time for each area; is the parts processing time; is the incident path length; is the reflection path length; is the spot diameter; is the scanning speed.

[0013] Preferably, performing the trajectory optimization operation according to the laser energy distribution diagram and the process time distribution diagram based on a preset laser energy threshold and a preset process time threshold includes: The trajectory optimization operation includes: Extracting laser energy greater than a preset laser energy threshold in the laser energy distribution map, and determining a sub-region corresponding to the laser energy as an energy optimization region; Extracting process time greater than a preset process time threshold in the process time distribution graph, and determining a sub-region corresponding to the process time as a time optimization region; reducing the laser power and increasing the scanning speed in the energy optimization area; The scanning speed is increased in the time-optimized region.

[0014] After extracting the process time greater than the preset process time threshold in the process time distribution graph and determining the sub-region corresponding to the process time as the time optimization region, the method further includes: Performing an operation of reducing laser flight trajectory jump points on the energy optimization area and the time optimization area; The operation of deleting duplicate laser flight trajectory points is performed on the time optimization area.

[0015] In a second aspect, the present invention provides a trajectory optimization device for laser flight processing, comprising: Parameter extraction module, used to divide the processing area into sub-regions, and obtaining part feature parameters and process feature parameters of the sub-regions; A feature calculation module, used to perform incident feature calculation according to the part feature parameters and the process feature parameters to obtain an incident path length and an incident angle; A path calculation module, used to calculate according to the incident path length and the incident angle to obtain the reflection path length; An area calculation module, used to perform area calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the incident sub-region area and the reflection sub-region area; An energy calculation module, used to perform energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameters to obtain laser energy; A time calculation module, used to perform time calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the process time; A graph construction module, used to perform a distribution graph construction operation according to the laser energy and the process time to obtain a laser energy distribution graph and a process time distribution graph; The trajectory optimization module is used to perform trajectory optimization operations according to the laser energy distribution diagram and the process time distribution diagram, based on a preset laser energy threshold and a preset process time threshold.

[0016] In a third aspect, the present invention further provides an electronic device comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein when the processor executes the computer program, the trajectory optimization method for laser flight processing described in any one of the above is implemented.

[0017] In a fourth aspect, the present invention further provides a computer-readable storage medium, which includes a stored computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute any one of the above-mentioned laser flight processing trajectory optimization methods.

[0018] The present invention provides a trajectory optimization method and device for laser flight processing to achieve simplified trajectory optimization and dynamically balance energy and time distribution. By dividing the processing area into N sub-areas, the part feature parameters and process feature parameters are obtained, and the incident feature and reflection feature are calculated based on these parameters to obtain the incident path length, the incident angle, and the reflection path length. These data are used to calculate the area, and the area of ​​the incident sub-area and the area of ​​the reflection sub-area are obtained respectively. The laser energy is calculated based on the area and the process feature parameters, and the process time of each area is further calculated. Finally, through the laser energy distribution diagram and the process time distribution diagram, based on the preset laser energy threshold and process time threshold, the laser power, scanning speed and flight path of the trajectory are optimized.

[0019] The present invention reduces the complexity of the global processing trajectory by dividing the processing area and calculating the characteristic parameters and process parameters in each area. The incident path length and angle of each area reflect the interactive characteristics of the laser and the surface of the part, calculate the energy distribution and processing time, and ensure the reliability and adaptability of the processing path. At the same time, by constructing a laser energy distribution map and a process time distribution map, it is possible to identify high-energy areas and long-time areas, and adjust the laser power and scanning speed in a targeted manner, thereby achieving dynamic optimization. During the optimization process, the overheating risk of high-energy areas and the processing delay problem of long-time areas are reduced by reducing the power and increasing the scanning speed of the energy optimization area and the time optimization area respectively. In addition, the trajectory jump points and the repeated trajectory point deletion operations are further reduced, which improves the continuity and smoothness of the laser flight path and avoids the influence of multiple repeated scans on the processing efficiency.

[0020] In summary, the present invention simplifies the generation and optimization process of the processing trajectory by optimizing trajectory generation and flight path, improves processing efficiency and trajectory calculation stability, and ultimately achieves a dynamic balance between laser energy and time, thereby improving processing quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic flow chart of a trajectory optimization method for laser on-the-fly machining provided by a first embodiment of the present invention; Figure 2 It is a schematic diagram of the structure of a trajectory optimization device for laser flight machining provided by the second embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Reference Figure 1 The first embodiment of the present invention provides a trajectory optimization method for laser flight processing, comprising the following steps: S11, divide the processing area into sub-regions, and obtaining part feature parameters and process feature parameters of the sub-regions; S12, performing incident characteristic calculation according to the part characteristic parameters and the process characteristic parameters to obtain an incident path length and an incident angle; S13, calculating according to the incident path length and the incident angle to obtain a reflection path length; S14, performing area calculation according to the process characteristic parameter, the incident path length, and the reflection path length to obtain an incident sub-region area and a reflection sub-region area; S15, performing energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameter to obtain laser energy; S16, performing time calculation according to the process characteristic parameter, the incident path length and the reflection path length to obtain process time; S17, performing a distribution map construction operation according to the laser energy and the process time to obtain a laser energy distribution map and a process time distribution map; S18, performing a trajectory optimization operation according to the laser energy distribution diagram and the process time distribution diagram based on a preset laser energy threshold and a preset process time threshold.

[0024] In step S11, the processing area needs to be divided into sub-regions, and obtain part feature parameters and process feature parameters of the sub-regions, including: First, the processing area needs to be divided into The main purpose of the sub-region is to deal with the complex geometric characteristics and processing characteristics of the parts. By dividing the overall area into smaller units, feature calculation and trajectory optimization can be performed on each area step by step, avoiding the high computational complexity and failure risk caused by global processing.

[0025] Next, in each sub-region, the following two types of parameters need to be obtained: part feature parameters and process feature parameters. Among them, the part feature parameters include part length, part width, and part tilt angle. The part length is directly read or measured from the CAD model of the part, which is used to determine the total length of the machining area, further used to divide the sub-regions and calculate the incident path length; the part width is also obtained by reading or measuring from the CAD model, which is used to determine the boundary dimensions of the sub-region and participate in the calculation of the incident path length. The part tilt angle is obtained through the geometric shape characteristics of the part or analysis by the scanning device; it is used to calculate the interaction characteristics (incident angle, reflection path) between the laser and the part surface, which affects the trajectory planning; the process feature parameters include spot diameter, laser power, scanning speed, reflection energy ratio, absorption coefficient, part machining time, upper boundary ordinate, and lower boundary ordinate. The spot diameter is obtained from the parameter settings of the laser device (for example, 1.5 mm), and its function is to directly affect the coverage area of the laser irradiation and is used for the calculation of the incident area and the reflection area; the laser power is provided by the laser device and is set according to the processing requirements, and its function is to affect the laser energy distribution in each sub-region; the scanning speed is set by the operating speed of the laser scanning device (for example, 100 m / s), which directly affects the processing time and the trajectory smoothness.

[0026] It should be noted that the reflection energy ratio is a key parameter in laser processing, which represents the proportion of energy lost due to reflection after the laser irradiates the part surface. Specifically, the reflection energy ratio is greater than 0 and less than or equal to 1, and its value is set by querying from the standard material database according to the part material (such as metal, ceramic, plastic).

[0027] For example, the reflection energy ratio of aluminum alloy (smooth surface) is 0.7 - 0.85, while that of stainless steel is 0.6 - 0.75. If the reflection energy ratio is relatively large (0.8), the laser energy utilization rate decreases, and it is necessary to increase the laser power or the number of scans. If the reflection energy ratio is relatively small (0.2), the laser power is easily sufficient to meet the processing requirements; the absorption coefficient represents the absorption ability of the material to laser energy, and its value range is 0 < k ≤ 1. For example, for high-absorption materials (such as ceramics), k ≈ 0.8 - 1; for low-absorption materials (such as smooth metal surfaces), k ≈ 0.5 - 0.7; the part machining time is obtained through the preset processing process. Specifically, the preprocessing process refers to the part machining time test of the part before the formal start of laser flying machining. By obtaining a series of data and processing them, the part machining time is obtained. The part machining time is used to calculate the machining time of each sub-region and evaluate the processing efficiency; the upper boundary ordinate and the lower boundary ordinate are used to define the boundaries of the machining area in the vertical direction. They determine the height range of each sub-region and are the core parameters for the calculation of the machining path (especially the incident angle and the reflection path), and the boundary information of the part machining area is directly read through the CAD model.

[0028] In step S12, it is necessary to perform incident characteristic calculation according to the part characteristic parameters and the process characteristic parameters to obtain the incident path length and the incident angle, including: First, it is necessary to calculate the incident path length based on the part length and the part width, wherein the calculation formula of the incident path length is: ; In the formula, is the part length; Indicates Area number; is the part width; is the incident path length; It should be noted that the incident path length Indicates the distance from the processing starting point to the current sub-area, which directly affects the distribution of laser energy and trajectory range; area number Determined by the division rules of the processing area, the numbering starts from 1 and increases. For example, if the processing area is divided into 10 sub-areas, the numbering .

[0029] Next, the incident angle needs to be calculated. The incident angle determines the way the laser interacts with the surface of the part, and directly affects the reflection path of the laser energy and the processing effect. The calculation formula of the incident angle is: ; In the formula, is the angle of incidence; is the part tilt angle; is the upper boundary ordinate; is the lower boundary ordinate.

[0030] In step S13, it is necessary to calculate according to the incident path length and the incident angle to obtain the reflection path length, including: In a specific embodiment, the reflection path is a path along which a portion of the laser energy propagates after the laser intersects the surface of the part, and the length of the reflection path directly affects the distribution of processing energy and trajectory planning.

[0031] Specifically, the calculation formula of the reflection path length is: ; In the formula, is the reflection path length; is the incident path length; is the angle of incidence.

[0032] It should be noted that For the The reflection path length of each sub-region; For the The incident path length of each sub-region; It is The incident angle of each sub-area.

[0033] In step S14, it is necessary to perform area calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the incident sub-region area and the reflection sub-region area, including: Exemplarily, the incident sub-region area refers to the surface area covered by the laser beam incident in the sub-region, wherein the calculation formula for the incident sub-region area is: ; In the formula, is the area of ​​the incident sub-region; is the incident path length; is the spot diameter; Exemplarily, the reflection sub-region area refers to the surface area covered by the reflection of the laser beam in the sub-region, wherein the calculation formula of the reflection sub-region area is: ; In the formula, is the area of ​​the reflection sub-region; is the reflection path length.

[0034] In step S15, it is necessary to perform energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameters to obtain laser energy, including: First, calculation is performed based on the parameters obtained in the above steps, wherein the calculation formula of the laser energy is: ; In the formula, is the reflected energy ratio; is the absorption coefficient; is the laser power; is the area of ​​the incident sub-region; is the area of ​​the reflection sub-region; For the The laser energy in the area.

[0035] In a specific embodiment, laser energy is the core parameter of energy distribution per unit area in the sub-region. Uniform energy distribution can ensure consistent processing quality. If the laser energy exceeds the set threshold, the laser power needs to be reduced; if the laser energy is lower than the set threshold, the laser power needs to be increased.

[0036] In step S16, it is necessary to perform time calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the process time, including: First, based on the parameters obtained in the above steps, calculation is performed, wherein the calculation formula of the process time is: ; In the formula, For the Process time for each area; is the parts processing time; is the incident path length; is the reflection path length; is the spot diameter; is the scanning speed.

[0037] It should be noted that the incident path length and the reflection path length determine the total processing path length of the laser beam in the sub-area; the regulation of the spot diameter and the scanning speed is directly related to the processing efficiency and accuracy. Increasing the spot diameter and increasing the scanning speed can reduce the processing time, but will reduce the accuracy, while reducing the spot diameter and slowing down the scanning speed can improve the accuracy, but will increase the processing time; the part processing time reflects the impact of non-processing operations on the total time and is an important basic parameter for evaluating processing efficiency.

[0038] In step S17, a distribution diagram construction operation needs to be performed according to the laser energy and the process time to obtain a laser energy distribution diagram and a process time distribution diagram, including: First, the laser energy and process time data are organized into a two-dimensional array, where the data of each sub-area corresponds to its position in the processing area. For example, after the processing area is divided into N sub-areas, the laser energy and process time of each sub-area are stored in the grid cells in the two-dimensional coordinate system. Then, a distribution map is constructed based on these data. The laser energy distribution map is used to show the energy intensity of each sub-area, and the process time distribution map is used to show the processing time required for each sub-area.

[0039] Specifically, in the laser energy distribution diagram, a color gradient is used to represent the energy value. ) areas use cool colors (such as blue), high energy ( ) area uses warm colors (such as red). This representation method can clearly identify areas with too high energy (such as red areas) or insufficient energy (such as blue areas), thus providing a basis for adjusting laser power or path planning. Similarly, in the process time distribution diagram, the length of processing time is reflected by the depth of color. For example, dark areas indicate longer time due to complex paths, repeated processing or other reasons; light areas indicate shorter time, with problems of low processing efficiency or insufficient coverage.

[0040] It should be noted that these two distribution maps can not only help identify abnormal areas during the processing, but also provide specific directions for subsequent parameter optimization. ) areas, overheating can be avoided by reducing the laser power or increasing the scanning speed; for areas with too long ( ) area, the trajectory optimization can be adjusted or repeated paths can be reduced to shorten the processing time. In addition, by analyzing the energy and time variation patterns in the distribution map, the spot diameter and path spacing can be dynamically optimized to make the processing process more uniform and efficient.

[0041] In step S18, it is necessary to perform a trajectory optimization operation according to the laser energy distribution diagram and the process time distribution diagram, based on a preset laser energy threshold and a preset process time threshold, including: First, sub-regions where the laser energy is greater than the threshold are extracted from the laser energy distribution map and these regions are marked as energy-optimized regions. ) area will cause processing overheating or material surface defects, so targeted optimization is required. Subsequently, sub-areas with process time greater than the threshold are extracted from the process time distribution map. These areas are marked as time optimization areas, indicating that the processing time is too long, which is caused by overly complex paths or repeated operations, and measures need to be taken to improve efficiency.

[0042] For the energy optimization area, adjustments are made by reducing the laser power and increasing the scanning speed. Reducing the laser power can reduce the total energy input to the material by the laser. For example, reducing the laser power from 200 W to 180 W can avoid local overheating caused by high energy. At the same time, by increasing the scanning speed, such as increasing the speed from 100 mm / s to 120 mm / s, the movement of the laser beam can be accelerated, the energy accumulation at a single position can be reduced, and the overall processing efficiency can be improved. For the time optimization area, the processing time is mainly reduced by increasing the scanning speed. For example, if the processing time of a certain area is 25 s, which exceeds the threshold of 20 s, the scanning speed can be increased from 100 mm / s1 to 125 mm / s to shorten the processing time.

[0043] In a specific embodiment, after extracting the process time greater than a preset process time threshold in the process time distribution diagram and determining the sub-region corresponding to the process time as the time optimization region, it also includes: reducing the laser flight trajectory jump point operation on the energy optimization region and the time optimization region; and deleting duplicate laser flight trajectory points on the time optimization region.

[0044] Specifically, the jump points of the laser flight trajectory are reduced, and the continuity of the trajectory path is optimized by merging continuous sub-areas to avoid increased processing time and decreased efficiency due to path jumps. Secondly, duplicate trajectory points are deleted, and within the time optimization area, it is checked whether there are trajectories that cover the same area multiple times, and redundant points are removed to ensure that the processing path is concise and efficient. These optimization measures make the laser processing path smoother, while reducing the number of laser starts and stops and reducing equipment wear.

[0045] It should be noted that the preset laser energy threshold and process time threshold can be flexibly set according to the processing requirements and material characteristics. For metal materials, such as aluminum and stainless steel, the laser energy threshold can be set to , while for ceramic or plastic materials, set to ; The process time threshold is set to 20-25 s, and can be set to 25-30 s for special areas of complex parts.

[0046] The following describes the working process of the present invention using a common scenario as an example. Figure 2 , which is Figure 1 Schematic diagram of the working scenario of the method.

[0047] In a complex metal part laser processing scenario, the part has a size of 100 mm × 50 mm, a surface with an inclination angle of 15°, and multiple geometric features that require precise processing. In order to cope with the complexity of processing and improve efficiency, the processing area is first divided into N = 10 sub-areas, each with a length of 10 mm and a width of 5 mm. Through the CAD model of the part, the characteristic parameters, including the length, width and inclination angle of the part, are extracted; at the same time, the process parameters are obtained from the laser equipment, such as the spot diameter of 1.5 mm, the laser power of 200 W, the scanning speed of 100 mm / s, and the reflection energy ratio of 0.8 and the absorption coefficient of 0.7. In addition, the upper boundary ordinate Ymax = 50 mm and the lower boundary ordinate Ymin = 0 mm of the processing area are also read through the CAD model for subsequent calculation of the laser path and angle.

[0048] In the processing preparation stage, the incident path length and incident angle of each sub-area are calculated in turn. For example, the incident path length of the third sub-area is calculated to be 480 mm, and its incident angle is calculated to be 12°. These parameters directly affect the interaction mode of the laser on the surface of the part and are also used to determine the reflection path length. According to the reflection path length formula, the reflection path length of this sub-area is 470.1 mm.

[0049] Next, the incident area and reflection area of ​​the sub-region are calculated by the length of the incident path and the reflection path. For example, the incident area of ​​the third sub-region is 720 , the reflection area is 705.15 , based on the area data, the laser energy is further calculated, and the laser energy in this area is calculated by the formula: , exceeding the preset energy threshold Therefore, this area is marked as a high energy area and adjustments in power and speed are required.

[0050] In the process time calculation, the processing time of the 5th sub-area is calculated as 25 s by combining the incident and reflected path lengths, which also exceeds the preset time threshold of 20 s. Therefore, this area is marked as a time optimization area. For these problem areas, the laser power is reduced from 200 W to 180 W, and the scanning speed is increased from 100 mm / s to 125 mm / s. In the time optimization area, adjacent sub-areas are merged to reduce jump points. At the same time, repeated trajectory points are checked and deleted to make the path smoother and avoid repeated processing.

[0051] Through the visual analysis of laser energy distribution diagram and process time distribution diagram, high energy areas are marked with warm colors, such as red ( ), low energy areas are marked with cool colors, such as blue ( The process time distribution diagram shows the time distribution through light and dark colors. ) area is marked as the time optimization area. After optimization, the laser power and scanning speed are reasonably adjusted, the trajectory jump points are reduced by 20%, the processing time is shortened by 15%, the overall efficiency is improved, and processing defects caused by overheating or insufficient energy are avoided.

[0052] In the optimized processing, the laser energy and processing time of each sub-area are further dynamically adjusted in combination with the characteristics of the processed material. For example, for metal materials (such as aluminum and stainless steel), due to their high reflection energy ratio (0.7-0.85), the utilization rate of laser energy is low, so the high energy area adopts the method of increasing the scanning speed and optimizing the path to reduce the excess energy. For ceramic materials, due to their high absorption coefficient (0.8-1) and high energy utilization efficiency, more attention is paid to time optimization to reduce the heat accumulation problem caused by processing time.

[0053] When generating laser energy distribution maps and process time distribution maps, the color gradient visualization allows operators to quickly identify processing problem areas. For example, certain dark red areas (high energy or long time) are highlighted, and after parameter optimization, the color distribution of these areas gradually becomes uniform. During the entire processing process, the time distribution map and energy distribution map serve as real-time feedback tools, which not only assist in adjusting the processing path and parameters, but also make the entire processing process more transparent and controllable.

[0054] Ultimately, this technical solution increased the overall efficiency of laser processing by about 15-20%, while reducing the risk of defects caused by uneven energy or long processing time. The optimized trajectory design ensures the uniformity of surface processing quality of complex parts and reduces energy waste.

[0055] In summary, the present invention provides a trajectory optimization method and device for laser flight processing to achieve simplified trajectory optimization and dynamically balance energy and time distribution. By dividing the processing area into N sub-areas, obtaining part feature parameters and process feature parameters, and calculating the incident feature and reflection feature based on these parameters, the incident path length, incident angle and reflection path length are obtained. These data are used to calculate the area, and the incident sub-area area and the reflection sub-area area are obtained respectively. The laser energy is calculated based on the area and the process feature parameters, and the process time of each area is further calculated. Finally, through the laser energy distribution diagram and the process time distribution diagram, based on the preset laser energy threshold and process time threshold, the laser power, scanning speed and flight path of the trajectory are optimized. The present invention reduces the complexity of the global processing trajectory by dividing the processing area and calculating the feature parameters and process parameters in different areas. The incident path length and angle of each area reflect the interactive characteristics between the laser and the part surface, calculate the energy distribution and processing time, and ensure the reliability and adaptability of the processing path. At the same time, by constructing laser energy distribution maps and process time distribution maps, high-energy areas and long-time areas can be identified, and the laser power and scanning speed can be adjusted in a targeted manner to achieve dynamic optimization. During the optimization process, the overheating risk in high-energy areas and the processing delay problem in long-time areas were reduced by reducing the power and increasing the scanning speed in energy optimization areas and time optimization areas respectively. In addition, the operation of further reducing trajectory jump points and deleting duplicate trajectory points improves the continuity and smoothness of the laser flight path and avoids the impact of multiple repeated scans on processing efficiency.

[0056] In summary, the present invention simplifies the generation and optimization process of the processing trajectory by optimizing trajectory generation and flight path, improves processing efficiency and trajectory calculation stability, and ultimately achieves a dynamic balance between laser energy and time, thereby improving processing quality and efficiency.

[0057] Reference Figure 2 The second embodiment of the present invention provides a trajectory optimization device for laser flying processing, comprising: Parameter extraction module, used to divide the processing area into sub-regions, and obtaining part feature parameters and process feature parameters of the sub-regions; A feature calculation module, used to perform incident feature calculation according to the part feature parameters and the process feature parameters to obtain an incident path length and an incident angle; A path calculation module, used to calculate according to the incident path length and the incident angle to obtain the reflection path length; An area calculation module, used to perform area calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the incident sub-region area and the reflection sub-region area; An energy calculation module, used to perform energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameters to obtain laser energy; A time calculation module, used to perform time calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the process time; A graph construction module, used to perform a distribution graph construction operation according to the laser energy and the process time to obtain a laser energy distribution graph and a process time distribution graph; The trajectory optimization module is used to perform trajectory optimization operations according to the laser energy distribution diagram and the process time distribution diagram, based on a preset laser energy threshold and a preset process time threshold.

[0058] Preferably, the parameter extraction module is specifically used to divide the processing area into sub-regions, and obtain part feature parameters and process feature parameters of the sub-regions, including: The part characteristic parameters include part length, part width and part inclination angle; The process characteristic parameters include spot diameter, laser power, scanning speed, reflection energy ratio, absorption coefficient, part processing time, upper boundary ordinate and lower boundary ordinate.

[0059] Preferably, the feature calculation module is specifically used to perform incident feature calculation according to the part feature parameters and the process feature parameters to obtain the incident path length and the incident angle, including: The calculation formula of the incident path length is: ; In the formula, is the part length; Indicates Area number; is the part width; is the incident path length; The calculation formula of the incident angle is: ; In the formula, is the angle of incidence; is the part tilt angle; is the upper boundary ordinate; is the lower boundary ordinate.

[0060] Preferably, the path calculation module is specifically used to calculate according to the incident path length and the incident angle to obtain the reflection path length, including: The calculation formula of the reflection path length is: ; In the formula, is the reflection path length; is the incident path length; is the angle of incidence.

[0061] Preferably, the area calculation module is specifically used to perform area calculation according to the process characteristic parameter, the incident path length and the reflection path length to obtain the incident sub-region area and the reflection sub-region area, including: The calculation formula of the incident sub-region area is: ; In the formula, is the area of ​​the incident sub-region; is the incident path length; is the spot diameter; The calculation formula of the reflection sub-region area is: ; In the formula, is the area of ​​the reflection sub-region; is the reflection path length.

[0062] Preferably, the energy calculation module is specifically used to perform energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameter to obtain the laser energy, including: The calculation formula of the laser energy is: ; In the formula, is the reflected energy ratio; is the absorption coefficient; is the laser power; is the area of ​​the incident sub-region; is the area of ​​the reflection sub-region; For the The laser energy in the area.

[0063] Preferably, the time calculation module is specifically used to perform time calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the process time, including: The calculation formula of the process time is: ; In the formula, For the Process time for each area; is the parts processing time; is the incident path length; is the reflection path length; is the spot diameter; is the scanning speed.

[0064] Preferably, the graphic construction module is specifically used to perform a distribution map construction operation according to the laser energy and the process time to obtain a laser energy distribution map and a process time distribution map.

[0065] Preferably, the trajectory optimization module is specifically used to perform trajectory optimization operations according to the laser energy distribution diagram and the process time distribution diagram, based on a preset laser energy threshold and a preset process time threshold, including: The trajectory optimization operation includes: Extracting laser energy greater than a preset laser energy threshold in the laser energy distribution map, and determining a sub-region corresponding to the laser energy as an energy optimization region; Extracting process time greater than a preset process time threshold in the process time distribution graph, and determining a sub-region corresponding to the process time as a time optimization region; reducing the laser power and increasing the scanning speed in the energy optimization area; The scanning speed is increased in the time-optimized region.

[0066] After extracting the process time greater than the preset process time threshold in the process time distribution graph and determining the sub-region corresponding to the process time as the time optimization region, the method further includes: Performing an operation of reducing laser flight trajectory jump points on the energy optimization area and the time optimization area; The operation of deleting duplicate laser flight trajectory points is performed on the time optimization area.

[0067] It should be noted that a trajectory optimization device for laser flight processing provided in an embodiment of the present invention is used to execute all process steps of a trajectory optimization method for laser flight processing in the above-mentioned embodiment. The working principles and beneficial effects of the two correspond one to one, and thus will not be elaborated on herein.

[0068] The embodiment of the present invention further provides an electronic device. The electronic device includes: a processor, a memory, and a computer program stored in the memory and executable on the processor, such as an incident angle calculation program. When the processor executes the computer program, the steps in the above-mentioned laser flight processing trajectory optimization method embodiments are implemented, such as Figure 1 Alternatively, when the processor executes the computer program, the functions of the modules / units in the above-mentioned device embodiments are realized, such as the parameter extraction module.

[0069] Exemplarily, the computer program may be divided into one or more modules / units, which are stored in the memory and executed by the processor to implement the present invention. The one or more modules / units may be a series of computer program instruction segments capable of implementing specific functions, which are used to describe the execution process of the computer program in the electronic device.

[0070] The electronic device may be a computing device such as a desktop computer, a notebook, a PDA, and a smart tablet. The electronic device may include, but is not limited to, a processor and a memory. Those skilled in the art will appreciate that the above components are merely examples of electronic devices and do not constitute a limitation on the electronic device. The electronic device may include more or fewer components than the above components, or may combine certain components, or different components. For example, the electronic device may also include input and output devices, network access devices, buses, etc.

[0071] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the electronic device, and uses various interfaces and lines to connect various parts of the entire electronic device.

[0072] The memory can be used to store the computer program and / or module, and the processor realizes various functions of the electronic device by running or executing the computer program and / or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the mobile phone (such as audio data, a phone book, etc.), etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0073] Wherein, if the module / unit integrated in the electronic device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0074] It should be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the accompanying drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art may understand and implement it without paying any creative effort.

[0075] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A trajectory optimization method for laser flight processing, characterized in that: include: The processing area is divided into sub-regions, and obtaining part feature parameters and process feature parameters of the sub-regions; According to the part characteristic parameters and the process characteristic parameters, incident characteristic calculation is performed to obtain the incident path length and the incident angle; Calculating according to the incident path length and the incident angle to obtain the reflection path length; Performing area calculation according to the process characteristic parameters, the incident path length, and the reflection path length to obtain the incident sub-region area and the reflection sub-region area; Performing energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameters to obtain laser energy; Performing time calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain process time; According to the laser energy and the process time, a distribution map construction operation is performed to obtain a laser energy distribution map and a process time distribution map; According to the laser energy distribution diagram and the process time distribution diagram, a trajectory optimization operation is performed based on a preset laser energy threshold and a preset process time threshold.

2. The trajectory optimization method for laser flying machining according to claim 1, characterized in that: The part characteristic parameters include part length, part width and part inclination angle; The process characteristic parameters include spot diameter, laser power, scanning speed, reflection energy ratio, absorption coefficient, part processing time, upper boundary ordinate and lower boundary ordinate.

3. The trajectory optimization method for laser flying machining according to claim 2, characterized in that: The calculation formula of the incident path length is: ； In the formula, is the part length; Indicates Area number; is the part width; is the incident path length; The calculation formula of the incident angle is: ； In the formula, is the angle of incidence; is the part tilt angle; is the upper boundary ordinate; is the lower boundary ordinate.

4. The trajectory optimization method for laser on-the-fly machining according to claim 3, characterized in that: The calculation formula of the reflection path length is: ； In the formula, is the reflection path length; is the incident path length; is the angle of incidence.

5. The trajectory optimization method for laser on-the-fly machining according to claim 4, characterized in that: The calculation formula of the incident sub-region area is: ； In the formula, is the area of ​​the incident sub-region; is the incident path length; is the spot diameter; The calculation formula of the reflection sub-region area is: ； In the formula, is the area of ​​the reflection sub-region; is the reflection path length.

6. The trajectory optimization method for laser on-the-fly machining according to claim 5, characterized in that: The calculation formula of the laser energy is: ； In the formula, is the reflected energy ratio; is the absorption coefficient; is the laser power; is the area of ​​the incident sub-region; is the area of ​​the reflection sub-region; For the The laser energy in the area.

7. The trajectory optimization method for laser on-the-fly machining according to claim 4, characterized in that: The calculation formula of the process time is: ； In the formula, For the Process time for each area; is the parts processing time; is the incident path length; is the reflection path length; is the spot diameter; is the scanning speed.

8. The trajectory optimization method for laser on-the-fly machining according to claim 1, characterized in that: The trajectory optimization operation includes: Extracting laser energy greater than a preset laser energy threshold in the laser energy distribution map, and determining a sub-region corresponding to the laser energy as an energy optimization region; Extracting process time greater than a preset process time threshold in the process time distribution graph, and determining a sub-region corresponding to the process time as a time optimization region; reducing the laser power and increasing the scanning speed in the energy optimization area; The scanning speed is increased in the time optimization region.

9. The trajectory optimization method for laser on-the-fly machining according to claim 8, characterized in that: After extracting the process time greater than the preset process time threshold in the process time distribution graph and determining the sub-region corresponding to the process time as the time optimization region, the method further includes: An operation of reducing the jump points of the laser flight trajectory is performed on the energy optimization area and the time optimization area; The operation of deleting duplicate laser flight trajectory points is performed on the time optimization area.

10. A trajectory optimization device for laser flight processing, characterized in that: include: Parameter extraction module, used to divide the processing area into sub-regions, and obtaining part feature parameters and process feature parameters of the sub-regions; A feature calculation module, used to perform incident feature calculation according to the part feature parameters and the process feature parameters to obtain an incident path length and an incident angle; A path calculation module, used to calculate according to the incident path length and the incident angle to obtain the reflection path length; An area calculation module, used to perform area calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the incident sub-region area and the reflection sub-region area; An energy calculation module, used to perform energy calculation according to the incident sub-region area, the reflection sub-region area and the process characteristic parameters to obtain laser energy; A time calculation module, used to perform time calculation according to the process characteristic parameters, the incident path length and the reflection path length to obtain the process time; A graph construction module, used to perform a distribution graph construction operation according to the laser energy and the process time to obtain a laser energy distribution graph and a process time distribution graph; The trajectory optimization module is used to perform trajectory optimization operations according to the laser energy distribution diagram and the process time distribution diagram, based on a preset laser energy threshold and a preset process time threshold.

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