Packaging substrate and manufacturing method thereof, electric driving system and vehicle

Abstract

The invention provides a packaging substrate and a manufacturing method thereof, an electric driving system and a vehicle. The packaging substrate comprises a multi-layer structure, a power chip and a resistance-capacitance module. The multi-layer structure comprises a first circuit layer and a second circuit layer, two embedded cavities are formed in the packaging substrate, the two embedded cavities are formed between the first circuit layer and the second circuit layer and are arranged at intervals in the first direction, and the power chip and the resistance-capacitance module are arranged in the two embedded cavities respectively; wherein the first direction is perpendicular to the stacking direction of the multi-layer structure.

Description

Technical Field

[0001] The present application belongs to the field of electric drive control technology, and more specifically, to a packaging substrate and a manufacturing method thereof, an electric drive system and a vehicle. Background Art

[0002] In the driving system of an electric vehicle, when the main drive based on the embedded system adopts a silicon carbide driving circuit, since oscillation will be generated during the switching process, an RC absorption circuit is designed to absorb the oscillation.

[0003] like Figure 1 As shown, in the related art, the RC absorption circuit 100′ is arranged on the top layer of the packaged circuit board 200′. Since the RC absorption circuit 100′ needs to withstand a large voltage, the power used by each device is large, and a higher temperature will be generated during use, resulting in a high temperature in the environment. The top layer is far from the cooling channel at the bottom of the packaged circuit board, and an ideal heat dissipation effect cannot be achieved. In addition, there are multiple RC absorption circuits 100′ arranged, and the packaging volume of each RC absorption circuit is large, resulting in a large overall volume of the packaged circuit board, which occupies more of the internal volume of the electric drive system, and is not conducive to the rational use of the internal space of the electric drive system. At the same time, the packaging volume of the RC absorption circuit is large, which is not conducive to achieving a reasonable wiring layout on the top layer, and is not conducive to the circuit board meeting its safety requirements. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a packaging substrate and a method for manufacturing the same, an electric drive system and a vehicle, so as to solve the technical problems that the existing circuit board places the RC circuit on the top layer, resulting in poor heat dissipation efficiency, large packaging volume and not conducive to reasonable wiring on the top layer.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] Provided is a packaging substrate, the packaging substrate comprising a multilayer structure, a power chip and a resistor-capacitor module;

[0007] The multilayer structure includes a first circuit layer and a second circuit layer. Two embedded cavities are provided inside the packaging substrate. The two embedded cavities are arranged between the first circuit layer and the second circuit layer and are spaced apart along a first direction. The power chip and the resistor-capacitor module are respectively arranged in the two embedded cavities; wherein the first direction is perpendicular to the stacking direction of the multilayer structure.

[0008] In some embodiments, the first circuit layer is provided with a first potential transmission portion and a negative potential portion spaced apart from the first potential transmission portion, and the second circuit layer is provided with a second potential transmission portion and a positive potential portion spaced apart from the second potential transmission portion;

[0009] The first potential transfer portion and the positive electrode potential portion are opposite to each other along the stacking direction, the second potential transfer portion and the negative electrode potential portion are opposite to each other along the stacking direction, and the first potential transfer portion and the second potential transfer portion are connected via a metal hole.

[0010] In some embodiments, the RC module is composed of a resistor and a capacitor connected in series.

[0011] In some embodiments, the RC module includes a silicon substrate and a resistor and a capacitor integrated on the silicon substrate, and the silicon substrate is stacked on the circuit layer.

[0012] In some embodiments, the resistor device and the capacitor device are sequentially arranged along a second direction, and the first direction, the second direction and the stacking direction are perpendicular to each other.

[0013] In some embodiments, the packaging substrate includes multiple groups of the power chips, and the multiple groups of the power chips are arranged in sequence along the first direction; each group of the power chips includes multiple power chips, and the multiple power chips are arranged in sequence along the second direction; the packaging substrate includes multiple resistor-capacitor modules, and a resistor-capacitor module is provided between any two adjacent groups of the power chips.

[0014] In some embodiments, the power chip, the RC module and the metal hole are sequentially arranged along the first direction, and the metal hole is arranged between any adjacent power chip and RC module.

[0015] In some embodiments, the multilayer structure further comprises a transmission layer group, the transmission layer group comprises at least two signal transmission layers, and the transmission layer group is arranged between the first circuit layer and the second circuit layer;

[0016] The two embedded cavities are respectively a first embedded cavity and a second embedded cavity, the first embedded cavity runs through the entire thickness of the transmission layer group, the power chip is arranged in the first embedded cavity, the second embedded cavity runs through a part of the thickness of the transmission layer group, and the resistor-capacitor module is arranged in the second embedded cavity.

[0017] The packaging substrate provided by the present application has the following beneficial effects:

[0018] Compared with the prior art, the packaging substrate provided by the present application has the RC module embedded in the packaging substrate, that is, the power chip and the RC module are embedded in the multi-layer structure of the packaging substrate. This embedding method has the following technical effects:

[0019] First, because the RC module is subjected to a large voltage, the power used by each device is large, and the ambient temperature of the embedded cavity where the RC module is located is high. The embedded cavity is arranged in the multi-layer structure, and the embedded cavity is close to the cooling channel at the bottom of the multi-layer structure. The cooling channel can directly cool the multi-layer structure to take away the heat of the embedded cavity, and the RC module can obtain a more ideal heat dissipation effect;

[0020] Second, the RC module is embedded in the embedding cavity inside the multi-layer structure, and does not increase the volume of the multi-layer structure. Regardless of whether it is one or more RC modules, the packaging substrate can save space on the top layer, thereby reducing the packaging volume of the packaging substrate and reducing the occupancy of the internal space of the electric drive system by the packaging substrate, which is beneficial to the rational use of the internal space of the electric drive system.

[0021] Third, the packaging substrate can save space on the top layer, which is conducive to achieving a reasonable routing layout on the top layer, thereby meeting the safety requirements of the packaging substrate.

[0022] Another object of the present application is to provide an electric drive system, which includes the packaging substrate as described above.

[0023] The beneficial effects of the electric drive system provided in the present application compared to the prior art are consistent with the beneficial effects of the packaging substrate provided in the present application compared to the prior art, and will not be repeated here.

[0024] Another object of the present application is to provide a vehicle, the vehicle comprising the packaging substrate as described above; or the vehicle comprising the electric drive system as described above.

[0025] The beneficial effects of the vehicle provided in the present application compared to the prior art are consistent with the beneficial effects of the packaging substrate or electric drive system provided in the present application compared to the prior art, and will not be repeated here.

[0026] Another object of the present application is to provide a method for manufacturing a packaging substrate, the manufacturing method comprising:

[0027] Providing a prefabricated substrate, the prefabricated substrate comprising a second circuit layer, the prefabricated substrate being provided with at least two embedded cavities, the embedded cavities being located above the second circuit layer and having openings facing away from the second circuit layer;

[0028] Providing a power chip and a resistor-capacitor module, and placing the power chip and the resistor-capacitor module into the two embedding cavities through the two openings respectively;

[0029] A first circuit layer is manufactured above the opening where the power chip is located, and the first circuit layer covers the openings of at least two embedded cavities.

[0030] In some embodiments, providing the RC module and placing the RC module into the embedded cavity through the opening includes:

[0031] Providing a silicon substrate, integrating a resistor component and a capacitor component on the silicon substrate to form the resistor-capacitor module, and placing the resistor-capacitor module into the embedding cavity through the opening;

[0032] Alternatively, a silicon substrate is provided, the silicon substrate is placed into the embedding cavity through the opening, and a resistor component and a capacitor component are integrated on the silicon substrate through the opening to form the resistor-capacitor module.

[0033] The beneficial effects of the method for manufacturing the packaging substrate provided in the present application are:

[0034] Compared with the prior art, the manufacturing method of the package substrate provided by the present application provides a power chip and a resistor-capacitor module, and the power chip and the resistor-capacitor module can be placed in two embedding cavities through two openings respectively. The resistor-capacitor module can be placed in the embedding cavity synchronously with the power chip, and one of the resistor-capacitor module and the power chip can be placed immediately after the other is placed. That is to say, on the basis of the existing manufacturing method of the package substrate, it is only necessary to incorporate the placement of the resistor-capacitor module at the same time as or before and after the placement of the power chip, and there is no need to make major changes to the manufacturing order or process of the package substrate, and the package substrate with the above-mentioned beneficial effects provided by the present application can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0036] Figure 1 is a schematic diagram of a circuit board in the related art, wherein an RC absorption circuit is arranged on a top layer;

[0037] Figure 2 A side cut view of the packaging substrate provided in an embodiment of the present application along the stacking direction;

[0038] Figure 3 A circuit connection diagram of multiple groups of power chips and multiple resistor-capacitor modules in a packaging substrate provided in an embodiment of the present application;

[0039] Figure 4 A schematic diagram of a method for manufacturing a packaging substrate provided in an embodiment of the present application.

[0040] Among them, the reference numerals in the figure are:

[0041] 100, multi-layer structure; 200, power chip; 300, resistor and capacitor module; 400, insulation layer; 500, metal copper layer; 600, top metal layer;

[0042] 101a, negative electrode potential portion; 101b, positive electrode potential portion; 102a, first potential transmission portion; 102b, second potential transmission portion; 103a, first embedded cavity; 103b, second embedded cavity; 104, metal hole; 105, transmission layer group;

[0043] 301. Resistor device; 302. Capacitor device. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0045] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] The packaging substrate and its manufacturing method, the electric drive system and the vehicle provided in the embodiments of the present application are now described.

[0049] See also Figure 2 and Figure 3 As shown, the packaging substrate provided in the embodiment of the present application includes a multilayer structure 100 , a power chip 200 and a resistor-capacitor module 300 .

[0050] The multilayer structure 100 includes a first circuit layer and a second circuit layer, and two embedded cavities are provided inside the package substrate, the two embedded cavities are arranged between the first circuit layer and the second circuit layer and are arranged at intervals along a first direction, and the power chip 200 and the resistor-capacitor module 300 are respectively arranged in the two embedded cavities. The first direction is perpendicular to the stacking direction of the multilayer structure 100.

[0051] Among them, the multilayer structure 100 refers to a structure composed of multiple layers stacked in sequence along the stacking direction, and these layers include but are not limited to metal layers, protective layers, dielectric layers, insulating layers, etc. The multilayer structure 100 constitutes the main part of the packaging substrate, plays a supporting and conductive role, and each functional device is arranged on the surface or inside of the multilayer structure 100. The composition of the multilayer structure 100 of the packaging substrate and the function of each layer are well-known technologies for those skilled in the art, and the embodiments of this application will not be described in detail. Generally, the packaging substrate can be a PCB (Printed Circuit Board), also known as a printed circuit board.

[0052] Generally, the power chip is embedded in the transmission layer group 105 described below. The first circuit layer and the second circuit layer refer to two metal layer structures located outside the transmission layer group 105 on the multilayer structure 100. The first circuit layer and the second circuit layer have electrical and / or signal interconnection functions, and play the role of connecting the substrate to the external circuit. The thickness of the first circuit layer and the second circuit layer is customized according to different needs, and the material can be one of the metals or metal alloys such as copper, aluminum, copper-aluminum alloy, etc.

[0053] In the actual multi-layer structure 100, an insulating layer may be optionally provided between the layer structures inside the transmission layer group 105, between the transmission layer group 105 and the first circuit layer and the second circuit layer, and between the first circuit layer and the second circuit layer and the layer structure located outside thereof. For example, the lower side of the second circuit layer is sequentially stacked with an insulating layer 400 and a metal copper layer 500, and the metal copper layer 500 contacts the cooling channel. The top layer of the first circuit layer is also provided with a top metal layer 600 for arranging various electrical devices. This embodiment does not describe these insulating layers and other metal layers in detail. The material, function, stacking relationship of each metal layer structure with other layer structures in the multi-layer structure 100, and the connection relationship with various functional devices are well known to those skilled in the art, and the embodiments of this application do not describe them in detail.

[0054] The RC module 300 refers to a module having at least a resistor 301 and a capacitor 302. The resistor 301 and the capacitor 302 are connected in series, and their main function is to absorb vibrations during the circuit switching process. For example, in the driving system of an electric vehicle, when the main drive based on the embedded system adopts a silicon carbide driving circuit, since vibrations will be generated during the switching process, the RC module 300 is designed to absorb the vibrations.

[0055] The packaging substrate provided in the embodiment of the present application, wherein the RC module 300 is provided in the packaging substrate in an embedded manner, that is, the power chip 200 and the RC module 300 are both embedded in the multilayer structure 100 of the packaging substrate. This embedding manner has the following technical effects:

[0056] First, because the RC module 300 is subjected to a large voltage, the power used by each device is large, and the ambient temperature of the embedded cavity where the RC module 300 is located is high. The embedded cavity is arranged in the multi-layer structure 100, and the embedded cavity is close to the cooling channel at the bottom of the multi-layer structure 100. The cooling channel can directly cool the multi-layer structure 100 to take away the heat of the embedded cavity, and the RC module 300 can obtain a relatively ideal heat dissipation effect;

[0057] Second, the RC module 300 is embedded in the embedding cavity inside the multi-layer structure 100, and does not increase the volume of the multi-layer structure 100. Regardless of whether it is one or more RC modules 300, the packaging substrate can save space on the top layer, thereby reducing the packaging volume of the packaging substrate and reducing the occupation of the internal space of the electric drive system by the packaging substrate, which is beneficial to the rational use of the internal space of the electric drive system.

[0058] Third, the packaging substrate can save space on the top layer, which is conducive to achieving a reasonable routing layout on the top layer, thereby meeting the safety requirements of the packaging substrate.

[0059] In some embodiments, a first potential transmission portion 102a and a negative potential portion 101a spaced apart from the first potential transmission portion 102a are provided on the first circuit layer, and a second potential transmission portion 102b and a positive potential portion 101b spaced apart from the second potential transmission portion 102b are provided on the second circuit layer. The first potential transmission portion 102a and the positive potential portion 101b are directly opposite to each other along the stacking direction, the second potential transmission portion 102b and the negative potential portion 101a are directly opposite to each other along the stacking direction, and the first potential transmission portion 102a and the second potential transmission portion 102b are connected through a metal hole.

[0060] Among them, each of the above-mentioned potential parts is composed of a cluster of multiple potential points integrated on the circuit layer, and the positive potential part 101b and the negative potential part 101a are also called DC+ and DC-. The first potential transmission part 102a and the first potential transmission part 102b are also called two electrodes of AC. It should be noted that the first potential transmission part 102a and the negative potential part 101a separated therefrom are arranged on the first circuit layer, and the second potential transmission part 102b and the positive potential part 101b separated therefrom are arranged on the second circuit layer, and the functions of each potential part and the connection relationship with each layer structure are well known to those skilled in the art, and the embodiments of the present application will not be described in detail.

[0061] Generally, the metal hole 104 refers to a hole opened in the portion between the first circuit layer and the second circuit layer on the package substrate, and metal is plated on the hole wall to electrically connect the first potential transmission part 102a and the second potential transmission part 102b. The diameter and number of the metal hole 104 are specifically customized according to different needs. The material, function and connection relationship of the metal hole 104 in the multilayer structure 100 with each layer structure are well known to those skilled in the art, and are not described in detail in the embodiments of the present application.

[0062] In some embodiments, the RC module 300 is composed of a resistor device 301 and a capacitor device 302 connected in series. The resistor device 301 and the capacitor device 302 connected in series can be placed in the embedded cavity as a whole module, and the two poles of the RC module 300 are respectively connected to the positive potential part 101b and the negative potential part 101a.

[0063] In some embodiments, the RC module 300 includes a silicon substrate and a resistor device 301 and a capacitor device 302 integrated on the silicon substrate, and the silicon substrate is stacked on the circuit layer. The silicon substrate and the resistor device 301 and the capacitor device 302 integrated on the silicon substrate can be placed in the embedded cavity as a module as a whole, and the two poles of the RC module 300 are connected to the positive potential part 101b and the negative potential part 101a respectively. The silicon substrate can also be placed in the embedded cavity alone, and then the resistor device 301 and the capacitor device 302 are integrated on the silicon substrate, wherein the integration includes but is not limited to being achieved by etching.

[0064] In some embodiments, the resistor device 301 and the capacitor device 302 are arranged in sequence along the second direction, and the first direction, the second direction and the stacking direction are perpendicular to each other. The power device and the resistor-capacitor module 300 are distributed in sequence along the first direction. Compared with the solution in which the resistor device 301 and the capacitor device 302 are distributed in sequence along the first direction, the resistor device 301 and the capacitor device 302 are distributed in sequence along the second direction, so that the size occupied by the power device and the resistor-capacitor module 300 in the first direction can be reduced, so that the power chip 200 can be arranged as much as possible in the first direction, thereby improving the overall power of the electric drive system.

[0065] In some embodiments, the packaging substrate includes multiple groups of power chips 200, and the multiple groups of power chips 200 are arranged in sequence along a first direction; each group of power chips 200 includes multiple power chips 200, and the multiple power chips 200 are arranged in sequence along a second direction; the packaging substrate includes multiple resistor-capacitor modules 300, and a resistor-capacitor module 300 is provided between any two adjacent groups of power chips 200.

[0066] A plurality of groups of power chips 200 and a plurality of resistor-capacitor modules 300 are arranged along a first direction, and a plurality of power chips 200 in a single group of power chips 200 are arranged along a second direction together with a resistor device 301 and a capacitor device 302 in a single resistor-capacitor module 300, thereby providing an optimal layout method for a plurality of groups of power chips 200 and a plurality of resistor-capacitor modules 300 in a multi-layer structure 100, which can not only layout a large number of power chips 200 to achieve the purpose of improving the total power of the electric drive system, but also play a good role in absorbing shocks through the rationally arranged plurality of resistor-capacitor modules 300.

[0067] In some embodiments, multiple RC modules 300 may also be arranged irregularly in the multilayer structure 100, for example, by making full use of unused areas in the multilayer structure 100 of the existing packaging substrate to open cavities, or one or more RC modules 300 may be set between two adjacent chips in any direction, and multiple RC modules 300 may be arranged in parallel or at an angle.

[0068] In some embodiments, each group of power chips 200 includes two power chips 200, and more than two groups of power chips 200 may be arranged in the first direction. Figure 3 As shown, a half-bridge structure of multiple parallel-connected power chips 200 is shown, each parallel-connected upper and lower bridge forms a group, and a resistor-capacitor module 300 is connected in parallel between any two adjacent groups.

[0069] Among them, the electrical connection relationship between the power chips 200 and the electrical connection relationship between the RC modules 300, as well as the electrical connection relationship between the RC modules 300 are all well-known technologies to those skilled in the art. The embodiment of the present application changes the setting position of the RC module 300 and the method of making it in the multi-layer structure 100, but does not change the electrical connection relationship between the RC module 300 and other devices and each layer structure.

[0070] In some embodiments, the power chip 200, the RC module 300 and the metal hole 104 are sequentially arranged along the first direction, and the metal hole 104 is arranged between any adjacent power chip 200 and RC module 300. The metal hole 104 avoids the power chip 200 and the RC module 300, that is, the cavity opening operation and the manufacturing area of ​​the metal hole 104 avoid each other, so as to facilitate the manufacturing and form functional areas separated from each other after the manufacturing, which is conducive to heat dissipation.

[0071] In some embodiments, the multilayer structure 100 further includes a transmission layer group 105, the transmission layer group 105 includes at least two signal transmission layers, and the transmission layer group 105 is disposed between the first circuit layer and the second circuit layer. The two embedded cavities are respectively a first embedded cavity 103a and a second embedded cavity 103b, the first embedded cavity 103a runs through the entire thickness of the transmission layer group 105, the power chip 200 is disposed in the first embedded cavity 103a, the second embedded cavity 103b runs through a portion of the thickness of the transmission layer group 105, and the resistor-capacitor module 300 is disposed in the second embedded cavity 103b.

[0072] Generally, the signal transmission layer refers to a metal layer structure located inside the first circuit layer and the second circuit layer, which has the function of interconnecting electricity and / or signals. The power chip 200 is connected to each circuit layer and each signal transmission layer, and the power chip 200 can be connected to electricity or input / output signals through the circuit layer and / or the signal transmission layer. The number of layers and thickness of the signal transmission layer are specifically customized according to different needs. The material, function and stacking relationship of the signal transmission layer in the multilayer structure 100 with other layer structures, as well as the connection relationship with each functional device are well known to those skilled in the art, and the embodiments of the present application will not be described in detail.

[0073] Another purpose of the embodiment of the present application is to provide an electric drive system, the electric drive system comprising the above packaging substrate. The beneficial effects of the electric drive system provided by the embodiment of the present application compared with the prior art are consistent with the beneficial effects of the packaging substrate provided by the embodiment of the present application compared with the prior art, and will not be repeated here.

[0074] Another object of the embodiments of the present application is to provide a vehicle, the vehicle includes the above packaging substrate; or the vehicle includes the above electric drive system. The beneficial effects of the vehicle provided by the embodiments of the present application compared with the prior art are consistent with the beneficial effects of the packaging substrate or the electric drive system provided by the embodiments of the present application compared with the prior art, and will not be repeated here.

[0075] like Figure 4 As shown, another object of the embodiment of the present application is to provide a method for manufacturing a packaging substrate, the manufacturing method comprising:

[0076] 1001. Provide a prefabricated substrate, wherein the prefabricated substrate includes a second circuit layer, and at least two embedded cavities are provided on the prefabricated substrate. The embedded cavities are located above the second circuit layer and have openings facing away from the second circuit layer.

[0077] 1002. Provide a power chip and a resistor-capacitor module, and place the power chip and the resistor-capacitor module into two embedding cavities through two openings respectively;

[0078] 1003. Fabricate a first circuit layer above the opening where the power chip is located, and make the first circuit layer cover the openings of at least two embedded cavities.

[0079] There is no strict order restriction for providing the prefabricated substrate and providing the power chip and the resistor-capacitor module.

[0080] The manufacturing method of the package substrate provided in the embodiment of the present application provides a power chip and a resistor-capacitor module, and the power chip and the resistor-capacitor module can be placed in two embedding cavities through two openings respectively. The resistor-capacitor module can be placed in the embedding cavity synchronously with the power chip, and one of the resistor-capacitor module and the power chip can be placed immediately after the other is placed. That is to say, on the basis of the existing manufacturing method of the package substrate, it is only necessary to incorporate the placement of the resistor-capacitor module at the same time as or before and after the placement of the power chip, and there is no need to make major changes to the manufacturing order or process of the package substrate, and the package substrate with the above-mentioned beneficial effects provided by the present application can be obtained.

[0081] That is, the packaging substrate provided in the embodiment of the present application, which is manufactured by the manufacturing method of the packaging substrate provided in the embodiment of the present application, has the following technical effects:

[0082] First, because the RC module is subjected to a large voltage, the power used by each device is large, and the ambient temperature of the embedded cavity where the RC module is located is high. The embedded cavity is arranged in the multi-layer structure, and the embedded cavity is close to the cooling channel at the bottom of the multi-layer structure. The cooling channel can directly cool the multi-layer structure to take away the heat of the embedded cavity, and the RC module can obtain a more ideal heat dissipation effect;

[0083] Second, the RC module is embedded in the embedding cavity inside the multi-layer structure, and does not increase the volume of the multi-layer structure. Regardless of whether it is one or more RC modules, the packaging substrate can save space on the top layer, thereby reducing the packaging volume of the packaging substrate and reducing the occupancy of the internal space of the electric drive system by the packaging substrate, which is beneficial to the rational use of the internal space of the electric drive system.

[0084] Third, the packaging substrate can save space on the top layer, which is conducive to achieving a reasonable routing layout on the top layer, thereby meeting the safety requirements of the packaging substrate.

[0085] In some embodiments, the above-mentioned providing the RC module and placing the RC module into the embedded cavity through the opening includes:

[0086] A silicon substrate is provided, a resistor device and a capacitor device are integrated on the silicon substrate to form a resistor-capacitor module, and the resistor-capacitor module is placed in an embedded cavity through an opening; or a silicon substrate is provided, the silicon substrate is placed in the embedded cavity through an opening, and the resistor device and the capacitor device are integrated on the silicon substrate through the opening to form a resistor-capacitor module.

[0087] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A packaging substrate, characterized in that: The packaging substrate comprises a multilayer structure (100), a power chip (200) and a resistor-capacitor module (300); The multilayer structure (100) comprises a first circuit layer and a second circuit layer, two embedded cavities (103a, 103b) are provided inside the packaging substrate, the two embedded cavities (103a, 103b) are arranged between the first circuit layer and the second circuit layer and are arranged at intervals along a first direction, and the power chip (200) and the resistor-capacitor module (300) are respectively arranged in the two embedded cavities (103a, 103b); Wherein, the first direction is perpendicular to the stacking direction of the multilayer structure (100).

2. The packaging substrate according to claim 1, wherein: The first circuit layer is provided with a first potential transmission portion (102a) and a negative potential portion (101a) spaced apart from the first potential transmission portion (102a); the second circuit layer is provided with a second potential transmission portion (102b) and a positive potential portion (101b) spaced apart from the second potential transmission portion (102b); The first potential transmission part (102a) and the positive potential part (101b) are opposite to each other along the stacking direction, the second potential transmission part (102b) and the negative potential part (101a) are opposite to each other along the stacking direction, and the first potential transmission part (102a) and the second potential transmission part (102b) are connected through a metal hole.

3. The packaging substrate according to claim 1, wherein: The resistance-capacitance module (300) is composed of a resistance device (301) and a capacitance device (302) connected in series.

4. The packaging substrate according to claim 1, wherein: The resistor-capacitor module (300) comprises a silicon substrate and a resistor device (301) and a capacitor device (302) integrated on the silicon substrate, and the silicon substrate is stacked on one of the circuit layers.

5. The packaging substrate according to claim 3 or 4, characterized in that: The resistance device (301) and the capacitance device (302) are arranged in sequence along a second direction, and the first direction, the second direction and the stacking direction are perpendicular to each other.

6. The packaging substrate according to claim 5, wherein: The packaging substrate comprises a plurality of groups of power chips (200), and the plurality of groups of power chips (200) are arranged in sequence along the first direction; each group of power chips (200) comprises a plurality of power chips (200), and the plurality of power chips (200) are arranged in sequence along the second direction; the packaging substrate comprises a plurality of resistor-capacitor modules (300), and a resistor-capacitor module (300) is provided between any two adjacent groups of power chips (200).

7. The packaging substrate according to claim 2, wherein: The first potential transmission part (102a) and the second potential transmission part (102b) are connected via a metal hole (104); the power chip (200), the resistor-capacitor module (300) and the metal hole (104) are arranged in sequence along the first direction; and the metal hole (104) is arranged between the power chip (200) and the resistor-capacitor module (300).

8. The packaging substrate according to any one of claims 1 to 4 and 6 to 7, characterized in that: The multilayer structure (100) further comprises a transmission layer group (105), the transmission layer group (105) comprises at least two signal transmission layers, and the transmission layer group (105) is arranged between the first circuit layer and the second circuit layer; The two embedded cavities (103a, 103b) are respectively a first embedded cavity (103a) and a second embedded cavity (103b); the first embedded cavity (103a) penetrates the thickness of the transmission layer group (105); the power chip (200) is arranged in the first embedded cavity (103a); the second embedded cavity (103b) penetrates part of the thickness of the transmission layer group (105); and the resistor-capacitor module (300) is arranged in the second embedded cavity (103b).

9. An electric drive system, characterized in that: The electric drive system comprises a packaging substrate as claimed in any one of claims 1 to 8.

10. A vehicle, characterized in that: The vehicle comprises a packaging substrate as claimed in any one of claims 1 to 8; Or, the vehicle includes the electric drive system as claimed in claim 9.

11. A method for manufacturing a packaging substrate, characterized in that: The production method comprises: Providing a prefabricated substrate, the prefabricated substrate comprising a second circuit layer, the prefabricated substrate being provided with at least two embedded cavities, the embedded cavities being located above the second circuit layer and having openings facing away from the second circuit layer; Providing a power chip (200) and a resistor-capacitor module (300), and placing the power chip (200) and the resistor-capacitor module (300) into the two embedded cavities through the two openings respectively; A first circuit layer is manufactured above the opening where the power chip (200) is located, and the first circuit layer covers the openings of at least two embedded cavities.

12. The method for manufacturing a packaging substrate according to claim 11, wherein: Providing the resistor-capacitor module (300) and placing the resistor-capacitor module (300) into the embedded cavity through the opening, comprising: Providing a silicon substrate, integrating a resistor device (301) and a capacitor device (302) on the silicon substrate to form the resistor-capacitor module (300), and placing the resistor-capacitor module (300) into the embedded cavity through the opening; Alternatively, a silicon substrate is provided, the silicon substrate is placed into the embedded cavity through the opening, and a resistor component (301) and a capacitor component (302) are integrated on the silicon substrate through the opening to form the resistor-capacitor module (300).

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