Etching equipment for wafer processing

Abstract

The present invention relates to the technical field of wafer processing and etching, and discloses a wafer processing etching device, comprising a workbench and a support frame, wherein the support frame is arranged at the bottom of the workbench and fixedly connected to the bottom of the workbench, a processing cylinder is fixedly connected to the top of the workbench, and further comprising a processing device, which is arranged inside the processing cylinder and is used to perform etching treatment on wafers requiring etching treatment, and the processing device is fixedly connected to the inner wall of the processing cylinder; a transfer device, which is arranged above the processing cylinder and is used to move the wafers to different processing positions, and the transfer device is fixed to the workbench via a support; the processing device includes an etching cylinder, which is arranged inside the processing cylinder. The wafer processing etching device can automatically drive the wafers to different processing stations and is relatively easy to use.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing and etching, in particular to an etching device for wafer processing. Background Art

[0002] Silicon carbide is a representative material of the third-generation semiconductors. It has a large bandgap and high chemical inertness. It has important application value in the field of high-frequency and high-voltage devices. It has gradually been used in photovoltaics, new energy vehicles, smart grids and other fields, and has performed excellently. During the processing of silicon carbide wafers, dislocation defects are prone to occur on the surface of silicon carbide. Such defects are not easy to detect. Since dislocations will be corroded first, the corrosion method is usually used to judge the dislocation area of ​​silicon carbide wafers.

[0003] However, the currently used etching equipment is not convenient for removing and cleaning the wafers after etching, and the wafers are not convenient for being fully in contact with the etching solution during the etching process. Summary of the Invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: A wafer processing etching device includes a workbench and a support frame, wherein the support frame is arranged at the bottom of the workbench and fixedly connected to the bottom of the workbench, and a processing cylinder is fixedly connected to the top of the workbench, and further includes:

[0005] A processing device is disposed inside the processing cylinder and is used to perform etching on wafers that require etching. The processing device is fixedly connected to the inner wall of the processing cylinder;

[0006] A transfer device is provided above the processing cylinder and is used to move the wafer to different processing positions. The transfer device is fixed to the workbench via a bracket.

[0007] The processing device comprises:

[0008] An etching cylinder is disposed inside the processing cylinder and is used to perform etching treatment on the wafer to be processed. The etching cylinder is filled with an etching solution.

[0009] A cleaning cylinder, the cleaning cylinder being arranged inside the processing cylinder and being used for cleaning the wafer after the etching process;

[0010] The positioning frame is arranged inside the processing cylinder, and the bottom of the positioning frame is fixedly connected to the bottom of the inner wall of the processing cylinder. The positioning frame is used to fix the etching cylinder and the cleaning cylinder inside the processing cylinder, so as to automatically drive the wafer to be transferred to different processing stations, which is convenient to use.

[0011] Preferably, the cleaning cylinder includes a cylinder body, an arc-shaped guide rail is fixedly connected to one side of the inner wall of the cylinder, the side of the arc-shaped guide rail away from the inner wall of the cylinder is fixedly connected to a fixed seat through an electronic slider, the side of the fixed seat away from the arc-shaped guide rail is fixedly connected to a water spray assembly, a stirring assembly is passed through and rotatably connected to the bottom of the inner wall of the cylinder, the bottom of the stirring assembly is located outside the cylinder body, the bottom of the stirring assembly is fixedly connected to the driving shaft of the driving motor, and the top of the driving motor is fixedly connected to the bottom of the cylinder body through a bracket. By combining the cleaning and rinsing operations, the surface of the chip is cleaned more thoroughly and the cleaning effect is better.

[0012] Preferably, the side surface of the cylinder is fixedly connected to the side surface of the positioning frame, the stirring assembly is rotatably connected to the cylinder via a sealed bearing, and the interior of the cylinder below the water spray assembly is filled with cleaning water.

[0013] Preferably, the water spray assembly includes a main water pipe, the side of the main water pipe is connected to an annular water pipe, the inner side wall of the annular water pipe is connected to a water nozzle, and the side of the annular water pipe is slidably connected to a supporting slide through a slider.

[0014] Preferably, the side of the support slide away from the annular water pipe is fixed on the inner wall of the cylinder, the side of the main water pipe away from the annular water pipe is fixed on a fixed seat, and the bottom of the main water pipe is connected to an external water injection pump through a connecting pipe, so that the water nozzle can rinse the chips inside the transfer device from different positions and angles, avoiding dead corners during rinsing, and making the rinsing effect more thorough and comprehensive.

[0015] Preferably, the transfer device includes a transfer bracket, the top of the transfer bracket is fixedly connected to an electric rotating table, the rotating part of the electric rotating table is fixedly connected to the rotating bracket, the bottom of the rotating bracket is fixedly connected to a telescopic push rod, and the bottom of the telescopic push rod is fixedly connected to a placement device to facilitate the transfer of chips.

[0016] Preferably, the bottom of the transfer bracket is fixedly connected to the top of the workbench, and the fixed part of the electric rotating table is fixedly connected to the transfer bracket.

[0017] Preferably, the placement device includes a placement base, the bottom of the placement base is fixedly connected to a rotating motor, the driving shaft of the rotating motor is fixedly connected to a placement bracket, the bottom of the placement bracket is fixedly connected to a placement net cylinder, a placement opening is opened on the side of the placement net cylinder, and a plug is provided inside the placement opening to avoid the situation where the fixed part is inconvenient to contact with the corrosion solution due to the fixed chip, and the corrosion is more comprehensive.

[0018] Preferably, the top of the placement base is fixedly connected to the bottom of the telescopic push rod, and the interior of the placement net cylinder is divided into multiple groups of placement spaces by multiple groups of mesh plates.

[0019] The present invention provides an etching device for wafer processing. It has the following beneficial effects:

[0020] 1. When using the etching equipment for wafer processing, the wafer is placed inside the transfer device, and the transfer device drives the wafer to move to the inside of the etching cylinder. The etching cylinder etches the wafer inside the transfer device. After the etching process is completed, the transfer device drives the wafer to transfer to the inside of the cleaning cylinder, and the cleaning cylinder cleans the etched wafer. It is convenient to automatically drive the wafer to different processing stations, and it is convenient to use.

[0021] 2. The etching equipment for wafer processing, when the transfer device sends the wafer into the interior of the cleaning cylinder, first sends the wafer into the cleaning water inside the cylinder for cleaning, and at the same time drives the motor to rotate the stirring component, and the stirring component drives the cleaning water inside the cylinder to move, and the wafer is cleaned by the movement of the cleaning water. After cleaning is completed, the transfer device drives the wafer to rise inside the cleaning cylinder to a position facing the water spray component, and the wafer is rinsed by the water spray component to facilitate rinsing of the residual liquid on the wafer. By combining the cleaning and rinsing operations, the wafer surface is cleaned more thoroughly and the cleaning effect is better.

[0022] 3. When the chip processing etching equipment is in use, the external water injection pump sends cleaning water into the main water pipe through the connecting pipe. The cleaning water inside the main water pipe enters different annular water pipes respectively and is sprayed out through the water nozzles on the inner sides of the annular water pipes. The water nozzles spray the cleaning water onto the chips inside the transfer device to clean the chips. At the same time, the arc guide rail drives the fixed seat to move through the electronic slider, and the fixed seat drives the water spray assembly to slide along the inner wall of the cylinder, so that the water nozzle can rinse the chips inside the transfer device from different positions and angles, avoiding dead corners during rinsing and making the rinsing effect more thorough and comprehensive.

[0023] 4. When using the etching equipment for wafer processing, the wafer is placed inside the placement device, and then the electric rotary table drives the rotating bracket to rotate, the rotating bracket drives the telescopic push rod to rotate, and the telescopic push rod drives the placement device to rotate, so that the wafer inside it can be transferred through the placement device. When transferred to the corresponding processing station, the placement device is driven down by extending the telescopic push rod, and the wafer inside the placement device can be sent into the corresponding processing device, which is convenient for transferring the wafer.

[0024] 5. The etching equipment for chip processing, when the placement device enters the interior of the etching cylinder and is immersed in the etching liquid, the placement bracket is driven to rotate by the rotating motor, the placement bracket drives the placement mesh cylinder to rotate, and the placement mesh cylinder drives the chip inside it to rotate. When the chip rotates, it will slide inside the placement space under the resistance of the etching liquid and stick to the mesh plate. By rotating the motor to drive the placement bracket to rotate back and forth, the chip can be driven to slide back and forth inside the placement space, so that the two sides of the chip are intermittently stuck to different mesh plates, so that both sides of the chip can be corroded by the etching solution, avoiding the situation where the fixed part is inconvenient to contact with the etching solution due to the fixing of the chip, and the etching is more comprehensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of the etching equipment for wafer processing of the present invention;

[0026] Figure 2 This is a schematic structural diagram of the processing device of the present invention;

[0027] Figure 3 This is a schematic diagram of the cleaning cylinder structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the internal structure of the cleaning cylinder of the present invention;

[0029] Figure 5 This is a schematic structural diagram of the water spray assembly of the present invention;

[0030] Figure 6 Schematic diagram of the transfer device structure of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the placement device of the present invention;

[0032] Figure 8 This is a schematic diagram of the internal structure of the screen cylinder of the present invention.

[0033] In the figure: 1. workbench; 2. support frame; 3. treatment cylinder; 4. treatment device; 41. corrosion cylinder; 42. cleaning cylinder; 421. cylinder body; 422. arc guide rail; 423. fixing seat; 424. water spray assembly; 4241. main water pipe; 4242. annular water pipe; 4243. water nozzle; 4244. supporting slide; 425. stirring assembly; 426. driving motor; 43. positioning frame; 5. transfer device; 51. transfer bracket; 52. electric rotating table; 53. rotating bracket; 54. telescopic push rod; 55. placement device; 551. placement base; 552. rotating motor; 553. placement bracket; 554. placement net cylinder; 555. placement port; 556. plug. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] See also Figure 1-Figure 5 The present invention provides a technical solution to solve the problem that the etching equipment currently used is inconvenient to remove and clean the wafers after etching: an etching equipment for wafer processing, comprising a workbench 1 and a support frame 2, the support frame 2 is arranged at the bottom of the workbench 1 and fixedly connected to the bottom of the workbench 1, and a processing cylinder 3 is fixedly connected to the top of the workbench 1, and further comprising:

[0036] The processing device 4 is arranged inside the processing cylinder 3 and is used to perform etching on the wafers that need to be etched. The processing device 4 is fixedly connected to the inner wall of the processing cylinder 3;

[0037] The transfer device 5 is arranged above the processing cylinder 3 and is used to move the wafer to different processing positions. The transfer device 5 is fixed to the workbench 1 through a bracket;

[0038] The processing device 4 includes:

[0039] The etching cylinder 41 is disposed inside the processing cylinder 3 and is used to perform etching on the wafer to be processed. The etching cylinder 41 is filled with an etching solution.

[0040] The cleaning cylinder 42 is arranged inside the processing cylinder 3 and is used to clean the wafer after the etching process;

[0041] The positioning frame 43 is arranged inside the treatment cylinder 3. The bottom of the positioning frame 43 is fixedly connected to the bottom of the inner wall of the treatment cylinder 3. The positioning frame 43 is used to fix the corrosion cylinder 41 and the cleaning cylinder 42 inside the treatment cylinder 3;

[0042] When in use, the wafer is placed inside the transfer device 5, and the transfer device 5 drives the wafer to move to the inside of the etching cylinder 41. The etching cylinder 41 etches the wafer inside the transfer device 5. After the etching process is completed, the transfer device 5 drives the wafer to move to the inside of the cleaning cylinder 42, and the cleaning cylinder 42 cleans the etched wafer. This facilitates the automatic transfer of the wafer to different processing stations and is relatively convenient to use.

[0043] The cleaning cylinder 42 includes a cylinder body 421, one side of the inner wall of the cylinder body 421 is fixedly connected to an arcuate guide rail 422, the side of the arcuate guide rail 422 away from the inner wall of the cylinder body 421 is fixedly connected to a fixing seat 423 through an electronic slider, the side of the fixing seat 423 away from the arcuate guide rail 422 is fixedly connected to a water spray assembly 424, the bottom of the inner wall of the cylinder body 421 is penetrated and rotatably connected to a stirring assembly 425, the bottom of the stirring assembly 425 is located outside the cylinder body 421, the bottom of the stirring assembly 425 is fixedly connected to the driving shaft of a driving motor 426, the top of the driving motor 426 is fixedly connected to the bottom of the cylinder body 421 through a bracket, the side of the cylinder body 421 is fixedly connected to the side of the positioning frame 43, the stirring assembly 425 and the cylinder body 421 are rotatably connected through a sealed bearing, and the position inside the cylinder body 421 below the water spray assembly 424 is filled with cleaning water;

[0044] When the transfer device 5 sends the wafer into the cleaning cylinder 42, the wafer is first sent into the cleaning water inside the cylinder 421 for cleaning, and at the same time, the driving motor 426 drives the stirring component 425 to rotate, and the stirring component 425 drives the cleaning water inside the cylinder 421 to move, and the wafer is cleaned by the movement of the cleaning water. After cleaning is completed, the transfer device 5 drives the wafer to rise inside the cleaning cylinder 42 to a position facing the water spray component 424, and the wafer is rinsed by the water spray component 424, so as to facilitate rinsing away the residual liquid on the wafer. By combining the cleaning and rinsing operations, the wafer surface is cleaned more thoroughly and the cleaning effect is better.

[0045] The water spray assembly 424 includes a main water pipe 4241, the side of which is connected to an annular water pipe 4242, the inner wall of which is connected to a water nozzle 4243, and the side of the annular water pipe 4242 is slidably connected to a support slide 4244 via a slider. The side of the support slide 4244 away from the annular water pipe 4242 is fixed to the inner wall of the cylinder 421, and the side of the main water pipe 4241 away from the annular water pipe 4242 is fixed to the fixing seat 423. The bottom of the main water pipe 4241 is connected to an external water injection pump via a connecting pipe.

[0046] During use, the external water injection pump sends cleaning water into the main water pipe 4241 through the connecting pipe. The cleaning water inside the main water pipe 4241 enters different annular water pipes 4242 respectively and is sprayed out through the water nozzles 4243 on the inner sides of the annular water pipes 4242. The water nozzles 4243 spray the cleaning water onto the wafers inside the transfer device 5 to clean the wafers. At the same time, the arc guide rail 422 drives the fixed seat 423 to move through the electronic slider, and the fixed seat 423 drives the water spray assembly 424 to slide along the inner wall of the cylinder 421, so that the water nozzles 4243 can rinse the wafers inside the transfer device 5 from different positions and angles, avoiding dead corners during rinsing and making the rinsing effect more thorough and comprehensive.

[0047] See also Figures 1-8 The present invention provides a technical solution to solve the problem that the currently used etching equipment is inconvenient to transfer wafers and the wafers are not convenient to fully contact with the etching solution during the etching process: the transfer device 5 includes a transfer bracket 51, the top of the transfer bracket 51 is fixedly connected to an electric rotating table 52, the rotating part of the electric rotating table 52 is fixedly connected to a rotating bracket 53, the bottom of the rotating bracket 53 is fixedly connected to a telescopic push rod 54, the bottom of the telescopic push rod 54 is fixedly connected to a placing device 55, the bottom of the transfer bracket 51 is fixedly connected to the top of the workbench 1, and the fixed part of the electric rotating table 52 is fixedly connected to the transfer bracket 51;

[0048] When in use, the wafer is placed inside the placement device 55, and then the electric rotating table 52 drives the rotating bracket 53 to rotate, and the rotating bracket 53 drives the telescopic push rod 54 to rotate, and the telescopic push rod 54 drives the placement device 55 to rotate, so that the wafer inside it can be moved by the placement device 55. When it is transferred to the corresponding processing station, the telescopic push rod 54 is extended to drive the placement device 55 to descend, and the wafer inside the placement device 55 can be sent to the corresponding processing device, which facilitates the transfer of wafers.

[0049] The placement device 55 includes a placement base 551, a rotating motor 552 is fixedly connected to the bottom of the placement base 551, a placement bracket 553 is fixedly connected to the driving shaft of the rotating motor 552, a placement net cylinder 554 is fixedly connected to the bottom of the placement bracket 553, a placement opening 555 is opened on the side of the placement net cylinder 554, a plug 556 is provided inside the placement opening 555, the top of the placement base 551 is fixedly connected to the bottom of the telescopic push rod 54, the interior of the placement net cylinder 554 is divided into multiple groups of placement spaces by multiple groups of mesh plates, the placement net cylinder 554 is columnar, and the placement net cylinder 554 is fixed to the placement bracket 553 with its axis kept horizontal;

[0050] After the placement device 55 enters the interior of the etching cylinder 41 and is immersed in the etching liquid, the placement bracket 553 is driven to rotate by rotating the motor 552, and the placement bracket 553 drives the placement mesh cylinder 554 to rotate, and the placement mesh cylinder 554 drives the chip inside it to rotate. When the chip rotates, it will slide inside the placement space under the resistance of the etching liquid and stick to the mesh plate. By rotating the motor 552 to drive the placement bracket 553 to rotate back and forth, the chip can be driven to slide back and forth inside the placement space, so that the two sides of the chip are intermittently stuck to different mesh plates, so that both sides of the chip can be corroded by the etching solution, avoiding the situation where the fixed part is inconvenient to contact with the etching solution due to the fixed chip, and the corrosion is more comprehensive.

[0051] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without making creative efforts should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention shall be implemented in accordance with conventional means in the field unless otherwise specified or limited.

Claims

1. A wafer processing etching device, comprising a workbench (1) and a support frame (2), wherein the support frame (2) is arranged at the bottom of the workbench (1) and fixedly connected to the bottom of the workbench (1), and a processing cylinder (3) is fixedly connected to the top of the workbench (1), characterized in that: Also includes: A processing device (4), the processing device (4) is arranged inside the processing cylinder (3), the processing device (4) is used to perform etching processing on the wafer that needs to be etched, and the processing device (4) is fixedly connected to the inner wall of the processing cylinder (3); A transfer device (5), the transfer device (5) is arranged above the processing cylinder (3), the transfer device (5) is used to drive the wafer to move to different processing positions, and the transfer device (5) is fixed on the workbench (1) through a bracket; The processing device (4) comprises: An etching cylinder (41) is arranged inside the processing cylinder (3), and the etching cylinder (41) is used to perform etching treatment on a wafer to be processed, and the interior of the etching cylinder (41) is filled with an etching solution; A cleaning cylinder (42), the cleaning cylinder (42) being arranged inside the processing cylinder (3), and the cleaning cylinder (42) being used to clean the wafer after the etching process; A positioning frame (43) is provided inside the treatment cylinder (3), the bottom of the positioning frame (43) is fixedly connected to the bottom of the inner wall of the treatment cylinder (3), and the positioning frame (43) is used to fix the corrosion cylinder (41) and the cleaning cylinder (42) inside the treatment cylinder (3).

2. The etching equipment for wafer processing according to claim 1, characterized in that: The cleaning cylinder (42) comprises a cylinder (421), one side of the inner wall of the cylinder (421) is fixedly connected to an arc-shaped guide rail (422), the side of the arc-shaped guide rail (422) away from the inner wall of the cylinder (421) is fixedly connected to a fixing seat (423) via an electronic slider, the side of the fixing seat (423) away from the arc-shaped guide rail (422) is fixedly connected to a water spray assembly (424), the bottom of the inner wall of the cylinder (421) is penetrated and rotatably connected to a stirring assembly (425), the bottom of the stirring assembly (425) is located outside the cylinder (421), the bottom of the stirring assembly (425) is fixedly connected to the driving shaft of a driving motor (426), and the top of the driving motor (426) is fixedly connected to the bottom of the cylinder (421) via a bracket.

3. The etching equipment for wafer processing according to claim 2, characterized in that: The side of the cylinder (421) is fixedly connected to the side of the positioning frame (43), the stirring assembly (425) and the cylinder (421) are rotatably connected via a sealed bearing, and the interior of the cylinder (421) below the water spray assembly (424) is filled with cleaning water.

4. The etching equipment for wafer processing according to claim 2, wherein: The water spray assembly (424) comprises a main water pipe (4241), the side of the main water pipe (4241) is connected to an annular water pipe (4242), the inner side wall of the annular water pipe (4242) is connected to a water nozzle (4243), and the side of the annular water pipe (4242) is slidably connected to a supporting slideway (4244) via a slider.

5. The etching equipment for wafer processing according to claim 4, characterized in that: The side of the support slide (4244) away from the annular water pipe (4242) is fixed to the inner wall of the cylinder (421), the side of the main water pipe (4241) away from the annular water pipe (4242) is fixed to the fixing seat (423), and the bottom of the main water pipe (4241) is connected to the external water injection pump through a connecting pipe.

6. The etching equipment for wafer processing according to claim 1, characterized in that: The transfer device (5) comprises a transfer bracket (51), the top of the transfer bracket (51) is fixedly connected to an electric rotating platform (52), the rotating part of the electric rotating platform (52) is fixedly connected to a rotating bracket (53), the bottom of the rotating bracket (53) is fixedly connected to a telescopic push rod (54), and the bottom of the telescopic push rod (54) is fixedly connected to a placement device (55).

7. The etching equipment for wafer processing according to claim 6, characterized in that: The bottom of the transfer bracket (51) is fixedly connected to the top of the workbench (1), and the fixed portion of the electric rotating table (52) is fixedly connected to the transfer bracket (51).

8. The etching equipment for wafer processing according to claim 6, characterized in that: The placement device (55) comprises a placement base (551), the bottom of the placement base (551) is fixedly connected to a rotating motor (552), the driving shaft of the rotating motor (552) is fixedly connected to a placement bracket (553), the bottom of the placement bracket (553) is fixedly connected to a placement net cylinder (554), a placement opening (555) is provided on the side of the placement net cylinder (554), and a plug (556) is provided inside the placement opening (555).

9. The etching equipment for wafer processing according to claim 8, characterized in that: The top of the placement base (551) is fixedly connected to the bottom of the telescopic push rod (54), and the interior of the placement net cylinder (554) is divided into multiple groups of placement spaces by multiple groups of net plates.

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