Heat dissipation device, fin device and electronic equipment

Abstract

The embodiment of the present application discloses a heat dissipation device, a fin device and an electronic device. The heat dissipation device comprises: a main body component, the main body component is used to dissipate heat from a heat-generating component; an impurity removal component, comprising a fixing portion and a deformation portion; the fixing portion is connected to the main body component, the deformation portion can have a first shape and a second shape based on temperature; during the switching process between the first shape and the second shape, the deformation portion can contact at least part of the main body component to remove impurities from the main body component.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, a fin device and an electronic device. Background Art

[0002] The heat dissipation structure is used to dissipate heat for electronic equipment such as air conditioners and computers to ensure that the electronic equipment can operate normally. In the related art, the heat dissipation structure is used to dissipate heat. During the long-term use of the heat dissipation structure, the heat dissipation performance of the heat dissipation structure often decreases, making the adaptability of the heat dissipation device poor. Summary of the invention

[0003] In view of this, embodiments of the present application are intended to provide a heat dissipation device, a fin device, and an electronic device.

[0004] To achieve the above purpose, the technical solution of this application is implemented as follows:

[0005] The embodiment of the present application provides a heat dissipation device, comprising:

[0006] A main body component, the main body component is used to dissipate heat from the heat-generating components;

[0007] A debris removal component, comprising a fixed portion and a deformable portion; the fixed portion is connected to the main component, and the deformable portion can have a first shape and a second shape based on temperature;

[0008] During the switching between the first shape and the second shape, the deformed portion can contact at least a portion of the body component to remove impurities from the body component.

[0009] In some optional implementations,

[0010] The main body component has a first state and a second state. The heat dissipation performance of the main body component in the first state is a first performance. The heat dissipation performance of the main body component in the second state is a second performance. The second performance is less than the first performance.

[0011] In the first state, the amount of impurities attached to the main component is a first amount;

[0012] In the second state, the amount of impurities attached to the main component is a second amount, and the second amount is greater than the first amount;

[0013] When the temperature of the impurity removal component is greater than or equal to the first set temperature, the impurity removal component switches from the first shape to the second shape;

[0014] When the temperature of the impurity removal component is lower than the first set temperature, the impurity removal component switches from the second shape to the first shape.

[0015] In some optional implementations, the main body assembly includes: a fan; the fan includes:

[0016] A seat portion, used for connecting with a driving member;

[0017] at least two blades are radially arranged on the outer peripheral side of the seat;

[0018] The debris removal assembly includes a first debris removal member disposed between two adjacent blades; and / or the debris removal assembly includes a second debris removal member disposed on an end side of the seat portion.

[0019] In some optional implementations,

[0020] The first fixing portion of the first debris removing member is connected to the outer peripheral side of the seat portion,

[0021] When the temperature is lower than the first set temperature, the first deformable portion of the first impurity removing member is curled and attached to the outer peripheral side of the seat portion.

[0022] When the temperature is greater than or equal to the first set temperature, the first deformation portion is in an expanded state and is located between two adjacent blades; and / or,

[0023] The second fixing portion of the second debris removing member is connected to the end side of the seat portion,

[0024] When the temperature is lower than the first set temperature, the second deformation portion of the second impurity removing member is attached to the end side of the seat portion in a first unfolded shape.

[0025] When the temperature is greater than or equal to the first set temperature, the second deformation portion is attached to one end of the at least two blades in a second expanded shape.

[0026] The present application also provides an electronic device, including:

[0027] A heat generating component and a heat dissipation device, wherein the heat dissipation device is used to provide heat dissipation for the heat generating component; the heat dissipation device comprises:

[0028] A main body component, the main body component is used to dissipate heat from the heat generating component;

[0029] A debris removal component, comprising a fixed portion and a deformable portion; the fixed portion is connected to the main component, and the deformable portion can have a first shape and a second shape based on temperature;

[0030] During the switching between the first shape and the second shape, the deformed portion can contact at least a portion of the body component to remove impurities from the body component.

[0031] In some optional implementations, the main body component has a first state and a second state, the heat dissipation performance of the main body component in the first state is a first performance, the heat dissipation performance of the main body component in the second state is a second performance, and the second performance is less than the first performance;

[0032] In the first state, the amount of impurities attached to the main component is a first amount, and in the second state, the amount of impurities attached to the main component is a second amount, and the second amount is greater than the first amount;

[0033] When the temperature of the impurity removal component is greater than or equal to the first set temperature, the impurity removal component switches from the first shape to the second shape;

[0034] When the temperature of the impurity removal component is lower than the first set temperature, the impurity removal component switches from the second shape to the first shape;

[0035] In the first state, and when the heat generating component operates at maximum power consumption, the temperature of the impurity removal component is lower than the first set temperature.

[0036] In some optional implementations, the main assembly includes a fan, and the heat generating component includes a processor;

[0037] The electronic device further comprises:

[0038] A detection component, used for detecting the temperature of the impurity removal component;

[0039] The processor is electrically connected to the detection component and the fan, respectively; the processor is used to control the increase of the rotation speed of the fan and / or the reduction of the power consumption of the processor when the detection component detects that the temperature of the impurity removal component is greater than or equal to the first set temperature, and is also used to control the fan to operate at a set rotation speed and / or control the processor to be in a normal power consumption mode when the detection component detects that the temperature of the impurity removal component is lower than the first set temperature.

[0040] In some optional implementations, the method further includes:

[0041] The fin assembly defines an air outlet channel; the fin assembly is in a folded shape;

[0042] The fin assembly can have a first folded shape and a second folded shape based on temperature;

[0043] In the case of the first folded shape, the fin assembly is located in the first area and the second area,

[0044] In the case of the second folded shape, the fin assembly is located in the first area and a first channel is formed in the second area.

[0045] In some optional implementations, when the temperature of the fin assembly is greater than or equal to a third set temperature, the fin assembly switches from the first folding shape to the second folding shape; when the temperature of the fin assembly is less than the third set temperature, the fin assembly switches from the second folding shape to the first folding shape.

[0046] In some optional implementations,

[0047] In the first folded shape, the fin assembly defines at least two air outlet channels of the first cross-section;

[0048] In the second folded shape, the fin assembly defines at least two air outlet channels of the second cross section; wherein the area of ​​the second cross section is smaller than the area of ​​the first cross section; and the area of ​​the cross section of the first channel is larger than the area of ​​the first cross section.

[0049] The present application also provides a fin device, comprising:

[0050] A fin assembly defines an air outlet channel; the fin assembly is in a folded shape; the fin assembly is used to dissipate heat from a heat-generating component, and the fin assembly can have a first folded shape and a second folded shape based on temperature;

[0051] In the case of the first folded shape, the fin assembly is located in the first area and the second area,

[0052] In the case of the second folded shape, the fin assembly is located in the first area and a first channel is formed in the second area.

[0053] In some optional implementations, when the temperature of the fin assembly is greater than or equal to a third set temperature, the fin assembly switches from the first folding shape to the second folding shape; when the temperature of the fin assembly is less than the third set temperature, the fin assembly switches from the second folding shape to the first folding shape.

[0054] In some optional implementations,

[0055] In the first folded shape, the fin assembly defines at least two air outlet channels of the first cross-section;

[0056] In the second folded shape, the fin assembly defines at least two air outlet channels of the second cross section; wherein the area of ​​the second cross section is smaller than the area of ​​the first cross section; and the area of ​​the cross section of the first channel is larger than the area of ​​the first cross section.

[0057] In some optional implementations, when the fin assembly is switched from the first folded shape to the second folded shape, impurities located at the air outlet channel are removed based on the first channel.

[0058] In some optional implementations, when the fin assembly switches from the second folding shape to the first folding shape, at least part of the impurities in the air outlet channel are separated from the fin assembly and removed through the air outlet channel.

[0059] The present application also provides an electronic device, comprising: a heat generating component and a fin device, wherein the fin device is used to provide heat dissipation for the heat generating component; the fin device comprises:

[0060] The fin assembly defines an air outlet channel; the fin assembly is in a folded shape;

[0061] The fin assembly can have a first folded shape and a second folded shape based on temperature;

[0062] In the case of the first folded shape, the fin assembly is located in the first area and the second area,

[0063] In the case of the second folded shape, the fin assembly is located in the first area and a first channel is formed in the second area. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 This is an optional structural schematic diagram of the heat dissipation device in the embodiment of the present application, wherein the impurity removal component is in the second shape;

[0065] Figure 2 for Figure 1 Schematic diagram of the local structure;

[0066] Figure 3 for Figure 2 A view from another perspective;

[0067] Figure 4 for Figure 2 A partial enlarged view of

[0068] Figure 5 This is an optional structural schematic diagram of the heat dissipation device in the embodiment of the present application, wherein the impurity removal component is in a first shape;

[0069] Figure 6 for Figure 5 Schematic diagram of the local structure;

[0070] Figure 7 for Figure 6 A view from another perspective;

[0071] Figure 8for Figure 6 A partial enlarged view of

[0072] Fig. 9 This is an optional structural diagram of an electronic device in an embodiment of the present application;

[0073] Fig.10 This is another optional structural diagram of the electronic device in the embodiment of the present application;

[0074] Fig.11 This is another optional structural diagram of the electronic device in the embodiment of the present application;

[0075] Fig.12 This is an optional structural schematic diagram of the fin assembly in the embodiment of the present application, wherein the fin assembly is in a first folded shape;

[0076] Fig.13 This is an optional structural schematic diagram of the fin assembly in the embodiment of the present application, wherein the fin assembly is in a second folded shape;

[0077] Fig.14 This is another optional structural diagram of the electronic device in the embodiment of the present application;

[0078] Fig.15 for Fig.14 A schematic diagram of a partial structure of the invention, wherein the sheet assembly is in a first folded shape;

[0079] Fig.16 for Fig.14 A schematic diagram of a partial structure of the invention, wherein the sheet assembly is in a second folded shape.

[0080] Figure numerals: 100, main body assembly; 110, fan; 111, seat; 112, blades; 113, fixed shell; 200, impurity removal assembly; 210, first impurity removal member; 211, first fixed portion; 212, first deformation portion; 220, second impurity removal member; 221, second fixed portion; 222, second deformation portion; 300, heat-generating component; 400, heat-conducting member; 500, fin assembly; 501, air outlet channel; 502, first channel; 600, frame; 610, first wall; 620, second wall. DETAILED DESCRIPTION

[0081] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

[0082] In the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connection" should be understood in a broad sense. For example, it can be an electrical connection or a connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0083] It should be noted that the terms "first\second\third" involved in the embodiments of the present application are only used to distinguish similar objects, and do not represent a specific order for the objects. It is understandable that the specific order or sequence of "first\second\third" can be interchanged where permitted. It should be understood that the objects distinguished by "first\second\third" can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0084] The following combination Figures 1 to 16 The heat dissipation device, electronic device and fin device of the connection structure described in the embodiments of the present application are described in detail.

[0085] The embodiment of the present application describes a heat dissipation device, including: a main body component 100 and an impurity removal component 200. The main body component 100 is used to dissipate heat from a heat-generating component 300; the impurity removal component 200 includes a fixing portion and a deformation portion; the fixing portion is connected to the main body component 100, and the deformation portion can have a first shape and a second shape based on temperature; during the switching process between the first shape and the second shape, the deformation portion can contact at least part of the main body component 100 to remove impurities from the main body component 100, thereby improving the heat dissipation capacity of the main body component 100 for dissipating heat from the heat-generating component 300.

[0086] In the related art, the heat dissipation structure is used for heat dissipation. During long-term use, the heat dissipation performance of the heat dissipation structure often decreases, making the adaptability of the heat dissipation device poor. For example, during long-term use, the heat dissipation performance of the heat dissipation structure often decreases due to the accumulation of dust, making the adaptability of the heat dissipation device poor. The heat dissipation device of the present application includes an impurity removal component 200, and the impurity removal component 200 includes a deformation part. The deformation part can have a first shape and a second shape based on temperature. During the switching process between the first shape and the second shape, the deformation part can contact at least part of the main component 100 to remove impurities of the main component 100, thereby preventing impurities from reducing the heat dissipation performance of the main component 100. At the same time, the impurity removal component 200 of the present application does not include: a motor, a drive shaft, a drive rod, a memory alloy drive member and other drive mechanisms. The impurity removal component 200 can remove impurities of the main component 100 by deformation, thereby greatly simplifying the structure of the heat dissipation device, thereby improving the adaptability of the heat dissipation device.

[0087] In the embodiment of the present application, the heat dissipation device is a device capable of dissipating heat for the heat-generating component 300 .

[0088] In the embodiment of the present application, the structure of the heat-generating component 300 is not limited. The heat-generating method of the heat-generating component is not limited. For example, the heat-generating component can be a component that can generate heat by itself. As an example, the heat-generating component 300 can include at least one of a motor, a processor, a power supply, a graphics card, a motherboard, etc. Of course, the heat-generating component can also be a component that cannot generate heat by itself but can transfer heat. For example, the heat-generating component 300 can include a heat pipe, a heat sink fin, a liquid cooling component, etc. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0089] In the embodiment of the present application, the structure of the main assembly 100 is not limited, as long as the main assembly 100 can dissipate heat for the heat generating component 300. For example, the main assembly 100 may include a fan 110. For another example, the main assembly 100 may include heat dissipation fins, a liquid cooling assembly, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the structure according to specific needs.

[0090] In the embodiment of the present application, when impurities are attached to the main assembly 100, the impurities may affect the performance of the main assembly 100 in dissipating heat for the heat generating component 300. Impurities attached to the main assembly 100 means that the impurities are deposited on the surface of the main assembly 100 and cover at least part of the surface of the main assembly 100, thereby affecting the performance of the main assembly 100 in dissipating heat for the heat generating component 300.

[0091] The form of impurities is not limited. Impurities may be substances that affect the heat dissipation of the main assembly 100. For example, impurities may include dust, external parts, liquids, and other substances that affect heat dissipation attached to the main assembly 100. However, the present application is not limited thereto, and those skilled in the art may adjust or set the impurities according to specific needs.

[0092] As an example, the main component 100 can have a first state and a second state. The heat dissipation performance of the main component 100 in the first state is a first performance, and the heat dissipation performance of the main component 100 in the second state is a second performance, and the second performance is less than the first performance. In the first state, the amount of impurities attached to the main component 100 is a first amount; in the second state, the amount of impurities attached to the main component 100 is a second amount, and the second amount is greater than the first amount.

[0093] Here, the units of the first amount and the second amount are the same. The units of the first amount and the second amount are not limited. For example, the units of the first amount and the second amount can be units such as number, gram, area, etc. that can determine the amount of impurities. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0094] Here, the body assembly 100 may have different amounts of impurities in the first state and the second state, so that the body assembly 100 has different heat dissipation performances.

[0095] Here, the first performance may refer to a higher heat dissipation performance. The second performance may refer to a lower heat dissipation performance. In the first state, the amount of impurities attached to the main component 100 is small, and the heat dissipation performance of the main component 100 is high. In the second state, the amount of impurities attached to the main component 100 is large, and the heat dissipation performance of the main component 100 is low. As an example, the first performance may be a heat dissipation performance of 8000 watts / meter, and the second performance may be a heat dissipation performance of 5000 watts / meter. As another example, the first performance may be a heat dissipation performance of 7000 watts / meter, and the second performance may be a heat dissipation performance of 4000 watts / meter. As another example, the first performance may be a heat dissipation performance that makes the temperature of the heat-generating component 300 less than 50 degrees, and the second performance may be a heat dissipation performance that makes the temperature of the heat-generating component 300 less than 62 degrees. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0096] Here, the remaining features of the main body component 100 in the first state and the second state may be the same. For example, the shape, position, size, connection relationship with other structures, etc. of the main body component 100 in the first state and the second state may be the same. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0097] Here, since the amount of impurities in the main component 100 in the first state and the second state is different, the heat dissipation performance of the main component 100 in the first state and the second state is different. As an example, the main component 100 will affect the heat dissipation performance under the influence of impurities, which will lead to a decrease in heat dissipation efficiency. The decrease in heat dissipation efficiency will cause the temperature of the heat-generating component 300 to rise, thereby affecting the temperature sensed by the impurity removal component 200. The impurity removal component 200 senses the temperature rise and then starts to switch from the first shape to the second shape to remove impurities from the main component 100, thereby reducing the amount of impurities in the main component 100 and improving the heat dissipation performance of the main component 100.

[0098] In the embodiment of the present application, the structure of the impurity removal component 200 is not limited, as long as the impurity removal component 200 can have a first shape and a second shape based on temperature. Here, the material of the impurity removal component 200 can be a shape memory material. For example, the material of the impurity removal component 200 can be a shape memory alloy, a shape memory polymer material, a shape memory ceramic, etc. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0099] The fixed part can be a part that the impurity removal component 200 is fixedly connected to the main component 100, and the fixed part and the main component 100 can be connected by bonding, clamping, welding, etc. The deformable part can be a part of the impurity removal component 200 that can be deformed. The structure of the deformable part is not limited, as long as the impurity removal component 200 can have a first shape and a second shape based on temperature, and the material of the deformable part can be a shape memory material. The deformable part and the fixed part can be different parts of the same structural part, or different structural parts. As an example, the materials of the deformable part and the fixed part can both be shape memory materials. Since the fixed part is fixedly connected to the main component 100, the fixed part will not be deformed. However, the present application is not limited to this, that is, those skilled in the art can adjust or set it according to specific needs.

[0100] The first shape and the second shape of the deformation portion are not limited. For example, the first shape of the deformation portion may be a sheet-like structure, and the second shape of the deformation portion may also be a sheet-like structure. The curvature, length, width, thickness, etc. of at least part of the first shape and the second shape of the deformation portion may be different. For another example, the first shape of the deformation portion may be a curled structure, and the second shape of the deformation portion may also be a sheet-like structure. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the structure according to specific needs.

[0101] The deformable portion being able to contact at least part of the main body component 100 may include the deformable portion being able to contact part of the main body component, and may also include the deformable portion being able to contact the entire main body component.

[0102] The deformation temperature of the impurity removal component 200 is not limited. For example, when the temperature of the impurity removal component 200 is greater than or equal to the first set temperature, the impurity removal component 200 can be switched from the first shape to the second shape; when the temperature of the impurity removal component 200 is less than the first set temperature, the impurity removal component 200 can be switched from the second shape to the first shape.

[0103] In some embodiments, the first set temperature may be the deformation temperature of the impurity removal component 200. The first set temperature may have a corresponding relationship with the temperature of the heating component 300. When the heating component 300 reaches a higher temperature, the performance of the heating component 300 will be affected. Usually, the heating part will have a safe working temperature. The first set temperature may have a corresponding relationship with the safe working temperature of the heating component 300. As an example, the heating component 300 and the impurity removal component 200 may be arranged at intervals or in contact. When the temperature of the heating component 300 is greater than the safe working temperature, the impurity removal component 200 will reach the first set temperature, and the impurity removal component 200 may be switched from the first shape to the second shape, so as to improve the heat dissipation capacity of the main component 100 to the heat dissipation of the heating component 300 by the impurity removal component 200 for the main component 100, thereby reducing the temperature of the heating component 300. When the main component 100 dissipates heat to the heating component 300 and reduces the temperature of the heating component 300 to less than or equal to the safe working temperature, the temperature of the impurity removal component 200 is lower than the first set temperature, and the impurity removal component 200 may be switched from the second shape to the first shape to prepare for impurity removal again.

[0104] When the heating component 300 is spaced from the impurity removal component 200, the heating component 300 reaches a safe operating temperature, the impurity removal component 200 reaches a first temperature, the first temperature is less than the safe operating temperature, and the first set temperature can be greater than the first temperature. As an example, the safe operating temperature of the heating component 300 can be 52 degrees, the impurity removal component 200 reaches a first temperature of 20 degrees, and the first set temperature can be 32 degrees. As another example, the safe operating temperature of the heating component 300 can be 54 degrees, the impurity removal component 200 reaches a first temperature of 30 degrees, and the first set temperature can be 35 degrees. When the heating component 300 is in direct or indirect contact with the impurity removal component 200, the heating component 300 reaches a safe operating temperature, the heating component 300 reaches a first temperature, the first temperature is substantially the same as the safe operating temperature, and the first set temperature can be greater than the first temperature. As an example, the safe operating temperature of the heating component 300 can be 52 degrees, the impurity removal component 200 reaches a first temperature of 52 degrees, and the first set temperature can be 62 degrees. As another example, the safe operating temperature of the heating component 300 may be 54 degrees, the impurity removal component 200 reaches the first temperature of 54 degrees, and the first set temperature may be 60 degrees.

[0105] In other embodiments, the first set temperature may not correspond to the temperature of the heating component 300. For example, the first set temperature may be set by a person skilled in the art according to specific needs. However, the present application is not limited thereto, that is, a person skilled in the art may adjust or set the first set temperature according to specific needs.

[0106] As an example, the heat dissipation device may further include: a heat conductor 400, which is used to contact the heat generating component 300; and the heat conductor 400 is also used to transfer the heat at the heat generating component 300 to the impurity removal component 200. By transferring the heat of the heat generating component 300 to the impurity removal component 200 through the heat conductor 400, the consistency of the temperature change of the impurity removal component 200 and the temperature change of the heat generating component 300 can be greatly improved, and the time of the deformation hysteresis of the impurity removal component 200 can be greatly improved, thereby improving the sensitivity of the main component 100 to the impurity removal of the heat generating component 300.

[0107] Here, the heat conducting member 400 may be in direct contact with the heat generating component, or may be in indirect contact with the heat conducting structure. The heat conducting member 400 is used to transfer the heat at the heat generating component 300, and the structure of the heat conducting member 400 is not limited. For example, the heat conducting member 400 may be a heat conducting strip, or a heat conducting block, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the heat conducting member 400 according to specific needs.

[0108] Here, the heat conducting member 400 can only be used as a heat conducting structure between the heat generating component 300 and the impurity removing component 200. Of course, the heat conducting member 400 can also be used as both a heat conducting structure between the heat generating component 300 and the impurity removing component 200 and a heat conducting structure between the heat generating component 300 and the heat dissipation structure, thereby simplifying the structure of the heat dissipation device. As an example, Fig. 9 and Fig.10 As shown, the heat conducting member 400 is also used to transfer the heat of the heat generating component 300 to the fin assembly 500, so as to dissipate the heat of the heat generating component 300 through the fin assembly 500. Here, the heat conducting member 400 can be a heat conducting pipe, a heat conducting strip, a heat conducting sheet, etc. In other words, the heat conducting member 400 is used to transfer the heat to the fin assembly 500, and the heat conducting member 400 is also used to transfer the heat to the impurity removal assembly 200. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0109] Here, the heat conductor 400 can directly transfer heat to the impurity removal component 200, or transfer heat to the impurity removal component 200 through other structural components. As an example, the main component 100 may include a fan 110, and the impurity removal component 200 is arranged on the fan 110. The heat conductor 400 can also be used to transfer the heat of the heat-generating component 300 to the impurity removal component 200 through the fixed shell 113 of the fan 110. Here, the heat of the heat-generating component 300 is first transferred to the fixed shell 113, and then transferred from the fixed shell 113 to the impurity removal component 200; here, the heat conductor 400 can be in direct contact with the fixed shell 113 of the fan 110 or in contact with it through a heat-conducting structure. By transferring the heat of the heat conductor to the fixed shell 113 of the fan 110, it is possible to prevent the heat conductor from affecting the rotation of the fan 110; of course, in other examples, there may also be a gap between the heat conductor 400 and the fixed shell 113 of the fan 110. As another example, the heat conducting member 400 may contact the impurity removal component 200. The heat conducting member 400 and the impurity removal component 200 may contact directly or indirectly through a heat conducting structure. By directly transferring the heat of the heat conducting member to the impurity removal component 200, the consistency of the temperature change of the impurity removal component 200 and the temperature change of the heat generating component 300 can be greatly improved. Of course, there may also be a gap between the impurity removal component 200 and the heat conducting member 400.

[0110] In some embodiments, when the main assembly 100 includes the fan 110, the fan 110 may be a part of the main assembly 100, the fin assembly 500 may be another part of the main assembly 100, and the fin assembly 500 may also be provided with the impurity removal assembly 200. Of course, the fin assembly 500 may not be another part of the main assembly 100.

[0111] The number of the impurity removing parts of the impurity removing assembly 200 is not limited. For example, the impurity removing assembly 200 may include a first impurity removing part 210 and a second impurity removing part 220, and the first impurity removing part 210 and the second impurity removing part 220 may be arranged in different positions. Of course, the first impurity removing part 210 and the second impurity removing part 220 may also be arranged in different shapes.

[0112] Here, the first impurity removing member 210 may have a first fixing portion 211 and a first deformation portion 212, and the second impurity removing member 220 may have a second fixing portion 221 and a second deformation portion 222. The first fixing portion 211 and the second fixing portion 221 are similar to the above fixing portions, and the first deformation portion 212 and the second deformation portion 222 are similar to the above deformation portions, which will not be described in detail.

[0113] As an example, the first impurity removing member 210 and the second impurity removing member 220 are disposed at different positions of the main assembly 100, and the first impurity removing member 210 and the second impurity removing member 220 have different shapes. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set the same according to specific needs.

[0114] During the switching between the first shape and the second shape, the deformation portion can contact at least a portion of the main component 100 to remove impurities of the main component 100; since the deformation portion can have the first shape and the second shape based on temperature, no external driving structure is required to drive the deformation of the deformation portion, which can greatly simplify the structure of the heat dissipation device, thereby improving the adaptability of the heat dissipation device.

[0115] When the impurity removing assembly 200 includes the first impurity removing member 210 and the second impurity removing member 220 , the deformation temperatures of the first impurity removing member 210 and the second impurity removing member 220 may be the same or different.

[0116] As an example, when the temperature is greater than or equal to the first set temperature, the first and second debris-removing parts 210 and 220 switch from the first shape to the second shape; when the temperature is less than the first set temperature, the first and second debris-removing parts 210 and 220 switch from the second shape to the first shape. Here, the first and second debris-removing parts 210 and 220 can remove debris at the same time or in different time periods. When the temperatures of the heat-generating component 300 sensed by the first and second debris-removing parts 210 and 220 are different, the first and second debris-removing parts 210 and 220 can remove debris in different time periods; when the temperatures of the heat-generating component 300 sensed by the first and second debris-removing parts 210 and 220 are substantially the same, the first and second debris-removing parts 210 and 220 can remove debris at the same time.

[0117] As another example, when the temperature is greater than or equal to the first set temperature, the first impurity removing member 210 switches from the first shape to the second shape; when the temperature is less than the first set temperature, the first impurity removing member 210 switches from the second shape to the first shape. When the temperature is greater than or equal to the fourth set temperature, the second impurity removing member 220 switches from the first shape to the second shape; when the temperature is less than the fourth set temperature, the second impurity removing member 220 switches from the second shape to the first shape. The fourth set temperature is different from the first set temperature. Since the first impurity removing member 210 and the second impurity removing member 220 are set at different positions, the first impurity removing member 210 and the second impurity removing member 220 can remove impurities simultaneously or in different time periods by making the fourth set temperature different from the first set temperature.

[0118] Here, the fourth set temperature is similar to the first set temperature mentioned above, and will not be described in detail here.

[0119] In some optional implementations of the present application, the main assembly 100 may include: a fan 110; the fan 110 may include: a seat 111 and at least two blades 112. The seat 111 is used to connect with the driving member; the at least two blades 112 are radially arranged on the outer peripheral side of the seat 111.

[0120] In this implementation, the fan 110 is used to dissipate heat from the heat generating component 300. The fan 110 can blow air to the heat generating component 300 or to a structure for dissipating heat from the heat generating component 300. As an example, Fig.10 As shown, the fan 110 can blow air to the fin assembly 500 for dissipating heat for the heat-generating component 300 , so as to dissipate heat by cooperating with the fin assembly 500 .

[0121] In this implementation, if Figure 1 and 5 As shown, the fan 110 may further include a fixed shell 113, and at least two blades 112 may rotate in a space defined by the fixed shell 113. The fan 110 may be fixedly disposed by the fixed shell 113.

[0122] In this implementation, the structure of the driving member is not limited. For example, the driving member can be a motor, a driving shaft, a driving wheel, etc. The driving member is used to drive at least two blades 112 to rotate through the seat 111 to form flowing air to dissipate heat from the heat generating component 300.

[0123] The seat 111 and the driving member can be connected by bonding, clamping, welding, etc. The seat 111 and the at least two blades 112 can be connected by bonding, clamping, welding, etc. Of course, the seat 111 and the at least two blades 112 can also be different parts of a structural member.

[0124] The shape of the seat 111 is not limited. For example, the seat 111 may be a disc-shaped structure. For another example, the seat 111 may be a ring-shaped structure. However, the present application is not limited thereto, and those skilled in the art may adjust or set the seat 111 according to specific needs.

[0125] The seat 111 has an outer peripheral side farthest from the rotation axis and end sides corresponding to both ends of the rotation axis. At least two blades 112 are radially arranged on the outer peripheral side of the seat 111, the root of the blade 112 is connected to the outer peripheral side of the seat 111, and the end of the blade 112 is suspended and protruded in the direction away from the rotation axis side, and two adjacent blades 112 are arranged at intervals, thereby forming a radial shape.

[0126] In this implementation, the at least two blades 112 may include two blades 112 , or may include more than two blades 112 .

[0127] In this implementation, the location of the impurity removal component 200 is not limited. For example, the impurity removal component 200 can be set at the seat 111. For another example, the impurity removal component 200 can be set at the blade 112. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set it according to specific needs.

[0128] The number of the impurity removal components 200 is not limited. For example, the impurity removal component 200 may include one impurity removal component, or may include at least two impurity removal components. However, the present application is not limited thereto, and those skilled in the art may adjust or set the impurity removal component according to specific needs.

[0129] As an example, the impurity removing assembly 200 may include a first impurity removing member 210 disposed between two adjacent blades 112 , so that impurities between the two adjacent blades 112 can be removed by the first impurity removing member 210 .

[0130] In this example, at least a portion of the first impurity removing member 210 is located between two adjacent blades 112. The first impurity removing member 210 may be located entirely between two adjacent blades 112. Of course, the first impurity removing member 210 may also be located partially between two adjacent blades 112.

[0131] In this example, the first fixing portion 211 of the first impurity removing member 210 can be connected to the outer peripheral side of the seat 111. When the temperature is lower than the first set temperature, the first deformable portion 212 of the first impurity removing member 210 can be curled and attached to the outer peripheral side of the seat 111, as shown in FIG. Figure 7 and Figure 8 When the temperature is greater than or equal to the first set temperature, the first deformation portion 212 may be located between two adjacent blades 112 in an expanded state, such as Figure 2 , Figure 3 and Figure 4 shown.

[0132] Of course, in other examples, the first impurity removing member 210 may also be connected to the blade 112 by bonding, clamping, welding, etc., and the first deformed portion 212 of the first impurity removing member 210 may be curled and spaced apart from the outer peripheral side of the seat 111 .

[0133] The above embodiment has been described in conjunction with the first set temperature, which will not be described again here.

[0134] Here, the first fixing portion 211 and the outer peripheral side of the seat portion 111 may be connected by bonding, clamping, welding, etc. The first fixing portion 211 and the seat portion 111 may also be different parts of a structural member.

[0135] Here, in the first shape, the first debris remover 210 is curled, so that the first debris remover 210 can be located at the outer peripheral side of the seat 111 in most cases, that is, the first debris remover 210 can be located at the root of the blade 112 in most cases, thereby reducing the influence of the first debris remover 210 on the air volume of the fan 110.

[0136] Here, the first impurity removing member 210 being in a curled shape may include at least a portion of the first impurity removing member 210 being stacked together in a spiral curling manner, a pleated curling manner, a folded curling manner, etc., so as to reduce the occupied space of the first impurity removing member 210. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the shape according to specific needs.

[0137] Here, the first deformation portion 212 of the first debris removing component 210 is curled and attached to the outer peripheral side of the seat 111, which may mean that the curled first deformation portion 212 is in contact with, close to, or adjacent to the outer peripheral side of the seat 111, so that the curled first deformation portion 212 is located in the space close to the outer peripheral side of the seat 111, thereby reducing the influence of the first debris removing component 210 on the air volume of the fan 110.

[0138] Here, in the second shape, the first impurity removing member 210 is in an expanded state, which can increase the contact area between the first impurity removing member 210 and the blade 112 , thereby increasing the amount of impurities removed by the first impurity removing member 210 .

[0139] Here, the first debris removing piece 210 is in an unfolded state compared to the first debris removing piece 210 being in a curled state, as long as the first debris removing piece 210 in an unfolded state is arranged more sparsely than the first debris removing piece 210 in a curled state, and can have more contact area with the blade 112. For example, the space occupied by the first debris removing piece 210 in an unfolded state as a whole is greater than the space occupied by the first debris removing piece 210 in a curled state as a whole. As an example, the first debris removing piece 210 in an unfolded state may include the first debris removing piece 210 being in a straight plate state, a curved plate shape, a spiral shape, a folded shape, etc. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0140] Here, the first deformation portion 212 being in the unfolded state and being located between two adjacent blades 112 may mean that during the deformation of the first impurity removing member 210 from the curled state to the unfolded state, the first impurity removing member 210 moves between two adjacent blades 112 to remove impurities between the adjacent blades 112 .

[0141] Here, when the first impurity removing member 210 switches from the first shape to the second shape, the first impurity removing member 210 may contact two adjacent blades 112 at the same time, so that the first impurity removing member 210 can remove impurities from the two adjacent blades 112 at the same time.

[0142] Here, the number of the first impurity removing members 210 is not limited. As an example, the impurity removing assembly 200 may include at least two first impurity removing members 210, each of which is disposed between two adjacent blades 112, so that more impurities between adjacent blades 112 can be removed by at least two first impurity removing members 210.

[0143] As another example, the impurity removing assembly 200 may include a second impurity removing member 220 disposed at the end side of the seat 111 , so that impurities on the end surface side of the blade 112 can be removed by the second impurity removing member 220 .

[0144] In this example, the second fixing portion 221 of the second impurity removing member 220 is connected to the end side of the seat 111. When the temperature is lower than the first set temperature, the second deformable portion 222 of the second impurity removing member 220 is attached to the end side of the seat 111 in a first unfolded shape, as shown in FIG. Figure 7 and Figure 8 When the temperature is greater than or equal to the first set temperature, the second deformation portion 222 is attached to one end of at least two blades 112 in a second unfolded shape, such as Figure 2 , Figure 3 and Figure 4 shown.

[0145] The first set temperature has been described in the above embodiment and will not be described again here.

[0146] Of course, when the temperature is lower than the fourth set temperature, the second deformation portion 222 of the second impurity removing member 220 may also be attached to the end side of the seat portion 111 in the first unfolded shape, such as 6, Figure 7 and Figure 8 When the temperature is greater than or equal to the fourth set temperature, the second deformation portion 222 may also be attached to one end of at least two blades 112 in a second unfolded shape, such as Figure 2 , Figure 3 and Figure 4 The fourth set temperature has been described above and will not be described again here.

[0147] Here, the second fixing portion 221 can be connected to the end side of the seat 111 by bonding, clamping, welding, etc. The second fixing portion 221 and the seat 111 can also be different parts of a structural member. Of course, in other examples, the second fixing portion 221 of the second impurity removing member 220 can also be connected to the end side of the blade 112 by bonding, clamping, welding, etc.

[0148] Here, in the first shape, the second debris remover 220 is attached to the end side of the seat 111 in the first expanded shape, so that the second debris remover 220 does not block the air flow between the blades 112, thereby reducing the influence of the second debris remover 220 on the air volume of the fan 110.

[0149] Here, in the second shape, the second impurity removing member 220 is attached to one end of at least two blades 112 in a second expanded shape, so that the second impurity removing member 220 can contact the end surface of the blade 112, so that impurities on the end surface of the blade 112 can be removed by the second impurity removing member 220.

[0150] Here, the specific forms of the second unfolded shape and the first unfolded shape are not limited, as long as the second deformable portion 222 of the second debris removing member 220 is attached to the end side of the seat 111 in the first unfolded shape, and the second deformable portion 222 of the second debris removing member 220 is attached to one end of at least two blades 112 in the second unfolded shape. For example, the second deformable portion 222 of the first unfolded shape can be in the shape of a straight plate, a curved plate, a folded plate, etc. For example, the second deformable portion 222 of the second unfolded shape can be in the shape of a straight plate, a curved plate, a folded plate, etc. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set it according to specific needs.

[0151] Here, sticking may include contacting, approaching, getting close, etc.

[0152] Here, one end of at least two blades may refer to one end of at least two blades corresponding to the rotation axis of fan 110 . One end of at least two blades may also refer to one end of at least two blades on the same side as the end side of seat 111 .

[0153] Here, when the second impurity removing member 220 switches from the first shape to the second shape, the second impurity removing member 220 may contact impurities on the end surfaces of at least two adjacent blades 112 , so that the second impurity removing member 220 can remove impurities on the end surfaces of at least two adjacent blades 112 at the same time.

[0154] Here, the number of the second impurity removing members 220 is not limited. As an example, the impurity removing assembly 200 may include at least two second impurity removing members 220, which are arranged in an annular shape at the end side of the seat 111, so that most of the impurities on the end surface side of at least two blades 112 can be removed by the at least two second impurity removing members 220.

[0155] As another example, the impurity removing assembly 200 may include a first impurity removing member 210 disposed between two adjacent blades 112 ; the impurity removing assembly 200 may further include a second impurity removing member 220 disposed at an end side of the seat 111 .

[0156] The first impurity removing member 210 and the second impurity removing member 220 have been described in the above examples, and will not be described in detail herein.

[0157] In some optional implementations of the embodiments of the present application, the deformation part may include at least two sections, and the temperature of the shape change of at least two sections of the deformation part may be different, so as to make the expansion and recovery of the deformation part smoother and prevent the deformation part from contacting with the external structure and getting stuck.

[0158] In this implementation, the number of segments of the deformation part is not limited. The deformation part including at least two segments may include the deformation part including two segments, or may include the deformation part including more than two segments. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the deformation part according to specific needs.

[0159] For example, the deformation portion may include: a first section portion and a second section portion, wherein the first section portion is connected to the fixing portion, and the second section portion is connected to an end of the first section portion away from the fixing portion.

[0160] In this example, the first section and the fixing portion may be connected by bonding, clamping, welding, etc. The first section and the fixing portion may also be different parts of a structural member.

[0161] In this example, the second section and the first section can be connected by bonding, clamping, welding, etc. The second section and the first section can also be different parts of a structural member.

[0162] In this example, the temperature at which the shape changes of the first section and the second section are different can be that the first section and the second section can both be deformed, and the deformation temperature is different. The implementation method of having different shape change temperatures of the second section and the first section is not limited. For example, the second section and the first section can be different shape memory materials, so that the second section and the first section have different shape change temperatures. As an example, the material of the second section can be a shape memory alloy, and the material of the first section can be a shape memory polymer material. For another example, the second section and the first section have the same material, and the process treatment temperature of the second section and the first section is different, so that the second section and the first section have different shape change temperatures. As another example, the materials of the second section and the first section can both be shape memory alloys, shape memory polymer materials, shape memory ceramics, etc. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0163] In this example, the temperature at which the shape of one of the second section and the first section changes may be the first set temperature, and the temperature at which the shape of the other section changes may be a non-first set temperature.

[0164] As an example, when the temperature is greater than or equal to the first set temperature, the first section can switch from the third shape to the fourth shape; when the temperature is greater than or equal to the second set temperature, the second section can switch from the fifth shape to the sixth shape; wherein the first set temperature and the second set temperature are different.

[0165] Here, when the first section is in the third shape and the second section is in the fifth shape, the first section and the second section together form a first shape of the deformation section, and when the first section is in the fourth shape and the second section is in the sixth shape, the first section and the second section together form a second shape of the deformation section.

[0166] Here, the first set temperature may be greater than the second set temperature, and the first set temperature may be less than the second set temperature. As an example, the second set temperature may be equal to the first set temperature plus 2 degrees, 3 degrees, 4 degrees, etc. As another example, the second set temperature may be equal to the first set temperature minus 2 degrees, 3 degrees, 4 degrees, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the temperature according to specific needs.

[0167] In some embodiments, the first deformation portion 212 of the first debris removing piece 210 may include a first section and a second section; when the second set temperature is greater than the first set temperature, the first debris removing piece 210 may be unfolded or curled more smoothly in sections to prevent the first debris removing piece 210 from being stuck between the two blades 112.

[0168] Here, the first deformation portion 212 of the first debris removing piece 210 may include at least two sections, and the set deformation temperatures of the at least two sections of the first deformation portion 212 may be increased sequentially from the first fixed portion 211 to the end of the first deformation portion 212, so that the at least two sections of the first deformation portion 212 can be more smoothly unfolded or curled in sections from the first fixed portion 211 to the end of the first deformation portion 212.

[0169] Of course, in other embodiments, the second deformation portion 222 of the second impurity removing member 220 may also include a first section and a second section; or, the second deformation portion 222 of the second impurity removing member 220 may also include at least two sections.

[0170] As another example, when the temperature is greater than or equal to the first set temperature, the second section can switch from the fifth shape to the sixth shape; when the temperature is greater than or equal to the second set temperature, the first section can switch from the third shape to the fourth shape; wherein the first set temperature and the second set temperature are different.

[0171] The second set temperature, the fifth shape, the sixth shape, the third shape and the fourth shape have been described above and will not be repeated here.

[0172] The embodiment of the present application also describes an electronic device, including: a heat-generating component 300 and a heat-dissipating device, the heat-dissipating device is used to provide heat dissipation for the heat-generating component 300; the heat-dissipating device may include: a main assembly 100 and an impurity-removing assembly 200. The main assembly 100 is used to dissipate heat for the heat-generating component 300; the impurity-removing assembly 200 may include a fixing portion and a deformation portion; the fixing portion is connected to the main assembly 100, and the deformation portion can have a first shape and a second shape based on temperature; during the switching process between the first shape and the second shape, the deformation portion can contact at least a part of the main assembly 100 to remove impurities of the main assembly 100; so that a more efficient heat dissipation capability can be provided to the heat-generating component 300 through the heat-dissipating device.

[0173] The heat dissipation device and the heat generating component 300 have been described in the above embodiment, and will not be described again here.

[0174] In the embodiments of the present application, in some embodiments, the main assembly 100 may include two fans 110, such as Fig. 9 Of course, Fig.10 As shown, the electronic device may further include a fin assembly 500. The fin assembly 500 may also be a part of the main assembly 100 and provided with the impurity removal assembly 200, or may not be a part of the main assembly 100. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the fin assembly 500 according to specific needs.

[0175] In the embodiments of the present application, the structure of the electronic device is not limited. For example, the electronic device may be a computer, a game console, an air conditioner, a refrigerator, etc. However, the present application is not limited thereto, and those skilled in the art may adjust or set the structure according to specific needs.

[0176] In the embodiment of the present application, the main body component 100 has a first state and a second state. The heat dissipation performance of the main body component 100 in the first state is the first performance, and the heat dissipation performance of the main body component 100 in the second state is the second performance, and the second performance is less than the first performance; in the first state, the amount of impurities attached to the main body component 100 is the first amount, and in the second state, the amount of impurities attached to the main body component 100 is the second amount, and the second amount is greater than the first amount; when the temperature of the impurity removal component 200 is greater than or equal to the first set temperature, the impurity removal component 200 switches from the first shape to the second shape; when the temperature of the impurity removal component 200 is less than the first set temperature, the impurity removal component 200 switches from the second shape to the first shape.

[0177] The above embodiments have described the first state, the second state, the first set temperature, the first amount, the second amount, the first performance and the second performance, which will not be repeated here.

[0178] In some optional implementations of the embodiments of the present application, in the first state, and when the heat-generating component 300 operates at maximum power consumption, the temperature of the impurity removal component 200 is lower than the first set temperature.

[0179] In this implementation, in the first state, the impurity mass of the main component 100 is relatively small, and the heat dissipation performance of the main component 100 to the heat-generating component 300 is relatively high; when the heat-generating component 300 operates at the maximum power consumption, the impurity removal component 200 does not need to reach the deformation temperature, and the heat dissipation performance of the main component 100 can meet the maximum power consumption requirement of the heat-generating component 300.

[0180] Here, the maximum power consumption of the heating component 300 may include the loss when all components of the heating component 300 are operating at maximum power. As an example, the heating component 300 may include a central processing unit (CPU), and the maximum power consumption of the heating component 300 may be the loss when the CPU is operating at maximum power. As another example, the heating component 300 may include a CPU and a graphics processing unit (GPU), and the maximum power consumption of the heating component 300 may be the loss when both the CPU and the GPU are operating at maximum power. However, the present application is not limited to this, that is, those skilled in the art may adjust or set according to specific needs.

[0181] In this implementation, in the second state, the main component 100 has a large amount of impurities, and the heat dissipation performance of the main component 100 to the heat-generating component 300 is relatively low; here, regardless of whether the heat-generating component 300 is operating at maximum power consumption, the impurity removal component 200 may reach a deformation temperature, thereby removing impurities from the main component 100, which can switch the main component 100 from the second state to the first state, thereby improving the heat dissipation performance to the heat-generating component 300, and preventing the temperature of the heat-generating component 300 from being too high and affecting the performance of the heat-generating component 300.

[0182] In some optional implementations of the embodiments of the present application, the main component 100 may include a fan 110, and the heat generating component 300 may include a processor; the electronic device may further include: a detection component, the detection component is used to detect the temperature of the impurity removal component 200. The processor may be electrically connected to the detection component and the fan 110 respectively; the processor may be used to control the temperature of the processor to be lowered when the detection component detects that the temperature of the impurity removal component 200 is greater than or equal to the first set temperature, and may also be used to control the electronic device to be in a normal mode when the detection component detects that the temperature of the impurity removal component 200 is less than the first set temperature.

[0183] In this implementation, the fan 110 has been described above and will not be repeated here.

[0184] In this implementation, the detection component is a component capable of detecting temperature, and the structure of the detection component is not limited. For example, the detection component may include a temperature sensor, and the temperature of the impurity removal component 200 may be detected by the temperature sensor. As an example, the detection component may include a resistance temperature sensor, an infrared temperature sensor, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the temperature according to specific needs.

[0185] In this implementation, the processor may include a CPU, may include a GPU, or may include a CPU and a GPU. However, the present application is not limited thereto, and those skilled in the art may adjust or set the processor according to specific requirements.

[0186] The detection component can directly detect the temperature of the impurity removal component 200. Of course, the detection component can also indirectly detect the temperature of the impurity removal component 200. For example, the impurity removal component 200 is set on the fan 110, and the detection component can indirectly detect the temperature of the impurity removal component 200 by detecting the temperature of the fan 110. As an example, the detection component can detect the temperature of the impurity removal component 200 by detecting the temperature of the fixed shell 113 of the fan 110. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0187] In this implementation, the processor is used to control the temperature of the processor to be lowered when the detection component detects that the temperature of the impurity removal component 200 is greater than or equal to the first set temperature. In this way, when the temperature of the impurity removal component 200 is greater than or equal to the first set temperature, the impurities of the main component 100 can be removed by switching the impurity removal component 200 from the first shape to the second shape, and the impurity removal component 200 can be returned to the first shape after dust removal, so that the impurity removal component 200 can reduce the impact on the heat dissipation performance of the main component 100 without removing impurities.

[0188] Here, the implementation method of the processor for reducing the temperature of the processor is not limited. For example, the processor can be used to control the increase of the speed of the fan 110 when the detection component detects that the temperature of the impurity removal component 200 is greater than or equal to the first set temperature, so as to reduce the temperature of the processor by improving the heat dissipation capacity of the fan 110. Here, the noise of the fan 110 can be relatively large.

[0189] The fan 110 generally has a set speed, and when the fan 110 works at the set speed, the noise of the fan 110 is relatively small. When the temperature of the heat-generating component 300 is relatively low, the fan 110 works at the set speed. The set speed of the fan 110 may be 1000 rpm, 1500 rpm, 2000 rpm, etc. Here, the processor controlling to increase the speed of the fan 110 may include controlling the speed of the fan 110 to be greater than the set speed. As an example, the processor may control the speed of the fan 110 to be the set speed plus 100 rpm, plus 300 rpm, plus 500 rpm, etc. However, the present application is not limited to this, that is, those skilled in the art may adjust or set according to specific needs.

[0190] For another example, the processor can be used to control the reduction of the power consumption of the processor when the detection component detects that the temperature of the impurity removal component 200 is greater than or equal to the first set temperature, so as to reduce the temperature of the heat-generating component 300 by reducing the heat generated by the processor, and here, the operation of the electronic device will slow down. For another example, the processor can be used to control the increase of the speed of the fan 110 and the reduction of the power consumption of the processor when the detection component detects that the temperature of the impurity removal component 200 is greater than or equal to the first set temperature. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0191] Here, the processor controlling to reduce the power consumption of the processor may include the processor controlling to reduce the power of the processor. As an example, the processor controlling to reduce the power consumption of the processor may include the processor controlling to reduce the processing speed of the processor, reduce the number of software running on the processor, reduce the number of instructions or data processed simultaneously by the processor, etc. Here, the running speed of the electronic device will be slowed down. As an example, the speed of playing games by the user will be slowed down. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0192] In this implementation, the processor is also used to control the electronic device to be in normal mode when the detection component detects that the temperature of the impurity removal component 200 is lower than the first set temperature; so as to ensure that the electronic device is in a more comfortable working state when the temperature of the impurity removal component 200 is lower than the first set temperature.

[0193] Here, the electronic device being in normal mode may include the processor being in normal power consumption mode, and the processor being in normal power consumption mode will not reduce the power consumption of the processor, and the processor of the electronic device is working based on the needs of the customer. Here, the running speed of the electronic device will be faster. As an example, the user will play games very quickly. The electronic device being in normal mode may also include the fan 110 working at a set speed. The electronic device being in normal mode may also include the processor being in normal power consumption mode and the fan 110 working at a set speed. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0194] The setting speed has been described above and will not be repeated here.

[0195] For example, in some embodiments, the processor may also be used to control the fan 110 to work at a set speed when the detection component detects that the temperature of the impurity removal component 200 is less than the first set temperature; here, the speed of the fan 110 is low to reduce the noise of the fan 110. For another example, in other embodiments, the processor may also be used to control the processor to be in a normal power consumption mode when the detection component detects that the temperature of the impurity removal component 200 is less than the first set temperature, and here, the power consumption of the processor may be larger to increase the processing speed of the processor. For another example, in other embodiments, the processor may also be used to control the fan 110 to work at a set speed and control the processor to be in a normal power consumption mode when the detection component detects that the temperature of the impurity removal component 200 is less than the first set temperature.

[0196] In an application scenario, when the impurity removal component 200 is greater than or equal to the first set temperature, regardless of whether the impurity removal component 200 is higher due to the accumulation of impurities in the main component 100, the impurity removal component 200 will switch from the first shape to the second shape to clean the impurities in the main component 100, thereby improving the heat dissipation capacity of the main component 100; at the same time, the processor can be used to reduce the temperature of the heating component 300, so that the impurity removal component 200 switches from the second shape to the first shape. If the temperature of the heating component 300 and the impurity removal component 200 is higher due to the accumulation of impurities in the main component 100, the temperature of the heating component 300 and the impurity removal component 200 will not rise again; if it is due to other reasons, for example, the temperature of the heating component 300 and the impurity removal component 200 is higher due to the high external environment temperature, here, the temperature of the impurity removal component 200 will be greater than or equal to the first set temperature again, and the processor will reduce the temperature of the heating component 300 again to ensure that the electronic device is not burned.

[0197] like Fig.11As shown, in some optional implementations of the embodiments of the present application, the electronic device may further include a fin assembly 500. The fin assembly 500 may define an air outlet channel 501; the fin assembly 500 may be folded; the fin assembly 500 may have a first folded shape and a second folded shape based on temperature; in the case of the first folded shape, the fin assembly 500 is located in the first area and the second area, and in the case of the second folded shape, the fin assembly 500 is located in the first area and forms a first channel 502 in the second area.

[0198] Of course, in other implementations, the fin assembly 500 may also be a conventional fin structure.

[0199] In this implementation, the fin assembly 500 includes at least two adjacently arranged sheet parts. The sheet parts of the fin assembly 500 are used to contact with the air to exchange heat so as to dissipate heat from the heat generating component 300. As an example, the heat of the heat generating component 300 can be transferred to the sheet parts of the fin assembly 500, and the heat of the heat generating component 300 can be quickly taken away by the fin assembly 500 with a larger surface area.

[0200] The fin assembly 500 defines an air outlet channel. When air flows through the air outlet channel, it can contact the sheet-like portion of the fin assembly 500 located on the peripheral side of the air outlet channel to achieve heat exchange.

[0201] In this implementation, the fin assembly 500 is not limited to the folding manner. For example, the fin assembly 500 can be folded by arranging at least two sheet-like parts in a Z-shaped manner. For another example, the fin assembly 500 can be folded by arranging at least two sheet-like parts in a folded manner. For another example, the fin assembly 500 can be folded by arranging at least two sheet-like parts in an I-shaped manner. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0202] When the fin assembly 500 is in the first folded shape, at least two sheet portions of the fin assembly 500 are arranged sparsely, and the fin assembly 500 occupies a larger space. When the fin assembly 500 is in the second folded shape, at least two sheet portions of the fin assembly 500 are arranged closely, and the fin assembly 500 occupies a smaller space.

[0203] In this implementation, the function of the first channel 502 is not limited.

[0204] For example, the first channel 502 may be a channel for active impurity removal, where impurities at the main body assembly 100 or impurities at the fin assembly 500 may be automatically removed by the air flowing at the first channel 502 .

[0205] Here, when the fin assembly 500 switches from the first folding shape to the second folding shape, the impurities located at the air outlet channel 501 can be removed based on the first channel 502; here, the impurities located at the air outlet channel 501 may include impurities located at the entrance of the air outlet channel 501, and may also include impurities located at the exit of the air outlet channel 501. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the impurities according to specific needs. When the fin assembly 500 switches from the first folding shape to the second folding shape, part of the impurities originally located at the entrance or exit of the air outlet channel 501 are separated from the fin assembly 500 and located on the path of the first channel 502. The air flowing through the first channel 502 can automatically take away and remove the impurities located on the path of the first channel 502, thereby greatly improving the automatic impurity removal capability of the fin assembly 500, and further improving the heat dissipation capability of the fin assembly 500.

[0206] Here, when the fin assembly 500 is switched from the first folded shape to the second folded shape, impurities located at the body assembly 100 can be removed through the first channel 502 .

[0207] Here, when the fin assembly 500 switches from the first folded shape to the second folded shape, impurities located at the air outlet channel 501 can be removed based on the first channel 502; and impurities located at the main body assembly 100 can be removed through the first channel 502.

[0208] For another example, the first channel 502 can be used to increase the air volume in the second area.

[0209] For another example, the first channel 502 can be used for maintenance, or as a channel for manual or machine passive debris removal.

[0210] Here, as an example, due to long-term use, some impurities stick to some areas of the fin assembly 500 or the main body assembly 100, which are not easy to remove automatically and can be removed manually or passively by a machine.

[0211] Here, as another example, the electronic device has a first structural component in the space corresponding to the second area, and the first structural component can be repaired or replaced through the first channel 502 .

[0212] In this implementation, the adaptability of the fin assembly 500 can be greatly improved by setting the first channel 502. At the same time, by switching the fin assembly 500 between the second folding shape and the first folding shape, the impurities in the air outlet channel 501 defined by the fin assembly 500 can also be separated from the fin assembly 500 and removed. As an example, when the fin assembly 500 switches from the second folding shape to the first folding shape, at least part of the impurities in the air outlet channel 501 are separated from the fin assembly 500 and removed through the air outlet channel 501; here, due to the change in the shape of the fin assembly 500, the impurities in the air outlet channel 501 are separated from the fin assembly 500, and the air flowing through the air outlet channel 501 can automatically take away and remove the impurities in the air outlet channel 501 that are separated from the fin assembly 500, thereby greatly improving the automatic impurity removal capability of the fin assembly 500.

[0213] In this implementation, the manner in which the fin assembly 500 can have the first folded shape and the second folded shape based on temperature is not limited. The material of the impurity removal assembly 200 may be a shape memory material. For example, the material of the fin assembly 500 may be a shape memory alloy, a shape memory polymer material, a shape memory ceramic, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs. As an example, the material of the fin assembly 500 may be a memory alloy; thereby enabling the fin assembly 500 to automatically switch between the first folded shape and the second folded shape through temperature changes.

[0214] The first folded shape and the second folded shape of the fin assembly 500 are not limited. For example, as shown in FIG12 , the fin assembly 500 in the first folded shape may be substantially in the shape of a rectangular parallelepiped. Fig.13 As shown, the fin assembly 500 in the second folded shape may be substantially in the shape of a cuboid. However, the present application is not limited thereto, and those skilled in the art may adjust or configure the fin assembly 500 according to specific requirements.

[0215] In this implementation, the sizes of the first area and the second area are defined differently. Fig.13 As shown, the second area may be larger than the first area. The shapes of the first area and the second area are different. As an example, the first area and the second area may both be rectangular. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the shape according to specific needs.

[0216] As an example, in the first folded shape, the fin assembly 500 defines at least two air outlet channels 501 of the first cross-section; in the second folded shape, the fin assembly 500 defines at least two air outlet channels 501 of the second cross-section; wherein the area of ​​the second cross-section is smaller than the area of ​​the first cross-section; the cross-sectional area of ​​the first channel 502 is larger than the area of ​​the first cross-section, so as to form a first channel 502 with a larger space.

[0217] Here, at least two may include two, and may include more than two.

[0218] Here, the first cross section and the second cross section may be cross sections of the air outlet channel perpendicular to the air outlet direction. In the first folded shape, the at least two sheet portions of the fin assembly 500 are arranged sparsely, and the area of ​​the first cross section of the air outlet channel surrounded by the at least two sheet portions is larger. In the second folded shape, the at least two sheet portions of the fin assembly 500 are arranged closely, and the area of ​​the second cross section of the air outlet channel surrounded by the at least two sheet portions is smaller.

[0219] In this implementation, the temperature of the fin assembly 500 can be greater than or equal to the third set temperature. When the temperature of the fin assembly 500 is greater than or equal to the third set temperature, the fin assembly 500 switches from the first folding shape to the second folding shape. When the temperature of the fin assembly 500 is less than the third set temperature, the fin assembly 500 switches from the second folding shape to the first folding shape.

[0220] Here, the third set temperature may be the deformation temperature of the fin assembly 500. In some embodiments, the third set temperature may have a corresponding relationship with the temperature of the heat generating component 300. When the heat generating component 300 reaches a higher temperature, the performance of the heat generating component 300 will be affected. Generally, the heat generating part has a safe operating temperature, and the third set temperature may have a corresponding relationship with the safe operating temperature of the heat generating component 300. As an example, the fin assembly 500 and the heat-generating component 300 can be spaced apart or in contact with each other. When the temperature of the heat-generating component 300 is greater than the safe operating temperature, the fin assembly 500 reaches a third set temperature, and the fin assembly 500 can switch from the first folded shape to the second folded shape to improve the heat dissipation capacity of the main body assembly 100 and the fin assembly 500 for dissipating heat from the heat-generating component 300 by removing impurities through the first channel 502 of the fin assembly 500. When the main body assembly 100 and the fin assembly 500 dissipate heat from the heat-generating component 300 and make the temperature of the heat-generating component 300 less than or equal to the safe operating temperature, the temperature of the fin assembly 500 is lower than the third set temperature, and the fin assembly 500 can switch from the second folded shape to the first folded shape to prepare for forming the first channel 502 again. At the same time, it does not affect the air outlet of the air outlet channel 501 of the fin assembly 500.

[0221] When the heating component 300 is spaced from the fin assembly 500, the heating component 300 reaches a safe operating temperature, the fin assembly 500 reaches a second temperature, the second temperature is less than the safe operating temperature, and the third set temperature may be greater than the second temperature. As an example, the safe operating temperature of the heating component 300 may be 52 degrees, the fin assembly 500 reaches a second temperature of 25 degrees, and the third set temperature may be 35 degrees. As another example, the safe operating temperature of the heating component 300 may be 54 degrees, the fin assembly 500 reaches a second temperature of 20 degrees, and the third set temperature may be 30 degrees. When the heating component 300 is in direct or indirect contact with the fin assembly 500, the heating component 300 reaches a safe operating temperature, the heating component 300 reaches a second temperature, the second temperature is substantially the same as the safe operating temperature, and the third set temperature may be greater than the second temperature. As an example, the safe operating temperature of the heating component 300 may be 52 degrees, the fin assembly 500 reaches a second temperature of 52 degrees, and the third set temperature may be 62 degrees. As another example, the safe operating temperature of the heat generating component 300 may be 54 degrees, the fin assembly 500 reaches the second temperature of 54 degrees, and the third set temperature may be 60 degrees. However, the present application is not limited thereto, and those skilled in the art may adjust or set the temperature according to specific needs.

[0222] Here, the heat-generating component 300 and the fin assembly 500 may be in direct contact or in indirect contact through other structures. For example, the heat dissipation device may also include: a heat conductor 400, which is used to transfer the heat of the heat-generating component 300 to the fin assembly 500; the heat conductor 400 may be in direct contact with the fin assembly 500, or it may be in indirect contact with other structures at the fin assembly 500. Of course, the heat conductor 400 and the fin assembly 500 may also be spaced apart. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0223] In other embodiments, the third set temperature may not correspond to the temperature of the heating component 300. For example, the third set temperature may be set by those skilled in the art according to specific requirements.

[0224] For another example, the third set temperature may be a temperature that the electronic device itself cannot reach. Here, the third set temperature may be a temperature at which the operator deforms the fin assembly 500 by heating the fin assembly 500; here, during normal operation of the electronic device, the fin assembly 500 will not deform. When the first channel 502 needs to be used, the operator may heat the fin assembly 500 to make the fin assembly 500 reach the third set temperature, so that the fin assembly 500 switches from the first folding shape to the second folding shape, thereby repairing or removing impurities from the electronic device through the formed first channel 502. When the electronic device is repaired or removed, the temperature of the fin assembly 500 is lower than the third set temperature, and the fin assembly 500 automatically switches from the second folding shape to the first folding shape so as not to affect the air outlet channel 501 of the fin assembly 500; here, the electronic device may be in a shutdown state.

[0225] For example, Fig.14 , Fig.15 and Fig.16 As shown, in some embodiments, the electronic device may further include a frame 600, the frame 600 having a first wall 610 and a second wall 620 spaced apart, the fin assembly 500 being located in a space defined by the first wall 610 and the second wall 620, the fin assembly 500 may have a first end and a second end relatively disposed, the first end of the fin assembly 500 and the first wall 610 may be connected by bonding, welding, snapping, etc.; in the case of the first folded shape, the second end of the fin assembly 500 is in contact with the second wall 620; in the case of the second folded shape, the second end of the fin assembly 500 is spaced apart from the second wall 620 so as to form a first channel 502 between the second wall 620 and the second end of the fin assembly 500.

[0226] It should be noted that in Fig.11 and Fig.12 The two fin assemblies 500 are included. For ease of understanding, the two fin assemblies 500 are illustratively in different folding shapes. Of course, the two fin assemblies 500 can be in the same folding shape. As an example, the two fin assemblies 500 can be switched to the first folding shape or the second folding shape at the same time. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0227] In this example, the first wall 610 and the second wall 620 define a first region and a second region; in the second folded shape, the second region is between the second wall 620 and the second end of the fin assembly 500. The first region is between the first wall 610 and the second end of the fin assembly 500.

[0228] Of course, in other examples, the electronic device may not include the frame 600. Here, the electronic device may include a first wall 610, the fin assembly 500 may be disposed on the first wall 610, and the electronic device may include a second wall 620. The first wall 610 and the second wall 620 may be part of the housing of the electronic device or part of the structural member of the electronic device. Of course, the electronic device may not include the second wall 620 but only include the first wall 610. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0229] As an example, when the temperature of the impurity removal component 200 is greater than or equal to the first set temperature, the impurity removal component 200 can switch from the first shape to the second shape, and when the temperature of the impurity removal component 200 is less than the first set temperature, the impurity removal component 200 can switch from the second shape to the first shape; there can be a first temperature difference between the first set temperature and the third set temperature; the heat dissipation device can also include: a heat conductor 400, which is used to transfer the heat of the heat-generating component 300 to the impurity removal component 200 and the fin assembly 500; there can be a second temperature difference between the impurity removal component 200 and the fin assembly 500; the first temperature difference and the second temperature difference can be the same, so that the impurity removal component 200 and the fin assembly 500 switch shapes at the same time, here, the impurities removed by the impurity removal component 200 can be automatically removed through the first channel 502, and the impurities at the fin assembly 500 can also be automatically removed through the first channel 502, thereby greatly improving the automatic impurity removal capability of the electronic device. At the same time, the impurities removed by the impurity removal component 200 are removed through the first channel 502, which can also prevent the impurities removed by the impurity removal component 200 from accumulating in the air outlet channel 501 of the fin component 500, thereby greatly improving the thorough impurity removal capability of the electronic device.

[0230] Here, the first set temperature may be greater than the third set temperature, the temperature of the impurity removal assembly 200 may be greater than the temperature of the fin assembly 500, the first temperature difference may be the first set temperature minus the third set temperature, and the second temperature difference may be the temperature of the impurity removal assembly 200 minus the temperature of the fin assembly 500. The first set temperature may also be less than the third set temperature, the temperature of the impurity removal assembly 200 may also be less than the temperature of the fin assembly 500, the first temperature difference may be the third set temperature minus the first set temperature, and the second temperature difference may be the temperature of the fin assembly 500 minus the temperature of the impurity removal assembly 200. Of course, the first set temperature may also be equal to the third set temperature, and here, the first temperature difference and the second temperature difference are zero.

[0231] Here, the simultaneous switching of the shapes of the impurity removal assembly 200 and the fin assembly 500 may mean that the impurity removal assembly 200 and the fin assembly 500 switch their shapes at substantially the same time point.

[0232] Of course, in other examples, the first temperature difference and the second temperature difference may also be different, so that the impurity removal component 200 and the fin component 500 switch shapes in a time-sharing manner.

[0233] The embodiment of the present application also describes a fin device, which includes a fin assembly 500. The fin assembly 500 can define an air outlet channel 501; the fin assembly 500 can be folded; the fin assembly 500 is used to dissipate heat from the heat-generating component 300, and the fin assembly 500 can have a first folded shape and a second folded shape based on temperature; in the case of the first folded shape, the fin assembly 500 is located in the first area and the second area, and in the case of the second folded shape, the fin assembly 500 is located in the first area and forms a first channel 502 in the second area.

[0234] The embodiment of the present application also records an electronic device, which includes a heat-generating component 300 and a fin device, wherein the fin device is used to provide heat dissipation for the heat-generating component 300; the fin assembly 500 can define an air outlet channel 501; the fin assembly 500 can be in a folded shape; the fin assembly 500 can have a first folded shape and a second folded shape based on temperature; in the case of the first folded shape, the fin assembly 500 is located in a first area and a second area, and in the case of the second folded shape, the fin assembly 500 is located in the first area and forms a first channel 502 in the second area.

[0235] In the related art, a heat dissipation structure is used to dissipate heat. During long-term use, the heat dissipation performance of the heat dissipation structure often decreases, making the adaptability of the heat dissipation device poor. For example, during long-term use, the heat dissipation performance of the heat dissipation structure often decreases due to the accumulation of dust, making the adaptability of the heat dissipation device poor. In the fin device of the present application, the fin assembly 500 can switch between the first folding shape and the second folding shape based on the temperature. During the process of the fin assembly 500 switching between the first folding shape and the second folding shape based on the temperature, some impurities attached to the fin assembly 500 can be separated from the fin assembly 500, and the air flowing through the fin assembly 500 can remove the impurities separated from the fin assembly 500, thereby improving the heat dissipation capacity of the fin assembly 500 for dissipating heat from the heat-generating component 300, and further improving the adaptability of the fin assembly 500.

[0236] The above embodiment has described the fin assembly 500 and the heat generating component 300, which will not be repeated here. It should be noted that the heat generating component 300 can be cooled by the main assembly 100 of the above embodiment alone, or by the fin assembly 500 alone, or by the main assembly 100 and the fin assembly 500 together.

[0237] In some optional implementations of the embodiments of the present application, the electronic device may further include a heat sink. The heat sink is used to provide heat dissipation to the heat generating component 300; the heat sink may include: a main assembly 100 and an impurity removal assembly 200. The main assembly 100 is used to dissipate heat from the heat generating component 300; the impurity removal assembly 200 may include a fixing portion and a deformation portion; the fixing portion is connected to the main assembly 100, and the deformation portion can have a first shape and a second shape based on temperature; during the switching process between the first shape and the second shape, the deformation portion can contact at least part of the main assembly 100 to remove impurities from the main assembly 100; so that the electronic device can remove impurities from the main assembly 100 through the impurity removal assembly 200.

[0238] The heat dissipation device has been described in the above embodiment, which will not be repeated here.

[0239] In some optional implementations of the embodiments of the present application, by switching the fin assembly 500 between the second folded shape and the first folded shape, impurities in the air outlet channel 501 defined by the fin assembly 500 can also be separated from the fin assembly 500 and removed. As an example, when the fin assembly 500 is switched from the second folded shape to the first folded shape, at least part of the impurities in the air outlet channel 501 are separated from the fin assembly 500 and removed through the air outlet channel 501. As another example, when the fin assembly 500 is switched from the first folded shape to the second folded shape, at least part of the impurities in the air outlet channel 501 are separated from the fin assembly 500 and removed through the air outlet channel 501. Here, due to the change in the shape of the fin assembly 500, the impurities in the air outlet channel 501 will be separated from the fin assembly 500, and the air flowing through the air outlet channel 501 can automatically carry away and remove the impurities in the air outlet channel 501 that are separated from the fin assembly 500, thereby greatly improving the automatic impurity removal capability of the fin assembly 500, and further improving the heat dissipation capability of the fin assembly 500.

[0240] In some optional implementations of the embodiments of the present application, impurities located at the air outlet channel 501 can be removed based on the first channel 502; here, the impurities located at the air outlet channel 501 may include impurities located at the entrance of the air outlet channel 501, and may also include impurities located at the exit of the air outlet channel 501. However, the present application is not limited to this, that is, those skilled in the art may adjust or set it according to specific needs. When the fin assembly 500 switches from the first folding shape to the second folding shape, part of the impurities originally located at the entrance or exit of the air outlet channel 501 are separated from the fin assembly 500 and located on the path of the first channel 502. The air flowing through the first channel 502 can automatically take away and remove the impurities located on the path of the first channel 502, thereby greatly improving the automatic impurity removal capability of the fin assembly 500, and further improving the heat dissipation capability of the fin assembly 500.

[0241] In some optional implementations of the embodiments of the present application, the first channel 502 may be a channel for improving the heat dissipation performance of the fin device, or may be a channel for other functions. When the first channel 502 is used as a channel for improving the heat dissipation performance of the fin device, the heat dissipation performance of the fin device can be improved through the first channel 502, thereby greatly improving the adaptability of the heat dissipation device.

[0242] The first channel 502 may be a channel for improving the heat dissipation performance of the fin device, and the implementation method is not limited.

[0243] For example, the first channel 502 may be a channel for active impurity removal.

[0244] Here, when the fin assembly 500 switches from the first folding shape to the second folding shape, impurities located at the air outlet channel 501 can be removed based on the first channel 502; here, the impurities located at the air outlet channel 501 can include impurities located at the entrance of the air outlet channel 501, and can also include impurities located at the outlet of the air outlet channel 501. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0245] When the electronic device includes the main body assembly 100, impurities at the main body assembly 100 can also be automatically removed by the air flowing at the first channel 502. Here, when the fin assembly 500 switches from the first folded shape to the second folded shape, impurities at the main body assembly 100 can be removed through the first channel 502.

[0246] For another example, the first channel 502 may be used to increase the air volume in the second area to improve the heat dissipation performance of the fin device.

[0247] For another example, the first channel 502 can be used as a channel for manual or machine passive impurity removal.

[0248] Here, as an example, due to long-term use, some impurities stick to some areas of the fin assembly 500 or the main assembly 100 and are not easy to remove automatically. They can be removed manually or passively by a machine, thereby improving the heat dissipation performance of the fin device.

[0249] For another example, the first passage 502 may be used as a maintenance passage.

[0250] Here, as an example, the electronic device has a first structural component in the space corresponding to the second area, and the first structural component can be repaired or replaced through the first channel 502 .

[0251] Here, damage to the first structural member may affect the heat dissipation performance of the fin device, and the heat dissipation performance of the fin device can be improved by repairing or replacing the first structural member. Of course, damage to the first structural member may not affect the heat dissipation performance of the fin device.

[0252] Of course, in other examples, the first channel 502 can also be used as a channel for other functions, for example, the first channel 502 can be used as a channel for repairing or replacing parts. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set it according to specific needs.

[0253] In some optional implementations of the embodiments of the present application, in a first folded shape, the fin assembly 500 defines at least two air outlet channels 501 of a first cross-section; in a second folded shape, the fin assembly 500 defines at least two air outlet channels 501 of a second cross-section; wherein the area of ​​the second cross-section is smaller than the area of ​​the first cross-section; the cross-sectional area of ​​the first channel 502 is larger than the area of ​​the first cross-section, so as to form a first channel 502 with a larger space.

[0254] The first cross section and the second cross section have been described in the above embodiment, which will not be repeated here.

[0255] In some optional implementations of the embodiments of the present application, the temperature of the fin assembly 500 may be greater than or equal to a third set temperature. When the temperature of the fin assembly 500 is greater than or equal to the third set temperature, the fin assembly 500 switches from the first folding shape to the second folding shape. When the temperature of the fin assembly 500 is less than the third set temperature, the fin assembly 500 switches from the second folding shape to the first folding shape.

[0256] The third set temperature has been described in the above embodiment and will not be described again here.

[0257] In some optional implementations of the embodiments of the present application, the fin device may also include a frame 600, the frame 600 may have a first wall 610 and a second wall 620 that are spaced apart, the fin assembly 500 is located in a space defined by the first wall 610 and the second wall 620, the fin assembly 500 may have a first end and a second end that are relatively disposed, the first end of the fin assembly 500 and the first wall 610 may be connected by bonding, welding, clamping, etc.; in the case of the first folded shape, the second end of the fin assembly 500 is in contact with the second wall 620; in the case of the second folded shape, the second end of the fin assembly 500 is spaced apart from the second wall 620 so that a first channel 502 is formed between the second wall 620 and the second end of the fin assembly 500.

[0258] In this example, the first wall 610 and the second wall 620 define a first region and a second region; in the second folded shape, the second region is between the second wall 620 and the second end of the fin assembly 500. The first region is between the first wall 610 and the second end of the fin assembly 500.

[0259] Of course, in other examples, the fin assembly 500 may not include the frame 600. Here, the electronic device may include a first wall 610, the fin assembly 500 may be arranged on the first wall 610, and the electronic device may include a second wall 620. The first wall 610 and the second wall 620 may be part of the housing of the electronic device or part of the structural part of the electronic device. Of course, the electronic device may not include the second wall 620. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0260] In some optional implementations of the embodiments of the present application, the electronic device may further include a fan 110 so as to dissipate heat for the fin device through the fan 110 .

[0261] In this implementation, the fan 110 may be a conventional fan 110. Of course, the fan 110 may also be a fan 110 with a debris removal component 200. The fan 110 and the debris removal component 200 have been described in the above embodiment, and will not be repeated here.

[0262] The various specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction, for example, different embodiments and technical solutions can be formed by combining different specific technical features. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features in this application will not be described separately.

[0263] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation device, comprising: A main body component, the main body component is used to dissipate heat from the heat-generating components; A debris removal component, including a fixing portion and a deformation portion; The fixing portion is connected to the main body assembly, and the deformable portion can have a first shape and a second shape based on temperature; During the switching between the first shape and the second shape, the deformed portion can contact at least a portion of the body component to remove impurities from the body component.

2. The heat dissipation device according to claim 1, The main body component has a first state and a second state. The heat dissipation performance of the main body component in the first state is a first performance. The heat dissipation performance of the main body component in the second state is a second performance. The second performance is less than the first performance. In the first state, the amount of impurities attached to the main component is a first amount; In the second state, the amount of impurities attached to the main component is a second amount, and the second amount is greater than the first amount; When the temperature of the impurity removal component is greater than or equal to the first set temperature, the impurity removal component switches from the first shape to the second shape; When the temperature of the impurity removal component is lower than the first set temperature, the impurity removal component switches from the second shape to the first shape.

3. The heat dissipation device according to claim 2, wherein the main body assembly comprises: fan; The fan comprises: A seat portion, used for connecting with a driving member; at least two blades are radially arranged on the outer peripheral side of the seat; The debris removal assembly includes a first debris removal member disposed between two adjacent blades; and / or the debris removal assembly includes a second debris removal member disposed on an end side of the seat portion.

4. The heat dissipation device according to claim 3, The first fixing portion of the first debris removing member is connected to the outer peripheral side of the seat portion, When the temperature is lower than the first set temperature, the first deformable portion of the first impurity removing member is curled and attached to the outer peripheral side of the seat portion. When the temperature is greater than or equal to the first set temperature, the first deformation portion is in an expanded state and is located between two adjacent blades; and / or, The second fixing portion of the second debris removing member is connected to the end side of the seat portion, When the temperature is lower than the first set temperature, the second deformation portion of the second impurity removing member is attached to the end side of the seat portion in a first unfolded shape. When the temperature is greater than or equal to the first set temperature, the second deformation portion is attached to one end of the at least two blades in a second expanded shape.

5. An electronic device, comprising: A heat generating component and a heat dissipation device, wherein the heat dissipation device is used to provide heat dissipation for the heat generating component; the heat dissipation device comprises: A main body component, the main body component is used to dissipate heat from the heat generating component; A debris removal component, comprising a fixed portion and a deformable portion; the fixed portion is connected to the main component, and the deformable portion can have a first shape and a second shape based on temperature; During the switching between the first shape and the second shape, the deformed portion can contact at least a portion of the body component to remove impurities from the body component.

6. The electronic device according to claim 5, wherein the main body component has a first state and a second state, the heat dissipation performance of the main body component in the first state is a first performance, and the heat dissipation performance of the main body component in the second state is a second performance, and the second performance is less than the first performance; In the first state, the amount of impurities attached to the main component is a first amount, and in the second state, the amount of impurities attached to the main component is a second amount, and the second amount is greater than the first amount; When the temperature of the impurity removal component is greater than or equal to the first set temperature, the impurity removal component switches from the first shape to the second shape; When the temperature of the impurity removal component is lower than the first set temperature, the impurity removal component switches from the second shape to the first shape; In the first state, and when the heat generating component operates at maximum power consumption, the temperature of the impurity removal component is lower than the first set temperature.

7. The electronic device according to claim 5 or 6, further comprising: A fin assembly defines an air outlet channel; The fin assembly is in a folded shape; The fin assembly can have a first folded shape and a second folded shape based on temperature; In the case of the first folded shape, the fin assembly is located in the first area and the second area, In the case of the second folded shape, the fin assembly is located in the first area and a first channel is formed in the second area.

8. The electronic device according to claim 7, when the temperature of the fin assembly is greater than or equal to the third set temperature, the fin assembly switches from the first folding shape to the second folding shape, and when the temperature of the fin assembly is less than the third set temperature, the fin assembly switches from the second folding shape to the first folding shape.

9. The electronic device according to claim 7, In the first folded shape, the fin assembly defines at least two air outlet channels of the first cross-section; In the second folded shape, the fin assembly defines at least two air outlet channels of the second cross section; wherein, The area of ​​the second cross section is smaller than the area of ​​the first cross section; the area of ​​the cross section of the first channel is larger than the area of ​​the first cross section.

10. A fin device, comprising: A fin assembly defines an air outlet channel; The fin assembly is in a folded shape; The fin assembly is used to dissipate heat from a heat generating component, and the fin assembly can have a first folded shape and a second folded shape based on temperature; In the case of the first folded shape, the fin assembly is located in the first area and the second area, In the case of the second folded shape, the fin assembly is located in the first area and a first channel is formed in the second area.

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