Quick-action switch life evaluation method and device, computer equipment and storage medium

Abstract

The invention discloses a quick-action switch service life evaluation method and device, computer equipment and a storage medium, relates to the technical field of switch fault prediction, and can solve the technical problem of inaccurate quick-action switch service life evaluation at present. Comprising the steps of determining service life stress of the quick-action switch according to failure characteristics of the quick-action switch, performing a service life test on the quick-action switch according to the service life stress, and monitoring parameter degradation data corresponding to each parameter in real time in the test process; the failure type of the quick-action switch is determined according to the parameter degradation data, and the failure type comprises failure with a degradation track and random failure; if the failure type is failure with a degradation track, fitting the parameter degradation data to obtain a fitting curve of the parameter degradation data and the test time, evaluating the service life of the quick-action switch according to the fitting curve and a preset service life failure threshold value corresponding to the parameters, and if the failure type is random failure, evaluating the service life of the quick-action switch. And evaluating the service life of the quick-action switch based on the standard Brownian motion and inverse Gaussian distribution.

Description

Technical Field

[0001] The present invention relates to the technical field of switch fault prediction, and in particular to a method, device, computer equipment and storage medium for evaluating the life of a quick-acting switch. Background Art

[0002] As a commonly used electromechanical component, switches are usually affected by various life stresses during use. In order to ensure product reliability, their life needs to be evaluated during device selection and product design.

[0003] The current life assessment method for switches is to use multiple temperature levels to conduct accelerated stress tests simultaneously, and regularly take samples for performance parameter tests, and perform life assessment based on the degradation characteristics of the performance parameters combined with the Arrhenius model. However, on the one hand, the failure or failure of the snap-action switch is random in application, and the actual failure time of the switch cannot be accurately obtained through the timing detection method. At the same time, due to the randomness of the failure, the obtained life data has a low confidence level. On the other hand, the operating environment temperature of the snap-action switch is much lower than the temperature specified in its product manual, and its failure is caused by multiple life stresses. The life obtained by using only temperature stress does not match the actual life. Summary of the invention

[0004] In view of this, the present invention provides a method, device, computer equipment and storage medium for evaluating the life of a snap-action switch, which can solve the current technical problem of inaccurate evaluation of the life of a snap-action switch.

[0005] According to a first aspect of the present invention, a method for evaluating the life of a snap-action switch is provided, the method comprising:

[0006] Determine the life stress of the snap-action switch according to the failure characteristics of the snap-action switch, perform a life test on the snap-action switch according to the life stress, and monitor parameter degradation data corresponding to each parameter in real time during the test;

[0007] Determining a failure type of the snap-action switch according to the parameter degradation data, wherein the failure type includes a failure with a degradation trajectory and a random failure;

[0008] If the failure type is a failure with a degradation trajectory, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time, and the life of the snap-action switch is evaluated according to a preset life failure threshold corresponding to the fitting curve and the parameter. If the failure type is a random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution.

[0009] Preferably, determining the life stress of the snap-action switch according to the failure characteristics of the snap-action switch comprises:

[0010] Determine the failure characteristics of snap-action switches as connection failure, disconnection failure, action sticking, and contact erosion;

[0011] The life stress of the snap-action switch corresponding to the connection failure, disconnection failure and action jam is determined to be mechanical stress, and the life stress of the snap-action switch corresponding to the contact erosion is determined to be electrical stress.

[0012] Preferably, the performing a life test on the snap-action switch according to the life stress comprises:

[0013] Install a specified number of snap-action switches on a mechanical stress endurance test bench;

[0014] Simulate the pressing force and switch contact displacement during the operation of the snap-action switch;

[0015] Apply electrical stress and load under working conditions to the snap-action switch;

[0016] The snap-action switch is subjected to a preset number of mechanical stress and electrical stress switch fatigue durability tests.

[0017] Preferably, during the test, real-time monitoring of parameter degradation data corresponding to each parameter includes:

[0018] Use force sensors to monitor the pressing force data of each snap-action switch in real time, adjust the laser displacement sensor so that the light is aimed at the reflective sticker installed at the switch contact, and monitor the switch contact displacement data in real time during the switch action process;

[0019] Use Hall sensors and acquisition cards to monitor the action voltage and current data of the quick-acting switch in real time;

[0020] Real-time monitoring of load data;

[0021] The pressing force data, the switch contact displacement data, the operating voltage data, the operating current data, and the load data are used as parameter degradation data.

[0022] Preferably, the method of evaluating the life of the snap-action switch according to a preset life failure threshold value corresponding to the fitting curve and the parameter includes:

[0023] For each parameter, determining a first target test time corresponding to a preset life failure threshold value corresponding to the parameter on the fitting curve;

[0024] The minimum value of the first target test time corresponding to all parameters is determined as the life of the snap-action switch.

[0025] Preferably, the evaluating the life of the snap-action switch based on standard Brownian motion and inverse Gaussian distribution comprises:

[0026] Construct a lifespan model based on standard Brownian motion;

[0027] A remaining life distribution function is constructed based on the preset life failure threshold corresponding to the parameter, the inverse Gaussian distribution and the life model, wherein the remaining life distribution function is:

[0028]

[0029] Wherein, t is the test time, y0 is the initial value of the parameter degradation, μ is the drift coefficient, σ is the diffusion coefficient, and D is the preset life failure threshold;

[0030] The snap switch lifetime is estimated based on the remaining lifetime distribution function.

[0031] Preferably, the evaluating the life of the snap-action switch according to the remaining life distribution function comprises:

[0032] Calculating a second target test time when the remaining life distribution function is zero;

[0033] The minimum value of the second target test time corresponding to all parameters is determined as the life of the snap-action switch.

[0034] According to a second aspect of the present invention, there is provided a device for evaluating the life of a snap-action switch, the device comprising:

[0035] A test module, used to determine the life stress of the snap-action switch according to the failure characteristics of the snap-action switch, perform a life test on the snap-action switch according to the life stress, and monitor parameter degradation data corresponding to each parameter in real time during the test;

[0036] A determination module, configured to determine a failure type of the snap-action switch according to the parameter degradation data, wherein the failure type includes a failure with a degradation trajectory and a random failure;

[0037] An evaluation module is used to fit the parameter degradation data if the failure type is a failure with a degradation trajectory to obtain a fitting curve of the parameter degradation data and the test time, and to evaluate the life of the snap-action switch according to a preset life failure threshold corresponding to the fitting curve and the parameter; if the failure type is a random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution.

[0038] According to a third aspect of the present application, a storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the above-mentioned method for evaluating the life of a snap-action switch is implemented.

[0039] According to a fourth aspect of the present application, a computer device is provided, comprising a storage medium, a processor, and a computer program stored on the storage medium and executable on the processor, wherein the processor implements the above-mentioned method for evaluating the life of a quick-acting switch when executing the program.

[0040] By means of the above technical scheme, the present invention provides a method, device, computer equipment and storage medium for evaluating the life of a snap-action switch. First, the life stress of the snap-action switch is determined according to the failure characteristics of the snap-action switch, and a life test is performed on the snap-action switch according to the life stress. During the test, the parameter degradation data corresponding to each parameter is monitored in real time; then, the failure type of the snap-action switch is determined according to the parameter degradation data, wherein the failure type includes failure with a degradation trajectory and random failure; finally, if the failure type is a failure with a degradation trajectory, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time, and the life of the snap-action switch is evaluated according to the preset life failure threshold corresponding to the fitting curve and the parameter; if the failure type is a random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution. Through the technical solution of the present invention, on the one hand, the life stress that causes the failure of the snap-action switch in the actual use process is determined according to the failure characteristics of the snap-action switch, and the life test of the snap-action switch is carried out under such life stress, which ensures that the life test of the snap-action switch is consistent with the actual situation, improves the accuracy of the parameter degradation data, and thus improves the accuracy of the life assessment of the snap-action switch. On the other hand, considering the randomness of failures in the actual use process, in addition to using the corresponding snap-action switch life assessment method for failures with failure trajectories, the corresponding snap-action switch life assessment method is also used for random failures, which is consistent with the actual situation, thereby improving the accuracy of the life assessment of the snap-action switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the local application. In the drawings:

[0042] Figure 1 A schematic flow chart of a method for evaluating the life of a snap-action switch provided in an embodiment of the present invention is shown;

[0043] Figure 2 A schematic flow chart of another method for evaluating the life of a snap-action switch provided in an embodiment of the present invention is shown;

[0044] Figure 3 A schematic structural diagram of a fast-acting switch life assessment device provided by an embodiment of the present invention is shown;

[0045] Figure 4 A schematic structural diagram of another fast-acting switch life assessment device provided by an embodiment of the present invention is shown;

[0046] Figure 5 A schematic diagram of the dimensions of a laser displacement sensor provided by an embodiment of the present invention is shown;

[0047] Figure 6 An example diagram of technical parameters of a laser displacement sensor provided by an embodiment of the present invention is shown;

[0048] Figure 7 An example diagram of interface definition of a laser displacement sensor provided by an embodiment of the present invention is shown;

[0049] Figure 8 A schematic diagram of the appearance of a force sensor provided by an embodiment of the present invention is shown;

[0050] Fig. 9 An example diagram of technical parameters of a force sensor provided by an embodiment of the present invention is shown;

[0051] Fig.10 A schematic diagram of wiring of a force sensor provided by an embodiment of the present invention is shown;

[0052] Fig.11 A schematic diagram of the appearance of a current-voltage converter provided by an embodiment of the present invention is shown;

[0053] Fig.12 A schematic diagram of electrical connection of a current-voltage converter provided by an embodiment of the present invention is shown;

[0054] Fig.13 A schematic diagram of the appearance of a high-speed acquisition oscilloscope provided by an embodiment of the present invention is shown;

[0055] Fig.14 A schematic diagram of a circuit design provided by an embodiment of the present invention is shown;

[0056] Fig.15 A flow chart of life distribution type evaluation provided by an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0057] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0058] This embodiment provides a method for evaluating the life of a snap-action switch. Figure 1 As shown, the method includes:

[0059] 101. Determine the life stress of the snap-action switch according to the failure characteristics of the snap-action switch, perform a life test on the snap-action switch according to the life stress, and during the test, monitor parameter degradation data corresponding to each parameter in real time.

[0060] 102. Determine a failure type of the snap-action switch according to the parameter degradation data, wherein the failure type includes failure with a degradation trajectory and random failure.

[0061] Among them, if the parameter degradation data corresponding to all parameters are continuous as the data change over the test time, the failure type is failure with degradation trajectory. If the parameter degradation data corresponding to only one parameter is discrete as the data change over the test time (i.e., lack of degradation trajectory, sudden failure), the failure type is random failure.

[0062] 103. If the failure type is a failure with a degradation trajectory, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time, and the life of the snap-action switch is evaluated according to a preset life failure threshold corresponding to the fitting curve and the parameter. If the failure type is a random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution.

[0063] In summary, on the one hand, when the prior art evaluates the life of a snap-action switch, the selected life stress is different from the actual usage. The failures of the snap-action switch include connection failure, disconnection failure, action jamming, and contact ablation, which cause these failures to include both electrical stress and mechanical stress. Therefore, only temperature stress evaluation is performed, or only electrical stress evaluation is performed without considering the mechanical stress corresponding to fatigue damage caused by frequent switch operation. The obtained life data is still significantly different from the actual data and is inaccurate. However, step 101 of the embodiment of the present application specifically determines the life stress of the snap-action switch based on the failure characteristics of the snap-action switch, including both electrical stress and mechanical stress. The obtained life is consistent with the actual data, thereby improving the accuracy of the life evaluation.

[0064] On the other hand, the failure or failure of the quick-acting switch is random in application. The existing technology cannot accurately obtain the actual failure time of the quick-acting switch through the timed detection method. At the same time, due to the randomness of the failure, the obtained life data has a low confidence level, that is, it is inaccurate, and cannot be matched to the relevant life model for life assessment. However, in steps 102 and 103 of the embodiment of the present application, there are corresponding life assessment methods for failure types with degradation trajectories, and there are also corresponding life assessment methods for random failures, that is, random failures are taken into account to ensure accurate life assessment when this occurs.

[0065] The present invention provides a method, device, computer equipment and storage medium for evaluating the life of a snap-action switch. First, the life stress of the snap-action switch is determined according to the failure characteristics of the snap-action switch, and the life test of the snap-action switch is performed according to the life stress. During the test, the parameter degradation data corresponding to each parameter is monitored in real time; then, the failure type of the snap-action switch is determined according to the parameter degradation data, wherein the failure type includes failure with degradation trajectory and random failure; finally, if the failure type is failure with degradation trajectory, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time, and the life of the snap-action switch is evaluated according to the preset life failure threshold corresponding to the fitting curve and the parameter, and if the failure type is random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution. Through the technical solution of the present invention, on the one hand, the life stress that causes the failure of the snap-action switch in actual use is determined according to the failure characteristics of the snap-action switch, and the life test of the snap-action switch is performed under such life stress, which ensures that the life test of the snap-action switch is consistent with the actual situation, improves the accuracy of the parameter degradation data, and thus improves the accuracy of the life evaluation of the snap-action switch. On the other hand, considering the randomness of failures in actual use, in addition to using the corresponding snap-action switch life assessment method for failures with failure trajectories, the corresponding snap-action switch life assessment method is also used for random failures, which is consistent with the actual situation, thereby improving the accuracy of the snap-action switch life assessment.

[0066] Further, as a refinement and extension of the specific implementation of the above embodiment, in order to fully illustrate the specific implementation process of this embodiment, another quick-acting switch life assessment method is provided, such as Figure 2 As shown, the method includes:

[0067] 201. Determine the life stress of the snap-action switch based on the failure characteristics of the snap-action switch.

[0068] For this embodiment, determining the life stress of the snap-action switch according to the failure characteristics of the snap-action switch includes: determining the failure characteristics of the snap-action switch to be a connection fault, a disconnection fault, a stuck action, and a contact burnout; determining that the life stress of the snap-action switch corresponding to the connection fault, the disconnection fault, and the stuck action is a mechanical stress, and determining that the life stress of the snap-action switch corresponding to the contact burnout is an electrical stress.

[0069] Among them, the connection failure, disconnection failure, and action jamming are caused by fatigue or mechanical wear of mechanical parts, while contact erosion is caused by the large voltage or current formed by the capacitive load or inductive load at the moment of actual closing / opening of the switch contacts, which causes erosion of the switch contacts. Therefore, it is determined that the life stress of the snap-action switch includes mechanical stress and electrical stress. The problem of selecting the life stress of the snap-action switch is solved.

[0070] 202. Perform a life test on the snap-action switch according to the life stress, and during the test, monitor parameter degradation data corresponding to each parameter in real time.

[0071] For this embodiment, the life stress determined by step 201 of the embodiment is used to select multiple snap-action switch samples, apply simulated action stress, actual electrical stress and matching load, and perform mechanical life and electrical life evaluation for a preset number of actions by increasing the action frequency of the snap-action switches. Specifically: the life test of the snap-action switches according to the life stress includes: installing a specified number of snap-action switches on a mechanical stress endurance test bench; simulating the pressing force and switch contact displacement received by the snap-action switches during operation; applying electrical stress and load under working conditions to the snap-action switches; and performing a preset number of mechanical stress and electrical stress switch fatigue endurance assessments on the snap-action switches.

[0072] That is, for steps 201 and 202 of the embodiment, a life test that meets the failure characteristics is designed based on the failure characteristics of the snap-action switch.

[0073] For this embodiment, the parameters may include: pressing force, switch contact displacement, action voltage, action current, load (i.e., contact resistance), wherein, during the test process, the parameter degradation data corresponding to each parameter is monitored in real time, including: using a force sensor to monitor the pressing force data of each snap-action switch in real time, adjusting the laser displacement sensor so that the light is aimed at the reflective sticker installed at the switch contact, and monitoring the switch contact displacement data in real time during the switch action process; using a Hall sensor and an acquisition card to monitor the action voltage data and action current data of the snap-action switch in real time; monitoring the load data in real time; and using the pressing force data, the switch contact displacement data, the action voltage data, the action current data, and the load data as parameter degradation data. That is, during the test process, the data corresponding to each parameter as the test time is monitored in real time, so as to track the data change of each parameter as the test time in real time, so as to determine the failure type according to the parameter degradation data in step 203 of the embodiment.

[0074] It should be noted that the snap-action switch life assessment method of steps 201-205 of the embodiment is applied in a snap-action switch life assessment system. The snap-action switch life assessment system:

[0075] 1. Hardware configuration:

[0076] In the electrical characteristic test of the fast-acting switch, the conduction voltage, current and on-off anomalies characterized by it have a certain randomness. According to the action characteristics of the switch, a real-time electrical stress acquisition device is designed to conduct electrical stress assessment of the switch. The device has the functions of real-time acquisition, data storage, and data processing. The parameters of the voltage and current acquisition and data processing device are as follows in Table 1:

[0077] Table 1:

[0078]

[0079] 2. Equipment parameters:

[0080] 1) Laser Displacement Sensor ensures the high precision, high repeatability, high reliability and high cost performance of the product. It can be widely used in online and offline measurement of 3C manufacturing production lines, robots, CNC centers, precision assembly lines and other scenes. The dimensions are as follows: Figure 5 As shown, its model is LDS-S-50-D2, and the technical parameters of the laser displacement sensor are as follows Figure 6 As shown, the laser displacement sensor needs an independent power supply with a power supply voltage of 18-24V and uses Vout+ and Vout- output signals, such as Figure 7 shown.

[0081] 2) The force sensor model is ZNLBS-V1-1kg, the range is 10N, and it is a full-bridge sensor. Its appearance is as follows Figure 8 As shown, the technical parameters are as follows Fig. 9 As shown, a four-wire system is used for power supply and signal transmission. The power supply and signal transmission wiring is as follows Fig.10 shown.

[0082] 3) Current acquisition: Current acquisition is mainly divided into current sensors and high-speed acquisition oscilloscopes. The current sensor is the CSV10B-G170T07 current-voltage converter, which has the following appearance: Fig.11 As shown in the figure, the current-voltage converter has a DB9 connector at each end of the housing. The input end is a female connector, which is used to input the current signal to be measured and provide external working power. The output end is a male connector, which is used to connect the working power supply and output the measurement signal. The electrical connection is as follows: Fig.12 There are 16 current-voltage converters in total, which are powered by independent power supplies.

[0083] The high-speed acquisition oscilloscope is the PicoScope 4824A series, each with 8 channels, and a total of 2 units are used for current acquisition. Its appearance is as follows Fig.13 As shown, the size is 190×170×40mm, with 12-bit vertical resolution, 20MHz bandwidth, 256MS buffer and 80MS / s high-speed sampling rate.

[0084] 3. Circuit diagram

[0085] like Fig.14 As shown, the circuit uses quick-connect multi-row terminals for connection. The voltage acquisition is connected in parallel with the two ends of the quick-action switch to measure the voltage, and the current acquisition is connected in series with the quick-action switch to measure the current.

[0086] 203. Determine a failure type of the snap-action switch according to the parameter degradation data, wherein the failure type includes failure with a degradation trajectory and random failure.

[0087] Among them, if the parameter degradation data corresponding to all parameters are continuous as the data change over the test time, the failure type is failure with degradation trajectory. If the parameter degradation data corresponding to only one parameter is discrete as the data change over the test time (i.e., lack of degradation trajectory, sudden failure), the failure type is random failure.

[0088] 204. If the failure type is a failure with a degradation trajectory, fit the parameter degradation data to obtain a fitting curve of the parameter degradation data and test time, and evaluate the life of the snap-action switch according to a preset life failure threshold corresponding to the fitting curve and the parameter.

[0089] It should be noted that the method of steps 203 to 205 of the embodiment may be built into a snap-action switch life assessment system, thereby matching the parameter degradation data with a corresponding life assessment method.

[0090] For this embodiment, as an implementation method, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time.

[0091] Among them, the parameter degradation data corresponding to each parameter is fitted. Specifically, each parameter can be fitted into one of the following curves. For example, if the parameter degradation data changes linearly with the test time t, one of the following curves y(t)=α+βt y(t)=α+βlnt y(t)=exp(α+βt) can be used. If the parameter degradation data changes logarithmically with the test time t, ln[y(t)]=α+βlnt in the following curve can be used.

[0092] y(t)=α+βt

[0093] y(t)=α+βlnt

[0094] ln[y(t)]=α+βlnt

[0095] y(t)=exp(α+βt)

[0096] α and β can be determined after fitting the known parameter degradation data and the corresponding test time. t represents the test time and y(t) represents the parameter degradation.

[0097] As another implementation, for each parameter, the distribution type of life can be output according to the distribution characteristics of the corresponding parameter degradation data, such as the mean, variance, skewness, and kurtosis. By substituting the known parameter degradation data and the test time into the distribution type of the corresponding parameter life, a life assessment model can be obtained, such as Fig.15 As shown in the figure, the life data is the parameter degradation data corresponding to any parameter, θ represents the mean, S 2 represents variance, C s represents skewness, C e It is necessary to explain that if the parameter degradation data corresponding to a certain parameter is Fig.15 After that, the result is other distribution test. At this time, the parameter degradation data is fitted to obtain the fitting curve of the parameter degradation data and the test time. It should be noted that Fig.15 The resulting distribution type of life expectancy is subjected to hypothesis testing to determine the accuracy of the resulting distribution.

[0098] For this embodiment, the life of the snap-action switch is evaluated based on the fitting curve and the preset life failure threshold corresponding to the parameter, including: for each parameter, determining the first target test time corresponding to the preset life failure threshold corresponding to the parameter on the fitting curve; and determining the minimum value of the first target test time corresponding to all parameters as the life of the snap-action switch.

[0099] Among them, the preset life failure threshold corresponding to the parameter means that when the parameter degradation data corresponding to the parameter reaches the preset life failure threshold, the remaining life of the snap-action switch is 0, that is, failure. Since the fitting curve is the parameter degradation data and the test time, when the parameter degradation data is the preset life failure threshold, the corresponding test time on the fitting curve is the first target test time. Similarly, for the above-mentioned life assessment model, it is also about parameter degradation data and test time. Therefore, when the parameter degradation data is the preset life failure threshold, the corresponding test time on the life assessment model is the first target test time.

[0100] Since the snap-action switch fails as long as one of the parameters corresponding to the snap-action switch fails, the snap-action switch fails, and therefore the minimum value of the first target test time corresponding to all the parameters is determined as the life of the snap-action switch.

[0101] 205. If the failure type is random failure, evaluate the life of the snap-action switch based on standard Brownian motion and inverse Gaussian distribution.

[0102] For this embodiment, the method of evaluating the life of a snap-action switch based on standard Brownian motion and inverse Gaussian distribution includes: Step 1: constructing a life model based on standard Brownian motion;

[0103] y t =y0+μt+σBt

[0104] Where t represents the test time, y(t) represents parameter degradation, y0 represents the parameter degradation amount of y(t) at the initial test time, that is, y0 represents the initial value of the parameter degradation amount, B t represents the standard Brownian motion, namely ΔB t ~N(0,Δt), N(0,t) is a normal distribution with mean 0 and variance t, μ represents the drift coefficient, which is related to the stress on the snap-action switch, and σ represents the diffusion coefficient, which is determined by random factors such as inconsistency or instability of the snap-action switch itself, measurement error and stability, and external noise during the test.

[0105] Step 2: Construct a remaining life distribution function based on the preset life failure threshold corresponding to the parameter, the inverse Gaussian distribution and the life model, wherein the remaining life distribution function is:

[0106]

[0107] Wherein, t is the test time, y0 is the initial value of the parameter degradation amount, μ is the drift coefficient, σ is the diffusion coefficient, and D is the preset life failure threshold; the life of the snap-action switch is evaluated according to the remaining life distribution function. The method of evaluating the life of the snap-action switch according to the remaining life distribution function includes: calculating the second target test time when the remaining life distribution function is zero; and determining the minimum value of the second target test time corresponding to all parameters as the life of the snap-action switch.

[0108] Specifically, due to the normality of standard Brownian motion, the incremental degradation of the performance of the snap-action switch follows the mean μΔt i , with variance σ 2 Δt i The normal distribution of (where i represents the parameter) has a probability density distribution function of:

[0109]

[0110] Among them, Δt i =t i+1 -t i Indicates the test time interval for performance testing, represents the increment of parameter degradation, and the life of the snap-action switch can be defined as the time when the parameter degradation data first reaches the preset life failure threshold. The remaining life of the snap-action switch at time t is L t The definition is as follows:

[0111]

[0112] The prediction process of remaining life is the conditional probability distribution density:

[0113]

[0114] Since the first arrival time of the standard Brownian motion (i.e., the time when the preset life failure threshold is first reached) is the remaining life distribution, and the first arrival time distribution of the standard Brownian motion is an inverse Gaussian distribution, its probability distribution density function is as follows:

[0115]

[0116] By integrating it, we can get the remaining life distribution function:

[0117]

[0118] The present invention provides a method, device, computer equipment and storage medium for evaluating the life of a snap-action switch. First, the life stress of the snap-action switch is determined according to the failure characteristics of the snap-action switch, and the life test of the snap-action switch is performed according to the life stress. During the test, the parameter degradation data corresponding to each parameter is monitored in real time; then, the failure type of the snap-action switch is determined according to the parameter degradation data, wherein the failure type includes failure with degradation trajectory and random failure; finally, if the failure type is failure with degradation trajectory, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time, and the life of the snap-action switch is evaluated according to the preset life failure threshold corresponding to the fitting curve and the parameter, and if the failure type is random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution. Through the technical solution of the present invention, on the one hand, the life stress that causes the failure of the snap-action switch in actual use is determined according to the failure characteristics of the snap-action switch, and the life test of the snap-action switch is performed under such life stress, which ensures that the life test of the snap-action switch is consistent with the actual situation, improves the accuracy of the parameter degradation data, and thus improves the accuracy of the life evaluation of the snap-action switch. On the other hand, considering the randomness of failures in actual use, in addition to using the corresponding snap-action switch life assessment method for failures with failure trajectories, the corresponding snap-action switch life assessment method is also used for random failures, which is consistent with the actual situation, thereby improving the accuracy of the snap-action switch life assessment.

[0119] Further, as Figure 1 and Figure 2 The specific implementation of the method shown in the figure, the embodiment of the present invention provides a device for evaluating the life of a snap-action switch, such as Figure 3 As shown, the device includes: a test module 31, a determination module 32, and an evaluation module 33;

[0120] A test module 31 is used to determine the life stress of the snap-action switch according to the failure characteristics of the snap-action switch, perform a life test on the snap-action switch according to the life stress, and monitor parameter degradation data corresponding to each parameter in real time during the test;

[0121] A determination module 32, configured to determine a failure type of the snap-action switch according to the parameter degradation data, wherein the failure type includes a failure with a degradation trajectory and a random failure;

[0122] The evaluation module 33 is used to fit the parameter degradation data to obtain a fitting curve of the parameter degradation data and the test time if the failure type is a failure with a degradation trajectory, and to evaluate the life of the snap-action switch according to a preset life failure threshold corresponding to the fitting curve and the parameter; if the failure type is a random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution.

[0123] Accordingly, in order to determine the life stress of the snap-action switch according to the failure characteristics of the snap-action switch, the test module 31 may specifically include: a first determination unit 311, a second determination unit 312;

[0124] The first determination unit 311 is specifically used to determine whether the failure characteristic of the snap-action switch is a connection failure, a disconnection failure, a stuck action, or a contact ablation;

[0125] The second determining unit 312 is specifically used to determine that the life stress of the snap-action switch corresponding to the connection fault, the disconnection fault, and the action jam is the mechanical stress, and to determine that the life stress of the snap-action switch corresponding to the contact ablation is the electrical stress.

[0126] Accordingly, in order to conduct a life test on the snap-action switch according to the life stress, the test module 31 can be specifically used to install a specified number of snap-action switches on a mechanical stress endurance test bench; simulate the pressing force and switch contact displacement received by the snap-action switch during operation; apply electrical stress and load under working conditions to the snap-action switch; and perform a preset number of mechanical stress and electrical stress switch fatigue endurance assessments on the snap-action switch.

[0127] Accordingly, in order to monitor the parameter degradation data corresponding to each parameter in real time during the test, the test module 31 can be specifically used to use a force sensor to monitor the pressing force data of each snap-action switch in real time, adjust the laser displacement sensor to align the light with the reflective sticker installed at the switch contact, and monitor the switch contact displacement data in real time during the switch action process; use the Hall sensor and the acquisition card to monitor the action voltage data and the action current data of the snap-action switch in real time; monitor the load data in real time; and use the pressing force data, the switch contact displacement data, the action voltage data, the action current data and the load data as parameter degradation data.

[0128] Accordingly, in order to evaluate the life of the snap-action switch according to the fitting curve and the preset life failure threshold corresponding to the parameter, the evaluation module 33 can be specifically used to determine, for each parameter, a first target test time corresponding to the preset life failure threshold corresponding to the parameter on the fitting curve; and determine the minimum value of the first target test time corresponding to all parameters as the life of the snap-action switch.

[0129] Accordingly, in order to evaluate the life of the snap-action switch based on the standard Brownian motion and the inverse Gaussian distribution, the evaluation module 33 can be specifically used to construct a life model based on the standard Brownian motion; and to construct a remaining life distribution function based on the preset life failure threshold corresponding to the parameter, the inverse Gaussian distribution and the life model, wherein the remaining life distribution function is:

[0130]

[0131] Wherein, t is the test time, y0 is the initial value of the parameter degradation amount, μ is the drift coefficient, σ is the diffusion coefficient, and D is the preset life failure threshold; the life of the snap-action switch is evaluated according to the remaining life distribution function.

[0132] It should be noted that for other corresponding descriptions of the functional units involved in the quick-acting switch life assessment device provided in this embodiment, reference can be made to Figure 1 to Figure 2 The corresponding description will not be repeated here.

[0133] Based on the above Figure 1 to Figure 2 The method shown in the embodiment, accordingly, also provides a storage medium, which can be volatile or non-volatile, and stores a computer program, which is executed by a processor to implement the above-mentioned Figure 1 to Figure 2 The snap-action switch life assessment method shown.

[0134] Based on this understanding, the technical solution of the present invention can be embodied in the form of a software product, which can be stored in a storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.), and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods of various implementation scenarios of the present invention.

[0135] Based on the above Figure 1 to Figure 2 The method shown and Figure 3 , Figure 4 In order to achieve the above-mentioned purpose, the present embodiment further provides a computer device, which includes a storage medium and a processor; the storage medium is used to store a computer program; the processor is used to execute the computer program to achieve the above-mentioned Figure 1 to Figure 2 The snap-action switch life assessment method shown.

[0136] Optionally, the computer device may further include a user interface, a network interface, a camera, a radio frequency (RF) circuit, a sensor, an audio circuit, a WI-FI module, etc. The user interface may include a display, an input unit such as a keyboard, etc., and the optional user interface may also include a USB interface, a card reader interface, etc. The network interface may optionally include a standard wired interface, a wireless interface (such as a WI-FI interface), etc.

[0137] Those skilled in the art will appreciate that the computer device structure provided in this embodiment does not constitute a limitation on the physical device, and may include more or fewer components, or a combination of certain components, or different component arrangements.

[0138] The storage medium may also include an operating network communication module. The operating is a program that manages the hardware and software resources of the above-mentioned computer device, supporting the operation of the information processing program and other software and / or programs. The network communication module is used to communicate between the components inside the storage medium, and to communicate with other hardware and software in the information processing entity device.

[0139] Through the description of the above implementation modes, those skilled in the art can clearly understand that the present invention can be implemented by means of software plus a necessary general hardware platform, or by hardware.

[0140] The present invention provides a method, device, computer equipment and storage medium for evaluating the life of a snap-action switch. First, the life stress of the snap-action switch is determined according to the failure characteristics of the snap-action switch, and the life test of the snap-action switch is performed according to the life stress. During the test, the parameter degradation data corresponding to each parameter is monitored in real time; then, the failure type of the snap-action switch is determined according to the parameter degradation data, wherein the failure type includes failure with degradation trajectory and random failure; finally, if the failure type is failure with degradation trajectory, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time, and the life of the snap-action switch is evaluated according to the preset life failure threshold corresponding to the fitting curve and the parameter, and if the failure type is random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution. Through the technical solution of the present invention, on the one hand, the life stress that causes the failure of the snap-action switch in actual use is determined according to the failure characteristics of the snap-action switch, and the life test of the snap-action switch is performed under such life stress, which ensures that the life test of the snap-action switch is consistent with the actual situation, improves the accuracy of the parameter degradation data, and thus improves the accuracy of the life evaluation of the snap-action switch. On the other hand, considering the randomness of failures in actual use, in addition to using the corresponding snap-action switch life assessment method for failures with failure trajectories, the corresponding snap-action switch life assessment method is also used for random failures, which is consistent with the actual situation, thereby improving the accuracy of the snap-action switch life assessment.

[0141] Those skilled in the art will appreciate that the accompanying drawings are only schematic diagrams of a preferred implementation scenario, and the modules or processes in the accompanying drawings are not necessarily necessary for implementing the present invention. Those skilled in the art will appreciate that the modules in the devices in the implementation scenario can be distributed in the devices of the implementation scenario according to the description of the implementation scenario, or can be changed accordingly and located in one or more devices different from the present implementation scenario. The modules of the above-mentioned implementation scenario can be combined into one module, or can be further split into multiple submodules.

[0142] The above serial numbers of the present invention are only for description and do not represent the advantages and disadvantages of the implementation scenarios. The above disclosure is only a few specific implementation scenarios of the present invention, but the present invention is not limited thereto, and any changes that can be thought of by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A method for evaluating the life of a snap-action switch, characterized in that: The method comprises: Determine the life stress of the snap-action switch according to the failure characteristics of the snap-action switch, perform a life test on the snap-action switch according to the life stress, and monitor parameter degradation data corresponding to each parameter in real time during the test; Determining a failure type of the snap-action switch according to the parameter degradation data, wherein the failure type includes a failure with a degradation trajectory and a random failure; If the failure type is a failure with a degradation trajectory, the parameter degradation data is fitted to obtain a fitting curve of the parameter degradation data and the test time, and the life of the snap-action switch is evaluated according to a preset life failure threshold corresponding to the fitting curve and the parameter. If the failure type is a random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution.

2. The method according to claim 1, characterized in that The method of determining the life stress of the snap-action switch according to the failure characteristics of the snap-action switch comprises: Determine the failure characteristics of snap-action switches as connection failure, disconnection failure, action sticking, and contact erosion; The life stress of the snap-action switch corresponding to the connection failure, disconnection failure and action jam is determined to be mechanical stress, and the life stress of the snap-action switch corresponding to the contact erosion is determined to be electrical stress.

3. The method according to claim 2, characterized in that The life test of the snap-action switch according to the life stress comprises: Install a specified number of snap-action switches on a mechanical stress endurance test bench; Simulate the pressing force and switch contact displacement during the operation of the snap-action switch; Apply electrical stress and load under working conditions to the snap-action switch; The snap-action switch is subjected to a preset number of mechanical stress and electrical stress switch fatigue durability tests.

4. The method according to claim 3, characterized in that During the test, the parameter degradation data corresponding to each parameter is monitored in real time, including: Use force sensors to monitor the pressing force data of each snap-action switch in real time, adjust the laser displacement sensor so that the light is aimed at the reflective sticker installed at the switch contact, and monitor the switch contact displacement data in real time during the switch action process; Use Hall sensors and acquisition cards to monitor the action voltage and current data of the quick-acting switch in real time; Real-time monitoring of load data; The pressing force data, the switch contact displacement data, the operating voltage data, the operating current data, and the load data are used as parameter degradation data.

5. The method according to claim 1, characterized in that The method of evaluating the life of the snap-action switch according to the preset life failure threshold corresponding to the fitting curve and the parameter includes: For each parameter, determining a first target test time corresponding to a preset life failure threshold value corresponding to the parameter on the fitting curve; The minimum value of the first target test time corresponding to all parameters is determined as the life of the snap-action switch.

6. The method according to claim 1, characterized in that The method for evaluating the life of a snap-action switch based on standard Brownian motion and inverse Gaussian distribution includes: Construct a lifespan model based on standard Brownian motion; A remaining life distribution function is constructed based on the preset life failure threshold corresponding to the parameter, the inverse Gaussian distribution and the life model, wherein the remaining life distribution function is: Wherein, t is the test time, y0 is the initial value of the parameter degradation, μ is the drift coefficient, σ is the diffusion coefficient, and D is the preset life failure threshold; The snap switch lifetime is estimated based on the remaining lifetime distribution function.

7. The method according to claim 1, characterized in that The evaluating the life of the snap-action switch according to the remaining life distribution function comprises: Calculating a second target test time when the remaining life distribution function is zero; The minimum value of the second target test time corresponding to all parameters is determined as the life of the snap-action switch.

8. A snap-action switch life assessment device, characterized in that: The device comprises: A test module, used to determine the life stress of the snap-action switch according to the failure characteristics of the snap-action switch, perform a life test on the snap-action switch according to the life stress, and monitor parameter degradation data corresponding to each parameter in real time during the test; A determination module, configured to determine a failure type of the snap-action switch according to the parameter degradation data, wherein the failure type includes a failure with a degradation trajectory and a random failure; An evaluation module is used to fit the parameter degradation data if the failure type is a failure with a degradation trajectory to obtain a fitting curve of the parameter degradation data and the test time, and to evaluate the life of the snap-action switch according to a preset life failure threshold corresponding to the fitting curve and the parameter; if the failure type is a random failure, the life of the snap-action switch is evaluated based on standard Brownian motion and inverse Gaussian distribution.

9. A storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for evaluating the life of a snap-action switch according to any one of claims 1 to 7 is implemented.

10. A computer device comprising a storage medium, a processor, and a computer program stored in the storage medium and executable on the processor, characterized in that: When the processor executes the computer program, the method for evaluating the life of a snap-action switch according to any one of claims 1 to 7 is implemented.

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