Printed circuit board, method for manufacturing printed circuit board, and display device

Abstract

The present application provides a printed circuit board, a method for manufacturing a printed circuit board, and a display device. The printed circuit board includes: multiple welding areas, each welding area is used to weld an electronic component, a welding area includes multiple pads, and the pads include shared pads and non-shared pads. The shared pads are used to weld with the target pins of the electronic component, and the non-shared pads are used to weld with the non-target pins of the electronic component. A non-shared pad corresponds to a circuit parameter of a welding circuit, wherein when the non-target pins of the electronic component are welded to different non-shared pads, the circuit parameters of the welding circuit connected on the printed circuit board are different, and the circuit parameters include the circuit type of the welding circuit and the signal voltage value of the welding circuit. The circuit board realizes pad reuse by optimizing the pad design of the printed circuit board, improves the space utilization of the device area, and reduces the packaging area.

Description

Technical Field

[0001] The present application relates to the field of printed circuit boards, and in particular, to a printed circuit board, a method for manufacturing a printed circuit board, and a display device. Background Art

[0002] Printed Circuit Board (PCB) is a plate-like substrate used to support and connect electronic components. Conductive lines are laid on it to transmit signals and power between electronic components. Printed circuit boards play a key role in electronic devices and are an important part of modern electronic products.

[0003] A printed circuit board is a substrate used to connect and support electronic components, with wires and other structured circuit elements on it. A display panel is a component used to display images or information, such as an LCD or LED display.

[0004] In many electronic devices, printed circuit boards are used to connect and support electronic components on display panels. For example, in a smartphone or tablet, the printed circuit board connects and supports the display, touch screen and other electronic components so that they can work properly.

[0005] In addition, the circuit design and layout on the printed circuit board will also affect the performance and function of the display panel. Therefore, when designing and manufacturing the display panel, the design and layout of the printed circuit board need to be considered to ensure good connection and cooperation between them. Therefore, the relationship between the printed circuit board and the display panel is inseparable.

[0006] As the size of display panels in the prior art is getting smaller and smaller, the requirements for space utilization and circuit reuse functions of circuit boards are higher, but the existing circuit boards can no longer meet the requirements for space utilization and circuit reuse functions. Summary of the invention

[0007] The main purpose of the present application is to provide a printed circuit board, a method for manufacturing a printed circuit board, and a display device, so as to at least solve the problem in the prior art that the space utilization rate of the circuit board is low and the circuit reuse function requirements cannot be met.

[0008] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a printed circuit board is provided, comprising: a plurality of welding areas, each welding area is used for welding an electronic component, one of the welding areas comprises a plurality of pads, the pads comprise common pads and non-common pads, the common pads are used for welding with the target pins of the electronic component, the non-common pads are used for welding with the non-target pins of the electronic component, one of the non-common pads corresponds to a circuit parameter of a welding circuit, wherein, when the non-target pins of the electronic component are welded to different non-common pads, the circuit parameters of the welding circuit connected on the printed circuit board are different, and the circuit parameters include the circuit type of the welding circuit and the signal voltage value of the welding circuit.

[0009] According to another aspect of the present application, a method for manufacturing any one of the printed circuit boards is provided, comprising: providing a substrate; forming a first preliminary conductive layer on a first surface of the substrate, performing a first patterning on the first preliminary conductive layer to obtain a first conductive layer; forming a first preliminary protective layer on a surface of the first conductive layer on a side away from the substrate, performing a second patterning on the first preliminary protective layer to obtain a first protective layer and a plurality of first openings, wherein the first conductive layer forms a plurality of first conductive portions at the plurality of first openings, one of the first conductive portions being a pad, and the first opening penetrating the first protective layer.

[0010] According to another aspect of the present application, a display device is provided, comprising: any one of the printed circuit boards described above.

[0011] Applying the technical solution of the present application, the above-mentioned printed circuit board includes: multiple welding areas, one welding area includes multiple pads, the pads include shared pads and non-shared pads, the shared pads are used to weld with the target pins of the electronic component, the non-shared pads are used to weld with the non-target pins of the electronic component, and one non-shared pad corresponds to a circuit parameter of a welding circuit, wherein, when the non-target pins of the electronic component are welded to different non-shared pads, the circuit parameters of the welding circuits connected on the printed circuit board are different, and the circuit parameters include the circuit type of the welding circuit and the signal voltage value of the welding circuit. The circuit board realizes the reuse of the pads by setting a common pad, and while providing a variety of circuit design solutions, it also improves the space utilization of the device area and reduces the packaging area, solving the problem that the space utilization of the circuit board in the prior art is low and cannot meet the circuit reuse function requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0013] Figure 1 A top view of a printed circuit board provided in an embodiment of the present application is shown;

[0014] Figure 2 A top view of another printed circuit board provided in an embodiment of the present application is shown;

[0015] Figure 3 A top view of another printed circuit board provided in an embodiment of the present application is shown;

[0016] Figure 4 A top view of another printed circuit board provided in an embodiment of the present application is shown;

[0017] Figure 5 A top view of another printed circuit board provided in an embodiment of the present application is shown;

[0018] Figure 6 A cross-sectional schematic diagram of a printed circuit board provided in an embodiment of the present application is shown;

[0019] Figure 7 A cross-sectional schematic diagram of another printed circuit board provided in an embodiment of the present application is shown;

[0020] Figure 8 A cross-sectional schematic diagram of another printed circuit board provided in an embodiment of the present application is shown;

[0021] Fig. 9 A cross-sectional schematic diagram of another printed circuit board provided in an embodiment of the present application is shown;

[0022] Fig.10 A cross-sectional schematic diagram of a four-layer printed circuit board provided in an embodiment of the present application is shown;

[0023] Fig.11 A cross-sectional schematic diagram of another four-layer printed circuit board provided in an embodiment of the present application is shown;

[0024] Fig.12 A cross-sectional schematic diagram of another printed circuit board provided in an embodiment of the present application is shown;

[0025] Fig.13 A schematic diagram of a process of manufacturing a printed circuit board provided in an embodiment of the present application is shown;

[0026] Fig.14 A schematic structural diagram of a substrate provided in an embodiment of the present application is shown;

[0027] Fig.15 Shown in Fig.14 A schematic structural diagram of forming a first conductive layer on the basis of;

[0028] Fig.16 A top view of the printed circuit board is shown after the first conductive layer is formed and before the first preliminary protective layer is formed;

[0029] Fig.17 shows a top view of the printed circuit board after the first conductive portion is formed;

[0030] Fig.18 Shown in Figure 6 A schematic structural diagram of forming a second conductive layer on the basis of;

[0031] Fig.19 A schematic structural diagram of a display device provided according to an embodiment of the present application is shown.

[0032] The above drawings include the following reference numerals:

[0033] 01. welding area; 03. printed circuit board; 04. display panel; 05. interface; 10. shared pad; 20. non-shared pad; 21. first non-shared pad; 22. second non-shared pad; 23. third non-shared pad; 30. substrate; 31. first sub-substrate; 32. second sub-substrate; 41. first conductive layer; 411. first conductive part; 42. second conductive layer; 43. first sub-conductive layer; 44. second sub-conductive layer; 45. third sub-conductive layer; 421. second conductive part; 51. first protective layer; 52. second protective layer; 60. via; 61. copper layer; 70. conductive structure; 71. first conductive structure; 72. second conductive structure; 80. adhesive layer; 90. anti-oxidation layer. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0037] For the convenience of description, some nouns or terms involved in the embodiments of the present application are explained below:

[0038] Printed Circuit Board: Printed Circuit Board, referred to as PCB;

[0039] Flexible Printed Circuit: Flexible Printed Circuit, referred to as FPC;

[0040] Liquid Crystal Display: Liquid Crystal Display, referred to as LCD;

[0041] Organic Light Emitting Diode: Organic Light Emitting Diode, referred to as OLED.

[0042] As introduced in the background technology, the size of display panels in the prior art is getting smaller and smaller. Therefore, the requirements for the space utilization and circuit reuse function of the circuit board are relatively high, and the existing circuit boards can no longer meet the requirements of space utilization and circuit reuse function. In order to solve the problem that the space utilization of circuit boards in the prior art is low and cannot meet the requirements of circuit reuse function, the embodiments of the present application provide a printed circuit board, a method for manufacturing a printed circuit board, and a display device.

[0043] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0044] In this embodiment, a printed circuit board is provided. Figure 1 Schematic diagram of the structure of a printed circuit board according to an embodiment of the present application. Figure 1As shown, the printed circuit board includes: multiple welding areas 01, each welding area 01 is used to weld an electronic component, a welding area 01 includes multiple pads, the pads include shared pads 10 and non-shared pads 20, the shared pads 10 are used to weld with the target pins of the electronic component, the non-shared pads 20 are used to weld with the non-target pins of the electronic component, and a non-shared pad 20 corresponds to a circuit parameter of a welding circuit, wherein, when the non-target pins of the electronic component are welded to different non-shared pads 20, the circuit parameters of the welding circuit connected on the printed circuit board are different, and the circuit parameters include the circuit type of the welding circuit and the signal voltage value of the welding circuit.

[0045] In some embodiments, the printed circuit board is a rigid printed circuit board or a flexible printed circuit board.

[0046] Flexible Printed Circuit (FPC) is a key component of display devices that is closely integrated with Liquid Crystal Display (LCD) and Organic Light Emitting Diode (OLED) panels. FPC has the advantages of small size, good flexibility and low cost, which makes the use of flexible screens more diverse. FPC is mainly responsible for connecting various functional components on the display screen, such as backlight unit, touch screen, camera, audio driver, etc. The reasonable design and layout of FPC has a very important impact on the display effect of the display screen.

[0047] At present, the design of flexible screen FPC mainly includes the following two aspects:

[0048] 1. On a specific flexible substrate, design circuits for connecting various functional components on the display screen, such as power circuits, signal processing circuits, audio circuits, etc.;

[0049] 2. According to the arrangement and connection relationship of components, rationally layout the FPC circuit to ensure that the FPC circuit can correctly and effectively connect various components.

[0050] As the size of flexible screens becomes smaller and smaller, the requirements for space utilization and circuit reuse functions of circuit boards are higher, but existing circuit boards can no longer meet the requirements for space utilization and circuit reuse functions.

[0051] In PCB design, the soldering area refers to an area reserved for specific electronic components, which contains a series of pads and is used to fix the electronic components to the PCB through soldering. In order to meet the needs of various circuits, different circuit parameters can be achieved on the same PCB according to the different pads where the electronic components are soldered. The circuit parameters include the circuit type (such as digital circuit, analog circuit, hybrid circuit, etc.) and the signal voltage value (such as 3.3V, 5V, etc.). When the pins of the electronic components are soldered on different non-shared pads, they will be connected into circuits with different parameters.

[0052] For example, when one pin of a two-pin electronic component is soldered on a common pad and the other pin is soldered on the first non-common pad, the signal voltage value provided to the electronic component by the connected circuit is 5V. When one pin of the electronic component is soldered on a common pad and the other pin is soldered on a second non-common pad, the signal voltage value provided to the electronic component by the connected circuit is 10V. This not only provides a variety of circuit designs, but also saves space on the printed circuit board.

[0053] like Figure 2 As shown, the printed circuit board in the prior art does not have a design of shared pads, that is, for an electronic component with two pins, if two circuit designs are to be implemented, four pads will be designed, that is, when the pins of the electronic component are soldered on the first pad and the second pad, the signal voltage value provided to the electronic component by the connected circuit is 5V, and when the pins of the electronic component are soldered on the third pad and the fourth pad, the signal voltage value provided to the electronic component by the connected circuit is 10V. Although this provides a variety of circuit designs, the space utilization rate on the printed circuit board is low. Specifically, Figure 2 As shown, the printed circuit board of this embodiment saves the area of ​​the pad A in the figure compared with the printed circuit board of the prior art due to the design of the shared pad, thereby greatly improving the space utilization rate on the printed circuit board.

[0054] It should be noted that the above circuit design is for illustration only, and different connection circuits are not limited to different signal voltage values, and need to be set according to the circuit design of actual needs.

[0055] By designing multiple non-shared pads, and each non-shared pad corresponds to different circuit parameters, the characteristics of the circuit can be adjusted by selecting different non-shared pads for welding, increasing the flexibility of circuit design, saving space and cost. This design is particularly suitable for occasions where circuit parameters need to be quickly adjusted according to different application scenarios or configurations. For example, in product compatibility design, pad reuse can reduce the package area and improve the space utilization of the device area, thereby saving costs and achieving a more compact product design.

[0056] The above-mentioned printed circuit board of the present application includes: multiple welding areas, one welding area includes multiple pads, the pads include shared pads and non-shared pads, the shared pads are used to weld with the target pins of the electronic component, the non-shared pads are used to weld with the non-target pins of the electronic component, and one non-shared pad corresponds to a circuit parameter of a welding circuit, wherein, when the non-target pins of the electronic component are welded to different non-shared pads, the circuit parameters of the welding circuits connected on the printed circuit board are different, and the circuit parameters include the circuit type of the welding circuit and the signal voltage value of the welding circuit. The circuit board realizes the reuse of pads by setting common pads, and while providing a variety of circuit design solutions, it also improves the space utilization of the device area and reduces the packaging area, solving the problem that the space utilization of the circuit board in the prior art is low and cannot meet the circuit reuse function requirements.

[0057] In some instances, such as Figure 3 As shown, there are two non-shared pads, namely a first non-shared pad 21 and a second non-shared pad 22. The first non-shared pad 21, the shared pad 10 and the second non-shared pad 22 are arranged in sequence along a first direction on the printed circuit board, and the first direction is a direction parallel to the welding area 01.

[0058] Specifically, the first direction can be Figure 3 The a direction in the Figure 3 The b direction in the Figure 3 The specific direction setting is related to the circuit routing of the printed circuit board. Figure 3 As shown, the printed circuit board in the prior art does not have a design of shared pads, that is, for an electronic component with two pins, if two circuit designs are to be implemented, four pads will be designed, and the four pads are grouped in pairs. The two groups of pads can be arranged in parallel or vertically. When the pins of the electronic component are soldered on the first pad and the second pad, the circuit structure at this time is the first structure. When the pins of the electronic component are soldered on the third pad and the fourth pad, the circuit structure at this time is the second structure. Although this provides a variety of circuit designs, the space utilization rate on the printed circuit board is low. Specifically, Figure 3 As shown, the printed circuit board of this embodiment saves the area of ​​the pad B in the figure compared with the printed circuit board of the prior art due to the design of the shared pad, thereby greatly improving the space utilization rate on the printed circuit board.

[0059] In some instances, such as Figure 1As shown, there are two non-shared pads 20, namely a first non-shared pad 21 and a second non-shared pad 22. The shared pad 10 and the first non-shared pad 21 are arranged in sequence along the second direction on the printed circuit board, and the shared pad 10 and the second non-shared pad 22 are arranged in sequence along the third direction on the printed circuit board. The second direction and the third direction are both parallel to the welding area 01, and the second direction is different from the third direction.

[0060] Specifically, the number of shared pads and the number of non-shared pads are related to the number of pins of the electronic component, and the number of non-shared pads is also related to the number of design schemes of the circuit of the soldered circuit board.

[0061] If an electronic component has two pins and there are two design schemes for the circuit of the soldering circuit board, one for providing 5V voltage and the other for providing 10V voltage, then the structure of the soldering circuit board is as follows: Figure 1 As shown, it includes a first non-shared pad 21 and a second non-shared pad 22, and when one of the pins of the electronic component is soldered on the shared pad 10 and the other pin is soldered on the first non-shared pad 21, the circuit is designed to provide a 5V voltage to the electronic component, and when one of the pins of the electronic component is soldered on the shared pad 10 and the other pin is soldered on the second non-shared pad 22, the circuit is designed to provide a 10V voltage to the electronic component.

[0062] If an electronic component has two pins and there are three circuit design schemes for welding the circuit board, which provide 5V voltage, 10V voltage and 15V voltage respectively, then the structure of the welding circuit board is as follows: Figure 4 As shown, it includes a first non-shared pad 21, a second non-shared pad 22 and a third non-shared pad 23, and when one of the pins of the electronic component is soldered on the shared pad 10 and the other pin is soldered on the first non-shared pad 21, the circuit is designed to provide a 5V voltage to the electronic component, when one of the pins of the electronic component is soldered on the shared pad 10 and the other pin is soldered on the second non-shared pad 22, the circuit is designed to provide a 10V voltage to the electronic component, and when one of the pins of the electronic component is soldered on the shared pad 10 and the other pin is soldered on the third non-shared pad 23, the circuit is designed to provide a 15V voltage to the electronic component.

[0063] If the electronic component has three pins, and there are two design schemes for the circuit of the welding circuit board, one is to provide 5V voltage and the other is to provide 10V voltage, then the structure of the welding circuit board is as follows: Figure 5As shown, it includes a first common pad 11, a second common pad 12, a first non-common pad 21 and a second non-common pad 22. When the first pin of the electronic component is soldered on the first common pad 11, the second pin is soldered on the second common pad 12, and the third pin is soldered on the first non-common pad 21, the circuit is designed to provide a 5V voltage to the electronic component. When the first pin of the electronic component is soldered on the first common pad 11, the second pin is soldered on the second common pad 12, and the third pin is soldered on the second non-common pad 22, the circuit is designed to provide a 10V voltage to the electronic component.

[0064] It should be noted that the number of shared pads and the number of non-shared pads mentioned above are examples. According to the number of pins of electronic components and the circuit design, the number of shared pads, the number of non-shared pads and the design positions of the pads can be adjusted accordingly.

[0065] In some examples, the projection of the pad on the substrate of the printed circuit board is a closed figure, the projections of any two pads on the substrate of the printed circuit board have the same or different shapes, and the shape of the pad is any one of rectangular, circular, and elliptical.

[0066] Specifically, the pad is the metal area on the PCB used to solder the pins of electronic components. When observing the projection of the pad on the PCB substrate, it should be a complete and uninterrupted shape. This is because the pad needs to provide sufficient contact area and stability when soldering electronic components. The closed pattern can ensure sufficient support for the pins when soldering, and it is also easy to identify and operate the automated soldering equipment.

[0067] On a PCB, different pads may have different shapes and sizes, depending on the requirements of the electronic component pins they are connected to and the needs of the circuit design. The projection of any two pads on the substrate can be the same shape, such as all pads used to connect the same type of devices are designed to be circular; or they can be different shapes, such as some pads are designed to be rectangular to facilitate the connection of large devices, while other pads are designed to be circular or oval to accommodate small devices or specific layout requirements.

[0068] The shape of the pad can be any of rectangular, circular, and elliptical. Each shape has its specific application scenario:

[0069] Rectangular pads: usually used to connect rectangular or long pins of electronic components, such as resistors, capacitors, etc. Rectangular pads can provide a larger contact area, which is conducive to enhancing the stability and reliability of welding.

[0070] Round pad: Suitable for round or small-sized pins, especially when space is limited or a more compact layout is required. Round pads can avoid sharp corners, reduce stress concentration, and improve the mechanical strength of the solder joint.

[0071] Oval pads: In some cases, oval pads can provide a contact area and shape between rectangular and circular, suitable for situations where specific directionality is required or the shape of the solder joint is optimized within a limited space.

[0072] In summary, the shape and layout design of pads are important components in PCB design, which directly affect the welding quality of electronic components and the processing technology of circuit boards. By flexibly designing the shape and layout of pads, the space utilization of PCBs can be optimized, the performance and reliability of circuit boards can be enhanced, and it also helps to improve production efficiency and reduce costs.

[0073] In some instances, such as Figure 6 As shown, the printed circuit board also includes: a substrate 30; a first conductive layer 41, located on the first surface of the substrate 30; a first protective layer 51, located on the surface of the first conductive layer 41 on the side away from the substrate 30, the first protective layer 51 is provided with a plurality of first openings, the first conductive layer 41 forms a plurality of first conductive parts 411 at the plurality of first openings, the first openings correspond to the first conductive parts 411 one by one, one first conductive part 411 is a pad, and the first opening passes through the first protective layer 51.

[0074] The first conductive layer is equivalent to the wire part in the circuit, forming different circuit structures, and the electronic components are connected to the circuit by soldering them on different pads to form a complete circuit structure. Due to the setting of the first conductive layer, the circuit structures formed when the electronic components are soldered on different pads are different.

[0075] In some instances, such as Figure 7 As shown, the printed circuit board also includes: a second conductive layer 42, located on the second surface of the substrate 30, the first surface and the second surface are arranged opposite to each other; a second protective layer 52, located on the side surface of the second conductive layer 42 away from the substrate 30, the second protective layer 52 is provided with a plurality of second openings, the second conductive layer 42 forms a plurality of second conductive parts 421 at the plurality of second openings, one second conductive part 421 is a pad, and the second opening runs through the second protective layer 52.

[0076] Among them, in single-sided PCB, all wiring must be completed on the same plane, which limits the complexity and wiring density of the circuit. Double-sided PCB or PCB with more layers can significantly increase the available wiring space by setting conductive layers on both surfaces of the substrate, and at the same time can accommodate more electronic components and more complex circuit networks in a limited space.

[0077] In addition, in high-speed circuits, signal integrity is very critical. Double-sided or multi-layer PCBs can enhance the shielding performance of the circuit, reduce crosstalk between signals, and improve signal quality by adding plane layers such as power planes or ground planes between the top and bottom layers. These plane layers can also be used for the distribution of power and ground to stabilize voltage and current and reduce noise. That is, the setting of double-sided PCB not only saves space, but also can make the signal interference between circuits weaker.

[0078] In circuits that require high power or generate a lot of heat, double-sided or multi-layer PCBs can improve the heat dissipation performance of the circuit board by setting a large area of ​​grounding layer or heat dissipation layer on the bottom layer to protect the circuit and electronic components from overheating. The design of double-sided or multi-layer PCBs can meet the needs of modern electronic devices for complex circuits, high signal integrity, good power distribution, reliable mechanical performance and efficient heat dissipation, and is one of the key technologies for achieving high-performance, high-density circuit boards.

[0079] The thickness of the substrate is generally in the range of 20 μm to 25 μm, the thickness of the conductive layer (including the first conductive layer and the second conductive layer) is generally 12 μm, and the thickness of the protective layer (including the first protective layer and the second protective layer) is generally 15 μm.

[0080] The substrate of a printed circuit board is usually an insulating material that supports the electronic components and conductive traces on the circuit board. Common substrate materials include:

[0081] FR-4: This is a composite material made of epoxy resin and glass fiber, which has good electrical insulation performance and mechanical strength. It is the most common substrate in PCBs.

[0082] Polyimide: In printed circuit boards, polyimide is a high-performance polymer that is widely used due to its high flexibility and heat resistance.

[0083] Epoxy resin substrate: suitable for PCBs with some special requirements, such as high-frequency circuit boards and high-density interconnect (HDI) circuit boards.

[0084] Ceramic Substrates: Ceramic substrates are used in applications that require extremely high thermal stability and a low coefficient of thermal expansion, such as microwave circuits and high-power electronic devices.

[0085] In some instances, such as Figure 6 As shown, the material of the first conductive layer 41 is copper.

[0086] The conductive layer is usually made of copper or silver. Copper is the most commonly used conductive layer material, with good conductivity and solderability, and is easy to process. Silver has extremely high conductivity, but is not as good as copper in terms of cost and oxidation resistance, and is usually used in some high-performance circuit boards.

[0087] The protective layer is used to protect the conductive layer from corrosion, wear and short circuit, and provide good insulation performance. The protective layer is provided with openings to expose the pad area, and these openings penetrate the protective layer so that the pad can contact the pin of the electronic component. Common protective layer materials include: Solder resist: A coating made of materials such as photosensitive resin, which is used to prevent non-welding areas from being covered by solder during the soldering process to ensure the reliability of the circuit board. Epoxy resin or polyimide coating: In some high-end or special PCBs, epoxy resin or polyimide is used as a protective layer to provide higher protection performance and heat resistance.

[0088] When the printed circuit board is a hard PCB board, the first protective layer may be an oily material. When the printed circuit board is a flexible printed circuit board, the protective layer may be a PI material.

[0089] The choice of these materials depends on the specific application of the PCB, circuit design requirements, production costs and environmental factors. For example, in a flexible circuit board, the substrate may choose polyimide, while the conductive layer and protective layer may use copper and photosensitive solder resist to ensure the flexibility and stability of the circuit board. In high-frequency circuits or high-power applications, the substrate may choose a low dielectric constant material, while the conductive layer may use thicker copper or silver, and the protective layer may require a higher performance material to adapt to special working environments and requirements.

[0090] In some instances, such as Figure 8 As shown, the first conductive layer 41 is connected to the second conductive layer 42 through a via 60 , and the via 60 passes through the substrate 30 .

[0091] Double-sided or multi-layer PCBs allow connections to be made between different conductive layers, which are usually achieved through through-holes or blind or buried vias. Interlayer connections enable circuit boards to achieve more complex and efficient signal and power paths, making it easier to design complex circuit structures and achieve high-performance circuit boards.

[0092] Specifically, Figure 8 As shown, the first conductive layer 41 and the second conductive layer 42 can be two independent circuit structures, or they can be connected into one circuit structure through the via 60. When the first conductive layer 41 and the second conductive layer 42 are connected through the via 60, the via 60 penetrates the substrate 30. When the electronic component is a surface-mount component, the routing of the first conductive layer 41 and the routing of the second conductive layer 42 can be different. When the electronic component is a plug-in component, if the electronic component needs to be inserted from the front side of the printed circuit board (the side where the first conductive layer is located) to the back side for soldering, the routing of the first conductive layer 41 and the routing of the second conductive layer 42 must be the same.

[0093] like Figure 8As shown, since the substrate 30 itself is not conductive, in order to electrically connect the first conductive layer 41 and the second conductive layer 42, it is necessary to plate copper on both sides of the via 60 to obtain a copper layer 61 on the side wall of the via, that is, the first conductive layer 41 and the second conductive layer 42 are electrically connected by punching copper-plated holes in the substrate.

[0094] The drilling stage of PCB manufacturing usually uses mechanical drilling, laser drilling or water jet drilling to form holes on the substrate. Mechanical drilling is the most common method and is suitable for the production of most holes; laser drilling is more suitable for the production of small diameter holes or blind holes and buried holes; water jet drilling is less used and is mainly used for holes of special materials or special shapes.

[0095] Once the hole is formed, the next step is to activate the hole wall surface to facilitate the subsequent copper plating. The activation process can be chemical or electrochemical methods, such as chemical etching, plasma treatment or chemical deposition, etc. The purpose is to remove the oxide layer and contaminants on the hole wall so that the surface can be well combined with the copper plating solution.

[0096] After the hole wall is activated, copper plating is carried out next, which is to deposit a layer of copper on the hole wall by electroplating or chemical plating to form a conductive hole wall. Electroplating is the most common copper plating method, which uses electric current to deposit copper ions on the hole wall to form a uniform copper layer to ensure that the hole has good conductivity. Chemical copper plating does not rely on current and is suitable for copper plating of hole walls in non-conductive areas, such as the manufacture of blind and buried holes.

[0097] The thickness of the copper plating layer depends on the type of hole and the specific requirements of the PCB design. The copper plating layer of the through hole is usually thicker to ensure sufficient mechanical strength and electrical performance; while the plating layer of the blind and buried vias may be thinner, but still needs to ensure reliable electrical connection.

[0098] The technology of drilling copper-plated holes in substrates is a key step in realizing multi-layer PCBs, which can connect the conductive paths of different layers, enabling PCBs to have higher wiring density and more complex circuit design capabilities. During the manufacturing process, the accuracy and quality of drilling and copper-plated holes directly affect the performance and reliability of PCBs, so it is necessary to accurately control the size and position of the holes, as well as the uniformity and thickness of the copper-plated layer to meet the design requirements.

[0099] This technology is of great significance in PCB manufacturing. It promotes the development of PCB towards higher density, smaller size and more complex design, meeting the demand of modern electronic equipment for high performance and compact size. With the continuous advancement of PCB technology, the technology of punching and copper plating holes is also constantly innovating, such as laser direct hole forming, automatic control of electroplated copper, and improvement of chemical copper plating, in order to improve production efficiency, reduce costs and ensure product quality.

[0100] In some instances, such as Fig. 9As shown, the printed circuit board also includes at least one conductive structure 70, wherein, in the case where the printed circuit board includes multiple conductive structures 70, the conductive structure 70 is sequentially arranged between the first conductive layer 41 and the first protective layer 51, or, the conductive structure 70 is sequentially arranged between the second conductive layer 42 and the second protective layer 52, or, a part of the conductive structure 70 is sequentially arranged between the first conductive layer 41 and the first protective layer 51 and another part of the conductive structure 70 is sequentially arranged between the second conductive layer 42 and the second protective layer 52; in the case where the printed circuit board includes one conductive structure 70, the conductive structure 70 is arranged between the first conductive layer 41 and the first protective layer 51, or, the conductive structure 70 is arranged between the second conductive layer 42 and the second protective layer 52.

[0101] The conductive structure is a double-sided board structure or a single-sided board structure. The double-sided board is a structure in which the first surface and the second surface of the substrate are respectively provided with the first conductive layer and the second conductive layer. The single-sided board is a structure in which only one of the first surface and the second surface of the substrate is provided with a conductive layer. A multilayer board can be obtained by arbitrarily combining at least one double-sided board and at least one single-sided board. The number of layers of the multilayer board is the same as the number of layers of the conductive layer.

[0102] In some instances, such as Fig.10 and Fig.11 As shown, the conductive structure 70 is a first conductive structure 71 or a second conductive structure 72, wherein the first conductive structure 71 includes a first sub-conductive layer 43, a first sub-substrate 31 and a second sub-conductive layer 44 arranged in sequence; the second conductive structure 72 includes a second sub-substrate 32 and a third sub-conductive layer 45 arranged in sequence.

[0103] The multilayer board structure is to first manufacture multiple single-sided boards or double-sided boards separately, that is, to manufacture each conductive structure separately, and then to bond each conductive structure together to make a multilayer board. Fig.10 and Fig.11 As shown, two adjacent single-sided boards or double-sided boards are bonded together using an adhesive layer 80 . Fig.10 In the figure, the first conductive layer 41, the substrate 30 and the second conductive layer 42 are a double-layer board, and the first conductive structure 71 composed of the first sub-conductive layer 43, the first sub-substrate 31 and the second sub-conductive layer 44 is also a double-layer board. The two double-layer boards are bonded into a four-layer board through the adhesive layer 80. Fig.11 In the figure, the first conductive layer 41, the substrate 30 and the second conductive layer 42 form a double-sided board, the second conductive structure 72 composed of the second sub-substrate 32 and the third sub-conductive layer 45 is a single-sided board, and a double-sided board and two single-sided boards are bonded into a four-layer board through an adhesive layer 80.

[0104] The adhesive layer 80 may be made of soft glue, or epoxy resin or other materials.

[0105] It should be noted that the number of single-sided boards and double-sided boards and the structure of the multi-layer boards are only an embodiment. Single-sided boards and double-sided boards can be arbitrarily combined according to actual needs to obtain the required multi-layer boards.

[0106] The structure of multi-layer printed circuit boards (Multi-layer PCB) has many significant benefits compared to single-layer or double-layer PCBs, which make multi-layer PCBs the first choice for many high-performance and high-density electronic devices. The following are the main benefits of multi-layer board structure:

[0107] Increased wiring density: Multilayer PCBs can significantly increase the wiring density of the circuit board by creating electrical connections between multiple internal layers of the substrate. This allows for more complex circuit designs, where more electronic components can be closely arranged in a limited space without causing wiring conflicts or signal interference issues.

[0108] Improve signal integrity: In multi-layer PCB design, power and ground layers can be specially set up, which can provide shielding for signal lines, reduce crosstalk between signals, and improve signal integrity. In addition, the path of signal lines can be optimized to reduce signal delay and reflection, which is especially important for high-speed digital signals and high-frequency analog signals.

[0109] Implementation of advanced packaging technology: Multilayer PCB design can support more advanced packaging technologies, such as chip scale package (CSP), ball grid array (BGA) and system-in-package (SiP). These packaging technologies require high-density I / O pin connections, and multilayer PCBs can provide enough space and connection points to meet these requirements.

[0110] Enhanced mechanical strength and heat dissipation performance: Multilayer PCB can improve the overall mechanical strength of the circuit board by adding interlayer materials and strengthening interlayer connections. In addition, the multilayer structure can design a more effective heat dissipation path, such as directly connecting the heat source to the heat dissipation layer or metal backplane to improve the heat dissipation performance of the circuit board.

[0111] Save space and cost: For complex circuit designs, using multi-layer PCBs can save overall space, because many wiring can be done on the inner layer without taking up outer layer space. In addition, although the manufacturing cost of multi-layer PCBs is higher than that of single-layer or double-layer boards, by optimizing the design and reducing the use of external connectors and cables, the overall system cost and assembly cost can be reduced.

[0112] Design flexibility and modularity: Multi-layer PCB design provides greater flexibility, allowing different circuit modules or functions to be distributed on different layers for easy design and testing. This is also conducive to modular circuit design, making it easier to upgrade or maintain the circuit board.

[0113] In some instances, such as Fig.10 and Fig.11 As shown, at least two layers among the first conductive layer 41 , the second conductive layer 42 , the first sub-conductive layer 43 , the second sub-conductive layer 44 and the third sub-conductive layer 45 are connected through vias.

[0114] Specifically, the conductive layers of a multi-layer PCB can be connected arbitrarily through vias (not shown in the figure), allowing wiring in the vertical direction, that is, establishing connections between different layers through through holes, blind holes and buried holes, which makes 3D wiring and component layout possible, further improving the space utilization and performance of the circuit board. Multi-layer PCB design provides higher circuit integration, better signal and power management, enhanced mechanical and heat dissipation performance, and greater design flexibility.

[0115] In multi-layer printed circuit boards (PCBs), vias are key components for electrical connections between layers, making it possible to achieve high-density, high-performance, and complex circuit designs. The following are some of the main benefits of using vias to connect multi-layer boards:

[0116] Electrical connectivity: Vias (including through holes, blind holes and buried holes) allow electrical connections between layers, ensuring the integrity of the circuit. Whether it is a signal line, power line or ground line, vias can provide the necessary paths to allow signals and power to be transmitted smoothly between different internal layers.

[0117] Increased wiring density: In multi-layer PCBs, the use of vias allows designers to route on different layers without having to worry about "dead ends" on the lines. This means that more complex circuit designs can be implemented in a limited space, with denser wiring layouts, thus saving space and making the PCB more compact.

[0118] Signal integrity: By using vias in multi-layer PCBs, signal lines can be isolated and interference and crosstalk between signals can be reduced. For example, power and ground lines can be placed on separate layers and connected to the required circuits through vias, thereby improving signal quality and ensuring the stability and reliability of the circuit.

[0119] Design flexibility: The use of vias increases design flexibility, allowing designers to arrange components and wiring more freely without being restricted by single-layer wiring. This helps optimize circuit layout and reduce unnecessary line length, thereby reducing signal delays and improving circuit performance.

[0120] Modularity and scalability: Vias support the modular design of circuit boards, allowing independent circuit modules to be implemented on different layers while being connected together through vias, which facilitates future upgrades or expansions.

[0121] Cost-effectiveness: Although the manufacturing cost of multi-layer PCBs is generally higher than that of single-layer or double-layer PCBs, high-density routing and optimized circuit layout achieved through vias can reduce the required board size, thereby reducing material costs and assembly costs, saving total costs in the long run.

[0122] In some instances, such as Fig.12 As shown, the printed circuit board further includes an anti-oxidation layer 90 , which is located on a surface of the first conductive portion 411 facing away from the substrate 30 .

[0123] Among them, after the PCB is manufactured, its copper conductor is easily exposed to the air and reacts with oxygen to form copper oxide, which will reduce the welding performance and conductivity. The anti-oxidation layer can effectively isolate the copper conductor from the air, prevent the formation of the oxide layer, and ensure that the PCB can still maintain good welding performance after long-term storage. That is, the anti-oxidation layer is used to protect the pads during the transportation of the printed circuit board. Since the exposed conductive part is easily oxidized and the conductive performance becomes weak, the anti-oxidation layer is set on the surface of the side of the first conductive part away from the substrate to prevent the pads from oxidizing during the transportation of the printed circuit board. When the printed circuit board is put into use, the anti-oxidation layer can be removed and it can be used normally.

[0124] In this embodiment, a method for manufacturing any one of the printed circuit boards is also provided, such as Figure 6 , Fig.13 , Fig.14 and Fig.15 As shown, the method comprises the following steps:

[0125] Step S101, providing a substrate 30; the structure of the substrate 30 is as follows Fig.14 As shown;

[0126] Step S102, forming a first preliminary conductive layer on the first surface of the substrate 30, and performing a first patterning on the first preliminary conductive layer to obtain a first conductive layer 41; the structure of the first conductive layer 41 is as follows: Fig.15 As shown;

[0127] Step S103, forming a first preliminary protective layer on the surface of the first conductive layer 41 facing away from the substrate 30, performing a second patterning on the first preliminary protective layer to obtain a first protective layer 51 and a plurality of first openings, wherein the first conductive layer 41 forms a plurality of first conductive portions 411 at the plurality of first openings, wherein each first conductive portion 411 is a pad, and the first opening penetrates the first protective layer 51. The structure of the first protective layer 51 and the first conductive portion 411 is as shown in FIG. Figure 6 shown.

[0128] The first patterning and the second patterning have different patterns. The first patterning is to etch the first preliminary conductive layer to form a circuit trace to form a first conductive layer. Fig.16FIG. 1 is a top view of a printed circuit board after forming a first conductive layer and before forming a first preliminary protective layer. Fig.16 As shown, the first surface of the substrate 30 is a first conductive layer 41, and the wiring shape of the first conductive layer 41 is "W". The second patterning is to etch a pad on the first protective layer, that is, to etch away part of the first protective layer to expose part of the first conductive layer to obtain a first conductive portion. Fig.17 FIG. 1 is a top view of a printed circuit board after forming the first conductive portion. Fig.17 As shown, only the first conductive portion 411 (ie, the pad) and the first protection layer 51 are exposed on the surface of the final printed circuit board.

[0129] It should be noted that the above embodiment takes a single-sided board as an example, that is, the above steps are steps for manufacturing a single-sided board.

[0130] In some instances, such as Figure 7 and Fig.18 As shown, the method also includes the following steps:

[0131] Step S202, forming a second preliminary conductive layer on the second surface of the substrate 30, and performing a third patterning on the second preliminary conductive layer to obtain a second conductive layer 42;

[0132] In step S203, a second preliminary protective layer is formed on the surface of the second conductive layer 42 facing away from the substrate 30, and the second preliminary protective layer is subjected to a fourth patterning to obtain a second protective layer and a plurality of second openings. The second conductive layer 42 forms a plurality of second conductive portions 421 at the plurality of second openings, and one second conductive portion 421 is a pad. The second opening penetrates the second protective layer 52.

[0133] Among them, the patterns in the third patterning and the fourth patterning are different. The third patterning is to etch the circuit wiring from the second preliminary conductive layer to form a second conductive layer. The fourth patterning is to etch a pad on the second protective layer, that is, to etch away part of the second protective layer to expose part of the second conductive layer to obtain a second conductive portion. The patterns of the first patterning and the third patterning can be the same or different. Similarly, the patterns of the second patterning and the fourth patterning can be the same or different.

[0134] In addition, conductive layer patterning is a key step in the manufacturing process of printed circuit boards (PCBs), the purpose of which is to form a predetermined circuit pattern on the substrate to achieve electrical connections between electronic components. This process usually involves multiple technical steps, and the specific technical means include:

[0135] Lithography: This is the most common method for patterning conductive layers, similar to the photolithography process in semiconductor manufacturing. First, a layer of photoresist is applied to the conductive layer (usually the copper layer). Then, the photoresist is exposed using a photomask and ultraviolet light, and the photoresist hardens in the areas exposed to light. Next, the unexposed photoresist is removed by developing, leaving the pattern of the protective layer. Finally, a chemical etchant is used to etch away the copper layer not covered by the photoresist, leaving the desired conductive pattern. After exposure, the photoresist is removed to complete the patterning of the conductive layer.

[0136] Laser Direct Imaging (LDI): This is a more advanced patterning technology that uses lasers to form patterns directly on the conductive layer without the need for traditional photolithography and development processes. The laser can accurately etch or activate the surface of the conductive layer, and then directly deposit metal to form a circuit pattern, or remove unnecessary insulating layers to expose copper conductors. LDI technology can provide higher precision and faster processing speeds.

[0137] Electroplating: In PCB manufacturing, electroplating technology is often used to increase the thickness of the conductive layer, especially in the metallization process of vias, blind holes and buried holes. Electroplating deposits metal ions on the surface of the conductor through electric current to form a thicker conductive layer to improve mechanical strength and electrical performance.

[0138] Metal Mask: This is a technology similar to screen printing, which uses a metal mask to cover areas that do not need to be conductive, and then deposits conductive materials in the exposed areas to form circuit patterns. This method is usually used for low-cost, high-volume PCB manufacturing.

[0139] The choice of technology for patterning the conductive layer depends on the design complexity, precision requirements, cost budget and batch size of the PCB. For high-precision, high-density PCBs, photolithography and laser direct structuring are the first choice; while for cost-sensitive, mass-production applications, technologies such as chemical deposition and metal masks may be more applicable.

[0140] The manufacturing method of the printed circuit board of the present application first forms a first preliminary conductive layer on the first surface of the substrate, performs a first patterning on the first preliminary conductive layer to obtain a first conductive layer; then forms a first preliminary protective layer on the surface of the first conductive layer facing away from the substrate, performs a second patterning on the first preliminary protective layer to obtain a plurality of first openings and a first protective layer, wherein the first conductive layer forms a plurality of first conductive parts at the plurality of first openings, one first conductive part is a pad, and the first opening runs through the first protective layer. This method realizes the reuse of pads by setting a common pad, and while providing a variety of circuit design solutions, it also improves the space utilization of the device area, reduces the packaging area, and solves the problem in the prior art that the space utilization of the circuit board is low and cannot meet the circuit reuse function requirements.

[0141] In this embodiment, a display device is also provided. Fig.19 As shown, the printed circuit board 03 includes any one of the above embodiments. The display device also includes a display panel 04 and an interface 05 , that is, the printed circuit board 03 is a bridge connecting the display panel 04 and the interface 05 .

[0142] The interface is the AP-side interface, i.e., the Application Processor port or interface. The Application Processor is one of the core components in modern smart devices (such as smartphones, tablets, smart TVs, etc.), responsible for running operating systems, applications, and processing various input and output data. In the context of display technology, the AP side can be understood as the connection point between the application processor and the display panel, which is responsible for transmitting image data, control signals, and possible other information (such as touch information) from the application processor to the display panel.

[0143] Specifically, the AP may include the following functions or components:

[0144] Data transmission interface: such as MIPI (Mobile Industry Processor Interface) DSI (Display Serial Interface) or LVDS (Low-Voltage Differential Signaling), used for high-speed transmission of image data.

[0145] Control signal interface: used to send control commands, such as turning the display on and off, adjusting the brightness, controlling the refresh rate, etc.

[0146] Touch information interface: In a touch screen device, the AP also needs to process the signals from the touch screen sensor so that the application processor can respond according to the user's touch operation.

[0147] Power management interface: responsible for distributing power from the device's power management system to the display panel to ensure the normal operation of the display panel.

[0148] The display device provided in this embodiment may be an array substrate or a terminal display device, such as a mobile phone, a computer, a television, or other display devices with display functions, and the present invention does not specifically limit this. The display device provided in the embodiment of the present invention has the beneficial effects of the gate drive circuit provided in the embodiment of the present invention, and the details can be referred to the above embodiments. The specific description of the gate drive circuit is not repeated in this embodiment.

[0149] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0150] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0151] 1) The printed circuit board of the present application comprises: a plurality of welding areas, a welding area comprises a plurality of pads, the pads comprise shared pads and non-shared pads, the shared pads are used to weld with the target pins of the electronic components, the non-shared pads are used to weld with the non-target pins of the electronic components, a non-shared pad corresponds to a circuit parameter of a welding circuit, wherein, when the non-target pins of the electronic components are welded to different non-shared pads, the circuit parameters of the welding circuits connected on the printed circuit board are different, and the circuit parameters include the circuit type of the welding circuit and the signal voltage value of the welding circuit. The circuit board realizes the reuse of the pads by setting a common pad, and while providing a variety of circuit design solutions, it also improves the space utilization of the device area, reduces the packaging area, and solves the problem in the prior art that the space utilization of the circuit board is low and cannot meet the circuit reuse function requirements.

[0152] 2) The manufacturing method of the printed circuit board of the present application is as follows: first, a first preliminary conductive layer is formed on the first surface of the substrate, and the first preliminary conductive layer is patterned to obtain a first conductive layer; then, a first preliminary protective layer is formed on the surface of the first conductive layer facing away from the substrate, and the first preliminary protective layer is patterned to obtain a plurality of first openings and a first protective layer, wherein the first conductive layer forms a plurality of first conductive parts at the plurality of first openings, and a first conductive part is a pad, and the first opening runs through the first protective layer. This method realizes the reuse of pads by setting a common pad, and while providing a variety of circuit design solutions, it also improves the space utilization of the device area, reduces the packaging area, and solves the problem in the prior art that the space utilization of the circuit board is low and cannot meet the circuit reuse function requirements.

[0153] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A printed circuit board, characterized in that: include: A plurality of welding areas, each welding area is used for welding an electronic component, a plurality of pads are included in one welding area, the pads include shared pads and non-shared pads, the shared pads are used for welding with target pins of the electronic component, the non-shared pads are used for welding with non-target pins of the electronic component, one non-shared pad corresponds to a circuit parameter of a welding circuit, wherein when the non-target pins of the electronic component are welded to different non-shared pads, the circuit parameters of the welding circuit connected on the printed circuit board are different, and the circuit parameters include the circuit type of the welding circuit and the signal voltage value of the welding circuit.

2. The printed circuit board according to claim 1, characterized in that: There are two non-shared pads, namely a first non-shared pad and a second non-shared pad. The first non-shared pad, the shared pad and the second non-shared pad are arranged in sequence along a first direction on the printed circuit board, and the first direction is a direction parallel to the welding area.

3. The printed circuit board according to claim 1, characterized in that: There are two non-shared pads, namely a first non-shared pad and a second non-shared pad. The shared pad and the first non-shared pad are arranged in sequence along a second direction on the printed circuit board, and the shared pad and the second non-shared pad are arranged in sequence along a third direction on the printed circuit board. The second direction and the third direction are both parallel to the welding area, and the second direction is different from the third direction.

4. The printed circuit board according to claim 1, characterized in that: The projection of the pad on the substrate of the printed circuit board is a closed figure, the shapes of the projections of any two pads on the substrate of the printed circuit board are the same or different, and the shape of the pad is any one of rectangular, circular and elliptical.

5. The printed circuit board according to claim 1, characterized in that: The printed circuit board also includes: Base material; A first conductive layer is located on a first surface of the substrate; The first protective layer is located on the surface of the first conductive layer on the side facing away from the substrate. The first protective layer is provided with a plurality of first openings. The first conductive layer forms a plurality of first conductive parts at the plurality of first openings. The first openings correspond to the first conductive parts one by one. One of the first conductive parts is one of the pads. The first openings penetrate the first protective layer.

6. The printed circuit board according to claim 5, characterized in that: The printed circuit board also includes: A second conductive layer is located on a second surface of the substrate, the first surface and the second surface are arranged opposite to each other; The second protective layer is located on the surface of the second conductive layer facing away from the substrate. The second protective layer is provided with a plurality of second openings. The second conductive layer forms a plurality of second conductive parts at the plurality of second openings. One second conductive part is a pad. The second opening runs through the second protective layer.

7. The printed circuit board according to claim 6, characterized in that: The first conductive layer is connected to the second conductive layer through a via hole, and the via hole penetrates the substrate.

8. The printed circuit board according to claim 6, characterized in that: The printed circuit board further comprises at least one conductive structure, wherein In the case where the printed circuit board includes a plurality of the conductive structures, the conductive structures are sequentially arranged between the first conductive layer and the first protective layer, or the conductive structures are sequentially arranged between the second conductive layer and the second protective layer, or a part of the conductive structures are sequentially arranged between the first conductive layer and the first protective layer and another part of the conductive structures are sequentially arranged between the second conductive layer and the second protective layer; In the case where the printed circuit board includes one conductive structure, the conductive structure is disposed between the first conductive layer and the first protective layer, or the conductive structure is disposed between the second conductive layer and the second protective layer.

9. The printed circuit board according to claim 8, characterized in that: The conductive structure is a first conductive structure or a second conductive structure, wherein: The first conductive structure includes a first sub-conductive layer, a first sub-substrate and a second sub-conductive layer arranged in sequence; The second conductive structure includes a second sub-substrate and a third sub-conductive layer which are sequentially arranged.

10. The printed circuit board according to claim 9, characterized in that: At least two of the first conductive layer, the second conductive layer, the first sub-conductive layer, the second sub-conductive layer, and the third sub-conductive layer are connected through a via.

11. The printed circuit board according to claim 5 or 6, characterized in that: The printed circuit board also includes: An anti-oxidation layer is located on a surface of the first conductive portion that is away from the substrate.

12. The printed circuit board according to claim 5 or 6, characterized in that: The material of the first conductive layer is copper.

13. The printed circuit board according to claim 1, characterized in that: The printed circuit board is a rigid printed circuit board or a flexible printed circuit board.

14. A method for manufacturing a printed circuit board according to any one of claims 1 to 13, characterized in that: include: Providing a substrate; forming a first preliminary conductive layer on a first surface of the substrate, and performing a first patterning on the first preliminary conductive layer to obtain a first conductive layer; A first preliminary protective layer is formed on a surface of the first conductive layer facing away from the substrate, and the first preliminary protective layer is subjected to a second patterning to obtain a plurality of first openings and a first protective layer, wherein the first conductive layer forms a plurality of first conductive portions at the plurality of first openings, one of the first conductive portions being a pad, and the first opening passes through the first protective layer.

15. The method according to claim 14, characterized in that The method further comprises: forming a second preliminary conductive layer on the second surface of the substrate, and performing a third patterning on the second preliminary conductive layer to obtain a second conductive layer; A second preliminary protective layer is formed on the surface of the second conductive layer on the side facing away from the substrate, and the second preliminary protective layer is subjected to a fourth patterning to obtain a second protective layer and a plurality of second openings, wherein the second conductive layer forms a plurality of second conductive portions at the plurality of second openings, one second conductive portion being a pad, and the second opening passes through the second protective layer.

16. A display device, characterized in that: include: A printed circuit board as claimed in any one of claims 1 to 13.

Images