Automatic film pre-pasting equipment and automatic film pre-pasting method

Abstract

The invention relates to automatic film pre-pasting equipment and an automatic film pre-pasting method. The automatic film pre-pasting equipment comprises a rack, a plate feeding assembly, a film pre-pasting assembly and a plate discharging assembly. The plate feeding assembly comprises a plate feeding conveying structure and a plate storing structure which are arranged on one side of the rack side by side, and a plate taking and placing structure arranged above the plate storing structure and the plate feeding conveying structure. The pre-film-pasting assembly comprises a first pre-film-pasting mechanism and a second pre-film-pasting mechanism which are correspondingly arranged in the middle of the rack up and down, and a film-pasting gap corresponding to the plate feeding conveying structure is formed between the first pre-film-pasting mechanism and the second pre-film-pasting mechanism; the plate discharging assembly comprises a plate discharging conveying structure arranged on the other side of the rack and a plate pulling mechanism arranged above the plate discharging conveying structure. The problems that in the prior art, a manual circuit board film pre-pasting mode is adopted, one person needs to operate one machine, the phenomena of product wrinkles, dry film wrinkles and the like can occur when manual operation actions are not standard, and the product quality is affected can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to an automatic pre-lamination device and an automatic pre-lamination method. Background Art

[0002] In traditional technology, before vacuum lamination of circuit boards, dry films of corresponding sizes need to be cut according to the size of the circuit boards, and then the dry films are manually pre-laid on one side of the circuit boards by operators. The operators then pinch the corners of the circuit boards to flip the circuit boards over, and then manually pre-lay dry films on the other side of the circuit boards. The operators then pinch the corners of the circuit boards and transfer them to the production platform of the vacuum laminator for vacuum lamination. This manual method of pre-laminating circuit boards requires one person to operate one machine, and when manual operation is not standardized, product wrinkles and dry film wrinkles will occur, affecting product quality. Summary of the invention

[0003] The present invention provides an automatic pre-lamination device and an automatic pre-lamination method, which can solve the technical problem that the traditional technology adopts a manual method to pre-laminate circuit boards, which requires one person to operate one machine, and when the manual operation is not standardized, product wrinkles, dry film wrinkles and the like will occur, affecting product quality.

[0004] In order to solve the above technical problems, the present invention provides an automatic pre-lamination device, comprising:

[0005] frame;

[0006] A board feeding assembly, comprising a board feeding conveying structure and a board storing structure arranged side by side on one side of the frame, and a board taking and placing structure arranged above the board storing structure and the board feeding conveying structure;

[0007] A pre-film laminating assembly comprises a first pre-film laminating mechanism and a second pre-film laminating mechanism which are arranged in the middle of the frame in correspondence with each other, and a film laminating gap corresponding to the plate feeding and conveying structure is provided between the first pre-film laminating mechanism and the second pre-film laminating mechanism;

[0008] The board discharging assembly comprises a board discharging conveying structure arranged on the other side of the frame, and a board pulling mechanism arranged above the board discharging conveying structure.

[0009] Optionally, the first pre-film laminating mechanism and the second pre-film laminating mechanism both include a film laminating rack arranged on the frame, a film discharging mechanism arranged on the film laminating rack, a film pulling and fixing film suction plate mechanism corresponding to the film discharging mechanism, a film laminating suction block structure corresponding to the film pulling and fixing film suction plate mechanism, a dry film cutting structure corresponding to the film laminating suction block structure, and a material in-and-out sensor arranged at the film laminating gap, and the film laminating gap is formed between the two film laminating suction block structures.

[0010] Optionally, the film pulling and fixing film suction plate mechanism includes a U-shaped mounting frame rotatably arranged on the film sticking frame, a connecting shaft rotatably arranged between the two side plates of the U-shaped mounting frame, a connecting block respectively arranged on both sides of the connecting shaft, a telescopic driving member respectively arranged on the two side plates of the U-shaped mounting frame, a dry film adsorption positioning plate connected to the ends of the two telescopic driving members, and a connecting rod respectively arranged at the two ends of the dry film adsorption positioning plate, and the two connecting rods are movably passed through the two connecting blocks.

[0011] Optionally, the dry film adsorption positioning plate includes an adsorption plate body connected to the telescopic driving member and the connecting rod, and a dry film heating element arranged at the bottom or top of the adsorption plate body, and the side of the adsorption plate body is provided with a plurality of first vacuum adsorption holes for adsorbing the dry film supplied by the film discharging mechanism, and the dry film heating element is used to crimp the dry film onto the circuit board.

[0012] Optionally, the film discharge mechanism includes a film discharge reel rotatably arranged on the film sticking frame, a plurality of film discharge guide shafts rotatably arranged on the film sticking frame, and a film discharge limiting shaft rotatably arranged on the film sticking frame, the film discharge limiting shaft and the connecting shaft are arranged side by side and close to each other, and a positioning gap is formed therebetween, and the positioning gap corresponds to the side of the adsorption plate body where the plurality of first vacuum adsorption holes are provided.

[0013] Optionally, the film sticking suction block structure includes an arc-shaped suction block rotatably arranged on the film sticking frame, and a plurality of second vacuum suction holes for adsorbing the dry film supplied by the film discharging mechanism and the film pulling and fixing suction plate mechanism are provided on the arc-shaped surface of the arc-shaped suction block, and the film sticking gap is formed between two of the arc-shaped suction blocks.

[0014] Optionally, the dry film cutting structure includes a cutting guide frame arranged on the film sticking frame and corresponding to the film sticking suction block structure, a cutting knife slidably arranged on the cutting guide frame, and a cutting drive connected to the cutting knife, wherein the cutting drive is used to drive the cutting knife to move along the cutting guide frame.

[0015] Optionally, the plate pulling mechanism includes plate pulling guide rails arranged on both sides of the plate output conveying structure, a plate pulling frame slidingly arranged on the plate pulling guide rails on both sides, a plate pulling driving member arranged on the frame and connected to the plate pulling frame, and a plurality of plate pulling clamps protruding from one side of the plate pulling frame, the plate pulling clamps are arranged in front and behind correspondence with the film pasting gap, and the plate pulling driving member is used for driving the plate pulling frame and the plate pulling clamps thereon to approach or move away from the film pasting gap.

[0016] Optionally, the plate feeding conveying structure includes a first conveying frame arranged on the frame, and a conveying roller structure arranged on the first conveying frame, and the conveying direction of the conveying roller structure corresponds to the film pasting gap;

[0017] The plate-discharging conveying structure includes a second conveying frame arranged on the frame, a conveying roller structure arranged on the second conveying frame, and a first limiting roller and a second limiting roller arranged at both ends of the second conveying frame and located above the conveying roller structure. The conveying direction of the conveying roller structure is opposite to the film-laminating gap, and the pulling plate mechanism is slidably arranged on the second conveying frame and is arranged across the top of the conveying roller structure.

[0018] In addition, the present invention also provides an automatic pre-lamination method, which is applied to the automatic pre-lamination device as described above;

[0019] The method comprises:

[0020] Control the board-taking and placing structure of the board-feeding assembly to obtain the circuit board from the board storage structure, and move the circuit board to the board-feeding conveying structure on the side of the board storage structure, and control the board-feeding conveying structure to convey the circuit board to the film gap direction of the pre-filming assembly;

[0021] The first pre-film laminating mechanism and the second pre-film laminating mechanism of the pre-film laminating assembly are controlled to respectively convey two dry films to the film laminating gap in advance, and when it is detected that the circuit board is conveyed to the film laminating gap, the first pre-film laminating mechanism and the second pre-film laminating mechanism are controlled to respectively attach the two dry films to the starting ends of the two sides of the circuit board;

[0022] Control the plate pulling mechanism of the plate discharging assembly to clamp and pull the circuit board located at the film laminating gap and the dry film at the starting end of the two side surfaces thereof, and control the first pre-laminating mechanism and the second pre-laminating mechanism to respectively continuously laminate the two dry films on the two side surfaces of the circuit board passing through the film laminating gap;

[0023] When it is detected that the end of the circuit board leaves the film laminating gap, the first pre-laminating mechanism and the second pre-laminating mechanism are controlled to cut off the dry film adhered to the two sides of the circuit board from the end of the circuit board, and the board pulling mechanism is controlled to place the circuit board with pre-laminating on both sides on the board output conveying structure, and the board output conveying structure is controlled to convey the circuit board with pre-laminating on both sides to the next workstation.

[0024] The beneficial effects brought about by the technical solution provided by the present invention include:

[0025] The circuit board stored in the board storage structure can be automatically transferred to the board feeding conveying structure through the board taking and placing structure of the board feeding assembly, and the circuit board can be automatically conveyed to the film pasting gap of the pre-film pasting assembly through the board feeding conveying structure, and then the front and back sides of the circuit board can be pre-filmed respectively through the first pre-film pasting mechanism and the second pre-film pasting mechanism. In the process of pre-film pasting of the circuit board, the circuit board pre-pasted with dry film is pulled by the board pulling mechanism of the board output assembly, and the circuit board with dry film pasted on both sides is pulled and sent to the board output conveying structure, and then the circuit board pre-pasted with dry film is conveyed to the next workstation (i.e., the production platform of the vacuum laminating machine) through the board output conveying structure.

[0026] In this process, the automatic pre-lamination equipment can automatically load and unload the circuit board, and can automatically pre-lamination the dry film on the front and back of the circuit board at the same time, without the need to manually pre-lay the dry film on one side of the circuit board, then manually flip the circuit board, pre-lay the dry film on the other side of the circuit board, and then manually transfer it to the production platform of the vacuum laminating machine for vacuum lamination. In this way, not only can the efficiency of pre-lamination be greatly improved, the number of operators can be reduced and manpower can be saved, but also the phenomenon of product wrinkles and dry film wrinkles caused by improper manual operation can be reduced, thus ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 The three-dimensional structure diagram of the automatic pre-lamination device according to the embodiment of the present invention is shown in FIG. Figure 1 ;

[0029] Figure 2 The three-dimensional structure diagram of the automatic pre-lamination device according to the embodiment of the present invention is shown in FIG. Figure 2 ;

[0030] Figure 3 It is a schematic diagram of the three-dimensional structure of the plate feeding assembly of the automatic pre-lamination device according to an embodiment of the present invention;

[0031] Figure 4 The three-dimensional structure of the pre-film laminating component of the automatic pre-film laminating device according to the embodiment of the present invention is shown in FIG. Figure 1 ;

[0032] Figure 5 The three-dimensional structure of the pre-film laminating component of the automatic pre-film laminating device according to the embodiment of the present invention is shown in FIG. Figure 2 ;

[0033] Figure 6 The three-dimensional structure diagram of the first pre-film laminating mechanism or the second pre-film laminating mechanism of the pre-film laminating assembly according to the embodiment of the present invention is shown in FIG. Figure 1 ;

[0034] Figure 7 The three-dimensional structure diagram of the first pre-film laminating mechanism or the second pre-film laminating mechanism of the pre-film laminating assembly according to the embodiment of the present invention is shown in FIG. Figure 2 ;

[0035] Figure 8 It is a schematic diagram of the three-dimensional structure of the plate output assembly of the automatic pre-lamination device according to an embodiment of the present invention;

[0036] Fig. 9 The figure is a simplified block diagram showing the process of the automatic pre-lamination method according to an embodiment of the present invention.

[0037] In the figure: 10, automatic pre-film laminating equipment; 100, frame; 200, board feeding assembly; 210, board feeding conveying structure; 212, first conveying frame; 214, conveying roller structure; 220, board storage structure; 230, board taking and placing structure; 232, material taking and placing translation driving member; 234, material taking and placing lifting driving member; 236, material taking and placing adsorption frame; 300, pre-film laminating assembly; 301, first pre-film laminating mechanism; 302, second pre-film laminating mechanism; 303, film laminating gap; 310, film laminating frame; 320, film discharging mechanism; 322, film discharging reel; 324, film discharging guide shaft; 326, film discharging limiting shaft; 330, film pulling and fixing film suction plate mechanism; 332, U-shaped mounting frame; 333 , connecting shaft; 334, connecting block; 335, telescopic driving member; 336, dry film adsorption positioning plate; 3362, adsorption plate body; 3364, dry film heating member; 3366, first vacuum adsorption hole; 337, connecting rod; 340, film suction block structure; 342, arc adsorption block; 344, second vacuum adsorption hole; 350, dry film cutting structure; 352, cutting guide frame; 354, cutting knife; 356, cutting driving member; 400, board output assembly; 410, board output conveying structure; 412, second conveying frame; 414, conveying roller structure; 420, board pulling mechanism; 422, board pulling guide; 424, board pulling frame; 426, board pulling driving member; 428, board pulling fixture. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] like Figure 1 to Figure 2 As shown, the present invention proposes an automatic pre-lamination device 10, including a frame 100, a board feed assembly 200, a pre-lamination assembly 300, and a board discharge assembly 400 arranged on the frame 100 in sequence. The board feed assembly 200 can automatically take the circuit board to be pre-lamination and transport it to the pre-lamination assembly 300, and the pre-lamination assembly 300 can automatically transport the dry film to the lamination position and automatically pre-lay the dry film on both sides of the circuit board. The board discharge assembly 400 can assist the pre-lamination assembly 300 in laminating and discharging the circuit board, and transport the pre-lamination circuit board to the production platform of the vacuum laminator.

[0040] Specifically, the board-input assembly 200 may include a board-input conveying structure 210 and a board-storing structure 220 arranged side by side on one side of the frame 100, and a board-taking and placing structure 230 arranged above the board-storing structure 220 and the board-input conveying structure 210. Moreover, the pre-film laminating assembly 300 may include a first pre-film laminating mechanism 301 and a second pre-film laminating mechanism 302 arranged in the middle of the frame 100 in correspondence with each other, and a film laminating gap 303 corresponding to the board-input conveying structure 210 is provided between the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302. Moreover, the board-output assembly 400 may include a board-output conveying structure 410 arranged on the other side of the frame 100, and a board-pulling mechanism 420 arranged above the board-output conveying structure 410, and the board-pulling mechanism 420 is simultaneously matched with the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302.

[0041] The circuit board stored in the board storage structure 220 can be automatically transferred to the board input conveying structure 210 by the board taking and placing structure 230 of the board input assembly 200, and the circuit board can be automatically conveyed to the film gap 303 of the pre-filming assembly 300 by the board input conveying structure 210, and then the front and back sides of the circuit board can be pre-filmed respectively by the first pre-filming mechanism 301 and the second pre-filming mechanism 302. In the process of pre-filming the circuit board, the circuit board pre-filmed with dry film is pulled by the pulling mechanism 420 of the board output assembly 400, and the circuit board with dry film on both sides is pulled and sent to the board output conveying structure 410, and then the circuit board pre-filmed with dry film is conveyed to the next workstation (i.e., the production platform of the vacuum laminating machine) by the board output conveying structure 410.

[0042] In this process, the automatic pre-filming device 10 can automatically put the circuit board on and off, and can automatically pre-laminate the dry film on the front and back of the circuit board at the same time, without the need to manually pre-lay the dry film on one side of the circuit board, then manually flip the circuit board, then pre-lay the dry film on the other side of the circuit board, and then manually transfer it to the production platform of the vacuum laminating machine for vacuum laminating. In this way, not only can the efficiency of pre-laminating be greatly improved, the number of operators can be reduced to save manpower, but also the phenomenon of product wrinkles and dry film wrinkles caused by improper manual operation can be reduced, thereby ensuring product quality.

[0043] Furthermore, if Figures 2 to 3 As shown, the board feeding conveying structure 210 of the board feeding assembly 200 may include a first conveying frame 212 disposed on the frame 100, and a conveying roller structure 214 disposed on the first conveying frame 212, the conveying direction of the conveying roller structure 214 corresponds to the film pasting gap 303 between the first pre-film pasting mechanism 301 and the second pre-film pasting mechanism 302, and the board storage structure 220 is located on the side of the conveying roller structure 214. Through the board storage structure 220 and the board taking and placing structure 230 above the board feeding conveying structure 210, the circuit boards to be pasted stored on the board storage structure 220 can be grabbed and transferred to the conveying roller structure 214, and the circuit boards are transported to the film pasting gap 303 between the first pre-film pasting mechanism 301 and the second pre-film pasting mechanism 302 through the conveying roller structure 214.

[0044] In addition, the board feeding conveying structure 210 may also include a circuit board cleaning roller structure provided on the first conveying frame 212, and the circuit board cleaning roller structure may be located at the conveying end of the conveying roller structure 214. When the circuit board is conveyed to the film gap 303, the circuit board cleaning roller structure may clean the surface of the circuit board, and the circuit board may be limited so that the circuit board is conveyed to the film gap 303 and is not easily offset. In addition, the conveying roller structure 214 may be extended along the longitudinal direction of the frame 100, that is, the circuit board may be conveyed along the longitudinal direction of the frame 100.

[0045] Furthermore, the board storage structure 220 may include a board storage rack disposed on the frame 100 and located on the side of the first conveyor frame 212, and the board storage rack may be used to store a tray loaded with a plurality of stacked circuit boards, or directly used to store a plurality of stacked circuit boards. Furthermore, the board storage structure 220 may also include a circuit board lifting structure disposed on the board storage rack, which may lift and transfer the tray or the circuit board. In addition, a limiting plate structure may be disposed on the board storage rack, which may limit the position of the tray or the circuit board from all sides. In addition, the board storage rack and the first conveyor frame 212 may be disposed side by side in the transverse direction of the frame 100, so that the board feeding conveying structure 210 and the board storage structure 220 are disposed side by side in the transverse direction on the frame 100.

[0046] Moreover, the board picking and placing structure 230 may include a material picking and placing translational driving member 232 disposed on the upper side of the frame 100 in the horizontal direction along the frame 100, a material picking and placing lifting driving member 234 connected to the material picking and placing translational driving member 232, and a material picking and placing adsorption frame 236 disposed on the material picking and placing lifting driving member 234. The material picking and placing translational driving member 232 is disposed horizontally between the board storage structure 220 and the conveying roller structure 214, and can perform translational driving of the material picking and placing adsorption frame 236 between the two; the material picking and placing adsorption frame 236 can be driven to approach or move away from the board storage structure 220 or the conveying roller structure 214 by the material picking and placing lifting driving member 234, so as to facilitate the picking and placing of the circuit board by the material picking and placing adsorption frame 236. In addition, the board picking and placing structure 230 may also include a material visual positioning structure disposed on the frame 100 or the material picking and placing lifting driving member 234, which can detect and position the circuit board, so as to facilitate accurate picking and releasing of the circuit board.

[0047] Furthermore, the material picking and unloading translation drive 232 may include a first motor linear drive module horizontally arranged on the frame 100, and the material picking and unloading lifting drive 234 may include a second motor linear drive module vertically arranged on the first motor linear drive module. Moreover, the material picking and unloading adsorption frame 236 may include an adsorption frame connected to the second motor linear drive module, a telescopic drive member 335 arranged on each side of the adsorption frame, an adsorption plate arranged on each telescopic drive member 335, and a plurality of vacuum suction nozzles arranged on each adsorption plate, and the two adsorption plates may be arranged side by side. The circuit board can be sucked or released from both sides by the plurality of vacuum suction nozzles on the two adsorption plates, and the adsorption plate can be further lifted and lowered by the telescopic drive member 335, and the adsorption height position can be finely adjusted.

[0048] In addition, if Figures 4 to 7 As shown, the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 of the pre-film laminating assembly 300 may include a film laminating frame 310 arranged on the frame 100, a film discharging mechanism 320 arranged on the film laminating frame 310, a film pulling and fixing film suction plate mechanism 330 corresponding to the film discharging mechanism 320, a film laminating suction block structure 340 corresponding to the film pulling and fixing film suction plate mechanism 330, a dry film cutting structure 350 corresponding to the film laminating suction block structure 340, and a material in-and-out sensor arranged at a film laminating gap 303, and a film laminating gap 303 is formed between the two film laminating suction block structures 340.

[0049] The dry film to be pasted on the surface of the circuit board can be supplied to the film pasting gap 303 by the film discharging mechanism 320, and the dry film can be positioned and pulled by the film pasting suction block structure 340 arranged at the film pasting gap 303, so that the dry film on the film discharging mechanism 320 moves to the film pasting gap 303 under the guidance of the film pasting suction block structure 340, and the dry film on the film discharging mechanism 320 can be pulled out by the film pulling and fixing suction plate mechanism 330, and the dry film moved to the film pasting gap 303 can also be pasted to the circuit board transported to the film pasting gap 303, so as to fix the end of the dry film on the surface of the circuit board; moreover, after the dry film is pre-pasted on the surface of a circuit board, the dry film can be cut off by the dry film cutting structure 350, so as to facilitate the transportation of the circuit board pasted with the dry film to the next station, and also facilitate the pasting of the dry film on another circuit board.

[0050] Among them, the inlet and outlet sensing element can be used to detect and sense the circuit board. When one side of the circuit board enters the film gap 303 and the circuit board is detected by the inlet and outlet sensing element, the film pulling and fixing film suction plate mechanism 330 can pull and discharge the dry film on the film discharge mechanism 320, and at the same time, the film pulling and fixing film suction plate mechanism 330 can adhere and fix the end of the dry film guided to the film gap 303 by the film suction block structure 340 to the edge of the surface of the circuit board, and fix the end of the dry film on the circuit board, so as to facilitate the pre-pasting of the dry film on the entire surface of the circuit board. Moreover, the circuit board with the dry film pasted can be pulled and discharged to the board discharge conveying structure 410 through the pulling plate mechanism 420 of the board discharge assembly 400. In the process of continuously pulling the circuit board out of the film gap 303, the dry film can be continuously guided and squeezed onto the surface of the paper circuit board through the film suction block structure 340. When the in-and-out material sensing element detects that the circuit board is completely pulled out of the film gap 303 (ie, the other side of the circuit board leaves the film gap 303 ), the dry film at the end of the circuit board can be cut off by the dry film cutting structure 350 .

[0051] Specifically, the first pre-film laminating mechanism 301 of the pre-film laminating assembly 300 may include a first film laminating frame 310 disposed on the upper side of the frame 100, a first film discharging mechanism 320 disposed on the first film laminating frame 310, a first film pulling and fixing film suction plate mechanism 330 corresponding to the first film discharging mechanism 320, a first film laminating suction block structure 340 corresponding to the first film pulling and fixing film suction plate mechanism 330, a first dry film cutting structure 350 corresponding to the first film laminating suction block structure 340, and a first material in-and-out sensor disposed at the film laminating gap 303. Moreover, the first film discharging mechanism 320 may be disposed on the top of the first film laminating frame 310, the first film laminating suction block structure 340 may be disposed on the bottom of the first film laminating frame 310, the first film pulling and fixing film suction plate mechanism 330 may be disposed between the first film discharging mechanism 320 and the first film laminating suction block structure 340, and the first dry film cutting structure 350 may be disposed on the side of the first film laminating suction block structure 340. That is, the dry film can be supplied from the first film discharging mechanism 320 at the top to the first film pasting frame 310 at the bottom, and the dry film can be pulled toward the first film pasting frame 310 through the first film pulling and fixing film suction plate mechanism 330 in the middle.

[0052] Furthermore, the second pre-film laminating mechanism 302 may include a second film laminating frame 310 disposed on the lower side of the frame 100, a second film discharging mechanism 320 disposed on the second film laminating frame 310, a second film drawing and fixing suction plate mechanism 330 corresponding to the second film discharging mechanism 320, a second film laminating suction block structure 340 corresponding to the second film drawing and fixing suction plate mechanism 330, a second dry film cutting structure 350 corresponding to the second film laminating suction block structure 340, and a second material in-and-out sensor disposed at the film laminating gap 303. The above-mentioned film laminating gap 303 is formed between the first film laminating suction block structure 340 and the second film laminating suction block structure 340. Correspondingly, the second film discharging mechanism 320 may be arranged at the bottom of the second film sticking frame 310, the second film sticking suction block structure 340 may be arranged at the top of the second film sticking frame 310, the second film pulling and fixing suction plate mechanism 330 may be arranged between the second film discharging mechanism 320 and the second film sticking suction block structure 340, and the second dry film cutting structure 350 may be arranged at the side of the second film sticking suction block structure 340. That is, the second film discharging mechanism 320 at the bottom supplies the dry film to the second film sticking frame 310 at the top, and the dry film may be pulled toward the second film sticking frame 310 through the second film pulling and fixing suction plate mechanism 330 in the middle.

[0053] In this embodiment, the first film laminating rack 310 and the second film laminating rack 310 can be integrated; the first material inlet and outlet sensor and the second material inlet and outlet sensor can be set as the same material inlet and outlet sensor, that is, the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 can be controlled by the same material inlet and outlet sensor. Moreover, the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 can be symmetrically arranged on the frame 100, so as to facilitate the pre-laminating of the dry film on the front and back of the circuit board at the same time, and make the dry film laminating more neat and reliable.

[0054] Further, the film sticking frame 310 (i.e., the first film sticking frame 310 or the second film sticking frame 310) may include a first side frame plate and a second side frame plate arranged side by side on the frame 100, and the film discharging mechanism 320, the film pulling and fixing film suction plate mechanism 330, the film sticking suction block structure 340, and the dry film cutting structure 350 may be arranged between the first side frame plate and the second side frame plate. Moreover, the film discharging mechanism 320 may include a film discharging reel 322 rotatably arranged between the first side frame plate and the second side frame plate, a plurality of film discharging guide shafts 324 rotatably arranged between the first side frame plate and the second side frame plate, and a film discharging limiting shaft 326 rotatably arranged between the first side frame plate and the second side frame plate, and the film discharging limiting shaft 326 may be arranged close to the film pulling and fixing film suction plate mechanism 330.

[0055] Moreover, the film discharging reel 322 can be detachably installed between the first side frame plate and the second side frame plate, and is used to pass the dry film roll; the film discharging guide shaft 324 and the film discharging limit shaft 326 are used to tension the dry film and guide the dry film to the film sticking suction block structure 340. Moreover, the film discharging reel 322 and the film discharging limit shaft 326 can be arranged on one side of the film sticking frame 310 (the side close to the film pulling and fixing film suction plate mechanism 330), and the plurality of film discharging guide shafts 324 can be arranged on the other side of the film sticking frame 310 (the side away from the film pulling and fixing film suction plate mechanism 330); moreover, the film discharging reel 322 and the film discharging limit shaft 326 can be arranged on the upper part and the lower part of the film sticking frame 310 respectively, and the plurality of film discharging guide shafts 324 can be arranged on the middle part of the film sticking frame 310, which is more conducive to tensioning the dry film so as to make the discharging smoother. Moreover, two film discharging reels 322 can be provided, and the two film discharging reels 322 are correspondingly movably arranged between the first side frame plate and the second side frame plate, so as to facilitate installation and replacement of dry film rolls, and the film discharging reel 322 on the lower side can be used to place the dry film rolls, and the film discharging reel 322 on the upper side can be used to limit and guide the dry film. In addition, the film discharging guide shaft 324 is arranged close to the film pulling and fixing film suction plate mechanism 330, so as to facilitate limiting the position of the dry film between the two so that the dry film is close to the film pulling and fixing film suction plate mechanism 330, so as to facilitate adsorption and positioning of the dry film and pulling and discharging.

[0056] In addition, the film pulling and fixing film suction plate mechanism 330 may include a U-shaped mounting frame rotatably arranged between the first side frame plate and the second side frame plate of the film sticking frame 310, a connecting shaft 333 rotatably arranged between the two side plates of the U-shaped mounting frame, a connecting block 334 arranged on each side of the connecting shaft 333, a telescopic driving member 335 arranged on each side plate of the U-shaped mounting frame, a dry film adsorption positioning plate 336 connected to the ends of the two telescopic driving members 335, and a connecting rod 337 arranged at each end of the dry film adsorption positioning plate 336, and the two connecting rods 337 are respectively movably passed through the two connecting blocks 334. When the dry film adsorption positioning plate 336 is driven to telescopically move from both ends by two telescopic driving members 335, the two connecting rods 337 connected to the dry film adsorption positioning plate 336 will telescopically move along the two connecting blocks 334, and the dry film adsorption positioning plate 336 can be guided and limited. At the same time, under the action of the telescopic driving member 335, the connecting block 334, the connecting rod 337, and the dry film adsorption positioning plate 336 will swing around the connecting shaft 333 as a whole. In addition, the telescopic driving member 335 can be set as a telescopic driving cylinder.

[0057] The dry film adsorption and positioning plate 336 can be driven to telescopically move by the telescopic driving member 335, so that the dry film adsorption and positioning plate 336 is moved to the side of the film sticking suction block structure 340, so that the dry film adsorption and positioning plate 336 can be moved to the film sticking gap 303, corresponding to the edge of the circuit board transported to the film sticking gap 303, so that the end of the dry film adsorbed and positioned by the film sticking suction block structure 340 can be pasted to the edge of the circuit board through the dry film adsorption and positioning plate 336; moreover, when the dry film adsorption and positioning plate 336 moves toward the film sticking suction block structure 340 under the drive of the telescopic driving member 335, it can not only move in a straight line, but also rotate at a preset angle, so that the side of the dry film adsorption and positioning plate 336 is closer to the dry film, which is convenient for adsorbing the dry film, so that the dry film adsorption and positioning plate 336 can drive the dry film to move toward the film sticking suction block structure 340, and the dry film can be pulled out, which is simple and convenient.

[0058] Furthermore, the dry film adsorption positioning plate 336 may include an adsorption plate body 3362 connected to the telescopic driving member 335 and the connecting rod 337, and a dry film heating member 3364 provided at the bottom or top of the adsorption plate body 3362, and a plurality of first vacuum adsorption holes 3366 for adsorbing the dry film supplied by the film discharging mechanism 320 are provided on the side of the adsorption plate body 3362, and the dry film heating member 3364 is used to press the dry film onto the circuit board. Moreover, the film discharging limiting shaft 326 of the film discharging mechanism 320 may be arranged side by side with the connecting shaft 333 to form a positioning gap between the two, and the positioning gap corresponds to the side of the adsorption plate body 3362 on which the plurality of first vacuum adsorption holes 3366 are provided. The dry film led out by the film discharging reel 322 and the film discharging guide shaft 324 of the film discharging mechanism 320 can be guided to the positioning gap between the film discharging limiting shaft 326 and the connecting shaft 333, so that the dry film is guided to the film sticking gap 303 at the film sticking suction block structure 340 when it is adjacent to the side of the adsorption plate body 3362 of the dry film adsorption positioning plate 336.

[0059] Before the dry film is pulled and positioned by the dry film adsorption and positioning plate 336, the dry film can be adsorbed and positioned by the multiple first vacuum adsorption holes 3366 on the side of the adsorption plate body 3362 of the dry film adsorption and positioning plate 336, so that when the adsorption plate body 3362 is driven by the telescopic driving member 335 to move toward the film suction block structure 340, the dry film can be pulled out from the film suction block structure 340. Moreover, through the dry film heating element 3364 at the bottom or top of the adsorption plate body 3362 of the dry film adsorption positioning plate 336, when the adsorption plate body 3362 is driven close to the film gap 303 at the film adsorption suction block structure 340, the dry film heating element 3364 on the adsorption plate body 3362 can be brought into contact with the end of the dry film located at the film gap 303, and the end of the dry film is thermally bonded to the edge of the surface of the circuit board located at the film gap 303, thereby fixing the end of the dry film to the edge of the surface of the circuit board, making it easier to completely attach the dry film to the entire surface of the circuit board. In addition, after the dry film adsorption positioning plate 336 completes the positioning and pulling out of the dry film, the adsorption positioning of the dry film can be released.

[0060] In addition, the film sticking suction block structure 340 may include an arc-shaped suction block 342 rotatably disposed between the first side frame plate and the second side frame plate of the film sticking frame 310, and a plurality of second vacuum suction holes 344 for sucking the dry film supplied by the film discharging mechanism 320 and the film pulling and fixing suction plate mechanism 330 are provided on the arc-shaped surface of the arc-shaped suction block 342, and a film sticking gap 303 is formed between the two arc-shaped suction blocks 342. The arc-shaped surface of the arc-shaped suction block 342 may be extended from the suction side of the suction plate body 3362 of the dry film adsorption and positioning plate 336 toward the film sticking gap 303, so that the dry film guided by the film discharging mechanism 320 and the film pulling and fixing suction plate mechanism 330 can be sucked and positioned through the plurality of second vacuum suction holes 344 on the arc-shaped suction block 342, so that the end of the dry film can be located at the film sticking gap 303, so as to correspond to the circuit board transported to the film sticking gap 303.

[0061] Moreover, by rotating the arc-shaped adsorption block 342, when guiding the dry film, the arc-shaped surface of the arc-shaped adsorption block 342 can be rotated in the direction of the film-pulling and film-fixing suction plate mechanism 330, which can not only increase the film-pasting gap 303 between the two film-pasting suction block structures 340 to facilitate the end of the dry film to paste the film gap 303, but also make the arc-shaped surface of the arc-shaped adsorption block 342 close to and parallel to the adsorption side surface of the adsorption plate body 3362 of the dry film adsorption positioning plate 336, so as to facilitate the adsorption and positioning of the dry film pulled out by the dry film adsorption positioning plate 336; moreover, when the dry film is laid on the circuit board at the film-pasting gap 303, the adsorption and positioning of the dry film can be released, and the arc-shaped adsorption block 342 can be rotated so that its arc-shaped surface is close to the surface of the circuit board in the film-pasting gap 303, so that the dry film can be better squeezed and fitted on the surface of the circuit board. Moreover, a separate rotating drive member may be provided to drive the arc-shaped adsorption block 342 to rotate; the pulling force of the pulling plate mechanism 420 may also be used to make the arc-shaped adsorption block 342 rotate under the pulling force of the dry film in the process of pulling the dry film to be laid on the circuit board, so as to clamp the circuit board at the film-pasting gap 303. In addition, an arc-shaped guide baffle may be provided on the outer side of the arc-shaped surface of the arc-shaped adsorption block 342, and a guide gap may be formed between the arc-shaped adsorption block 342 and the guide baffle, so that the dry film can smoothly pass through the guide gap to fit and position on the arc-shaped surface of the arc-shaped adsorption block 342, thereby guiding the end of the dry film to the film-pasting gap 303.

[0062] In addition, the dry film cutting structure 350 may include a cutting guide frame 352 disposed between the first side frame plate and the second side frame plate of the film pasting frame 310 and corresponding to the film pasting suction block structure 340, a cutting knife 354 slidably disposed on the cutting guide frame 352, and a cutting driving member 356 connected to the cutting knife 354, the cutting driving member 356 is used to drive the cutting knife 354 to move along the cutting guide frame 352. When the circuit board at the film pasting gap 303 is pulled out by the pulling plate mechanism 420, the dry film is continuously guided and pressed onto the circuit board by the arc surface of the arc suction block 342. When the film pasting is completed on the entire surface of the circuit board, the cutting knife 354 can be driven to move by the dry film cutting structure 350, so that the cutting knife 354 cuts off the dry film guided by the film pasting suction block structure 340 to the film pasting gap 303, so that the circuit board after film pasting is completed out.

[0063] Moreover, a plurality of third vacuum adsorption holes may also be provided on the side of the middle connecting plate of the U-shaped mounting frame of the film-pulling and film-fixing suction plate mechanism 330. The middle connecting plate may be located between the arc-shaped adsorption block 342 of the film-pasting suction block structure 340 and the dry film adsorption and positioning plate 336 of the film-pulling and film-fixing suction plate mechanism 330. When the dry film is cut by the cutting knife 354, the dry film may be adsorbed and positioned through the plurality of third vacuum adsorption holes on the middle connecting plate. After the dry film is cut, the adsorption and positioning of the dry film may be released, and the dry film may be adsorbed and positioned through the arc-shaped adsorption block 342 of the film-pasting suction block structure 340, so as to facilitate guiding the dry film to the film-pasting gap 303 again. Moreover, a cutting gap is formed between the cutting guide frame 352 and the side of the middle connecting plate of the U-shaped mounting frame. When the dry film is not cut, the dry film can be limited and guided, so that the dry film is smoothly guided and adsorbed to the arc surface of the arc adsorption block 342 through the cutting gap; when the dry film is cut, the middle connecting plate of the U-shaped mounting frame can be combined to limit the dry film to avoid the dry film from deviating during cutting. Moreover, a cutting knife groove can be set on the side of the middle connecting plate of the U-shaped mounting frame to cooperate with the cutting knife 354.

[0064] In addition, if Figure 2 and Figure 8As shown, the board delivery conveying structure 410 may include a second conveying frame 412 disposed on the frame 100, a conveying roller structure 414 disposed on the second conveying frame 412, and a first limiting roller and a second limiting roller disposed at both ends of the second conveying frame 412 and located above the conveying roller structure 414. The conveying direction of the conveying roller structure 414 is opposite to the film pasting gap 303 (referring to the direction away from the film pasting gap 303). The plate pulling mechanism 420 is slidably disposed on the second conveying frame 412 and is disposed across the conveying roller structure 414. The circuit board with dry film pasted pulled out from the film pasting gap 303 by the plate pulling mechanism 420 can be moved to the conveying roller structure 414 and conveyed to the vacuum laminating machine for laminating through the conveying roller structure 414. Moreover, when the circuit board is conveyed by the conveying roller structure 414, the circuit board can be limited by the first limiting roller and the second limiting roller so that the circuit board remains straight during the conveying process.

[0065] Moreover, the plate pulling mechanism 420 may include a plate pulling guide rail 422 arranged on both sides of the plate output conveying structure 410, a plate pulling frame 424 slidingly arranged on the plate pulling guide rail 422 on both sides, a plate pulling driving component 426 arranged on the frame 100 and connected to the plate pulling frame 424, and a plurality of plate pulling clamps 428 protruding from one side of the plate pulling frame 424, the plate pulling clamps 428 are arranged corresponding to the film gap 303 in front and back, and the plate pulling driving component 426 is used to drive the plate pulling frame 424 and the plate pulling clamps 428 thereon to approach or move away from the film gap 303.

[0066] When the circuit board is conveyed to the film pasting gap 303 by the board feeding conveying structure 210, and the end of the dry film is bonded to the edge of the surface of the circuit board by the film pulling, fixing and sucking plate mechanism 330, the multiple plate pulling clamps 428 on the plate pulling frame 424 can be driven to move to the film pasting gap 303 by the plate pulling driving member 426 of the plate pulling mechanism 420, and the multiple plate pulling clamps 428 arranged side by side can simultaneously clamp the edges of the front and back sides of the circuit board (starting ends), as well as the ends of each dry film bonded to the edges of the two sides, and then the multiple plate pulling clamps 428 on the plate pulling frame 424 are driven by the plate pulling driving member 426 to move onto the conveying roller structure 414 in the direction away from the film pasting gap 303, so that the circuit board and the dry film can be gradually pulled out of the film pasting gap 303. When the circuit board and the dry film are pulled out by the plate pulling mechanism 420, the arc-shaped adsorption blocks 342 of the film sticking suction block structure 340 on both sides of the film sticking gap 303 can continuously squeeze the dry film to be pre-sticked on the two surfaces of the circuit board. Moreover, the plate pulling drive 426 can be set as a motor linear drive module. In addition, the plate pulling mechanism 420 may include a plurality of clamp lifting drive members provided on the plate pulling frame 424, and the plurality of clamp lifting drive members are connected to a plurality of plate pulling clamps 428 in a one-to-one correspondence, and are used to drive the plate pulling clamps 428 to move up and down so as to clamp and place the circuit board on the board feeding conveying structure 210.

[0067] The automatic pre-film laminating device 10 provided by the present invention can realize automatic board taking and transmission, and no manual operation is required during production. The dry film can be pre-laid on both sides of the product at the same time, and the corresponding dry film size can be cut, which can improve the utilization rate of the equipment and reduce the number of defective products caused by manual operation. Originally, each person operated one machine, but now multiple devices can be operated at the same time, saving manpower; no independent cutting equipment is required, and the cutting equipment can be eliminated and manpower can be saved; the defect rate caused by manual film laminating is reduced.

[0068] In addition, the present invention also proposes an automatic pre-lamination method, which is applied to the automatic pre-lamination device 10 as described above. Specifically, Fig. 9 As shown, the automatic pre-lamination method may include the following steps:

[0069] S100, controlling the board taking and placing structure 230 of the board feeding assembly 200 to obtain the circuit board from the board storage structure 220, and transferring the circuit board to the board feeding conveying structure 210 on the side of the board storage structure 220, and controlling the board feeding conveying structure 210 to convey the circuit board toward the film gap 303 of the pre-film lamination assembly 300;

[0070] S200, controlling the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 of the pre-film laminating assembly 300 to respectively transport two dry films to the film laminating gap 303 in advance, and when detecting that the circuit board is transported to the film laminating gap 303, controlling the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 to respectively attach the two dry films to the starting ends of the two sides of the circuit board;

[0071] S300, controlling the plate pulling mechanism 420 of the plate discharging assembly 400 to clamp and pull the circuit board located at the film laminating gap 303 and the dry films at the starting ends of the two sides thereof, and controlling the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 to respectively continuously laminate the two dry films on the two side surfaces of the circuit board passing through the film laminating gap 303;

[0072] S400, when it is detected that the end of the circuit board leaves the film laminating gap 303, the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 are controlled to cut off the dry film adhered to the two sides of the circuit board from the end of the circuit board, and the plate pulling mechanism 420 is controlled to place the circuit board with pre-laminating on both sides on the plate output conveying structure 410, and the plate output conveying structure 410 is controlled to convey the circuit board with pre-laminating on both sides to the next station.

[0073] Through the automatic pre-lamination method provided by the present invention, the board feeding assembly 200 can be controlled to automatically convey the circuit board to be laminarized to the pre-lamination assembly 300 to the lamination gap 303 between the first pre-lamination mechanism 301 and the second pre-lamination mechanism 302 of the pre-lamination assembly 300, and the first pre-lamination mechanism 301 and the second pre-lamination mechanism 302 of the pre-lamination assembly 300 can be controlled to automatically pre-laminate from the front and back sides of the circuit board at the same time, and the pulling mechanism 420 of the board output assembly 400 can be controlled to pull and discharge the circuit board and the dry film pre-laminarized on both sides of the circuit board, so that the dry film can be automatically and completely pre-laminarized on the front and back sides of the circuit board, and the circuit board after pre-lamination can be automatically conveyed to the vacuum laminating machine (i.e., the next station).

[0074] Further, in step S100, the board taking and placing structure 230 of the board feeding assembly 200 is controlled to obtain the circuit board from the board storage structure 220, and the circuit board is transferred to the board feeding conveying structure 210 on the side of the board storage structure 220, and the board feeding conveying structure 210 is controlled to convey the circuit board to the film gap 303 of the pre-filming assembly 300, which may further include the following steps:

[0075] S110, stacking a plurality of circuit boards to be laminated on the board storage rack in the board storage structure 220 in advance, or placing them on a tray on the board storage rack, controlling the material taking and placing translation driving member 232 of the board taking and placing structure 230 of the board feeding assembly 200 to drive the material taking and placing adsorption rack 236 to translate horizontally to just above the circuit board on the board storage rack, controlling the material taking and placing lifting driving member 234 of the board taking and placing structure 230 to descend to the top of the circuit board on the board storage rack, and controlling the material taking and placing adsorption rack 236 of the board taking and placing structure 230 to adsorb and grab the circuit board on the board storage rack;

[0076] S120, control the material picking and placing lifting and driving member 234 of the board picking and placing structure 230 to drive the material picking and placing suction rack 236 and the circuit board it grabs to rise to a preset height position away from the circuit board on the board storage rack, control the material picking and placing translation driving member 232 to drive the material picking and placing suction rack 236 and the circuit board it grabs to translate horizontally to the top of the conveying roller structure 214 of the board feeding conveying structure 210, and control the material picking and placing lifting and driving member 234 to drive the material picking and placing suction rack 236 and the circuit board it grabs to descend to a surface position close to the conveying roller structure 214, and control the material picking and placing suction rack 236 to place the grabbed circuit board on the conveying roller structure 214; then, the board picking and placing structure 230 can be controlled to reset to control it to grab and transfer the next circuit board;

[0077] S130, controlling the conveying roller structure 214 of the board feeding conveying structure 210 to convey the circuit board thereon to the film laminating gap 303 between the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 of the pre-film laminating assembly 300; and, during the conveying process, the circuit board cleaning roller structure at the conveying end of the conveying roller structure 214 can be controlled to clean the front and back sides of the circuit board.

[0078] In addition, in step S200, the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 of the pre-film laminating assembly 300 are controlled to respectively transport two dry films to the film laminating gap 303 in advance, which may further include the following steps:

[0079] S210, pre-placing two rolls of dry film materials on the film discharge reel 322 of the film discharge mechanism 320 of the first pre-film laminating mechanism 301 and the film discharge reel 322 of the film discharge mechanism 320 of the second pre-film laminating mechanism 302, respectively, and using the film discharge guide shaft 324 and the film discharge limiting shaft 326 of the film discharge mechanism 320 of each pre-film laminating mechanism to guide the dry film of the dry film roll on the film discharge reel 322 to the arc surface of the arc adsorption block 342 of the corresponding film laminating suction block structure 340;

[0080] S220, controlling the plurality of second vacuum adsorption holes 344 on the arc surface of the arc adsorption block 342 of the film sticking suction block structure 340 to adsorb and position the end of the dry film, and positioning the end of the dry film of the two rolls of dry film respectively at the film sticking gap 303 between the arc adsorption blocks 342 of the two film sticking suction block structures 340.

[0081] Moreover, in step S200, when it is detected that the circuit board is transported to the film laminating gap 303, the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 are controlled to respectively laminarize two dry films on the starting ends of the two sides of the circuit board, which may further include the following steps:

[0082] S230, when the conveying roller structure 214 of the board feeding conveying structure 210 is controlled to convey the circuit board to the film laminating gap 303 of the pre-laminating assembly 300, the circuit board is detected by the inlet and outlet sensing element provided at the film laminating gap 303;

[0083] S240, when the inlet and outlet sensing component detects that one end of the circuit board enters the film pasting gap 303, the film pulling and fixing suction plate mechanism 330 of the first pre-film pasting mechanism 301 and the film pulling and fixing suction plate mechanism 330 of the second pre-film pasting mechanism 302 are controlled to respectively adhere the ends of the dry film positioned on the arc-shaped adsorption blocks 342 of the corresponding film pasting suction block structures 340 to the starting end of the front side of the circuit board (i.e., the edge of one side of the front side of the circuit board initially entering the film pasting gap 303) and the starting end of the back side (i.e., the edge of one side of the back side of the circuit board initially entering the film pasting gap 303) from both sides.

[0084] Furthermore, in step S240, the film pulling and fixing suction plate mechanism 330 of the first pre-film laminating mechanism 301 and the film pulling and fixing suction plate mechanism 330 of the second pre-film laminating mechanism 302 are controlled to respectively adhere the ends of the dry film positioned on the arc-shaped adsorption blocks 342 of the corresponding film laminating suction block structures 340 to the starting ends of the front side and the back side of the circuit board from both sides, which may further include the following steps:

[0085] S242, controlling the plurality of first vacuum adsorption holes 3366 on the side of the adsorption plate body 3362 of the dry film adsorption and positioning plate 336 of the film pulling and fixing suction plate mechanism 330 of the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302, respectively adsorbing and positioning the dry film portion located between the film laminating suction block structure 340 and the film discharging mechanism 320 of the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302;

[0086] S244, respectively controlling the telescopic driving members 335 of the film pulling, fixing and sucking machines of the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 to telescopically and rotationally drive the dry film adsorption and positioning plate 336 rotatably arranged on the U-shaped mounting frame, so that the dry film adsorption and positioning plate 336 moves to the side of the film laminating and sucking block structure 340, so that the dry film adsorption and positioning plate 336 corresponds to the starting end of the circuit board, and the dry film roll on the film discharging reel 322 of the film discharging mechanism 320 is pulled and discharged;

[0087] S246, controlling the dry film heating element 3364 on the dry film adsorption and positioning plate 336 to heat the ends of the dry film adsorbed and positioned by the film sticking suction block structure 340, so that the ends of the two dry films are respectively bonded to the starting ends of the front side and the back side of the circuit board;

[0088] S248, respectively controlling the adsorption plate bodies 3362 of the dry film adsorption and positioning plates 336 of the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 to release the adsorption and positioning of the dry film, and controlling the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 to reset.

[0089] In addition, in step S300, the board pulling mechanism 420 of the board discharging assembly 400 is controlled to clamp and pull the circuit board located at the film laminating gap 303 and the dry films at the starting ends of the two sides thereof, and the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 are controlled to continuously laminate the two dry films on the two side surfaces of the circuit board passing through the film laminating gap 303, and the following steps may be further included:

[0090] S310, pre-controlling the plate pulling driving member 426 of the plate pulling mechanism 420 of the plate output assembly 400 to drive the plate pulling frame 424 and the plurality of plate pulling clamps 428 thereon to move to the exit side of the film laminating gap 303;

[0091] S320, when the starting end of the front side and the starting end of the back side of the circuit board located at the film pasting gap 303 have completed the pasting of the end of the dry film, the multiple pulling plate clamps 428 of the pulling plate mechanism 420 are controlled to clamp the starting end of the circuit board and the dry films on both sides thereof from different positions at the same time, and the arc surfaces of the arc adsorption blocks 342 of the two film pasting suction block structures 340 are controlled to release the adsorption and positioning of the dry films;

[0092] S330, control the plate pulling driving member 426 of the plate pulling mechanism 420 to drive the plate pulling frame 424 and the multiple plate pulling clamps 428 thereon to pull in the direction away from the exit side of the film pasting gap 303, so that the dry film on the arc surface of the arc adsorption block 342 attached to the two film pasting suction block structures 340 respectively drives the corresponding arc adsorption block 342 to rotate, so that the arc surface of the arc adsorption block 342 continuously squeezes the corresponding dry film and adheres it to the two side surfaces (front and back) of the circuit board passing through the film pasting gap 303.

[0093] In addition, in step S400, when it is detected that the end of the circuit board leaves the film laminating gap 303, the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 are controlled to cut off the dry film attached to the two sides of the circuit board from the end of the circuit board, which may further include the following steps:

[0094] S410, when the other end (i.e., the end) of the circuit board is detected to leave the film laminating gap 303 by the inlet and outlet sensing element, the plate pulling driving element 426 of the plate pulling mechanism 420 is controlled to stop working, and the plurality of third vacuum adsorption holes on the side of the middle connecting plate of the U-shaped mounting frame of the two film pulling and fixing film suction plate mechanisms 330 are respectively controlled to adsorb and position the dry film;

[0095] S420, respectively controlling the dry film cutting structures 350 of the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 to cut the dry films on both sides, and cutting off the dry films attached to the two side surfaces of the circuit board from the end of the circuit board.

[0096] Moreover, the above step S420 may further include the following steps:

[0097] S422, respectively controlling the cutting driving members 356 of the dry film cutting structures 350 of the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 to drive the cutting blade 354 to slide along the cutting guide rail frame 352 corresponding to the film laminating suction block structure 340, so that the cutting blade 354 cuts the dry film adsorbed and positioned on the side of the middle connecting plate of the U-shaped mounting frame, and cuts off the dry film attached to the two side surfaces of the circuit board from the end of the circuit board;

[0098] S424, control the plate pulling mechanism 420 to pull the circuit board with the dry film cut off to the preset position of the plate pulling mechanism 420, and release the adsorption and positioning of the dry film by the side of the middle connecting plate of the U-shaped mounting frame, and at the same time control the multiple second vacuum adsorption holes 344 on the arc surface of the arc adsorption block 342 of the film sticking suction block structure 340 to adsorb and position the dry film so that the end of the dry film is located at the film sticking gap 303 again.

[0099] Moreover, in step S400, the board pulling mechanism 420 is controlled to place the circuit board with pre-laminated films on both sides on the board delivery conveying structure 410, and the board delivery conveying structure 410 is controlled to deliver the circuit board with pre-laminated films on both sides to the next station, which may further include the following steps:

[0100] S430, control the multiple plate pulling clamps 428 of the plate pulling mechanism 420 to simultaneously release the clamping of the pre-laminated circuit board, so that the pre-laminated circuit board falls onto the conveying roller structure 414 of the board output conveying structure 410; control the conveying roller structure 414 to convey the pre-laminated circuit board to the next station, so that the pre-laminated circuit board reaches the vacuum laminating machine.

[0101] Moreover, the automatic pre-lamination device 10 as described above may include a controller connected to the board inlet assembly 200, the pre-lamination assembly 300, and the board outlet assembly 400, for controlling the automatic pre-lamination device 10 to implement the automatic pre-lamination method described above.

[0102] In addition, the present invention also proposes an automatic pre-lamination system, which is applied to the automatic pre-lamination device 10. Specifically, the automatic pre-lamination system may include:

[0103] The board feeding control module is used to control the board taking and placing structure 230 of the board feeding assembly 200 to obtain the circuit board from the board storage structure 220, and transfer the circuit board to the board feeding conveying structure 210 on the side of the board storage structure 220, and control the board feeding conveying structure 210 to convey the circuit board to the film gap 303 of the pre-filming assembly 300;

[0104] The circuit board film laminating control module is used to control the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 of the pre-laminating assembly 300 to respectively transport two dry films to the laminating gap 303 in advance, and when it is detected that the circuit board is transported to the laminating gap 303, the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 are controlled to respectively attach the two dry films to the starting ends of the two sides of the circuit board;

[0105] The board pulling control module is used to control the board pulling mechanism 420 of the board discharging assembly 400 to clamp and pull the circuit board located at the film laminating gap 303 and the dry films at the starting ends of the two sides thereof, and control the first pre-laminating mechanism 301 and the second pre-laminating mechanism 302 to respectively continuously laminate the two dry films on the two side surfaces of the circuit board passing through the film laminating gap 303;

[0106] The board output control module is used to control the first pre-film laminating mechanism 301 and the second pre-film laminating mechanism 302 to cut off the dry film adhered to the two sides of the circuit board from the end of the circuit board when it is detected that the end of the circuit board leaves the film laminating gap 303, and control the board pulling mechanism 420 to place the circuit board with pre-films on both sides on the board output conveying structure 410, and control the board output conveying structure 410 to convey the circuit board with pre-films on both sides to the next station.

[0107] The automatic pre-film lamination system described in this embodiment corresponds to the automatic pre-film lamination method described above. The functions of each module in the automatic pre-film lamination system in this embodiment are described in detail in the corresponding method embodiment and will not be repeated here.

[0108] Based on the same inventive concept, an embodiment of the present application further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, all or part of the method steps in the above-mentioned automatic pre-film lamination method are implemented.

[0109] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program running on the processor, and when the processor executes the computer program, all or part of the method steps in the above-mentioned automatic pre-film lamination method are implemented.

[0110] It should be noted that, in the present invention, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0111] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. An automatic pre-lamination device, characterized in that: include: frame; A board feeding assembly, comprising a board feeding conveying structure and a board storing structure arranged side by side on one side of the frame, and a board taking and placing structure arranged above the board storing structure and the board feeding conveying structure; A pre-film laminating assembly comprises a first pre-film laminating mechanism and a second pre-film laminating mechanism which are arranged in the middle of the frame in correspondence with each other, and a film laminating gap corresponding to the plate feeding and conveying structure is provided between the first pre-film laminating mechanism and the second pre-film laminating mechanism; The board discharging assembly comprises a board discharging conveying structure arranged on the other side of the frame, and a board pulling mechanism arranged above the board discharging conveying structure.

2. The automatic pre-lamination equipment according to claim 1, characterized in that: The first pre-film laminating mechanism and the second pre-film laminating mechanism both include a film laminating frame arranged on the frame, a film discharging mechanism arranged on the film laminating frame, a film pulling and fixing film suction plate mechanism corresponding to the film discharging mechanism, a film laminating suction block structure corresponding to the film pulling and fixing film suction plate mechanism, a dry film cutting structure corresponding to the film laminating suction block structure, and a material in-and-out sensor arranged at the film laminating gap, wherein the film laminating gap is formed between the two film laminating suction block structures.

3. The automatic pre-lamination equipment according to claim 2, characterized in that: The film pulling, fixing and suction plate mechanism includes a U-shaped mounting frame rotatably arranged on the film sticking frame, a connecting shaft rotatably arranged between the two side plates of the U-shaped mounting frame, a connecting block arranged on each side of the connecting shaft, a telescopic driving member arranged on each side plate of the U-shaped mounting frame, a dry film adsorption positioning plate connected to the ends of the two telescopic driving members, and a connecting rod arranged at each end of the dry film adsorption positioning plate, and the two connecting rods are movably arranged in the two connecting blocks respectively.

4. The automatic pre-lamination equipment according to claim 3, characterized in that: The dry film adsorption positioning plate includes an adsorption plate body connected to the telescopic driving member and the connecting rod, and a dry film heating member arranged at the bottom or top of the adsorption plate body. The side of the adsorption plate body is provided with a plurality of first vacuum adsorption holes for adsorbing the dry film supplied by the film discharging mechanism, and the dry film heating member is used to crimp the dry film onto the circuit board.

5. The automatic pre-lamination equipment according to claim 4, characterized in that: The film discharging mechanism includes a film discharging reel rotatably arranged on the film sticking frame, a plurality of film discharging guide shafts rotatably arranged on the film sticking frame, and a film discharging limiting shaft rotatably arranged on the film sticking frame, the film discharging limiting shaft and the connecting shaft are arranged side by side and close to each other, and a positioning gap is formed therebetween, and the positioning gap corresponds to the side surface of the adsorption plate body on which the plurality of the first vacuum adsorption holes are arranged.

6. The automatic pre-lamination equipment according to any one of claims 2 to 5, characterized in that: The film sticking suction block structure includes an arc-shaped suction block rotatably arranged on the film sticking frame, and a plurality of second vacuum suction holes for sucking the dry film supplied by the film discharging mechanism and the film pulling and fixing suction plate mechanism are provided on the arc-shaped surface of the arc-shaped suction block, and the film sticking gap is formed between two of the arc-shaped suction blocks.

7. The automatic pre-lamination equipment according to any one of claims 2 to 5, characterized in that: The dry film cutting structure includes a cutting guide frame arranged on the film sticking frame and corresponding to the film sticking suction block structure, a cutting knife slidably arranged on the cutting guide frame, and a cutting drive connected to the cutting knife, wherein the cutting drive is used to drive the cutting knife to move along the cutting guide frame.

8. The automatic pre-lamination equipment according to any one of claims 1 to 5, characterized in that: The plate pulling mechanism includes plate pulling guide rails arranged on both sides of the plate output conveying structure, a plate pulling frame slidingly arranged on the plate pulling guide rails on both sides, a plate pulling driving member arranged on the frame and connected to the plate pulling frame, and a plurality of plate pulling clamps protruding from one side of the plate pulling frame, the plate pulling clamps are arranged in front and behind correspondence with the film pasting gap, and the plate pulling driving member is used for driving the plate pulling frame and the plate pulling clamps thereon to approach or move away from the film pasting gap.

9. The automatic pre-lamination equipment according to any one of claims 1 to 5, characterized in that: The plate feeding conveying structure comprises a first conveying frame arranged on the frame, and a conveying roller structure arranged on the first conveying frame, and the conveying direction of the conveying roller structure corresponds to the film pasting gap; The plate-discharging conveying structure includes a second conveying frame arranged on the frame, a conveying roller structure arranged on the second conveying frame, and a first limiting roller and a second limiting roller arranged at both ends of the second conveying frame and located above the conveying roller structure. The conveying direction of the conveying roller structure is opposite to the film-laminating gap, and the pulling plate mechanism is slidably arranged on the second conveying frame and is arranged across the top of the conveying roller structure.

10. An automatic pre-lamination method, applied to the automatic pre-lamination device as claimed in any one of claims 1 to 9; It is characterized in that The method comprises: Control the board-taking and placing structure of the board-feeding assembly to obtain the circuit board from the board storage structure, and move the circuit board to the board-feeding conveying structure on the side of the board storage structure, and control the board-feeding conveying structure to convey the circuit board to the film gap direction of the pre-filming assembly; The first pre-film laminating mechanism and the second pre-film laminating mechanism of the pre-film laminating assembly are controlled to respectively convey two dry films to the film laminating gap in advance, and when it is detected that the circuit board is conveyed to the film laminating gap, the first pre-film laminating mechanism and the second pre-film laminating mechanism are controlled to respectively attach the two dry films to the starting ends of the two sides of the circuit board; Control the plate pulling mechanism of the plate discharging assembly to clamp and pull the circuit board located at the film laminating gap and the dry film at the starting end of the two side surfaces thereof, and control the first pre-laminating mechanism and the second pre-laminating mechanism to respectively continuously laminate the two dry films on the two side surfaces of the circuit board passing through the film laminating gap; When it is detected that the end of the circuit board leaves the film laminating gap, the first pre-laminating mechanism and the second pre-laminating mechanism are controlled to cut off the dry film adhered to the two sides of the circuit board from the end of the circuit board, and the board pulling mechanism is controlled to place the circuit board with pre-laminating on both sides on the board output conveying structure, and the board output conveying structure is controlled to convey the circuit board with pre-laminating on both sides to the next workstation.

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