A method, device and equipment for automatically designing a gold finger etching lead protection film

Abstract

This invention discloses an automatic design method, apparatus, and device for gold finger etched lead protection film. The method includes: copying predetermined gold finger pads in a circuit layer, outputting a first circuit layer, and stretching the gold finger pads in the first circuit layer towards the edge of the PCB board by a first distance to obtain a second circuit layer; copying the second circuit layer to obtain a third circuit layer, extending the gold finger pads of the third circuit layer to or beyond the edge of the PCB board, and adjusting the pad width; superimposing a shape layer onto the third circuit layer in a negative manner, outputting a fourth circuit layer, integrating the negative to obtain a fifth circuit layer, and merging the first, second, and fifth circuit layers to form a sixth circuit layer; and automatically completing the creation of a gold finger area layer, a protective lead pattern layer, a gold-plated finger pattern layer, an etched lead pattern layer, and a wet film stencil file based on the first circuit layer, the sixth circuit layer, and set parameters.

Description

Technical Field

[0001] This invention relates to the field of PCB technology, and in particular to an automatic design method, apparatus and equipment for gold finger etching lead protection film. Background Technology

[0002] In the PCB design and manufacturing industry, PCB gold fingers refer to the process of inserting a section of a PCB circuit board into a connector slot. The connector's insertion pins act as the board's exit points, allowing the solder pads or copper traces to contact the corresponding pins to achieve an electrical connection. PCB gold fingers have a wide range of applications, such as connecting computer motherboards to peripherals (graphics cards, memory modules, network cards, sound cards, etc.), communication in digital equipment, connection contacts in industrial machinery, and optoelectronic products (communication and networking).

[0003] PCB gold fingers need to meet the following requirements: First, they need to have good conductivity to effectively transmit signals and current; second, they need to have good corrosion resistance to resist oxidation and corrosion; and finally, they need to have good mechanical strength to withstand insertion, removal, and pressure. Based on these considerations, gold fingers currently require thick gold plating to meet these requirements.

[0004] However, PCB gold fingers in optoelectronic products are designed with varying lengths. Traditional processes involve electroplating the entire board before etching the circuitry. This method only plating the surface of the gold fingers, leaving exposed copper on the sides after etching, which affects connection reliability, wear resistance, and signal transmission. Adding leads to the outer ends of conventional gold fingers with equal lengths also affects finger length and signal transmission after etching. To solve this problem, an etching lead process is needed to remove the external leads after gold plating. This additional lead etching process requires engineers to create protective film to assist production.

[0005] Typically, the gold finger etching lead file includes four protective film files. The current method is to manually create each protective film file separately. This method is not only time-consuming, but also prone to deviations between the files due to manufacturing discrepancies, which can affect the quality of the final PCB gold fingers produced. Summary of the Invention

[0006] To address the aforementioned problems, the present invention aims to provide an automatic design method, apparatus, and device for gold finger etching lead protection film, thereby improving the above-mentioned issues.

[0007] In a first aspect, embodiments of the present invention provide an automatic design method for gold finger etched lead protection film, comprising:

[0008] S1, copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer towards the edge of the PCB board by a first distance to obtain the second circuit layer;

[0009] S2, the second circuit layer is copied to obtain the third circuit layer, the gold finger pads of the third circuit layer are extended to or beyond the edge of the PCB board, and the width of the pads is adjusted to be less than or equal to the width of the gold finger pads of the second circuit layer.

[0010] S3, the predetermined shape of the outline layer is superimposed on the third circuit layer in a negative manner to output the fourth circuit layer. Then, the pattern of the fourth circuit layer outside the outline layer is deleted by integrating the negative to obtain the fifth circuit layer. Finally, the first circuit layer, the second circuit layer and the fifth circuit layer are merged to form the sixth circuit layer, thus completing the circuit layer lead design.

[0011] S4 automatically completes the creation of the gold finger area layer, protective lead pattern layer, gold-plated finger pattern layer, etched lead pattern layer and wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, and obtains the gold finger etched lead protective film.

[0012] Preferably, in step S1, the gold finger pads of the circuit layer are selected and defined as predetermined attributes, so as to realize the selection and copying of predetermined gold finger pads through the predetermined attributes; the first distance is 4 to 8 mil.

[0013] Preferably, in step S2, when adjusting the width of the gold finger pads of the third circuit layer, it is determined whether the width of the gold finger pads of the second circuit layer is greater than a preset value; if it is greater, the width of the gold finger pads of the third circuit layer is set to be 1-3 mil less than the width of the gold finger pads of the second circuit layer; if it is not greater, the width of the gold finger pads of the third circuit layer is set to be equal to the width of the gold finger pads of the second circuit layer.

[0014] Preferably, in step S3, before merging the fifth line layer, the fifth line layer is extended outward by a second distance.

[0015] Preferably, step S4 includes:

[0016] The first gold finger pad area is determined based on the first circuit layer. The first gold finger pad area is filled with copper to form a whole, forming the second gold finger pad layer. Then, according to the shape, the second gold finger pad layer is extended to the edge of the PCB board to a third distance outside the board, and integrated to form the gold finger area layer.

[0017] Preferably, step S4 further includes:

[0018] The gold finger pads of the first circuit layer are copied to the sixth circuit layer, and the overall size is increased by the first dimension. The two sides are extended to the outside of the board by the second distance. Then the whole thing is moved into the board by the first dimension. The gold finger area layer is copied to form a pattern layer. The pattern layer is superimposed on the sixth circuit layer with negative attributes to integrate the negative attributes and obtain the protective lead pattern layer. The first dimension is the gold finger pitch value.

[0019] Copy the protective lead pattern layer to the seventh circuit layer, and move the seventh circuit layer inward by a fourth distance to obtain the etched lead pattern layer.

[0020] Preferably, step S4 further includes:

[0021] The gold finger pads of the first circuit layer are copied to obtain a new layer of gold finger pads. The new layer of gold finger pads is enlarged as a whole and extended to the edges of the PCB board on both sides to obtain a gold-plated finger pattern layer.

[0022] Preferably, step S4 further includes:

[0023] Copy the gold finger area layer to the eighth line layer and enlarge the overall size to complete the creation of the wet film stencil file.

[0024] Secondly, embodiments of the present invention also provide an automatic design device for gold finger etching lead protection film, comprising:

[0025] The stretching unit is used to copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer towards the edge of the PCB board by a first distance to obtain the second circuit layer.

[0026] The width adjustment unit is used to copy the second circuit layer to obtain the third circuit layer, extend the gold finger pads of the third circuit layer to or beyond the edge of the PCB board, and adjust the width of the pads so that the width is less than or equal to the width of the gold finger pads of the second circuit layer.

[0027] The lead design unit is used to superimpose a predetermined shape outline layer onto the third circuit layer in a negative manner, output the fourth circuit layer, and then delete the pattern of the fourth circuit layer outside the outline layer by integrating the negative to obtain the fifth circuit layer. Finally, the first circuit layer, the second circuit layer and the fifth circuit layer are merged to form the sixth circuit layer, thus completing the lead design of the circuit layer.

[0028] The film design unit is used to automatically create the gold finger area layer, protective lead pattern layer, gold-plated finger pattern layer, etched lead pattern layer and wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, so as to obtain the gold finger etched lead protection film.

[0029] Thirdly, embodiments of the present invention also provide an automatic design device for gold finger etching lead protection film, which includes a memory and a processor. The memory stores a computer program, which can be executed by the processor to realize the automatic design method for gold finger etching lead protection film as described above.

[0030] In summary, in this embodiment, by defining the gold fingers and their outline patterns, a circuit layer lead design can be generated. Based on this circuit layer lead design, and considering the correlation between the protective film files, the automatic design and generation of protective film for gold finger etching leads can be achieved by setting parameters. This allows for the rapid and automatic processing of etched lead gold finger files, improving CAM processing efficiency, avoiding file creation errors caused by human operation, and reducing production scrap rates.

[0031] Furthermore, in this embodiment, since the entire file creation process is transparent and traceable, it can be converted into a script to automatically create auxiliary files, further improving the efficiency of engineering CAM.

[0032] Furthermore, files processed by engineering CAM are closer to production needs, enabling better and faster etching of leads that are not designed by the customer during electroplating, reducing production scrap rates and improving quality. Attached Figure Description

[0033] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a flowchart illustrating the automatic design method for gold finger etching lead protection film provided in the first embodiment of the present invention.

[0035] Figure 2 This is a schematic diagram of the operating interface provided in an embodiment of the present invention.

[0036] Figure 3 This is a schematic diagram of the first circuit layer provided in an embodiment of the present invention.

[0037] Figure 4 This is a schematic diagram of the fourth circuit layer provided in an embodiment of the present invention.

[0038] Figure 5 and Figure 6 A schematic diagram of the formation of the gold finger region layer.

[0039] Figure 7 and Figure 8A schematic diagram for forming a protective lead pattern layer.

[0040] Figure 9 This is a schematic diagram of the etched lead pattern layer.

[0041] Figure 10 This is a schematic diagram of the gold-plated finger graphic layer.

[0042] Figure 11 This is a schematic diagram of a wet film stencil file.

[0043] Figure 12 This is a schematic diagram of the automatic design device for gold finger etching lead protection film provided in the second embodiment of the present invention. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] Please see Figure 1 The first embodiment of the present invention provides an automatic design method for gold finger etching lead protection film, which can be executed by an automatic design device for gold finger etching lead protection film (hereinafter referred to as the design device), specifically, by one or more processors within the design device, to implement the following steps:

[0046] S1, copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer towards the edge of the PCB board by a first distance to obtain the second circuit layer.

[0047] In this embodiment, the design device can be a computing device with data processing capabilities, such as a desktop computer, laptop computer, tablet computer, or workstation, etc., and the present invention does not impose specific limitations. In terms of hardware, generally, the design device includes at least a processor, a display, and a bus interface. In terms of software, the design device is equipped with an operating system and corresponding application software or scripts to implement the functions required in this embodiment.

[0048] In this embodiment, the predetermined gold finger pads in the circuit layer need to be copied first to output the first circuit layer. To improve the efficiency of copying and selecting the predetermined gold finger pads, the gold finger pads in the circuit layer can be selected and defined as "gold finger pads". This allows the gold finger pads to be copied all at once by selecting the attribute.

[0049] In addition, the etching direction of the gold fingers can be selected, such as... Figure 2 As shown.

[0050] In this embodiment, the predetermined gold finger pads in the replicated circuit layer are output as follows: Figure 3 After the first circuit layer is shown, the gold finger pads of the gold finger area 1 in the first circuit layer are stretched by a first distance toward the edge of the PCB board that their ends point to, to obtain the second circuit layer.

[0051] In this embodiment, the first distance can be 4 to 8 mil. Extending the first distance before making the lead is mainly to take into account that there will be some deviation during etching. If the gold finger pad is not extended, lead residue may be generated after etching, affecting the appearance.

[0052] like Figure 4 As shown, Figure 4 In the middle, the first extended area 2, which is the same width as the gold finger pad, is the extended part.

[0053] S2, the second circuit layer is copied to obtain a third circuit layer, the gold finger pads of the third circuit layer are extended to or beyond the edge of the PCB board, and the width of the pads is adjusted to be less than or equal to the width of the gold finger pads of the second circuit layer.

[0054] This step is mainly for creating the leads. When extending them, it is necessary to ensure that all gold finger pads extend to the edge of the board along their length, and longer fingers can extend beyond the edge of the board.

[0055] In this embodiment, when adjusting the width of the gold finger pads of the third circuit layer, it is first determined whether the width of the gold finger pads of the second circuit layer is greater than a preset value; if it is greater, the width of the gold finger pads of the third circuit layer is set to be 1-3 mil less than the width of the gold finger pads of the second circuit layer; if it is not greater, the width of the gold finger pads of the third circuit layer is set to be equal to the width of the gold finger pads of the second circuit layer.

[0056] Considering that the width of a typical gold finger is greater than 16 mil, the preset value is set to 16 mil.

[0057] like Figure 4 As shown, Figure 4 In the middle, the narrower second extension area 3 is part of the gold finger pad of the third circuit layer after the width is adjusted.

[0058] S3, the predetermined shape of the outline layer is superimposed on the third circuit layer in a negative manner to output the fourth circuit layer. Then, the pattern of the fourth circuit layer outside the outline layer is deleted by integrating the negative to obtain the fifth circuit layer. Finally, the first circuit layer, the second circuit layer and the fifth circuit layer are merged to form the sixth circuit layer, thus completing the circuit layer lead design.

[0059] In this embodiment, the outline layer 4 is used to define the outline of the PCB board. The outline layer 4 is superimposed on the third circuit layer in a negative manner to obtain the following result: Figure 4 The fourth circuit layer is shown, and then the fifth circuit layer is obtained by integrating the negative deletion of the fourth circuit layer outside the outline layer.

[0060] like Figure 5 As shown, after obtaining the fifth circuit layer, the end is copied and extended a certain distance towards the corresponding board edge to form an extended gold finger guide line 5. This extended gold finger guide line is mainly used for connecting the main leads. The main leads outside the board can be connected to the power supply, thereby transmitting current to each branch lead to achieve electroplating.

[0061] The specified distance here can be 2mm, but it can also be adjusted according to actual needs, such as being set between 1.5 and 3mm. This invention does not impose any specific limitations.

[0062] In this embodiment, the first line layer, the second line layer, and the fifth line layer are superimposed to form the sixth line layer, thereby completing the line layer lead design.

[0063] S4 automatically completes the creation of the gold finger area layer, protective lead pattern layer, gold-plated finger pattern layer, etched lead pattern layer and wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, thereby obtaining the gold finger etched lead protective film.

[0064] In this embodiment, multiple protective patterns (protective films) are required during the processing of gold fingers. After obtaining the sixth circuit layer as the circuit layer lead design, this embodiment can automatically generate each film based on the first circuit layer and the sixth circuit layer.

[0065] First, for the gold finger region layer:

[0066] like Figure 5 and Figure 6 As shown, the gold finger area layer 6 is mainly used to cover the area where the gold finger is located, so that processing can be carried out after covering.

[0067] The Goldfinger region layer 6 can be automatically generated through the following steps:

[0068] Step 1: Copy the gold finger pads of the first circuit layer to form the first gold finger pad layer;

[0069] Step 2: Select the gold finger pad layer in the first gold finger pad layer, determine the size of the gold finger pad area, and fill this area with copper to form a whole, thus forming the second gold finger pad layer;

[0070] Step 3: Extend the second gold finger pad layer outwards in three directions along the board edge according to the shape, and integrate this layer to form the gold finger area layer 6.

[0071] Among them, with Figure 5 For example, the three directions of the board edge include the direction of the lead wire extension and two directions perpendicular to that extension direction.

[0072] The distance extending beyond the plate can be 0.3 mm, or other close values, such as between 0.1 and 0.5 mm. This invention does not impose any specific limitation.

[0073] Then, for the protective lead pattern layer:

[0074] like Figure 7 and Figure 8 As shown, the protective lead pattern layer 7 can be automatically generated through the following steps:

[0075] Step 1: Copy the gold fingers of the first circuit layer to the sixth circuit layer, and increase the overall size by Xmil (Xmil is the gold finger spacing value), extending it 1mm outside the board on both sides, and then move it Xmil inside the board as a whole.

[0076] Step 2: Duplicate the gold finger area layer to create a graphic layer, and overlay the sixth line layer with a negative attribute.

[0077] Step 3: Integrate the negatives to form the protective lead pattern layer.

[0078] Among them, such as Figure 7 and Figure 8 As shown, the inner covering portion 8 of the protective lead pattern layer 7 is flush with the gold fingers before processing, i.e., covering 6 mil. The value h2, which is larger than the single side of the short finger, is half the distance h1 between the two gold fingers. The remaining distance is used to cover the distance of the long finger. The distance between the gold fingers needs to be more than 6 mil.

[0079] Next, regarding the etched lead pattern:

[0080] like Figure 9 As shown, etched lead pattern 9 is used to etch the lead, which covers the parts other than the lead.

[0081] The etched lead pattern 9 can be automatically generated through the following steps:

[0082] Copy the protective lead pattern layer and move it 4-8 mil to the gold finger area 1 to obtain the etched lead pattern layer 9.

[0083] Next, for the gold-plated finger graphic layer:

[0084] like Figure 10 As shown, since the gold finger leads are behind the gold fingers, the gold plating on the gold fingers needs to be removed (once gold plating is done, it cannot be etched off, and only the gold fingers need to be gold plating, while the leads do not need to be gold plating), a gold-plated finger graphic layer 10 needs to be designed. This gold-plated finger graphic layer 10 is used to cover the parts other than the gold fingers.

[0085] The gold-plated finger graphic layer 10 can be automatically generated through the following steps:

[0086] Step 1: Copy the gold finger pads of the first circuit layer to a new gold finger pad layer;

[0087] Step 2: Increase the size of the new gold finger pads by 4-8 mils and extend them to the edges of the board on both sides, resulting in the following: Figure 10 The gold-plated finger graphic layer 10 is shown.

[0088] Finally, regarding the wet film stencil file:

[0089] like Figure 11 As shown, copy the gold finger area layer 6 to a new layer, increase the overall size by 2mm to obtain the wet film area 11, and complete the wet film stencil file layer.

[0090] In summary, in this embodiment, by defining the gold fingers and their outline patterns, a circuit layer lead design can be generated. Based on this circuit layer lead design, and considering the correlation between the protective film files, the automatic design and generation of protective film for gold finger etching leads can be achieved by setting parameters. This allows for the rapid and automatic processing of etched lead gold finger files, improving CAM processing efficiency, avoiding file creation errors caused by human operation, and reducing production scrap rates.

[0091] Furthermore, in this embodiment, since the entire file creation process is transparent and traceable, it can be converted into a script to automatically create auxiliary files, further improving the efficiency of engineering CAM.

[0092] Furthermore, files processed by engineering CAM are closer to production needs, enabling better and faster etching of leads that are not designed by the customer during electroplating, reducing production scrap rates and improving quality.

[0093] Please see Figure 12 The second embodiment of the present invention also provides an automatic design device for gold finger etching lead protection film, which includes:

[0094] The stretching unit 210 is used to copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer towards the edge of the PCB board by a first distance to obtain the second circuit layer.

[0095] Width adjustment unit 220 is used to copy the second circuit layer to obtain a third circuit layer, extend the gold finger pads of the third circuit layer to or beyond the edge of the PCB board, and adjust the width of the pads so that the width is less than or equal to the width of the gold finger pads of the second circuit layer.

[0096] The lead design unit 230 is used to superimpose a predetermined shape of the outline layer onto the third circuit layer in a negative manner, output the fourth circuit layer, and then delete the pattern of the fourth circuit layer outside the outline layer by integrating the negative to obtain the fifth circuit layer. Finally, the first circuit layer, the second circuit layer and the fifth circuit layer are merged to form the sixth circuit layer, thus completing the lead design of the circuit layer.

[0097] Film design unit 240 is used to automatically complete the creation of gold finger area layer, protective lead pattern layer, gold-plated finger pattern layer, etched lead pattern layer and wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, to obtain gold finger etched lead protective film.

[0098] The third embodiment of the present invention also provides an automatic design device for gold finger etching lead protection film, which includes a memory and a processor. The memory stores a computer program, which can be executed by the processor to realize the automatic design method for gold finger etching lead protection film as described above.

[0099] The technical features of the above embodiments can be combined arbitrarily, and the execution order of the method steps is not restricted. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. An automatic design method for gold finger etching lead protection film, characterized in that, include: S1, copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer towards the edge of the PCB board by a first distance to obtain the second circuit layer; S2, the second circuit layer is copied to obtain the third circuit layer, the gold finger pads of the third circuit layer are extended to or beyond the edge of the PCB board, and the width of the pads is adjusted to be less than or equal to the width of the gold finger pads of the second circuit layer. S3, the predetermined shape of the outline layer is superimposed on the third circuit layer in a negative manner to output the fourth circuit layer. Then, the pattern of the fourth circuit layer outside the outline layer is deleted by integrating the negative to obtain the fifth circuit layer. Finally, the first circuit layer, the second circuit layer and the fifth circuit layer are merged to form the sixth circuit layer, thus completing the circuit layer lead design. S4 automatically completes the creation of the gold finger area layer, protective lead pattern layer, gold-plated finger pattern layer, etched lead pattern layer and wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, and obtains the gold finger etched lead protective film.

2. The automatic design method for gold finger etching lead protection film according to claim 1, characterized in that, In step S1, the gold finger pads of the circuit layer are selected and defined as predetermined attributes, so as to select and copy predetermined gold finger pads through the predetermined attributes; the first distance is 4 to 8 mil.

3. The automatic design method for gold finger etching lead protection film according to claim 1, characterized in that, In step S2, when adjusting the width of the gold finger pads of the third circuit layer, it is determined whether the width of the gold finger pads of the second circuit layer is greater than a preset value; if it is greater, the width of the gold finger pads of the third circuit layer is set to be 1-3 mil less than the width of the gold finger pads of the second circuit layer. If it is not greater than, then the width of the gold finger pad of the third circuit layer is set to be equal to the width of the gold finger pad of the second circuit layer.

4. The automatic design method for gold finger etching lead protection film according to claim 1, characterized in that, In step S3, before merging the fifth line layer, the fifth line layer is extended outward by a second distance.

5. The automatic design method for gold finger etching lead protection film according to claim 4, characterized in that, Step S4 includes: The first gold finger pad area is determined based on the first circuit layer. The first gold finger pad area is filled with copper to form a whole, forming the second gold finger pad layer. Then, according to the shape, the second gold finger pad layer is extended to the edge of the PCB board to a third distance outside the board, and integrated to form the gold finger area layer.

6. The automatic design method for gold finger etching lead protection film according to claim 5, characterized in that, Step S4 also includes: The gold finger pads of the first circuit layer are copied to the sixth circuit layer, and the overall size is increased by the first dimension. The two sides are extended to the outside of the board by the second distance. Then the whole thing is moved into the board by the first dimension. The gold finger area layer is copied to form a pattern layer. The pattern layer is superimposed on the sixth circuit layer with negative attributes to integrate the negative attributes and obtain the protective lead pattern layer. The first dimension is the gold finger pitch value. Copy the protective lead pattern layer to the seventh circuit layer, and move the seventh circuit layer inward by a fourth distance to obtain the etched lead pattern layer.

7. The automatic design method for gold finger etching lead protection film according to claim 5, characterized in that, Step S4 also includes: The gold finger pads of the first circuit layer are copied to obtain a new layer of gold finger pads. The new layer of gold finger pads is enlarged as a whole and extended to the edges of the PCB board on both sides to obtain a gold-plated finger pattern layer.

8. The automatic design method for gold finger etching lead protection film according to claim 5, characterized in that, Step S4 also includes: Copy the gold finger area layer to the eighth line layer and enlarge the overall size to complete the creation of the wet film stencil file.

9. An automatic design device for gold finger etching lead protection film, characterized in that, include: The stretching unit is used to copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer towards the edge of the PCB board by a first distance to obtain the second circuit layer. The width adjustment unit is used to copy the second circuit layer to obtain the third circuit layer, extend the gold finger pads of the third circuit layer to or beyond the edge of the PCB board, and adjust the width of the pads so that the width is less than or equal to the width of the gold finger pads of the second circuit layer. The lead design unit is used to superimpose a predetermined shape outline layer onto the third circuit layer in a negative manner, output the fourth circuit layer, and then delete the pattern of the fourth circuit layer outside the outline layer by integrating the negative to obtain the fifth circuit layer. Finally, the first circuit layer, the second circuit layer and the fifth circuit layer are merged to form the sixth circuit layer, thus completing the lead design of the circuit layer. The film design unit is used to automatically create the gold finger area layer, protective lead pattern layer, gold-plated finger pattern layer, etched lead pattern layer and wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, thereby obtaining the gold finger etched lead protection film.

10. An automatic design device for gold finger etching lead protection film, characterized in that, The device includes a memory and a processor, wherein the memory stores a computer program that can be executed by the processor to implement the automatic design method for gold finger etching lead protection film as described in any one of claims 1 to 8.

Images