Packaging structure manufacturing method, packaging structure and electronic device

Abstract

The present application provides a method for manufacturing a packaging structure, a packaging structure and an electronic device, and relates to the field of semiconductor technology. The method includes: providing a first substrate and a second substrate, the first substrate includes a first surface and a second surface arranged oppositely, the first surface includes a plurality of first electronic components; the second substrate includes a third surface and a fourth surface arranged oppositely, the third surface includes a plurality of second electronic components; bonding the first substrate and the second substrate so that the second surface of the first substrate and the fourth surface of the second substrate are in contact; forming a first plastic sealing layer on a side of the first electronic component away from the first substrate, and forming a second plastic sealing layer on a side of the second electronic component away from the second substrate; removing the first substrate and the second substrate to obtain a first packaging structure and a second packaging structure, so that the warping problem occurring during the processing can be effectively prevented, and the packaging efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method for manufacturing a packaging structure, a packaging structure and an electronic device. Background Art

[0002] Currently, during the packaging process, due to the different thermal expansion coefficients of different packaging layers, when electronic components undergo thermal cycles, the expansion and contraction of the packaging materials may cause stress between the electronic components and the substrate, which in turn causes warping of the packaging structure and reduces production efficiency. Summary of the invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a method for manufacturing a packaging structure, a packaging structure and an electronic device.

[0004] In a first aspect, an embodiment of the present application provides a method for manufacturing a packaging structure, the method for manufacturing the packaging structure comprising:

[0005] Providing a first substrate and a second substrate, wherein the first substrate comprises a first surface and a second surface disposed opposite to each other, and the first surface comprises a plurality of first electronic components; and the second substrate comprises a third surface and a fourth surface disposed opposite to each other, and the third surface comprises a plurality of second electronic components;

[0006] Bonding the first substrate and the second substrate so that the second surface of the first substrate contacts the fourth surface of the second substrate;

[0007] forming a first plastic encapsulation layer on a side of the first electronic component away from the first substrate, and forming a second plastic encapsulation layer on a side of the second electronic component away from the second substrate;

[0008] The first substrate and the second substrate are removed to obtain a first packaging structure and a second packaging structure.

[0009] In a possible implementation, the step of forming a first plastic encapsulation layer on a side of the first electronic component away from the first substrate and forming a second plastic encapsulation layer on a side of the second electronic component away from the second substrate includes:

[0010] Providing a plastic encapsulation mold, the plastic encapsulation mold comprising an upper mold, a middle mold and a lower mold;

[0011] Placing the first substrate and the second substrate after bonding on the middle mold, so that the first electronic component of the first substrate is located on a side of the middle mold close to the upper mold, and the second electronic component of the second substrate is located on a side of the middle mold close to the lower mold;

[0012] Filling the lower mold and the first substrate with plastic packaging materials on one side close to the upper mold respectively;

[0013] The first surface of the first substrate and the third surface of the second substrate are plastic-sealed to form a first plastic-sealing layer on a side of the first electronic component away from the first substrate, and a second plastic-sealing layer on a side of the second electronic component away from the second substrate.

[0014] In a possible implementation, the first surface of the first substrate further includes a first redistribution layer, and the first electronic component is electrically connected to the first redistribution layer; the third surface of the second substrate further includes a second redistribution layer, and the second electronic component is electrically connected to the second redistribution layer.

[0015] In a possible implementation, after the step of removing the first substrate and the second substrate to obtain the first packaging structure and the second packaging structure, the method further includes:

[0016] A first external pin is arranged on a side of the first redistribution layer or the second redistribution layer away from the plastic packaging layer.

[0017] In a possible implementation manner, the orthographic projections of the plurality of first electronic components on the first substrate coincide with the orthographic projections of the plurality of second electronic components on the first substrate.

[0018] In a second aspect, an embodiment of the present application further provides a method for manufacturing a packaging structure, the method for manufacturing a packaging structure comprising:

[0019] Providing a third substrate, wherein a third redistribution layer is disposed on one side of the third substrate;

[0020] Disposing a plurality of third electronic components on a side of the third redistribution layer away from the third substrate;

[0021] Removing the third substrate, and disposing a plurality of fourth electronic components on a side of the third redistribution layer away from the third electronic component;

[0022] Plastic-sealing the third electronic component and the fourth electronic component, forming a third plastic-sealing layer on a side of the third electronic component away from the third redistribution layer, and forming a fourth plastic-sealing layer on a side of the fourth electronic component away from the third redistribution layer;

[0023] A fourth redistribution layer is formed on a side of the fourth plastic packaging layer away from the third redistribution layer.

[0024] In a possible implementation, the method further includes:

[0025] A plurality of conductive pillars are arranged on a side of the third redistribution layer away from the third electronic component, wherein the conductive pillars are electrically connected to the third redistribution layer;

[0026] The step of forming a fourth redistribution layer on a side of the fourth plastic encapsulation layer away from the third redistribution layer comprises:

[0027] Grinding the fourth plastic packaging layer to expose the conductive pillar;

[0028] A fourth redistribution layer is formed on a side of the fourth plastic packaging layer away from the third redistribution layer, so that the fourth redistribution layer is electrically connected to the conductive pillar.

[0029] In a possible implementation manner, after the step of forming a fourth redistribution layer on a side of the fourth plastic encapsulation layer away from the third redistribution layer, the method further includes:

[0030] A second external pin is arranged on a side of the fourth redistribution layer away from the fourth plastic packaging layer.

[0031] In a third aspect, an embodiment of the present application further provides a packaging structure, wherein the packaging structure is manufactured using the manufacturing method of the packaging structure described in any of the above aspects.

[0032] In a fourth aspect, an embodiment of the present application further provides an electronic device, wherein the electronic device includes the packaging structure described in any of the above aspects.

[0033] Based on any one of the above aspects, the manufacturing method of the packaging structure, the packaging structure and the electronic device provided in the embodiments of the present application, by bonding the first substrate and the second substrate so that the first electronic component and the second electronic component are respectively provided on both sides of the first substrate and the second substrate after bonding, can effectively prevent the warping problem occurring during the processing process, and can obtain the first substrate structure and the second substrate structure, thereby improving the packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 This is a schematic diagram of a process of manufacturing a packaging structure provided in this embodiment;

[0036] Figure 2 One of the manufacturing process schematic diagrams of the manufacturing method of the packaging structure provided in this embodiment;

[0037] Figure 3 A second schematic diagram of the manufacturing process of the packaging structure provided in this embodiment;

[0038] Figure 4 A schematic diagram of sub-steps of step S130 provided in this embodiment;

[0039] Figure 5 A schematic diagram of the plastic encapsulation process provided in this embodiment;

[0040] Figure 6 One of the schematic diagrams of the packaging structure provided in this embodiment;

[0041] Figure 7 A second schematic diagram of the packaging structure provided in this embodiment;

[0042] Figure 8 A schematic diagram of a first packaging structure provided in this embodiment;

[0043] Fig. 9 A second flow chart of the method for manufacturing the packaging structure provided in this embodiment;

[0044] Fig.10 A third schematic diagram of the packaging structure provided in this embodiment;

[0045] Fig.11 A fourth schematic diagram of the packaging structure provided in this embodiment;

[0046] Fig.12 A fifth schematic diagram of the packaging structure provided in this embodiment;

[0047] Fig.13 A sixth schematic diagram of the packaging structure provided in this embodiment;

[0048] Fig.14 A seventh schematic diagram of a packaging structure provided in this embodiment;

[0049] Fig.15 An eighth schematic diagram of the packaging structure provided in this embodiment;

[0050] Fig.16 A schematic diagram of sub-steps of step S250 provided in this embodiment;

[0051] Fig.17 This is the ninth schematic diagram of the packaging structure provided in this embodiment.

[0052] Icon: 110-first substrate; 111-first surface; 112-second surface; 120-second substrate; 121-third surface; 122-fourth surface; 130-third substrate; 210-first electronic component; 220-second electronic component; 230-third electronic component; 240-fourth electronic component; 310-first plastic encapsulation layer; 320-second plastic encapsulation layer; 330-third plastic encapsulation layer; 340-fourth plastic encapsulation layer; 400-plastic encapsulation mold; 410-upper mold; 420-middle mold; 430-lower mold; 510-first redistribution layer; 520-second redistribution layer; 530-third redistribution layer; 540-fourth redistribution layer; 610-first filling layer; 620-second filling layer; 630-third filling layer; 710-first external pin; 720-second external pin; 800-conductive column. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0055] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0056] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0057] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0058] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.

[0059] Please refer to Figure 1 , Figure 1 This is a schematic flow chart of a method for manufacturing a packaging structure provided in this embodiment. The method may include the following steps.

[0060] In step S110 , a first substrate 110 and a second substrate 120 are provided. The first substrate 110 includes a first surface 111 and a second surface 112 that are oppositely disposed. The first surface 111 includes a plurality of first electronic components 210 . The second substrate 120 includes a third surface 121 and a fourth surface 122 that are oppositely disposed. The third surface 121 includes a plurality of second electronic components 220 .

[0061] In this embodiment, please refer to Figure 2 The first substrate 110 and the second substrate 120 may both be glass substrates, and the first substrate 110 and the second substrate 120 have the same size. During the packaging process, the first substrate 110 and the second substrate 120 may both have a warping problem.

[0062] The plurality of first electronic components 210 are arranged in the same layer, and the plurality of first electronic components 210 may be chips with the same structure or chips with different structures. For example, the plurality of first electronic components 210 may be high bandwidth memory (HBM) chips, application specific integrated circuit (ASIC) chips, system on chip (SoC), etc., and the plurality of first electronic components 210 may also all be system chips.

[0063] The plurality of second electronic components 220 are arranged in the same layer, and the plurality of second electronic components 220 may be chips with the same structure or chips with different structures. For example, the plurality of second electronic components 220 may be high bandwidth memory (HBM) chips, application specific integrated circuit (ASIC) chips, system on chip (SoC), etc., and the plurality of second electronic components 220 may also all be system chips.

[0064] It should be noted that the first electronic component 210 and the second electronic component 220 may also include other electronic components besides chips, such as integrated circuits, etc., which are not specifically limited here.

[0065] Step S120 , bonding the first substrate 110 and the second substrate 120 , so that the second surface 112 of the first substrate 110 and the fourth surface 122 of the second substrate 120 are in contact with each other.

[0066] In this embodiment, please refer to Figure 2 , a bonding adhesive may be coated on the second surface 112 of the first substrate 110 and / or the fourth surface 122 of the second substrate 120, and the first substrate 110 with the warping problem and the second substrate 120 with the warping problem may be bonded by the bonding adhesive. Exemplarily, the bonding adhesive may be a thermal debonding adhesive or a laser debonding material.

[0067] Step S130 , forming a first plastic encapsulation layer 310 on a side of the first electronic component 210 away from the first substrate 110 , and forming a second plastic encapsulation layer 320 on a side of the second electronic component 220 away from the second substrate 120 .

[0068] In this embodiment, please refer to Figure 3 , the first molding layer 310 and the second molding layer 320 can be formed simultaneously using the molding mold 400 , the first molding layer 310 can completely cover the first electronic components 210 , and the second molding layer 320 can completely cover the second molding layer 320 .

[0069] The material of the first plastic encapsulation layer 310 and the second plastic encapsulation layer 320 can be an insulating material, for example, can include epoxy molding compound (Epoxy Molding Compound, EMC). Epoxy molding compound (Epoxy Molding Compound, EMC) is a powder molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, silicon micropowder and the like as a filler, and a variety of additives. Epoxy molding compound (Epoxy Molding Compound, EMC) is easy to shape and has a hard texture. It can protect the first electronic component 210 and the second electronic component 220, effectively prevent external water and oxygen from contacting the first electronic component 210 and the second electronic component 220, and can also improve the reliability of the packaging structure.

[0070] Step S140 , removing the first substrate 110 and the second substrate 120 to obtain a first packaging structure and a second packaging structure.

[0071] In this embodiment, please refer to Figure 3The first substrate 110 and the second substrate 120 may be debonded by heating or laser, and then the first substrate 110 and the second substrate 120 may be removed to obtain the first packaging structure and the second packaging structure.

[0072] It should be noted that the method for debonding the first substrate 110 and the second substrate 120 is not limited to heating and laser. The first substrate 110 and the second substrate 120 can also be debonded by other methods, such as mechanical debonding, chemical debonding, etc. The specific debonding method can be selected according to the material of the bonding glue and the actual bonding method, and is not specifically limited here.

[0073] In the above design, by bonding the first substrate 110 and the second substrate 120, the first electronic component 210 and the second electronic component 220 are respectively provided on both sides of the first substrate 110 and the second substrate 120 after bonding, which can effectively prevent the warping problem occurring during the processing process, and can obtain the first substrate 110 structure and the second substrate 120 structure, thereby improving the packaging efficiency.

[0074] In one possible implementation, see Figure 4 , step S130 may include the following sub-steps.

[0075] Step S131 , providing a plastic encapsulation mold 400 , wherein the plastic encapsulation mold 400 includes an upper mold 410 , a middle mold 420 and a lower mold 430 .

[0076] Step S132, placing the first substrate 110 and the second substrate 120 after bonding on the middle mold 420, so that the first electronic component 210 of the first substrate 110 is located on the side of the middle mold 420 close to the upper mold 410, and the second electronic component 220 of the second substrate 120 is located on the side of the middle mold 420 close to the lower mold 430.

[0077] Step S133 , filling the lower mold 430 and the first substrate 110 at a side close to the upper mold 410 with plastic packaging materials respectively.

[0078] Step S134, plastic-sealing the first surface 111 of the first substrate 110 and the third surface 121 of the second substrate 120, forming a first plastic-sealing layer 310 on the side of the first electronic component 210 away from the first substrate 110, and forming a second plastic-sealing layer 320 on the side of the second electronic component 220 away from the second substrate 120.

[0079] In this embodiment, please refer to Figure 5, the first substrate 110 and the second substrate 120 after bonding obtained in step S120 can be placed on the middle mold 420 of the plastic encapsulation mold 400, so that the first electronic component 210 of the first substrate 110 is located on the side of the middle mold 420 close to the upper mold 410. Then, the plastic encapsulation material (for example, epoxy resin molding compound) is filled in the lower mold 430 and the side of the first substrate 110 close to the upper mold 410 respectively, so that the upper mold 410 and the lower mold 430 are moved in the direction close to the middle mold 420 at the same time, so that the first plastic encapsulation layer 310 is formed on the side of the first electronic component 210 away from the first substrate 110, and the second plastic encapsulation layer 320 is formed on the side of the second electronic component 220 away from the second substrate 120. In this way, double-sided packaging can be achieved.

[0080] In other examples, the first substrate 110 and the second substrate 120 after bonding obtained in step S120 can be placed on the middle mold 420 of the plastic encapsulation mold 400, so that the second electronic component 220 of the second substrate 120 is located on the side of the middle mold 420 close to the upper mold 410. Then, a plastic encapsulation material (for example, epoxy resin molding compound) is filled on the lower mold 430 and the side of the second substrate 120 close to the upper mold 410 respectively, so that the upper mold 410 and the lower mold 430 are moved simultaneously in a direction close to the middle mold 420, so that the first plastic encapsulation layer 310 is formed on the side of the first electronic component 210 away from the first substrate 110, and the second plastic encapsulation layer 320 is formed on the side of the second electronic component 220 away from the second substrate 120.

[0081] It should be noted that when filling the plastic packaging material, the filling amount of the plastic packaging material can be adjusted according to the actual size requirements of the packaging structure.

[0082] In addition, after forming the first plastic encapsulation layer 310 and the second plastic encapsulation layer 320 , the first plastic encapsulation layer 310 and the second plastic encapsulation layer 320 may be ground to further adjust the sizes of the first packaging structure and the second packaging structure.

[0083] In one possible implementation, see Figure 6 The first surface 111 of the first substrate 110 may further include a first redistribution layer 510 , and the first electronic component 210 is electrically connected to the first redistribution layer 510 .

[0084] In this embodiment, the first redistribution layer 510 can completely cover the first surface 111 of the first substrate 110, the first electronic component 210 can be located on the side of the first redistribution layer 510 away from the first substrate 110, and a first connecting pin is provided on the side of the first electronic component 210 close to the first redistribution layer 510, and the first electronic component 210 can be electrically connected to the first redistribution layer 510 through the first connecting pin.

[0085] Also, please refer to Figure 7 A first filling layer 610 is also arranged between the first electronic component 210 and the first redistribution layer 510. The orthographic projection of the first filling layer 610 on the first redistribution layer 510 can completely cover the orthographic projection of the first electronic component 210 on the first redistribution layer 510. The first filling layer 610 can be used to fill the gap between the first electronic component 210 and the first redistribution layer 510 and the gap between multiple first electronic components 210.

[0086] In the above structure, by providing the first filling layer 610, the bonding strength between the first electronic component 210 and the first redistribution layer 510 can be increased, the first electronic component 210 and the first redistribution layer can be protected, and the reliability of the first packaging structure can be improved.

[0087] Please refer again Figure 6 The third surface 121 of the second substrate 120 may further include a second redistribution layer 520 , and the second electronic component 220 is electrically connected to the second redistribution layer 520 .

[0088] In this embodiment, the second redistribution layer 520 can completely cover the third surface 121 of the second substrate 120, the second electronic component 220 can be located on the side of the second redistribution layer 520 away from the second substrate 120, and a second connecting pin is provided on the side of the second electronic component 220 close to the second redistribution layer 520, and the second electronic component 220 can be electrically connected to the second redistribution layer 520 through the second connecting pin.

[0089] In addition, please refer again Figure 7 A second filling layer 620 is also arranged between the second electronic component 220 and the second redistribution layer 520. The orthographic projection of the second filling layer 620 on the second redistribution layer 520 can completely cover the orthographic projection of the second electronic component 220 on the second redistribution layer 520. The second filling layer 620 can be used to fill the gap between the second electronic component 220 and the second redistribution layer 520 and the gap between multiple second electronic components 220.

[0090] In the above structure, by providing the second filling layer 620, the bonding strength between the second electronic component 220 and the second redistribution layer 520 can be increased, the second electronic component 220 and the second redistribution layer can be protected, and the reliability of the second packaging structure can be improved.

[0091] In one possible implementation, see Figure 8 After removing the first substrate 110 and the second substrate 120 to obtain the first packaging structure and the second packaging structure, a first external pin 710 can also be set on the side of the first redistribution layer 510 or the second redistribution layer 520 away from the plastic packaging layer.

[0092] In this embodiment, one end of the first external pin 710 can be electrically connected to the first redistribution layer 510 or the second redistribution layer 520, and the other end of the first external pin 710 can be connected to other components, which helps the packaging structure to further achieve electrical connection with other components.

[0093] In some examples, the first external pin 710 can be a solder ball, a ball grid array (BGA) ball, a controlled collapse chip connection (C4) bump, or a micro bump.

[0094] In a possible implementation, the orthographic projections of the plurality of first electronic components 210 on the first substrate 110 coincide with the orthographic projections of the plurality of second electronic components 220 on the first substrate 110 .

[0095] In this embodiment, the number of the first electronic components 210 and the second electronic components 220 are equal, and the first electronic components 210 and the second electronic components 220 are symmetrically distributed, and the first electronic components 210 and the second electronic components 220 corresponding to the positions are exactly the same. Therefore, in step S140, the first packaging structure and the second packaging structure obtained after removing the first substrate 110 and the second substrate 120 are exactly the same.

[0096] In the above design, the warping problems caused by the different thermal expansion coefficients of different packaging layers can be offset by a symmetrical process, thereby improving the packaging efficiency.

[0097] The present application also provides a method for manufacturing a packaging structure. Fig. 9 , the method may include the following steps.

[0098] In step S210 , a third substrate 130 is provided, and a third redistribution layer 530 is disposed on one side of the third substrate 130 .

[0099] In this embodiment, please refer to Fig.10 The third substrate 130 may be a glass substrate, and the third redistribution layer 530 may completely cover a surface of the third substrate 130. The third redistribution layer 530 and the third substrate 130 may be connected by bonding adhesive. Exemplarily, the bonding adhesive may be a thermally degradable adhesive or a laser debonding material.

[0100] Specifically, the third redistribution layer 530 can be formed by photolithography, plating, sputtering, etc.

[0101] In step S220 , a plurality of third electronic components 230 are disposed on a side of the third redistribution layer 530 away from the third substrate 130 .

[0102] In this embodiment, please refer to Fig.10 A plurality of the third electronic components 230 may be arranged on a side of the third redistribution layer 530 away from the third substrate 130, and the plurality of the third electronic components 230 may be arranged on the same layer. A third connecting pin may be arranged on a side of the third electronic component 230 close to the third redistribution layer 530, and the third electronic component 230 may be electrically connected to the third redistribution layer 530 through the third connecting pin.

[0103] The plurality of third electronic components 230 may be chips of the same structure or chips of different structures. For example, the plurality of third electronic components 230 may be high bandwidth memory (HBM) chips, application specific integrated circuit (ASIC) chips, system on chip (SoC), etc., and the plurality of third electronic components 230 may all be system chips.

[0104] After the third electronic component 230 is provided, a third filling layer 630 may be provided between the third electronic component 230 and the third redistribution layer 530. The third filling layer 630 may be used to fill the gap between the third electronic component 230 and the third redistribution layer 530 and the gaps between the plurality of third electronic components 230. In this way, the bonding strength between the third electronic component 230 and the third redistribution layer 530 may be increased, the third electronic component 230 and the third redistribution layer 530 may be protected, and the reliability of the packaging structure may be improved.

[0105] In step S230 , the third substrate 130 is removed, and a plurality of fourth electronic components 240 are disposed on a side of the third redistribution layer 530 away from the third electronic component 230 .

[0106] In this embodiment, the third substrate 130 may be removed by heating or laser, and a plurality of fourth electronic components 240 may be disposed on a side of the third redistribution layer 530 away from the third electronic component 230 .

[0107] In one possible implementation, please refer to Fig.11 , the plurality of fourth electronic components 240 are asymmetrically distributed with the plurality of third electronic components 230. The fourth electronic component 240 may be a bridge chip, and a bridge pin may be provided on the surface of the bridge chip close to the third redistribution layer 530, and the bridge chip may be electrically connected to the third redistribution layer 530 through the bridge pin. The surface of the bridge chip away from the third redistribution layer 530 may be a ground layer.

[0108] In another possible implementation, please refer to Fig.12 , the plurality of fourth electronic components 240 are symmetrically distributed with the plurality of third electronic components 230, and the orthographic projection of the third electronic component 230 on the third redistribution layer 530 completely overlaps with the orthographic projection of the fourth electronic component 240 on the third redistribution layer 530. The third electronic component 230 and the fourth electronic component 240 corresponding to each other can be the same chip, for example, both can be high bandwidth memory (HBM) chips.

[0109] The third electronic component 230 and the fourth electronic component 240 may also include other electronic components besides chips, such as integrated circuits, etc., which are not specifically limited here.

[0110] It should be noted that the method of removing the third substrate 130 is not limited to heating and laser, and the third substrate 130 can also be removed by other methods, such as mechanical debonding, chemical debonding, etc. The specific removal method can be selected according to the material of the bonding glue and the actual connection method, and is not specifically limited here.

[0111] Step S240 , plastic-encapsulating the third electronic component 230 and the fourth electronic component 240 , forming a third plastic-encapsulation layer 330 on a side of the third electronic component 230 away from the third redistribution layer 530 , and forming a fourth plastic-encapsulation layer 340 on a side of the fourth electronic component 240 away from the third redistribution layer 530 .

[0112] In this embodiment, please refer to Fig.13The third electronic component 230 and the fourth electronic component 240 may be plastic-encapsulated by a plastic-encapsulation mold 400 to form the third plastic-encapsulation layer 330 and the fourth plastic-encapsulation layer 340 .

[0113] Specifically, the package structure obtained in step S230 can be placed on the middle mold 420 of the plastic mold 400, so that the third electronic component 230 (or the fourth electronic component 240) is located on the side of the middle mold 420 close to the upper mold 410. Then, a plastic molding material (for example, epoxy resin molding compound) is filled on the side of the lower mold 430 and the third electronic component 230 (or the fourth electronic component 240) close to the upper mold 410, respectively, so that the upper mold 410 and the lower mold 430 are moved simultaneously in a direction close to the middle mold 420, so that the third plastic molding layer 330 is formed on the side of the third electronic component 230 away from the third redistribution layer 530, and the fourth plastic molding layer 340 is formed on the side of the fourth electronic component 240 away from the third redistribution layer 530.

[0114] When filling the plastic packaging material, the filling amount of the plastic packaging material can be adjusted according to the actual size requirements of the packaging structure.

[0115] After the third plastic encapsulation layer 330 and the fourth plastic encapsulation layer 340 are formed, the third plastic encapsulation layer 330 and the fourth plastic encapsulation layer 340 may be ground to further adjust the size of the packaging structure.

[0116] Step S250 , forming a fourth redistribution layer 540 on a side of the fourth plastic encapsulation layer 340 away from the third redistribution layer 530 .

[0117] In this embodiment, please refer to Fig.14 , the orthographic projection of the fourth redistribution layer 540 on the fourth plastic encapsulation layer 340 completely overlaps with the orthographic projection of the third redistribution layer 530 on the fourth plastic encapsulation layer 340 .

[0118] Specifically, the quadruple wiring layer can be formed by photolithography, plating, sputtering, etc.

[0119] In the above design, by respectively arranging the third electronic component 230 and the fourth electronic component 240 on both sides of the third redistribution layer 530 , the warping degree of the packaging structure can be effectively reduced and the production efficiency can be improved.

[0120] In one possible implementation, see Fig.15In step S230, after removing the third substrate 130, a plurality of spaced apart conductive pillars 800 may be provided on a side of the third redistribution layer 530 away from the third electronic component 230, and the conductive pillars 800 are electrically connected to the third redistribution layer 530.

[0121] The conductive pillars 800 may be disposed at gaps between the fourth electronic components 240 or at edges of the fourth electronic components 240 , which is not specifically limited herein.

[0122] Preferably, the conductive pillar 800 may be a copper pillar.

[0123] It should be noted that the number of the conductive pillars 800 can be determined according to actual needs and is not specifically limited here.

[0124] Please refer to Fig.16 , step S250 may include the following sub-steps.

[0125] Step S251 , grinding the fourth plastic encapsulation layer 340 to expose the conductive pillars 800 .

[0126] Step S252 , forming a fourth redistribution layer 540 on a side of the fourth plastic encapsulation layer 340 away from the third redistribution layer 530 , so that the fourth redistribution layer 540 is electrically connected to the conductive pillar 800 .

[0127] In this embodiment, when the fourth plastic encapsulation layer 340 is formed, the fourth plastic encapsulation layer 340 can completely cover the surfaces of the fourth electronic component 240 and the conductive column 800. Therefore, the fourth plastic encapsulation layer 340 needs to be polished so that the surface of the fourth plastic encapsulation layer 340 is flush with the surface of the conductive column 800. In this way, it is convenient to achieve electrical connection between the fourth redistribution layer 540 and the conductive column 800.

[0128] The height of the conductive pillar 800 may be greater than or equal to the thickness of the fourth electronic component 240. When the height of the conductive pillar 800 is greater than the thickness of the fourth electronic component 240, after grinding the fourth plastic sealing layer 340, the fourth plastic sealing layer 340 may only expose the surface of the conductive pillar 800, but not expose the surface of the fourth electronic component 240 away from the third redistribution layer 530. When the height of the conductive pillar 800 is equal to the thickness of the fourth electronic component 240, after grinding the fourth plastic sealing layer 340, the fourth plastic sealing layer 340 may expose the surface of the conductive pillar 800 and the surface of the fourth electronic component 240 away from the third redistribution layer 530.

[0129] In one possible implementation, see Fig.17 After forming the fourth redistribution layer 540 on the side of the fourth plastic encapsulation layer 340 away from the third redistribution layer 530 , a second external pin 720 may be further provided on the side of the fourth redistribution layer 540 away from the fourth plastic encapsulation layer 340 .

[0130] One end of the second external pin 720 may be electrically connected to the fourth redistribution layer 540 , and the other end of the second external pin 720 may be connected to other components, which helps the package structure to be further electrically connected to other components.

[0131] In some examples, the second external pin 720 can be a solder ball, a ball grid array (BGA) ball, a controlled collapse chip connection (C4) bump, or a micro bump.

[0132] An embodiment of the present application also provides a packaging structure, which can be manufactured using the manufacturing method of the packaging structure provided in this embodiment.

[0133] An embodiment of the present application also provides an electronic device, which may include the packaging structure provided by this embodiment.

[0134] In summary, the present embodiment provides a method for manufacturing a packaging structure, a packaging structure and an electronic device. By bonding a first substrate and a second substrate so that the first electronic component and the second electronic component are respectively provided on both sides of the first substrate and the second substrate after bonding, the warping problem occurring during the processing can be effectively prevented, and the first substrate structure and the second substrate structure can be obtained, thereby improving the packaging efficiency.

[0135] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0136] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a packaging structure, characterized in that: The method comprises: Providing a first substrate and a second substrate, wherein the first substrate comprises a first surface and a second surface disposed opposite to each other, and the first surface comprises a plurality of first electronic components; and the second substrate comprises a third surface and a fourth surface disposed opposite to each other, and the third surface comprises a plurality of second electronic components; Bonding the first substrate and the second substrate so that the second surface of the first substrate contacts the fourth surface of the second substrate; forming a first plastic encapsulation layer on a side of the first electronic component away from the first substrate, and forming a second plastic encapsulation layer on a side of the second electronic component away from the second substrate; The first substrate and the second substrate are removed to obtain a first packaging structure and a second packaging structure.

2. The method for manufacturing a packaging structure according to claim 1, characterized in that: The step of forming a first plastic encapsulation layer on a side of the first electronic component away from the first substrate and forming a second plastic encapsulation layer on a side of the second electronic component away from the second substrate comprises: Providing a plastic encapsulation mold, the plastic encapsulation mold comprising an upper mold, a middle mold and a lower mold; Placing the first substrate and the second substrate after bonding on the middle mold, so that the first electronic component of the first substrate is located on a side of the middle mold close to the upper mold, and the second electronic component of the second substrate is located on a side of the middle mold close to the lower mold; Filling the lower mold and the first substrate with plastic packaging materials on one side close to the upper mold respectively; The first surface of the first substrate and the third surface of the second substrate are plastic-sealed to form a first plastic-sealing layer on a side of the first electronic component away from the first substrate, and a second plastic-sealing layer on a side of the second electronic component away from the second substrate.

3. The method for manufacturing a packaging structure according to claim 1, characterized in that: The first surface of the first substrate further includes a first redistribution layer, and the first electronic component is electrically connected to the first redistribution layer; the third surface of the second substrate further includes a second redistribution layer, and the second electronic component is electrically connected to the second redistribution layer.

4. The method for manufacturing a packaging structure according to claim 3, characterized in that: After the step of removing the first substrate and the second substrate to obtain the first packaging structure and the second packaging structure, the method further includes: A first external pin is arranged on a side of the first redistribution layer or the second redistribution layer away from the plastic packaging layer.

5. The method for manufacturing a packaging structure according to claim 1, characterized in that: The orthographic projections of the plurality of first electronic components on the first substrate coincide with the orthographic projections of the plurality of second electronic components on the first substrate.

6. A method for manufacturing a packaging structure, characterized in that: The method comprises: Providing a third substrate, wherein a third redistribution layer is disposed on one side of the third substrate; Disposing a plurality of third electronic components on a side of the third redistribution layer away from the third substrate; Removing the third substrate, and disposing a plurality of fourth electronic components on a side of the third redistribution layer away from the third electronic component; Plastic-sealing the third electronic component and the fourth electronic component, forming a third plastic-sealing layer on a side of the third electronic component away from the third redistribution layer, and forming a fourth plastic-sealing layer on a side of the fourth electronic component away from the third redistribution layer; A fourth redistribution layer is formed on a side of the fourth plastic packaging layer away from the third redistribution layer.

7. The method for manufacturing a packaging structure according to claim 6, characterized in that: The method further comprises: A plurality of conductive pillars are arranged on a side of the third redistribution layer away from the third electronic component, wherein the conductive pillars are electrically connected to the third redistribution layer; The step of forming a fourth redistribution layer on a side of the fourth plastic encapsulation layer away from the third redistribution layer comprises: Grinding the fourth plastic packaging layer to expose the conductive pillar; A fourth redistribution layer is formed on a side of the fourth plastic packaging layer away from the third redistribution layer, so that the fourth redistribution layer is electrically connected to the conductive pillar.

8. The method for manufacturing a packaging structure according to claim 6, characterized in that: After the step of forming a fourth redistribution layer on a side of the fourth plastic encapsulation layer away from the third redistribution layer, the method further includes: A second external pin is arranged on a side of the fourth redistribution layer away from the fourth plastic packaging layer.

9. A packaging structure, characterized in that: The packaging structure is manufactured using the packaging structure manufacturing method described in any one of claims 1 to 5 or claims 6 to 8.

10. An electronic device, characterized in that: The electronic device comprises the packaging structure according to claim 9.

Images