Automatic discharging equipment and method for electronic part machining

Abstract

The automatic discharging equipment comprises a cross beam, L-shaped shaft brackets are fixed to the two ends of the cross beam, housings are fixed to the outer walls of the sides, close to each other, of the two L-shaped shaft brackets, and a main shaft is rotationally installed in each housing; an opposite-pull type plate tool used for clamping a PCB substrate workpiece is installed between the opposite ends of the two main shafts, and a gear type hydraulic turn-over module used for driving the opposite-pull type plate tool to conduct A-axis rotation is arranged in one cover shell. Turnover is carried out through the gear type hydraulic turnover module, it is ensured that the face, with electronic parts, of the base plate faces the flexible bearing structure, then discharging and moving-out operation is completed through the double-shaft moving unit and the pneumatic picking unit, the turned base plate can be more stably placed on the flexible bearing structure, and the working efficiency is improved. Potential safety hazards caused by unevenness or unstable placement are reduced, and the base plate is stably adsorbed by the pneumatic picking unit in the carrying process.

Description

Technical Field

[0001] The invention relates to the technical field of spare parts blanking, and in particular to an automatic blanking device and method for electronic parts processing. Background Art

[0002] During the processing of electronic parts, the unloading equipment is mainly responsible for transporting the processed small-size PCB substrates from one process to the next process to ensure the continuity and efficiency of the production process. At the same time, the automated unloading equipment can ensure seamless connection between the processes, ensuring that the substrates enter the next link on time and in quantity, avoiding stagnation of the production line or increased waiting time, thereby improving overall production efficiency. The structure of this type of unloading equipment usually consists of an input end, a separation and transmission system, a handling device, an output end device, and a control system. The coordinated work of each part ensures the stability and accuracy of the substrate during the handling process, and reduces defective products caused by improper operation. Its working principle is to automatically complete the positioning, handling and transportation of the substrate through an integrated transmission, separation and handling system to ensure the precise execution of each link;

[0003] A PCB board unloading device disclosed in the authorization announcement number CN221459157U includes a device body, the device body includes a conveyor line for conveying PCB boards; also includes a first material rack, on which empty jig trays are stacked and placed, and the jig trays are used to receive PCB boards; also includes a second material rack, in which jig trays that have received PCB boards are stacked and placed; also includes a first suction cup, the first suction cup is movably arranged between the conveyor rack and the second material rack, and is used to suck up the PCB board, the PCB board is placed on the conveyor belt and moves on the linear guide rail, when a PCB board moves to the material taking position, the limit rod is driven by the telescopic cylinder to rise and block the PCB board moving on the linear guide rail, so that the PCB board remains stationary, and then the first suction cup sucks the PCB board out of the linear guide rail; at the same time, the second suction cup takes out one of the empty material trays stacked in the first material rack and puts it into the second material rack, and then the first suction cup puts the sucked out PCB board into the jig tray in the second material rack;

[0004] The existing PCB board unloading technology and equipment operation methods are basically the same, that is, after the handling device (such as a robotic arm or a suction cup) receives a control signal, it will take out the substrate and move it to the next link according to a preset program. However, during its operation, since electronic parts such as capacitors, resistors, chips, etc. are installed on the upper surface of the PCB substrate, these parts have different heights and shapes, especially for surface mount devices (SMDs), the parts are relatively prominent. At this time, the handling device (such as a robotic arm, a suction cup, etc.) relies on contact or clamping with the substrate surface when grabbing the substrate. However, when electronic components are assembled on the substrate, these components will protrude from the substrate surface to form an irregular surface. The suction cup device will not be able to effectively grab the substrate due to poor contact with these parts. At this time, the robotic arm will cause a grasping failure or damage to the substrate due to misjudgment of the part position, and the suction cup will also have grasping difficulties due to uneven pressure distribution, resulting in bending of the substrate or damage to the components. Some small-sized or precision electronic components, such as small chips, resistors, etc., may be too small to be grasped stably by the suction cup. Especially in high-speed production lines, misoperation of the suction cup will cause production interruption or damage to the product. Summary of the invention

[0005] The object of the present invention is to provide an automated unloading device and method for processing electronic parts. A PCB substrate to be processed is placed in a pull-type plate fixture and fixed. After the processing of the PCB substrate is completed, a gear-type hydraulic flipping module causes the pull-type plate fixture and the PCB substrate to flip and change the surface until the side of the PCB substrate with electronic parts faces a flexible receiving structure. The pull-type plate fixture releases the PCB substrate to make it fall onto the flexible receiving structure, that is, the back of the PCB substrate faces upward. Subsequently, a dual-axis moving unit and a pneumatic picking unit complete the unloading and removal operations of the PCB substrate, so that the PCB substrate is placed on a subsequent conveyor belt and transferred to the next processing station for use by the staff, thereby solving the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: an automatic blanking device for electronic parts processing, comprising:

[0007] A crossbeam, both ends of the crossbeam are fixed with L-shaped shaft frames, and a cover is fixed on the outer wall of the side where the two L-shaped shaft frames are close to each other, a main shaft is rotatably installed inside the cover, and a pull-type plate tooling for clamping a PCB substrate workpiece is installed between the opposite ends of the two main shafts, and a gear-type hydraulic flip module for driving the pull-type plate tooling to rotate the A axis is arranged inside one of the covers;

[0008] A flexible receiving structure is provided on an outer wall on one side of the crossbeam and is located below the pull-type panel fixture. The flexible receiving structure is used to receive the PCB substrate workpiece released by the pull-type panel fixture. A dual-axis moving unit is installed on the outer wall on the other side of the crossbeam, and a pneumatic picking unit is installed on the Z-axis moving end of the dual-axis moving unit. The pneumatic picking unit is used to pick up the PCB substrate workpiece on the flexible receiving structure. A PLC controller is installed on an outer wall on one side of the L-shaped shaft frame. The output end of the PLC controller is electrically connected to the input ends of the gear-type hydraulic flipping module, the pull-type panel fixture, the dual-axis moving unit, and the pneumatic picking unit, respectively.

[0009] Preferably, the pull-type plate tooling includes a return frame fixed between two main shafts, clamping arms slidably installed on both sides of the return frame, and a base fixed on one side of the top of the clamping arm, and convex inner grooves are provided on the outer walls of the two clamping arms that are close to each other. A first cylinder is installed between the two bases in the horizontal direction, and the input end of the first cylinder is electrically connected to the output end of the PLC controller.

[0010] Preferably, pulleys are rotatably mounted on both side outer walls of the clamp arm, and raceways for the pulleys to roll are arranged on the front and rear inner walls of the return frame, and the clamp arm is made of a rubber component.

[0011] Preferably, the gear-type hydraulic flipping module includes a hydraulic cylinder installed at the bottom end of one of the L-shaped shaft frames, a vertical slide installed at the top end of the hydraulic cylinder piston rod, and racks fixed on the left and right outer walls of the vertical slide. Two driven gears are fixed to one end of the main shaft surface, and the driven gears and the racks are meshed with each other. When the hydraulic cylinder drives the vertical slide and the rack to move upward, the rack drives the driven gear, the main shaft, and the return frame to rotate along the A axis.

[0012] Preferably, a turntable is fixed to one end of the main shaft close to the return frame, and two symmetrical connecting seats are fixed to the outer wall of the turntable on the side away from the driven gear, and the return frame is welded between the two connecting seats in the vertical direction.

[0013] Preferably, two symmetrical dovetail sleeves are fixed on the inner wall of one side of the cover shell, and a dovetail track is installed on the outer wall of the rack away from the driven gear. The dovetail track and the dovetail sleeve are slidably connected, and the length of the dovetail track is equal to the length of the rack.

[0014] Preferably, the flexible supporting structure includes a T-shaped cross frame fixed on the outer wall of one side of the beam, a guide rod slidably installed at the top corner of the T-shaped cross frame, and a support plate fixed at one end of the surface of the guide rod, a sponge table is installed on the upper surface of the support plate, and the sponge table is located below the circular frame, and a coil spring coaxial with the guide rod is installed at the top corner of the T-shaped cross frame.

[0015] Preferably, the dual-axis movable unit includes two back plates fixed on the outer wall on the other side of the beam, a U-frame fixed between the two back plates, and a Y-axis screw linear module installed on the inner wall on one side of the U-frame, the movable end of the Y-axis screw linear module is installed with a steel seat, and a Z-axis dual-axis cylinder is installed on the outer wall of the steel seat on the side close to the beam, a U-shaped extension frame is installed at the bottom end of the piston rod of the Z-axis dual-axis cylinder, and the pneumatic pickup unit is installed at the bottom end of the U-shaped extension frame.

[0016] Preferably, the pneumatic picking unit includes straight slots arranged on both sides of the bottom end of the dual-axis moving unit and suction cups installed inside the straight slots. There are four suction cups in total, and the four suction cups are symmetrically structured about the vertical center reference plane of the U-shaped extension frame.

[0017] The present invention also provides an automated blanking method for electronic parts processing, such as the automated blanking device for electronic parts processing described above, comprising the following steps:

[0018] S101: placing the PCB substrate to be processed in the pull-type plate fixture, fixing the PCB substrate by the pull-type plate fixture, so as to stably clamp the PCB substrate to be processed, ensuring that it will not be displaced or tilted during the processing. When the PCB substrate is processed and unloading operation is performed, the staff turns on the gear-type hydraulic flipping module through the PLC controller to work. The gear-type hydraulic flipping module uses hydraulic pressure to stably flip the PCB substrate from one direction to another. At this time, the side with electronic parts faces upward, and the surface of the substrate becomes smoother after flipping;

[0019] S102: When the PCB substrate is turned over and the back of the substrate faces upward, the pull-type panel tooling actively releases the PCB substrate so that the PCB substrate falls onto the flexible receiving structure to ensure that the substrate does not slide or tilt during transportation, and adjusts according to the size and shape of the substrate to ensure that each substrate can be optimally supported;

[0020] S103: After the substrate is turned over and placed securely on the flexible receiving structure, the dual-axis moving unit starts to work. The dual-axis moving unit controls the pneumatic pickup unit to move in the Z-axis and Y-axis directions, and makes the pneumatic pickup unit move smoothly along a predetermined path until the pneumatic pickup unit contacts the upward side of the substrate. The pneumatic pickup unit will be accurately adsorbed to the back side of the substrate to ensure that the substrate does not tilt or deflect during the handling process;

[0021] S104: After the unloading operation is completed, the pneumatic picking unit sucks the PCB substrate and transfers the substrate to the subsequent conveyor belt through the dual-axis moving unit. During this process, the PLC controller coordinates the actions of various components to ensure that the substrate can enter the next processing station smoothly and quickly, so as to send the substrate to the next link of the production line for the staff to take.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows: the automatic unloading equipment and method for processing electronic parts are provided with structures that cooperate with each other, such as a pull-type plate fixture, a gear-type hydraulic flipping module, a flexible receiving structure, and a double-axis moving unit, so that the PCB substrate to be processed is fixed in the pull-type plate fixture, and then turned over by the gear-type hydraulic flipping module to ensure that the side of the substrate with electronic parts faces the flexible receiving structure, and then the unloading and removal operations are completed by the double-axis moving unit and the pneumatic picking unit. After the flipping operation, the electronic components are transferred to the back of the substrate, and the turned substrate can be placed more stably on the flexible receiving structure, reducing the safety hazards caused by unevenness or unstable placement. In this way, the substrate is no longer exposed to the outside during transportation, which effectively avoids accidental damage during transportation, and ensures the stability and integrity of the components.

[0023] The substrate is flipped over by the hydraulic flipping module with the electronic components facing downward. At this time, there are no electronic components on the back of the flipped PCB substrate, and the surface is flatter and smoother, which is conducive to the grasping of the dual-axis moving unit and the pneumatic picking unit, ensuring that the substrate is stably and accurately grasped. At this time, the grasping surface of the pneumatic picking unit becomes more uniform and clear, reducing the operating difficulty caused by the complex layout of electronic parts, avoiding unstable grasping or misoperation during transportation, and after the substrate is turned over, it can be more conveniently processed by the next station through an automated conveyor belt or distribution system, allowing downstream stations to obtain substrates more effectively, reducing transportation delays caused by improper placement of substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0025] Figure 2 It is a side view structural schematic diagram of the present invention;

[0026] Figure 3 The three-dimensional structure of the present invention is shown in FIG. Figure 1 ;

[0027] Figure 4 The three-dimensional structure of the present invention is shown in FIG. Figure 2 ;

[0028] Figure 5 The three-dimensional structure of the present invention is shown in FIG. Figure 3 ;

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of a gear-type hydraulic flip module according to the second embodiment of the present invention;

[0030] Figure 7 It is a schematic diagram of the three-dimensional structure of the pull-type plate tooling according to the second embodiment of the present invention;

[0031] Figure 8 It is a schematic diagram of the three-dimensional structure of the dual-axis moving unit according to the third embodiment of the present invention.

[0032] In the figure: 1, crossbeam; 2, L-shaped shaft frame; 3, cover; 4, main shaft; 5, gear-type hydraulic flip module; 501, hydraulic cylinder; 502, vertical slide; 503, rack; 504, driven gear; 505, turntable; 506, connecting seat; 6, pull-type plate fixture; 601, return frame; 602, clamping arm; 603, convex inner groove; 604, base; 605, first cylinder; 7. Back plate; 8. U-shaped frame; 9. Dual-axis moving unit; 901. Y-axis screw linear module; 902. Steel seat; 903. Z-axis dual-axis cylinder; 904. U-shaped extension frame; 10. Pneumatic pick-up unit; 11. Flexible supporting structure; 1101. T-shaped cross frame; 1102. Guide rod; 1103. Pallet; 1104. Sponge table; 1105. Coil spring; 12. PLC controller. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Embodiment 1, by Figures 1 to 5 The present invention comprises a crossbeam 1, both ends of the crossbeam 1 are fixed with L-shaped shaft frames 2, a cover 3 is fixed on the outer wall of the side close to the two L-shaped shaft frames 2, a main shaft 4 is rotatably installed inside the cover 3, and a pull-type plate fixture 6 for clamping a PCB substrate workpiece is installed between the opposite ends of the two main shafts 4, and a gear-type hydraulic flip module 5 for driving the pull-type plate fixture 6 to rotate the A axis is arranged inside one of the cover shells 3;

[0035] A flexible receiving structure 11 is arranged on an outer wall of one side of the crossbeam 1 and is located below the pull-type plate fixture 6. The flexible receiving structure 11 is used to receive the PCB substrate workpiece released by the pull-type plate fixture 6. A dual-axis moving unit 9 is installed on the outer wall of the other side of the crossbeam 1, and a pneumatic pickup unit 10 is installed on the Z-axis moving end of the dual-axis moving unit 9. The pneumatic pickup unit 10 is used to pick up the PCB substrate workpiece on the flexible receiving structure 11. A PLC controller 12 is installed on an outer wall of one side of the L-shaped shaft frame 2. The output end of the PLC controller 12 is electrically connected to the input end of the gear-type hydraulic flip module 5, the pull-type plate fixture 6, the dual-axis moving unit 9, and the pneumatic pickup unit 10 respectively;

[0036] An automatic blanking method for electronic parts processing of this embodiment, such as the automatic blanking equipment for electronic parts processing described above, comprises the following steps:

[0037] S101: placing the PCB substrate to be processed in the pull-type plate fixture 6, fixing the PCB substrate by the pull-type plate fixture 6, so as to stably clamp the PCB substrate to be processed, ensuring that it will not be displaced or tilted during the processing. When the PCB substrate is processed and unloading operation is performed, the staff starts the gear-type hydraulic flipping module 5 through the PLC controller 12 to work. The gear-type hydraulic flipping module 5 uses hydraulic pressure to stably flip the PCB substrate from one direction to another. At this time, the side with electronic parts faces upward, and the surface of the substrate becomes smoother after flipping.

[0038] S102: When the PCB substrate is turned over, with the back of the substrate facing upward, the pull-type panel tooling 6 actively releases the PCB substrate, so that the PCB substrate falls onto the flexible receiving structure 11, ensuring that the substrate does not slide or tilt during transportation, and adjusting according to the size and shape of the substrate to ensure that each substrate can be optimally supported;

[0039] S103: After the substrate is turned over and placed securely on the flexible receiving structure 11, the biaxial moving unit 9 starts to work, and the biaxial moving unit 9 controls the pneumatic pickup unit 10 to move in the Z-axis and Y-axis directions, and makes the pneumatic pickup unit 10 move smoothly along a predetermined path until the pneumatic pickup unit 10 contacts the upward side of the substrate. The pneumatic pickup unit 10 will be accurately adsorbed to the back side of the substrate to ensure that the substrate does not tilt or deflect during the transportation process;

[0040] S104: After the unloading operation is completed, the pneumatic picking unit 10 sucks the PCB substrate and transfers the substrate to the subsequent conveyor belt through the dual-axis moving unit 9. During this process, the PLC controller 12 coordinates the actions of various components to ensure that the substrate can enter the next processing station smoothly and quickly, so as to send the substrate to the next link of the production line for the staff to take.

[0041] Embodiment 2, based on embodiment 1, Figure 6 and Figure 7 It is given that the pull-type plate tooling 6 includes a return frame 601 fixed between two main shafts 4, clamping arms 602 slidably installed on both sides of the return frame 601, and a base 604 fixed on one side of the top of the clamping arm 602. The outer walls of the two clamping arms 602 that are close to each other are provided with convex inner grooves 603. A first cylinder 605 is installed between the two bases 604 in the horizontal direction. The input end of the first cylinder 605 is electrically connected to the output end of the PLC controller 12. The staff places the PCB substrate to be processed between the two clamping arms 602, and makes the side of the PCB substrate located in the convex inner groove 603 of the clamping arms 602. Then, the PLC controller 12 controls the first cylinder 605 to work, and the first cylinder 605 drives the two bases 604 and the two clamping arms 602 in the horizontal direction to approach each other until the PCB substrate is clamped by the clamping arms 602, so as to fix the PCB substrate in a stable position, thereby avoiding the displacement or tilt of the substrate during operation.

[0042] Pulleys are rotatably mounted on the outer walls of both sides of the clamping arm 602, and raceways for the pulleys to roll are arranged on the front and rear inner walls of the return frame 601. The clamping arm 602 is made of rubber material and is clamped and released pneumatically, ensuring that the substrate is firmly fixed without applying excessive force, thereby effectively preventing damage to the substrate, and the operator does not need to spend too much time adjusting the position of the workpiece, ensuring that the substrate can complete the unloading process quickly and stably, thereby improving the overall production efficiency;

[0043] The gear-type hydraulic flip module 5 includes a hydraulic cylinder 501 installed at the bottom end of one of the L-shaped shaft frames 2, a vertical slide 502 installed at the top of the piston rod of the hydraulic cylinder 501, and a rack 503 fixed on the left and right outer walls of the vertical slide 502. Two driven gears 504 are fixed at one end of the surface of the main shaft 4. The driven gear 504 and the rack 503 are meshed with each other. When the hydraulic cylinder 501 drives the vertical slide 502 and the rack 503 to move upward, the rack 503 drives the driven gear 504, the main shaft 4, and the return frame 601 to rotate along the A axis. A turntable 505 is fixed at one end of the main shaft 4 close to the return frame 601, and two symmetrical connecting seats 506 are fixed on the outer wall of the turntable 505 away from the driven gear 504. The return frame 601 is welded between the two connecting seats 506 in the vertical direction.

[0044] When the processed PCB substrate needs to be turned over, the hydraulic cylinder 501 is controlled by the PLC controller 12 to work, and the hydraulic cylinder 501 pushes the vertical slide 502 upward. Since the racks 503 on the outer walls of both sides of the vertical slide 502 are meshed with the driven gear 504, the Z-axis linear movement of the rack 503 is converted into the rotational movement of the driven gear 504, the spindle 4, and the return frame 601, until the return frame 601 and the clamped substrate workpiece are turned over, so that the substrate is facing downward;

[0045] Two symmetrical dovetail sleeves are fixed on the inner wall of one side of the cover shell 3, and a dovetail track is installed on the outer wall of the rack 503 away from the driven gear 504. The dovetail track and the dovetail sleeve are slidably connected, and the length of the dovetail track is equal to the length of the rack 503. The gear-type hydraulic flip module 5 is driven by hydraulic pressure to provide powerful power, and quickly and stably complete the flipping of the PCB substrate, which is particularly suitable for large or heavy PCB substrates, while ensuring that the substrate will not cause unnecessary displacement or damage during the flipping process.

[0046] Embodiment 3, based on embodiment 2, Figure 8The flexible bearing structure 11 includes a T-shaped cross frame 1101 fixed on the outer wall of one side of the cross beam 1, a guide rod 1102 slidably installed at the top corner of the T-shaped cross frame 1101, and a support plate 1103 fixed at one end of the surface of the guide rod 1102. A sponge table 1104 is installed on the upper surface of the support plate 1103. The sponge table 1104 is located below the return frame 601. A spiral spring 1105 coaxial with the guide rod 1102 is installed at the top corner of the T-shaped cross frame 1101. When the sponge table 1104 is fixed to the upper surface of the support plate 1103, the sponge table 1104 is located below the return frame 601. After the pull-type plate tooling 6 actively releases the substrate, the substrate falls onto the sponge table 1104. At this time, the sponge table 1104 actively supports the substrate. Under the action of the gravity of the substrate, the sponge table 1104, the support plate 1103 and the guide rod 1102 move downward, and the coil spring 1105 is compressed, so that the substrate is securely supported. During this process, the sponge table 1104 is relatively soft and has strong adaptability, which can effectively reduce scratches, deformation and other damages caused by improper contact during the handling and transmission of the substrate.

[0047] The double-axis moving unit 9 includes two back plates 7 fixed on the outer wall on the other side of the beam 1, a U-shaped frame 8 fixed between the two back plates 7, and a Y-axis screw linear module 901 installed on the inner wall of one side of the U-shaped frame 8. A steel seat 902 is installed on the moving end of the Y-axis screw linear module 901, and a Z-axis double-axis cylinder 903 is installed on the outer wall of the steel seat 902 close to the beam 1. A U-shaped extension frame 904 is installed at the bottom end of the piston rod of the Z-axis double-axis cylinder 903. The pneumatic pickup unit 10 is installed at the bottom end of the U-shaped extension frame 904. After the PCB substrate falls onto the sponge table 1104, the Y-axis screw linear module 901 is moved to the sponge table 1104. The module 901 drives the steel seat 902, the Z-axis double-axis cylinder 903, the U-shaped extension frame 904 and the pneumatic pickup unit 10 to move in the Y-axis direction until the pneumatic pickup unit 10 moves above the PCB substrate, and the Z-axis double-axis cylinder 903 drives the U-shaped extension frame 904 and the pneumatic pickup unit 10 to move downward, so that the pneumatic pickup unit 10 contacts the back of the PCB substrate. The PLC controller 12 precisely adjusts the Y-axis screw linear module 901 and the Z-axis double-axis cylinder 903, so that the pneumatic pickup unit 10 can move on a precise path, ensuring the accuracy of the substrate position during unloading;

[0048] The pneumatic pickup unit 10 includes straight slots arranged on both sides of the bottom end of the dual-axis moving unit 9 and suction cups installed inside the straight slots. There are four suction cups in total. The four suction cups are symmetrically structured about the vertical center reference plane of the U-shaped extension frame 904. The pneumatic pickup unit 10 is composed of two unilaterally symmetrical suction cups, which can quickly and accurately absorb the PCB substrate through the suction cups; the suction cups provide suction through an external air drive system, which can ensure that the substrate is firmly absorbed on the suction cup without causing excessive pressure or damage to the surface of the substrate.

[0049] When the embodiment of the present application is used, the staff first places the PCB substrate to be processed in the pull-type plate fixture 6, and fixes the PCB substrate by the pull-type plate fixture 6, so as to stably clamp the PCB substrate to be processed to ensure that it will not be displaced or tilted during the processing. In this process, the pull-type plate fixture 6 and the PCB substrate are fixed in a stable position to prepare for the subsequent processing and turning operations; when the PCB substrate is processed and the unloading operation is performed, the staff turns on the gear-type hydraulic turning module 5 through the PLC controller 12 to work, and the gear-type The hydraulic flip module 5 uses hydraulic pressure to flip the PCB substrate stably from one direction to another. At this time, the side with electronic parts faces upward, and the surface of the flipped substrate becomes smoother, which is helpful for the subsequent handling and unloading operations. In this process, the gear-type hydraulic flip module 5 provides a powerful and stable power source to ensure that the flipping process is smooth and vibration-free, and prevents the substrate from being damaged during the flipping process; when the PCB substrate is flipped over, the back of the substrate faces upward, and the pull-type plate fixture 6 actively releases the PCB substrate, so that the PCB substrate falls onto the flexible receiving structure 11, and the flexible receiving structure 11 A stable and flexible support platform is provided to ensure that the substrate will not slide or tilt during transportation, and the substrate is adjusted according to the size and shape of the substrate to ensure that each substrate can be optimally supported; after the substrate is turned over and placed securely on the flexible receiving structure 11, the dual-axis moving unit 9 starts to work, and the dual-axis moving unit 9 controls the pneumatic pickup unit 10 to move in the Z-axis and Y-axis directions, and makes the pneumatic pickup unit 10 move smoothly along a predetermined path until the pneumatic pickup unit 10 contacts the upward side of the substrate. Since the back of the turned-over substrate is flat and has no components, the pneumatic pickup unit 10 It will be precisely adsorbed to the back of the substrate to ensure that the substrate does not tilt or shift during transportation. In this process, the adsorption force of the pneumatic pickup unit 10 needs to be adjusted in advance to ensure that the substrate is firmly fixed without causing damage to the substrate. After completing the unloading operation, the pneumatic pickup unit 10 adsorbs the PCB substrate and transfers the substrate to the subsequent conveyor belt through the dual-axis moving unit 9. In this process, the PLC controller 12 coordinates the actions of various components to ensure that the substrate can enter the next processing station smoothly and quickly, so as to send the substrate to the next link of the production line for the staff to take.

[0050] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automated blanking device for electronic parts processing, characterized in that: include: A crossbeam (1), both ends of the crossbeam (1) are fixed with L-shaped shaft frames (2), a cover shell (3) is fixed on the outer wall of the two L-shaped shaft frames (2) on the side close to each other, a main shaft (4) is rotatably installed inside the cover shell (3), a pull-type plate fixture (6) for clamping a PCB substrate workpiece is installed between the opposite ends of the two main shafts (4), and a gear-type hydraulic flip module (5) is arranged inside one of the cover shells (3) for driving the pull-type plate fixture (6) to rotate the A axis; A flexible receiving structure (11) is arranged on an outer wall of one side of the crossbeam (1) and is located below the pull-type plate fixture (6). The flexible receiving structure (11) is used to receive a PCB substrate workpiece released by the pull-type plate fixture (6). A double-axis moving unit (9) is installed on the outer wall of the other side of the crossbeam (1), and a pneumatic pickup unit (10) is installed on the Z-axis moving end of the double-axis moving unit (9). The pneumatic pickup unit (10) is used to pick up the PCB substrate workpiece on the flexible receiving structure (11). A PLC controller (12) is installed on an outer wall of one side of the L-shaped shaft frame (2). The output end of the PLC controller (12) is electrically connected to the input ends of the gear-type hydraulic flipping module (5), the pull-type plate fixture (6), the double-axis moving unit (9), and the pneumatic pickup unit (10).

2. The automatic blanking equipment for electronic parts processing according to claim 1, characterized in that: The pull-type plate tooling (6) comprises a return frame (601) fixed between two main shafts (4), clamping arms (602) slidably installed on both sides of the return frame (601), and a base (604) fixed on one side of the top of the clamping arms (602), and convex inner grooves (603) are provided on the outer walls of the two clamping arms (602) adjacent to each other. A first cylinder (605) is installed between the two bases (604) in the horizontal direction, and the input end of the first cylinder (605) is electrically connected to the output end of the PLC controller (12).

3. The automatic blanking equipment for electronic parts processing according to claim 2 is characterized in that: Pulleys are rotatably mounted on both side outer walls of the clamp arm (602), and rolling tracks for the pulleys to roll are arranged on the front and rear inner walls of the return frame (601). The clamp arm (602) is made of rubber material.

4. The automatic blanking equipment for electronic parts processing according to claim 2 is characterized in that: The gear-type hydraulic flip module (5) comprises a hydraulic cylinder (501) installed at the bottom end of one of the L-shaped shaft frames (2), a vertical slide (502) installed at the top end of the piston rod of the hydraulic cylinder (501), and racks (503) fixed on the left and right outer walls of the vertical slide (502). Two driven gears (504) are fixed on one end of the surface of the main shaft (4), and the driven gears (504) and the racks (503) are meshed with each other. When the hydraulic cylinder (501) drives the vertical slide (502) and the racks (503) to move upward, the racks (503) drive the driven gears (504), the main shaft (4), and the return frame (601) to rotate along the A axis.

5. The automatic blanking equipment for electronic parts processing according to claim 4 is characterized in that: A turntable (505) is fixed to one end of the main shaft (4) close to the return frame (601), and two symmetrical connecting seats (506) are fixed to the outer wall of the turntable (505) on the side away from the driven gear (504), and the return frame (601) is welded between the two connecting seats (506) in the vertical direction.

6. The automatic blanking equipment for electronic parts processing according to claim 4, characterized in that: Two symmetrical dovetail sleeves are fixed on the inner wall of one side of the cover shell (3), and a dovetail track is installed on the outer wall of the rack (503) away from the driven gear (504). The dovetail track and the dovetail sleeve are slidably connected, and the length of the dovetail track is equal to the length of the rack (503).

7. The automatic blanking equipment for electronic parts processing according to claim 5, characterized in that: The flexible supporting structure (11) comprises a T-shaped cross frame (1101) fixed on the outer wall of one side of the cross beam (1), a guide rod (1102) slidably mounted at the top corner of the T-shaped cross frame (1101), and a support plate (1103) fixed at one end of the surface of the guide rod (1102); a sponge table (1104) is mounted on the upper surface of the support plate (1103); the sponge table (1104) is located below the return frame (601); and a coil spring (1105) coaxial with the guide rod (1102) is mounted at the top corner of the T-shaped cross frame (1101).

8. The automatic blanking equipment for electronic parts processing according to claim 7, characterized in that: The dual-axis moving unit (9) comprises two back plates (7) fixed on the outer wall on the other side of the crossbeam (1), a U-shaped frame (8) fixed between the two back plates (7), and a Y-axis screw linear module (901) installed on the inner wall on one side of the U-shaped frame (8); a steel seat (902) is installed on the moving end of the Y-axis screw linear module (901), and a Z-axis dual-axis cylinder (903) is installed on the outer wall on one side of the steel seat (902) close to the crossbeam (1); a U-shaped extension frame (904) is installed on the bottom end of the piston rod of the Z-axis dual-axis cylinder (903); and the pneumatic pickup unit (10) is installed at the bottom end of the U-shaped extension frame (904).

9. The automatic blanking equipment for electronic parts processing according to claim 8, characterized in that: The pneumatic picking unit (10) comprises straight slots arranged on both sides of the bottom end of the dual-axis moving unit (9) and suction cups installed inside the straight slots, and a total of four suction cups are arranged, and the four suction cups are symmetrically structured with respect to the vertical center reference plane of the U-shaped extension frame (904).

10. An automated blanking method for electronic parts processing, comprising the automated blanking device for electronic parts processing as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S101: placing the PCB substrate to be processed in the pull-type plate fixture (6), and fixing the PCB substrate by the pull-type plate fixture (6), so as to stably clamp the PCB substrate to be processed, ensuring that it will not be displaced or tilted during the processing. When the PCB substrate is processed and unloading operation is carried out, the staff starts the gear-type hydraulic flipping module (5) through the PLC controller (12) to work. The gear-type hydraulic flipping module (5) uses hydraulic pressure to stably flip the PCB substrate from one direction to another direction. At this time, the side with the electronic components faces upwards, and the surface of the substrate becomes smoother after flipping. S102: When the PCB substrate is turned over and the back of the substrate faces upward, the pull-type plate fixture (6) actively releases the PCB substrate so that the PCB substrate falls onto the flexible receiving structure (11), ensuring that the substrate does not slide or tilt during transportation, and adjusting according to the size and shape of the substrate to ensure that each substrate can be optimally supported; S103: After the substrate is turned over and placed securely on the flexible receiving structure (11), the dual-axis moving unit (9) starts to work. The dual-axis moving unit (9) controls the pneumatic pickup unit (10) to move in the Z-axis and Y-axis directions, and enables the pneumatic pickup unit (10) to move smoothly along a predetermined path until the pneumatic pickup unit (10) contacts the upward side of the substrate. The pneumatic pickup unit (10) is accurately adsorbed to the back side of the substrate to ensure that the substrate does not tilt or deflect during the transportation process; S104: After the unloading operation is completed, the pneumatic pick-up unit (10) sucks the PCB substrate and transfers the substrate to the subsequent conveyor belt through the dual-axis moving unit (9). During this process, the PLC controller (12) coordinates the actions of various components to ensure that the substrate can enter the next processing station smoothly and quickly, so as to send the substrate to the next link of the production line for the staff to take.

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