A method, device and system for manufacturing a display screen

Abstract

The embodiments of the present application provide a method, device and system for manufacturing a display screen, and relate to the technical field of display screen manufacturing. The method includes: obtaining point measurement information of multiple display chips, the point measurement information includes: at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; generating a bonding strategy based on the point measurement information of the multiple display chips, the bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first bonding point and the second bonding point of the display substrate respectively; the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in the adjacent bonding point row, respectively. The embodiments of the present application are used for display screen manufacturing.

Description

Technical Field

[0001] The present application relates to the technical field of display screen manufacturing, and in particular to a method, device and system for manufacturing a display screen. Background Art

[0002] The LED display is a display that uses a display chip array as display pixels to display images. By precisely controlling the luminous intensity, color and timing of each display chip in the display chip array, colorful, clear and realistic images can be constructed on the screen.

[0003] During the wafer production process, display chips produced at different positions have certain characteristic differences. When these chips are directly transferred to the display substrate according to the position law in the wafer, due to the inherent brightness and color differences between the chips, the human eye can easily perceive this inconsistency, which seriously affects the overall display effect of the display screen. In order to effectively overcome the negative impact of the difference in chips at different positions in the wafer on the display effect of the display screen, the chip sorting link and the chip mixing link are introduced in the production process of the display screen. In the chip sorting link, the display chips will first be sorted into different bin categories (light band characteristic classification) according to a certain method. The characteristic differences of chips in the same bin category are within a certain range. In the chip mixing link, the positions of the display chips in the same bin category will be disordered to avoid transferring the display chips to the display substrate according to the position law of the display chips in the wafer. However, both the chip sorting link and the chip mixing link will introduce certain equipment and time costs, which increases the overall production cost of the display screen. Summary of the invention

[0004] In view of this, embodiments of the present application provide a method, device, and system for manufacturing a display screen, which are used to reduce the production cost of the display screen.

[0005] In order to achieve the above purpose, the embodiments of the present application provide the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a method for manufacturing a display screen, comprising:

[0007] Acquire point measurement information of a plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0008] A die bonding strategy is generated according to the point measurement information of the multiple display chips, and the die bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in adjacent die bonding point rows, respectively.

[0009] As an optional implementation of the embodiment of the present application, the multiple display chips correspond one-to-one to the die-bonding points on the display substrate.

[0010] As an optional implementation of the embodiment of the present application, the die bonding strategy is used to transfer the multiple display chips to the display substrate so that the difference in display characteristics between any two areas of preset sizes on the display substrate is less than a threshold difference.

[0011] As an optional implementation of the embodiment of the present application, after generating the die bonding strategy according to the point measurement information of the plurality of display chips, the method further includes:

[0012] The first display chip and the second display chip are transferred to the first die-bonding position and the second die-bonding position respectively according to the die-bonding strategy.

[0013] As an optional implementation of the embodiment of the present application, the step of generating a die bonding strategy according to the point measurement information of the plurality of display chips includes:

[0014] Classifying the plurality of display chips according to the point measurement information to obtain classification results of the plurality of display chips; in the classification results, a characteristic difference between the point measurement information of any two display chips in the same category is less than a first threshold;

[0015] The die bonding strategy is generated according to the classification result.

[0016] As an optional implementation of the embodiment of the present application, generating the die bonding strategy according to the classification result includes:

[0017] Acquire a characteristic characterization value of each display chip in the plurality of display chips according to the classification result, wherein the characteristic characterization value of the display chip is point measurement information of a cluster center of a classification to which the display chip belongs, and the cluster center of the classification is a display chip whose point measurement information has the smallest sum of characteristic differences with point measurement information of other display chips in the classification;

[0018] The die bonding strategy is generated according to the characteristic characterization value of each display chip among the plurality of display chips.

[0019] As an optional implementation of the embodiment of the present application, generating the die bonding strategy according to the characteristic characterization value of each display chip among the plurality of display chips includes:

[0020] Arrange the plurality of display chips on a virtual substrate corresponding to the display substrate according to a characteristic characterization value of each of the plurality of display chips, wherein a difference between the characterization values ​​of any two regions of a preset size on the virtual substrate is less than a second threshold;

[0021] According to the arrangement of the display chips on the virtual substrate, acquiring a mapping relationship between each of the plurality of display chips and a die-bonding point on the display substrate;

[0022] The die-bonding strategy is generated according to a mapping relationship between each display chip in the plurality of display chips and a die-bonding point on the display substrate.

[0023] As an optional implementation of the embodiment of the present application, the step of generating a die bonding strategy according to the point measurement information of the plurality of display chips includes:

[0024] Respectively converting the point measurement information of the plurality of display chips into color values ​​in a perceptually uniform color space to obtain color values ​​corresponding to the plurality of display chips;

[0025] The die bonding strategy is generated according to the color values ​​corresponding to the plurality of display chips.

[0026] As an optional implementation of the embodiment of the present application, a plurality of lamp beads are arranged on the display chip; the colors of the plurality of lamp beads are different or the plurality of lamp beads include at least two lamp beads of the same color.

[0027] In a second aspect, the present application provides a method for manufacturing a display screen, comprising:

[0028] receiving a die bonding strategy, wherein the die bonding strategy is generated according to point measurement information of a plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0029] According to the die-bonding strategy, the first display chip and the second display chip which are transferred in adjacent order are transferred to the first die-bonding point and the second die-bonding point of the display substrate respectively;

[0030] Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

[0031] In a third aspect, the present application provides a method for manufacturing a display screen, comprising:

[0032] Perform lighting tests on the multiple display chips respectively to obtain point measurement information of the multiple display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0033] Generate a die-bonding strategy according to the point measurement information of the plurality of display chips, the die-bonding strategy being used to transfer the first display chip and the second display chip that are transferred in adjacent order to the first die-bonding point and the second die-bonding point of the display substrate respectively; the first die-bonding point and the second die-bonding point are not adjacent die-bonding points in spatial position, and the first die-bonding point and the second die-bonding point are not the last die-bonding point of the previous die-bonding point row and the first die-bonding point of the next die-bonding point row in adjacent die-bonding point rows respectively;

[0034] The first display chip and the second display chip are transferred to the first die-bonding point and the second die-bonding point respectively according to the die-bonding strategy.

[0035] In a fourth aspect, the present application provides a manufacturing device for a display screen, comprising:

[0036] an acquisition unit, configured to perform lighting tests on a plurality of display chips respectively to acquire point measurement information of the plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0037] A generating unit is used to generate a die-bonding strategy according to the point measurement information of the plurality of display chips, wherein the die-bonding strategy is used to transfer a first display chip and a second display chip that are transferred in an adjacent order to a first die-bonding point and a second die-bonding point of the display substrate, respectively; the first die-bonding point and the second die-bonding point are not adjacent die-bonding points in spatial position, and the first die-bonding point and the second die-bonding point are not respectively the last die-bonding point of a previous die-bonding point row and the first die-bonding point of a subsequent die-bonding point row in adjacent die-bonding point rows.

[0038] As an optional implementation of the embodiment of the present application, the multiple display chips correspond one-to-one to the die-bonding points on the display substrate.

[0039] As an optional implementation of the embodiment of the present application, the die bonding strategy is used to transfer the multiple display chips to the display substrate so that the difference in display characteristics between any two areas of preset sizes on the display substrate is less than a threshold difference.

[0040] As an optional implementation of the embodiment of the present application, the device further includes:

[0041] A transfer unit is used to transfer the first display chip and the second display chip to the first die-bonding point and the second die-bonding point respectively according to the die-bonding strategy after generating the die-bonding strategy according to the point-measurement information of the plurality of display chips.

[0042] As an optional implementation of the embodiment of the present application, the generating unit is specifically used to classify the multiple display chips according to the point measurement information to obtain the classification results of the multiple display chips, and generate the die bonding strategy according to the classification results;

[0043] Wherein, in the classification result, the characteristic difference of the point measurement information of any two display chips in the same category is less than a first threshold.

[0044] As an optional implementation of the embodiment of the present application, the generating unit is specifically used to obtain a characteristic characterization value of each of the multiple display chips according to the classification result, and generate the die bonding strategy according to the characteristic characterization value of each of the multiple display chips;

[0045] The characteristic characterization value of the display chip is the point measurement information of the cluster center of the category to which the display chip belongs, and the cluster center of the category is the display chip whose point measurement information has the smallest sum of characteristic differences with point measurement information of other display chips in the category.

[0046] As an optional implementation of the embodiment of the present application, the generating unit is specifically used to arrange the multiple display chips on a virtual substrate corresponding to the display substrate according to the characteristic characterization value of each display chip in the multiple display chips, obtain a mapping relationship between each display chip in the multiple display chips and a die bonding point on the display substrate according to the arrangement of the display chips on the virtual substrate, and generate the die bonding strategy according to the mapping relationship between each display chip in the multiple display chips and a die bonding point on the display substrate;

[0047] Wherein, a difference between the characterization values ​​of any two regions of preset sizes on the virtual substrate is less than a second threshold.

[0048] As an optional implementation of the embodiment of the present application, the generating unit is specifically used to convert the point measurement information of the multiple display chips into color values ​​in a perceived uniform color space respectively to obtain color values ​​corresponding to the multiple display chips; and generate the die bonding strategy according to the color values ​​corresponding to the multiple display chips.

[0049] As an optional implementation of the embodiment of the present application, a plurality of lamp beads are arranged on the display chip; the colors of the plurality of lamp beads are different or the plurality of lamp beads include at least two lamp beads of the same color.

[0050] In a fifth aspect, an embodiment of the present application provides a die bonding device, including: a machine platform, a loading component installed on the machine platform, a die bonding table, a communication component, a controller, and a transport component;

[0051] The loading assembly is used to carry the display chip;

[0052] The crystal bonding table is used to carry the display substrate;

[0053] The communication component is used to receive point measurement information of multiple display chips, and the point measurement information includes: at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0054] The controller is used to generate a die bonding strategy according to the point measurement information of the plurality of display chips;

[0055] The transport component is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die-bonding point and the second die-bonding point of the display substrate respectively according to the die-bonding strategy;

[0056] Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

[0057] In a sixth aspect, an embodiment of the present application provides a die bonding device, including: a machine platform, a loading component installed on the machine platform, a die bonding table, a communication component, and a transport component;

[0058] The loading assembly is used to carry the display chip;

[0059] The crystal bonding table is used to carry the display substrate;

[0060] The communication component is used to receive a die bonding strategy, wherein the die bonding strategy is generated according to point measurement information of a plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0061] The transport component is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die-bonding point and the second die-bonding point of the display substrate respectively according to the die-bonding strategy;

[0062] Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

[0063] In a seventh aspect, an embodiment of the present application provides a display screen manufacturing system, including: a point measurement device, a computing device, and a die bonding device;

[0064] The point test device performs lighting tests on the multiple display chips respectively to obtain point test information of the multiple display chips, wherein the point test information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0065] The computing device is used to receive the spot measurement information of the display chip sent by the spot measurement device, and generate a die bonding strategy according to the spot measurement information of the plurality of display chips, wherein the die bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in adjacent die bonding point rows respectively;

[0066] The die-bonding device is used to receive the die-bonding strategy sent by the computing device, and to transfer the first display chip and the second display chip to the first die-bonding position and the second die-bonding position respectively according to the die-bonding strategy.

[0067] In an eighth aspect, an embodiment of the present application provides a display screen manufacturing system, including: a point measurement device and a die bonding device;

[0068] The point test device is used to perform lighting tests on multiple display chips respectively to obtain point test information of the multiple display chips, wherein the point test information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0069] The die bonding device is used to receive the spot measurement information of the multiple display chips sent by the spot measurement device, generate a die bonding strategy according to the spot measurement information of the multiple display chips, and transfer the first display chip and the second display chip to the first die bonding point and the second die bonding point respectively according to the die bonding strategy;

[0070] Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

[0071] In a ninth aspect, an embodiment of the present application provides an electronic device, comprising: a memory and a processor, wherein the memory is used to store a computer program, and the processor is used to enable the electronic device to implement any of the above-mentioned methods for manufacturing a display screen when executing the computer program.

[0072] In the tenth aspect, an embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a computing device, the computing device implements any one of the above-mentioned methods for manufacturing a display screen.

[0073] In an eleventh aspect, an embodiment of the present application provides a computer program product, which, when executed on a computer, enables the computer to implement any one of the above-described methods for manufacturing a display screen.

[0074] The manufacturing method of the display screen provided in the embodiment of the present application first obtains the point measurement information of multiple display chips, and then generates a die bonding strategy based on the point measurement information of the multiple display chips. Since the manufacturing method of the display screen provided in the embodiment of the present application can generate a die bonding strategy including the die bonding points corresponding to the multiple display chips based on the point measurement information of the multiple display chips, and the die bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not respectively the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in the adjacent die bonding point row, so there is no need to implement the sorting link and the mixing link, and the embodiment of the present application can avoid transferring the display chip to the display substrate according to the position law of the display chip in the wafer, so the embodiment of the present application can save the equipment and time costs introduced in the chip sorting link and the chip mixing link, thereby reducing the production cost of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0076] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0077] Figure 1 A schematic diagram of a display screen manufacturing system provided in an embodiment of the present application;

[0078] Figure 2 A schematic diagram of another display screen manufacturing system provided in an embodiment of the present application;

[0079] Figure 3 One of the step flow charts of the method for manufacturing a display screen provided in an embodiment of the present application;

[0080] Figure 4 One of the schematic diagrams of the position relationship of the die-bonding points provided in the embodiment of the present application;

[0081] Figure 5 The second schematic diagram of the position relationship of the die-bonding points provided in the embodiment of the present application;

[0082] Figure 6 A schematic diagram of an area of ​​a preset size on a display substrate provided in an embodiment of the present application;

[0083] Figure 7 A schematic diagram of an area of ​​a preset size on a virtual substrate provided in an embodiment of the present application;

[0084] Figure 8 A second flowchart of the method for manufacturing a display screen provided in an embodiment of the present application;

[0085] Fig. 9 One of the structural schematic diagrams of the manufacturing device of the display screen provided in the embodiment of the present application;

[0086] Fig.10 The second structural schematic diagram of the manufacturing device of the display screen provided in the embodiment of the present application;

[0087] Fig.11 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0088] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the scheme of the present application will be further described below. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0089] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein. Obviously, the embodiments in the specification are only part of the embodiments of the present application, rather than all of the embodiments.

[0090] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way. In addition, in the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more.

[0091] The following first describes a manufacturing system for a display screen provided in an embodiment of the present application.

[0092] Reference Figure 1 As shown, in some embodiments, the manufacturing system of the display screen includes: a point measuring device 11, a computing device 12 and a solid crystal device 13. A data transmission link can be established between the computing device 12 and the point measuring device 11 and the solid crystal device 13, and data can be received and sent through the data transmission link. The data transmission link between the computing device 12 and the point measuring device 11 and the solid crystal device 13 can be established based on a wired connection or a wireless connection. The data link between the computing device 12 and the point measuring device 11 and the solid crystal device 13 can be connected simultaneously or when in use. The embodiments of the present application do not limit this, and data transmission can be performed between the computing device 12 and the point measuring device 11 and the solid crystal device 13 after the data transmission link is established.

[0093] The point measurement device 11 is used to perform a lighting test on the display chip to obtain point measurement information of multiple display chips, and send the obtained point measurement information of multiple display chips to the computing device 12 through a data transmission link between the computing device 12. The point measurement information may include at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information.

[0094] The computing device 12 is used to receive the point measurement information of multiple display chips sent by the point measurement device 11 through a data transmission link between the computing device 12 and the point measurement device 11, and generate a die bonding strategy based on the point measurement information of the multiple display chips. The die bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in adjacent die bonding point rows, respectively. The computing device 12 can be a computer, a server, a cloud server, a mobile terminal (such as a mobile phone, a mobile tablet) and other devices with computing capabilities, and the embodiments of the present application do not limit this.

[0095] The die bonding device 13 is used to receive the die bonding strategy sent by the computing device 12 through a data transmission link between the computing device 12, and transfer the first display chip and the second display chip to the first die bonding point and the second die bonding point respectively according to the die bonding strategy. In some embodiments, the die bonding device 13 includes: a machine, a loading component installed on the machine, a die bonding table, a communication component and a transport component; the loading component is used to carry the display chip; the die bonding table is used to carry the display substrate; the communication component is used to receive the die bonding strategy; the transport component is used to transfer the first display chip and the second display chip that are transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively according to the die bonding strategy.

[0096] Reference Figure 2 As shown, in other embodiments, the manufacturing system of the display screen includes: a point test device 21, and a die bonding device 22. A data transmission link can be established between the point test device 21 and the die bonding device 22, and data is received and sent through the data transmission link. Similarly, the data transmission link can be a data transmission link established based on a wired connection, or a data transmission link established based on a wireless connection.

[0097] Point measuring device 21 and Figure 1 The point measuring device 11 in the manufacturing system of the display screen shown is similar, except that: Figure 1 The point measuring device 11 in the manufacturing system of the display screen shown in FIG. 2 sends the obtained point measuring information of the display chip to the computing device 12 , and the point measuring device 21 in the manufacturing system of the display screen shown in FIG. 2 sends the obtained point measuring information of the display chip to the die bonding device 22 .

[0098] The die bonding device 22 is used to receive the spot measurement information of the multiple display chips sent by the spot measurement device 21, generate a die bonding strategy according to the spot measurement information of the multiple display chips, and transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively according to the die bonding strategy. The first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in the adjacent die bonding point rows, respectively. In some embodiments, the die bonding equipment 22 includes: a machine, a loading component installed on the machine, a die bonding table, a communication component, a controller and a transport component; the loading component is used to carry display chips; the die bonding table is used to carry display substrates; the communication component is used to receive point measurement information of multiple display chips; the controller is used to generate a die bonding strategy based on the point measurement information of the multiple display chips; the transport component is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively according to the die bonding strategy.

[0099] Right now, Figure 2 The die bonding device 22 in the manufacturing system of the display screen shown can realize Figure 1 The functions of the computing device 12 and the die bonding device 13 in the manufacturing system of the display screen are shown. The die bonding device is executed to generate a die bonding strategy according to the point measurement information of a plurality of display chips.

[0100] The present application provides a method for manufacturing a display screen. The method for manufacturing a display screen can be performed by a subject Figure 1 The computing device or Figure 2 The die bonding equipment in the display manufacturing system shown. Figure 3 As shown, the manufacturing method of the display screen includes the following steps:

[0101] S31, obtaining point measurement information of multiple display chips.

[0102] In the embodiment of the present application, at least one of a red lamp bead, a green lamp bead, and a blue lamp bead is arranged on the display chip, and the point measurement information of the display chip refers to the information obtained by performing a brightness test on the lamp bead arranged on the display chip. In addition, when a plurality of lamp beads are arranged on the display chip, the colors of two lamp beads adjacent in space can be the same or different, and the embodiment of the present application does not limit this.

[0103] In some embodiments, the plurality of display chips are a plurality of display chips obtained by dividing the same wafer or different wafers.

[0104] In other embodiments, the plurality of display chips are obtained by dividing chips originally located on the same or different wafers and arranging the chips on the intermediate adapter board in a certain pattern.

[0105] In some embodiments, obtaining the point measurement information of the plurality of display chips includes: performing lighting tests on the plurality of display chips respectively based on a lighting test device to obtain the point measurement information of the plurality of display chips.

[0106] In some other embodiments, obtaining the point-testing information of the plurality of display chips includes: receiving the point-testing information of the plurality of display chips sent by an upstream device, wherein the upstream device may be a chip tester, a wafer tester, a cloud data server, and the like.

[0107] The brightness information of the display chip refers to the intensity and related characteristics of the light emitted by the display chip when it is working normally, which may include: brightness value, brightness adjustment characteristics, brightness stability and other information. The brightness information of the display chip can be obtained by using a brightness meter, color analyzer, camera and other equipment when the display chip is working normally.

[0108] The chromaticity information of the display chip refers to the relevant characteristics of the color presented by the display chip when it is working normally, which may include: color accuracy, uniformity, color gamut, color coordinates, hue, hue, etc. The chromaticity information of the display chip can be obtained by detecting and obtaining it through equipment such as color analyzers, spectrophotometers, cameras, and imaging colorimeters when the display chip is working normally.

[0109] The spectral information of the display chip refers to the spectral distribution and related characteristics of the light emitted by the display chip when it is working normally, where the spectral distribution can be represented by a wavelength range, a spectral curve, etc., and the related characteristics of the spectrum may include: spectral purity, spectral stability, spectral resolution, spectral power density, peak wavelength, half-wave width, etc. The spectral information of the display chip can be obtained by detecting with a spectrometer, an optical sensor, and other equipment when the display chip is working normally.

[0110] The wavelength information of the display chip refers to the wavelength and related characteristics of the light emitted by the display chip when it is working normally, which may include: wavelength range, wavelength peak, main wavelength, etc. The wavelength information of the display chip can be detected and obtained through equipment such as a spectrometer, a wavelength selector, and an interferometer.

[0111] The voltage information of the display chip refers to various voltage parameters and their states related to the normal operation of the display chip, which may include: operating voltage, input voltage, output voltage, etc. The voltage information of the display chip can be obtained by testing with a voltmeter, oscilloscope, or other equipment when the display chip is operating normally.

[0112] The current information of the display chip refers to various current parameters and their states related to the normal operation of the display chip, which may include: working current, input current, output current, etc. The current information of the display chip can be obtained by detecting with a meter, oscilloscope, or other equipment when the display chip is operating normally.

[0113] In some embodiments, a plurality of lamp beads are disposed on the display chip, and the colors of the plurality of lamp beads are different.

[0114] When two lamp beads are arranged on the display chip, the colors of the two lamp beads on the display chip can be respectively: red and green, or red and blue, or green and blue.

[0115] When three lamp beads are arranged on the display chip, the colors of the three lamp beads on the display chip may be red, green and blue respectively.

[0116] In some embodiments, a plurality of lamp beads are disposed on the display chip, and the plurality of lamp beads include at least two lamp beads of the same color.

[0117] For example, when four lamp beads are arranged on the display chip, the colors of the four lamp beads on the display chip may be red, green, blue and red respectively.

[0118] S32: Generate a die bonding strategy according to the point measurement information of the plurality of display chips.

[0119] Among them, the bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first bonding point and the second bonding point of the display substrate respectively; the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

[0120] In the embodiment of the present application, the die-bonding point on the display substrate refers to a specific position point set on the display substrate for fixing the display chip.

[0121] In the embodiment of the present application, two adjacent crystal bonding points include two situations. The first situation is that the positions of the two crystal bonding points are adjacent in space; the second situation is that the two crystal bonding points are respectively the last crystal bonding point of the previous crystal bonding point row and the first crystal bonding point of the next crystal bonding point row of adjacent point bonding points. The two crystal bonding points are not adjacent, which includes all other position relationships except the first and second situations mentioned above.

[0122] The positions of two die-bonding points being adjacent in space means that the two die-bonding points are close to each other in space and are adjacent to each other. Figure 4 As shown, the crystal bonding point 41 and the crystal bonding point 42 are located in the same crystal bonding point row (both located in the 8th crystal bonding point row), and the crystal bonding point 41 and the crystal bonding point 42 are adjacent in spatial position (located in the 2nd crystal bonding point column and the 3rd crystal bonding point column, respectively), so the crystal bonding point 41 and the crystal bonding point 42 are adjacent crystal bonding points defined in the embodiment of the present application. The crystal bonding point 43 and the crystal bonding point 44 are also located in the same crystal bonding point row (both located in the 3rd crystal bonding point row), but are not adjacent in spatial position, so the crystal bonding point 43 and the crystal bonding point 44 are non-adjacent crystal bonding points defined in the embodiment of the present application. The bonding point 45 and the bonding point 46 are adjacent bonding points in the same bonding point column (both are located in the 8th bonding point column, and are located in the 6th bonding point row and the 7th bonding point row respectively), so the bonding point 45 and the bonding point 46 are adjacent bonding points in spatial position.

[0123] In the embodiment of the present application, two bonding points are respectively the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in the adjacent bonding point row. Another way of expressing is: one bonding point is the last bonding point of the Nth bonding point row, and the other bonding point is the first bonding point of the N+1th bonding point row, where N is a positive integer. Figure 5 As shown, the bonding point 51 is the last bonding point of the third bonding point row, and the bonding point 52 is the first bonding point of the fourth bonding point row, because the bonding point 51 and the bonding point 52 are adjacent bonding points defined in the embodiment of the present application. The bonding point 53 is the last bonding point of the fifth bonding point row. Although the bonding point 52 and the bonding point 53 are located in adjacent bonding point rows, the bonding point 52 and the bonding point 53 are the first bonding point of the previous bonding point row and the last bonding point of the next bonding point row, respectively. Therefore, the bonding point 52 and the bonding point 53 are non-adjacent bonding points defined in the embodiment of the present application. The bonding point 54 is the first bonding point of the 7th bonding point row. Although the bonding point 53 and the bonding point 54 are respectively the first bonding point of one bonding point row and the last bonding point of another bonding point row, the bonding point rows where the bonding point 53 and the bonding point 54 are located are not adjacent. Therefore, the bonding point 53 and the bonding point 54 are also non-adjacent bonding points defined in the embodiments of the present application.

[0124] In some embodiments, the plurality of display chips correspond one-to-one to the die-bonding points on the display substrate.

[0125] It should be noted that the die-bonding points corresponding to the multiple display chips may all be located on the same display substrate, or may be located on multiple display substrates.

[0126] In some embodiments, the die-bonding points corresponding to the plurality of display chips are die-bonding points on a plurality of display substrates, and the mapping relationship among the display chips, the display substrates and the die-bonding points may be as shown in Table 1 below:

[0127] Table 1 shows the corresponding relationship between the chip, display substrate and die bonding point

[0128]

[0129] The chip identifier can be the serial number of the display chip, the identification code of the display chip, the position information of the display chip on the wafer, etc., which is not limited in the embodiment of the present application, and the chip identifier is capable of uniquely identifying the display chip. The display substrate identifies the display substrate to which the die-bonding point belongs. The two coordinate values ​​(x, y) of the die-bonding point respectively represent the row number and column number in the die-bonding point matrix of the display substrate where the die-bonding point is located. For example, if the die-bonding point is (3, 5), then the die-bonding point is located at the 3rd row and the 5th column.

[0130] In some other embodiments, the die-bonding points corresponding to the plurality of display chips are die-bonding points on the same display substrate, and the mapping relationship between the display chips and the die-bonding points may be as shown in Table 2 below:

[0131] Table 2 shows the corresponding relationship between the chip and the die bonding point

[0132]

[0133] In some embodiments, the die-bonding strategy may further include other information, for example, the die-bonding strategy may further include a transfer sequence of the plurality of chips.

[0134] The manufacturing method of the display screen provided in the embodiment of the present application first obtains the point measurement information of multiple display chips, and then generates a die bonding strategy based on the point measurement information of the multiple display chips. Since the manufacturing method of the display screen provided in the embodiment of the present application can generate a die bonding strategy including the die bonding points corresponding to the multiple display chips based on the point measurement information of the multiple display chips, and the die bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not respectively the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in the adjacent die bonding point row, so there is no need to implement the sorting link and the mixing link, and the embodiment of the present application can avoid transferring the display chip to the display substrate according to the position law of the display chip in the wafer, so the embodiment of the present application can save the equipment and time costs introduced in the chip sorting link and the chip mixing link, thereby reducing the production cost of the display screen.

[0135] On the basis of any of the above embodiments, when the manufacturing method of the display screen is a die bonding device, after generating a die bonding strategy based on the point measurement information of the multiple display chips, the manufacturing method of the display screen provided in the embodiment of the present application may also include: transferring the first display chip and the second display chip to the first die bonding point and the second die bonding point respectively according to the die bonding strategy.

[0136] In some embodiments, the first display chip and the second display chip are transferred to the first bonding point and the second bonding point respectively according to the bonding strategy, including: directly transferring the multiple display chips from the wafer to the corresponding bonding points according to the bonding strategy.

[0137] In other embodiments, the first display chip and the second display chip are transferred to the first die-bonding point and the second die-bonding point respectively according to the die-bonding strategy, including: first transferring the multiple display chips from the wafer to the intermediate transfer board, and then transferring the multiple display chips from the intermediate transfer board to the corresponding die-bonding points according to the die-bonding strategy.

[0138] Since the bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first bonding point and the second bonding point of the display substrate respectively, the first display chip and the second display chip will be transferred to the first bonding point and the second bonding point respectively when transferring according to the bonding strategy.

[0139] In some embodiments, the die bonding strategy is used to transfer the plurality of display chips to the display substrate so that a difference in display characteristics between any two regions of a preset size on the display substrate is smaller than a threshold difference.

[0140] In some embodiments, the display characteristic of any area of ​​a preset size on the display substrate may be an average value, a mode, or a median of point measurement information of each display chip in the area.

[0141] For example, refer to Figure 6 As shown, Figure 6 In the figure, the display substrate includes 16*16 die bonding points and the preset size is 4*4. On the display substrate 60, the row and column coordinates of the display chips located in the area 61 with a size of 4*4 are: (1,13), (1,14), (1,15), (1,16), (2,13), (2,14), (2,15), (2,16), (3,13), (3,14), (3,15), (3,16), (4,13), (4,14), (4,15), (4,16), and the display chips located in the area 62 with a size of 4*4 are: The row and column coordinates of the slices are: (11,11), (11,12), (11,13), (11,14), (12,11), (12,12), (12,13), (12,14), (13,11), (13,12), (13,13), (13,14), (14,11), (14,12), (14,13), (14,14), so the display difference between area 61 and area 62 can be: The row and column coordinates are:

[0142] The average values ​​of the point measurement information of the display chips of (1,13), (1,14), (1,15), (1,16), (2,13), (2,14), (2,15), (2,16), (3,13), (3,14), (3,15), (3,16), (4,13), (4,14), (4,15), (4,16) and the differences between the average values ​​of the point measurement information of the display chips with row and column coordinates are: (11,11), (11,12), (11,13), (11,14), (12,11), (12,12), (12,13), (12,14), (13,11), (13,12), (13,13), (13,14), (14,11), (14,12), (14,13), (14,14).

[0143] In some embodiments, generating a die bonding strategy according to the point measurement information of the plurality of display chips includes: classifying the plurality of display chips according to the point measurement information to obtain classification results of the plurality of display chips, and generating the die bonding strategy according to the classification results.

[0144] Wherein, in the classification result, the characteristic difference of the point measurement information of any two display chips in the same category is less than a first threshold.

[0145] In some embodiments, the point measurement information includes brightness information, and the characteristic difference between the point measurement information of two display chips is the brightness difference between the two display chips.

[0146] In some embodiments, the point measurement information includes: chromaticity information, and the characteristic difference of the point measurement information of the two display chips is the spatial distance of the chromaticity information of the two display chips in the corresponding chromaticity space. For example: the chromaticity information is the chromaticity value in the International Commission on Illumination (CIE) xy chromaticity space, then the calculation formula for the characteristic difference of two display chips with chromaticity values ​​of (x1, y1) and (x2, y2) is:

[0147]

[0148] In some embodiments, the point measurement information includes: brightness information and chromaticity information, and the characteristic difference of the point measurement information of the two display chips is the spatial distance between the brightness information and chromaticity information of the two display chips in the corresponding color space. For example, if the brightness information and chromaticity information are the brightness information and chromaticity information in the Lab color space, then the brightness values ​​are L m and L n , chromaticity values ​​are (a m , b m ) and (a n , b n The calculation formula for the characteristic difference of two display chips is:

[0149]

[0150] In some embodiments, the implementation method of classifying the multiple display chips according to the point measurement information may include: randomly selecting a display chip from the multiple display chips as the classification center. Traversing the remaining display chips, calculating the characteristic difference between the point measurement information of the display chip and the classification center, and determining the size relationship between the characteristic difference and the first threshold value, if the characteristic difference is less than the first threshold value, the corresponding display chip is classified into the classification to which the classification center belongs, if the characteristic difference is greater than or equal to the first threshold value, no processing is performed temporarily; after completing the traversal, randomly selecting a display chip from the unclassified display chips as the classification center, and traversing the remaining unclassified display chips until all display chips are classified.

[0151] In some embodiments, the implementation method of classifying the multiple display chips according to the point measurement information may include: dividing the characteristic range of the point measurement information into multiple segments with the first threshold as an interval, and classifying the multiple display chips into categories corresponding to the segments according to the segments to which the point measurement information belongs.

[0152] In the embodiment of the present application, there is no limitation on the size of the first threshold value. If the value of the first threshold value is smaller, the characteristic difference of the point measurement information of the display chips in the same category will be smaller. If the value of the first threshold value is larger, the characteristic difference of the point measurement information of the display chips in the same category will be larger. In actual use, the first threshold value can be set according to actual needs.

[0153] In some embodiments, the first threshold may be 0. That is, the point measurement information of each display chip in the same category is the same, or one category corresponds to one display chip.

[0154] In some embodiments, generating the die bonding strategy according to the classification result includes: obtaining a characteristic characterization value of each of the multiple display chips according to the classification result, and generating the die bonding strategy according to the characteristic characterization value of each of the multiple display chips. The characteristic characterization value of the display chip is the point measurement information of the center of the category to which the display chip belongs, and the center of the category is the display chip with the smallest sum of characteristic differences between the point measurement information and the point measurement information of other display chips in the category.

[0155] The sum of the characteristic differences of the point measurement information of any chip to other display chips is:

[0156]

[0157] Where N is the total number of chips displayed in the category, D i The characteristic difference of the point measurement information of the i-th display chip in the chip classification.

[0158] Therefore, the center of any classification satisfies:

[0159]

[0160] In some embodiments, the implementation method of generating the die bonding strategy according to the classification result includes the following steps a to c:

[0161] Step a: arranging the plurality of display chips on a virtual substrate corresponding to the display substrate according to a characteristic representation value of each display chip in the plurality of display chips.

[0162] Wherein, a difference between the characterization values ​​of any two regions of preset sizes on the virtual substrate is less than a second threshold.

[0163] In some embodiments, the characterization value of the region is an average value, a median value, or a mode value of the characteristic characterization values ​​of each display chip in the region.

[0164] The above embodiment classifies the display chips, obtains the characteristic characterization value of each display chip according to the classification result of the display chips, and then arranges the multiple display chips on the virtual substrate corresponding to the display substrate according to the characteristic characterization value of each display chip. Compared with directly arranging the multiple display chips on the virtual substrate corresponding to the display substrate based on the point measurement information of each display chip, the above embodiment can reduce the settlement amount when arranging the display chips to display damage reduction, thereby improving the efficiency of generating the solid crystal strategy.

[0165] In the embodiment of the present application, the virtual substrate corresponding to the display substrate can be a virtual space constructed by digital modeling technology based on the distribution of the bonding points of the display substrate, and the virtual space includes virtual bonding points corresponding to each bonding point of the display substrate.

[0166] For example, refer to Figure 7 As shown, Figure 7 In the example, the virtual substrate includes 16*16 die-bonding points and the preset size is 4*4. On the virtual substrate 70, the characterization values ​​of the area 71 with a size of 4*4 are (1,13), (1,14), (1,15), (1,16), (2,13), (2,14), (2,15), (2,16), (3,13),

[0167] The average, median or mode of the characteristic characterization values ​​of the display chips at the die bonding points of (3,14), (3,15), (3,16), (4,13), (4,14), (4,15) and (4,16).

[0168] When the characteristic representation value of the display chip is a color value in the Lab color space, the representation value of the area of ​​the preset size is expressed as (Lave , a ave , b ave ), then:

[0169]

[0170] Where n = M*N, is the total number of die bonding points (display chips) in the area of ​​the preset size, L i , a i , b i Indicates the characteristic representation value of the display chip at the i-th die bonding point in the area of ​​the preset size.

[0171] When the representation values ​​of the two regions of the preset size are (L x , a x , b x ) and (L y , a y , b y ), then the difference D between the characterization values ​​of the two preset size regions xy It can be expressed as:

[0172]

[0173] It should be noted that in the embodiment of the present application, any two areas of preset sizes may be two adjacent areas of preset sizes, or two non-adjacent areas of preset sizes, or two areas of preset sizes with overlapping areas.

[0174] In the embodiment of the present application, the size of the second threshold is not limited. If the value of the second threshold is smaller, the difference in the characterization value between any two areas of preset sizes on the display substrate is smaller, and the display effect of the final display is better, but the calculation complexity when the multiple display chips are arranged on the virtual substrate is higher. Conversely, the larger the value of the second threshold, the larger the difference in the characterization value between any two areas of preset sizes on the display substrate is, but the calculation complexity when the multiple display chips are arranged on the virtual substrate can be reduced. In actual use, the second threshold can be set according to actual needs.

[0175] Step b: acquiring a mapping relationship between each of the plurality of display chips and a die-bonding point on the display substrate according to the arrangement of the display chips on the virtual substrate.

[0176] In some embodiments, according to the arrangement of the display chips on the virtual substrate, a mapping relationship between each of the multiple display chips and the bonding points on the display substrate is obtained, including: determining the mapping relationship between the display chip and the bonding points on the virtual substrate according to the arrangement of the display chips on the virtual substrate, and converting the mapping relationship between the display chip and the bonding points on the virtual substrate into a mapping relationship between the display chip and the bonding points on the display substrate according to the mapping relationship between the bonding points on the virtual substrate and the bonding points on the display substrate.

[0177] Step c: generating the die-bonding strategy according to a mapping relationship between each display chip in the plurality of display chips and a die-bonding point on the display substrate.

[0178] In some embodiments, a die bonding strategy is generated based on the point measurement information of the multiple display chips, including: converting the point measurement information of the multiple display chips into color values ​​in a perceived uniform color space respectively to obtain color values ​​corresponding to the multiple display chips, and generating the die bonding strategy based on the color values ​​corresponding to the multiple display chips.

[0179] The perceptually uniform color space is a color space designed based on the visual perception characteristics of the human eye. In the perceptually uniform color space, the distance between any two colors is proportional to the degree to which the human eye perceives the difference between the two colors. That is, the same distance in the perceptually uniform color space represents the same color difference perceived by the human eye, and the distribution of colors in the perceptually uniform color space is more in line with the visual perception law of the human eye.

[0180] The perceived uniform color space in the embodiment of the present application may specifically be: CIE Lab, CIE Luv, CIE Lxy, etc.

[0181] Exemplarily, when the point measurement information includes: tristimulus values ​​in CIE XYZ space, and the perceived uniform color space is CIE Lab, the point measurement information of the display chip can be converted into color values ​​in the perceived uniform color space by the following formula:

[0182]

[0183] in,

[0184]

[0185] X n , Y n , Z n These are the tristimulus values ​​under the preset standard light source.

[0186] The above embodiment first converts the point measurement information of the multiple display chips into color values ​​in the perceived uniform color space to obtain the color values ​​corresponding to the multiple display chips, and then generates the die bonding strategy according to the color values ​​corresponding to the multiple display chips. Therefore, the above embodiment can make the die bonding strategy more in line with the visual perception characteristics of the human eye and improve the consistency and accuracy of the display effect.

[0187] The present application also provides another method for manufacturing a display screen. The manufacturing method for the display screen can also be performed by a subject: Figure 1 Display screen manufacturing system or Figure 2 The display screen manufacturing system shown. Figure 8 As shown, the manufacturing method of the display screen includes the following steps:

[0188] S801, obtaining point measurement information of multiple display chips.

[0189] The point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information.

[0190] S802 , respectively converting the point measurement information of the plurality of display chips into color values ​​in a perceptually uniform color space to obtain color values ​​corresponding to the plurality of display chips.

[0191] S803: Classify the multiple display chips according to the color values ​​to obtain classification results of the multiple display chips.

[0192] Wherein, the difference in color values ​​between any two display chips in the same category in the classification result is less than a first threshold.

[0193] S804 , obtaining a characteristic representation value of each display chip among the plurality of display chips according to the classification result.

[0194] The characteristic characterization value of the display chip is the color value of the center of the category to which the display chip belongs, and the center of the category is the display chip whose color value has the smallest sum of differences from the color values ​​of other display chips in the category.

[0195] S805 , arranging the plurality of display chips on a virtual substrate corresponding to the display substrate according to a characteristic representation value of each of the plurality of display chips.

[0196] Wherein, a difference between the characterization values ​​of any two regions of preset sizes on the virtual substrate is less than a second threshold.

[0197] S806 . Acquire a mapping relationship between each of the plurality of display chips and a die-bonding point on the display substrate according to the arrangement of the display chips on the virtual substrate.

[0198] S807 , generating the die-bonding strategy according to a mapping relationship between each display chip in the plurality of display chips and a die-bonding point on the display substrate.

[0199] When the display screen manufacturing method is performed by a die bonding device, the display screen manufacturing method may further include performing the following step S808:

[0200] S808 , transferring the plurality of display chips to corresponding die-bonding positions according to the die-bonding strategy.

[0201] Based on the same inventive concept, as an implementation of the above method, an embodiment of the present application also provides a device for manufacturing a display screen. This embodiment corresponds to the above method embodiment. For ease of reading, this embodiment will no longer repeat the details of the above method embodiment one by one, but it should be clear that the device for manufacturing a display screen in this embodiment can correspond to all the contents of the above method embodiment.

[0202] The present application provides a device for manufacturing a display screen. Fig. 9 is a schematic diagram of the structure of the manufacturing device of the display screen, such as Fig. 9 As shown, the manufacturing device 900 of the display screen includes:

[0203] An acquisition unit 91 is used to perform lighting tests on a plurality of display chips respectively to obtain point measurement information of the plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information;

[0204] A generation unit 92 is used to generate a die bonding strategy based on the point measurement information of the multiple display chips, wherein the die bonding strategy is used to transfer the first display chip and the second display chip that are transferred in an adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in adjacent die bonding point rows, respectively.

[0205] As an optional implementation of the embodiment of the present application, the multiple display chips correspond one-to-one to the die-bonding points on the display substrate.

[0206] As an optional implementation of the embodiment of the present application, the die bonding strategy is used to transfer the multiple display chips to the display substrate so that the difference in display characteristics between any two areas of preset sizes on the display substrate is less than a threshold difference.

[0207] Reference Fig.10 As shown, as an optional implementation of the embodiment of the present application, the manufacturing device 900 of the display screen also includes:

[0208] The transfer unit 93 is used for transferring the first display chip and the second display chip to the first die-bonding point and the second die-bonding point respectively according to the die-bonding strategy after generating the die-bonding strategy according to the point-measurement information of the plurality of display chips.

[0209] As an optional implementation of the embodiment of the present application, the generating unit 92 is specifically configured to classify the plurality of display chips according to the point measurement information to obtain classification results of the plurality of display chips, and generate the die bonding strategy according to the classification results;

[0210] Wherein, in the classification result, the characteristic difference of the point measurement information of any two display chips in the same category is less than a first threshold.

[0211] As an optional implementation of the embodiment of the present application, the generating unit 92 is specifically configured to obtain a characteristic characterization value of each of the plurality of display chips according to the classification result, and generate the die bonding strategy according to the characteristic characterization value of each of the plurality of display chips;

[0212] The characteristic characterization value of the display chip is the point measurement information of the cluster center of the category to which the display chip belongs, and the cluster center of the category is the display chip whose point measurement information has the smallest sum of characteristic differences with point measurement information of other display chips in the category.

[0213] As an optional implementation of the embodiment of the present application, the generating unit 92 is specifically used to arrange the multiple display chips on a virtual substrate corresponding to the display substrate according to the characteristic characterization value of each display chip in the multiple display chips, obtain a mapping relationship between each display chip in the multiple display chips and a die-bonding point on the display substrate according to the arrangement of the display chips on the virtual substrate, and generate the die-bonding strategy according to the mapping relationship between each display chip in the multiple display chips and a die-bonding point on the display substrate;

[0214] Wherein, a difference between the characterization values ​​of any two regions of preset sizes on the virtual substrate is less than a second threshold.

[0215] As an optional implementation of the embodiment of the present application, the generating unit 92 is specifically used to convert the point measurement information of the multiple display chips into color values ​​in the perceived uniform color space respectively to obtain the color values ​​corresponding to the multiple display chips; and generate the die bonding strategy according to the color values ​​corresponding to the multiple display chips.

[0216] The manufacturing device of the display screen provided in the embodiment of the present application can execute the manufacturing method of the display screen provided in any of the above embodiments, and its implementation principle and technical effect are similar, which will not be repeated here.

[0217] Based on the same inventive concept, an embodiment of the present application also provides an electronic device. Fig.11 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application, such as Fig.11 As shown, the electronic device provided in this embodiment includes: a memory 111 and a processor 112, wherein the memory 111 is used to store a computer program, and the processor 112 is used to execute the method for manufacturing a display screen provided in the above embodiment when executing the computer program.

[0218] Based on the same inventive concept, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the computing device implements the method for manufacturing a display screen provided in the above embodiment.

[0219] Based on the same inventive concept, an embodiment of the present application further provides a computer program product. When the computer program product is run on a computer, the computing device implements the method for manufacturing a display screen provided in the above embodiment.

[0220] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media that include computer-usable program code.

[0221] The processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0222] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0223] Computer readable media include permanent and non-permanent, removable and non-removable storage media. Storage media can be implemented by any method or technology to store information, and the information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0224] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present application.

Claims

1. A method for manufacturing a display screen, characterized in that: include: Acquire point measurement information of a plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; A die bonding strategy is generated according to the point measurement information of the multiple display chips, and the die bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in adjacent die bonding point rows, respectively.

2. The method according to claim 1, characterized in that The plurality of display chips correspond one-to-one to the die-bonding points on the display substrate.

3. The method according to claim 1, characterized in that: The die-bonding strategy is used to transfer the plurality of display chips to the display substrate so that a difference in display characteristics between any two regions of a preset size on the display substrate is smaller than a threshold difference.

4. The method according to claim 1, characterized in that: After generating the die bonding strategy according to the point measurement information of the plurality of display chips, the method further includes: The first display chip and the second display chip are transferred to the first die-bonding position and the second die-bonding position respectively according to the die-bonding strategy.

5. The method according to claim 1, characterized in that The step of generating a die bonding strategy according to the point measurement information of the plurality of display chips comprises: Classifying the plurality of display chips according to the point measurement information to obtain classification results of the plurality of display chips; in the classification results, a characteristic difference between the point measurement information of any two display chips in the same category is less than a first threshold; The die bonding strategy is generated according to the classification result.

6. The method according to claim 5, characterized in that Generating the die bonding strategy according to the classification result includes: Acquire a characteristic characterization value of each display chip in the plurality of display chips according to the classification result, wherein the characteristic characterization value of the display chip is point measurement information of a cluster center of a classification to which the display chip belongs, and the cluster center of the classification is a display chip whose point measurement information has the smallest sum of characteristic differences with point measurement information of other display chips in the classification; The die bonding strategy is generated according to the characteristic characterization value of each display chip among the plurality of display chips.

7. The method according to claim 6, characterized in that The step of generating the die bonding strategy according to the characteristic characterization value of each display chip among the plurality of display chips comprises: Arrange the plurality of display chips on a virtual substrate corresponding to the display substrate according to a characteristic characterization value of each of the plurality of display chips, wherein a difference between the characterization values ​​of any two regions of a preset size on the virtual substrate is less than a second threshold; According to the arrangement of the display chips on the virtual substrate, acquiring a mapping relationship between each of the plurality of display chips and a die-bonding point on the display substrate; The die-bonding strategy is generated according to a mapping relationship between each of the plurality of display chips and a die-bonding point on the display substrate.

8. The method according to claim 1, characterized in that: The step of generating a die bonding strategy according to the point measurement information of the plurality of display chips comprises: Respectively converting the point measurement information of the plurality of display chips into color values ​​in a perceptually uniform color space to obtain color values ​​corresponding to the plurality of display chips; The die bonding strategy is generated according to the color values ​​corresponding to the plurality of display chips.

9. The method according to any one of claims 1 to 8, characterized in that: A plurality of lamp beads are arranged on the display chip; the colors of the plurality of lamp beads are different from each other or the plurality of lamp beads include at least two lamp beads of the same color.

10. A method for manufacturing a display screen, characterized in that: include: receiving a die bonding strategy, wherein the die bonding strategy is generated according to point measurement information of a plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; According to the die-bonding strategy, the first display chip and the second display chip which are transferred in adjacent order are transferred to the first die-bonding point and the second die-bonding point of the display substrate respectively; Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

11. A method for manufacturing a display screen, characterized in that: include: Perform lighting tests on the multiple display chips respectively to obtain point measurement information of the multiple display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; Generate a die-bonding strategy according to the point measurement information of the plurality of display chips, the die-bonding strategy being used to transfer the first display chip and the second display chip transferred in adjacent order to the first die-bonding point and the second die-bonding point of the display substrate respectively; the first die-bonding point and the second die-bonding point are not adjacent die-bonding points in spatial position, and the first die-bonding point and the second die-bonding point are not respectively the last die-bonding point of the previous die-bonding point row and the first die-bonding point of the next die-bonding point row in adjacent die-bonding point rows; The first display chip and the second display chip are transferred to the first die-bonding point and the second die-bonding point respectively according to the die-bonding strategy.

12. A device for manufacturing a display screen, characterized in that: include: an acquisition unit, configured to perform lighting tests on a plurality of display chips respectively to acquire point measurement information of the plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; A generating unit is used to generate a die-bonding strategy according to the point measurement information of the plurality of display chips, wherein the die-bonding strategy is used to transfer a first display chip and a second display chip that are transferred in an adjacent order to a first die-bonding point and a second die-bonding point of a display substrate, respectively; the first die-bonding point and the second die-bonding point are not adjacent die-bonding points in spatial position, and the first die-bonding point and the second die-bonding point are not respectively the last die-bonding point of a previous die-bonding point row and the first die-bonding point of a subsequent die-bonding point row in adjacent die-bonding point rows.

13. A die bonding device, characterized in that: include: A machine platform, a loading assembly installed on the machine platform, a die bonding table, a communication assembly, a controller, and a transport assembly; The loading assembly is used to carry the display chip; The crystal bonding table is used to carry the display substrate; The communication component is used to receive point measurement information of multiple display chips, and the point measurement information includes: at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; The controller is used to generate a die bonding strategy according to the point measurement information of the plurality of display chips; The transport component is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die-bonding point and the second die-bonding point of the display substrate respectively according to the die-bonding strategy; Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

14. A die bonding device, characterized in that: include: A machine platform, a loading assembly, a die bonding table, a communication assembly, and a handling assembly installed on the machine platform; The loading assembly is used to carry the display chip; The crystal bonding table is used to carry the display substrate; The communication component is used to receive a die bonding strategy, wherein the die bonding strategy is generated according to point measurement information of a plurality of display chips, wherein the point measurement information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; The transport component is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die-bonding point and the second die-bonding point of the display substrate respectively according to the die-bonding strategy; Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

15. An electronic device, characterized in that: include: A memory and a processor, wherein the memory is used to store a computer program and the processor is used to enable the electronic device to implement the method for manufacturing a display screen according to any one of claims 1 to 11 when executing the computer program.

16. A display screen manufacturing system, characterized in that: include: Point measuring equipment, computing equipment and die bonding equipment; The point test device performs lighting tests on the multiple display chips respectively to obtain point test information of the multiple display chips, wherein the point test information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; The computing device is used to receive the spot measurement information of the display chip sent by the spot measurement device, and generate a die bonding strategy according to the spot measurement information of the plurality of display chips, wherein the die bonding strategy is used to transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively; the first die bonding point and the second die bonding point are not adjacent die bonding points in spatial position, and the first die bonding point and the second die bonding point are not the last die bonding point of the previous die bonding point row and the first die bonding point of the next die bonding point row in adjacent die bonding point rows respectively; The die-bonding device is used to receive the die-bonding strategy sent by the computing device, and to transfer the first display chip and the second display chip to the first die-bonding position and the second die-bonding position respectively according to the die-bonding strategy.

17. A display screen manufacturing system, characterized in that: include: Point testing equipment and die bonding equipment; The point test device is used to perform lighting tests on multiple display chips respectively to obtain point test information of the multiple display chips, wherein the point test information includes at least one of brightness information, chromaticity information, spectrum information, wavelength information, voltage information, and current information; The die bonding device is used to receive the spot measurement information of the multiple display chips sent by the spot measurement device, generate a die bonding strategy according to the spot measurement information of the multiple display chips, and transfer the first display chip and the second display chip transferred in adjacent order to the first die bonding point and the second die bonding point of the display substrate respectively according to the die bonding strategy; Among them, the first bonding point and the second bonding point are not adjacent bonding points in spatial position, and the first bonding point and the second bonding point are not the last bonding point of the previous bonding point row and the first bonding point of the next bonding point row in adjacent bonding point rows respectively.

18. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a computing device, the computing device implements the method for manufacturing a display screen according to any one of claims 1 to 11.

19. A computer program product, characterized in that When the computer program product is run on a computer, the computer is enabled to implement the method for manufacturing a display screen according to any one of claims 1 to 11.

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