Inspection system and method for semiconductor process tools
By grouping the information sheets of semiconductor process equipment and performing "forward clearing," the problems of missed inspections and increased costs caused by random sampling were solved, achieving an efficient testing strategy and ensuring timely testing and cost control of key products.
Patent Information
- Application Number
- CN202411707600.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2044-11-26
AI Technical Summary
In existing semiconductor process testing methods, random sampling leads to missed inspections of important products on important equipment, and increases the cost of manpower and testing equipment, making it impossible to guarantee a sufficient sampling rate.
By acquiring and synchronously recording information tables of semiconductor product batches, grouping them according to processing sequence and statistical cycle, marking mandatory and non-mandatory inspection batch information, and adopting a "forward clearing" mechanism, the detection strategy is determined based on the ranking and category of batch information to avoid redundant detection.
Ensure that key products are tested in each statistical period, improve the sampling rate, avoid redundant testing, reduce costs, and maintain the stability and timeliness of the testing rate.
Smart Images
Figure CN119764211B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a detection system and method for semiconductor process equipment. Background Technology
[0002] Semiconductor chips and other products are essential components in modern electronic devices. Their quality and reliability significantly impact the performance and lifespan of these devices. Therefore, defect detection and electronic aging tests on semiconductor products are crucial for ensuring product quality and troubleshooting malfunctions. However, due to the diverse product types and complex processes on production lines, and considering the costs of manpower and testing equipment, only sampling inspections can be used to monitor product health. Existing testing methods primarily involve limited random sampling of products at process inspection stations to monitor the normal operation of process equipment, such as... Figure 1 As shown, product batches 1-3 are transferred from machine A to machines B1-B3 respectively. After passing through machine C, product batch 1 is randomly sampled for inspection, achieving quality monitoring of machines A and B1. However, when there are machines requiring focused monitoring of their processes, such as machine B2, random sampling may lead to missed inspections of products from important machines. Therefore, a significant increase in the sampling rate is needed to ensure that products processed by the machines under inspection are sampled. However, this method would significantly increase manpower and machine inspection costs, and cannot guarantee a sufficient sampling rate for the machines under inspection. Summary of the Invention
[0003] This application provides a testing system and method for semiconductor process equipment, which can ensure the reliability of equipment testing and avoid increased testing costs.
[0004] On one hand, this application provides a testing system for semiconductor process equipment, the system comprising:
[0005] The information acquisition module is used to acquire the information table of the machine to be inspected. The information table is used to synchronously record the batch information of semiconductor products processed by the machine to be inspected. The batch information of the information table is sorted according to the processing order and grouped sequentially according to the statistical period. The batch information includes mandatory inspection and non-mandatory inspection. The batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection product. Each statistical period grouping includes at least one batch information of the mandatory inspection category.
[0006] The information clearing module is used to clear the preceding group corresponding to the target batch information of the inspected product batch from the information table if any semiconductor product batch corresponding to the information table has completed random sampling inspection.
[0007] The detection control module is used to determine the detection strategy for the remaining product batches corresponding to the information table based on the ranking of the target batch information within the current group and the category of the subsequent batch information in the current group. The subsequent batch information refers to the batch information in the current group that is ranked after the target batch information.
[0008] In a possible implementation, the detection control module is specifically used for:
[0009] If there are batches of mandatory inspection categories in the subsequent batch information, and the target batch information is ranked in the first segment of the current group, the current group is retained and the semiconductor product batches of mandatory inspection categories in the current group are inspected.
[0010] In a possible implementation, the detection control module is further specifically used for:
[0011] If there are batches of mandatory categories in the subsequent batch information, and the target batch information is ranked in the latter part of the current group, then each batch of information in the current group is cleared from the information table.
[0012] In a possible implementation, the detection control module is specifically used for:
[0013] If there are batches of mandatory inspection category in the subsequent batch information, the ranking ratio of the target batch information in the target segment is determined based on the group ranking of the target batch information and the group ranking of the batch information of mandatory inspection category. The target segment refers to the segment from the first batch information of the current group to the batch information of mandatory inspection category.
[0014] If the ranking ratio does not exceed the preset ratio, the current group is retained and the semiconductor product batches of the mandatory inspection category in the current group are inspected.
[0015] In a possible implementation, the detection control module is further specifically used for:
[0016] If the ranking ratio exceeds the preset ratio, the information of each batch of the current group is cleared from the information table.
[0017] In a possible implementation, the detection control module is specifically used for:
[0018] If there is no batch information of the mandatory category in the subsequent batch information, the current grouping is cleared, and the next batch of information in the sorting of the target batch information is taken as the start of the statistical period, and the grouping is re-started from the next batch of information.
[0019] In a possible implementation, the system further includes:
[0020] An interval duration detection module is used to obtain the remaining transmission time of the semiconductor product batch, and the remaining transmission time is used to indicate the remaining consumable time before the semiconductor product batch is transmitted to the next process node.
[0021] The information category determination module is used to determine the category of the batch information as non-mandatory inspection if the remaining transmission time does not exceed a preset time and / or the semiconductor product batch is a non-inspection product.
[0022] In a possible implementation, the information category determination module is further configured to:
[0023] If the remaining transmission time of multiple semiconductor product batches in the statistical period exceeds the preset time and they are inspectable products, obtain the batch attribute data of each semiconductor product batch.
[0024] Based on the batch attribute data, determine the semiconductor product batches whose batch information category is mandatory for inspection from each of the semiconductor product batches.
[0025] In a possible implementation, the batch attribute data includes at least one of the following: the number of groups in the semiconductor product batch, the station distance, the estimated transmission time, and the pre-stored detection program information. The number of groups is used to indicate the number of information tables to which the batch information of the semiconductor product batch belongs, and each group corresponds to a machine to be inspected. The station distance is used to indicate the transmission distance between the current location of the semiconductor product batch and the inspection station. The estimated transmission time is used to indicate the time required for the semiconductor product batch to be transported from its current location to the inspection station. The pre-stored detection program information is used to indicate whether the inspection station has a pre-stored detection program for the semiconductor product batch.
[0026] The higher the number of packets, the shorter the distance between stations, the shorter the estimated transmission time, or the higher the probability that the batch information category is mandatory for inspection, the higher the probability that the detection program's pre-stored information indicates that it has been pre-stored.
[0027] On the other hand, this application provides a detection method for semiconductor process equipment, the method comprising:
[0028] An information table of the machine to be inspected is obtained. The information table is used to synchronously record the batch information of semiconductor products processed by the machine to be inspected. The batch information of the information table is sorted according to the processing order and grouped sequentially according to the statistical period. The category of the batch information includes mandatory inspection and non-mandatory inspection. The batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection product. Each statistical period grouping includes at least one batch information of the mandatory inspection category.
[0029] If any semiconductor product batch corresponding to the information table completes random sampling inspection, the preceding group corresponding to the target batch information of the inspected product batch is removed from the information table.
[0030] Based on the ranking of the target batch information within its current group and the category of subsequent batch information in the current group, the detection strategy for the remaining product batches corresponding to the information table is determined, wherein the subsequent batch information is the batch information in the current group that is ranked after the target batch information.
[0031] In a possible implementation, the step of determining the detection strategy for the remaining product batches corresponding to the information table based on the ranking of the target batch information within its current group and the category of subsequent batch information in the current group, wherein the subsequent batch information refers to the batch information in the current group that is ranked after the target batch information, including:
[0032] If there are batches of mandatory inspection categories in the subsequent batch information, and the target batch information is ranked in the first segment of the current group, the current group is retained and the semiconductor product batches of mandatory inspection categories in the current group are inspected.
[0033] In a possible implementation, the method further includes:
[0034] If there are batches of mandatory categories in the subsequent batch information, and the target batch information is ranked in the latter part of the current group, then the batch information of each batch of the current group is cleared from the information table.
[0035] In a possible implementation, the step of determining the detection strategy for the remaining product batches corresponding to the information table based on the ranking of the target batch information within its current group and the category of subsequent batch information in the current group, wherein the subsequent batch information refers to the batch information in the current group that is ranked after the target batch information, including:
[0036] If there are batches of mandatory inspection category in the subsequent batch information, the ranking ratio of the target batch information in the target segment is determined based on the group ranking of the target batch information and the group ranking of the batch information of mandatory inspection category. The target segment refers to the segment from the first batch information of the current group to the batch information of mandatory inspection category.
[0037] If the ranking ratio does not exceed the preset ratio, the current group is retained and the semiconductor product batches of the mandatory inspection category in the current group are inspected.
[0038] In a possible implementation, the method further includes:
[0039] If the ranking ratio exceeds the preset ratio, the information of each batch of the current group is cleared from the information table.
[0040] In a possible implementation, the method further includes:
[0041] If there is no batch information of the mandatory category in the subsequent batch information, the current grouping is cleared, and the next batch of information in the sorting of the target batch information is taken as the start of the statistical period, and the grouping is re-started from the next batch of information.
[0042] In a possible implementation, the method for determining the category of the batch information includes:
[0043] The remaining transmission time of the semiconductor product batch is obtained, and the remaining transmission time is used to indicate the remaining consumable time before the semiconductor product batch is transmitted to the next process node.
[0044] If the remaining transmission time does not exceed the preset time and / or the semiconductor product batch is a non-inspection product, the category of the batch information is determined to be non-mandatory inspection.
[0045] In a possible implementation, the method further includes:
[0046] If the remaining transmission time of multiple semiconductor product batches in the statistical period exceeds the preset time and they are inspectable products, obtain the batch attribute data of each semiconductor product batch.
[0047] Based on the batch attribute data, determine the semiconductor product batches whose batch information category is mandatory for inspection from each of the semiconductor product batches.
[0048] In a possible implementation, the batch attribute data includes at least one of the following: the number of groups in the semiconductor product batch, the station distance, the estimated transmission time, and the pre-stored detection program information. The number of groups is used to indicate the number of information tables to which the batch information of the semiconductor product batch belongs, and each group corresponds to a machine to be inspected. The station distance is used to indicate the transmission distance between the current location of the semiconductor product batch and the inspection station. The estimated transmission time is used to indicate the time required for the semiconductor product batch to be transported from its current location to the inspection station. The pre-stored detection program information is used to indicate whether the inspection station has a pre-stored detection program for the semiconductor product batch.
[0049] The higher the number of packets, the shorter the distance between stations, the shorter the estimated transmission time, or the higher the probability that the batch information category is mandatory for inspection, the higher the probability that the detection program's pre-stored information indicates that it has been pre-stored.
[0050] On the other hand, a computer device is provided, the device including a processor and a memory, the memory storing at least one instruction or at least one program, the at least one instruction or the at least one program being loaded and executed by the processor to implement the detection method for semiconductor process equipment as described above.
[0051] On the other hand, a computer-readable storage medium is provided, wherein at least one instruction or at least one program is stored therein, the at least one instruction or the at least one program being loaded and executed by a processor to implement the detection method for semiconductor process equipment as described above.
[0052] On the other hand, a server is provided, the server including a processor and a memory, the memory storing at least one instruction or at least one program, the at least one instruction or the at least one program being loaded and executed by the processor to implement the detection method for semiconductor process equipment as described above.
[0053] On the other hand, a terminal is provided, the terminal including a processor and a memory, the memory storing at least one instruction or at least one program, the at least one instruction or the at least one program being loaded and executed by the processor to implement the detection method for semiconductor process equipment as described above.
[0054] On the other hand, a computer program product is provided, which includes computer instructions that, when executed by a processor, implement the detection method for semiconductor process equipment as described above.
[0055] The testing system, method, equipment, storage medium, server, terminal, and computer program products for semiconductor process equipment provided in this application have the following technical advantages:
[0056] The semiconductor process equipment inspection system of this application acquires an information table of the equipment to be inspected, which synchronously records batch information of semiconductor products processed by the equipment. The batch information in the information table is sorted according to the processing order and grouped sequentially according to a statistical period. The batch information categories include mandatory and non-mandatory inspection; batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection item. Each statistical period's grouping includes at least one batch of mandatory inspection category information to ensure that key products of the equipment to be inspected are marked and inspected in each statistical period, completing equipment quality monitoring throughout the data cycle. Simultaneously, if any semiconductor product batch corresponding to the information table is completed... Random sampling is performed. The information clearing module removes the preceding group corresponding to the target batch information of the inspected product batch from the information table, that is, the data of the statistical period before the target batch information is cleared to zero. The detection control module determines the detection strategy of the remaining product batches corresponding to the information table based on the ranking of the target batch information within its current group and the category of the subsequent batch information in the current group. Then, based on the "forward clearing" mechanism, the statistical period that has been implemented for quality supervision is removed, ensuring the sampling rate of the machine to be inspected and avoiding redundant detection. There is no need to increase the sampling quantity of random sampling to improve the sampling rate of the machine to be inspected, thus avoiding the increase in labor and machine costs. Attached Figure Description
[0057] To more clearly illustrate the technical solutions and advantages in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0058] Figure 1 This is a schematic diagram of a batch random inspection process for semiconductor products provided by existing technology;
[0059] Figure 2 This is a schematic diagram of the framework of a testing system for semiconductor process equipment provided in an embodiment of this application;
[0060] Figure 3 This is a schematic diagram of an information table and a statistical period grouping provided in an embodiment of this application;
[0061] Figure 4 This is another information table and a schematic diagram of the statistical period grouping provided in the embodiments of this application;
[0062] Figure 5 This is another information table and a schematic diagram of the statistical period grouping provided in the embodiments of this application;
[0063] Figure 6 This is a schematic flowchart of a detection method for semiconductor process equipment provided in an embodiment of this application;
[0064] Figure 7 This is a hardware structure block diagram of an electronic device for a testing method of a semiconductor process equipment, provided in an embodiment of this application. Detailed Implementation
[0065] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0066] It should be noted that, in the description of this application, the following definitions shall apply unless a different definition is given elsewhere in the claims or this specification. All numerical values, whether or not explicitly indicated, are defined herein as being modified by the term "about". The term "about" generally refers to a range of numerical values that a person skilled in the art would consider equivalent to the stated values to produce substantially the same properties, functions, results, etc. A range of numerical values indicated by a low value and a high value is defined as including all numerical values within that range and all subranges included within that range.
[0067] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or sub-modules is not necessarily limited to those steps or sub-modules explicitly listed, but may include other steps or sub-modules not explicitly listed or inherent to such processes, methods, products, or devices.
[0068] In this embodiment, the terminal may include physical devices such as controllers, smartphones, desktop computers, tablets, laptops, digital assistants, augmented reality (AR) / virtual reality (VR) devices, smart voice interaction devices, and smart wearable devices, and may also include software running on the physical device, such as applications; the machine tool may be any machine tool used for processing devices in the semiconductor device processing process.
[0069] In this embodiment, the server can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN (Content Delivery Network), and big data and artificial intelligence platforms. Specifically, the server mentioned above can include physical devices, which may specifically include network communication submodules, processors, and memory, etc., and may also include software running on the physical device, which may specifically include applications, etc.
[0070] The following describes a detection system for semiconductor process equipment. This system can be applied to semiconductor manufacturing scenarios and can be used to detect any equipment in the semiconductor device fabrication process, thereby locating problematic equipment. Please refer to... Figure 2 , Figure 2 This is a schematic diagram of a detection system for a semiconductor process equipment according to an embodiment of this application. The system may include the following information acquisition module, information clearing module, and detection control module:
[0071] The information acquisition module is used to acquire the information table of the machine to be inspected.
[0072] Specifically, the machine to be inspected refers to the processing machine that needs to perform product testing, such as key process machines or machines with frequent problems. For each machine to be inspected, a corresponding information table is created and stored to synchronously record the batch information of semiconductor product lots processed by the machine to be inspected. The batch information is used to identify the semiconductor product lot, such as batch barcodes.
[0073] Specifically, batch information is categorized into mandatory and non-mandatory inspection categories. Batch information in the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection item. Understandably, after a semiconductor product batch passes through the inspection station in the processing sequence, a portion of the processed semiconductor product batches are selected as key products, and their batch information is marked as mandatory inspection. These are then transported to the testing station for defect detection or quality testing, ensuring the sampling rate of the inspection station and effectively monitoring the health of the inspection station.
[0074] Specifically, the batch information in the information table is sorted according to the processing order and grouped sequentially according to the statistical period. Each batch of information in the information table is sorted from first to last according to the processing order, and each statistical period's group includes batch information of at least one mandatory inspection category. The statistical period can be set based on actual testing needs; it can be a preset time period, a preset quantity period, etc. For example, a statistical period of 30 minutes, or N valid semiconductor product batches, etc., is used as a group, and the batch information in the information table is grouped sequentially from first to last according to the processing order. Understandably, as a batch of semiconductor products passes through the inspection machine, its batch information is added to the information table in near real-time and combined into the group corresponding to the latest statistical period.
[0075] Specifically, at least one key product is selected from each statistical period's group, and its batch information is marked as mandatory for inspection. This semiconductor product batch is then sent to a matching testing station for corresponding product testing. In one example, the statistical period is a preset time period; each preset time period results in a group of batch information, and one semiconductor product batch is selected as the key product, with its batch information category marked as mandatory for inspection. In another example, the statistical period is a preset quantity period; each time a preset quantity of valid product batches are processed by the testing machine, a group of batch information is formed, and the batch information of one semiconductor product batch is selected and marked as mandatory for inspection.
[0076] Specifically, in addition to marking key products on the machines to be inspected, random sampling inspections are also conducted on semiconductor products on each process machine in the semiconductor processing line to monitor the processing quality of each machine.
[0077] The information clearing module is used to clear the preceding group corresponding to the target batch information of the inspected product batch from the information table if any semiconductor product batch corresponding to the information table has completed random sampling inspection.
[0078] Understandably, the preceding group refers to other groups in the information table that are ranked before the group to which the target batch information belongs. During the mass production of semiconductor products, any batch of semiconductor products in the information table may be randomly sampled and sent to the testing station for testing before other batches that have already been shipped. Correspondingly, the semiconductor product batches currently recorded in the information table for the testing machine have completed the corresponding cycle of quality monitoring, thus achieving the goal of monitoring the processing health of the testing machine within the corresponding cycle. Even if there are key products that are processed before the inspected batch, there is no need for redundant testing. Based on the "forward clearing" logic, the statistical cycles before the statistical cycle to which the randomly sampled inspected batch belongs are cleared to update the data in the information table. This ensures the sampling rate of the testing machine while avoiding redundant testing, thereby avoiding increasing the burden on the defect detection machine.
[0079] The detection control module is used to determine the detection strategy for the remaining product batches corresponding to the information table based on the target batch information's ranking within its current group and the category of subsequent batch information in the current group.
[0080] Specifically, the subsequent batch information is the batch information in the current group that is sorted after the target batch information, and the remaining product batches are the semiconductor product batches corresponding to the remaining batch information after deleting the preceding group from the information table.
[0081] In summary, the semiconductor process equipment inspection system of this application acquires an information table of the equipment to be inspected, which simultaneously records batch information of semiconductor products processed by the equipment. The batch information in the information table is sorted according to the processing order and grouped sequentially according to a statistical period. The batch information categories include mandatory and non-mandatory inspection; batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection item. Furthermore, each statistical period's grouping includes at least one batch information of the mandatory inspection category, ensuring that key products of the equipment to be inspected are marked and inspected in each statistical period, completing equipment quality monitoring throughout the data cycle. Simultaneously, if any semiconductor product batch corresponding to the information table... After random sampling is completed, the information clearing module removes the preceding group corresponding to the target batch information of the inspected product batch from the information table. That is, the statistical period before the target batch information is cleared to zero. The detection control module determines the detection strategy for the remaining product batches corresponding to the information table based on the ranking of the target batch information within its current group and the category of the subsequent batch information in the current group. Then, based on the "forward clearing" mechanism, the statistical period that has been implemented for quality supervision is removed, ensuring the sampling rate of the machine to be inspected and avoiding redundant detection. There is no need to increase the sampling quantity of random sampling to improve the sampling rate of the machine to be inspected, thus avoiding the increase in labor and machine costs.
[0082] Based on some or all of the above implementation methods, in some embodiments, the detection control module is specifically used to: if there is no batch information of the mandatory inspection category in the subsequent batch information, clear the current group, take the next batch information of the target batch information in the sorting as the start of the statistical period, and regroup from the start of the next batch information.
[0083] Understandably, the statistical period corresponding to the inspected product batch may not have ended yet, and the grouping of the statistical period has not ended. Newly shipped semiconductor product batches will continue to be added to the current group until the end of the current statistical period. If no key products are selected from the semiconductor product batches added after the inspected product batch in the current statistical period, that is, there are no batches of mandatory inspection categories after the target batch information in the current group, it indicates that no new mandatory inspection product batch has been added. There is no need to continue the key product screening in the current statistical period. All batch information ranked before the target batch information in the information table is cleared. A new round of statistical period is restarted, starting with the next semiconductor product batch of the inspected product batch in the current statistical period. The grouping starts with the batch information of the next semiconductor product batch. The next semiconductor product batch is adjacent to the inspected product batch in terms of processing order but later than the inspected product batch. Thus, by combining key product marking and random sampling strategies, if a product in the statistical information table of the machine to be inspected has completed sampling first, and no new key products have been added afterward, not only is "forward clearing" executed, but the starting point of the statistical period is also updated to start the next cycle of inspection. This ensures effective monitoring of the machines to be inspected and maintains the overall random sampling rate, while avoiding the problem of an increase in defect detection sites caused by too many key products. It balances the random sampling and key product marking strategies and improves the reliability and timeliness of monitoring the health of the machines.
[0084] For example, refer to Figure 3 In this embodiment, taking the statistical period as a preset quantity period as an example, the preset quantity of effective product batches is 4. Within each statistical period, one key product is selected, that is, batch information of a mandatory inspection category is selected. The data axis in the figure records semiconductor product batches (Lots) based on the processing sequence (i.e., the order in which the products are processed by the inspection machine). i The batch information is represented by red dots, indicating that the batch information category is not mandatory, while the batch information category is mandatory. The batch information recorded in the information table includes Lot1-Lot7. Group A of statistical period A includes Lot1-Lot4, and the current group B of statistical period B includes Lot5-Lot7. However, it does not yet include batch information of key products.
[0085] Assuming Lot7 is completed, Lot6 is randomly sampled as Lot. k Lots 1-5 were pre-transmitted to the testing station for sampling inspection, while Lot 4, which was mandatory for inspection and not sampled, had not yet arrived at the testing station. The batch information Lot 4 in the information table was then transferred to the testing station. k Clear the batch information and previous batch information, and use Lot as the header. kThe first batch of Lots then starts a new statistical cycle and continues counting. This means deleting all batch information from statistical cycle A and batch information from statistical cycle B, Lot5-Lot6 (resetting to zero), and starting the counting of statistical cycle C with Lot7 as the starting point of the next statistical cycle.
[0086] Based on some or all of the above implementation methods, in some embodiments, the detection control module is further specifically used for:
[0087] If there are batches of mandatory inspection categories in the subsequent batch information, and the target batch information is ranked in the first segment of the current group, retain the current group and inspect the semiconductor product batches of mandatory inspection categories in the current group;
[0088] If there are batches of mandatory categories in the subsequent batch information, and the target batch information is ranked in the latter part of the current group, then remove all batch information of the current group from the information table.
[0089] Specifically, if key products have been selected and their batch information categories marked as mandatory for inspection in the current statistical period, the system determines whether to retain the batch information of the current group based on the ranking of the target batch information within the group in the current statistical period. This allows for flexible adaptation of the testing strategy based on the ranking of the inspected product batches, selective testing of key products in the current period, balancing the sampling rate and the testing volume of key products, improving the timeliness of monitoring important equipment, and avoiding increased costs for testing sites.
[0090] Specifically, the "pre-segment interval" refers to the grouping interval corresponding to the pre-preset proportion of batch information in the statistical period, while the "post-segment interval" refers to the grouping interval after the pre-preset proportion in the statistical period. The pre-preset proportion can be, for example, 60% of the number of batch information in the statistical period. Understandably, this pre-preset proportion can be set based on actual needs and is not limited to the above example. If the target batch information's ranking within the group is in the pre-segment interval of the current group, such as in the top 60%, it indicates that the inspected product batch's delivery time was relatively early and insufficient to represent the overall quality of the current statistical period. By retaining the current group to maintain the batch information of the mandatory inspection category in the remaining batch information, the machine quality of the remaining segment in the current statistical period can be further monitored, avoiding missed inspections of machine problems. If the target batch information's ranking within the group is in the post-segment interval of the current group, it indicates that the inspected product batch's delivery time was relatively late and already represents the overall quality of the current statistical period. The batch information and mandatory inspection marks of the current group are deleted, and key product marking and random sampling are carried out starting from the next statistical period to reduce redundant inspections and avoid increased inspection costs.
[0091] For example, refer to Figure 4The statistical period is a preset quantity period, the preset ratio is 60%, the preset quantity of valid product batches is 4, the mandatory inspection batch information for statistical period A is Lot4, and the mandatory inspection batch information for statistical period B is Lot8. When Lot9 is completed at the machine to be inspected, Lot1 to Lot8 have not yet been transmitted to the inspection station for inspection. Then, in one case, if Lot6 is randomly sampled as Lot... k If Lot4 is pre-transmitted to the testing station for sampling inspection as a batch of sampled products, then statistical period A is deleted based on the forward-clearing mechanism, and the mandatory inspection mark of Lot4 is canceled; if Lot6 is determined to be in the 50% of the group within statistical period B, and is in the top 60% of the period, then the grouping of statistical period B is maintained, and the mandatory inspection mark of Lot8 is retained so that it can be tested accordingly when it passes through the testing station; in another case, if Lot7 is randomly sampled as Lot... k As a batch of products to be sampled, the samples were transmitted to the testing site in advance to complete the sampling inspection. It was determined that Lot7 ranked 75% within the group of statistical period B, which is not among the top 60% of the period. Therefore, not only was the batch information of statistical period A cleared and the mandatory inspection mark of Lot4 canceled, but also statistical period B was deleted and the mandatory inspection mark of Lot8 was canceled. A new round of random sampling and key product marking began from statistical period C.
[0092] Based on some or all of the above embodiments, in other embodiments, the detection control module is further specifically used for:
[0093] If there are batches of mandatory inspection categories in the subsequent batch information, the ranking percentage of the target batch information in the target segment is determined based on the ranking of the target batch information within the group and the ranking of the mandatory inspection category batch information within the group.
[0094] If the ranking percentage does not exceed the preset ratio, the current group will be retained and the semiconductor product batches of the mandatory inspection category in the current group will be inspected;
[0095] If the ranking percentage exceeds the preset percentage, remove all batches of information for the current group from the information table.
[0096] Specifically, the target segment refers to the segment starting from the first batch of information in the current group and ending with the batch information of the mandatory inspection category. The ranking proportion refers to the proportion of the target batch information's ranking within the target segment relative to the overall ranking of the target segment; that is, the proportion of the total number of preceding batch information within the target segment to the total number of batch information in the target segment. Thus, using the batch information of the mandatory inspection category among the remaining batch information in the current group as nodes, it is determined whether the ranking proportion of the target batch information exceeds a preset ratio, thereby selectively inspecting key products in the current cycle, ensuring the comprehensiveness of monitoring in the current cycle and avoiding over-inspection.
[0097] Specifically, if the ranking percentage of the target batch information is within the preset ratio, it indicates that the inspected product batch is too far from the mandatory key products for the current statistical period and is insufficient to represent the overall quality of the current statistical period. Retaining the batch information and mandatory inspection mark of the current group can improve the reliability of machine quality monitoring. If the ranking percentage of the target batch information is outside the preset ratio, it indicates that the inspected product batch is close to the mandatory key products for the current statistical period and has already represented the overall quality of the current statistical period. Deleting the batch information and mandatory inspection mark of the current group and starting from the next statistical period, key product marking and random sampling will be carried out to reduce redundant testing and avoid increasing testing costs.
[0098] For example, refer to Figure 5 The statistical period is a preset quantity period, the preset quantity is 5, the preset ratio is 60%, the preset quantity of valid product batches is 4, the mandatory inspection batch information for statistical period A is Lot4, and the mandatory inspection batch information for statistical period B is Lot9. When Lot9 is completed at the machine to be inspected, Lot1 to Lot8 have not yet been transmitted to the inspection station for inspection; then, in one case, if Lot7 is randomly sampled as Lot... k If a product batch is pre-transmitted to the testing station for sampling inspection, then statistical period A is deleted based on the forward clearing mechanism, and the mandatory inspection mark for Lot4 is canceled. The target segment is [Lot6, Lot9]. If Lot7's ranking percentage in the target segment is determined to be 50%, placing it within the top 60% of the target segment, then the grouping of statistical period B is maintained, and the mandatory inspection mark for Lot9 is retained for corresponding testing when it passes through the testing station. Alternatively, if Lot8 is randomly sampled as Lot... k The batch of products to be sampled is transmitted to the testing station in advance for sampling inspection. If Lot8 is found to have a 75% ranking in the target area and does not belong to the top 60% of the target area, then not only is the batch information of statistical period A cleared and the mandatory inspection mark of Lot4 canceled, but also statistical period B is deleted and the mandatory inspection mark of Lot9 is canceled. A new round of random sampling and key product marking will begin from statistical period C.
[0099] Based on some or all of the above implementation methods, in some embodiments, the system further includes an interval duration detection module and an information category determination module: the interval duration detection module is used to obtain the remaining transmission duration of the semiconductor product batch; the information category determination module is used to determine the category of the batch information as non-mandatory inspection if the remaining transmission duration does not exceed a preset duration and / or the semiconductor product batch is a non-inspection product.
[0100] Specifically, the remaining transfer time indicates the remaining consumable time before a semiconductor product batch is transferred to the next process node. Understandably, due to process characteristics, there is a time interval between two adjacent processing nodes. A semiconductor product batch must be transferred from the previous processing node to the next adjacent node within this limited interval; otherwise, product defects will occur. Therefore, when selecting key products and marking batch information as mandatory inspection categories, semiconductor product batches with longer remaining transfer times are prioritized, while batches with remaining transfer times lower than the preset time are avoided to prevent processing timeouts during product inspection, thereby reducing the product defect rate. Furthermore, due to various reasons, some semiconductor product batches may not require defect inspection; accordingly, these will not be selected as key products, and their batch information category will be marked as non-mandatory inspection.
[0101] Specifically, the preset duration can be set based on actual testing needs, such as based on the set interval time, the defect detection duration at the testing site, and the estimated transmission duration. No specific numerical limit is set here.
[0102] In some cases, if the current statistical period reaches the preset time period or the number of product batches passing through the inspection station reaches the preset number, but the remaining transmission time of each semiconductor product batch in the current statistical period is less than the preset time, then it is preferable to select the next semiconductor product batch for remaining transmission time evaluation. If it exceeds the preset time, the batch information is marked as mandatory inspection, and the batch information is used as the last element in the current group; if it does not exceed the preset time, the next semiconductor product batch is evaluated, and so on, until the key product is identified, and the batch information of the key product is used as the last element in the current statistical period group.
[0103] In some embodiments, the information category determination module is also used to obtain batch attribute data for each semiconductor product batch if the remaining transmission time of multiple semiconductor product batches in the statistical period exceeds a preset time and they are inspectable products; and to determine the semiconductor product batches whose batch information category is mandatory for inspection from each semiconductor product batch based on the batch attribute data.
[0104] Understandably, multiple inspectable semiconductor product batches may meet the time requirements within the same statistical period, and their number may exceed the rated number N of key products to be screened in each statistical period. Therefore, the inspection priority of each semiconductor product batch is determined based on the batch attribute data, and the Top N semiconductor product batches with higher inspection priority are selected as key products and marked as mandatory inspection categories. This makes the inspected product batches more representative in terms of quality and further improves the reliability of the inspection equipment. N is a positive integer greater than or equal to 1, preferably 1.
[0105] In some implementations, batch attribute data includes at least one of the following: batch size of semiconductor product batch, station distance, estimated transmission time, and pre-stored detection program information. Specifically, the same semiconductor product batch may pass through multiple inspection stations and correspond to more than one inspection station's statistical period, i.e., it is recorded in the information tables of different inspection stations. The batch size indicates the number of information tables to which the batch information of the semiconductor product batch belongs; each information table corresponds to one inspection station, indicating how many inspection station information tables the batch information of the semiconductor product batch is currently recorded in. The station distance indicates the transmission distance between the current location of the semiconductor product batch and the inspection station. The estimated transmission time indicates the time required for the semiconductor product batch to be transported from its current location to the inspection station. The pre-stored detection program information indicates whether the inspection station has a pre-stored detection program for the semiconductor product batch, which instructs the inspection station on defect detection operations for the semiconductor product batch.
[0106] Accordingly, the higher the group size, the shorter the distance between stations, the shorter the estimated transmission time, or the more the pre-stored information in the detection program indicates that it is pre-stored, the higher the inspection priority of the semiconductor product batch, and the higher the probability that the batch information category is mandatory inspection. Conversely, the lower the inspection priority of the semiconductor product batch, the higher the probability that the batch information category is non-mandatory inspection. In this way, priority is given to product batches that have already established programs at the defect detection station, are closer to the matching detection station, have shorter transmission time to the detection station, and correspond to multiple statistical periods, balancing the reliability and amount of information in the selection of key products and improving the quality of machine monitoring.
[0107] In summary, compared with existing technologies, the detection system of this application only requires the selection of key products for the machine to be inspected and normal random sampling. It can automatically monitor the health of the machine to be inspected without changing the random sampling rate. Moreover, after random sampling, it avoids redundant testing of key products in each statistical period, avoids increasing the number of defect detection machines and manpower, can significantly save costs, and does not affect the overall detection rate, ensuring the timeliness of anomaly investigation.
[0108] This application also provides a detection method for semiconductor process equipment, such as... Figure 6 As shown, Figure 6 This document illustrates a flowchart of a testing method for semiconductor process equipment according to an embodiment of this application. While this specification provides the method operation steps as shown in the embodiments or flowcharts, more or fewer operation steps may be included based on conventional or non-inventive labor. The order of steps listed in the embodiments is merely one possible execution order among many and does not represent the only possible execution order. In actual system or server product execution, the method can be executed sequentially according to the embodiments or accompanying drawings, or in parallel (e.g., in a parallel processor or multi-threaded processing environment). Specifically, as... Figure 2As shown, the method may include the following steps S201-S205:
[0109] S201: Obtain the information table of the machine to be inspected. The information table is used to synchronously record the batch information of semiconductor products processed by the machine to be inspected. The batch information of each batch is sorted according to the processing order and grouped sequentially according to the statistical period. The batch information categories include mandatory inspection and non-mandatory inspection. The batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection product. Each statistical period grouping includes at least one batch information of the mandatory inspection category.
[0110] S203: If any semiconductor product batch corresponding to the information table has completed random sampling inspection, remove the preceding group corresponding to the target batch information of the inspected product batch from the information table;
[0111] S205: Based on the ranking of the target batch information within its current group and the category of subsequent batch information in the current group, determine the detection strategy for the remaining product batches corresponding to the information table. The subsequent batch information is the batch information in the current group that is ranked after the target batch information.
[0112] In some embodiments, S205 may include S301: if there are batch information of a mandatory inspection category in the subsequent batch information, and the ranking of the target batch information within the group is located in the first segment of the current group, retain the current group and inspect the semiconductor product batch of the mandatory inspection category in the current group.
[0113] In some embodiments, S205 may also include S302: if there are batch information of a mandatory category in the subsequent batch information, and the ranking of the target batch information within the group is in the later interval of the current group, clear each batch information of the current group from the information table.
[0114] In some embodiments, S205 may further include:
[0115] S401: If there are batch information of the mandatory inspection category in the subsequent batch information, determine the ranking ratio of the target batch information in the target segment based on the group ranking of the target batch information and the group ranking of the mandatory inspection category batch information. The target segment refers to the segment from the first batch information of the current group to the batch information of the mandatory inspection category.
[0116] S402: If the ranking ratio does not exceed the preset ratio, retain the current group and test the semiconductor product batches of the mandatory inspection category in the current group.
[0117] In some embodiments, S205 may also include S403: if the ranking ratio exceeds a preset ratio, clear the information of each batch of the current group from the information table.
[0118] In some embodiments, S205 may also include S501: if there is no batch information of the mandatory category in the subsequent batch information, clear the current group, take the next batch of information in the sorting of the target batch information as the start of the statistical period, and regroup from the start of the next batch of information.
[0119] In some embodiments, the method for determining the category of batch information includes S601-S603:
[0120] S601: Obtain the remaining transmission time of the semiconductor product batch. The remaining transmission time is used to indicate the remaining consumable time before the semiconductor product batch is transmitted to the next process node.
[0121] S603: If the remaining transmission time does not exceed the preset time and / or the semiconductor product batch is a non-inspection item, determine the category of the batch information as non-mandatory inspection.
[0122] In some embodiments, the method for determining the category of batch information further includes S605-S607:
[0123] S605: If the remaining transmission time of multiple semiconductor product batches in the statistical period exceeds the preset time and they are inspectable products, obtain the batch attribute data of each semiconductor product batch.
[0124] S607: Based on batch attribute data, determine the semiconductor product batches whose batch information category is mandatory for inspection from each semiconductor product batch.
[0125] In some embodiments, the batch attribute data includes at least one of the following: the number of semiconductor product batches, the station distance, the estimated transmission time, and the pre-stored detection program information. The number of batches is used to indicate the number of information tables to which the batch information of the semiconductor product batch belongs, with each information table corresponding to a machine to be inspected. The station distance is used to indicate the transmission distance between the current location of the semiconductor product batch and the inspection station. The estimated transmission time is used to indicate the time required for the semiconductor product batch to be transported from the current location to the inspection station. The pre-stored detection program information is used to indicate whether the inspection station has a pre-stored detection program for the semiconductor product batch.
[0126] The higher the number of packets, the shorter the distance between stations, the shorter the estimated transmission time, or the higher the probability that the batch information category is mandatory for inspection, the higher the probability that the information is pre-stored.
[0127] It should be noted that the above system embodiments and method embodiments are based on the same implementation methods.
[0128] This application provides a testing device for semiconductor process equipment. The device can be a terminal or a server, including a processor and a memory. The memory stores at least one instruction or at least one program. The at least one instruction or at least one program is loaded and executed by the processor to implement the testing method for semiconductor process equipment provided in the above method embodiments.
[0129] Memory is used to store software programs and modules. The processor executes these stored software programs and modules to perform various functional applications and for testing on semiconductor process equipment. Memory can primarily consist of a program storage area and a data storage area. The program storage area stores the operating system, application programs required for functions, etc.; the data storage area stores data created based on device usage, etc. Furthermore, memory can include high-speed random access memory (RAM) and non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, memory can also include a memory controller to provide the processor with access to the memory.
[0130] The methods and embodiments provided in this application can be executed in electronic devices such as mobile terminals, computer terminals, servers, or similar computing devices. Figure 7 This is a hardware structure block diagram of an electronic device for a testing method of a semiconductor process equipment, as provided in an embodiment of this application. Figure 7 As shown, the electronic device 900 can vary significantly due to different configurations or performance. It may include one or more Central Processing Units (CPUs) 910 (CPUs 910 may include, but are not limited to, microprocessors such as MCUs or programmable logic devices such as FPGAs), a memory 930 for storing data, and one or more storage media 920 (e.g., one or more mass storage devices) for storing application programs 923 or data 922. The memory 930 and storage media 920 may be temporary or persistent storage. The program stored in the storage media 920 may include one or more modules, each module including a series of instruction operations on the electronic device. Furthermore, the CPU 910 may be configured to communicate with the storage media 920 and execute a series of instruction operations in the storage media 920 on the electronic device 900. The electronic device 900 may also include one or more power supplies 960, one or more wired or wireless network interfaces 950, one or more input / output interfaces 940, and / or one or more operating systems 921, such as Windows Server. TM Mac OS X TM Unix TM Linux™, FreeBSD™, etc.
[0131] The input / output interface 940 can be used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by the communication provider of the electronic device 900. In one example, the input / output interface 940 includes a network interface controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the input / output interface 940 may be a radio frequency (RF) module for wireless communication with the Internet.
[0132] Those skilled in the art will understand that Figure 7 The structure shown is for illustrative purposes only and does not limit the structure of the electronic device described above. For example, the electronic device 900 may also include... Figure 7 The more or fewer components shown, or having the same Figure 7 The different configurations shown.
[0133] Embodiments of this application also provide a computer-readable storage medium, which can be disposed in an electronic device to store at least one instruction or at least one program related to implementing a detection method for a semiconductor process equipment in the method embodiments. The at least one instruction or the at least one program is loaded and executed by the processor to implement the detection method for a semiconductor process equipment provided in the above method embodiments.
[0134] Optionally, in this embodiment, the storage medium may be located at at least one of the multiple network servers in a computer network. Optionally, in this embodiment, the storage medium may include, but is not limited to, various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.
[0135] According to one aspect of this application, a computer program product or computer program is provided, comprising computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the methods provided in the various alternative implementations described above.
[0136] As can be seen from the embodiments of the semiconductor process equipment inspection system, apparatus, equipment, server, terminal, storage medium, and program product provided in this application, the semiconductor process equipment inspection system of this application acquires an information table of the equipment to be inspected, and synchronously records batch information of semiconductor product batches processed by the equipment to be inspected. The batch information in the information table is sorted according to the processing order and grouped sequentially according to the statistical period. The batch information categories include mandatory inspection and non-mandatory inspection. The batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection item, and the grouping of each statistical period includes batch information of at least one mandatory inspection category, so as to ensure that the key products of the equipment to be inspected are marked and inspected in each statistical period, and the data cycle is completed. Machine quality monitoring; simultaneously, if any semiconductor product batch corresponding to the information table completes random sampling inspection, the preceding group corresponding to the target batch information of the inspected product batch is cleared from the information table, and the detection control module determines the detection strategy for the remaining product batches corresponding to the information table based on the ranking of the target batch information within its current group and the category of the subsequent batch information in the current group. The subsequent batch information is the batch information in the current group that is ranked after the target batch information. Then, based on the "forward clearing" mechanism, the statistical period that has been implemented for quality supervision is removed, ensuring the sampling rate of the machine to be inspected and avoiding redundant detection. There is no need to increase the sampling quantity of random sampling to improve the sampling rate of the machine to be inspected, thus avoiding the increase in manpower and machine costs.
[0137] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, the above description focuses on specific embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in a different order than that shown in the embodiments and still achieve the desired results. Additionally, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired results. In some implementations, multitasking and parallel processing are also possible or may be advantageous.
[0138] The various embodiments in this application are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device, equipment, and storage medium embodiments are basically similar to the method embodiments, so the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.
[0139] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware, or by a program instructing the relevant hardware to implement them. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.
[0140] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A testing system for semiconductor process equipment, characterized in that, The system includes: The information acquisition module is used to acquire the information table of the machine to be inspected. The information table is used to synchronously record the batch information of semiconductor products processed by the machine to be inspected. The batch information of the information table is sorted according to the processing order and grouped sequentially according to the statistical period. The batch information includes mandatory inspection and non-mandatory inspection. The batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection product. Each statistical period grouping includes at least one batch information of the mandatory inspection category. The information clearing module is used to clear the preceding group corresponding to the target batch information of the inspected product batch from the information table if any semiconductor product batch corresponding to the information table has completed random sampling inspection. The detection control module is used to determine the detection strategy for the remaining product batches corresponding to the information table based on the ranking of the target batch information within the current group and the category of the subsequent batch information in the current group. The subsequent batch information refers to the batch information in the current group that is ranked after the target batch information.
2. The system according to claim 1, characterized in that, The detection and control module is specifically used for: If there are batches of mandatory inspection categories in the subsequent batch information, and the target batch information is ranked in the first segment of the current group, the current group is retained and the semiconductor product batches of mandatory inspection categories in the current group are inspected.
3. The system according to claim 2, characterized in that, The detection and control module is also specifically used for: If there are batches of mandatory categories in the subsequent batch information, and the target batch information is ranked in the latter part of the current group, then each batch of information in the current group is cleared from the information table.
4. The system according to claim 1, characterized in that, The detection and control module is specifically used for: If there are batches of mandatory inspection category in the subsequent batch information, the ranking ratio of the target batch information in the target segment is determined based on the group ranking of the target batch information and the group ranking of the batch information of mandatory inspection category. The target segment refers to the segment from the first batch information of the current group to the batch information of mandatory inspection category. If the ranking ratio does not exceed the preset ratio, the current group is retained and the semiconductor product batches of the mandatory inspection category in the current group are inspected.
5. The system according to claim 4, characterized in that, The detection and control module is also specifically used for: If the ranking ratio exceeds the preset ratio, the information of each batch of the current group is cleared from the information table.
6. The system according to claim 2, characterized in that, The detection and control module is specifically used for: If there is no batch information of the mandatory category in the subsequent batch information, the current grouping is cleared, and the next batch of information in the sorting of the target batch information is taken as the start of the statistical period, and the grouping is re-started from the next batch of information.
7. The system according to any one of claims 1-6, characterized in that, The system also includes: An interval duration detection module is used to obtain the remaining transmission time of the semiconductor product batch, and the remaining transmission time is used to indicate the remaining consumable time before the semiconductor product batch is transmitted to the next process node. The information category determination module is used to determine the category of the batch information as non-mandatory inspection if the remaining transmission time does not exceed a preset time and / or the semiconductor product batch is a non-inspection product.
8. The system according to claim 7, characterized in that, The information category determination module is also used for: If the remaining transmission time of multiple semiconductor product batches in the statistical period exceeds the preset time and they are inspectable products, obtain the batch attribute data of each semiconductor product batch. Based on the batch attribute data, determine the semiconductor product batches whose batch information category is mandatory for inspection from each of the semiconductor product batches.
9. The system according to claim 8, characterized in that, The batch attribute data includes at least one of the following: the number of groups in the semiconductor product batch, the station distance, the estimated transmission time, and the pre-stored detection program information. The number of groups is used to indicate the number of information tables to which the batch information of the semiconductor product batch belongs. Each group corresponds to a machine to be inspected. The station distance is used to indicate the transmission distance between the current location of the semiconductor product batch and the inspection station. The estimated transmission time is used to indicate the time required for the semiconductor product batch to be transported from its current location to the inspection station. The pre-stored detection program information is used to indicate whether the inspection station has a pre-stored detection program for the semiconductor product batch. The higher the number of packets, the shorter the distance between stations, the shorter the estimated transmission time, or the higher the probability that the batch information category is mandatory for inspection, the higher the probability that the detection program's pre-stored information indicates that it has been pre-stored.
10. A method for inspecting semiconductor process equipment, applied to an inspection system for semiconductor process equipment, characterized in that, The method includes: An information table of the machine to be inspected is obtained. The information table is used to synchronously record the batch information of semiconductor products processed by the machine to be inspected. The batch information of the information table is sorted according to the processing order and grouped sequentially according to the statistical period. The category of the batch information includes mandatory inspection and non-mandatory inspection. The batch information of the mandatory inspection category indicates that the semiconductor product batch is a mandatory inspection product. Each statistical period grouping includes at least one batch information of the mandatory inspection category. If any semiconductor product batch corresponding to the information table completes random sampling inspection, the preceding group corresponding to the target batch information of the inspected product batch is removed from the information table. Based on the ranking of the target batch information within its current group and the category of subsequent batch information in the current group, the detection strategy for the remaining product batches corresponding to the information table is determined, wherein the subsequent batch information is the batch information in the current group that is ranked after the target batch information.
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