Preparation method of LED device package and LED device

Abstract

The invention discloses a preparation method of an LED device package and an LED device. According to the scheme, the rare earth fluoride is added into the first fluorescent glue, and the rare earth fluoride has excellent luminescence performance, so that the luminous efficiency of the LED can be remarkably improved. Due to the unique electronic structure of the rare earth element, the rare earth element can absorb and convert various forms of energy, so that efficient and stable light is emitted. And the rare earth luminescent material has the advantages of narrow emission spectrum half-wave broadband band, high color purity and bright color, and can meet the high requirements of terminal customers on color quality. The rare earth fluoride has good chemical stability and can resist various severe environments, so that the service life of the LED is prolonged; alkaline earth metal fluoride, diffusion powder, nanometer negative ion powder and nanometer barium sulfate are added into the second fluorescent glue; the alkaline earth metal fluoride can improve the heat resistance and chemical stability of the fluorescent glue, and ensures that the LED can still work stably in severe environments such as high temperature and high humidity.

Description

Technical Field

[0001] The present invention relates to the technical field of luminescent materials, and in particular to a method for preparing an LED device package and an LED device. Background Art

[0002] In recent years, with the rapid development of the LED packaging industry, the LED white light packaging process has become increasingly mature. The packaging principle of white light LED is mainly to mix the blue light emitted by the blue LED chip with the yellow light emitted by the yellow phosphor to obtain white light. In addition, white light can also be obtained by mixing the light emitted by the three colors of LED chips, red light, green light and blue light, or by using ultraviolet LED chips to excite the three primary color phosphors.

[0003] The general process of white light LED packaging includes but is not limited to die bonding, die bonding baking, wire bonding, phosphor coating, phosphor baking, colloid baking, cutting, test grading, and inspection packaging. The selection and coating technology of phosphors are key factors affecting the luminous efficiency and color temperature of white light LEDs. It is necessary to select the appropriate phosphor type, particle size, and coating process to ensure the luminous performance and stability of the LED.

[0004] The traditional method of using blue light chips to excite LuYG / GaYAG yellow-green powder + nitride red phosphor to encapsulate white light of various color temperatures can no longer meet the end customers' demand for high-efficiency, high-brightness LED light sources. However, silicate green powder, silicate orange powder, and NBR red phosphor cannot meet customers' reliability requirements due to their poor temperature resistance.

[0005] Therefore, in order to solve the problem that the current white light LED packaging method on the market can no longer meet the end customers' requirements for high light efficiency and reliability, a new solution is urgently needed to overcome the shortcomings of the existing technology. Summary of the invention

[0006] In view of the problems existing in the above-mentioned prior art, the present invention provides a method for preparing an LED device package and an LED device, which can effectively solve the problems existing in the above-mentioned prior art.

[0007] The technical solution of the present invention is:

[0008] According to one aspect of the present invention, the following steps are included:

[0009] S1, uniformly mixing one or more combinations of K2SiF6:Mn4+, K2TiF6:Mn4+, K2GeF6:Mn4+, K3AlF6:Mn4+, NaHF2:Mn4+, Cs2GeF6:Mn4+, BaSiF6:Mn4+ or Na2SiF6:Mn4+ with a transparent resin and a rare earth fluoride in proportion to obtain a first fluorescent glue;

[0010] S2, evacuate the prepared first fluorescent glue until no bubbles are visible;

[0011] S3, using a dispensing machine to evenly dispense a certain amount of the first fluorescent glue in the support bowl of the blue light chip, and perform semi-precipitation to make the first fluorescent glue evenly leveled;

[0012] S4, then quickly heating the first fluorescent glue on the blue light wafer so that the surface of the first fluorescent glue is solidified and formed;

[0013] S5, mixing one or more components of yellow phosphor, green phosphor or orange phosphor according to a certain proportion, adding transparent resin and mixing evenly according to a certain proportion, and then adding nitride phosphor, alkaline earth metal fluoride, diffusion powder, nano negative ion powder and nano barium sulfate / calcium carbonate / silicon dioxide and mixing evenly according to a certain proportion to obtain a second fluorescent glue;

[0014] S6, evacuate the prepared second fluorescent glue until no bubbles are visible;

[0015] S7, using a glue dispenser to evenly dispense the second fluorescent glue according to a predetermined amount of glue on the surface of the first fluorescent glue that has been formed, and to precipitate the second fluorescent glue so that the second fluorescent glue evenly covers the surface of the first fluorescent glue;

[0016] S8, continuously heating the second fluorescent glue to solidify and crystallize the second fluorescent glue.

[0017] Furthermore, in step S1, the first fluorescent glue includes the following components in parts by mass: 30 to 35 parts of K2SiF6:Mn4+, 60 to 70 parts of transparent resin, and 5 to 8 parts of rare earth fluoride.

[0018] Further, in step S4, the first fluorescent glue is placed in an oven for high-temperature heating, the temperature of the oven is 120-180°C, the heating time is 15-30 minutes, and the pressure is 0.4-0.6 MPa.

[0019] Further, in step S5, the second fluorescent glue includes the following components in parts by mass: 10 to 14 parts of green fluorescent powder, 50 to 60 parts of transparent resin, 1 to 2 parts of nitride fluorescent powder, 0.5 to 1 part of alkaline earth metal fluoride, 0.5 to 1 part of diffusion powder, 0.5 to 0.8 part of nano negative ion powder, and 0.1 to 1 part of nano barium sulfate.

[0020] Further, in step S5, the second fluorescent glue includes the following components in parts by mass: 10 to 14 parts of green fluorescent powder, 50 to 60 parts of transparent resin, 1 to 2 parts of nitride fluorescent powder, 0.5 to 1 part of alkaline earth metal fluoride, 0.5 to 1 part of diffusion powder, 0.5 to 0.8 part of nano negative ion powder, and 0.1 to 1 part of calcium carbonate.

[0021] Further, in step S5, the second fluorescent glue includes the following components in parts by mass: 10 to 14 parts of green fluorescent powder, 50 to 60 parts of transparent resin, 1 to 2 parts of nitride fluorescent powder, 0.5 to 1 part of alkaline earth metal fluoride, 0.5 to 1 part of diffusion powder, 0.5 to 0.8 part of nano negative ion powder, and 0.1 to 1 part of silicon dioxide.

[0022] Furthermore, in step S8, the first fluorescent glue and the second fluorescent glue are placed in an oven, and after being heated at a predetermined temperature for a period of time, the temperature of the oven needs to be increased and heated for another period of time.

[0023] Further, in step S8, the temperature of the first oven is 105-120°C, the heating time is 40-80 minutes, and the pressure is 0.4-0.5 MPa. The temperature of the second oven is 140-180°C, the heating time is 250-300 minutes, and the pressure is 0.5-0.7 MPa.

[0024] Furthermore, the transparent resin is epoxy resin.

[0025] According to another aspect of the present invention, an LED device includes a bracket, and adopts any one of the preparation methods described above to fill a first fluorescent glue and a second fluorescent glue in layers in sequence in the bracket bowl of the bracket.

[0026] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0027] First, this solution adds rare earth fluoride to the first fluorescent glue. Rare earth fluoride has excellent luminescent properties and can significantly improve the luminous efficiency of LEDs. The unique electronic structure of rare earth elements enables them to absorb and convert various forms of energy, thereby emitting efficient and stable light. High color purity: The emission spectrum of rare earth luminescent materials has a narrow half-wave bandwidth, high color purity, and bright colors, which can meet the high requirements of end customers for color quality. Good chemical stability: Rare earth fluoride has good chemical stability and can withstand various harsh environments, thereby extending the service life of LEDs.

[0028] Alkaline earth metal fluorides, diffusion powder, nano negative ion powder and nano barium sulfate are added to the second fluorescent glue; alkaline earth metal fluorides can improve the heat resistance and chemical stability of the fluorescent glue, ensuring that the LED can still work stably in harsh environments such as high temperature and high humidity. Alkaline earth metal fluorides can also produce synergistic effects with rare earth fluorides to further improve the light efficiency and color quality of the LED. Diffusion powder effectively scatters light, making the light emitted by the LED softer and more uniform, reducing glare and shadows, and improving visual comfort; rare earth fluorides, as luminescent materials, have the characteristics of narrow half-wave broadband, high color purity and bright colors. Adding rare earth fluorides to fluorescent glue can significantly improve the luminous efficiency and color quality of LEDs, making the LED light source brighter and clearer. Rare earth fluorides have excellent physical and chemical stability and can withstand high-power electron beams, high-energy radiation and strong light. Adding rare earth fluorides to fluorescent glue can enhance the weather resistance and service life of fluorescent glue, making the LED light source more stable and reliable. Rare earth luminescent materials can emit a spectrum from ultraviolet to infrared light, especially in the visible light region. By adjusting the type and content of rare earth fluorides, the spectral distribution of fluorescent glue can be optimized, making the spectrum of LED light source closer to natural light, and improving color rendering index and color reproduction.

[0029] Secondly, the addition of calcium carbonate to the second fluorescent glue can significantly improve the whiteness of the fluorescent material, making the LED light source brighter and more conspicuous in a well-lit environment; calcium carbonate can enhance the durability of the fluorescent material, effectively resist aging and discoloration, thereby extending the service life of the LED; calcium carbonate helps the fluorescent material maintain a stable color, ensuring that the LED light source is bright and not easy to fade for a long time. Calcium carbonate can improve the toughness of the fluorescent glue, help avoid incomplete curing problems during the production process, and fragmentation during use, thereby improving the reliability and stability of the LED. Calcium carbonate can reduce the reflectivity of the surface of the filled plastic product to light, making the LED light source softer and playing a matting role.

[0030] Thirdly, the addition of silica to the second fluorescent glue can significantly improve the hardness, heat resistance and chemical stability of the fluorescent glue, making it more durable and reliable. Silica can also improve the refractive index of the fluorescent glue, which helps to optimize the optical properties of the LED; silica can be used as a carrier of fluorescent powder, and through its excellent dispersion properties, the fluorescent powder can be more evenly dispersed in the fluorescent glue, thereby improving the luminous efficiency and color uniformity of the LED; silica can also effectively prevent the sedimentation and agglomeration of the fluorescent powder in the fluorescent glue, ensuring the stability and consistency of the LED light source; silica has a high thermal conductivity, which can accelerate the transfer and dissipation of heat generated by the LED during operation, thereby reducing the operating temperature of the LED and improving its service life and reliability.

[0031] In summary, setting up a double-layer fluorescent glue structure and adding rare earth fluorides, alkaline earth metal fluorides, diffusion powders, nano negative ion powders, and nano barium sulfate / calcium carbonate / silicon dioxide and other additives can significantly improve the luminous efficiency, color quality, stability, durability, and additional functions of white light LEDs, thereby better meeting the needs of end customers. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 It is a schematic diagram of the preparation steps of the present invention;

[0034] Figure 2 This is a schematic diagram of the three-dimensional structure of the first fluorescent glue, the second fluorescent glue and the bracket in the present invention;

[0035] Figure 3 It is a schematic diagram of the cross-sectional structure of the first fluorescent glue, the second fluorescent glue and the bracket in the present invention;

[0036] In the figure: first fluorescent glue-1, second fluorescent glue-2, and bracket-3. DETAILED DESCRIPTION

[0037] The present invention will be further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present invention, but are not intended to limit the scope of the present invention. Similarly, the following examples are only partial embodiments of the present invention rather than all embodiments, and all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present invention.

[0038] like Figures 1 to 3 As shown, the present solution provides a method for preparing an LED device package and an LED device.

[0039] Embodiment 1:

[0040] See also Figures 1 to 3 , a method for preparing an LED device package, comprising the following steps:

[0041] S1, one or more combinations of K2SiF6:Mn4+, K2TiF6:Mn4+, K2GeF6:Mn4+, K3AlF6:Mn4+, NaHF2:Mn4+, Cs2GeF6:Mn4+, BaSiF6:Mn4+ or Na2SiF6:Mn4+ are uniformly mixed with a transparent resin and a rare earth fluoride in proportion to obtain a first fluorescent glue; specifically, the first fluorescent glue comprises the following components in parts by mass: 30 to 35 parts of K2SiF6:Mn4+, 60 to 70 parts of a transparent resin, and 5 to 8 parts of a rare earth fluoride. Preferably, the transparent resin is an epoxy resin. Epoxy resin has good tolerance to common chemicals and can protect the LED chip from the external environment. This helps to extend the service life of the LED and improve its reliability in various environments. The LED will generate a certain amount of heat when working, and the epoxy resin has a high heat resistance and can work stably at the higher temperature generated when the LED emits light. This helps ensure the stability and life of the LED and prevents performance degradation or damage caused by excessive temperature. As a luminescent material, rare earth fluorides have the characteristics of narrow half-wave broadband of the emission spectrum, high color purity, and bright colors. Adding rare earth fluorides to fluorescent glue can significantly improve the luminous efficiency and color quality of the LED, making the LED light source brighter and clearer. Rare earth fluorides have excellent physical and chemical stability and can withstand high-power electron beams, high-energy radiation and strong light. Adding rare earth fluorides to fluorescent glue can enhance the weather resistance and service life of the fluorescent glue, making the LED light source more stable and reliable. Rare earth luminescent materials can emit a spectrum from ultraviolet to infrared light, especially in the visible light region. By adjusting the type and content of rare earth fluorides, the spectral distribution of the fluorescent glue can be optimized, making the spectrum of the LED light source closer to natural light, and improving the color rendering index and color reproduction.

[0042] S2, evacuate the prepared first fluorescent glue until no bubbles are visible; bubbles in the fluorescent glue will scatter light, resulting in reduced light efficiency of LED white light. Through degassing treatment, the number of bubbles in the fluorescent glue can be significantly reduced, thereby reducing light scattering and improving the light efficiency of LED white light. The presence of bubbles will interfere with the propagation path of light, reducing the brightness of LED white light. After degassing treatment, the bubbles in the fluorescent glue are completely removed, and the light propagation is smoother, thereby improving the brightness of LED white light.

[0043] S3, use a dispensing machine to evenly dispense a certain amount of the first fluorescent glue in the bowl of the blue light chip support, and perform semi-precipitation to make the first fluorescent glue evenly leveled; the semi-precipitation process helps to evenly distribute the fluorescent glue in the bowl of the support. Through the precise control of the dispensing machine, the fluorescent glue is evenly dispensed in the bowl, and then under the action of semi-precipitation, the fluorescent glue can be naturally leveled, reducing the generation of bubbles and gaps, so that the distribution of the fluorescent powder in the colloid is more uniform.

[0044] S4, then quickly heating the first fluorescent glue on the blue light wafer to solidify the surface of the first fluorescent glue; placing the first fluorescent glue in an oven for high-temperature heating, the temperature of the oven is 120-180°C, the heating time is 15-30 minutes, and the pressure is 0.4-0.6MPa. Preferably, the temperature of the oven is 145-150°C, the heating time is 20-28 minutes, and the pressure is 0.5-0.55MPa.

[0045] S5, mix one or more components of yellow phosphor, green phosphor or orange phosphor in a certain proportion, then add transparent resin and mix evenly in proportion, then add nitride phosphor, alkaline earth metal fluoride, diffusion powder, nano negative ion powder and nano barium sulfate / calcium carbonate / silicon dioxide, mix evenly in proportion, and obtain the second fluorescent glue; specifically, the second fluorescent glue includes the following components by mass: 10-14 parts of green phosphor, 50-60 parts of transparent resin, 1-2 parts of nitride phosphor, 0.5-1 part of alkaline earth metal fluoride, 0.5-1 part of diffusion powder, 0.5-0.8 parts of nano negative ion powder, and 0.1-1 part of nano barium sulfate. Nano barium sulfate can solve the problems of uniform light and light transmission very well. Through the different refractive indices of the substrate and the microbeads, nano barium sulfate can make the incident light undergo multiple refractions to achieve a soft light effect, while reducing the loss of light transmission energy; the addition of nano barium sulfate can turn a point light source into a surface light source, expand the light-emitting surface, and make the light softer. Nano-barium sulfate has high strength and toughness, which can significantly improve the mechanical properties of fluorescent glue and make it more durable; nano-barium sulfate has the characteristics of strong chemical inertness and good stability, which can ensure that the fluorescent glue can maintain stable performance in various environments. The addition of nano-barium sulfate can improve the optical properties of fluorescent glue, making it have better light transmittance and uniform light. Nano-barium sulfate can also reduce light scattering and reflection, and improve the luminous efficiency and color quality of LEDs.

[0046] S6, evacuate the prepared second fluorescent glue until no bubbles are visible;

[0047] S7, use a glue dispenser to evenly dispense the second fluorescent glue according to a predetermined amount of glue on the surface of the first fluorescent glue that has been formed, and precipitate it so that the second fluorescent glue evenly covers the surface of the first fluorescent glue; through the precipitation process, the second fluorescent glue can evenly cover the surface of the first fluorescent glue, making the fluorescent powder layer more complete and uniform.

[0048] S8, continuously heat the second fluorescent glue to solidify and crystallize the second fluorescent glue. Specifically, the first fluorescent glue and the second fluorescent glue are placed in an oven, and after heating for a period of time according to a predetermined temperature, the temperature of the oven needs to be increased and heated for a period of time. The temperature of the first oven is 105-120°C, the heating time is 40-80min, and the pressure is 0.4-0.5Mpa. The temperature of the second oven is 140-180°C, the heating time is 250-300min, and the pressure is 0.5-0.7Mpa. Preferably, the temperature of the first oven is 110-115°C, the heating time is 65-70min, the pressure is 0.45-0.48Mpa, and the temperature of the second oven is 175-180°C, the heating time is 280-290min, and the pressure is 0.65-0.7Mpa. During the curing process, the second fluorescent glue may produce residual stress. The second heating helps to release these residual stresses, improve the stability of the second fluorescent layer, and ensure that the second fluorescent glue is completely cured to avoid performance degradation caused by incomplete curing, which helps to improve the luminous efficiency and light color consistency of the LED.

[0049] Embodiment 2:

[0050] See also Figures 1 to 3 , a method for preparing an LED device package, comprising the following steps:

[0051] S1. One or more combinations of K2SiF6:Mn4+, K2TiF6:Mn4+, K2GeF6:Mn4+, K3AlF6:Mn4+, NaHF2:Mn4+, Cs2GeF6:Mn4+, BaSiF6:Mn4+ or Na2SiF6:Mn4+ are uniformly mixed with a transparent resin and a rare earth fluoride in proportion to obtain a first fluorescent glue; specifically, the first fluorescent glue comprises the following components by mass: 30 to 35 parts of K2SiF6:Mn4+, 60 to 70 parts of a transparent resin, and 5 to 8 parts of a rare earth fluoride. The transparent resin is an epoxy resin.

[0052] S2, evacuate the prepared first fluorescent glue until no bubbles are visible;

[0053] S3, using a dispensing machine to evenly dispense a certain amount of the first fluorescent glue in the support bowl of the blue light chip, and perform semi-precipitation to make the first fluorescent glue evenly leveled;

[0054] S4, then quickly heat the first fluorescent glue on the blue light chip to solidify the surface of the first fluorescent glue; put the first fluorescent glue into an oven for high-temperature heating, the temperature of the oven is 120-180°C, the heating time is 15-30 minutes, and the pressure is 0.4-0.6MPa.

[0055] S5, mix one or more components of yellow fluorescent powder, green fluorescent powder or orange fluorescent powder in a certain proportion, then add transparent resin and mix evenly in proportion, then add nitride fluorescent powder, alkaline earth metal fluoride, diffusion powder, nano negative ion powder and nano barium sulfate / calcium carbonate / silicon dioxide, mix evenly in proportion, and obtain the second fluorescent glue; specifically, the second fluorescent glue includes the following components by mass: 10-14 parts of green fluorescent powder, 50-60 parts of transparent resin, 1-2 parts of nitride fluorescent powder, 0.5-1 parts of alkaline earth metal fluoride, 0.5-1 parts of diffusion powder, 0.5-0.8 parts of nano negative ion powder, and 0.1-1 parts of calcium carbonate. The addition of calcium carbonate can significantly improve the whiteness of fluorescent materials, making LED light sources brighter and more conspicuous in a well-lit environment; calcium carbonate can enhance the durability of fluorescent materials, effectively resist aging and discoloration, thereby extending the service life of LEDs; calcium carbonate helps fluorescent materials maintain a stable color, ensuring that the LED light source is bright in color and not easy to fade for a long time. Calcium carbonate can improve the toughness of fluorescent glue, help avoid incomplete curing during production and breakage during use, thereby improving the reliability and stability of LEDs. Calcium carbonate can reduce the reflectivity of the surface of filled plastic products to light, making the LED light source softer and playing a matting role.

[0056] S6, evacuate the prepared second fluorescent glue until no bubbles are visible;

[0057] S7, using a glue dispenser to evenly dispense the second fluorescent glue according to a predetermined amount of glue on the surface of the first fluorescent glue that has been formed, and to precipitate the second fluorescent glue so that the second fluorescent glue evenly covers the surface of the first fluorescent glue;

[0058] S8, continuously heat the second fluorescent glue to solidify and crystallize the second fluorescent glue. Specifically, the first fluorescent glue and the second fluorescent glue are placed in an oven, and after heating for a period of time according to a predetermined temperature, the temperature of the oven needs to be increased and heated for a period of time. The temperature of the first oven is 105-120°C, the heating time is 40-80min, and the pressure is 0.4-0.5Mpa. The temperature of the second oven is 140-180°C, the heating time is 250-300min, and the pressure is 0.5-0.7Mpa. Preferably, the temperature of the first oven is 110-115°C, the heating time is 65-70min, the pressure is 0.45-0.48Mpa, and the temperature of the second oven is 175-180°C, the heating time is 280-290min, and the pressure is 0.65-0.7Mpa.

[0059] Embodiment three:

[0060] See also Figures 1 to 3 , a method for preparing an LED device package, comprising the following steps:

[0061] S1, one or more combinations of K2SiF6:Mn4+, K2TiF6:Mn4+, K2GeF6:Mn4+, K3AlF6:Mn4+, NaHF2:Mn4+, Cs2GeF6:Mn4+, BaSiF6:Mn4+ or Na2SiF6:Mn4+ are mixed evenly with a transparent resin and a rare earth fluoride in proportion to obtain a first fluorescent glue; specifically, the first fluorescent glue comprises the following components by mass: 30 to 35 parts of K2SiF6:Mn4+, 60 to 70 parts of a transparent resin, and 5 to 8 parts of a rare earth fluoride. Preferably, the transparent resin is an epoxy resin.

[0062] S2, evacuate the prepared first fluorescent glue until no bubbles are visible;

[0063] S3, using a dispensing machine to evenly dispense a certain amount of the first fluorescent glue in the support bowl of the blue light chip, and perform semi-precipitation to make the first fluorescent glue evenly leveled;

[0064] S4, then quickly heating the first fluorescent glue on the blue light chip to solidify the surface of the first fluorescent glue; placing the first fluorescent glue in an oven for high-temperature heating, the temperature of the oven is 120-180° C.,

[0065] The heating time is 15 to 30 minutes, and the pressure is 0.4 to 0.6 MPa;

[0066] S5, mixing one or more components of yellow phosphor, green phosphor or orange phosphor in a certain proportion, then adding transparent resin and mixing evenly in proportion, then adding nitride phosphor, alkaline earth metal fluoride, diffusion powder, nano negative ion powder and nano barium sulfate / calcium carbonate / silicon dioxide, mixing evenly in proportion, to obtain a second fluorescent glue; specifically, the second fluorescent glue comprises the following components in parts by mass: 10 to 14 parts of green phosphor, 50 to 60 parts of transparent resin, 1 to 2 parts of nitride phosphor, 0.5 to 1 part of alkaline earth metal fluoride, 0.5 to 1 part of diffusion powder, 0.5 to 0.8 parts of nano negative ion powder, and 0.1 to 1 part of silicon dioxide. The addition of silica can significantly improve the hardness, heat resistance and chemical stability of fluorescent glue, making it more durable and reliable. Silica can also improve the refractive index of fluorescent glue, which helps to optimize the optical properties of LEDs. Silica can be used as a carrier of phosphors, and through its excellent dispersion properties, it can make the phosphors more evenly dispersed in the fluorescent glue, thereby improving the luminous efficiency and color uniformity of the LED. Silica can also effectively prevent the sedimentation and agglomeration of phosphors in fluorescent glue, ensuring the stability and consistency of the LED light source. Silica has a high thermal conductivity, which can accelerate the transfer and dissipation of heat generated by the LED during operation, thereby reducing the operating temperature of the LED and improving its service life and reliability.

[0067] S6, evacuate the prepared second fluorescent glue until no bubbles are visible;

[0068] S7, using a glue dispenser to evenly dispense the second fluorescent glue according to a predetermined amount of glue on the surface of the first fluorescent glue that has been formed, and to precipitate the second fluorescent glue so that the second fluorescent glue evenly covers the surface of the first fluorescent glue;

[0069] S8, continuously heat the second fluorescent glue to solidify and crystallize the second fluorescent glue. Specifically, the first fluorescent glue and the second fluorescent glue are placed in an oven, and after heating for a period of time according to a predetermined temperature, the temperature of the oven needs to be increased and heated for a period of time. The temperature of the first oven is 105-120°C, the heating time is 40-80min, and the pressure is 0.4-0.5Mpa. The temperature of the second oven is 140-180°C, the heating time is 250-300min, and the pressure is 0.5-0.7Mpa. Preferably, the temperature of the first oven is 110-115°C, the heating time is 65-70min, the pressure is 0.45-0.48Mpa, and the temperature of the second oven is 175-180°C, the heating time is 280-290min, and the pressure is 0.65-0.7Mpa.

[0070] See also Figure 2 and Figure 3According to another aspect of the present invention, an LED device includes a bracket 3, and a first fluorescent glue 1 and a second fluorescent glue 2 are filled in layers in sequence in the bracket bowl of the bracket 3 using a preparation method as described in any of the above embodiments.

[0071] Embodiment 1, embodiment 2 and embodiment 3 are all applied to the manufacture of LDE devices, and specifically include the following steps:

[0072] S1, the blue light chip is the core component of the LED white light. The blue light is combined with the light emitted by the phosphor to form white light. The blue light chip is bonded to the LED bracket with a bonding adhesive using an automatic bonding machine;

[0073] S2, clean the LED bracket, remove dust and impurities on the surface, apply a proper amount of bonding glue on the LED bracket, use an automatic bonding machine to accurately place the blue light chip on the LED bracket, and ensure that it forms a good bond with the bonding glue;

[0074] S3, using a metal wire (such as a gold wire) to weld the pad on the blue light chip and the conductive area on the LED bracket;

[0075] S4, using a glue dispensing machine to evenly apply the first fluorescent glue prepared in the above preparation method to the cup-shaped area formed by the LED bracket;

[0076] S5, putting the LED bracket coated with the first fluorescent glue into an oven for curing;

[0077] S6, using a glue dispenser to evenly apply the second fluorescent glue prepared in the above preparation method on the surface on which the first fluorescent glue has been cured;

[0078] S7, putting the LED bracket coated with the second fluorescent glue into an oven for curing;

[0079] S8, taking the cured LED bracket out of the oven and cutting it into independent LED lamp bead units;

[0080] S9, use a spectrometer to test the photoelectric performance of LED lamp beads and classify them according to parameters such as brightness and light color;

[0081] S10, packing the classified LED lamp beads into tapes for subsequent production and use;

[0082] S11, the packaged LED lamp beads are put into storage for management and prepared for sale or subsequent production.

[0083] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing an LED device package, characterized in that: The following steps are involved: S1, K2SiF6:Mn 4+ 、K2TiF 6 :Mn 4+ 、K2GeF6:Mn 4+ 、K3AlF6:Mn 4+ 、NaHF2:Mn 4+ 、Cs2GeF6:Mn 4+ 、BaSiF6:Mn 4+ or Na2SiF6:Mn 4+ One or more combinations thereof are mixed evenly with a transparent resin and a rare earth fluoride in a certain proportion to obtain a first fluorescent glue; S2, evacuate the prepared first fluorescent glue until no bubbles are visible; S3, using a dispensing machine to evenly dispense a certain amount of the first fluorescent glue in the support bowl of the blue light chip, and perform semi-precipitation to make the first fluorescent glue evenly leveled; S4, then quickly heating the first fluorescent glue on the blue light wafer so that the surface of the first fluorescent glue is solidified and formed; S5, mixing one or more components of yellow phosphor, green phosphor or orange phosphor according to a certain proportion, adding transparent resin and mixing evenly according to a certain proportion, and then adding nitride phosphor, alkaline earth metal fluoride, diffusion powder, nano negative ion powder and nano barium sulfate / calcium carbonate / silicon dioxide and mixing evenly according to a certain proportion to obtain a second fluorescent glue; S6, evacuate the prepared second fluorescent glue until no bubbles are visible; S7, using a glue dispenser to evenly dispense the second fluorescent glue according to a predetermined amount of glue on the surface of the first fluorescent glue that has been formed, and to precipitate the second fluorescent glue so that the second fluorescent glue evenly covers the surface of the first fluorescent glue; S8, continuously heating the second fluorescent glue to solidify and crystallize the second fluorescent glue.

2. A method for preparing an LED device package according to claim 1, characterized in that: In step S1, the first fluorescent glue comprises the following components by weight: K2SiF6:Mn 4+ 30-35 parts, transparent resin 60-70 parts, rare earth fluoride 5-8 parts.

3. The method for preparing an LED device package according to claim 1, characterized in that: In step S4, the first fluorescent glue is placed in an oven for high-temperature heating, the temperature of the oven is 120-180°C, the heating time is 15-30 minutes, and the pressure is 0.4-0.6 MPa.

4. The method for preparing an LED device package according to claim 1, characterized in that: In step S5, the second fluorescent glue includes the following components by mass: 10-14 parts of green fluorescent powder, 50-60 parts of transparent resin, 1-2 parts of nitride fluorescent powder, 0.5-1 part of alkaline earth metal fluoride, 0.5-1 part of diffusion powder, 0.5-0.8 part of nano negative ion powder, and 0.1-1 part of nano barium sulfate.

5. The method for preparing an LED device package according to claim 1, characterized in that: In step S5, the second fluorescent glue includes the following components by mass: 10-14 parts of green fluorescent powder, 50-60 parts of transparent resin, 1-2 parts of nitride fluorescent powder, 0.5-1 part of alkaline earth metal fluoride, 0.5-1 part of diffusion powder, 0.5-0.8 part of nano negative ion powder, and 0.1-1 part of calcium carbonate.

6. The method for preparing an LED device package according to claim 1, characterized in that: In step S5, the second fluorescent glue includes the following components by mass: 10-14 parts of green fluorescent powder, 50-60 parts of transparent resin, 1-2 parts of nitride fluorescent powder, 0.5-1 part of alkaline earth metal fluoride, 0.5-1 part of diffusion powder, 0.5-0.8 part of nano negative ion powder, and 0.1-1 part of silicon dioxide.

7. The method for preparing an LED device package according to claim 1, characterized in that: In step S8, the first fluorescent glue and the second fluorescent glue are placed in an oven, and after being heated at a predetermined temperature for a period of time, the temperature of the oven needs to be increased and heated for another period of time.

8. The method for preparing an LED device package according to claim 7, characterized in that: In step S8, the temperature of the first oven is 105-120°C, the heating time is 40-80 minutes, and the pressure is 0.4-0.5 MPa. The temperature of the second oven is 140-180°C, the heating time is 250-300 minutes, and the pressure is 0.5-0.7 MPa.

9. The method for preparing an LED device package according to claim 1, characterized in that: The transparent resin is epoxy resin.

10. An LED device, comprising a bracket (3), characterized in that: By adopting the preparation method as described in any one of claims 1 to 9, the first fluorescent glue (1) and the second fluorescent glue (2) are sequentially filled in layers in the bracket bowl of the bracket (3).

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