Power amplifier and real-time oscilloscope

Abstract

The invention discloses a power amplifier and a real-time oscilloscope, and relates to the field of signal processing, in order to solve the problem that the bandwidth of the power amplifier is insufficient under high frequency, the power amplifier comprises a signal shunt assembly configured to separate an initial radio frequency signal into a radio frequency signal and a direct current signal and then output the radio frequency signal and the direct current signal respectively; the broadband radio frequency amplification assembly is configured to amplify and output the received radio frequency signal; the low-frequency processing component is configured to amplify and output the received direct-current signal; and the signal combining assembly is configured to combine the amplified direct-current signal and the amplified radio-frequency signal to obtain an amplified radio-frequency signal and output the amplified radio-frequency signal. The power amplifier provided by the invention can realize higher bandwidth and lower noise, so that the real-time oscilloscope applying the power amplifier can adapt to more test scenes.

Description

Technical Field

[0001] The present invention relates to the field of signal processing, and in particular to a power amplifier and a real-time oscilloscope. Background Art

[0002] At present, in real-time oscilloscopes, power amplifiers that achieve high-bandwidth and low-noise RF signal amplitude amplification are key components for real-time oscilloscopes to meet functional indicators and improve system performance. Most existing power amplifiers have insufficient bandwidth at high frequencies due to the complexity of circuit design or limitations of material properties. This bandwidth limitation makes it possible for real-time oscilloscopes to fail to meet the required test standards when performing test tasks in fields such as high-speed signal transmission or wireless communications, thereby affecting the accuracy and effectiveness of the test.

[0003] Therefore, how to provide a solution to the above technical problems is a problem that those skilled in the art need to solve at present. Summary of the invention

[0004] The object of the present invention is to provide a power amplifier and a real-time oscilloscope, which can achieve higher bandwidth and lower noise, so that the real-time oscilloscope using the power amplifier can adapt to more test scenarios.

[0005] In order to solve the above technical problems, the present invention provides a power amplifier, comprising:

[0006] A signal splitting component, configured to separate the initial radio frequency signal into a radio frequency signal and a direct current signal, and output the radio frequency signal and the direct current signal respectively;

[0007] A broadband radio frequency amplification component, configured to amplify and output the received radio frequency signal;

[0008] A low frequency processing component configured to amplify and output the received DC signal;

[0009] The signal combining component is configured to combine the amplified DC signal and the amplified RF signal to obtain and output the amplified RF signal.

[0010] Optionally, the broadband radio frequency amplification component includes a printed circuit board, and a radio frequency amplifier chip die and a high-frequency connector disposed on the printed circuit board, wherein:

[0011] The RF amplifier chip die is configured to amplify the RF signal to obtain an amplified RF signal;

[0012] The high frequency connector is configured to output the amplified radio frequency signal.

[0013] Optionally, a microstrip line is provided on the surface of the printed circuit board, one end of the microstrip line is connected to the high-frequency connector, the other end of the microstrip line is connected to one end of a gold wire, and the other end of the gold wire is connected to the bare die of the RF amplifier chip.

[0014] Optionally, the RF amplifier chip die is configured to amplify the RF signal to obtain an amplified RF differential signal;

[0015] The method comprises four groups of gold wires, wherein the four groups of gold wires include a first group of gold wires for transmitting ground signals, a second group of gold wires for transmitting positive differential signals, a third group of gold wires for transmitting negative differential signals, and a fourth group of gold wires for transmitting ground signals, and the first group of gold wires, the second group of gold wires, the third group of gold wires, and the fourth group of gold wires are arranged at intervals along a predetermined direction.

[0016] Optionally, the printed circuit board is provided with a mounting groove, the RF amplifier chip die is arranged in the mounting groove, there is a gap between the RF amplifier chip die and the side wall of the mounting groove, and the gap is smaller than a predetermined distance.

[0017] Optionally, the RF amplifier chip die is further configured to receive a gain adjustment signal so as to amplify the received RF signal based on the gain adjustment signal to obtain an amplified RF signal.

[0018] Optionally, the signal splitting component includes a radio frequency connector, an attenuator and a broadband splitter, and the broadband splitter includes a first capacitor unit and a first inductor unit, wherein:

[0019] The input end of the RF connector is used to receive the initial RF signal, the output end of the RF connector is connected to the input end of the attenuator, the output end of the attenuator is respectively connected to the first end of the first capacitor unit and the first end of the first inductor unit, the second end of the first capacitor unit outputs the RF signal, and the second end of the first inductor unit outputs the DC signal;

[0020] The attenuator is configured to convert the initial radio frequency signal into an intermediate radio frequency signal with a preset amplitude and output the intermediate radio frequency signal.

[0021] Optionally, the signal combining component includes at least one broadband combiner, and the broadband combiner includes a second capacitor unit and a second inductor unit, wherein:

[0022] The first end of the second capacitor unit is connected to the amplified RF signal, the second end of the second capacitor unit is connected to the first end of the second inductor unit, and the common end outputs the amplified RF signal. The second end of the second inductor unit is connected to the amplified DC signal.

[0023] Optionally, the low frequency processing component includes:

[0024] a low-frequency operational amplifier configured to amplify the DC signal to obtain an intermediate signal;

[0025] The low-pass filter is configured to filter the high-frequency components in the intermediate signal to obtain an amplified direct current signal.

[0026] In order to solve the above technical problems, the present invention further provides a real-time oscilloscope, comprising a power amplifier as described in any one of the above items.

[0027] The present invention provides a power amplifier, which separates the initial RF signal into RF signal and DC signal through a signal splitting component, and then transmits the RF signal and DC signal to a broadband RF amplification component and a low-frequency processing component, respectively, to ensure that the RF signal and DC signal can be processed independently on different paths, avoiding mutual interference between them. The broadband RF amplification component is dedicated to amplifying the RF signal, thereby providing higher gain and lower noise, and the low-frequency processing component is dedicated to amplifying the DC signal, so that the low-frequency processing component is dedicated to amplifying the DC signal, reducing the noise impact on the RF signal, and then the amplified DC signal and the amplified RF signal are combined through the signal combining component to obtain the amplified RF signal and then output. Since the RF signal and the DC signal are amplified separately, the power amplifier can achieve higher bandwidth and lower noise, so that the real-time oscilloscope using the power amplifier can adapt to more test scenarios.

[0028] The present invention also provides a real-time oscilloscope having the same beneficial effects as the above power amplifier. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the structure of a first power amplifier provided by the present invention;

[0031] Figure 2 This is a schematic structural diagram of a first broadband radio frequency amplification component provided by the present invention;

[0032] Figure 3 A schematic diagram of the structure of a second broadband radio frequency amplification component provided by the present invention;

[0033] Figure 4 This is a schematic structural diagram of a third broadband radio frequency amplification component provided by the present invention;

[0034] Figure 5 A schematic diagram of the structure of a second power amplifier provided by the present invention;

[0035] Figure 6 A schematic diagram of the structure of a third power amplifier provided by the present invention;

[0036] Figure 7 This is a schematic diagram of the first S parameter simulation provided by the present invention;

[0037] Figure 8 This is a second impedance simulation schematic diagram provided by the present invention. DETAILED DESCRIPTION

[0038] The core of the present invention is to provide a power amplifier and a real-time oscilloscope, which can achieve higher bandwidth and lower noise, so that the real-time oscilloscope using the power amplifier can adapt to more test scenarios.

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] First, please refer to Figure 1 The present invention provides a power amplifier, comprising:

[0041] The signal splitter component 1 is configured to separate the initial radio frequency signal into a radio frequency signal and a direct current signal, and then output the radio frequency signal and the direct current signal respectively;

[0042] A broadband radio frequency amplification component 2, configured to amplify and output the received radio frequency signal;

[0043] A low frequency processing component 3, configured to amplify and output the received DC signal;

[0044] The signal combining component 4 is configured to combine the amplified DC signal and the amplified RF signal to obtain and output the amplified RF signal.

[0045] In this embodiment, the signal branching component 1 includes a composite input terminal, a DC output terminal and a radio frequency output terminal. The composite input terminal of the signal branching component 1 is connected to the radio frequency source and is used to access the initial radio frequency signal RFin. The initial radio frequency signal is a composite signal containing radio frequency components and DC components, wherein the radio frequency component has a higher frequency and the DC component has a frequency of almost 0. The signal branching component 1 separates the radio frequency component and the DC component in the initial radio frequency signal to obtain a radio frequency signal and a DC signal. The radio frequency signal is used for further signal processing or transmission, and the DC signal is used for power supply, bias or other circuits requiring a DC power supply. The radio frequency signal is output through the radio frequency output terminal, and the DC signal is output through the DC output terminal. The signal branching component 1 realizes the division of the high-frequency signal and the low-frequency signal in the initial radio frequency signal, which is convenient for the subsequent separate processing of the two. The signal branching component 1 separates the high-frequency signal and the low-frequency signal from the composite signal, thereby reducing the mutual interference between the two and improving the bandwidth utilization. The signal branching component 1 can be implemented in the form of components, chips, circuits or combinations thereof having the above functions, and this embodiment is not specifically limited here.

[0046] The broadband RF amplification component 2 includes a first input terminal and a first output terminal. The first input terminal of the broadband RF amplification component 2 is connected to the RF output terminal of the signal branching component 1, and is used to access the RF signal output by the signal branching component 1. The broadband RF amplification component 2 is used to amplify the RF signal according to the configured amplitude to ensure that the RF signal has sufficient power to reach the receiving end during the transmission process, and then output the amplified RF signal through the first output terminal. It can be understood that the broadband RF amplification component 2 includes at least one or more amplification circuits, which are designed to work on a wide band to process all signals within a certain frequency range. According to the requirements of the system configuration, the broadband RF amplification component 2 will amplify the RF signal according to the preset amplitude, ensuring that the power of the signal in the high frequency band is fully enhanced. Even under high-frequency operation, the amplified RF signal has a higher power level when it is output through the first output terminal, which is not only conducive to long-distance transmission of the signal, but also can maintain a high communication quality in a noisy environment. Therefore, the use of the broadband RF amplification component 2 not only improves the data acquisition capability of the real-time oscilloscope in the high frequency band, but also improves the performance of the entire RF front-end system, so that when the high-frequency bandwidth is insufficient, a clear and stable signal display can still be obtained, thereby improving the practicality and reliability of the real-time oscilloscope. The broadband RF amplification component 2 can be implemented in the form of components, chips, circuits or combinations thereof having the above functions, and this embodiment is not specifically limited here.

[0047] The low-frequency processing component 3 includes a second input terminal and a second output terminal. The second input terminal of the low-frequency processing component 3 is connected to the DC output terminal of the signal branching component 1, and is used to access the DC signal output by the signal branching component 1. The low-frequency processing component 3 amplifies the DC signal to obtain an amplified DC signal, and outputs the amplified DC signal from the second output terminal. The amplified DC signal is used for power supply, bias or other circuits that require a DC power supply. It can be understood that the low-frequency processing component 3 at least includes an amplifier circuit inside the low-frequency processing component 3, which is specially designed to amplify DC or low-frequency signals. The amplification process can be a precise control of the signal amplitude to meet the needs of specific applications. The access of the low-frequency processing component 3 can isolate the RF signal processing part and the DC power supply part, reduce mutual interference, and thus improve the signal-to-noise ratio and overall stability of the system. In a real-time oscilloscope, even under high-frequency operation, the stable DC output of the low-frequency processing component 3 can ensure the normal operation of the amplifier, so that the oscilloscope can more accurately capture and analyze high-frequency signals, thereby improving the practicality and reliability of the real-time oscilloscope in high-frequency applications. The low-frequency processing component 3 can be implemented in the form of a component, chip, circuit or a combination thereof having the above functions, which is not specifically limited in this embodiment.

[0048] The signal combining component 4 includes an RF input terminal, a DC input terminal and a composite output terminal. The RF input terminal of the signal combining component 4 is connected to the first output terminal of the broadband RF amplifying component 2, and is used to access the RF signal amplified by the broadband RF amplifying component 2. The DC input terminal of the signal combining component 4 is connected to the second output terminal of the low-frequency processing component 3, and is used to access the DC signal amplified by the low-frequency processing component 3. The signal combining component 4 combines the amplified RF signal and the amplified DC signal to obtain an amplified RF signal. The amplified RF signal includes an RF component and a DC component. The amplified RF signal is output through the composite output terminal for subsequent transmission or processing, ensuring that the combined signal remains stable and no additional noise or distortion is introduced due to the signal combining process. It can be understood that by effectively combining the amplified RF signal and the amplified DC signal, the signal combining component 4 ensures that the output is a stable amplified RF signal RFOUT containing both RF components and DC components. This design not only improves the overall power level of the signal, which is suitable for long-distance transmission or maintaining communication quality in a noisy environment, but also does not introduce additional noise or distortion during the combining process, thereby maintaining the clarity and accuracy of the signal. This is particularly important for real-time oscilloscopes that need to accurately capture and analyze signals under high-frequency operation. The stable output of the signal combining component 4 enables the real-time oscilloscope to maintain its performance when the high-frequency bandwidth is insufficient, providing reliable data acquisition and display, thereby enhancing the application value and user experience of the real-time oscilloscope in the field of high-frequency signal analysis. The signal combining component 4 can be implemented in the form of components, chips, circuits or combinations thereof having the above functions, and this embodiment is not specifically limited here.

[0049] Taking the transmission matching of DC-72GHz signal as an example, the low-frequency operation component supports a frequency of DC-1MHz, and the broadband RF amplification component 2 supports a frequency of 1MHz-72GHz. The composite input end of the signal splitter component 1 receives the DC-72GHz composite signal and divides the composite signal into two paths: one is a low-frequency DC-1MHz signal, and the other is a high-frequency 1MHz-72GHz signal. The low-frequency DC-1MHz signal is sent to the low-frequency operation component, which amplifies and processes the low-frequency signal to ensure the stability and matching of the low-frequency signal. The second output end of the low-frequency operation component outputs the amplified low-frequency signal. At the same time, the high-frequency 1MHz-72GHz signal is sent to the broadband RF amplification component 2, which amplifies the high-frequency signal to compensate for the loss of the signal during transmission and ensure that the signal has good transmission matching characteristics within the frequency range of 1MHz-72GHz. The first output end of the broadband RF amplification component 2 outputs the amplified high-frequency signal. Finally, the amplified low-frequency signal output by the low-frequency operation component and the amplified high-frequency signal output by the broadband RF amplification component 2 are recombined through the signal combining component 4 to obtain a composite signal containing low-frequency and high-frequency components, and output through the composite output terminal to achieve signal transmission matching in the entire DC-72GHz frequency range. This ensures the transmission efficiency and quality of the signal in the entire frequency band, and can also meet the specific processing requirements of different frequency components.

[0050] It can be seen that in this embodiment, after the initial RF signal is separated into RF signal and DC signal by the signal splitting component 1, the RF signal and DC signal are transmitted to the broadband RF amplification component 2 and the low-frequency processing component 3 respectively, ensuring that the RF signal and DC signal can be processed independently on different paths, avoiding mutual interference between them. The broadband RF amplification component 2 is dedicated to amplifying RF signals, thereby providing higher gain and lower noise, and the low-frequency processing component 3 is dedicated to amplifying DC signals. In this way, the low-frequency processing component 3 is dedicated to amplifying DC signals, reducing the noise impact on the RF signal, and then the amplified DC signal and the amplified RF signal are combined by the signal combining component 4 to obtain the amplified RF signal and then output. Since the RF signal and the DC signal are amplified separately, the power amplifier can achieve higher bandwidth and lower noise, so that the real-time oscilloscope using the power amplifier can adapt to more test scenarios.

[0051] Based on the above embodiments:

[0052] In an exemplary embodiment, referring to Figure 2 , Figure 3 , Figure 4The broadband radio frequency amplification component 2 includes a printed circuit board 21, and a radio frequency amplifier chip die 22 and a high-frequency connector 23 arranged on the printed circuit board 21, wherein:

[0053] The RF amplifier chip die 22 is configured to amplify the RF signal to obtain an amplified RF signal;

[0054] The high frequency connector 23 is configured to output the amplified radio frequency signal.

[0055] In this embodiment, the broadband RF amplifier component 2 is built based on a printed circuit board 21 (PCB, Printed Circuit Board), and a RF amplifier chip bare die 22 (bare die) and a high-frequency connector 23 are arranged on the printed circuit board 21. The RF amplifier chip bare die 22 and the high-frequency connector 23 communicate through the signal transmission line arranged on the printed circuit board 21 to realize signal transmission between the two. Among them, the RF amplifier chip bare die 22 is a semiconductor chip without packaging, which is used to amplify the RF signal to enhance the power level of the RF signal. The design of the bare die 22 can reduce the size and improve the thermal and electrical performance. The high-frequency connector 23 is specially designed for the transmission of high-frequency signals to ensure that the signal has minimal loss and low standing wave ratio between the connector and the PCB and when connected to other devices, thereby maintaining the quality of the RF signal. The connection path between the RF amplifier chip bare die 22 and the high-frequency connector 23 is arranged on the PCB, which usually includes high-frequency transmission lines such as microstrip lines 24, strip lines or coplanar waveguides. The use of bare die 22 and optimized PCB design helps to reduce the volume and weight of components and improve the integration and performance of the system.

[0056] In an exemplary embodiment, a microstrip line 24 is provided on the surface of the printed circuit board 21, one end of the microstrip line 24 is connected to the high-frequency connector 23, the other end of the microstrip line 24 is connected to one end of a gold wire 25, and the other end of the gold wire 25 is connected to the RF amplifier chip die 22.

[0057] In this embodiment, the microstrip line 24 is specifically a surface microstrip line 24 of the PCB, which is used to connect the high-frequency connector 23 and the RF amplifier chip die 22. Through simulation and board stacking design, the line width of the microstrip line 24 and the spacing from the reference ground layer are optimized to achieve a specific impedance of 50 ohms, which is convenient for signal transmission matching and minimizing reflection. The board stack uses a multi-layer PCB design of M8U material, with a total of 8 layers, to ensure the impedance consistency and low loss (ultra lowloss) of the surface high-speed microstrip line 24. The choice of this material helps to maintain signal quality during high-speed transmission. The gold wire 25 is used to connect the microstrip line 24 and the RF amplifier chip die 22. Specifically, a soldering pad finger pad of the microstrip line 24 terminal is provided on the PCB board for connecting with the gold wire 25.

[0058] In an exemplary embodiment, the RF amplifier chip die 22 is configured to amplify the RF signal to obtain an amplified RF differential signal;

[0059] The four groups of gold wires 25 include a first group of gold wires 25 for transmitting ground signals, a second group of gold wires 25 for transmitting positive differential signals, a third group of gold wires 25 for transmitting negative differential signals, and a fourth group of gold wires 25 for transmitting ground signals. The first group of gold wires 25, the second group of gold wires 25, the third group of gold wires 25, and the fourth group of gold wires 25 are arranged at intervals along a predetermined direction.

[0060] Correspondingly, the high-frequency connector 23 in this embodiment is a G3PO high-frequency connector 23, which independently verifies and tests the output performance of the broadband amplifier and adopts a differential output mode, which can better suppress differential mode noise and improve the SNR of the signal.

[0061] The RF amplifier chip die 22 is configured to differentially amplify the RF signal, and can simultaneously amplify two opposite phases (positive differential and negative differential) of the signal, thereby generating an amplified RF differential signal. Differential amplification can effectively improve the anti-interference ability of the signal and reduce the influence of common mode noise.

[0062] In this embodiment, the gold wire 25 of the high-speed part adopts a double-wire form, with a total of four groups. Arranged in the order of GSSG (ground-signal-signal-ground) to provide a reference for signal transmission and noise shielding. The height of the gold wire 25 is compressed to ≤100um, and the bonding length of the bonding line is shortened as much as possible to reduce parasitic effects. Among them, the gold wire 25 with a line width of 20um and an arc height of 100um can be selected.

[0063] Specifically, the first group of gold wires 25 provides a stable ground reference point for the differential amplifier, which is convenient for suppressing noise and interference. Stable grounding can reduce noise caused by ground potential fluctuations, thereby improving signal clarity and reliability. The second group of gold wires 25 is responsible for transmitting the amplified positive differential signal and is directly connected to the positive differential output terminal of the high-frequency connector 23. The third group of gold wires 25 corresponds to the second group of gold wires 25. This group of gold wires 25 transmits the amplified negative differential signal and is connected to the negative differential output terminal of the high-frequency connector 23. The negative differential signal is opposite to the positive differential signal, and the two together constitute a complete differential signal pair. The fourth group of gold wires 25 is similar to the first group of gold wires 25. This group of gold wires 25 further provides a ground signal, enhances the stability of the signal, and helps to balance the current distribution in the entire signal transmission path. The four groups of gold wires 25 are arranged at intervals along a predetermined direction. This arrangement helps to maintain the balance of the differential signal pair, reduce crosstalk between signals, and maintain signal integrity to ensure optimal electrical performance.

[0064] Through this configuration, the RF amplifier chip die 22 can provide high-bandwidth and low-noise differential signal amplification, while the application of gold wire 25 bonding technology ensures efficient transmission of signals between the chip and the PCB.

[0065] In an exemplary embodiment, the printed circuit board 21 is provided with a mounting groove, the RF amplifier chip die 22 is arranged in the mounting groove, there is a gap between the RF amplifier chip die 22 and the side wall of the mounting groove, and the gap is smaller than a predetermined distance.

[0066] Specifically, the assembly method of the RF amplifier chip die 22 on the printed circuit board 21 is to dig a groove on the printed circuit board 21 and use conductive glue to bond the chip to the window copper foil of the PCB. This bonding method not only fixes the chip, but also provides a good electrical connection. Then, one end of the gold wire 25 is connected to the pad 27 of the microstrip line 24 of the PCB through the bonding technology, and the other end of the gold wire 25 is connected to the diepad pad 28 of the RF amplifier chip die 22 through the bonding technology. Figure 4 The third layer of copper foil 26 of the PCB board is the RF reference ground of the chip bare die. There is a gap between the RF amplifier chip bare die 22 and the side wall of the mounting groove, which can ensure that the chip has enough space to be fixed in the groove, while minimizing the length of the gold wire bonding and reducing the loss of signal transmission. Exemplarily, the size of the mounting groove is 2 mil larger than the chip on each side, and the height of the chip is 0.3 mm. Such a design helps to control the length and shape of the gold wire and further optimize the signal transmission characteristics.

[0067] In this embodiment, in the key high-frequency and high-speed part of the channel, an optimized gold wire bonding process and a bare die chip installation method are used to reduce the loss of the signal during transmission, and the simulation-optimized high-speed PCB layout and wiring are used to achieve high-bandwidth and low-noise channel performance, so that the broadband RF amplification component 2 can show excellent performance in high-frequency applications. In an exemplary embodiment, the RF amplifier chip die 22 is also configured to receive a gain adjustment signal so as to amplify the received RF signal based on the gain adjustment signal to obtain an amplified RF signal.

[0068] In this embodiment, the RF amplifier chip die 22 has the advantages of high bandwidth, low noise, and adjustable output amplitude, wherein the RF amplifier chip die 22 has a pin for controlling the high-frequency output amplitude, and the gain can be controlled by writing a value to the register through the host computer, and the adjustable range includes but is not limited to 0-6dB. Specifically, the RF amplifier chip die 22 is designed with a special pin or interface for receiving a gain adjustment signal from an external control source. This signal can be an analog signal or a digital signal, depending on the design of the chip. Based on the received gain adjustment signal, the amplification circuit inside the chip will adjust its gain setting accordingly, thereby amplifying the received RF signal to different degrees to obtain an amplified RF signal of the required amplitude and power. Through this design, the RF amplifier chip die 22 can not only provide stable signal amplification, but also flexibly adjust the gain according to the actual application requirements, so that when processing high-frequency signals, the RF amplifier can also dynamically optimize its amplification performance according to the characteristics of the signal and the needs of the oscilloscope, thereby ensuring the integrity and clarity of the signal. By receiving analog or digital gain adjustment signals from an external control source, the amplification circuit inside the chip can respond in real time to adapt to different signal strengths and frequencies, effectively overcoming the limitation of insufficient high-frequency bandwidth of traditional power amplifiers. Therefore, this design not only improves the performance of real-time oscilloscopes in high-speed signal analysis, but also enhances its adaptability in complex electromagnetic environments, ensuring high-precision measurements and reliable signal capture.

[0069] In an exemplary embodiment, referring to Figure 5 As shown, the signal splitter component 1 includes a radio frequency connector 11, an attenuator 12 and a broadband splitter 13, and the broadband splitter 13 includes a first capacitor unit and a first inductor unit, wherein:

[0070] The input end of the RF connector 11 is used to receive the initial RF signal, the output end of the RF connector 11 is connected to the input end of the attenuator 12, the output end of the attenuator 12 is respectively connected to the first end of the first capacitor unit and the first end of the first inductor unit, the second end of the first capacitor unit outputs the RF signal, and the second end of the first inductor unit outputs the DC signal;

[0071] The attenuator 12 is configured to convert the initial RF signal into an intermediate RF signal with a preset amplitude and output the intermediate RF signal.

[0072] In this embodiment, the signal splitter component 1 specifically includes a radio frequency connector 11, an attenuator 12 and a bandwidth splitter. The specific connection relationship thereof is as follows: Figure 5 As shown. The broadband splitter 13 includes two paths, one is a radio frequency path, and the other is a direct current path. The radio frequency path is provided with a first capacitor unit, and the first capacitor unit includes at least one broadband capacitor to suppress the passage of the direct current component. The direct current path is provided with a first inductor unit to suppress the passage of the radio frequency component. The first inductor unit is constructed by connecting multiple inductors in series, in parallel or in combination thereof to meet the branching requirements of the actual circuit. The broadband splitter 13 can use a broadband BiasTee.

[0073] After the input end of the RF connector 11 is connected to the initial RF signal, it is output to the attenuator 12 through the output end. The attenuator 12 in this embodiment is specifically a DC-72GHz broadband adjustable step attenuator, which switches the internal attenuation value by detecting the amplitude of the initial RF signal. The step size of the attenuator 12 can be 1dB. The total range is 0-21dB, so as to achieve the purpose of protecting the subsequent circuit. The signal branching component 1 can not only effectively separate the RF and DC signals, but also protect the subsequent circuit from damage through precise attenuation control, while maintaining the quality and integrity of the signal, thereby improving the real-time oscilloscope's ability to process high-frequency signals.

[0074] In an exemplary embodiment, the signal combining component 4 includes at least one broadband combiner, and the broadband combiner includes a second capacitor unit and a second inductor unit, wherein:

[0075] The first end of the second capacitor unit is connected to the amplified RF signal, the second end of the second capacitor unit is connected to the first end of the second inductor unit, and the common end outputs the amplified RF signal. The second end of the second inductor unit is connected to the amplified DC signal.

[0076] Broadband combiner: includes a second capacitor unit and a second inductor unit, used to combine the amplified RF signal and DC signal. The first end of the second capacitor unit: connected to the amplified RF signal, the second end of the second capacitor unit: connected to the first end of the second inductor unit to form a common end, which outputs the combined amplified RF signal, and the second end of the second inductor unit: connected to the amplified DC signal. Through this design, the second capacitor unit allows the RF signal to pass through while suppressing the DC component, while the second inductor unit allows the DC signal to pass through while suppressing the RF component. In this way, the two signals can be combined without interfering with each other, thereby maintaining the quality of the RF signal and the stability of the DC signal.

[0077] It can be understood that when the broadband RF amplification component 2 outputs an RF differential signal, the signal combining component 4 includes two broadband combiners, the first broadband combiner is used to combine the amplified positive differential signal and the amplified DC signal, and the second broadband combiner is used to combine the amplified negative differential signal and the amplified DC signal.

[0078] In an exemplary embodiment, the low frequency processing component 3 comprises:

[0079] A low-frequency operational amplifier 31 is configured to amplify the DC signal to obtain an intermediate signal;

[0080] The low-pass filter 32 is configured to filter the high-frequency components in the intermediate signal to obtain an amplified DC signal.

[0081] The input end of the low-frequency operational amplifier 31 is connected to the DC output end of the signal splitter component 1, and is used to receive the DC signal separated by the signal splitter component 1. The low-frequency operational amplifier 31 preliminarily amplifies the received DC signal to generate an intermediate signal to increase the signal level so that it meets the requirements of subsequent processing or transmission. This intermediate signal contains the amplified DC component and possible high-frequency noise or interference.

[0082] The output end of the low-frequency operational amplifier 31 is connected to the input end of the low-pass filter 32. The low-pass filter 32 is used to filter out the high-frequency components in the intermediate signal and only allow DC and low-frequency signals to pass through, so as to effectively remove the high-frequency noise and interference introduced by the amplification process, thereby obtaining a pure amplified DC signal.

[0083] Reference Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of another power amplifier provided by the present invention, wherein the power supply circuit (power_supply) is specifically a collector power supply circuit of the RF amplifier chip die 22, and a broadband choke inductor and a filter capacitor are used to prevent the RF signal from entering the DC power supply and affecting the circuit performance. Figure 6 In the figure, the signal combining component 4 includes a first broadband combiner 41 and a second broadband combiner 42. The first broadband combiner 41 outputs a positive amplified RF signal RFOUT_P, and the second broadband combiner 42 outputs a negative amplified RF signal RFOUT_N. In summary, the present invention provides a broadband RF link channel design and device for a real-time oscilloscope, which adopts a two-stage component connection method; in the key high-frequency and high-speed part of the channel, an optimized gold wire bonding process and a bare die chip installation method, as well as a simulated optimized high-speed PCB layout and wiring method are adopted to ensure the low loss and low noise interference characteristics of the signal, and achieve high-bandwidth and low-noise channel performance. At the input and output ends of the RF amplifier chip bare die 22, a broadband BiasTee is used to achieve the purpose of high and low frequency combining to ensure the performance of the overall link. The overall high-speed design S parameter simulation and impedance as shown in the figure. Figure 7 and Figure 8 As shown, within the frequency band ≤72GHz, the loss is <-1dB, the return loss is <-16dB, and the TDR is around 98ohm, with overall good indicators.

[0084] In a second aspect, the present invention further provides a real-time oscilloscope, comprising a power amplifier as described in any one of the above items.

[0085] For an introduction to a real-time oscilloscope provided by the present invention, please refer to the above-mentioned embodiment, and the present invention will not be described in detail here.

[0086] The real-time oscilloscope provided by the present invention has the same beneficial effects as the above-mentioned power amplifier.

[0087] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0088] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power amplifier, characterized in that: include: A signal splitting component, configured to separate the initial radio frequency signal into a radio frequency signal and a direct current signal, and output the radio frequency signal and the direct current signal respectively; A broadband radio frequency amplification component, configured to amplify and output the received radio frequency signal; A low frequency processing component configured to amplify and output the received DC signal; The signal combining component is configured to combine the amplified DC signal and the amplified RF signal to obtain and output the amplified RF signal.

2. The power amplifier according to claim 1, characterized in that: The broadband radio frequency amplification component comprises a printed circuit board, and a radio frequency amplifier chip bare die and a high-frequency connector arranged on the printed circuit board, wherein: The RF amplifier chip die is configured to amplify the RF signal to obtain an amplified RF signal; The high frequency connector is configured to output the amplified radio frequency signal.

3. The power amplifier according to claim 2, characterized in that: A microstrip line is provided on the surface of the printed circuit board, one end of the microstrip line is connected to the high-frequency connector, the other end of the microstrip line is connected to one end of a gold wire, and the other end of the gold wire is connected to the bare die of the radio frequency amplifier chip.

4. The power amplifier according to claim 3, characterized in that: The RF amplifier chip die is configured to amplify the RF signal to obtain an amplified RF differential signal; The method comprises four groups of gold wires, wherein the four groups of gold wires include a first group of gold wires for transmitting ground signals, a second group of gold wires for transmitting positive differential signals, a third group of gold wires for transmitting negative differential signals, and a fourth group of gold wires for transmitting ground signals, and the first group of gold wires, the second group of gold wires, the third group of gold wires, and the fourth group of gold wires are arranged at intervals along a predetermined direction.

5. The power amplifier according to claim 3, characterized in that: The printed circuit board is provided with a mounting groove, the RF amplifier chip bare die is arranged in the mounting groove, there is a gap between the RF amplifier chip bare die and the side wall of the mounting groove, and the gap is smaller than a predetermined distance.

6. The power amplifier according to claim 2, characterized in that: The RF amplifier chip die is further configured to receive a gain adjustment signal so as to amplify the received RF signal based on the gain adjustment signal to obtain an amplified RF signal.

7. The power amplifier according to claim 1, characterized in that: The signal splitter assembly includes a radio frequency connector, an attenuator and a broadband splitter, and the broadband splitter includes a first capacitor unit and a first inductor unit, wherein: The input end of the RF connector is used to receive the initial RF signal, the output end of the RF connector is connected to the input end of the attenuator, the output end of the attenuator is respectively connected to the first end of the first capacitor unit and the first end of the first inductor unit, the second end of the first capacitor unit outputs the RF signal, and the second end of the first inductor unit outputs the DC signal; The attenuator is configured to convert the initial radio frequency signal into an intermediate radio frequency signal with a preset amplitude and output the intermediate radio frequency signal.

8. The power amplifier according to claim 1, characterized in that: The signal combining component comprises at least one broadband combiner, and the broadband combiner comprises a second capacitor unit and a second inductor unit, wherein: The first end of the second capacitor unit is connected to the amplified RF signal, the second end of the second capacitor unit is connected to the first end of the second inductor unit, and the common end outputs the amplified RF signal. The second end of the second inductor unit is connected to the amplified DC signal.

9. The power amplifier according to any one of claims 1 to 8, characterized in that: The low frequency processing component comprises: a low-frequency operational amplifier configured to amplify the DC signal to obtain an intermediate signal; The low-pass filter is configured to filter the high-frequency components in the intermediate signal to obtain an amplified direct current signal.

10. A real-time oscilloscope, characterized in that: Comprising a power amplifier as claimed in any one of claims 1-9.

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